Semiconductor wafer grinding device and grinding method thereof

Abstract

The present invention relates to the field of semiconductor wafer grinding technology, and in particular to a semiconductor wafer grinding device and grinding method thereof. The device comprises a base, to which a protective cylinder for splash protection during grinding is fixedly connected, and a wafer carrier for limiting and fixing the semiconductor wafer is provided in the protective cylinder; an adjustment block is driven to rotate by a second motor, and when the second gear rotates to the rack of the incomplete ring gear, the second gear engages with the incomplete ring gear to cause the second gear to rotate, thereby driving the screw to rotate, so that the grinding and polishing mechanism moves a short distance toward the central axis of the adjustment block every time it rotates one circle, thereby realizing spiral grinding of the surface of the semiconductor wafer, so that the device can grind semiconductor wafers of different sizes without dead angles while maintaining uniform grinding accuracy, effectively improving the yield rate of the finished grinding products.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor wafer grinding, and in particular relates to a semiconductor wafer grinding device and a grinding method thereof. Background Art

[0002] Silicon wafers, the base material for semiconductor substrates, undergo multiple grinding and polishing cycles of varying precision during production. Traditional semiconductor wafer grinding equipment is inconvenient for processing wafers of varying sizes, requiring different grinding discs for each size. This results in limited adaptability and the need for grinding disc replacements, which can lead to variations in grinding precision and a decrease in the yield rate of finished products.

[0003] After searching, the authorized patent document with the publication number of 2022.03.01 and the publication date of 2022.03.01 in the prior art discloses a substrate processing device for semiconductor production, which relates to the technical field of semiconductor production equipment. The device comprises a base, two transmission frames are provided on the left side of the top of the base; a polishing cylinder is provided on the right side of the transmission frame; a rotating seat is provided in the middle of the polishing cylinder, and a polishing turntable is provided on the rotating seat; a driving mechanism is provided at the bottom of the base, and a collection component is provided on the right side of the driving mechanism. The present invention does not require complex driving and control components. The transportation and polishing of silicon wafers can be regulated by controlling the double-headed motor. By polishing both the upper and lower surfaces of the silicon wafer at the same time, the process of changing the surface of the silicon wafer for polishing is saved, and the polishing efficiency is greatly improved. The low efficiency of single-side polishing of silicon wafers is solved. In addition, the coordination of transportation and polishing requires multiple sets of control and driving mechanisms, which increases the cost and power consumption of the equipment. At the same time, the residue generated by polishing is easily adsorbed on the surface of the silicon wafer, making the cleaning process more troublesome.

[0004] However, the device still has the following defects: although it can polish the upper and lower surfaces of silicon wafers at the same time, the device is not convenient for processing wafers of different sizes, resulting in the need to use grinding discs of different sizes for processing wafers of different sizes, which leads to poor universality of the device and the replacement of grinding discs can easily lead to changes in grinding accuracy, thereby reducing the yield rate of finished products. Summary of the Invention

[0005] In response to the above problems, the present invention provides a semiconductor wafer grinding device and grinding method thereof, comprising a base, to which is fixedly connected a protective cylinder for splash protection during grinding, and within which is disposed a wafer stage for limiting and fixing the semiconductor wafer;

[0006] The outer wall of the protective tube is provided with a thread, and a processing component is threadedly connected to the thread;

[0007] The processing assembly includes a lifting platform for height adjustment, the lifting platform is configured as an internally threaded cylinder, and the lifting platform is threadedly connected to the thread on the protective cylinder;

[0008] An L-shaped bracket is fixedly connected to the lifting platform, and a driving mechanism and an adjustment mechanism for adjusting the processing height and position are provided on the L-shaped bracket;

[0009] The driving mechanism includes a driving box, and the outer wall of the driving box is provided with an incomplete ring gear;

[0010] The adjustment mechanism includes an adjustment block, a screw groove is opened in the adjustment block, a screw is rotatably connected in the screw groove, a first internal thread block is threadedly connected to the screw, and the bottom end of the first internal thread block is fixedly connected to a grinding and polishing mechanism for grinding and polishing semiconductor wafers.

[0011] Furthermore, a give way groove is opened in the adjusting block, and the inner wall of one side of the give way groove is rotatably connected to the driven bevel gear, the center of the driven bevel gear is fixedly connected to one end of the screw rod, the adjusting block is fixedly connected to the mounting bracket, the bottom end of the mounting bracket is rotatably connected to the driving bevel gear, the driving bevel gear is meshed with the driven bevel gear, the top center of the driving bevel gear is fixedly connected to a linkage shaft, the top of the linkage shaft is fixedly connected to a second gear, the second gear is meshed with the incomplete ring gear, and the top center of the second gear is fixedly connected to an adjustment handle.

