Tin soldering device for integrated circuit board production

Abstract

The invention discloses a tin soldering device for integrated circuit board production, and relates to the technical field of welding equipment.The tin soldering device comprises a base, a supporting frame is arranged at the upper end of the base, a movable seat is arranged in the supporting frame, a mounting frame is arranged at the bottom end of the movable seat, a welding head is arranged in the mounting frame, a feeding pipe is arranged in the mounting frame, and a conical cavity is formed in the feeding pipe; according to the device, scaling powder can be uniformly smeared on the outer wall of the tin bar through the auxiliary mechanism, the tin bar is conveyed through the conveying mechanism while uniform smearing is achieved, meanwhile, the phenomenon that impurities are attached to the surface of a tin wire can be reduced through the sweeping mechanism, and therefore the welding quality of the tin wire is improved. According to the device, the tin bars are conveyed, smeared and cleaned through the linkage mechanism, the welding quality is further improved, the extra power requirement is reduced, and the cost and complexity of equipment are reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of welding equipment, and more specifically, to a soldering device for producing integrated circuit boards. Background Art

[0002] Circuit boards are important electronic components, supporting bodies for electronic components, and carriers for electrical connections between electronic components. Almost every electronic device, from electronic watches and calculators to computers, communication electronic equipment, and military weapon systems, as long as there are electronic components similar to integrated circuits, must use circuit boards to make electrical interconnections between the various components. Currently, electronic components are integrated on circuit boards by soldering. With the rapid development of the economy, in order to improve production efficiency, fully automatic soldering machines that can automatically perform soldering operations have emerged. To a certain extent, they have replaced manual labor and greatly improved welding work efficiency.

[0003] In order to ensure the welding accuracy, the current automatic soldering machine usually uses flux. The specific method is to spray the flux on the hot melting part of the solder through the nozzle to remove the oxide layer on the surface of the welding rod and reduce the surface tension of the solder. However, the flux may be unevenly distributed after being sprayed out. In some places, there is too much flux, and in other places, there is too little or even no flux. For this reason, we propose a soldering device for integrated circuit board production. Summary of the invention

[0004] In view of the shortcomings of the prior art, the present invention aims to provide a soldering device for producing integrated circuit boards.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: comprising a base, a support frame is provided on the upper end surface of the base, a movable seat is provided in the support frame, a mounting frame is provided at the bottom end of the movable seat, a welding head is provided in the mounting frame, a feeding pipe is provided in the mounting frame, a conical cavity is formed in the feeding pipe, a tin bar is provided in the movable seat, the tin bar correspondingly passes through the feeding pipe, an auxiliary mechanism for evenly applying the tin bar is provided in the feeding pipe, a conveying mechanism for conveying the tin bar is also provided in the feeding pipe, a cleaning mechanism for cleaning the outer surface of the tin bar is provided in the feeding pipe, and the auxiliary mechanism includes a setting A support member in the feeding tube, a smear member is arranged at the bottom end of the support member, a ring member is arranged in the feeding tube, a movable member cooperating with the smear member is arranged in the support member, the ring member and the movable member cooperate to drive the smear member, the conveying mechanism includes a gear member arranged in the ring member, a feeding member is arranged on the side wall of the conical cavity, the gear member and the feeding member cooperate to convey the tin bar, the cleaning mechanism includes a rotating member arranged on the feeding member, a limiting member is arranged on the outer side of the rotating member, a cleaning member for cleaning the outer surface of the tin bar is arranged in the limiting member, and the rotating member and the limiting member cooperate to control the cleaning member.

[0006] Preferably, the support member includes connecting blocks arranged on both sides of the inner wall of the conical cavity, a support plate is arranged between the connecting blocks on both sides, an opening one is arranged in the middle position of the support plate, an annular box is arranged on the upper end surface of the support plate, flux is arranged in the annular box, a support block is arranged at the bottom end of the support plate, the opening one extends into and penetrates the support block, a movable hole is circumferentially opened at the position of the opening one located at the support block, a discharge trough is circumferentially opened in the support plate and the support block, the discharge trough is correspondingly connected to the annular box, and an extrusion rod is correspondingly arranged in the movable hole.

[0007] Preferably, the smearing member comprises a porous plate arranged in the opening, one end of the squeezing rod is correspondingly pressed against the outer surface of the porous plate, and a wiping block is arranged on the inner wall of the porous plate.

[0008] Preferably, the annular member includes an annular groove arranged in the conical cavity, and also includes an annular plate, annular edges are arranged on the inner and outer walls of the annular plate, and the annular edges are correspondingly slidably connected in the annular groove, a first groove is arranged on the upper end surface of the annular plate, a second groove is arranged at the bottom end of the annular plate, a second opening is arranged in the middle position of the annular plate, a circular plate is arranged in the second groove, and the second opening extends into the circular plate accordingly, a reducing portion is circumferentially arranged on the outer wall of the circular plate, the porous plate is arranged on the lower end surface of the bottom end of the circular plate, and the reducing portion is composed of an expanding surface and a curved surface.

