Brain temperature control system and temperature control method

Abstract

The invention discloses a brain temperature control system, and belongs to the field of brain temperature control. The head sleeve is provided with a concave cavity for wrapping the head; the temperature control part is provided with a cavity for accommodating a heat-conducting medium; the pump body is communicated with the cavity through a pipeline to drive the heat-conducting medium to flow; the semiconductor chilling plate is arranged in the pump body to control the cooling / heating of the heat-conducting medium; the temperature control assembly is connected with the pump body to control opening and closing of the pump body; the temperature control pieces are arranged in the concave cavity and make contact with the skin of the head of the human body. The pipeline is connected with each temperature control piece, and the pipeline is composed of a liquid inlet channel and a liquid return channel; a liquid storage cavity communicated with the pipeline is formed in the pump body, and the semiconductor chilling plate is arranged in the liquid storage cavity to adjust the heat-conducting medium in the liquid storage cavity. The brain temperature control system has the beneficial effect that the cooling efficiency can be effectively controlled.

Description

Technical Field

[0001] The present application relates to the field of brain temperature control, and more specifically, to a brain temperature control system. Background Art

[0002] Definition and classification of hypothermic brain protection: Hypothermic brain protection is a treatment method that uses artificial physical methods to lower the patient's whole body temperature or local brain temperature, thereby reducing brain oxygen consumption and promoting brain function recovery. Currently, hypothermia is divided internationally into: mild hypothermia (33-35°C), moderate hypothermia (28-32°C), deep hypothermia (17-27°C), and ultra-deep hypothermia (4-16°C). Among them, mild hypothermia and moderate hypothermia belong to sub-hypothermia and are most commonly used in clinical practice. Most studies have shown that 33°C is the most suitable temperature for sub-hypothermia treatment, and it has the best protective effect on ischemic damage;

[0003] The brain cooling devices currently available on the market mainly use ice blankets for cooling; however, since the brain is a relatively sensitive part of the human body, the temperature of the ice blanket cannot be accurately controlled during cooling, which can easily lead to too-fast cooling or excessive cooling of the patient, thereby causing damage to the patient; therefore, it is necessary to design a brain temperature control system that can stably cool down the patient according to the patient's body temperature. Summary of the invention

[0004] The content of this application is used to introduce concepts in a brief form, which will be described in detail in the detailed implementation section below. The content of this application is not intended to identify the key features or essential features of the technical solution claimed for protection, nor is it intended to limit the scope of the technical solution claimed for protection.

[0005] In order to solve the technical problems mentioned in the above background technology section, some embodiments of the present application provide a brain temperature control system, including:

[0006] A head cover having a concave cavity for enclosing the head;

[0007] A temperature control unit having a chamber for containing a temperature-reducing medium;

[0008] A pump body is connected to the chamber through a pipeline to drive the cooling medium to flow;

[0009] Semiconductor refrigeration chip, which is arranged in the pump body to control the cooling / heating of the cooling medium;

[0010] A temperature control component, comprising a temperature measuring element for monitoring the patient's body temperature and connected to the semiconductor cooling chip to control the power of the semiconductor cooling chip according to the body temperature;

[0011] The temperature control unit has several pieces, which are arranged in the concave cavity and contact the epidermis of the human head; a pipeline is connected to each temperature control unit, and the pipeline consists of a liquid inlet channel and a liquid return channel; the pump body has a liquid storage cavity connected to the pipeline, and a semiconductor cooling plate is arranged in the liquid storage cavity to adjust the cooling medium in the liquid storage cavity

[0012] During use, the headgear makes the temperature control unit and the pipeline contact with the surface of the patient's head; the heat-conducting medium flowing in the pipeline and the temperature component can effectively cool down / heat up the patient's head and control the patient's temperature; the setting of the semiconductor refrigeration plate can cool down / heat the heat-conducting medium to effectively control the temperature; the setting of the temperature control component can control the power of the semiconductor refrigeration plate according to the patient's body temperature to adjust the temperature of the heat-conducting medium, and further control the cooling efficiency.

[0013] In some embodiments, the conduit extends along the inner wall of the cavity and is connected to the temperature control unit.