[0012] Furthermore, a second internal thread block is threadedly connected to the screw rod, and the top end of the second internal thread block is fixedly connected to a cooling mechanism, and the cooling mechanism includes a coolant tank, the liquid outlet end of the coolant tank is connected to a liquid pump, the liquid outlet end of the liquid pump is connected to a liquid guide tube, the liquid outlet end of the liquid guide tube is connected to an annular tube, and the annular tube is connected to several groups of nozzles, and the several groups of nozzles are distributed in an annular array with the central axis of the annular tube as the center.

[0013] Furthermore, the drive box is configured as a hollow cylinder, the top of the drive box is fixedly connected to an L-shaped bracket, a second motor is installed in the drive box, and the output end of the second motor is transmission-connected to the top center of the adjustment block.

[0014] Furthermore, two groups of limit blocks are fixedly connected to the side walls of the lifting platform, an annular slide groove is provided on the lifting platform, and the bottom end of the adjustment block is fixedly connected to two groups of support shafts. The bottom ends of the two groups of support shafts are fixedly connected to sliding bolts, and the two groups of sliding bolts are movably fitted with the annular slide groove.

[0015] Furthermore, the grinding and polishing mechanism includes a box body, and several groups of inclined brackets are fixedly connected to the outer wall of the box body, and several groups of the inclined brackets are fixedly connected to the annular tube. A third motor is installed in the box body, and the output end of the third motor is transmission-connected to an electric slip ring, and the bottom end of the electric slip ring is electrically connected to a first electric cylinder, and the output end of the first electric cylinder is transmission-connected to an internal threaded barrel, and the bottom end of the internal threaded barrel is threadedly connected to a mounting bolt, and the bottom end of the mounting bolt is fixedly connected to a grinding disc.

[0016] Furthermore, an outer gear ring is sleeved on the protective tube, a first motor is installed on the base, an output end of the first motor is transmission-connected to a first gear, and the first gear is meshed with the outer gear ring.

[0017] Furthermore, the inner wall of the protective tube is fixedly connected to a hollow bracket, the center of the hollow bracket is fixedly connected to a second electric cylinder, a telescopic waterproof cover is fixedly connected between the carrier stage and the hollow bracket, the second electric cylinder is arranged inside the telescopic waterproof cover, the output end of the second electric cylinder is transmission-connected to a transmission platform, an articulated frame is fixedly connected to the transmission platform, the side wall of the articulated frame is rotatably connected to a worm gear, the center of the worm gear is fixedly connected to a rotating shaft, the rotating shaft is rotatably connected to the articulated frame, a linkage block is fixedly connected to the center of the bottom end of the carrier stage, the linkage block is fixedly connected to the rotating shaft, two groups of fixed plates are fixedly connected to the transmission platform, a worm is rotatably connected between the two groups of fixed plates, the worm is meshingly connected to the worm wheel, a fourth motor is mounted on one group of fixed plates, and the output end of the fourth motor is transmission-connected to one end of the worm.

[0018] Furthermore, the bottom end of the protective tube is connected to a conical liquid guiding tube, and the bottom end of the conical liquid guiding tube is connected to a liquid drain pipe. A solenoid valve is provided on the liquid drain pipe. Two sets of limiting shafts are fixedly connected to the base, and the limiting shafts are movably fitted with the processing component.

[0019] A method for polishing a semiconductor wafer using a polishing device, the method comprising:

[0020] Bonding the semiconductor wafer to the wafer stage for fixation;

[0021] Adjust the grinding and polishing mechanism until the grinding disc moves to the edge of the semiconductor wafer;

[0022] The protective tube rotates to move the processing assembly threadedly connected to the outer wall of the protective tube downward until the processing end of the grinding and polishing mechanism contacts the surface of the semiconductor wafer, thereby grinding the semiconductor wafer;

[0023] The regulating block rotates, driving the grinding and polishing mechanism to perform spiral grinding on the surface of the semiconductor wafer.