[0009] Preferably, a fixing plate is provided on one side of the inner wall of the conical cavity, a rotating electric cylinder is provided on the upper end of the fixing plate, a gear 1 is provided on the output shaft end of the rotating electric cylinder, a gear ring is provided on the inner wall of the second slot, and the gear ring is correspondingly meshed with gear 1.

[0010] Preferably, the movable part includes a sliding hole circumferentially opened on the end surface of the support plate, a limiting groove is provided on the inner side of the sliding hole, a sliding rod is slidably connected between the sliding hole and the limiting groove, a tension spring is provided on the side wall of the sliding rod, one end of the tension spring is provided on the inner wall of the sliding hole, one end of the sliding rod is provided on the side of the reducing portion, and the extrusion rod is correspondingly provided on the outer wall of the sliding rod.

[0011] Preferably, the gear member includes a gear 2 arranged on the upper end surface of the slot 1, a circular opening is provided in the middle position of the gear 2, the gear 2 is meshingly connected with the gear 3, a rotating rod is provided in the gear 3, a linkage plate is provided on the side wall of the conical cavity, the rotating rod is provided in the linkage plate, the feeding member includes a feed wheel provided on the upper end of the rotating rod, a feed trough is provided in the feed wheel, and the tin bar is provided in the feed trough.

[0012] Preferably, the rotating member comprises a movable ring arranged on the outer wall of the rotating rod, the outer wall of the movable ring is provided with a wave groove, and the wave groove comprises a high portion and a low portion.

[0013] Preferably, the limiting member includes a limiting rod arranged in the wave groove, a cleaning rod is arranged at one end of the limiting rod, a cleaning hole is arranged on the upper end surface of the linkage plate, the cleaning rod is correspondingly slidably connected in the cleaning hole, a limiting plate is arranged on one side of the cleaning rod, a conical sleeve is arranged at the bottom end of the linkage plate, and a conical groove is arranged in the conical sleeve.

[0014] Preferably, the cleaning member includes a cleaning wheel arranged on one side of the limiting plate, a hollow hole is provided at the center of the cleaning wheel, a conical groove is provided inside the cleaning wheel, a spherical block is circumferentially provided inside the conical groove, a cleaning strip is provided on the outer wall of the spherical block, and the tin strip passes through the hollow hole accordingly.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] 1. In the present invention, an auxiliary mechanism is provided in the feeding tube so that the flux can be evenly applied on the outer wall of the tin bar, and the tin bar is transported by the conveying mechanism while being evenly applied. At the same time, the cleaning mechanism is helpful to reduce the phenomenon of impurities adhering to the surface of the tin wire, thereby helping to improve the welding quality. In this way, the device can transport, apply and clean the tin bar through the linkage mechanism, further improving the welding quality, which not only reduces the additional power demand, but also reduces the cost and complexity of the equipment.

[0017] 2. In the present invention, the circular plate is driven to rotate by gear transmission, and the diameter reducing part is driven to rotate when the circular plate rotates. At this time, the expanding surface and the curved surface on the diameter reducing part contact the slide bar in sequence. When the expanding surface contacts the slide bar, the slide bar slides outward in the slide hole. When the slide bar contacts the curved surface, it drives the slide hole of the slide bar to move inward under the restoring force of the tension spring. In this way, the flux is discharged into the outer wall of the porous plate through the movable hole, so that the wiping block can absorb the flux and evenly apply the flux to the outer wall of the tin bar, thereby improving the quality of welding.

[0018] 3. In the present invention, the movable ring is driven to rotate by gear transmission, and the wave groove on the movable ring rotates synchronously. Since the limit rod is correspondingly slidably connected in the wave groove, when the limit rod is slidably connected to the high position, the cleaning rod is at the highest point, and when the limit rod is slidably connected to the low position, the cleaning rod is at the lowest point. Therefore, the cleaning rod drives the cleaning wheel on the limit plate to move in the vertical direction. At this time, the cleaning strip on the spherical block cleans the outer wall of the tin strip, thereby reducing the phenomenon of impurities adhering to the surface of the tin wire, which is beneficial to improving the welding quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 The present invention provides a schematic diagram of the overall structure of a soldering device for integrated circuit board production;

[0020] Figure 2 The present invention proposes a soldering device for integrated circuit board production Figure 1 Schematic diagram of point A;

[0021] Figure 3 The present invention provides a cross-sectional schematic diagram of a feed pipe of a soldering device for producing integrated circuit boards;

[0022] Figure 4 The present invention provides a schematic diagram of the internal structure of a soldering device for producing integrated circuit boards;

[0023] Figure 5 The present invention provides a cross-sectional schematic diagram of a support member of a soldering device for producing integrated circuit boards;

[0024] Figure 6 The present invention provides a schematic diagram of a conveying mechanism of a soldering device for integrated circuit board production;

[0025] Figure 7 The present invention provides a schematic diagram of a cleaning mechanism of a soldering device for integrated circuit board production;

[0026] Figure 8 The present invention provides a bottom view schematic diagram of a soldering device for integrated circuit board production;

[0027] Fig. 9 The present invention proposes a soldering device for integrated circuit board production Figure 8 Schematic diagram of point B;

[0028] Fig.10 The present invention provides a cross-sectional schematic diagram of a cleaning component of a soldering device for producing integrated circuit boards.