[0014] In some embodiments, a rotating shaft is rotatably arranged on the inner wall of the liquid storage chamber, and the rotating shaft is connected to a driver to drive the rotating shaft to rotate;

[0015] An eccentric ring is eccentrically arranged in the liquid storage cavity, and at least a part of the side wall of the eccentric ring is in contact with the inner wall of the liquid storage cavity;

[0016] The eccentric ring has an inner cavity for containing a heat conducting agent;

[0017] The semiconductor refrigeration sheet is connected to the inner cavity to adjust the temperature of the thermal conductor.

[0018] In some embodiments, a guide plate is fixedly disposed on the side wall of the rotating shaft;

[0019] The inner wall of the eccentric ring radially penetrates into the liquid storage cavity to form an opening corresponding to the guide plate;

[0020] The guide plate passes through the opening and contacts the inner wall of the accommodating cavity;

[0021] The central axis of the rotating shaft and the central axis of the eccentric ring are arranged in parallel on the same plane.

[0022] In some embodiments, a partition is disposed in the inner cavity to divide the inner cavity into a first cavity and a second cavity;

[0023] The surface of the partition close to the opening penetrates the first cavity and the second cavity;

[0024] The first cavity is close to the liquid storage cavity, and an arc groove is formed near the inner wall of the liquid storage cavity.

[0025] In some embodiments, a portion of the surface of the partition is raised to form a convex column, and the convex column passes through the second chamber and approaches the rotation axis;

[0026] The end surface of the convex column penetrates into the first cavity to form a piston cavity;

[0027] The inner wall portion of the piston cavity penetrates into the second cavity to form an inlet;

[0028] The surface of the rotating shaft is partially raised to form a piston rod, and the piston rod is inserted into the piston cavity;

[0029] A first one-way valve is provided at the connection between the piston cavity and the first chamber;

[0030] A second one-way valve is arranged at the inlet.

[0031] In some embodiments, the semiconductor cooling chip is installed in the rotating shaft;

[0032] A heat conducting block connected to the semiconductor refrigeration sheet is arranged on the piston column;

[0033] The heat conducting block protrudes from the surface of the piston column.

[0034] In some embodiments, the temperature control assembly further comprises:

[0035] An electronic thermometer is arranged in the temperature control unit to detect the temperature of the cooling medium;

[0036] A flow monitor is installed on the pipeline to detect the flow rate of the cooling medium in the pipeline;

[0037] The central processing unit is electrically connected to the temperature measuring device, the electronic thermometer and the flow detector.

[0038] In some embodiments, the central processor further comprises an information processing module, which is used to receive and analyze electrical signals transmitted by the temperature measuring element, the electronic thermometer and the flow monitor;

[0039] The central processing unit is electrically connected to the driver and the semiconductor cooling chip to control the opening and closing of the driver and the power of the semiconductor cooling chip.

[0040] In some embodiments, a method for controlling temperature of a brain temperature control system comprises the following steps:

[0041] S1. When in use, insert the temperature measuring device into the patient's anus, and the central processor receives the patient's temperature; the central processor determines cooling / heating according to the preset temperature value; put the headgear on the patient's head and start operation;

[0042] S2, the central processing unit controls the semiconductor refrigeration chip to cool down and adjust the temperature of the heat-conducting medium; the pump body is started to drive the heat-conducting medium to flow;

[0043] S3, when the temperature measuring device detects that the patient's body temperature is close to the preset value, the central processing unit controls the driver to slow down after receiving the information;

[0044] S4. After the patient's body temperature is stabilized within a predetermined range, the temperature measuring device monitors the body temperature in real time and the central processing unit controls the power of the semiconductor refrigeration chip to stabilize the patient's temperature.

[0045] The beneficial effects of the present application are: 1. By setting the headgear, the temperature control unit and the pipeline can be in contact with the patient's head to improve the temperature control effect; 2. By setting the semiconductor refrigeration plate, the heat-conducting medium can be quickly cooled / heated to meet the different needs of the patient; for example, the patient needs to lower the body temperature or rewarm; 3. By setting the pump body and the main unit, the entire brain temperature control system can be miniaturized and easy to carry; 4. By setting an eccentric ring and combining it with a thermal conductor, the heat-conducting medium can be directly temperature-regulated during circulation, which can improve the thermal conductivity and effectively improve the temperature control efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] The drawings constituting a part of this application are used to provide a further understanding of this application, so that other features, purposes and advantages of this application become more obvious. The illustrative embodiment drawings and their descriptions of this application are used to explain this application and do not constitute an improper limitation on this application.