[0024] The beneficial effects of the present invention are:

[0025] 1. The adjusting block is driven to rotate by the second motor, so that the grinding and polishing mechanism rotates with the central axis of the adjusting block as the center, and the surface of the semiconductor wafer is ground. When the adjusting block rotates, the second gear rotates in contact with the surface of the incomplete ring gear. When the second gear rotates to the rack of the incomplete ring gear, the second gear is meshed with the incomplete ring gear, so that the second gear rotates on its own, thereby driving the screw to rotate, so that the grinding and polishing mechanism moves a short distance toward the central axis of the adjusting block every time it rotates one circle, thereby realizing spiral grinding of the surface of the semiconductor wafer, so that the device can grind semiconductor wafers of different sizes without dead angles while maintaining the uniformity of grinding accuracy, effectively improving the yield rate of the finished grinding products.

[0026] 2. By rotating the adjustment handle, the second gear drives the active bevel gear to rotate, and then the driven bevel gear drives the screw to rotate synchronously, so that the first internal thread block and the second internal thread block respectively drive the grinding and polishing mechanism and the cooling mechanism to move synchronously, so that the initial position of the grinding and polishing mechanism can be adjusted according to the size of the semiconductor wafer to be processed.

[0027] 3. The second electric cylinder drives the transmission table to move upward to the top of the protective cylinder, and the semiconductor wafer is bonded to the carrier table for fixation. After the semiconductor wafer is bonded, the second electric cylinder drives the carrier table and the semiconductor wafer to move downward into the protective cylinder for processing, thereby avoiding debris and waste liquid splashing during processing.

[0028] 4. The coolant in the coolant tank is introduced into the annular tube through a liquid pump, and finally sprayed to the processing surface of the grinding disc through several groups of nozzles. The processing surface is quickly cooled while grinding the semiconductor wafer, while avoiding the splash of debris. By keeping the grinding and polishing mechanism and the cooling mechanism moving synchronously, the coolant spraying position is kept consistent with the grinding processing position to improve the cooling effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following is a brief introduction to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0030] Figure 1 A schematic diagram of the main structure of an embodiment of the present invention is shown;

[0031] Figure 2 A schematic diagram of an explosion of the internal structure of a protective tube according to an embodiment of the present invention is shown;

[0032] Figure 3 A schematic diagram of the bottom structure of a wafer stage according to an embodiment of the present invention is shown;

[0033] Figure 4 It shows a schematic structural diagram of a processing assembly according to an embodiment of the present invention;

[0034] Figure 5 A cross-sectional view of a portion of the structure of a processing assembly according to an embodiment of the present invention is shown;

[0035] Figure 6 The embodiment of the present invention is shown Figure 5 A in the middle is an enlarged schematic diagram;

[0036] Figure 7 It shows a schematic diagram of the structure of the grinding and polishing mechanism and the cooling mechanism according to an embodiment of the present invention;

[0037] Figure 8 An exploded schematic diagram of the grinding and polishing mechanism structure according to an embodiment of the present invention is shown.

[0038] In the figure: 1. Base; 2. Protective tube; 3. Conical liquid guide tube; 4. Drain pipe; 5. Solenoid valve; 6. Slide stage; 601. Linkage block; 7. Thread; 8. Processing assembly; 801. Lifting platform; 802. Limit block; 803. L-shaped bracket; 804. Driving mechanism; 8041. Driving box; 8042. Second motor; 8043. Incomplete ring gear; 805. Adjusting mechanism; 8051. Adjusting block; 8052. Screw groove; 8053. Screw; 8054. First internal thread block; 8055. Grinding and polishing mechanism; 80551. Box; 80552. Oblique bracket; 80553. Third motor; 80554. Electric slip ring; 80555. First electric cylinder; 80556. Internal thread barrel; 80557. Grinding disc; 80558. Mounting bolt ;8056, second internal thread block;8057, cooling mechanism;80571, coolant tank;80572, liquid guide tube;80573, annular tube;80574, nozzle;8058, support shaft;8059, slide bolt;80510, give way groove;80511, driven bevel gear;80512, mounting bracket;80513, driving bevel gear;80514, linkage shaft;80515, second gear;80516, adjusting handle;806, annular slide;9, outer gear ring;10, first motor;11, first gear;12, limit shaft;13, hollow bracket;14, telescopic waterproof cover;15, second electric cylinder;16, transmission platform;17, articulated frame;18, worm gear;19, fixing plate;20, worm;21, fourth motor;22, rotating shaft. DETAILED DESCRIPTION

[0039] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0040] An embodiment of the present invention provides a semiconductor wafer grinding device, comprising a base 1; illustratively, as Figure 1 shown.

