Mixed liquid cooling system combining low-temperature liquid metal circulation and low-temperature cooling liquid heat dissipation and application

Abstract

The invention belongs to the technical field of heat dissipation systems of high-heat devices, and provides a mixed liquid cooling system combining low-temperature liquid metal circulation and low-temperature cooling liquid heat dissipation and application. The mixed liquid cooling system comprises ultralow-melting-point liquid metal, a heat absorption cooling plate, a flexible transmission pipeline, a low-temperature liquid cooling box, a heat dissipation module, an electromagnetic pump and a central cooling system. The mixed liquid cooling system disclosed by the invention has the following advantages: rapid heat dissipation: the two-stage circulation heat dissipation system efficiently transfers heat from high-heat equipment to the central cooling system, so that excellent heat dissipation performance is realized; the heat conduction performance is excellent; noise-free operation is realized; the structure is flexible; the system can be configured to be used for cooling one or more chips, and can adapt to different equipment layouts and requirements; expandability: the system has high expandability and is suitable for various application scenes; compared with a traditional system based on water cooling, cooling liquid cooling or air cooling, the hybrid system has the advantages that energy is remarkably saved, and the operation cost is reduced.

Description

[0001] This application claims priority to a Chinese patent application with application number 202411854152.8 filed on December 16, 2024, and invention name “A hybrid liquid cooling system and application combining low-temperature liquid metal circulation with low-temperature coolant heat dissipation”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present invention relates to the technical field of heat dissipation systems for high-temperature devices, and in particular to a mixed liquid cooling system and application thereof that combines low-temperature liquid metal circulation with low-temperature coolant heat dissipation. Background Art

[0003] Rapid heat dissipation is extremely important in various electronic devices and industrial applications. With the development of modern technology, the performance and power density of equipment are constantly improving, and the heat generated is also increasing. If there is no effective heat dissipation measure, the excessive temperature will seriously affect the performance, reliability and life of the equipment. High-heat devices (such as CPUs, GPUs, smart phones, electric vehicles, nuclear power systems, aerospace systems, etc.) generate a lot of heat during operation. If the heat cannot be dissipated quickly, the temperature of the device will rise rapidly, causing the components to operate in a non-ideal temperature range, resulting in performance degradation, system speed limits, or even complete failure. For example, in computing devices, overheating may cause the processor to downclock, reduce the operating speed to prevent damage or activate a self-protection mechanism, ultimately affecting the overall performance of the device. Therefore, rapid heat dissipation helps the device maintain stable operation for a long time and prevent performance degradation.

[0004] With the advancement of technology, the size of devices is getting smaller and smaller, but the required processing power and power density are constantly increasing, which means that the heat generated in a limited space is more concentrated, and traditional heat dissipation methods are increasingly unable to meet the needs. Without an effective and rapid heat dissipation mechanism, the device will be limited in its application due to heat accumulation. Rapid heat dissipation technology can solve this problem, allowing the device to achieve higher power density and better performance in a small size.

[0005] Long-term high-temperature operation will accelerate the aging of electronic components and materials, especially in semiconductor components (such as high-performance GPUs), PCB boards, connectors and other precision components. Thermal stress will cause repeated expansion and contraction of materials, increasing the risk of physical damage. Rapid heat dissipation can effectively slow down this aging process and reduce the damage to materials caused by thermal stress, thereby extending the service life of the equipment. When equipment is operated in a high-temperature environment, it usually leads to decreased efficiency and increased energy waste. Especially in applications such as data centers, nuclear power systems, space launchers, and electric vehicles, excessive temperatures lead to significant energy losses. Rapid heat dissipation technology can more efficiently manage the temperature inside the equipment, reduce the increase in energy consumption caused by rising temperatures, and thus improve overall energy utilization.

