Chip packaging method and chip packaging structure

Abstract

The invention discloses a chip packaging method and a chip packaging structure, and the method comprises the steps: providing a frame which comprises a frame and an elastic conductive part extending from the frame to one side; providing a chip package; arranging the chip packaging piece on the frame, and electrically connecting the chip with the elastic conductive piece; placing the frame provided with the plurality of chip packaging pieces in a packaging mold; regulating and controlling the pressure applied to the chip packaging pieces by the packaging mold, so that the cover plates of all the chip packaging pieces are propped against the packaging mold; injecting a plastic package material into the packaging mold to form a plastic package body; demolding and removing the borders of the frame to release the elastic conductive parts; forming a welding bulge on the elastic conductive piece; and cutting to form a plurality of chip packaging structures. According to the chip packaging method and the chip packaging structure, the problem of plastic packaging material overflow of an open type plastic packaging process can be solved, the function of an original chip is maintained, and the chip packaging yield is improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor packaging, and in particular relates to a chip packaging method and a chip packaging structure. Background Art

[0002] The packaging structure of optical image sensor chips is usually a cavity structure, which is fragile. Automotive-grade chips need to be sealed and protected through plastic packaging technology to improve reliability.

[0003] In the prior art, in order to protect the photosensitive area of ​​the optical image sensor chip from being contaminated and blocked, an open plastic encapsulation technology is usually used. In the open plastic encapsulation technology, a thin film is usually covered on the upper surface of the cover plate, and the upper mold of the encapsulation mold is in direct contact with the film and pressed tightly on the cover plate. The plastic encapsulation material enters the mold cavity from the injection port on the side of the encapsulation mold, and is cured under high temperature and high pressure. Finally, the surface film is peeled off to achieve open plastic encapsulation.

[0004] However, in the open plastic packaging process, since the upper mold is in direct contact with the cover plate on the chip and there is a height tolerance between multiple chips, the lower chips will overflow due to the gap between the film and the chip cover plate, and the higher chips will be delaminated due to the high pressure.

[0005] The information disclosed in this background technology section is only intended to enhance the understanding of the overall background of the invention and should not be regarded as an acknowledgment or any form of suggestion that the information constitutes the prior art already known to a person skilled in the art. Summary of the invention

[0006] The object of the present invention is to provide a chip packaging method and a chip packaging structure, which can solve the problem of plastic packaging material overflow in an open plastic packaging process, maintain the function of the original chip, and improve the chip packaging yield.

[0007] In order to achieve the above object, a technical solution provided by a specific embodiment of the present invention is as follows:

[0008] A chip packaging method, comprising:

[0009] Providing a frame, the frame comprising a frame and an elastic conductive member extending from the frame to one side, the elastic conductive member being configured to be deformable under the action of a force;

[0010] Providing a chip package, the chip package comprising a chip and a cover plate covering the chip;

[0011] Placing the chip package on the frame and electrically connecting the chip to the elastic conductive member;

[0012] placing a frame provided with a plurality of chip packages in a packaging mold;

[0013] The pressure applied by the packaging mold to the chip package is regulated, and the corresponding elastic conductive member is deformed to change the height of the chip package to which it belongs relative to the frame, so that the cover plates of all chip packages abut against the packaging mold;

[0014] Injecting a plastic encapsulation material into the encapsulation mold to form a plastic encapsulation body, wherein the plastic encapsulation body at least covers the connection between the frame and the chip package;

[0015] Demolding and forming a welding protrusion on the elastic conductive member;

[0016] The frame is cut and removed to release the elastic conductive member, and a plurality of chip packaging structures are formed.

[0017] In one or more embodiments of the present invention, the elastic conductive member has a first end connected to the frame and a second end away from the frame, and a preset height is provided between the second end and the frame, and the preset height is higher than a height tolerance of the plurality of chip packages.

[0018] In one or more embodiments of the present invention, the chip is electrically connected to the second end of the elastic conductive member; and / or,

[0019] A welding protrusion is formed on the first end of the elastic conductive member.

