High-reliability circuit board integrated folding infrared thermal imaging machine core

Abstract

The invention provides a high-reliability circuit board integrated folding infrared thermal imaging machine core which comprises a mainboard, a signal processing circuit board and an interface processing circuit board, and the signal processing circuit board and the interface processing circuit board are connected to the two sides of the mainboard through flexible circuit boards so that the interface processing circuit board can be installed between the signal processing circuit board and the mainboard in a folding mode. A main chip is arranged on the side of the main board, and when the main board is folded and installed, the main chip is located on the outer side of the main board; according to the invention, a board-to-board connector does not need to be arranged between the circuit boards, so that the mainboard with high heat productivity can be positioned on the outer side of the overall structure, and the problems of heat dissipation and circuit connection are solved.

Description

Technical Field

[0001] The invention relates to the field of infrared thermal imaging cores, and in particular to an infrared thermal imaging core with a high-reliability circuit board that is folded integrally. Background Art

[0002] When assembling the infrared thermal imaging core, it needs to be integrated into other optoelectronic systems for use, so there are strict restrictions on its size. The thermal imaging core circuit board system is generally composed of multiple modules with independent functions, such as detector drive circuit boards, signal processing circuit boards, power supply and interface processing circuit boards, etc. In order to control the system size, the above circuit boards need to be stacked and assembled. The traditional solution is to realize signal transmission between multi-layer circuit boards through board-to-board connectors.

[0003] With the increase in detector resolution and the demand for output digital signals, the number of interactive signal channels has increased rapidly. Boards are connected through connectors, and the signals that need to be transmitted include connection signals between adjacent boards and cross-board signals between non-adjacent boards, such as the need to transmit signals from the power supply board to the detector driver board. The above has led to a significant increase in the number of pins on the board-to-board connectors, especially with the current requirements for functional integration, and the addition of additional sensor signals. If traditional board-to-board socket connections are used, the reliability requirements for board-to-board connectors are getting higher and higher, especially in some special fields with vibration and impact requirements, and these board-to-board connectors are the key locations for failures. Summary of the invention

[0004] The purpose of the present invention is to provide a foldable infrared thermal imaging movement with an integrated circuit board, which does not require board-to-board connectors between circuit boards, so that a main board with high heat generation can be located on the outside of the overall structure to ensure high reliability in heat dissipation and line connection issues.

[0005] In order to solve the above technical problems, the present invention provides a high-reliability circuit board integrated folding infrared thermal imaging movement, including a main board, a signal processing circuit board and an interface processing circuit board respectively connected to both sides of the main board through flexible circuit boards, so that the interface processing circuit board is folded and installed between the signal processing circuit board and the main board, and a main chip is arranged on the side of the main board. When the main board is folded and installed, the main chip is located on the outside of the main board.

[0006] Furthermore, the interface processing circuit board is connected to the interface welding board and the first sensor on both sides through the flexible circuit board, so that after the main board is folded and installed, the interface welding board is folded and installed on the outer side of the main board.

[0007] Furthermore, the signal processing circuit board is installed on the structural fixing seat, and the side of the first sensor is connected to the second sensor through a flexible circuit board. When the main board is folded and installed, the first sensor and the second sensor are folded and installed on the outside of the structural fixing seat.

[0008] Furthermore, when the main board, the signal processing circuit board and the interface processing circuit board are folded and installed in sequence, support members and heat insulating members are provided between the interface processing circuit board and the signal processing circuit board, and between the interface processing circuit board and the main board.

[0009] Furthermore, one of the support members is disposed on the outer side of the flexible circuit board between the main board and the signal processing circuit board.

[0010] Furthermore, positioning holes are provided on the sides of the main board, the interface processing circuit board, the signal processing circuit board, the interface welding wire board, the first sensor and the second sensor, and locking bolts are passed through the positioning holes for positioning.

[0011] Furthermore, a heat sink is arranged on the outer side of the mainboard, and the heat sink is in close contact with the main chip.

[0012] Furthermore, a plurality of first grooves are provided on the peripheries of the main board and the interface processing circuit board, so that the flexible circuit board can be folded through the positions of the first grooves.