[0029] In the figure: 100, base; 101, support frame; 102, movable seat; 103, mounting frame; 104, welding head; 105, feeding pipe; 106, conical cavity; 107, tin bar; 200, auxiliary mechanism; 201, support member; 202, smear member; 203, ring member; 204, movable member; 300, conveying mechanism; 301, gear member; 302, feeding member; 400, cleaning mechanism; 401, rotating member; 402, limiting member Positioning piece; 403, cleaning piece; 201a, connecting block; 201b, supporting plate; 201c, opening one; 201d, ring box; 201e, supporting block; 201f, movable hole; 201g, discharge chute; 201h, extrusion rod; 202a, porous plate; 202b, wiping block; 203a, annular groove; 203b, annular plate; 203c, annular edge; 203d, slot one; 203e, slot two; 203f, opening 2; 203g, circular plate; 203h, diameter reducing part; 203i, fixed plate; 203j, rotary cylinder; 203k, gear 1; 203l, gear ring; 203m, diameter expansion surface; 203n, curved surface; 204a, sliding hole; 204b, limit groove; 204c, sliding rod; 204d, tension spring; 301a, gear 2; 301b, circular mouth; 301c, gear 3; 301d, rotating rod; 301e, linkage plate ; 302a, feed wheel; 302b, feed trough; 401a, movable ring; 401b, wave groove; 401c, high part; 401d, low part; 402a, limit rod; 402b, cleaning rod; 402c, cleaning hole; 402d, limit plate; 402e, conical sleeve; 402f, collecting trough; 403a, cleaning wheel; 403b, hollow hole; 403c, conical groove; 403d, spherical block; 403e, cleaning strip. DETAILED DESCRIPTION

[0030] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the accompanying drawings.

[0031] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0032] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The term "in one embodiment" that appears in different places in this specification does not necessarily refer to the same embodiment, nor is it a separate or selective embodiment that is mutually exclusive with other embodiments.

[0033] Embodiment 1 The present invention further describes a soldering device for integrated circuit board production, including a base 100, wherein the upper end surface of the base 100 is fixedly connected to a support frame 101, a movable seat 102 is installed in the support frame 101, a mounting frame 103 is fixedly connected to the bottom end of the movable seat 102, a welding head 104 is detachably connected in the mounting frame 103, a feeding pipe 105 is installed in the mounting frame 103, a conical cavity 106 is formed in the feeding pipe 105, a tin bar 107 is wound by a movable roller in the movable seat 102, the tin bar 107 correspondingly passes through the feeding pipe 105, an auxiliary mechanism 200 for evenly applying the tin bar 107 is provided in the feeding pipe 105, a conveying mechanism 300 for transmitting the tin bar 107 is also provided in the feeding pipe 105, and a cleaning mechanism 400 for cleaning the outer surface of the tin bar 107 is provided in the feeding pipe 105;

[0034] Circuit boards make circuits miniaturized and intuitive, and play an important role in the mass production of fixed circuits and the optimization of electrical appliance layout. Soldering is a welding method that uses low-melting-point metal solder to heat and melt, penetrate and fill the gaps at the joints of metal parts. In the process of processing circuit boards, a soldering device is required to solder the circuit elements on the circuit boards, so that the circuit boards and the circuit elements form a complete circuit. In order to ensure welding accuracy, current soldering machines usually use flux. The specific method is to spray the flux on the hot melt part of the solder through a nozzle to remove the oxide layer on the surface of the tin bar 107 and reduce the surface tension of the solder. However, the flux will be unevenly distributed when sprayed;

[0035] Therefore, the present invention provides an auxiliary mechanism 200 in the feeding tube 105, so that the soldering flux can be evenly applied on the outer wall of the tin bar 107. At the same time, through gear transmission, the device can evenly apply the soldering flux and transmit the tin bar 107 through the conveying mechanism 300. In addition, the device is provided with a cleaning mechanism 400 in the feeding tube 105. The cleaning mechanism 400 is conducive to reducing the phenomenon of impurities adhering to the surface of the tin wire, thereby improving the welding quality. In this way, the device combines the auxiliary mechanism 200, the conveying mechanism 300 and the cleaning mechanism 400 through a linkage structure, thereby transmitting, applying and cleaning the tin bar 107, further improving the welding quality.