[0020] In one or more embodiments of the present invention, the pressure applied by the packaging mold to the chip package is regulated so that the elastic conductive member corresponding to the chip package with a relatively higher height is squeezed and deformed to lower the preset height, and is supported on the packaging mold together with the chip package with a relatively lower height.

[0021] In one or more embodiments of the present invention, the packaging mold includes an upper mold and a lower mold that cooperate with each other;

[0022] The pressure applied by the upper mold of the packaging mold to the chip package is regulated, and the corresponding elastic conductive part is deformed to change the height of the chip package to which it belongs relative to the frame, so that the cover plates of all chip packages are in contact with the inner surface of the upper mold of the packaging mold.

[0023] In one or more embodiments of the present invention, a release film is provided on the inner surface of the upper mold.

[0024] In one or more embodiments of the present invention, after the border of the frame is cut and removed, the elastic conductive members are not connected to each other.

[0025] In one or more embodiments of the present invention, a chip package is provided, comprising:

[0026] Providing a wafer, the wafer comprising a plurality of chips, each of the chips having a first surface and a second surface arranged opposite to each other, and a functional area and a pad being formed on the first surface;

[0027] Providing a cover plate, and arranging the cover plate on the first surface to cover the functional area;

[0028] forming a protrusion electrically connected to the pad on the second surface;

[0029] The wafer is diced to form chip packages.

[0030] A chip packaging structure, comprising:

[0031] A chip package, comprising a chip and a cover plate covering the chip;

[0032] An elastic conductive member, arranged on a side of the chip away from the cover plate and electrically connected to the chip, wherein the elastic conductive member is configured to be deformable under the action of a force;

[0033] The plastic package is arranged on the peripheral surface of the chip package and at least covers the connection between the elastic conductive part and the chip.

[0034] In one or more embodiments of the present invention, the elastic conductive member has a first end and a second end that are oppositely disposed, the second end is electrically connected to the chip, and a welding protrusion is disposed on the first end, and the welding protrusion is exposed outside the plastic package.

[0035] Compared with the prior art, the chip packaging method and chip packaging structure of the present invention, through the provision of elastic conductive parts and utilizing the deformability of the elastic conductive parts, improve the uniformity of the height of the pressed chip during the open plastic packaging process, improve the delamination and glue overflow problems of the chip with a cavity structure in the open plastic packaging, and improve the packaging yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0037] Figure 1 A flowchart of a chip packaging method according to an embodiment of the present invention;

[0038] Figure 2a-2j A step structure diagram of a chip packaging method according to an embodiment of the present invention;

[0039] Figure 3 FIG. 4 is a cross-sectional view of a chip packaging structure in one embodiment of the present invention. DETAILED DESCRIPTION

[0040] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0041] As mentioned in the background technology, there will be a height tolerance between chips. In the chip open plastic packaging process, the higher chip will lift the film and the upper mold of the packaging mold, resulting in the film covering cannot completely protect the lower chip cover surface, the upper mold cannot press each chip cover surface tightly, resulting in gaps between the top surface of the cover of some chips and the packaging mold. During injection molding, the plastic packaging material overflows into the gap and contaminates the chip, affecting the packaging yield and chip function, and even worse, causing stratification problems.

[0042] Based on this, the present invention provides a chip packaging method and a chip packaging structure. Through the setting of elastic conductive parts, deformation can be artificially controlled during the open plastic packaging process to reduce or eliminate the height tolerance between different chips, thereby solving the problem of plastic packaging material overflow in the open plastic packaging process, maintaining the function of the original chip, and improving the chip packaging yield.

[0043] like Figure 1 As shown, the chip packaging method in one embodiment of the present invention specifically includes the following steps:

[0044] S1: Provide a frame, the frame comprising a frame and an elastic conductive member extending from the frame to one side, the elastic conductive member being configured to be deformable under the action of a force.

