Solution degassing device for semiconductor equipment

Abstract

The invention relates to the field of semiconductor manufacturing, and provides a solution degassing device for semiconductor equipment, which comprises a solution storage tank, a nitrogen pressurization system, an exhaust device, a filter, an on-off valve and a nozzle, the solution storage tank is sequentially connected with the exhaust device, the filter, the on-off valve and the nozzle through a liquid supply pipeline, the exhaust device comprises a liquid storage tank, a sensor, a liquid inlet, a liquid outlet, a degassing spray head and an exhaust pipeline, and the liquid inlet and the exhaust pipeline are arranged at the upper end of the liquid storage tank; the liquid outlet is formed in the lower end part of the liquid storage tank, one end of the degassing spray head is arranged in the liquid storage tank, the other end of the degassing spray head is connected with a liquid supply pipeline, a plurality of channels are arranged in the degassing spray head, and the diameter of each channel is smaller than that of the liquid supply pipeline. Cost is low and regular maintenance is not needed.

Description

Technical Field

[0001] The invention relates to the field of semiconductor manufacturing, and in particular to a solution degassing device for semiconductor equipment. Background Art

[0002] In semiconductor wet process equipment, solutions are used to process semiconductor wafers.

[0003] The solution is usually supplied by N2 pressure in a tank. When the solution comes into contact with N2, N2 will dissolve in the solution. N2 bubbles will affect the semiconductor process. N2 needs to be removed.

[0004] The main method now is to add a Degas Module to the pipeline: The working principle of adding a DegasModule to the pipeline is that the hollow fiber uses a vacuum to absorb the gas in the solution through the membrane.

[0005] Although the above method can effectively remove the bubbles in the solution, a Degas Module is expensive and needs to be connected to a vacuum pipeline separately. In addition, the hollow fiber membrane of the Degas Module is easily damaged and leaked, has a certain lifespan, and needs to be replaced regularly.

[0006] Therefore, although adding a Degas Module can solve the problem of solution bubbles, the high cost requires regular replacement of the hollow fiber membrane, which causes a significant increase in the manufacturing cost of the equipment. A new solution with low cost and low maintenance cost is urgently needed to solve the problem of solution bubbles. Summary of the invention

[0007] This application is proposed in order to solve the above technical problems.

[0008] A solution degassing device for semiconductor equipment, the device comprising a solution storage tank, a nitrogen pressurizing system, an exhaust device, a filter, an on-off valve and a nozzle, the nitrogen pressurizing system is connected to the solution storage tank, the solution storage tank and the exhaust device, the filter, the on-off valve and the nozzle are connected in sequence through a liquid supply pipeline, the exhaust device comprises a liquid storage tank, a sensor arranged on the liquid storage tank, a liquid inlet, a liquid outlet, a degassing nozzle, and an exhaust pipeline, the liquid inlet and the exhaust pipeline are arranged at the upper end of the liquid storage tank, the liquid outlet is arranged at the At the lower end, one end of the degassing nozzle is arranged in the liquid storage tank, and the other end of the degassing nozzle is connected to the liquid supply pipeline, wherein a plurality of channels are arranged in the degassing nozzle, and the diameter of the channel is smaller than the diameter of the liquid supply pipeline, so that when the liquid in the solution storage tank passes through the degassing nozzle, the flow rate of the liquid increases and the pressure decreases, so that the bubbles in the solution gather at the upper position, and the liquid outlet is arranged at the lower end of the liquid storage tank, therefore, the bubbles are at the top and the solution is at the bottom, and the solution is discharged to the nozzle along the liquid outlet, and the bubbles are discharged to the outside through the exhaust pipeline.

[0009] Preferably, when in operation, the nitrogen pressurizing system inputs nitrogen into the solution storage tank and maintains the gas pressure of the solution storage tank constant, so that the pressure of the solution storage tank when discharging liquid into the liquid supply pipeline is constant.

[0010] Preferably, a connector is provided at the upper end of the liquid storage tank, and the liquid inlet and the exhaust pipeline are arranged on the connector.

[0011] Preferably, the connecting piece is a cover piece, which mainly plays the role of disassembly and sealing of the liquid storage tank.