[0047] In addition, throughout the drawings, the same or similar reference numerals represent the same or similar elements. It should be understood that the drawings are schematic and that the components and elements are not necessarily drawn to scale.

[0048] In the attached picture:

[0049] Figure 1 is an overall schematic diagram according to an embodiment of the present application;

[0050] Figure 2 It is the installation structure diagram of the main engine and pump body;

[0051] Figure 3 This is a partial cross-sectional diagram of the headgear;

[0052] Figure 4 It is the distribution diagram of the pipe in the sleeve;

[0053] Figure 5 It is the structural diagram of the pump body;

[0054] Figure 6 This is a half-section diagram of the pump body;

[0055] Figure 7 It is a structural diagram of the first cavity and the second cavity in the pump body;

[0056] Figure 8 It is the structural diagram of the eccentric ring;

[0057] Fig. 9 It is a structural diagram of the pipeline.

[0058] Reference numerals:

[0059] 100. Brain temperature control system; 1. Headgear; 2. Temperature control unit; 3. Pump body; 4. Semiconductor cooling sheet; 5. Concave cavity; 6. Interlayer; 8. Main unit; 9. Installation cavity; 10. Pipeline; 11. Liquid storage cavity; 12. Liquid inlet hole; 13. Liquid outlet hole; 14. Eccentric ring; 15. Rotating shaft; 16. Driver; 17. Guide plate; 18. Opening; 20. Inner cavity; 21. Partition plate; 22. First cavity; 23. Second cavity; 24. Arc groove; 25. Boss; 26. Piston cavity; 27. Piston column; 29. ​​Groove; 30. Heat transfer block; 31. First one-way valve; 32. Second one-way valve; 33. Diaphragm. DETAILED DESCRIPTION

[0060] Embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although certain embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be construed as being limited to the embodiments set forth herein. On the contrary, these embodiments are provided to provide a more thorough and complete understanding of the present disclosure. It should be understood that the drawings and embodiments of the present disclosure are only for exemplary purposes and are not intended to limit the scope of protection of the present disclosure.

[0061] It should also be noted that, for ease of description, only the parts related to the invention are shown in the drawings. In the absence of conflict, the embodiments and features in the embodiments of the present disclosure can be combined with each other.

[0062] It should be noted that the concepts such as "first" and "second" mentioned in the present disclosure are only used to distinguish different devices, modules or units, and are not used to limit the order or interdependence of the functions performed by these devices, modules or units.

[0063] It should be noted that the modifications of "one" and "plurality" mentioned in the present disclosure are illustrative rather than restrictive, and those skilled in the art should understand that unless otherwise clearly indicated in the context, it should be understood as "one or more".

[0064] The present disclosure will be described in detail below with reference to the accompanying drawings and in conjunction with embodiments.

[0065] Embodiment 1

[0066] refer to Figures 1 to 9 , some embodiments of the present application provide a brain temperature control system 100, which is used to reduce the patient's brain temperature by physical cooling to achieve a hypothermic brain protection effect; in the present application, the brain temperature control system 100 includes: a headgear 1, a temperature control unit 2, a pump body 3, a semiconductor cooling sheet 4, and a temperature control component;

[0067] Among them, the head cover 1 can be made of other elastic fabrics such as polyester fabric, spandex fabric or knitted fabric, and is constructed to have a concave cavity 5 for wrapping the head, which can better fit the patient's head and provide a heat preservation effect; the head cover 1 has an interlayer 6, and in this embodiment, three temperature control components 2 are provided, which are respectively arranged in the interlayer 6 and correspond to the forehead of the human head and two places behind the ears, respectively. Such a setting can avoid the temperature control component 2 from directly contacting the patient's skin to improve and prevent the patient from frostbite or scalding; in other embodiments, the temperature control component 2 can be set to different positions and quantities according to the medical plan; the temperature control component 2 is made of rubber or silicone, which is easy to deform and has a soft texture. The temperature control component 2 forms a chamber for accommodating a heat-conducting medium. The heat-conducting medium is preferably heat-conducting oil, which has the advantages of fast heating / cooling and good thermal conductivity, and can effectively transfer heat, so it can effectively regulate the patient's brain temperature; specifically, the heat-conducting medium is controlled by the semiconductor refrigeration plate 4 to cool / heat, thereby achieving cooling / reheating of the patient's body temperature.