[0045] In a preferred embodiment, the elastic conductive member can be formed by stamping a frame. The frame includes a square frame and a plurality of elastic conductive members. A plurality of windows are formed in the middle of the square frame, and the plurality of elastic conductive members are sequentially arranged in the windows of the square frame. The elastic conductive member has a first end connected to the frame and a second end away from the frame. The second end is set as the free end of the elastic conductive member. There is a preset height between the second end and the frame, and the preset height is higher than the height tolerance of the plurality of chip packages. By applying pressure to the second end along the thickness direction of the frame, the relative height between the second end and the frame can be changed.

[0046] S2: Provide a chip package, wherein the chip package includes a chip and a cover plate covering the chip.

[0047] Wherein, providing a chip package comprises the following steps:

[0048] A wafer is provided. The wafer includes a plurality of chips. Each chip has a first surface and a second surface that are oppositely arranged. A functional area and a pad are formed on the first surface.

[0049] A cover plate is provided, and the cover plate is arranged on the first surface to cover the functional area. The cover plate and the first surface of the chip can be bonded by a glue bonding layer. The glue bonding layer is formed on the periphery of the functional area and together with the cover plate, forms a sealed chamber surrounding the functional area.

[0050] A protrusion electrically connected to the pad is formed on the second surface. For example, a hole can be opened on the second surface of the chip by TSV (Through Silicon Via) technology to expose the pad. Then, a conductive layer electrically connected to the pad is formed in the through hole, and the conductive layer extends to the second surface of the chip. The protrusion is formed on the conductive layer on the second surface.

[0051] The wafer is diced to form chip packages.

[0052] S3: placing the chip package on the frame and electrically connecting the chip to the elastic conductive member.

[0053] In a preferred embodiment, the chip package is flipped onto the frame, and the protrusions on the chip in the chip package correspond to the elastic conductive members one by one and are electrically connected.

[0054] S4: placing the frame provided with a plurality of chip packages in a packaging mold.

[0055] In this step, the height tolerance of multiple chip packages can be eliminated. By adjusting the pressure applied by the packaging mold to the chip package, the elastic conductive member corresponding to the chip package with a relatively high height is squeezed and deformed to reduce its preset height, thereby changing the height of the chip package with a relatively high height relative to the frame, and holding it against the packaging mold together with the chip package with a relatively low height, ensuring that the cover plates of all chip packages are in contact with the packaging mold.

[0056] It is understood that the packaging mold includes an upper mold and a lower mold that cooperate with each other. A release film is provided on the inner surface of the upper mold, and the release film can contact the cover plate of the chip package during the subsequent plastic packaging process to protect the chip package. By adjusting the pressure applied to the chip package by the upper mold of the packaging mold, the height tolerance of the chip package is eliminated.

[0057] S5: injecting a plastic encapsulation material into the encapsulation mold to form a plastic encapsulation body, wherein the plastic encapsulation body at least covers a connection between the frame and the chip package.

[0058] In order to further improve the structural strength of the chip package, the plastic package covers the connection between the elastic conductive part and the chip package, the peripheral surface of the chip package and the elastic conductive part, and only the top surface of the chip package and the first end of the elastic conductive part are exposed.

[0059] S6: Demolding and forming welding protrusions on the elastic conductive member.

[0060] In order to facilitate subsequent electrical connection to the circuit substrate, a welding protrusion may be formed on the exposed first end of the elastic conductive member after demoulding.

[0061] S7: cutting and removing the frame border to release the elastic conductive member, and forming a plurality of chip packaging structures.

[0062] Exemplarily, a single chip package structure is used as a cutting unit for cutting. When cutting, the frame frame needs to be removed together, leaving only the elastic conductive member on the frame frame. After removing the frame frame, the first end of the elastic conductive member will be completely released, and the first ends of adjacent elastic conductive members are not connected to each other to achieve mutual electrical isolation.

[0063] Figure 2a-2j The schematic diagram of the specific steps of the chip packaging method of the present invention is as follows. Figure 2a-2j , the chip packaging method of the present invention is elaborated in detail to facilitate a further understanding of the technical solution of the present invention.