[0006] Traditional heat dissipation methods (such as air cooling, water cooling, and liquid cooling like coolant) often fail to meet the requirements of speed and efficiency. The thermal conductivity of liquid metal is 50 to 80 times higher than that of water or other coolants. The circulation of liquid metal can quickly remove high heat from the heat source. The new liquid metal material, through optimized formula and innovative preparation process, can still maintain fluidity at a temperature of -10°C. At the same time, its boiling point is as high as 2400°C. During the heat dissipation cycle, the new liquid metal can quickly remove high-temperature heat to a low-temperature environment for heat dissipation through rapid flow. Therefore, it is of great significance to study a hybrid liquid cooling system that combines low-temperature liquid metal circulation with low-temperature coolant heat dissipation. Summary of the invention

[0007] The purpose of the present invention is to provide a hybrid liquid cooling system and application combining low-temperature liquid metal circulation with low-temperature coolant heat dissipation in order to overcome the deficiencies of the prior art.

[0008] In order to achieve the above-mentioned object of the invention, the present invention provides the following technical solutions:

[0009] The present invention provides a hybrid liquid cooling system that combines low-temperature liquid metal circulation with low-temperature coolant heat dissipation. The hybrid liquid cooling system includes ultra-low melting point liquid metal, heat-absorbing cooling plates 1, 20, flexible transmission pipelines 3, 5, a low-temperature liquid cooling box 8, a heat dissipation module, an electromagnetic pump 11, and a central cooling system.

[0010] Preferably, the ultra-low melting point liquid metal is vacuum packaged in a heat absorbing cooling plate, and the heat absorbing cooling plate is connected to the high-temperature device;

[0011] Ultra-low melting point liquid metal can still maintain fluidity at -10°C; the thermal conductivity of ultra-low melting point liquid metal is 50 to 80 times that of water or other coolants.

[0012] Preferably, the material of the heat-absorbing cooling plate and the heat dissipation module is nickel-plated high thermal conductivity metal; the heat-absorbing cooling plate includes a heat-absorbing cooling plate inlet 2, 22, a heat-absorbing cooling plate outlet 15, 21, a baffle 16, and a partition 23; the flexible transmission pipeline is a stainless steel bellows or is made of other materials that are resistant to liquid metal corrosion.

[0013] Preferably, the heat-absorbing cooling plate includes structure one and structure two. Structure one 1 sets a non-closed baffle in the middle of the heat-absorbing cooling plate. Liquid metal enters from the inlet 2 on one side of the baffle and enters the other side through the gap of the baffle 16. Through the baffle, the liquid metal circulates fully in the cooling plate and takes away the heat at the outlet 15 on the other side of the baffle. Structure two 20 is a double-layer structure. Liquid metal enters from the bottom inlet 22 and passes through the baffle 23, so that the liquid metal has a longer contact with the chip, absorbs more heat, and then takes away the heat from the outlet 21 on the baffle.

[0014] Preferably, the heat dissipation module includes heat dissipation copper tubes 7 , 14 , heat dissipation fins 10 , an electromagnetic pump 11 , a liquid metal injection port 12 , and a flange 18 .

[0015] Preferably, the low-temperature liquid cooling box comprises a liquid outlet and an inlet 9, 13 for connecting to a central cooling system; and the electromagnetic pump comprises an electromagnetic pump central stainless steel pipe 17.

[0016] Preferably, the ultra-low melting point liquid metal is driven by the electromagnetic force of the electromagnetic pump and flows to the heat-absorbing cooling plate through a flexible transmission pipe.

[0017] Preferably, the mixed liquid cooling system is in a vacuum fully sealed state.

[0018] Preferably, the hybrid liquid cooling system includes a two-stage circulating heat dissipation system, wherein the first stage circulating heat dissipation system is composed of a liquid metal heat dissipation system and a low-temperature coolant heat dissipation system, and the second stage circulating heat dissipation system is a heat dissipation cycle formed by a low-temperature liquid cooling box and a central cooling system.