[0036] The auxiliary mechanism 200 includes a support member 201 disposed in the feeding tube 105, a smear member 202 is disposed at the bottom of the support member 201, a ring member 203 is disposed in the feeding tube 105, and a movable member 204 is disposed in the support member 201 to cooperate with the smear member 202. The ring member 203 and the movable member 204 cooperate to drive the smear member 202. Figures 1 to 10It can be seen that the present invention provides a corresponding support effect by arranging a support member 201 in the feeding tube 105, and a smearing member 202 and a movable member 204 are arranged at the bottom of the support member 201. In this way, the device controls the smearing member 202 by cooperating with the annular member 203 and the movable member 204, and the soldering flux is evenly smeared on the outer wall of the tin bar 107 through the smearing member 202;

[0037] The conveying mechanism 300 includes a gear member 301 disposed in the annular member 203, and a feeding member 302 is disposed on the side wall of the conical cavity 106. The gear member 301 and the feeding member 302 cooperate to convey the tin bar 107. Figures 3 to 9 It can be seen that the ring member 203 is provided with a gear member 301. When the ring member 203 operates, the gear member 301 operates synchronously. A feeding member 302 is provided in the conical cavity 106. In this way, the gear member 301 and the feeding member 302 cooperate to transport the tin bar 107 in the movable seat 102, achieving a dual-purpose effect.

[0038] The cleaning mechanism 400 includes a rotating member 401 disposed on the feeding member 302, a limiting member 402 is disposed outside the rotating member 401, a cleaning member 403 for cleaning the outer surface of the tin bar 107 is disposed inside the limiting member 402, and the rotating member 401 and the limiting member 402 cooperate to control the cleaning member 403;

[0039] When the soldering machine is soldering the circuit board, the tin wire is continuously consumed and the tin wire needs to be continuously moved to the welding position. However, there are usually some metal debris and dust in the factory. The metal debris and dust are easy to adhere to the surface of the tin wire. When the circuit board is soldered, poor solder joint quality problems are prone to occur. Therefore, cleaning the tin wire before welding wastes time and has low welding efficiency. The present invention provides a cleaning mechanism 400 on the outer side of the feeding member 302, so that the cleaning mechanism 400 cleans the tin wire during the process of the conveying mechanism 300 conveying the tin wire, which is beneficial to reduce the phenomenon of impurities adhering to the surface of the tin wire, thereby helping to improve the welding quality.

[0040] Working principle: In summary, the present invention provides an auxiliary mechanism 200 in the feeding tube 105, so that the flux can be evenly applied on the outer wall of the tin bar 107, and the tin bar 107 is transported through the conveying mechanism 300 while being evenly applied. At the same time, the cleaning mechanism 400 is helpful to reduce the phenomenon of impurities adhering to the surface of the tin wire, thereby improving the welding quality. In this way, the device transmits, applies and cleans the tin bar 107 through the linkage structure, further improving the welding quality, which not only reduces the additional power demand, but also reduces the cost and complexity of the equipment.

[0041] Embodiment 2

[0042] The following technical features are added on the basis of the first embodiment: the support member 201 comprises a connection block 201a fixedly connected to both sides of the inner wall of the conical cavity 106, a support plate 201b is fixedly connected between the connection blocks 201a on both sides, an opening 201c is arranged in the middle position of the support plate 201b, an annular box 201d is detachably mounted on the upper end surface of the support plate 201b, a solder flux is arranged in the annular box 201d, a support block 201e is detachably mounted on the bottom end of the support plate 201b, the opening 201c extends into and penetrates the support block 201e, a movable hole 201f is circumferentially arranged at the position of the opening 201c located at the support block 201e, a discharge groove 201g is circumferentially arranged in the support plate 201b and the support block 201e, the discharge groove 201g is correspondingly connected to the annular box 201d, and an extrusion rod 201h is correspondingly slidably connected in the movable hole 201f;

[0043] Depend on Figures 2 to 8 It can be seen that the conical cavity 106 is symmetrically fixedly connected with a connection block 201a, and a circular support plate 201b is fixedly connected between the connection blocks 201a on both sides. A circular opening 201c is provided in the middle of the support plate 201b, and the tin bar 107 correspondingly passes through the opening 201c. An annular box 201d is detachably installed on the upper end surface of the support plate 201b, and the annular box 201d surrounds the opening 201c. The annular box 201d is placed in the annular box 201d, so that the flux can be replaced;

[0044] A circular support block 201e is detachably mounted at the bottom of the support plate 201b, and an opening 201c extends into and penetrates the support block 201e. A corresponding tin bar 107 penetrates the opening 201c. Three groups of movable holes 201f are opened in a circle on the inner wall of the support block 201e, and the movable holes 201f are provided with six groups in the vertical direction. The corresponding sliding connection of the movable holes 201f is provided with an extrusion rod 201h. The extrusion rod 201h is moved in the movable hole 201f. , so that the flux is ejected from the movable hole 201f. The main working process is that the flux is first discharged from the annular box 201d, and then flows into the discharge slot 201g. When the extrusion rod 201h cuts off the discharge slot 201g, the flux fails to flow into the movable hole 201f. After the extrusion rod 201h slides in the movable hole 201f, the flux falls into the movable hole 201f, and then the flux is pushed out by the extrusion rod 201h, thereby abutting against the outer wall of the smear member 202;