[0064] refer to Figure 2a As shown, a wafer 10 is provided, and the wafer 10 includes a plurality of chips 11 and dicing lanes 12 formed between adjacent chips 11. The chip 11 has a first surface and a second surface oppositely disposed, and a functional area 111 and a bonding pad 112 coupled to the functional area are formed on the first surface.

[0065] It is understandable that the cutting lanes 12 between adjacent chips 11 are used for cutting after wafer-level packaging. The chip 11 may be an optical image sensor chip, etc. The functional area 111 is an optical sensing area, for example, it may be formed by a plurality of photodiode arrays, and the photodiodes may convert the optical signals irradiated to the functional area 111 into electrical signals. The pads 112 serve as input and output terminals for connecting the devices in the functional area 111 to external circuits.

[0066] refer to Figure 2bAs shown, a cover plate 20 is provided. The cover plate 20 is preferably a transparent substrate, such as glass. The cover plate 20 is bonded to the first surface of the chip 11 by bonding glue, and the cover plate 20 covers the functional area 111. For example, a glue bonding layer A can be formed on the surface of the cover plate 20 and / or the first surface of the chip 11 by spraying, spin coating or gluing, and the glue bonding layer A is located at the periphery of the functional area 111. Then, the cover plate 20 and the first surface of the chip 11 are pressed relative to each other and combined by bonding glue.

[0067] The bonding glue can not only achieve bonding, but also play the role of insulation and sealing. The bonding glue can be a polymer bonding material, such as silicone, epoxy resin, benzocyclobutene and other polymer materials.

[0068] refer to Figure 2c As shown, the chip 11 is etched from the second surface of the chip 11 to form a through hole (not shown), and the through hole exposes the bonding pad 112 on one side of the first surface of the chip 11.

[0069] An insulating layer 113 is formed on the second surface of the chip 11 and on the sidewalls of the through hole, and the insulating layer 113 exposes the pad 112 at the bottom of the through hole. The insulating layer 113 can provide electrical insulation for the second surface of the chip 11. The material of the insulating layer 113 can be silicon oxide, silicon nitride, silicon oxynitride or insulating resin.

[0070] A conductive layer 114 connected to the pad 112 is formed on the surface of the insulating layer 113. The conductive layer 114 can be used as a rewiring layer to lead the pad 112 to the second surface of the chip 11 and then connect to an external circuit. The conductive layer 114 is formed by depositing and etching a metal film.

[0071] A solder resist layer 115 having openings (not shown) is formed on the surfaces of the conductive layer 114 and the insulating layer 113 , the openings exposing a portion of the surface of the conductive layer 114 . The solder resist layer 115 is made of insulating dielectric materials such as silicon oxide and silicon nitride and is used to protect the conductive layer 114 .

[0072] A protrusion 116 is formed on the surface of the solder resist layer 115. The protrusion 116 fills the opening and protrudes out of the opening. The protrusion 116 is a metal protrusion and has conductivity.

[0073] refer to Figure 2d As shown, the wafer 10 and the cover plate 20 are cut along the dicing streets 12 to form chip packages 100 .

[0074] refer to Figure 2e and Figure 2f As shown, Figure 2e is a schematic top view of the frame 30, Figure 2fSchematic diagram of a cross section of a frame 30. A frame 30 is provided. The frame 30 includes a frame 31 and an elastic conductive member 32 extending from the frame 31 to one side, and the elastic conductive member 32 is configured to be deformable under the action of a force.

[0075] In this embodiment, the elastic conductive member 32 can be formed by stamping the frame 30. The frame 30 includes a square frame 31 and a plurality of elastic conductive members 32. A plurality of windows 301 are formed in the middle of the square frame 31, and a plurality of elastic conductive members 32 are sequentially arranged in the windows 301 of the square frame 31. Each elastic conductive member 32 has a first end 321 connected to the frame 31 and a second end 322 away from the frame 31. There is a preset height H1 between the second end 322 and the frame 31, and the preset height H1 is higher than the height tolerance of the plurality of chip packages 100. By applying pressure to the second end 322 along the thickness direction of the frame 30, the relative height between the second end 322 and the frame 31 can be changed.