[0019] The present invention also provides the application of the hybrid liquid cooling system combining low-temperature liquid metal circulation and low-temperature coolant heat dissipation in high-power chips, high-performance computing systems, power electronic equipment, nuclear power equipment and aerospace equipment.

[0020] The beneficial effects of the present invention include:

[0021] The hybrid liquid cooling system of the present invention has the following advantages: (1) Rapid heat dissipation: The secondary circulation heat dissipation system efficiently transfers heat from high-heat equipment to the central cooling system, achieving excellent heat dissipation performance; (2) Excellent thermal conductivity: The thermal conductivity of liquid metal is 50 to 80 times that of water or other coolants, which significantly reduces thermal resistance; it is particularly suitable for the local efficient heat dissipation needs of small-area high-power chips; (3) Noiseless operation: There are no mechanical components in the local cooling system, ensuring silent operation, improving user experience and enhancing system reliability; (4) Flexible structure: The system of the present invention can be configured to cool a single or multiple chips, and can adapt to different equipment layouts and requirements; (5) Scalability: The system of the present invention is highly scalable and suitable for a variety of application scenarios, such as high-performance GPUs, servers, nuclear energy equipment and aerospace devices; (6) Energy efficiency and cost-effectiveness: Compared with traditional systems based on water cooling, coolant cooling or air cooling, the hybrid liquid cooling system of the present invention significantly saves energy and reduces operating costs; the system of the present invention can operate in extreme low temperature environments while taking into account high efficiency, stability, flexibility and low cost, providing a reliable thermal management solution for high power density equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 A schematic diagram of the hybrid liquid cooling system of the present invention used in a single-chip or dual-chip heat dissipation device;

[0023] Figure 2 A schematic diagram of a heat absorbing cooling plate with baffles containing liquid metal according to the present invention;

[0024] Figure 3 A schematic diagram of a double-layer structure heat-absorbing cooling plate containing liquid metal according to the present invention;

[0025] Figure 4 is a schematic diagram of a flexible transmission pipeline of the present invention;

[0026] Figure 5 It is a schematic diagram of a low-temperature liquid cooling box of the present invention;

[0027] Figure 6 is a schematic diagram of a heat dissipation module of the present invention;

[0028] Figure 7 is a schematic diagram of an electromagnetic pump of the present invention;

[0029] Figure 8 It is a schematic diagram of the connection between the low temperature liquid cooling box and the central cooling system circulation device;

[0030] Fig. 9 A schematic diagram of a liquid metal cooling system for eight high-power chips;

[0031] Among them, 1 and 20 are heat-absorbing cooling plates, 2 and 22 are inlets of heat-absorbing cooling plates, 3 and 5 are flexible transmission pipelines, 4 is a diverter valve, 6 is a pluggable joint between the heat dissipation copper tube and the flexible transmission pipeline, 7 and 14 are heat dissipation copper tubes, 8 is a low-temperature liquid cooling box, 9 is the liquid inlet of the low-temperature liquid cooling box, 13 is the liquid outlet of the low-temperature liquid cooling box, 10 is a heat dissipation fin, 11 is an electromagnetic pump, 12 is a liquid metal injection port, 15 and 21 are outlets of the heat-absorbing cooling plate, 16 is a baffle inside the heat-absorbing cooling plate, 17 is a central stainless steel pipe of the electromagnetic pump, 18 is a flange, 19 is a transmission pipeline of the central cooling system, and 23 is a partition inside the heat-absorbing cooling plate. DETAILED DESCRIPTION

[0032] The present invention provides a hybrid liquid cooling system that combines low-temperature liquid metal circulation with low-temperature coolant heat dissipation. The hybrid liquid cooling system includes ultra-low melting point liquid metal, heat-absorbing cooling plates 1, 20, flexible transmission pipelines 3, 5, a low-temperature liquid cooling box 8, a heat dissipation module, an electromagnetic pump 11, and a central cooling system.