[0041] A protective cylinder 2 is fixedly connected to the base 1. The bottom end of the protective cylinder 2 is connected to a tapered liquid-guiding cylinder 3. The bottom end of the tapered liquid-guiding cylinder 3 is connected to a liquid discharge pipe 4. A solenoid valve 5 is provided on the liquid discharge pipe 4. A wafer stage 6 is provided in the protective cylinder 2. A semiconductor wafer is bonded to the wafer stage 6.

[0042] Specifically, the semiconductor wafer is bonded to the wafer carrier 6 for fixation, and the grinding operation is performed in the protective tube 2 to effectively avoid the splashing of waste materials and waste liquid generated by grinding. By setting a conical liquid guide tube 3 and a drain pipe 4, the waste liquid generated by grinding can be discharged through the drain pipe 4, and the opening and closing of the drain pipe 4 is controlled by the solenoid valve 5.

[0043] The outer wall of the protective tube 2 is provided with a thread 7, and a processing assembly 8 is threadedly connected to the thread 7. Two sets of limiting shafts 12 are fixedly connected to the base 1, and the limiting shafts 12 are movably fitted with the processing assembly 8;

[0044] The protective tube 2 is sleeved with an outer gear ring 9, and the base 1 is mounted with a first motor 10. The output end of the first motor 10 is connected to a first gear 11, and the first gear 11 is meshed with the outer gear ring 9.

[0045] Specifically, the first motor 10 drives the first gear 11 to rotate, so that the outer gear ring 9 drives the protective tube 2 to rotate synchronously, thereby causing the processing assembly 8 threadedly connected to the outer wall of the protective tube 2 to move up and down, thereby achieving height adjustment of the processing assembly 8.

[0046] For example, Figure 2 and Figure 3 shown.

[0047] The inner wall of the protective tube 2 is fixedly connected to a hollow bracket 13, and the center of the hollow bracket 13 is fixedly connected to a second electric cylinder 15. A telescopic waterproof cover 14 is fixedly connected between the carrier stage 6 and the hollow bracket 13. The second electric cylinder 15 is arranged inside the telescopic waterproof cover 14. The output end of the second electric cylinder 15 is connected to a transmission platform 16. The transmission platform 16 is fixedly connected to an articulated frame 17. The side wall of the articulated frame 17 is rotatably connected to a worm gear 18. The center of the worm gear 18 A rotating shaft 22 is fixedly connected thereto, and the rotating shaft 22 is rotatably connected to the articulated frame 17. A linkage block 601 is fixedly connected to the center of the bottom end of the carrier stage 6, and the linkage block 601 is fixedly connected to the rotating shaft 22. Two groups of fixed plates 19 are fixedly connected to the transmission platform 16, and a worm 20 is rotatably connected between the two groups of fixed plates 19. The worm 20 is meshed with the worm wheel 18. A fourth motor 21 is installed on one group of the fixed plates 19, and the output end of the fourth motor 21 is transmission-connected to one end of the worm 20.

[0048] Specifically, the transmission platform 16 is driven up and down by the second electric cylinder 15, so that the wafer carrier 6 drives the semiconductor wafer to move up and down. When the wafer carrier 6 drives the semiconductor wafer to move upward to the top of the protective tube 2, it is convenient to load and unload the semiconductor wafer. When the semiconductor wafer needs to be ground, the semiconductor wafer is driven downward to the inside of the protective tube 2 by the second electric cylinder 15, and the worm 20 is driven to rotate by the fourth motor 21, so that the worm gear 18 drives the wafer carrier 6 to rotate to an inclined state, so that the debris and waste liquid remaining on the wafer carrier 6 flow into the protective tube 2, thereby keeping the wafer carrier 6 clean, which is convenient for continuous grinding of multiple groups of semiconductor wafers. The second electric cylinder 15 and the fourth motor 21 are waterproofed by providing a telescopic waterproof cover 14, which effectively extends the service life of the equipment.

[0049] For example, Figure 4-6 shown.

[0050] The processing assembly 8 includes a lifting platform 801, which is configured as an internally threaded cylinder. The lifting platform 801 is threadedly connected to the thread 7 on the protective cylinder 2. Two groups of limit blocks 802 are fixedly connected to the side wall of the lifting platform 801. The two groups of limit blocks 802 are movably fitted with two groups of limit shafts 12 respectively. An L-shaped bracket 803 is fixedly connected to the lifting platform 801. A driving mechanism 804 and an adjustment mechanism 805 are provided on the L-shaped bracket 803. An annular slide groove 806 is opened on the lifting platform 801.