[0045] The smearing member 202 includes a porous plate 202a disposed in the opening, one end of the extrusion rod 201h is correspondingly pressed against the outer surface of the porous plate 202a, and a wiping block 202b is installed on the inner wall of the porous plate 202a. The wiping block 202b is made of sponge material and is used to absorb the soldering flux from the active hole 201f. Figure 5It can be seen that a circular porous plate 202a is provided in the opening. As can be seen from the above, the soldering flux is discharged into the outer wall of the porous plate 202a through the movable holes 201f, and the distribution arrangement of the movable holes 201f is further limited by the device, so that the wiping block 202b can evenly absorb the soldering flux, so that when the porous plate 202a drives the wiping block 202b to rotate, the soldering flux can be evenly applied to the outer wall of the tin bar 107;

[0046] The annular member 203 includes an annular groove 203a provided in the conical cavity 106, and also includes an annular plate 203b. An annular edge 203c is integrally formed on the inner and outer walls of the annular plate 203b. The annular edge 203c is correspondingly slidably connected in the annular groove 203a. The upper end surface of the annular plate 203b is provided with a groove 1 203d, and the bottom end of the annular plate 203b is provided with a groove 203e. The middle position of the annular plate 203b is provided with a second opening 203f. The second groove 203e is fixedly connected to a circular plate 203g. The second opening 203f corresponds to The outer wall of the circular plate 203g is formed with a diameter reducing portion 203h in a circumferential manner. The porous plate 202a is fixedly connected to the lower end surface of the bottom end of the circular plate 203g. A fixed plate 203i is fixedly connected to one side of the inner wall of the conical cavity 106. A rotary electric cylinder 203j is detachably mounted on the upper end surface of the fixed plate 203i. A gear 203k is keyed to the output shaft end of the rotary electric cylinder 203j. A gear ring 203l is fixedly connected to the inner wall of the slot 203e. The gear ring 203l is correspondingly meshed with the gear 203k.

[0047] Depend on Figures 3 to 10 It can be seen that, in order to ensure the stability of the rotation of the annular plate 203b, an annular edge 203c is integrally formed on the outer wall of the annular plate 203b, and an annular groove 203a is provided on the inner wall of the conical cavity 106. The annular plate 203b is slidably connected in the annular groove 203a via the corresponding annular edge 203c. At the same time, the present invention further defines the structure of the annular plate 203b, and the annular plate 203b is respectively provided with a slot 1 203d and a slot 2 203e on both sides, the conveying mechanism 300 and the cleaning mechanism are arranged in the slot 1 203d, the auxiliary mechanism 200 is arranged in the slot 2 203e, and the bottom end of the annular plate 203b is fixedly connected with a circular plate 203g, and three groups of diameter reducing portions 203h are integrally formed on the outer wall of the circular plate 203g, and the porous plate 202a is correspondingly fixedly connected with the circular plate 203g, and the diameter reducing portion 203h is composed of a diameter expansion surface 203m and a curved surface 203n;

[0048] Depend on Figure 8 and Fig. 9It can be seen that the diameter-changing portion 203h is an arc-shaped structure with a continuously changing radius, which is mainly composed of an expanding surface 203m and a curved surface 203n. The expanding surface 203m is a portion where the radius increases, and the curved surface 203n is a portion where the radius gradually decreases. In this way, the annular plate 203b rotates, so that the annular plate 203b drives the circular plate 203g to rotate synchronously. At this time, the diameter-changing portion 203h generates an extrusion force on the slide bar 204c, and its driving source is a rotary electric cylinder 203j fixed on the inner wall of the tapered cavity 106. The rotary electric cylinder 203j drives the gear 1 203k to rotate, and the gear 1 203k is correspondingly meshed with the gear ring 203l, and the gear ring 203l is fixedly connected in the annular plate 203b. In this way, when the rotary electric cylinder 203j drives the gear 1 203k to rotate, it drives the annular plate 203b in the gear ring 203l to rotate;

[0049] The movable member 204 includes a sliding hole 204a which is circumferentially opened on the upper end surface of the support plate 201b, a limiting groove 204b is provided inside the sliding hole 204a, a sliding rod 204c is slidably connected in the sliding hole 204a and the limiting groove 204b, a tension spring 204d is fixedly connected to the side wall of the sliding rod 204c, the tension spring 204d is a carbon spring with high strength and is convenient for daily use, one end of the tension spring 204d is fixedly connected to the inner wall of the sliding hole 204a, one end of the sliding rod 204c is provided on the side of the reducing portion 203h, and the extrusion rod 201h is correspondingly fixedly connected to the outer wall of the sliding rod 204c;

[0050] Depend on Figures 5 to 10 It can be seen that the upper end surface of the support plate 201b is circumferentially provided with three groups of long strip-shaped sliding holes 204a, and T-shaped limiting grooves 204b are provided on both sides of the inner wall of the sliding hole 204a. The sliding hole 204a and the limiting groove 204b are connected with a sliding rod 204c through a tension spring 204d, and one end of the sliding rod 204c is arranged on the side of the diameter-changing portion 203h. It can be seen from the above that the annular plate 203b rotates and drives the diameter-changing portion 203h to rotate, so that the corresponding extrusion sliding rod 204c of the diameter-changing portion 203h drives the sliding rod 204c to move in the sliding hole 204a, thereby driving the extrusion rod 201h on the sliding rod 204c to slide in the movable hole 201f;