[0012] Preferably, a gas gathering structure with a conical structure design is provided at the connection between the connector and the exhaust pipe. The gas gathering structure is arranged in the liquid storage tank, and the diameter of the lower end of the gas gathering structure is larger than the upper end. When the bubbles in the solution gather at the upper position in the liquid storage tank, the bubbles will gradually gather along the upper end of the gas gathering structure and finally be discharged to the outside through the exhaust pipe.

[0013] Preferably, during operation, the solution storage tank presses out the liquid through the nitrogen pressurization system and transports it through the liquid supply pipeline. Since the air pressure input into the solution storage tank by the nitrogen pressurization system is constant, the flow rate increases and the pressure decreases when the liquid passes through the degassing nozzle, so that the bubbles in the solution gather above the solution and are discharged through the exhaust pipeline.

[0014] Preferably, the degassing nozzle is an exhaust device applied according to Bernoulli's principle.

[0015] Preferably, the degassing nozzle is made of PFA or PTFE material.

[0016] Preferably, the pressure difference and flow rate change of the liquid when passing through the degassing nozzle satisfies the following formula: Wherein, Q represents flow rate, C represents flow coefficient, d2 represents inner diameter of the channel of the degassing nozzle, p1, p2, represents pressure, and ρ represents density.

[0017] Preferably, the diameter of the channel is inversely proportional to the flow rate of the liquid, and the diameter of the channel and the flow rate of the liquid satisfy the following formula: Wherein, C represents the flow coefficient, Q represents the flow rate, V represents the kinematic viscosity (i.e., the ratio of the viscosity and density of the liquid in the solution storage tank), and L represents the channel length.

[0018] Compared with the prior art, the advantages of the technical solution of the present application include at least the following:

[0019] 1. In order to remove bubbles from the solution, most of the existing semiconductor devices adopt the method of adding a Degas Module to the pipeline. Although this method can remove the bubbles in the solution, the cost of a Degas Module is expensive, and a vacuum pipeline needs to be connected to it separately. In addition, the hollow fiber membrane of the Degas Module is easily damaged and leaks, has a certain lifespan, and needs to be replaced regularly. Based on this, the present invention proposes to add an exhaust device to the pipeline, which is mainly composed of a liquid storage tank, a degassing nozzle and an exhaust pipeline. The degassing nozzle is provided with a plurality of small-aperture channels. Since the nitrogen pressurization system can apply a constant gas pressure to the solution storage tank, the liquid will follow Bernoulli's principle when flowing through the degassing nozzle, so that the bubbles in the solution gather above the solution, and the solution and the bubbles are stratified. In addition, the bubbles will be discharged to the outside through the exhaust pipeline. The cost of this solution is low, and there is no need to replace the hollow fiber membrane regularly.

[0020] 2. Different from the prior art, the diameter of the lower end of the gas gathering structure is larger than that of the upper end. When the bubbles in the solution gather at the upper position in the liquid storage tank, the bubbles will gradually gather along the upper end of the gas gathering structure and finally be discharged to the outside through the exhaust pipe.

[0021] The embodiments of the present application can achieve other advantageous technical effects that are not listed one by one. These other technical effects may be partially described below and are predictable and understandable to those skilled in the art after reading the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The above-mentioned features and advantages and other features and advantages of these embodiments and the manner in which they are achieved will become more apparent, and the embodiments of the present application can be better understood by referring to the following description together with the accompanying drawings, in which:

[0023] Figure 1 It is a circuit diagram of the present invention.

[0024] Figure 2 , 3 It is a schematic diagram of the exhaust device of the present invention.

[0025] Figure 4 Schematic diagram of gas comparison before and after the solution passes through the degassing device in the present invention.

[0026] The features indicated by the numbers in the accompanying drawings are as follows:

[0027] 1-solution storage tank, 2-nitrogen pressurization system, 3-exhaust device, 31-liquid storage tank, 311-connector, 3111-gas gathering structure, 32-sensor, 33-liquid inlet, 34-liquid outlet, 35-degassing nozzle, 351-channel, 36-exhaust pipeline, 4-filter, 5-on-off valve, 6-nozzle, 7-liquid supply pipeline. DETAILED DESCRIPTION

[0028] In the following description of the drawings and specific embodiments, the details of one or more embodiments of the present application will be described. From these descriptions, drawings and claims, other features, purposes and advantages of the present application can be clearly seen.