[0051] The driving mechanism 804 includes a driving box 8041, which is configured as a hollow cylinder. The top of the driving box 8041 is fixedly connected to the L-shaped bracket 803. A second motor 8042 is installed in the driving box 8041. The outer wall of the driving box 8041 is provided with an incomplete ring gear 8043.

[0052] The adjustment mechanism 805 includes an adjustment block 8051, the top center of which is transmission-connected to the output end of the second motor 8042. A screw slot 8052 is defined in the adjustment block 8051, in which a screw 8053 is rotatably connected. A first internally threaded block 8054 is threadedly connected to the screw 8053, and a polishing mechanism 8055 is fixedly connected to the bottom end of the first internally threaded block 8054. A second internally threaded block 8056 is threadedly connected to the screw 8053, and a cooling mechanism 8057 is fixedly connected to the top end of the second internally threaded block 8056.

[0053] The bottom end of the adjustment block 8051 is fixedly connected to two sets of support shafts 8058. The bottom ends of the two sets of support shafts 8058 are fixedly connected to sliding bolts 8059. The two sets of sliding bolts 8059 are movably fitted with the annular sliding groove 806.

[0054] A give way groove 80510 is provided in the adjusting block 8051, and a driven bevel gear 80511 is rotatably connected to an inner wall of one side of the give way groove 80510, and the center of the driven bevel gear 80511 is fixedly connected to one end of the screw rod 8053, and a mounting bracket 80512 is fixedly connected to the adjusting block 8051, and the bottom end of the mounting bracket 80512 is rotatably connected to a driving bevel gear 80513, and the driving bevel gear 80513 is meshed with the driven bevel gear 80511, and a linkage shaft 80514 is fixedly connected to the top center of the driving bevel gear 80513, and a second gear 80515 is fixedly connected to the top of the linkage shaft 80514, and the second gear 80515 is meshed with the incomplete ring gear 8043, and an adjusting handle 80516 is fixedly connected to the top center of the second gear 80515;

[0055] Specifically, by rotating the adjustment handle 80516, the second gear 80515 drives the active bevel gear 80513 to rotate, which in turn causes the driven bevel gear 80511 to drive the screw rod 8053 to rotate synchronously, thereby causing the first internally threaded block 8054 and the second internally threaded block 8056 to respectively drive the grinding and polishing mechanism 8055 and the cooling mechanism 8057 to move synchronously, thereby adjusting the initial position of the grinding and polishing mechanism 8055 according to the size of the semiconductor wafer to be processed;

[0056] Furthermore, the second motor 8042 drives the adjustment block 8051 to rotate, so that the grinding and polishing mechanism 8055 rotates around the central axis of the adjustment block 8051 to grind the surface of the semiconductor wafer. When the adjustment block 8051 rotates, the second gear 80515 rotates in contact with the surface of the incomplete ring gear 8043. When the second gear 80515 rotates to the rack of the incomplete ring gear 8043, the second gear 80515 engages with the incomplete ring gear 8043, causing the second gear 80515 to rotate on its own, thereby driving the screw 8053 to rotate, so that the grinding and polishing mechanism 8055 moves a short distance toward the central axis of the adjustment block 8051 every time it rotates one circle, thereby realizing spiral grinding of the surface of the semiconductor wafer. Therefore, the device can grind semiconductor wafers of different sizes without dead angles while maintaining uniform grinding accuracy, effectively improving the yield rate of the finished products.

[0057] For example, Figure 5 、 7 and Figure 8 shown.

[0058] The cooling mechanism 8057 includes a cooling liquid tank 80571. The liquid outlet of the cooling liquid tank 80571 is connected to a liquid pump. The liquid outlet of the liquid pump is connected to a liquid guide tube 80572. The liquid outlet of the liquid guide tube 80572 is connected to an annular tube 80573. The annular tube 80573 is connected to a plurality of groups of nozzles 80574. The plurality of groups of nozzles 80574 are distributed in an annular array centered on the central axis of the annular tube 80573.

[0059] The grinding and polishing mechanism 8055 includes a box 80551, the outer wall of which is fixedly connected to a plurality of groups of oblique brackets 80552, each of which is fixedly connected to an annular tube 80573. A third motor 80553 is installed in the box 80551, and the output end of the third motor 80553 is transmission-connected to an electric slip ring 80554, the bottom end of the electric slip ring 80554 is electrically connected to a first electric cylinder 80555, the output end of the first electric cylinder 80555 is transmission-connected to an internally threaded barrel 80556, the bottom end of the internally threaded barrel 80556 is threadedly connected to a mounting bolt 80558, and the bottom end of the mounting bolt 80558 is fixedly connected to a grinding disc 80557.