[0076] refer to Figure 2g As shown, multiple chip packages 100 are flipped onto the frame 30. The protrusions 116 on the chips 11 in the chip packages 100 correspond one-to-one to and are electrically connected to the second ends 322 of the elastic conductive members 32. In the initial state, after the multiple chip packages 100 are formed on the frame 30, there is a certain height tolerance H2.

[0077] refer to Figure 2h As shown, a release film 220 is pasted on the inner top surface of the upper mold 210 of the packaging mold 200, and a frame 30 provided with a plurality of chip packages 100 is placed in the packaging mold 200, and an open-type plastic packaging process is performed.

[0078] In the open-type plastic packaging process, after the flat upper mold 210 presses the release film 220, it can produce an extrusion effect on the chip package 100, and deform the elastic conductive member 32 of the frame 30, resulting in a change in the preset height H1. The taller chip package 100 is squeezed, and the corresponding elastic conductive member 32 is deformed and reduces the preset height H1, so that the upper mold 210 presses the shorter chip package 100, and finally achieves the same height.

[0079] The encapsulation material is filled into the encapsulation mold 200 through the injection port. The encapsulation material is a polymer composite material such as epoxy resin, polyimide, and dry mold. Then, the encapsulation material is cured under high temperature and high pressure to form a encapsulation body 50. The encapsulation body 50 provides physical support for the encapsulation structure and plays a role in sealing and protecting the chip package 100, the frame 30, and the elastic conductive member 32. The encapsulation body 50 exposes the top surface of the chip package 100 and the first end 321 of the elastic conductive member 32.

[0080] refer to Figure 2iAs shown, the plastic package body 50 after demoulding covers the side wall of the cover plate 20 and is flush with the top surface of the cover plate 20 , and the plastic package body 50 is not formed on the top surface of the cover plate 20 .

[0081] refer to Figure 2j As shown, a welding protrusion 40 is formed on the exposed first end 321 of the elastic conductive member 32. Figure 2e and Figure 2j The packaging structure after the plastic package 50 is formed and the frame 30 are cut at the dotted line position in the figure, and the frame 31 of the frame 30 is completely removed, leaving only the elastic conductive member 32 on the frame 31, to form a plurality of chip packaging structures. After removing the frame 31 of the frame 30, the first end 321 of the elastic conductive member 32 will be completely released, and the first ends 321 of adjacent elastic conductive members 32 are not connected to each other to achieve mutual electrical isolation.

[0082] The present invention also provides a chip packaging structure, which is packaged by the above chip packaging method. Figure 2a-2j The description of the chip packaging method may be incorporated herein.

[0083] refer to Figure 3 As shown, the chip packaging structure includes a chip package 100 , an elastic conductive member 32 , a soldering protrusion 40 and a plastic package 50 .

[0084] The chip package 100 includes a chip 11 and a cover plate 20 covering the chip 11. The chip 11 has a first surface and a second surface arranged opposite to each other, a functional area 111 and a pad 112 are formed on the first surface, and a protrusion 116 electrically connected to the pad 112 is formed on the second surface. The protrusion 116 is a metal protrusion and has conductivity.

[0085] The cover plate 20 is disposed on the first surface of the chip 11 through the glue bonding layer A to cover the functional area 111 .

[0086] The elastic conductive element 32 is disposed on one side of the second surface of the chip 11 and is electrically connected to the chip 11 .

[0087] Specifically, the elastic conductive member 32 has a first end 321 and a second end 322 that are arranged opposite to each other. A preset height H1 is provided between the second end 322 and the first end 311, and the preset height H1 is higher than the height tolerance of the plurality of chip packages 100. The second end 322 of the elastic conductive member 32 corresponds to and is electrically connected to the protrusion 116 of the chip 11. A welding protrusion 40 is provided on the first end 321 of the elastic conductive member 32.

[0088] The elastic conductive member 32 is configured to be deformable under the action of force. Applying pressure to the elastic conductive member 32 in the thickness direction of the chip package 100 can change the relative height H1 between the second end 322 and the first end 321, thereby adjusting the relative height tolerance of multiple chip packages 100 during the open plastic packaging process.