[0068] In this embodiment, the brain temperature control system 100 also has a host 8, which includes a shell wall and an installation cavity 9 defined by the shell wall; wherein the pump body 3 is constructed in a cylindrical shape and fixedly arranged in the installation cavity 9, and the installation method is screw connection, bonding, etc., but not limited to other methods or structures that can stably fix the pump body 3 in the installation cavity 9; a pipeline 10 is arranged on the pump body 3, and the pipeline 10 is inserted into the interlayer 6 and is arranged along the inner wall of the concave cavity 5 in a connected continuous S-shaped distribution and in parallel with the temperature control unit 2; the portion of the pipeline 10 located in the concave cavity 5 is flat so as to increase the contact area with the patient's head epidermis; with such a configuration, when the heat-conducting medium flows through the pipeline 10, it can also evenly take away the heat of the patient's head, thereby obtaining a better cooling effect;

[0069] Specifically, a liquid storage chamber 11 connected to the pipeline 10 is formed in the pump body 3; it can be understood that the pump body 3 can give the heat-conducting medium a power to flow in the pipeline 10, so that the heat-conducting medium can flow into the temperature control unit 2 through the pipeline 10 and then flow back into the pump body 3; more specifically, a semiconductor refrigeration sheet 4 is arranged in the pump body 3, and the semiconductor refrigeration sheet 4 can achieve temperature adjustment of the heat-conducting medium from 90°C to -130°C; the temperature of the refrigeration medium can be adjusted by the arrangement of the semiconductor refrigeration sheet 4 to control the cooling / heating of the heat-conducting medium, which can be understood as achieving the temperature of the temperature control unit 2 and thus the body temperature of the patient;

[0070] The inner wall of the liquid storage chamber 11 is formed with a liquid inlet hole 12 and a liquid outlet hole 13; specifically, a diaphragm 33 is formed in the pipe 10 to divide the pipe 10 into a liquid inlet chamber and a liquid outlet chamber; wherein the liquid inlet chamber is connected to the liquid outlet hole 13, so that the heat-conducting medium enters the liquid inlet chamber from the liquid outlet hole 13 and then flows into the temperature control unit 2 along the pipe 10; the heat-conducting medium in the temperature control unit 2 can enter the liquid outlet chamber and enter the liquid inlet hole 12 along the pipe 10; thereby, heat exchange is achieved, ensuring that the heat-conducting medium is always in the best temperature control state;

[0071] More specifically, a reference plane perpendicular to the bottom surface of the liquid storage chamber 11 and radially dividing the two side walls of the liquid storage chamber 11 is defined as a first reference plane, and the central axis of the liquid storage chamber 11 is coplanar with the first reference plane; the liquid inlet hole 12 and the liquid outlet hole 13 are both located on one side of the first reference plane; on this basis, an eccentric ring 14 is rotatably arranged in the liquid storage chamber 11, and the central axis of the eccentric ring 14 is parallel to the central axis of the liquid storage chamber 11 on the same horizontal plane; at least part of the side wall of the eccentric ring 14 is always in contact with the inner wall of the liquid storage chamber 11; wherein, a rotating shaft 15 is rotatably arranged on the bottom surface of the liquid storage chamber 11, and the axis of the rotating shaft 15 is colinearly arranged with the axis of the liquid storage chamber 11; specifically, a driver 16 connected to the rotating shaft 15 is installed outside the main machine 8, and the driver 16 is a motor for driving the rotating shaft 15 to rotate;

