Heat storage and soaking plate, heat dissipation assembly thereof and electronic equipment
By designing a heat storage compartment cavity and a heat conduction compartment cavity on the mobile phone heat dissipation and heat conduction plate, using phase change heat storage materials and heat conduction media, the hand-held heat experience problem caused by heat transfer to the frame in the prior art is solved, and a more effective heat dissipation and cooling effect is achieved.
Patent Information
- Application Number
- CN202510162235.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-13
- Publication Date
- 2025-05-02
AI Technical Summary
In the existing mobile phone cooling solution, the VC heat equalization plate has a large area, which increases the heat experience problem when holding it.
A heat storage and heat equalization plate is designed, including a heat storage container cavity and a heat conduction container cavity in the encapsulated shell. The heat storage container cavity is filled with phase change heat storage material, and a heat conduction medium is provided in the heat conduction container cavity to realize heat storage and rapid conduction.
The phase-change heat storage material absorbs heat and delays the temperature rise, reduces the temperature rise rate at the frame position of the electronic device, and improves the thermal experience of users holding the electronic device in their hands.
Smart Images
Figure CN119922885A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of heat dissipation of electronic equipment, and specifically to a heat storage vapor chamber and a heat dissipation component thereof, and electronic equipment. Background Art
[0002] As mobile phones and other electronic devices become more high-end, their performance is getting stronger, which will also increase power consumption and heat generation. In addition, more and more mobile phones are using metal frames to enhance the texture of the phone. Metal frames make the heat more obvious when held by the hand, and in daily use scenarios, human hands come into contact with metal frames the most.
[0003] In the current mobile phone cooling solution, a large-area VC heat spreader is usually used for heat dissipation. The larger the VC area, the stronger the heat dissipation capacity of the whole machine. At the same time, more heat is transferred to the frame through the VC, which is not conducive to the thermal experience when the hand is holding it. Summary of the invention
[0004] A first aspect of an embodiment of the present application provides a heat storage vapor chamber, wherein the heat storage vapor chamber comprises a packaging shell, wherein the packaging shell is sealed to form a heat storage cavity and a heat conduction cavity which are spaced apart; the heat storage cavity is filled with a phase change heat storage material for absorbing heat through a phase change process when the temperature reaches the phase change temperature of the phase change material, thereby delaying the temperature rise; a heat conduction cavity is provided with a heat conducting medium for realizing rapid heat conduction; wherein the heat storage cavity and the heat conduction cavity are adjacently arranged along the planar extension direction of the heat storage vapor chamber.
[0005] In a second aspect, an embodiment of the present application provides a heat dissipation assembly, which includes a heat source device and the heat storage and heat diffusion plate described in the above embodiment, wherein the heat storage and heat diffusion plate is arranged in contact with the heat source device to dissipate heat from the heat source device.
[0006] In a third aspect, an embodiment of the present application provides an electronic device, which includes a housing and the heat dissipation assembly described in the above embodiment, wherein the heat storage and heat diffusion plate of the heat dissipation assembly is respectively attached to the housing and the heat source device.
[0007] The heat storage and heat diffusion plate provided in the embodiment of the present application is designed to have an integrated structure with heat storage and heat diffusion functions, a heat storage cavity is set at the edge of the heat diffusion plate, and a phase change heat storage material is filled in the heat storage cavity. This can not only achieve rapid and uniform heat dissipation, but also reduce the temperature rise rate at the frame of the electronic device, thereby improving the thermal experience of the user holding the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS
[0008] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0009] Figure 1 It is a schematic diagram of the overall structure of an embodiment of a heat storage vapor chamber for electronic equipment of the present application;
[0010] Figure 2 yes Figure 1 A schematic diagram of the cross-sectional structure of the heat storage and soaking plate along AA in the embodiment;
[0011] Figure 3 This is a schematic structural diagram of another embodiment of the heat storage vapor chamber of the present application;
[0012] Figure 4 It is a structural schematic diagram of an embodiment of a heat dissipation assembly of the present application;
[0013] Figure 5 This is a schematic diagram of the structure of the heat dissipation component of the present application used in an electronic device;
[0014] Figure 6 It is a schematic diagram of the overall structure of an embodiment of the electronic device of the present application;
[0015] Figure 7 yes Figure 6 A schematic cross-sectional view of the electronic device along line BB in the embodiment;
[0016] Figure 8 is a schematic cross-sectional structural diagram of another embodiment of the electronic device of the present application;
[0017] Fig. 9 is a schematic cross-sectional structural diagram of another embodiment of the electronic device of the present application;
[0018] Fig.10 It is a schematic diagram of the structural composition block diagram of an embodiment of the electronic device of the present application. DETAILED DESCRIPTION
[0019] The present application is further described in detail below in conjunction with the accompanying drawings and examples. It is particularly noted that the following examples are only used to illustrate the present application, but are not intended to limit the scope of the present application. Similarly, the following examples are only some embodiments of the present application rather than all embodiments, and all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.