[0089] The plastic package 50 covers the elastic conductive member 32, the connection between the elastic conductive member 32 and the chip package 100, and the peripheral surface of the chip package 100. The top surface of the cover 20 of the chip package 100 and the welding protrusions 40 are exposed outside the plastic package 50.

[0090] Compared with the prior art, the chip packaging method and chip packaging structure of the present invention, through the provision of elastic conductive parts and utilizing the deformability of the elastic conductive parts, improve the uniformity of the height of the pressed chip during the open plastic packaging process, improve the delamination and glue overflow problems of the chip with a cavity structure in the open plastic packaging, and improve the packaging yield.

[0091] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0092] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A chip packaging method, characterized in that: include: Providing a frame, the frame comprising a frame and an elastic conductive member extending from the frame to one side, the elastic conductive member being configured to be deformable under the action of a force; Providing a chip package, the chip package comprising a chip and a cover plate covering the chip; Placing the chip package on the frame and electrically connecting the chip to the elastic conductive member; placing a frame provided with a plurality of chip packages in a packaging mold; The pressure applied by the packaging mold to the chip package is regulated, and the corresponding elastic conductive member is deformed to change the height of the chip package to which it belongs relative to the frame, so that the cover plates of all chip packages abut against the packaging mold; Injecting a plastic encapsulation material into the encapsulation mold to form a plastic encapsulation body, wherein the plastic encapsulation body at least covers the connection between the frame and the chip package; Demolding and forming a welding protrusion on the elastic conductive member; The frame is cut and removed to release the elastic conductive member, and a plurality of chip packaging structures are formed.

2. The chip packaging method according to claim 1, characterized in that: The elastic conductive element has a first end connected to the frame and a second end away from the frame. A preset height is provided between the second end and the frame. The preset height is higher than a height tolerance of the plurality of chip packages.

3. The chip packaging method according to claim 2, characterized in that: The chip is electrically connected to the second end of the elastic conductive member; and / or, A welding protrusion is formed on the first end of the elastic conductive member.

4. The chip packaging method according to claim 2, characterized in that: The pressure applied by the packaging mold to the chip package is regulated so that the elastic conductive member corresponding to the chip package with a relatively high height is squeezed and deformed to reduce the preset height and is supported on the packaging mold together with the chip package with a relatively low height.

5. The chip packaging method according to claim 1, characterized in that: The packaging mold includes an upper mold and a lower mold that cooperate with each other; The pressure applied by the upper mold of the packaging mold to the chip package is regulated, and the corresponding elastic conductive part is deformed to change the height of the chip package to which it belongs relative to the frame, so that the cover plates of all chip packages are in contact with the inner surface of the upper mold of the packaging mold.

6. The chip packaging method according to claim 5, characterized in that: A release film is provided on the inner surface of the upper mold.

7. The chip packaging method according to claim 1, characterized in that: After the frame of the frame is cut and removed, the elastic conductive parts are not connected to each other.

8. The chip packaging method according to claim 1, characterized in that: Provide chip packaging, including: Providing a wafer, the wafer comprising a plurality of chips, each of the chips having a first surface and a second surface arranged opposite to each other, and a functional area and a pad being formed on the first surface; Providing a cover plate, and arranging the cover plate on the first surface to cover the functional area; forming a protrusion electrically connected to the pad on the second surface; The wafer is diced to form chip packages.

9. A chip packaging structure, characterized in that: include: A chip package, comprising a chip and a cover plate covering the chip; An elastic conductive member, arranged on a side of the chip away from the cover plate and electrically connected to the chip, wherein the elastic conductive member is configured to be deformable under the action of a force; The plastic package is arranged on the peripheral surface of the chip package and at least covers the connection between the elastic conductive part and the chip.

10. The chip packaging structure according to claim 9, characterized in that: The elastic conductive member has a first end and a second end that are oppositely disposed, the second end is electrically connected to the chip, and a welding protrusion is disposed on the first end, and the welding protrusion is exposed outside the plastic package.

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