[0072] Specifically, a guide plate 17 is fixedly arranged on the side wall of the rotating shaft 15; the inner wall of the eccentric ring 14 radially penetrates to the liquid storage chamber 11 to form an opening 18 corresponding to the guide plate 17, and the guide plate 17 contacts the inner wall of the accommodating chamber through the opening 18. When the rotating shaft 15 starts to rotate, it can drive the guide plate 17 to rotate, thereby driving the heat-conducting medium in the liquid storage chamber 11 to be diverted from the liquid inlet hole 12 to the liquid outlet hole 13, so that the heat-conducting medium flows through the liquid storage chamber 11 and circulates; wherein, a sealing sleeve that fits the surface of the guide plate 17 is arranged at the opening 18 to prevent the liquid in the liquid storage chamber 11 from entering the eccentric ring 14, thereby improving the sealing performance; on this basis, an inner cavity 20 is formed in the eccentric ring 14, and a heat-conducting agent is provided in the inner cavity 20, and the heat-conducting agent is mercury with good thermal conductivity; the heat-conducting agent contacts the semiconductor refrigeration sheet 4; It can be understood that the semiconductor refrigeration sheet 4 can cool / heat mercury. Since mercury has good thermal conductivity, it can quickly respond to temperature changes to adjust the temperature of the eccentric ring 14 so that the temperature of the eccentric ring 14 is consistent with the temperature of the heat conductor. During the rotation of the eccentric ring 14, the outer wall of the eccentric ring 14 contacts the heat-conducting medium in the liquid storage chamber 11. Therefore, the rotation of the eccentric ring 14 can drive the heat-conducting medium to flow on the one hand, and on the other hand, the temperature of the heat-conducting medium in the liquid storage chamber 11 is adjusted during the flow. For example, when cooling a patient, the heat-conducting medium absorbs heat after passing through the patient's head, causing the temperature of the heat-conducting medium to rise. When the heat-conducting medium enters the liquid storage chamber 11, the eccentric ring 14 acts to cool the heat-conducting medium again, thereby improving the cooling effect of the patient and achieving a rapid cooling effect.

[0073] More specifically, a partition 21 is provided in the inner cavity 20 to divide the inner cavity 20 into a first cavity 22 and a second cavity 23; the surface of the partition 21 near the opening 18 penetrates the first cavity 22 and the second cavity 23 so that mercury can flow between the first cavity 22 and the second cavity 23; wherein, the first cavity 22 is near the liquid storage cavity 11, and a plurality of arc grooves 24 are formed inside the first cavity 22, and the arc grooves 24 are provided in a plurality and are evenly distributed along the inner wall of the first cavity 22 to increase the contact area between the refrigerant and the first cavity 22, thereby improving the temperature regulation effect; on this basis, a portion of the surface of the partition 21 The protrusion forms a protrusion 25, which penetrates the second cavity 23 and approaches the rotating shaft 15; the end surface of the protrusion 25 close to the rotating shaft 15 penetrates the first cavity 22 to form a piston cavity 26; the radial protrusion of the side wall of the rotating shaft 15 forms a piston column 27 inserted into the piston cavity 26; wherein, the piston cavity 26 is located on the inner wall of the second cavity 23 and penetrates into the second cavity 23 to form an inlet, so that the liquid in the second cavity 23 enters the piston cavity 26 from the inlet; it can be understood that during operation, since the rotating shaft 15 and the eccentric ring 14 are eccentrically arranged, the piston column 27 will be caused in the piston cavity 22 during the rotation process. 6 reciprocates; thus, mercury can be driven to flow between the first cavity 22 and the second cavity 23 so that the mercury can be uniformly transferred to the heat of the eccentric ring 14; specifically, a first one-way valve 31 is provided at the junction of the piston cavity 26 and the first cavity 22, and a second one-way valve 32 is provided at the inlet; wherein, the first one-way valve 31 always allows the refrigerant to enter the first cavity 22 from the piston cavity 26, and the second one-way valve 32 always allows the refrigerant to enter the piston cavity 26 from the second cavity 23; thus, when the piston column 27 moves, for example, when the piston column 27 is away from the first one-way valve 32, the refrigerant in the second cavity 23 can be The heat transfer agent is introduced into the piston cavity 26, and the temperature is adjusted after contacting with the semiconductor refrigeration plate 4; when the piston 27 is close to the first one-way valve 32, the heat transfer agent in the piston cavity 26 is introduced into the first cavity 22; at this time, the heat transfer agent in the first cavity 22 can adjust the temperature of the heat transfer medium in the liquid storage cavity 11 through the cooling / heating of the semiconductor refrigeration plate 4; the design of the above scheme avoids the semiconductor refrigeration plate 4 directly adjusting the temperature of the heat transfer medium, and the heat transfer agent can be used as a medium for regulation to more stably adjust the temperature of the heat transfer medium; prevent the temperature of the heat transfer medium from cooling / heating too fast, which affects the comfort of the patient;