[0060] Specifically, the grinding disc 80557 is driven to rotate by the third motor 80553 to grind the semiconductor wafer, and the grinding disc 80557 is driven to move up and down by the first electric cylinder 80555 to meet the processing requirements of different thicknesses of semiconductor wafers. The installation method of threaded connection between the mounting bolt 80558 and the internal threaded barrel 80556 is adopted to facilitate the replacement of the grinding disc 80557, so that the device can meet the different processing requirements of rough grinding and thinning and fine grinding and polishing. The coolant in the coolant tank 80571 is introduced into the annular tube 80573 by a liquid pump, and finally sprayed to the processing surface of the grinding disc 80557 through several groups of nozzles 80574, so that the semiconductor wafer is ground and the processing surface is quickly cooled while the chip splashing is avoided.

[0061] The working principle of the semiconductor wafer grinding device proposed by the present invention is as follows:

[0062] The transmission platform 16 is driven by the second electric cylinder 15 to move upward to the top of the protective tube 2, and the semiconductor wafer is bonded to the wafer carrier 6 for fixation. After the semiconductor wafer is bonded, the wafer carrier 6 and the semiconductor wafer are driven by the second electric cylinder 15 to move downward into the protective tube 2 for processing, thereby avoiding debris and waste liquid splashing during processing.

[0063] By rotating the adjustment handle 80516, the second gear 80515 drives the active bevel gear 80513 to rotate, and then the driven bevel gear 80511 drives the screw rod 8053 to rotate synchronously, so that the first internal thread block 8054 and the second internal thread block 8056 respectively drive the grinding and polishing mechanism 8055 and the cooling mechanism 8057 to move synchronously, so that the initial position of the grinding and polishing mechanism 8055 can be adjusted according to the size of the semiconductor wafer to be processed.

[0064] The first motor 10 drives the first gear 11 to rotate, so that the outer gear ring 9 drives the protective tube 2 to rotate synchronously, so that the processing component 8 threadedly connected to the outer wall of the protective tube 2 moves downward, so that the processing end of the grinding disk 80557 contacts the surface of the semiconductor wafer, and the grinding disk 80557 is driven to rotate by the third motor 80553 to grind the semiconductor wafer. The grinding disk 80557 is driven to move up and down by the first electric cylinder 80555 to meet the processing requirements of semiconductor wafers of different thicknesses.

[0065] The second motor 8042 drives the adjustment block 8051 to rotate, so that the grinding and polishing mechanism 8055 rotates around the central axis of the adjustment block 8051 to grind the surface of the semiconductor wafer. When the adjustment block 8051 rotates, the second gear 80515 rotates in contact with the surface of the incomplete ring gear 8043. When the second gear 80515 rotates to the rack of the incomplete ring gear 8043, the second gear 80515 engages with the incomplete ring gear 8043, causing the second gear 80515 to rotate on its own, thereby driving the screw 8053 to rotate. The grinding and polishing mechanism 8055 moves a short distance toward the central axis of the adjustment block 8051 for each rotation, thereby achieving spiral grinding of the surface of the semiconductor wafer. This allows the device to grind semiconductor wafers of different sizes without dead angles while maintaining uniform grinding accuracy, effectively improving the yield rate of the finished products.

[0066] The coolant in the coolant tank 80571 is introduced into the annular tube 80573 through a liquid pump, and finally sprayed onto the processing surface of the grinding disc 80557 through several groups of nozzles 80574, thereby grinding the semiconductor wafer while quickly cooling the processing surface and preventing debris from splashing. By keeping the grinding and polishing mechanism 8055 and the cooling mechanism 8057 moving synchronously, the coolant spraying position is kept consistent with the grinding processing position to improve the cooling effect.

[0067] After completing the grinding operation, the first motor 10 drives the first gear 11 to rotate in the opposite direction, so that the outer gear ring 9 drives the protective tube 2 to rotate in the opposite direction synchronously, thereby causing the processing component 8 threadedly connected to the outer wall of the protective tube 2 to move upward, and the grinding disc 80557 to move to the outside of the protective tube 2. At this time, the grinding disc 80557 can be removed by rotating the grinding disc 80557, and the grinding disc 80557 with different grinding precision can be replaced according to the processing requirements to achieve rough grinding and thinning and fine grinding and polishing operations.