[0020] The terms "first", "second", and "third" in the embodiments of the present application are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first", "second", and "third" can expressly or implicitly include at least one of the features. In the description of the present application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In the embodiments of the present application, all directional indications (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication also changes accordingly. The terms "including" and "having" in the embodiments of the present application and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but optionally also includes steps or units that are not listed, or optionally also includes other steps or components inherent to these processes, methods, products, or devices.
[0021] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.
[0022] As used herein, "electronic devices" (or simply "terminals") include, but are not limited to, devices configured to receive / send communication signals via a wireline connection (e.g., via a public switched telephone network (PSTN), a digital subscriber line (DSL), a digital cable, a direct cable connection, and / or another data connection / network) and / or via a wireless interface (e.g., for a cellular network, a wireless local area network (WLAN), a digital television network such as a DVB-H network, a satellite network, an AM-FM broadcast transmitter, and / or another communication terminal). Communication terminals configured to communicate via a wireless interface may be referred to as "wireless communication terminals", "wireless terminals" or "mobile terminals". Examples of mobile terminals include, but are not limited to, satellite or cellular phones; personal communication system (PCS) terminals that may combine cellular radiotelephones with data processing, fax, and data communication capabilities; PDAs that may include radiotelephones, pagers, Internet / intranet access, web browsers, organizers, calendars, and / or global positioning system (GPS) receivers; and conventional laptop and / or palmtop receivers or other electronic devices that include radiotelephone transceivers. A mobile phone is an electronic device equipped with a cellular communication module.
[0023] Some technical solutions use a heat dissipation structure that uses a VC heat spreader with a graphite sheet or a heat storage material stacked together. However, this structure is thick because it is a stacked structure, which conflicts with the current thin and light design of mobile phones and is difficult to implement in projects. In addition, the above solution can improve the temperature rise rate to a certain extent because it is a stacked structure, but it cannot improve the temperature rise of the metal frame of the mobile phone, so it cannot solve the problem of excessive temperature rise on the metal side of the mobile phone.
[0024] In view of the above problems, the present application first provides a heat storage vapor chamber. Figure 1 and Figure 2 , Figure 1 1 is a schematic diagram of the overall structure of an embodiment of a heat storage vapor chamber for electronic equipment of the present application. Figure 2 yes Figure 1 Schematic diagram of the cross-sectional structure of the heat storage vapor chamber along AA in the embodiment; it should be noted that the electronic device in the present application may include electronic devices with heat source devices such as mobile phones, tablet computers, laptops, wearable devices, etc. The heat storage vapor chamber 100 for electronic devices includes a packaging shell 110.
[0025] Specifically, the overall shape of the package shell 110 is a sheet structure, and the specific shape is not limited, and can be a rectangular or irregular shape, etc. The package shell 110 is sealed to form a heat storage chamber 111 and a heat conduction chamber 112 that are spaced apart; the heat storage chamber 111 is filled with a phase change heat storage material 1110, which is used to absorb heat through a phase change process when the temperature reaches the phase change temperature of the phase change material, thereby delaying the temperature rise. For example, when heated by an external heat source, the phase change heat storage material 1110 changes from a solid state to a liquid state after absorbing heat. In this phase change process, the heat storage material absorbs heat without increasing the temperature, thereby reducing the transient process temperature.
[0026] Optionally, the phase change heat storage material 1110 includes an organic phase change heat storage material or an inorganic phase change heat storage material. Among them, the organic phase change heat storage material can include any one or more of paraffin or fatty acid compounds, etc. The inorganic phase change heat storage material can include any one or more of crystalline hydrated salts or molten salt compounds, etc.
[0027] Optionally, the material of the package shell 110 may include metal, metal alloy, metal oxide and the like, such as stainless steel, copper, aluminum alloy and the like.