[0051] Working principle: As can be seen from Example 1, when the device is used, the rotary electric cylinder 203j is started by the external controller, and the rotary electric cylinder 203j drives the gear 1 203k at the output shaft end to rotate, and the ring gear 203l is correspondingly meshed with the gear 1 203k, thereby driving the annular plate 203b outside the ring gear 203l to rotate, and the annular plate 203b rotates and drives the circular plate 203g to rotate, and the circular plate 203g rotates and drives the diameter reducing part 203h to rotate, at this time, the diameter expansion surface 203m and the curved surface 203n on the diameter reducing part 203h contact with the slide bar 204c in turn, and when the diameter expansion surface 203m contacts with the slide bar 204c, the diameter expansion surface 203m and the slide bar 204c are in contact. When the sliding rod 204c is in contact with the curved surface 203n, the sliding rod 204c moves the sliding hole 204a inward under the restoring force of the tension spring 204d, so that the sliding rod 204c drives the extruding rod 201h on the inner wall to slide in the movable hole 201f. At this time, the flux is discharged into the outer wall of the porous plate 202a through the movable hole 201f, so that the wiping block 202b can evenly absorb the flux, so that when the porous plate 202a drives the wiping block 202b to rotate, the flux can be evenly applied to the outer wall of the tin bar 107, thereby improving the quality of welding.

[0052] Embodiment 3, further illustrating a soldering device for integrated circuit board production proposed by the present invention, the gear member 301 includes a gear 2 301a fixedly connected to the upper end surface of the slot 1 203d, a circular opening 301b is provided in the middle of the gear 2 301a, the gear 2 301a is meshingly connected with a gear 3 301c, a rotating rod 301d is keyed in the gear 3 301c, a linkage plate 301e is fixedly connected to the side wall of the tapered cavity 106, the rotating rod 301d is rotatably connected in the linkage plate 301e through a bearing, the feeding member 302 includes a feeding wheel 302a fixedly connected to the upper end of the rotating rod 301d, a feeding trough 302b is provided in the feeding wheel 302a, and the tin bar 107 is provided in the feeding trough 302b;

[0053] Depend on Figures 4 to 7 It can be seen that the upper end surface of the annular plate 203b is fixedly connected with the gear 2 301a. It can be seen from the above that the annular plate 203b rotates and drives the gear 2 301a to rotate synchronously. The side wall of the conical cavity 106 is fixedly connected with the straight bar-shaped linkage plate 301e. The linkage plate 301e is rotatably connected with a rotating rod 301d through a bearing. The bottom end of the rotating rod 301d is fixedly connected with the gear 3 301c. The gear 2 301a is meshed with the gear 3 301c. In this way, the rotating rod 301d in the gear 3 301c is driven to rotate by the gear 2 301a, and the upper end of the rotating rod 301d is fixedly connected with the feed wheel 302a. At this time, the feed trough 302b in the feed wheel 302a transmits the tin bar 107.

[0054] Working principle: It can be seen from Example 1 that when the device is in use, when the annular plate 203b rotates, it drives the gear 2 301a to rotate synchronously. The gear 2 301a is meshed with the gear 3 301c. The gear 3 301c drives the rotating rod 301d to rotate synchronously. The rotating rod 301d drives the feed wheel 302a to rotate. At this time, the feed wheel 302a rotates to transmit the tin bar 107, thereby reducing the additional power demand and reducing the cost and complexity of the equipment.

[0055] Embodiment 4 The present invention further describes a soldering device for producing integrated circuit boards. The rotating member 401 includes a movable ring 401a fixedly connected to the outer wall of the rotating rod 301d. The outer wall of the movable ring 401a is provided with a wave groove 401b. The wave groove 401b includes a high portion 401c and a low portion 401d.

[0056] Since metal debris and dust are easily attached to the surface of the tin wire, poor soldering quality problems are likely to occur when soldering the circuit board. Figure 7 It can be seen that a circular movable ring 401a is fixedly connected to the outer wall of the rotating rod 301d, and a wave groove 401b is provided on the outer wall of the movable ring 401a. Therefore, when the rotating rod 301d rotates, the movable ring 401a on the rotating rod 301d is driven to rotate synchronously;

[0057] The limiting member 402 includes a limiting rod 402a slidably connected to the wave groove 401b, one end of the limiting rod 402a is fixedly connected to a cleaning rod 402b, the upper end surface of the linkage plate 301e is provided with a cleaning hole 402c, the cleaning rod 402b is correspondingly slidably connected to the cleaning hole 402c, one side of the cleaning rod 402b is fixedly connected to the limiting plate 402d, the bottom end of the linkage plate 301e is fixedly connected to a conical sleeve 402e, and the conical sleeve 402e is provided with a collecting groove 402c. 02f, the cleaning member 403 includes a cleaning wheel 403a fixedly connected to one side of the limiting plate 402d, a hollow hole 403b is provided at the center of the cleaning wheel 403a, a conical groove 403c is provided in the cleaning wheel 403a, a spherical block 403d is circumferentially installed in the conical groove 403c, a cleaning strip 403e is fixedly connected to the outer wall of the spherical block 403d, the cleaning strip 403e is made of soft rubber, and the tin strip 107 passes through the hollow hole 403b accordingly;