[0068] During the upward movement of the processing component 8, the protective cylinder 2 drives the wafer carrier 6 and the semiconductor wafer inside it to rotate simultaneously. Through the action of centrifugal force, the debris and waste liquid attached to the wafer carrier 6 and the semiconductor wafer are thrown into the protective cylinder 2. The worm 20 is driven to rotate by the fourth motor 21, so that the worm gear 18 drives the wafer carrier 6 to rotate to an inclined state, so that the debris and waste liquid remaining on the wafer carrier 6 flow into the protective cylinder 2, thereby keeping the wafer carrier 6 clean, facilitating the continuous grinding of multiple groups of semiconductor wafers. By setting a telescopic waterproof cover 14, the second electric cylinder 15 and the fourth motor 21 are waterproofed, which effectively extends the service life of the equipment.

[0069] By arranging the conical liquid guiding cylinder 3 and the liquid draining pipe 4 , the waste liquid generated by grinding can be discharged through the liquid draining pipe 4 for centralized treatment, and the opening and closing of the liquid draining pipe 4 is controlled by the electromagnetic valve 5 .

[0070] Based on the above-mentioned semiconductor wafer grinding device, an embodiment of the present invention further provides a grinding method for the grinding device. Exemplarily, the grinding method includes:

[0071] Turn on the second electric cylinder to drive the transmission platform to move upward to the top of the protective tube;

[0072] Bonding the semiconductor wafer to the wafer stage for fixation;

[0073] Turn on the second electric cylinder to drive the wafer carrier and the semiconductor wafer to move downward into the protective cylinder;

[0074] Turn the adjustment handle, and the grinding and polishing mechanism and the cooling mechanism move synchronously until the grinding disc moves to the edge of the semiconductor wafer;

[0075] Turning on the first motor to drive the first gear to rotate, causing the outer gear ring to drive the protective tube to rotate synchronously, causing the processing assembly threadedly connected to the outer wall of the protective tube to move downward until the processing end of the grinding disc contacts the surface of the semiconductor wafer;

[0076] Turning on the third motor to drive the grinding disc to rotate and grind the semiconductor wafer;

[0077] Turn on the first electric cylinder to drive the grinding disc to move up and down to meet the processing requirements of semiconductor wafers of different thicknesses;

[0078] Turn on the second motor to drive the adjusting block to rotate, so that the grinding and polishing mechanism rotates around the central axis of the adjusting block;

[0079] When the second gear rotates to the rack of the incomplete ring gear, the second gear rotates on its own, thereby driving the screw to rotate, so that the grinding and polishing mechanism moves a small distance toward the central axis of the adjustment block every time it rotates one circle, thereby realizing spiral grinding of the surface of the semiconductor wafer;

[0080] The liquid pump is turned on to guide the coolant in the coolant tank into the annular tube, and finally sprayed out to the processing surface of the grinding disc through several groups of nozzles, grinding the semiconductor wafer while quickly cooling the processing surface;

[0081] After the grinding operation is completed, the first motor is turned on to drive the first gear to rotate in the opposite direction, so that the outer gear ring drives the protective tube to rotate in the opposite direction synchronously, thereby causing the processing component threadedly connected to the outer wall of the protective tube to move upward, and the grinding disc is moved to the outside of the protective tube. At this time, the grinding discs of different precisions can be replaced;

[0082] As the processing assembly moves upward, the protective cylinder drives the wafer carrier and the semiconductor wafer inside it to rotate simultaneously. Through the action of centrifugal force, the debris and waste liquid attached to the wafer carrier and the semiconductor wafer are thrown into the protective cylinder.

[0083] The fourth motor is turned on to drive the worm to rotate, so that the worm gear drives the wafer stage to rotate to an inclined state, so that the debris and waste liquid remaining on the wafer stage flow into the protective tube, thereby keeping the wafer stage clean and facilitating the processing operation of the next group of semiconductor wafers.