[0013] Furthermore, the sides of the main board, the signal processing circuit board, the interface processing circuit board and the interface welding wire board are all provided with second grooves for connecting the flexible circuit board.

[0014] The beneficial effect of the present invention is that when the multi-layer circuit board of the infrared thermal imaging movement is assembled, the signal processing circuit board and the interface processing circuit board are respectively connected to the two sides of the main board to ensure stable transmission between the main board and the two, and due to the connection setting of the flexible circuit board, the interface processing circuit board is foldably installed between the main board and the signal processing circuit board, forming a transmission connection in which the main board is located in the central position and the interface processing circuit board is located in the central position of the folding structure. The main board can be effectively located on the outside of the overall structure, thereby ensuring the heat dissipation effect of the main chip, so that the main board spacing transmission is stable and the heat dissipation effect is good. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a structural schematic diagram of the present invention.

[0016] Figure 2 It is a folding schematic diagram of the interface processing circuit board in the present invention.

[0017] Figure 3 It is a schematic diagram of the folding of the main board in the present invention.

[0018] Figure 4 It is a schematic diagram of the folding of the interface welding wire board in the present invention.

[0019] Figure 5 It is a schematic diagram of the folding of the first sensor and the second sensor in the present invention.

[0020] Figure 6 It is a schematic diagram of the expansion of each circuit board in the present invention.

[0021] Figure numerals: 1. main board; 2. flexible circuit board; 3. signal processing circuit board; 4. interface processing circuit board; 5. main chip; 6. interface welding board; 7. first sensor; 8. structural fixing seat; 9. second sensor; 10. support member; 11. thermal insulation member; 12. positioning hole; 13. locking bolt; 14. heat sink; 15. first groove; 16. second groove. DETAILED DESCRIPTION

[0022] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present invention.

[0023] Those skilled in the art should understand that, in the disclosure of the present invention, the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, the above terms should not be understood as limiting the present invention.

[0024] It is to be understood that the term "one" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element may be one, while in another embodiment, the number of the element may be multiple, and the term "one" should not be understood as a limitation on the quantity.

[0025] like Figure 1-Figure 6 The present invention provides a high-reliability circuit board integrated foldable infrared thermal imaging movement, including a main board 1, a signal processing circuit board 3 and an interface processing circuit board 4 connected to both sides of the main board 1 through a flexible circuit board 2, so that the interface processing circuit board 4 is folded and installed between the signal processing circuit board 3 and the main board 1, and a main chip 5 is arranged on the side of the main board 1. When the main board 1 is folded and installed, the main chip 5 is located on the outside of the main board 1.

[0026] When assembling the multi-layer circuit board of the infrared thermal imaging movement, the signal processing circuit board and the interface processing circuit board are respectively connected to the two sides of the main board to ensure stable transmission between the main board and the two. Due to the connection setting of the flexible circuit board, the interface processing circuit board can be folded and installed between the main board and the signal processing circuit board, forming a transmission connection with the main board located in the center and the interface processing circuit board located in the center of the folding structure. The main board can be effectively located on the outside of the overall structure, thereby ensuring the heat dissipation effect of the main chip, so that the main board spacing transmission is stable and the heat dissipation effect is good. Since there is no need to use connectors between the circuit boards, under the same conditions, the movement structure of this scheme can be more concise and compact.

[0027] Among them, the structural form of the flexible circuit board is consistent with the existing flexible circuit board, and will not be described in detail here.

[0028] In one embodiment of the present scheme, a heat sink 14 is arranged on the outside of the main board 1, and the heat sink 14 is in close contact with the main chip 5, so that the heat sink can stably dissipate heat for the main chip on the outside of the main board. Moreover, since the main board is located on the outside of the overall structure, the heat sink of the present scheme can provide better heat dissipation than the heat sink in the prior art (the existing main board can only be arranged in the middle of the overall structure to ensure stable connection with each layer of circuit board, so that the heat sink connected to the main board can also only be arranged in the middle of the overall structure).