[0058] Depend on Figures 7 to 10It can be seen that a cleaning rod 402b is slidably connected in the vertical direction in the linkage plate 301e, and the side wall of the bottom end of the cleaning rod 402b is fixedly connected to the limiting rod 402a, and the limiting rod 402a is correspondingly slidably connected in the wave groove 401b. Therefore, when the limiting rod 402a is slidably connected to the high-position part 401c, the cleaning rod 402b is at the highest point, and when the limiting rod 402a is slidably connected to the low-position part 401d, the cleaning rod 402b is at the lowest point. It can be seen that the cleaning rod 402b drives the cleaning wheel 403a on the limiting plate 402d to move in the vertical direction;

[0059] In order to ensure the cleaning effect of the tin bar 107, the cleaning wheel 403a is provided with an annular conical groove 403c, and a spherical block 403d can be moved in the conical groove 403c. A soft cleaning strip 403e is fixed on the outer wall of the spherical block 403d, so that when the cleaning wheel 403a moves in the vertical direction, the cleaning strip 403e on the spherical block 403d cleans the outer wall of the tin bar 107;

[0060] Working principle: It can be seen from Example 3 that when gear three 301c drives the rotating rod 301d to rotate, the rotating rod 301d drives the movable ring 401a to rotate, and at this time the wave groove 401b on the movable ring 401a rotates synchronously. Since the limiting rod 402a is correspondingly slidably connected in the wave groove 401b, when the limiting rod 402a is slidably connected to the high-position part 401c, its cleaning rod 402b is at the highest point, and when the limiting rod 402a is slidably connected to the low-position part 401d, its cleaning rod 402b is at the lowest point. Therefore, the cleaning rod 402b drives the cleaning wheel 403a on the limiting plate 402d to move in the vertical direction. At this time, the cleaning strip 403e on the spherical block 403d cleans the outer wall of the tin strip 107, thereby reducing the phenomenon of impurities adhering to the surface of the tin wire, which is beneficial to improving the welding quality.

[0061] The above is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiments. All technical solutions under the concept of the present invention belong to the protection scope of the present invention. It should be pointed out that for ordinary technicians in this technical field, some improvements and modifications without departing from the principle of the present invention should also be regarded as the protection scope of the present invention.

Claims

1. A soldering device for producing integrated circuit boards, comprising a base (100), a support frame (101) being arranged on the upper end surface of the base (100), a movable seat (102) being arranged inside the support frame (101), a mounting frame (103) being arranged at the bottom end of the movable seat (102), a soldering head (104) being arranged inside the mounting frame (103), characterized in that: A feeding pipe (105) is arranged in the mounting frame (103), a conical cavity (106) is formed in the feeding pipe (105), a tin bar (107) is arranged in the movable seat (102), the tin bar (107) correspondingly passes through the feeding pipe (105), an auxiliary mechanism (200) for evenly applying is arranged in the feeding pipe (105), a conveying mechanism (300) is also arranged in the feeding pipe (105), and a cleaning mechanism (400) for cleaning the outer surface of the tin bar (107) is arranged in the feeding pipe (105); The auxiliary mechanism (200) comprises a support member (201) arranged in a feeding tube (105); a smear member (202) is arranged at the bottom end of the support member (201); a ring member (203) is arranged in the feeding tube (105); a movable member (204) cooperating with the smear member (202) is arranged in the support member (201); the ring member (203) and the movable member (204) cooperate to drive the smear member (202); The conveying mechanism (300) comprises a gear member (301) arranged in the annular member (203); a feeding member (302) is arranged on the side wall of the conical cavity (106); the gear member (301) and the feeding member (302) cooperate to convey the tin bar (107); The cleaning mechanism (400) comprises a rotating member (401) arranged on a feeding member (302), a limiting member (402) being arranged outside the rotating member (401), a cleaning member (403) for cleaning the outer surface of the tin bar (107) being arranged inside the limiting member (402), and the rotating member (401) and the limiting member (402) cooperate to control the cleaning member (403).

2. A soldering device for integrated circuit board production according to claim 1, characterized in that: The support member (201) comprises connection blocks (201a) arranged on both sides of the inner wall of the conical cavity (106); a support plate (201b) is arranged between the connection blocks (201a) on both sides; an opening (201c) is arranged in the middle of the support plate (201b); an annular box (201d) is arranged on the upper end surface of the support plate (201b); soldering flux is arranged in the annular box (201d); and a support block (201e) is arranged at the bottom end of the support plate (201b). The opening 1 (201c) extends into and penetrates the support block (201e); a movable hole (201f) is circumferentially provided at the position of the opening 1 (201c) located in the support block (201e); a discharge trough (201g) is circumferentially provided in the support plate (201b) and the support block (201e); the discharge trough (201g) is correspondingly connected to the annular box (201d); and a squeezing rod (201h) is correspondingly provided in the movable hole (201f).