[0033] In the present invention, ultra-low melting point liquid metal is vacuum packaged in a heat absorbing cooling plate, and the heat absorbing cooling plate is connected to a high-temperature device;

[0034] The ultra-low melting point liquid metal preferably maintains fluidity at -10°C; the thermal conductivity of the ultra-low melting point liquid metal is preferably 50 to 80 times that of water or other coolants, and can quickly transfer high heat away from the heat source.

[0035] The ultra-low melting point liquid metal of the present invention has excellent thermal conductivity, and the thermal conductivity of the liquid metal is tens to hundreds of times that of water or coolant; the thermal conductivity of water is 0.59W / m·K, the thermal conductivity of other coolants is between 0.13 and 0.45W / m·K, and the thermal conductivity of liquid metal is 27 to 37W / m·K. The liquid metal with optimized formula can reach up to 50 to 80W / m·K, which is 50 to 120 times the thermal conductivity of water or other coolants. The ultra-low melting point liquid metal still shows excellent fluidity in a sub-zero environment and can very efficiently conduct heat from a high-heat device to a larger heat dissipation system. Water or other coolants are used as secondary media for heat dissipation; the low-melting point liquid metal can still maintain fluidity at an ambient temperature of -10°C, thereby achieving rapid and efficient heat dissipation.

[0036] In the present invention, when the heat absorbing cooling plate is attached to the high-power chip, a high-thermal-conductivity flexible material or liquid metal paste is used for airtight and tight attachment.

[0037] In the present invention, the material of the heat-absorbing cooling plate and the heat dissipation module is preferably nickel-plated high thermal conductivity metal; the heat-absorbing cooling plate preferably includes a heat-absorbing cooling plate inlet 2, 22, a heat-absorbing cooling plate outlet 15, 21, a baffle 16, and a partition 23; the flexible transmission pipeline is preferably a stainless steel bellows or made of other materials that are resistant to liquid metal corrosion.

[0038] In the present invention, the high thermal conductivity metal is preferably copper and aluminum, and the thermal conductivity coefficient can reach 400W / m·K. Liquid metal has a certain corrosiveness to the high thermal conductivity metal. The heat-absorbing cooling plate and the heat-dissipating copper tube are coated with a nickel-plated protective coating to prevent corrosion by liquid metal and extend the service life.

[0039] In the present invention, the isolation plate in the heat-absorbing cooling plate ensures that the liquid metal fully circulates and stays in the cooling plate, realizes efficient heat absorption, and transfers the heat of the high-temperature device to the liquid metal; the liquid metal after heat absorption returns to the low-temperature liquid cooling box through the heat-absorbing cooling plate outlets 15, 21 and the stainless steel bellows.

[0040] In the present invention, the heat absorbing cooling plate preferably includes structure one and structure two. Structure one 1 sets a non-closed baffle in the middle of the heat absorbing cooling plate. Liquid metal enters from the inlet 2 on one side of the baffle and enters the other side through the gap of the baffle 16. Through the baffle, the liquid metal circulates fully in the cooling plate and takes away the heat at the outlet 15 on the other side of the baffle. Structure two 20 is a double-layer structure. Liquid metal enters from the bottom inlet 22 and passes through the baffle 23, so that the liquid metal has a longer contact with the chip, absorbs more heat, and then takes away the heat from the outlet 21 on the baffle.

[0041] In the present invention, the corrugated structure can maintain the flexibility of placing the heat absorbing cooling plate, so that the heat absorbing cooling plate can adapt to different position requirements during the installation process.

[0042] In the present invention, the heat dissipation module preferably includes heat dissipation copper tubes 7 , 14 , heat dissipation fins 10 , an electromagnetic pump 11 , a liquid metal injection port 12 , and a flange 18 .

[0043] In the present invention, the copper tube is used to efficiently conduct heat, and the heat dissipation fins can increase the surface area to improve the heat dissipation efficiency; the electromagnetic pump drives the liquid metal to flow to ensure the continuity of the cycle; the liquid metal injection port is convenient for adding or replacing liquid metal; and the flange is used to connect and fix the components.