[0029] Preferably, the two sides of the interface processing circuit board 4 are respectively connected to the interface welding board 6 and the first sensor 7 through the flexible circuit board 2, so that after the main board 1 is folded and installed, the interface welding board 6 is folded and installed on the outer side of the main board 1.

[0030] Specifically, the interface welding board is directly connected to the side of the interface processing circuit board through the flexible circuit board to ensure a stable connection between the two, and because the flexible circuit board is foldable, the interface welding board can be directly folded and installed to the bottom of the movement to ensure a stable physical connection between the interface welding board and the interface processing circuit board, and avoid interference problems between the interface welding board and the main board or the interface processing circuit board.

[0031] Preferably, the signal processing circuit board 3 is installed on the structural fixing seat 8, and the side of the first sensor 7 is connected to the second sensor 9 through the flexible circuit board 2. When the main board 1 is folded and installed, the first sensor 7 and the second sensor 9 are folded and installed on the outside of the structural fixing seat 8.

[0032] Specifically, the first sensor and the second sensor are connected to the interface processing circuit board in sequence through the flexible circuit board, and then after the main board is folded, the first sensor and the second sensor are folded and installed to the outside of the structural fixing seat, so that the sensors can stably perform sensing work. Preferably, when the main board 1, the signal processing circuit board 3 and the interface processing circuit board 4 are folded and installed in sequence, a support member 10 and a heat insulating member 11 are provided between the interface processing circuit board 4 and the signal processing circuit board 3, and between the interface processing circuit board 4 and the main board 1.

[0033] Specifically, the support members are used to support the intervals between the multi-layer circuit boards to ensure that the folding and installation of each layer of the circuit boards are stable. At the same time, the multi-layer circuit boards are insulated by the insulation members to prevent the heat from the main board, signal processing circuit board and other circuit boards that are prone to heat from being transferred to other circuit boards, so as to improve the thermal stability between the layers of the circuit boards, and cooperate with the outer heat dissipation effect of the main board and signal processing circuit board to increase the overall heat dissipation effect of the equipment.

[0034] In one embodiment of the present scheme, a heat insulating member may be simultaneously provided at the installation position of the support member, so as to insulate the position between the support member and one of the circuit boards through the heat insulating member, thereby preventing heat from being conducted along the support member to the other circuit board.

[0035] Preferably, one of the support members 10 is disposed to cover the outside of the flexible circuit board 2 between the main board 1 and the signal processing circuit board 3 .

[0036] Specifically, since the flexible circuit board between the main board and the signal processing circuit board is relatively long and needs to extend through the side of the entire interface processing circuit board, there is a possibility that the flexible circuit board is easily arched outward. This solution covers one of the support members to the outside of the flexible circuit board, so that the support member can not only support the position between the main board and the interface processing circuit board, but also limit the flexible circuit board, thereby improving the overall connection stability of the equipment.

[0037] Preferably, positioning holes 12 are provided on the sides of the main board 1 , the interface processing circuit board 4 , the signal processing circuit board 3 , the interface welding wire board 6 , the first sensor 7 and the second sensor 9 , and locking bolts 13 are passed through the positioning holes 12 for positioning.

[0038] Specifically, after each layer of circuit boards is installed, each positioning hole is aligned, and then each locking bolt is inserted into each positioning hole in turn, and each layer of circuit boards can be positioned by the locking bolts. Since the locking bolts in the existing circuit boards need to fix the circuit boards into a whole, and then the position of the in-between-board plug-ins is locked by fixing the circuit boards, and the board-to-board connectors themselves have no locking function, the reliability is low under harsh working conditions. The locking bolts in this solution are only used to fix each layer of circuit boards, and a certain amount of misalignment and deformation between each layer of circuit boards are allowed, so the reliability is higher under harsh working conditions.

[0039] Preferably, a plurality of first grooves 15 are provided on the peripheries of the main board 1 and the interface processing circuit board 4 , so that the flexible circuit board 2 can be folded through the positions of the first grooves 15 .

[0040] Specifically, since some flexible circuit boards need to be connected across boards, the provision of the first groove can effectively provide a cross-board connection path for the flexible circuit board, avoid the flexible circuit board from arching outward when connected across boards, and provide stability for the cross-board connection.