3. A soldering device for integrated circuit board production according to claim 2, characterized in that: The smearing member (202) comprises a porous plate (202a) arranged in an opening, one end of the squeezing rod (201h) correspondingly abuts against the outer surface of the porous plate (202a), and a wiping block (202b) is arranged on the inner wall of the porous plate (202a).

4. A soldering device for integrated circuit board production according to claim 3, characterized in that: The annular member (203) comprises an annular groove (203a) arranged in the conical cavity (106), and also comprises an annular plate (203b), annular edges (203c) are arranged on the inner and outer walls of the annular plate (203b), and the annular edges (203c) are correspondingly slidably connected in the annular groove (203a), the upper end surface of the annular plate (203b) is provided with a first groove (203d), the bottom end of the annular plate (203b) is provided with a second groove (203e), and the annular plate (203b) is provided with a second groove (203e). 3b) is provided with a second opening (203f) in the middle position, a circular plate (203g) is provided in the second opening (203e), the second opening (203f) extends into the circular plate (203g) correspondingly, the outer wall of the circular plate (203g) is provided with a diameter reducing portion (203h) in a circular shape, the porous plate (202a) is provided on the lower end surface of the bottom end of the circular plate (203g), and the diameter reducing portion (203h) is composed of a diameter expansion surface (203m) and a curved surface (203n).

5. A soldering device for integrated circuit board production according to claim 4, characterized in that: A fixing plate (203i) is arranged on one side of the inner wall of the conical cavity (106), a rotating electric cylinder (203j) is arranged on the upper end of the fixing plate (203i), a gear 1 (203k) is arranged on the output shaft end of the rotating electric cylinder (203j), a gear ring (203l) is arranged on the inner wall of the second slot (203e), and the gear ring (203l) is correspondingly meshed with the gear 1 (203k).

6. A soldering device for integrated circuit board production according to claim 5, characterized in that: The movable part (204) comprises a sliding hole (204a) which is circumferentially opened on the upper end surface of the support plate (201b); a limiting groove (204b) is arranged on the inner side of the sliding hole (204a); a sliding rod (204c) is slidably connected in the sliding hole (204a) and the limiting groove (204b); a tension spring (204d) is arranged on the side wall of the sliding rod (204c); one end of the tension spring (204d) is arranged on the inner wall of the sliding hole (204a); one end of the sliding rod (204c) is arranged on the side of the diameter reducing portion (203h); and the extrusion rod (201h) is correspondingly arranged on the outer wall of the sliding rod (204c).

7. A soldering device for integrated circuit board production according to claim 6, characterized in that: The gear member (301) comprises a second gear (301a) arranged on the upper end surface of the first slot (203d), a circular opening (301b) is arranged in the middle position of the second gear (301a), the second gear (301a) is meshedly connected with the third gear (301c), a rotating rod (301d) is arranged in the third gear (301c), a linkage plate (301e) is arranged on the side wall of the conical cavity (106), the rotating rod (301d) is arranged in the linkage plate (301e), the feeding member (302) comprises a feeding wheel (302a) arranged on the upper end of the rotating rod (301d), a feeding trough (302b) is arranged in the feeding wheel (302a), and the tin bar (107) is arranged in the feeding trough (302b).

8. A soldering device for integrated circuit board production according to claim 7, characterized in that: The rotating member (401) comprises a movable ring (401a) arranged on the outer wall of the rotating rod (301d), a wave groove (401b) is provided on the outer wall of the movable ring (401a), and the wave groove (401b) comprises a high-position portion (401c) and a low-position portion (401d).

9. A soldering device for integrated circuit board production according to claim 8, characterized in that: The limiting member (402) comprises a limiting rod (402a) arranged in the wave groove (401b), a cleaning rod (402b) is arranged at one end of the limiting rod (402a), a cleaning hole (402c) is arranged on the upper end surface of the linkage plate (301e), the cleaning rod (402b) is correspondingly slidably connected in the cleaning hole (402c), a limiting plate (402d) is arranged on one side of the cleaning rod (402b), and a conical sleeve (402e) is arranged at the bottom end of the linkage plate (301e), and a collecting groove (402f) is arranged in the conical sleeve (402e).

10. A soldering device for integrated circuit board production according to claim 9, characterized in that: The cleaning member (403) comprises a cleaning wheel (403a) arranged on one side of the limiting plate (402d), a hollow hole (403b) being arranged at the center of the cleaning wheel (403a), a conical groove (403c) being arranged inside the cleaning wheel (403a), a spherical block (403d) being arranged in a circle inside the conical groove (403c), a cleaning strip (403e) being arranged on the outer wall of the spherical block (403d), and the tin strip (107) correspondingly passes through the hollow hole (403b).

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