[0029] It should be understood that the illustrated and described embodiments are not limited in application to the details of the construction and arrangement of the components set forth in the following description or illustrated in the accompanying drawings. The illustrated embodiments may be other embodiments and may be implemented or executed in various ways. Each example is provided by explaining the disclosed embodiments rather than limiting them. In fact, it will be apparent to those skilled in the art that various modifications and variations may be made to the embodiments of the present application without departing from the scope or essence disclosed in the present application. For example, a feature illustrated or described as part of an embodiment may be used together with another embodiment to still produce another embodiment. Therefore, the present application discloses and covers such modifications and variations within the scope of the appended claims and their equivalent elements.

[0030] Likewise, it is understood that the phrases and terms used herein are for descriptive purposes and should not be considered restrictive. The use of "include," "comprise," or "have" and variations thereof herein is intended to be open-ended to include the items listed thereafter and their equivalents and additional items.

[0031] The present application will be described in more detail below with reference to different embodiments and examples of several aspects of the present application.

[0032] Embodiment 1

[0033] A solution degassing device for semiconductor equipment, such as Figure 1 As shown, the device includes a solution storage tank 1, a nitrogen pressurizing system 2, an exhaust device 3, a filter 4, an on-off valve 5 and a nozzle 6. The nitrogen pressurizing system 2 is connected to the solution storage tank 1, and the solution storage tank 1 is connected to the exhaust device 3, the filter 4, the on-off valve 5 and the nozzle 6 in sequence through a liquid supply pipeline 7. Figure 2 and 3 As shown, the exhaust device 3 includes a liquid storage tank 31, a sensor 32 (sensor 32 tests the liquid level) arranged on the liquid storage tank 31, a liquid inlet 33, a liquid outlet 34, a degassing nozzle 35, and an exhaust pipeline 36, wherein the liquid inlet 33 and the exhaust pipeline 36 are arranged at the upper end of the liquid storage tank 31, the liquid outlet 34 is arranged at the lower end of the liquid storage tank 31, one end of the degassing nozzle 35 is arranged in the liquid storage tank 31, and the other end of the degassing nozzle 35 is connected to the liquid supply pipeline 7, wherein the degassing nozzle 35 is provided with There are multiple channels 351, and the diameter of the channels 351 is smaller than the diameter of the liquid supply pipeline 7, so that when the liquid in the solution storage tank 1 passes through the degassing nozzle 35, the flow rate of the liquid increases and the pressure decreases, so that the bubbles in the solution gather at the upper position, and the liquid outlet 34 is arranged at the lower end of the liquid storage tank 31, so that the bubbles are at the top and the solution is at the bottom, and the solution is discharged to the nozzle 6 along the liquid outlet 34, and the bubbles are discharged to the outside through the exhaust pipeline 36. Before and after the solution passes through the degassing nozzle 35, the nitrogen contained in the solution is significantly reduced, such as Figure 4 shown.

[0034] In one embodiment, when in operation, the nitrogen pressurizing system 2 inputs nitrogen into the solution storage tank 1 and maintains the gas pressure of the solution storage tank 1 constant, so that the pressure of the solution storage tank 1 when discharging liquid into the liquid supply pipeline 7 is constant.

[0035] In one embodiment, a connector 311 is disposed at the upper end of the liquid storage tank 31 , and the liquid inlet 33 and the exhaust pipe 36 are disposed on the connector 311 .

[0036] In one embodiment, the connecting member 311 is a cover member, which mainly serves the function of disassembly and sealing the liquid storage tank 31 .

[0037] In one embodiment, a gas gathering structure 3111 with a conical structure design is provided at the connection between the connecting piece 311 and the exhaust pipe 36. The gas gathering structure 3111 is arranged in the liquid storage tank 31, and the diameter of the lower end of the gas gathering structure 3111 is larger than the upper end. When the bubbles in the solution gather at the upper position in the liquid storage tank 31, the bubbles will gradually gather along the upper end of the gas gathering structure 3111, and finally be discharged to the outside through the exhaust pipe 36.

[0038] In one embodiment, during operation, the solution storage tank 1 presses out the liquid through the nitrogen pressurizing system 2 and transports it through the liquid supply pipeline 7. Since the gas pressure input into the solution storage tank 1 by the nitrogen pressurizing system 2 is constant, when the liquid passes through the degassing nozzle 35, the flow rate increases and the pressure decreases, so that the bubbles in the solution gather above the solution and are discharged through the exhaust pipeline 36.