[0041] Preferably, the sides of the main board 1 , the signal processing circuit board 3 , the interface processing circuit board 4 and the interface welding wire board 6 are all provided with a second groove 16 for connecting the flexible circuit board 2 .

[0042] Specifically, since the connection between the side of the circuit board and the flexible circuit board is prone to bending and arching when the circuit board is folded and installed, the present solution provides a second groove so that the connection at the end of the flexible circuit board is located in the second groove. Even if the connection of the flexible circuit board is bent and arched, it can be accommodated in the second groove, thereby ensuring the bending stability of the flexible circuit board.

[0043] The present invention is not limited to the above-mentioned optimal implementation mode. Anyone can derive other various forms of products under the inspiration of the present invention. However, no matter what changes are made in the shape or structure, all technical solutions that are the same or similar to those of the present application fall within the protection scope of the present invention.

Claims

1. A high-reliability circuit board integrated folding infrared thermal imaging movement, characterized by: The movement is a multi-layer circuit board stacking structure, each circuit board is connected via a flexible circuit board, the circuit board comprises a main board (1), a signal processing circuit board (3) and an interface processing circuit board (4) respectively connected to both sides of the main board (1) via a flexible circuit board (2), so that the interface processing circuit board (4) is folded and installed between the signal processing circuit board (3) and the main board (1), and a main chip (5) is arranged on the side of the main board (1), and when the main board (1) is folded and installed, the main chip (5) is located on the outside of the main board (1).

2. The high-reliability circuit board integrated folding infrared thermal imaging core according to claim 1, characterized in that: The two sides of the interface processing circuit board (4) are respectively connected to an interface welding board (6) and a first sensor (7) via a flexible circuit board (2), so that after the main board (1) is folded and installed, the interface welding board (6) is folded and installed on the outer side of the main board (1).

3. The high-reliability circuit board integrated folding infrared thermal imaging core according to claim 2, characterized in that: The signal processing circuit board (3) is mounted on the structural fixing seat (8), and the side of the first sensor (7) is connected to the second sensor (9) via the flexible circuit board (2); when the main board (1) is folded and installed, the first sensor (7) and the second sensor (9) are folded and installed on the outside of the structural fixing seat (8).

4. The high-reliability circuit board integrated folding infrared thermal imaging core according to claim 1, characterized in that: When the main board (1), the signal processing circuit board (3) and the interface processing circuit board (4) are folded and installed in sequence, a support member (10) and a heat insulating member (11) are provided between the interface processing circuit board (4) and the signal processing circuit board (3), and between the interface processing circuit board (4) and the main board (1).

5. The high-reliability circuit board integrated folding infrared thermal imaging core according to claim 4, characterized in that: One of the support members (10) is arranged to cover the outside of the flexible circuit board (2) between the main board (1) and the signal processing circuit board (3).

6. The high-reliability circuit board integrated folding infrared thermal imaging core according to claim 3, characterized in that: Positioning holes (12) are provided on the sides of the main board (1), the interface processing circuit board (4), the signal processing circuit board (3), the interface welding board (6), the first sensor (7) and the second sensor (9), and locking bolts (13) are passed through the positioning holes (12) for positioning.

7. The high-reliability circuit board integrated folding infrared thermal imaging core according to claim 1, characterized in that: A heat sink (14) is arranged on the outside of the mainboard (1), and the heat sink (14) is in close contact with the main chip (5).

8. The high-reliability circuit board integrated folding infrared thermal imaging core according to claim 1, characterized in that: The outer peripheries of the main board (1) and the interface processing circuit board (4) are both provided with a plurality of first grooves (15), so that the flexible circuit board (2) can be folded via the positions of the first grooves (15).

9. The high-reliability circuit board integrated folding infrared thermal imaging core according to claim 2, characterized in that: Second grooves (16) are provided on the sides of the main board (1), the signal processing circuit board (3), the interface processing circuit board (4) and the interface welding wire board (6) for connecting the flexible circuit board (2).

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