[0028] By utilizing the endothermic phase change characteristics of phase change heat storage materials, heat can be stored in the phase change heat storage materials, thereby improving the transient heat dissipation capacity of electronic equipment and reducing the temperature rise rate of electronic equipment during use.
[0029] Please continue reading Figure 2 A heat-conducting medium (liquid, not shown in the figure) is provided in the heat-conducting accommodating cavity 112 for realizing rapid heat conduction; optionally, the heat-conducting medium can be a liquid heat dissipation medium, such as water or oil, etc., which is not specifically limited here.
[0030] Among them, the heat storage accommodating chamber 111 and the heat conductive accommodating chamber 112 are adjacently arranged along the plane extension direction of the heat storage heat diffusion plate, and the heat storage accommodating chamber 111 and the heat conductive accommodating chamber 112 are separated by a retaining wall 102, and the heat storage accommodating chamber 111 and the heat conductive accommodating chamber 112 are obtained by an integrally formed structure of the packaging shell 110.
[0031] Optionally, the heat storage chamber 111 and the heat conduction chamber 112 may be one and arranged adjacent to each other, or may be arranged as follows: Figure 1 and Figure 2 In the structural form, there are two heat storage accommodating chambers 111, including a first heat storage accommodating chamber 1111 and a second heat storage accommodating chamber 1112, and the first heat storage accommodating chamber 1111 and the second heat storage accommodating chamber 1112 are respectively arranged on opposite sides of the heat conduction accommodating chamber 112; in addition, please refer to Figure 3 , Figure 3 It is a structural schematic diagram of another embodiment of the heat storage and heat diffusion plate of the present application, wherein the heat storage chamber 111 in this embodiment is arranged along the circumference of the heat conduction chamber 112. In some other embodiments, the heat storage chamber 111 and the heat conduction chamber 112 can also be arranged in other ways. Those skilled in the art can design them according to their needs, and they will not be listed and described in detail here.
[0032] Optionally, see Figure 2 In this embodiment, a liquid guide member 113 is provided in the heat conduction accommodating cavity 112, and the heat conduction medium is soaked in the liquid guide member 113. The material of the liquid guide member 113 can be selected from any one of copper mesh, fiber, non-woven fabric or foam, which is not specifically limited here.
[0033] Optionally, see Figure 2 In this embodiment, the heat-conducting cavity 112 is provided with a plurality of support columns 114 which are integrally formed with the packaging shell 110. The plurality of support columns 114 are used to support the liquid-conducting member 113. The plurality of support columns 114 can be formed with the packaging shell 110 by integral stamping, integral etching or integral injection molding.
[0034] The heat storage and heat diffusion plate in the embodiment of the present application is designed to have an integrated structure with heat storage and heat diffusion functions, a heat storage cavity is set at the edge of the heat diffusion plate, and a phase change heat storage material is filled in the heat storage cavity. This can not only achieve rapid and uniform heat dissipation, but also reduce the temperature rise rate at the frame of the electronic device, thereby improving the thermal experience of the user holding the electronic device.
[0035] In addition, the present application also provides a heat dissipation component, see Figure 4 , Figure 4 1 is a schematic diagram of the structure of an embodiment of the heat dissipation component of the present application, wherein the heat dissipation component 10 includes a heat source device 200 and a heat storage vapor chamber 100, and the heat storage vapor chamber 100 is arranged in contact with the heat source device 200 to dissipate heat from the heat source device 200. The detailed structural features of the heat storage vapor chamber 100 can refer to the description of the aforementioned embodiment, and the heat source device 200 can include a display screen and a control circuit board (on which a processor and other devices may be provided), etc. The specific structure will be described in detail in the subsequent electronic device embodiment.
[0036] Please also read Figure 5 , Figure 5 It is a structural schematic diagram of the heat dissipation component of the present application used in an electronic device. Optionally, the heat source device 200 in this embodiment can be fitted correspondingly to the heat-conducting accommodating cavity 112 of the heat storage and heat diffusion plate 100. When the heat source device 200 is working, a gas-liquid phase change occurs in the heat-conducting accommodating cavity 112 area, and the heat is diffused to the entire heat-conducting accommodating cavity 112 area. Further, the heat is transferred to the phase change heat storage material in the heat storage accommodating cavity area through the retaining wall and the packaging shell. When the temperature reaches the phase change temperature of the phase change heat storage material, the phase change heat storage material in the heat storage accommodating cavity 112 area undergoes a solid-liquid phase change. At this time, the phase change material absorbs heat without increasing the temperature until all the phase change heat storage materials in the heat storage accommodating cavity 112 area complete the phase change. In the solid-liquid phase change process of the phase change material in the heat storage accommodating cavity 112 area, compared with the ordinary VC heat diffusion plate structure, the phase change heat storage material reduces the heat transferred to the frame, thereby delaying the temperature rise, and effectively improving the thermal experience of the user holding the side frame 212 of the electronic device.