[0039] In one embodiment, the degassing nozzle 35 is an exhaust device 3 applied according to Bernoulli's principle.

[0040] In one embodiment, the degassing nozzle 35 is made of PFA or PTFE material.

[0041] In one embodiment, the pressure difference and flow rate changes of the liquid when passing through the degassing nozzle 35 satisfy the following formula: Wherein, Q represents flow velocity, C represents flow coefficient, d2 represents inner diameter of channel 351 of degassing nozzle 35, p1, p2, represents pressure, and ρ represents density.

[0042] In one embodiment, the diameter of the channel 351 is inversely proportional to the flow rate of the liquid, and the diameter of the channel 351 and the flow rate of the liquid satisfy the following formula:

[0043] Wherein, C represents the flow coefficient, Q represents the flow rate, V represents the kinematic viscosity (ie, the ratio of the viscosity and density of the liquid in the solution storage tank 1 ), and L represents the length of the channel 351 .

[0044] The foregoing description of several embodiments of the present application is presented for illustrative purposes. The foregoing description is not intended to be exhaustive, nor is it intended to limit the present application to the precise configurations, constructions and / or steps disclosed, and it is apparent that many modifications and variations may be made in light of the teachings above. The scope of the present invention and all equivalents are intended to be defined by the appended claims.

Claims

1. A solution degassing device for semiconductor equipment, characterized in that: The device includes a solution storage tank, a nitrogen pressurizing system, an exhaust device, a filter, an on-off valve and a nozzle, wherein the nitrogen pressurizing system is connected to the solution storage tank, and the solution storage tank is connected to the exhaust device, the filter, the on-off valve and the nozzle in sequence through a liquid supply pipeline, and the exhaust device includes a liquid storage tank, a sensor arranged on the liquid storage tank, a liquid inlet, a liquid outlet, a degassing nozzle and an exhaust pipeline, wherein the liquid inlet and the exhaust pipeline are arranged at the upper end of the liquid storage tank, and the liquid outlet is arranged at the lower end of the liquid storage tank, one end of the degassing nozzle is arranged in the liquid storage tank, and the other end of the degassing nozzle is connected to the liquid supply pipeline, wherein a plurality of channels are arranged in the degassing nozzle, and the diameter of the channel is smaller than the diameter of the liquid supply pipeline.

2. A solution degassing device for semiconductor equipment according to claim 1, characterized in that: During operation, the nitrogen pressurizing system inputs a constant air pressure into the solution storage tank, so that the pressure when the solution storage tank discharges liquid into the liquid supply pipeline is constant.

3. A solution degassing device for semiconductor equipment according to claim 1, characterized in that: A connector is provided at the upper end of the liquid storage tank, and the liquid inlet and the exhaust pipeline are arranged on the connector.

4. A solution degassing device for semiconductor equipment according to claim 3, characterized in that: A gas gathering structure with a conical structure design is provided at the connection point between the connector and the exhaust pipe.

5. A solution degassing device for semiconductor equipment according to claim 1, characterized in that: During operation, the solution storage tank presses out the liquid through the nitrogen pressurization system and transports it through the liquid supply pipeline. When the liquid passes through the degassing nozzle, the flow rate increases and the pressure decreases, so that the bubbles in the solution gather above the solution and are discharged through the exhaust pipeline.

6. A solution degassing device for semiconductor equipment according to claim 1, characterized in that: The degassing nozzle is an exhaust device applied according to Bernoulli's principle.

7. A solution degassing device for semiconductor equipment according to claim 1, characterized in that: The degassing nozzle is made of PFA or PTFE material.

8. A solution degassing device for semiconductor equipment according to claim 1, characterized in that: The pressure difference and flow rate changes of the liquid when passing through the degassing nozzle satisfy the following formula: Wherein, Q represents flow rate, C represents flow coefficient, d2 represents inner diameter of the channel of the degassing nozzle, p1, p2, represents pressure, and ρ represents density.

9. A solution degassing device for semiconductor equipment according to claim 1, characterized in that: The diameter of the channel is inversely proportional to the flow rate of the liquid.

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