[0074] More specifically, a groove 29 for placing the semiconductor cooling sheet 4 is formed in the rotating shaft 15, and a heat-conducting block 30 is provided on the piston column 27. The heat-conducting block 30 penetrates into the groove 29 and is connected to the semiconductor cooling sheet 4; and the connection is also coated with thermal grease to improve the heat conduction effect; wherein, the bottom part of the groove 29 penetrates to the outside of the host 8 to form a heat dissipation hole, and a micro fan is also installed in the groove 29 to dissipate heat from the semiconductor cooling sheet 4; preferably, the heat-conducting block 30 is an aluminum block or silver, which has good thermal conductivity to improve the transfer of heat energy of the semiconductor cooling sheet 4; the surface of the heat-conducting block 30 protruding from the piston column 27 can contact with mercury, so that when in use, the heat-conducting block 30 can transfer the temperature generated by the semiconductor cooling sheet 4 to the mercury, thereby improving the performance of heat conduction; at the same time, it also avoids direct contact between mercury and the semiconductor cooling sheet 4, effectively protecting the semiconductor cooling sheet 4.

[0075] In another more specific embodiment, the brain temperature control system 100 is also provided with a temperature control component for controlling the start / shutdown of the pump body 3 and the semiconductor refrigeration plate 4; the temperature control component includes: a temperature measuring component, an electronic thermometer, a flow monitor, and a central processing unit; wherein the temperature measuring component is a thermometer, which can be preferably an electronic rectal thermometer, and the thermometer can be placed in the patient's anus for a long time to monitor the temperature in real time; the electronic thermometer is arranged in the temperature control unit 2 to detect the temperature of the heat-conducting medium; the flow monitor is arranged in the pipeline 10 to monitor the flow rate of the heat-conducting medium in the pipeline 10; a central processing unit electrically connected to the temperature measuring component, the electronic thermometer and the flow detector is also arranged in the host 8; the central processing unit is used to receive and process the electrical signals sent by the temperature measuring component, the electronic thermometer and the flow detector; the central processing unit actively determines according to the electrical signal, for example: the patient's temperature is monitored according to the body temperature signal transmitted by the thermometer, and the power of the semiconductor refrigeration plate 4 is adjusted according to the temperature to change the temperature of the heat-conducting medium, so as to control the patient's body temperature; the electronic thermometer reduces the temperature signal of the heat-conducting medium and transmits it to the central processing unit The central processor can control the power of the semiconductor refrigeration plate 4 according to the temperature of the heat-conducting medium so that the temperature of the heat-conducting medium remains relatively stable, thereby improving the temperature control effect on the patient; the flow monitor can monitor the flow rate of the heat-conducting medium in the pipeline 10 in real time, and can control the power of the driver 16 according to the flow rate in the pipeline 10, thereby adjusting the rotation of the rotating shaft 15 to control the flow rate of the heat-conducting medium, so that the flow rate can be more stable, and the stable flow rate can make the cooling more comfortable for the patient; the host 8 is also provided with a display electrically connected to the central processor to display the patient temperature and the temperature of the heat-conducting medium; the central processor is also electrically connected to the information storage module to save the patient's temperature in each time period and generate a temperature curve diagram for the convenience of observation by medical staff; in addition, the central processor in the host 8 also has a Bluetooth module to connect to the mobile terminal of the medical staff, such as a mobile phone or a tablet to facilitate real-time monitoring by the medical staff; the host 8 is also provided with a controller, which can actively select the patient's body temperature; the central processor can automatically adjust according to the temperature selected by the controller, thereby improving the convenience of use.