[0037] The present application also provides an electronic device, please refer to Figure 6 and Figure 7 , Figure 6 is a schematic diagram of the overall structure of an embodiment of the electronic device of the present application, Figure 7 yes Figure 6 The cross-sectional structure diagram of the electronic device along the BB line in the embodiment, wherein the electronic device comprises a housing 20 and a heat dissipation assembly 10, and a heat storage vapor chamber 100 of the heat dissipation assembly 10 is respectively attached to the housing 20 and the heat source device 200.
[0038] Optionally, the housing 20 in this embodiment may include a middle frame 21 and a back cover 22, and the middle frame 21 may further include a middle plate 211 and a side frame 212 of an integrated structure. The heat source device 200 in this embodiment may include at least one of a display screen 210 and a control circuit board 220 (on which a processor 221, a shielding cover 222 and other devices are provided). The control circuit board 220 in this embodiment is the main heat source device and is connected to the back cover 22 (i.e., the battery cover) through a heat storage and heat soaking plate 100.
[0039] The reference numeral 30 in the figure represents a battery, wherein the battery 30 and the heat dissipation assembly 10 are both arranged in a receiving cavity formed by the middle plate 211 , the side frame 212 and the back cover 22 .
[0040] See also Figure 8 , Figure 8 It is a schematic diagram of the cross-sectional structure of another embodiment of the electronic device of the present application, wherein the electronic device in this embodiment may also include a housing 20 and a heat dissipation assembly 10, and the heat storage and heat diffusion plate 100 of the heat dissipation assembly 10 is respectively bonded to the housing 20 and the heat source device 200. Optionally, the housing 20 in this embodiment may also include a middle frame 21 and a back cover 22, and the middle frame 21 may further include a middle plate 211 and a side frame 212 of an integrated structure. The heat source device 200 in this embodiment may be a display screen 210 and a control circuit board 220 (on which a processor 221, a shielding cover 222 and other devices are provided). The control circuit board 220 in this embodiment is connected to the back cover 22 (i.e., the battery cover) through a heat storage and heat diffusion plate 100, and the display screen 210 may be bonded to the middle plate 211 through another heat storage and heat diffusion plate 100.
[0041] Among them, 30 marked in the figure represents a battery, wherein the battery 30 and the control circuit board 220 are both arranged in a accommodating cavity formed by the middle plate 211, the side frame 212 and the back cover 22; the display screen 210 and the side of the middle plate 211 away from the battery 30 are thermally connected through a heat storage and heat diffusion plate 100.
[0042] See also Fig. 9 , Fig. 9 2 is a cross-sectional structural diagram of another embodiment of the electronic device of the present application. Different from the above-mentioned embodiment, the heat dissipation assembly 10 in this embodiment further includes a heat conductive sheet 300, which is disposed between the heat source device 200 and the heat storage and heat diffusion plate 100. Specifically, the heat conductive sheet 300 may be disposed between the display screen 210 and the heat storage and heat diffusion plate 100 and between the control circuit board 220 and the heat storage and heat diffusion plate 100. The heat conductive sheet 300 may be a graphite sheet.
[0043] The electronic device in the embodiment of the present application can effectively reduce the temperature rise rate of the electronic device during use by providing a heat storage and heat diffusion plate and a heat conductive sheet, thereby improving the heat dissipation efficiency and greatly improving the thermal experience of the electronic device.