[0044] In the present invention, the low-temperature liquid cooling box preferably includes a liquid outlet 13 and a liquid inlet 9 for connecting to the central cooling system; the electromagnetic pump preferably includes an electromagnetic pump central stainless steel pipe 17.

[0045] In the present invention, a low-temperature liquid cooling box is used to dissipate heat of liquid metal, and the temperature of the coolant in the low-temperature liquid cooling box is maintained below 0°C to maximize the temperature gradient, thereby improving the cooling performance; the central stainless steel pipe of the electromagnetic pump is used to promote the flow of liquid metal, and no mechanical moving parts are required, ensuring noiseless and efficient operation; this design effectively avoids the wear problem of traditional pumps, while improving the reliability and service life of the equipment.

[0046] In the present invention, the ultra-low melting point liquid metal preferably flows to the heat absorbing cooling plate through a flexible transmission pipe under the driving force of the electromagnetic pump.

[0047] In the present invention, the mixed liquid cooling system is preferably in a vacuum fully sealed state to prevent the liquid metal from being oxidized and ensure that the liquid metal maintains its fluidity for a long time.

[0048] In the present invention, the central stainless steel pipe of the electromagnetic pump is connected to the heat dissipation copper pipe through a highly sealed flange, and the stainless steel bellows is connected to the heat dissipation copper pipe joint through a sealing sleeve to ensure that the liquid metal in the pipeline is in a vacuum protection state.

[0049] In the present invention, the hybrid liquid cooling system preferably includes a two-stage circulating heat dissipation system, the first stage circulating heat dissipation system is composed of a liquid metal heat dissipation system and a low-temperature coolant heat dissipation system, and the second stage circulating heat dissipation system is a heat dissipation cycle formed by a low-temperature liquid cooling box and a central cooling system.

[0050] In the present invention, the first-stage circulating heat dissipation system: the ultra-low melting point liquid metal absorbs heat from the high-heat device (such as GPU and CPU) from the heat-absorbing cooling plate. The heated liquid metal is driven by an electromagnetic pump and transported to the heat dissipation module through a flexible transmission pipeline. In the heat dissipation module, heat is exchanged with the coolant (water or other coolant) in the low-temperature liquid cooling box, and the heat is transferred to the coolant and then rapidly cooled down; the cooled liquid metal is transported back to the high-heat device under the action of the electromagnetic pump, forming a continuous cooling cycle. The second-stage circulating heat dissipation system: the heat in the low-temperature liquid cooling box is transferred to the central cooling system through the inlet and outlet of the low-temperature liquid cooling box, thereby dissipating heat over a large range, ensuring the continuity of the cooling cycle and the uninterrupted operation of the heat dissipation process. The low-temperature liquid cooling box is connected to the central cooling system and has integration capabilities.

[0051] Through the combination of the two-stage circulation cooling system, the integrated two-stage circulation cooling system significantly improves the heat dissipation efficiency and realizes more efficient thermal management. It is suitable for high-power consumption and high-heat density equipment, ensuring long-term stable operation of the equipment while greatly improving the heat dissipation performance.

[0052] In the present invention, liquid metal rapidly cools down in a cryogenic liquid cooling box due to its excellent thermal conductivity, and maintains efficient heat transfer throughout the cooling cycle; the second-stage circulating heat dissipation system provides an extended heat dissipation capacity, enabling the system to handle larger-scale heat loads, such as multi-chip high-heat devices or high-heat density devices in industrial applications. Through optimized component design and fluid management methods, the present invention achieves excellent thermal management performance, which is particularly suitable for high-power consumption, high-heat density devices and systems.

[0053] The present invention also provides the application of the hybrid liquid cooling system combining low-temperature liquid metal circulation and low-temperature coolant heat dissipation in high-power chips, high-performance computing systems, power electronic equipment, nuclear power equipment and aerospace equipment.