[0076] On this basis, the host 8 is also provided with an alarm, which is also connected to the mobile terminal through a Bluetooth module; wherein the alarm is a three-color light of green, yellow and red; during use, the green light is on when the patient's temperature is within the set range; when the host 8 is cooling down / heating up, the yellow light is on, indicating that the host 8 is working; when the patient's body temperature exceeds the set range during use, the red light is on and an alarm signal is issued.

[0077] Embodiment 2

[0078] A temperature control method for a brain temperature control system 100 comprises the following steps:

[0079] S1. When in use, insert the temperature measuring device into the patient's anus, and the central processor receives the patient's temperature; select the temperature required by the patient through the controller; for example, the selected temperature control is 32℃-34℃, the central processor determines that the temperature needs to be lowered, puts on the hood and starts running;

[0080] S2, the central processing unit controls the semiconductor refrigeration plate 4 to cool down and adjust the temperature of the heat-conducting medium; starts the pump body 3 to start driving the heat-conducting medium to flow;

[0081] S3. The design of the pipe 10 allows the heat-conducting medium to flow evenly in the brain to take away the heat. During operation, the temperature measuring element detects the patient's body temperature in real time and feeds back to the central processor. For example, when the temperature measuring element detects that the patient's body temperature is close to 35°C, the central processor controls the driver 16 to slow down after receiving the information, thereby controlling the flow of the heat-conducting medium to slow down the cooling speed, making the cooling more stable and preventing excessive cooling.

[0082] S4. After the patient's body temperature stabilizes at 32°C-34°C, the temperature measuring element monitors the body temperature in real time and the central processing unit controls the power of the semiconductor refrigeration sheet 4 to stabilize the patient's temperature.

[0083] Embodiment 3

[0084] A temperature control method for a brain temperature control system 100 comprises the following steps:

[0085] S1. When in use, insert the temperature measuring device into the patient's anus, and the central processor receives the patient's temperature; select the temperature and time required by the patient through the controller; for example, select to control the temperature to 32℃-34℃ within 3h, the central processor determines that the temperature needs to be lowered, puts on the hood and starts operation;

[0086] S2, the central processing unit controls the semiconductor refrigeration plate 4 to cool down and adjust the temperature of the heat-conducting medium; starts the pump body 3 to start driving the heat-conducting medium to flow;

[0087] S3, the heat-conducting medium flows in the pipe 10 to take away the patient's heat, and the temperature measuring element monitors the patient's body temperature in real time; at the same time, the signal is transmitted to the central processing unit, and the central processing unit can adjust the temperature of the semiconductor refrigeration sheet 4 according to the body temperature in each time period to control the temperature of the heat-conducting medium, thereby being able to control the cooling speed;

[0088] S4. After the patient's body temperature stabilizes at 32°C-34°C, the temperature measuring element monitors the body temperature in real time and the central processing unit controls the power of the semiconductor refrigeration sheet 4 to stabilize the patient's temperature.

[0089] The above descriptions are only some preferred embodiments of the present disclosure and an explanation of the technical principles used. Those skilled in the art should understand that the scope of the invention involved in the embodiments of the present disclosure is not limited to the technical solutions formed by a specific combination of the above-mentioned technical features, but should also cover other technical solutions formed by any combination of the above-mentioned technical features or their equivalent features without departing from the above-mentioned inventive concept. For example, the above-mentioned features are replaced with the technical features with similar functions disclosed in the embodiments of the present disclosure (but not limited to) and the technical solutions formed.

Claims

1. A brain temperature control system, worn on the patient's head, characterized in that: include: A head cover having a cavity for wrapping the head; A temperature control unit having a chamber for containing a heat transfer medium; A pump body, connected to the chamber through a pipeline to provide power for the heat transfer medium to flow; A semiconductor refrigeration sheet is arranged in the pump body to control the cooling / heating of the heat-conducting medium; A temperature control component, electrically connected to the semiconductor refrigeration chip and controlling the cooling / heating of the semiconductor refrigeration chip; Among them, the temperature control unit is provided with several blocks, which are fixedly arranged on the inner wall of the concave cavity and in contact with the epidermis of the human head to transfer the temperature to the epidermis of the head; the pipeline is laid on the inner wall of the concave cavity and is connected in parallel / series with each of the temperature control units; the pump body is provided with a liquid storage cavity connected to the pipeline, and the semiconductor refrigeration plate is arranged in the liquid storage cavity to adjust the cooling / heating of the heat-conducting medium in the liquid storage cavity.