[0044] See also Fig.10 , Fig.10 It is a schematic diagram of the structural composition block diagram of an embodiment of an electronic device of the present application. The electronic device can be a mobile phone, a tablet computer, a laptop computer, a wearable device, etc. The mobile phone is used as an example in the diagram of this embodiment. The structure of the electronic device may include an RF circuit 910, a memory 920, an input unit 930, a display unit 940 (which may be the display screen 210 in the above embodiment), a sensor 950, an audio circuit 960, a wifi module 970, a processor 980 (which may be the processor 221 in the above embodiment) and a power supply 990 (which may be the battery 30 in the above embodiment), etc. Among them, the RF circuit 910, the memory 920, the input unit 930, the display unit 940, the sensor 950, the audio circuit 960 and the wifi module 970 are respectively connected to the processor 980; the power supply 990 is used to provide power to the entire electronic device 10.
[0045] Specifically, the RF circuit 910 is used to receive and send signals; the memory 920 is used to store data instruction information; the input unit 930 is used to input information, which may specifically include a touch panel 931 and other input devices 932 such as operation buttons; the display unit 940 may include a display panel 941, etc.; the sensor 950 includes an infrared sensor, a laser sensor, etc., for detecting user approach signals, distance signals, etc.; the speaker 961 and the microphone (or microphone) 962 are connected to the processor 980 through the audio circuit 960 for receiving and sending sound signals; the wifi module 970 is used to receive and transmit wifi signals, and the processor 980 is used to process data information of the electronic device. For the specific structural features of the electronic device, please refer to the relevant description of the above embodiment, which will not be described in detail here.
[0046] The electronic device in this embodiment has a heat storage and heat diffusion plate with an integrated structure having heat storage and heat diffusion functions. A heat storage cavity is set at the edge of the heat diffusion plate, and a phase change heat storage material is filled in the heat storage cavity. This can not only achieve rapid and uniform heat dissipation, but also reduce the temperature rise rate at the frame of the electronic device, thereby improving the thermal experience of the user holding the electronic device.
[0047] The above descriptions are only some embodiments of the present application, and do not limit the protection scope of the present application. Any equivalent device or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.
Claims
1. A heat storage and soaking plate, characterized in that: The heat storage vapor chamber comprises a packaging shell, which is sealed to form a heat storage cavity and a heat conduction cavity that are spaced apart; the heat storage cavity is filled with a phase change heat storage material, which is used to absorb heat through a phase change process when the temperature reaches the phase change temperature of the phase change material, thereby delaying the temperature rise; a heat conduction medium is provided in the heat conduction cavity, which is used to achieve rapid heat conduction; wherein the heat storage cavity and the heat conduction cavity are adjacently arranged along the plane extension direction of the heat storage vapor chamber.
2. The heat storage vapor chamber according to claim 1, characterized in that: The heat storage chamber includes a first heat storage chamber and a second heat storage chamber, and the first heat storage chamber and the second heat storage chamber are respectively arranged on opposite sides of the heat conduction chamber.
3. The heat storage vapor chamber according to claim 1, characterized in that: The heat storage accommodating cavity is arranged along the circumference of the heat conduction accommodating cavity.
4. The heat storage vapor chamber according to claim 1, characterized in that: The phase change heat storage material includes an organic phase change heat storage material or an inorganic phase change heat storage material; wherein the organic phase change heat storage material includes any one or more of paraffin or fatty acid compounds; the inorganic phase change heat storage material includes any one or more of crystalline hydrated salts or molten salt compounds.
5. The heat storage vapor chamber according to claim 1, characterized in that: The packaging shell is made of metal or alloy.
6. The heat storage vapor chamber according to any one of claims 1 to 5, characterized in that: A liquid guiding member is arranged in the heat conducting accommodating cavity, and the heat conducting medium is soaked in the liquid guiding member.
7. The heat storage vapor chamber according to claim 6, characterized in that: A plurality of support columns which are integrally formed with the packaging shell are arranged in the heat-conducting accommodating cavity, and the plurality of support columns are used to support the liquid-conducting member.
8. A heat dissipation component, characterized in that: The heat dissipation assembly includes a heat source device and the heat storage vapor chamber according to any one of claims 1 to 7, wherein the heat storage vapor chamber is arranged in close contact with the heat source device to dissipate heat from the heat source device.
9. The heat dissipation assembly according to claim 8, characterized in that: The heat source device is correspondingly fitted with the heat conduction accommodating cavity of the heat storage and heat diffusion plate.
10. An electronic device, characterized in that: The electronic device comprises a housing and the heat dissipation assembly according to claim 8 or 9, wherein the heat storage and heat diffusion plate of the heat dissipation assembly is respectively attached to the housing and the heat source device.