[0054] In the present invention, the high-performance computing system includes a data center, a GPU server or a workstation, which provides efficient cooling for high-power processors to ensure stable operation; the power electronic equipment includes a high-power module, a transformer or an electric vehicle battery (such as a ternary lithium battery or a lithium iron phosphate battery), which provides thermal stability support and extends the life of the equipment; improves the operational stability of key systems of nuclear power equipment, optimizes thermal management to cope with high temperature challenges; efficiently copes with extreme heat demands in closed, high-stress environments, and provides reliable thermal management solutions for aerospace equipment. By adapting to the needs of different fields, the hybrid liquid cooling system of the present invention demonstrates excellent flexibility and efficiency, and provides a new heat dissipation solution for various high heat density applications.

[0055] The technical solutions provided by the present invention are described in detail below in conjunction with the embodiments, but they should not be construed as limiting the protection scope of the present invention.

[0056] Example 1

[0057] The hybrid liquid cooling system combines the circulation of low-temperature liquid metal and the heat dissipation of low-temperature coolant to dissipate heat through a secondary circulation heat dissipation system; the hybrid liquid cooling system is in a vacuum fully sealed state;

[0058] The hybrid liquid cooling system includes ultra-low melting point liquid metal, heat absorbing cooling plate, flexible transmission pipeline, low temperature liquid cooling box, heat dissipation module, electromagnetic pump, and central cooling system; the liquid metal is vacuum packaged in the heat absorbing cooling plate, the heat absorbing cooling plate is attached to the high-power chip (such as NVIDIA GB200), and the heat absorbing cooling plate includes a heat absorbing cooling plate inlet, a heat absorbing cooling plate outlet, and an isolation plate;

[0059] The materials of the heat-absorbing cooling plate and the heat dissipation module are both nickel-plated copper, and the flexible transmission pipeline is a stainless steel bellows; the heat dissipation module includes a heat dissipation copper tube, heat dissipation fins, an electromagnetic pump, a liquid metal injection port, and a flange; the low-temperature liquid cooling box includes a liquid inlet and a liquid outlet, and is connected to the central cooling system; the central pipeline of the electromagnetic pump is a stainless steel pipeline; the central stainless steel tube of the electromagnetic pump is connected to the heat dissipation copper tube through a highly sealed flange, and the joint of the stainless steel bellows and the heat dissipation copper tube is connected through a sealing sleeve.

[0060] The first-stage circulating heat dissipation system consists of a liquid metal heat dissipation system and a low-temperature coolant heat dissipation system. The heat-absorbing cooling plate containing ultra-low melting point liquid metal is directly attached to the high-power chip. The heat of the high-power chip is transferred to the ultra-low melting point liquid metal in the heat-absorbing cooling plate. The electromagnetic pump drives the liquid metal to flow through a closed-loop flexible transmission pipeline, and quickly pushes the heat-absorbing and heated liquid metal to the heat dissipation module. The heat dissipation module is immersed in a low-temperature liquid cooling box (the low-temperature liquid cooling box is filled with low-temperature liquid water). The heat collected by the liquid metal is transferred to the water in the low-temperature liquid cooling box through the heat dissipation copper tube. The liquid metal after heat dissipation is driven by the electromagnetic pump to flow to the heat-absorbing cooling plate, circulating to take away the heat from the high-power chip.

[0061] The second-stage circulating heat dissipation system is a heat dissipation cycle formed by the low-temperature liquid cooling box and the central cooling system. After the water in the low-temperature liquid cooling box exchanges heat with the liquid metal, the temperature rises. The heated water is connected to the transmission pipe of the central cooling system through the interface of the liquid inlet and outlet of the low-temperature liquid cooling box, and the heat is transferred to the central cooling system, thereby dissipating heat on a large scale. The cooled water is then returned to the low-temperature liquid cooling box through the booster pump of the central cooling system, so that the liquid in the low-temperature liquid cooling box remains at a low temperature.