2. The brain temperature control system according to claim 1, characterized in that: The headgear is also provided with a temperature measuring element for monitoring the patient's body temperature; The temperature measuring component is electrically connected to the temperature control component; Wherein, the temperature measuring component is inserted into the patient's ear canal to detect the patient's ear temperature.

3. A brain temperature control system according to claim 1, characterized in that: The inner wall of the liquid storage chamber is rotatably provided with a rotating shaft; A driver is arranged on the pump body, and the driver is connected to the rotating shaft to drive the rotating shaft to rotate; An eccentric ring is eccentrically arranged in the liquid storage cavity, and at least a part of the side wall of the eccentric ring is in contact with the inner wall of the liquid storage cavity; The eccentric ring forms an inner cavity for accommodating a thermal conductive agent; Wherein, the semiconductor refrigeration sheet is partially located in the inner cavity and in contact with the heat conductive agent.

4. A brain temperature control system according to claim 3, characterized in that: A guide plate is fixedly arranged on the side wall of the rotating shaft; The inner wall of the eccentric ring radially penetrates into the liquid storage cavity to form an opening corresponding to the guide plate; The guide plate passes through the opening and contacts the inner wall of the accommodating cavity; Wherein, the central axis of the rotating shaft and the central axis of the eccentric ring are arranged in parallel on the same plane.

5. A brain temperature control system according to claim 4, characterized in that: A partition is fixedly arranged in the inner cavity to divide the inner cavity into a first cavity and a second cavity; The surface of the partition close to the opening penetrates the first cavity and the second cavity; Wherein, the first cavity is close to the liquid storage cavity, and an arc groove is formed near the inner wall of the liquid storage cavity.

6. A brain temperature control system according to claim 5, characterized in that: The surface of the partition plate is partially raised to form a convex column, and the convex column passes through the second chamber and approaches the rotation axis; The end surface of the convex column penetrates into the first cavity to form a piston cavity; The inner wall portion of the piston cavity penetrates into the second cavity to form an inlet; The surface of the rotating shaft is partially raised to form a piston column, and the piston column is inserted into the piston cavity; A first one-way valve is provided at the junction of the piston cavity and the first chamber; A second one-way valve is arranged at the inlet.

7. A brain temperature control system according to claim 6, characterized in that: The semiconductor refrigeration sheet is installed in the rotating shaft; A heat conducting block connected to the semiconductor refrigeration sheet is arranged on the piston column; Wherein, the heat-conducting block protrudes from the surface portion of the piston column.

8. A brain temperature control system according to claim 7, characterized in that: The temperature control component also includes: An electronic thermometer, arranged in the temperature control unit to detect the temperature of the heat-conducting medium; A flow monitor, arranged on the pipeline to detect the flow rate of the heat-conducting medium in the pipeline; The central processing unit is electrically connected to the temperature measuring element, the electronic thermometer and the flow detector.

9. A brain temperature control system according to claim 8, characterized in that: The central processor further comprises an information processing module, which is used to receive and analyze the electrical signals transmitted by the temperature measuring element, the electronic thermometer and the flow monitor; The central processing unit is electrically connected to the driver and the semiconductor refrigeration chip to control the opening and closing of the driver and the power of the semiconductor refrigeration chip.

10. A temperature control method for a brain temperature control system, characterized in that: A brain temperature control system according to any one of claims 1 to 9, comprising the following steps: S1. When in use, insert the temperature measuring device into the patient's anus, and the central processor receives the patient's temperature; the central processor determines cooling / heating according to the preset temperature value; put the headgear on the patient's head and start operation; S2, the central processing unit controls the semiconductor refrigeration chip to cool down and adjust the temperature of the heat-conducting medium; the pump body is started to drive the heat-conducting medium to flow; S3, when the temperature measuring device detects that the patient's body temperature is close to the preset value, the central processing unit controls the driver to slow down after receiving the information; S4. After the patient's body temperature is stabilized within a predetermined range, the temperature measuring device monitors the body temperature in real time and the central processing unit controls the power of the semiconductor refrigeration chip to stabilize the patient's temperature.

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