[0062] Example 2

[0063] The high-power chip in Example 1 is replaced by a GPU chip, and other conditions are the same as in Example 1.

[0064] Example 3

[0065] The high-power chip in Example 1 is replaced with a power battery (lithium iron phosphate battery), and other conditions are the same as in Example 1.

[0066] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A hybrid liquid cooling system combining low-temperature liquid metal circulation and low-temperature coolant heat dissipation, characterized in that: The mixed liquid cooling system comprises ultra-low melting point liquid metal, a heat absorbing cooling plate (1, 20), a flexible transmission pipeline (3, 5), a low temperature liquid cooling box (8), a heat dissipation module, an electromagnetic pump (11), and a central cooling system.

2. The hybrid liquid cooling system according to claim 1, characterized in that: The ultra-low melting point liquid metal is vacuum packaged in a heat absorbing cooling plate, and the heat absorbing cooling plate is connected to a high-temperature device; Ultra-low melting point liquid metal can still maintain fluidity at -10°C; the thermal conductivity of ultra-low melting point liquid metal is 50 to 80 times that of water or other coolants.

3. The hybrid liquid cooling system according to claim 1 or 2, characterized in that: The heat absorbing cooling plate and the heat dissipation module are made of nickel-plated high thermal conductivity metal; the heat absorbing cooling plate comprises a heat absorbing cooling plate inlet (2, 22), a heat absorbing cooling plate outlet (15, 21), a baffle (16), and a partition (23); the flexible transmission pipeline is a stainless steel bellows or is made of other materials that are resistant to liquid metal corrosion.

4. The hybrid liquid cooling system according to claim 3, characterized in that: The heat absorbing cooling plate comprises structure 1 and structure 2. Structure 1 (1) has a non-enclosed baffle plate in the middle of the heat absorbing cooling plate. Liquid metal enters from the inlet (2) on one side of the baffle plate and enters the other side through the gap of the baffle plate (16). Through the baffle plate, the liquid metal fully circulates in the cooling plate and takes away the heat at the outlet (15) on the other side of the baffle plate. Structure 2 (20) is a double-layer structure. Liquid metal enters from the bottom inlet (22) and passes through the baffle plate (23), so that the liquid metal has a longer contact time with the chip, absorbs more heat, and then takes away the heat from the outlet (21) on the baffle plate.

5. The hybrid liquid cooling system according to claim 3, characterized in that: The heat dissipation module comprises heat dissipation copper tubes (7, 14), heat dissipation fins (10), an electromagnetic pump (11), a liquid metal injection port (12), and a flange (18).

6. The hybrid liquid cooling system according to claim 4 or 5, characterized in that: The low-temperature liquid cooling box comprises a liquid outlet and an inlet (9, 13) for connecting to a central cooling system; and the electromagnetic pump comprises an electromagnetic pump central stainless steel pipe (17).

7. The hybrid liquid cooling system according to claim 6, characterized in that: Driven by the electromagnetic force of the electromagnetic pump, the ultra-low melting point liquid metal flows to the heat-absorbing cooling plate through a flexible transmission pipe.

8. The hybrid liquid cooling system according to claim 7, characterized in that: The mixed liquid cooling system is in a vacuum and fully sealed state.

9. The hybrid liquid cooling system according to claim 1 or 8, characterized in that: The hybrid liquid cooling system includes a two-stage circulating heat dissipation system. The first-stage circulating heat dissipation system is composed of a liquid metal heat dissipation system and a low-temperature coolant heat dissipation system. The second-stage circulating heat dissipation system is a heat dissipation cycle formed by a low-temperature liquid cooling box and a central cooling system.

10. Application of the hybrid liquid cooling system combining low-temperature liquid metal circulation and low-temperature coolant heat dissipation as described in any one of claims 1 to 9 in high-power chips, high-performance computing systems, power electronic equipment, nuclear power equipment and aerospace equipment.

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