[0084] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A semiconductor wafer polishing device comprising a base, characterized in that: A protective cylinder for splash protection during grinding is fixedly connected to the base, and a wafer carrier for limiting and fixing the semiconductor wafer is arranged inside the protective cylinder; The outer wall of the protective tube is provided with a thread, and a processing component is threadedly connected to the thread; The processing assembly includes a lifting platform for height adjustment, the lifting platform is configured as an internally threaded cylinder, and the lifting platform is threadedly connected to the thread on the protective cylinder; An L-shaped bracket is fixedly connected to the lifting platform, and a driving mechanism and an adjustment mechanism for adjusting the processing height and position are provided on the L-shaped bracket; The driving mechanism includes a driving box, and the outer wall of the driving box is provided with an incomplete ring gear; The adjustment mechanism includes an adjustment block, a screw slot is formed in the adjustment block, a screw is rotatably connected in the screw slot, a first internal thread block is threadedly connected to the screw, and a grinding and polishing mechanism for grinding and polishing the semiconductor wafer is fixedly connected to the bottom end of the first internal thread block; A give way groove is provided in the adjusting block, and the inner wall of one side of the give way groove is rotatably connected to a driven bevel gear, the center of the driven bevel gear is fixedly connected to one end of the screw rod, the adjusting block is fixedly connected to a mounting bracket, the bottom end of the mounting bracket is rotatably connected to a driving bevel gear, the driving bevel gear is meshed with the driven bevel gear, the top center of the driving bevel gear is fixedly connected to a linkage shaft, the top of the linkage shaft is fixedly connected to a second gear, the second gear is meshed with the incomplete ring gear, and the top center of the second gear is fixedly connected to an adjusting handle.

2. The semiconductor wafer polishing device according to claim 1, wherein: A second internal thread block is threadedly connected to the screw rod, and a cooling mechanism is fixedly connected to the top of the second internal thread block. The cooling mechanism includes a coolant tank, the liquid outlet end of the coolant tank is connected to a liquid pump, the liquid outlet end of the liquid pump is connected to a liquid guide tube, the liquid outlet end of the liquid guide tube is connected to an annular tube, and the annular tube is connected to several groups of nozzles, and the several groups of nozzles are distributed in an annular array with the central axis of the annular tube as the center.

3. The semiconductor wafer polishing device according to claim 1, wherein: The drive box is configured as a hollow cylinder, the top of which is fixedly connected to an L-shaped bracket. A second motor is installed in the drive box, and the output end of the second motor is transmission-connected to the top center of the adjustment block.

4. The semiconductor wafer polishing device according to claim 1, wherein: Two groups of limit blocks are fixedly connected to the side walls of the lifting platform, an annular slide groove is provided on the lifting platform, and the bottom end of the adjustment block is fixedly connected to two groups of support shafts. The bottom ends of the two groups of support shafts are fixedly connected to sliding bolts, and the two groups of sliding bolts are movably fitted with the annular slide groove.

5. The semiconductor wafer polishing device according to claim 1, wherein: The grinding and polishing mechanism includes a box body, and several groups of oblique brackets are fixedly connected to the outer wall of the box body, and several groups of oblique brackets are fixedly connected to the annular tube. A third motor is installed in the box body, and the output end of the third motor is transmission-connected to an electric slip ring, and the bottom end of the electric slip ring is electrically connected to a first electric cylinder, and the output end of the first electric cylinder is transmission-connected to an internal threaded barrel, and the bottom end of the internal threaded barrel is threadedly connected to a mounting bolt, and the bottom end of the mounting bolt is fixedly connected to a grinding disc.

6. The semiconductor wafer polishing device according to claim 1, wherein: An outer gear ring is sleeved on the protective tube, a first motor is mounted on the base, an output end of the first motor is transmission-connected to a first gear, and the first gear is meshed with the outer gear ring.

7. The semiconductor wafer polishing device according to claim 6, wherein: The inner wall of the protective tube is fixedly connected to a hollow bracket, and the center of the hollow bracket is fixedly connected to a second electric cylinder, a telescopic waterproof cover is fixedly connected between the carrier stage and the hollow bracket, the second electric cylinder is arranged inside the telescopic waterproof cover, and the output end of the second electric cylinder is transmission-connected to a transmission platform, and an articulated frame is fixedly connected to the transmission platform, and the side wall of the articulated frame is rotatably connected to a worm gear, and the center of the worm gear is fixedly connected to a rotating shaft, and the rotating shaft is rotatably connected to the articulated frame, and a linkage block is fixedly connected to the center of the bottom end of the carrier stage, and the linkage block is fixedly connected to the rotating shaft, and two groups of fixed plates are fixedly connected to the transmission platform, and a worm is rotatably connected between the two groups of fixed plates, and the worm is meshed with the worm wheel, and a fourth motor is installed on one group of the fixed plates, and the output end of the fourth motor is transmission-connected to one end of the worm.

8. The semiconductor wafer polishing device according to claim 7, wherein: The bottom end of the protective cylinder is connected to a conical liquid guiding cylinder, and the bottom end of the conical liquid guiding cylinder is connected to a drainage pipe. A solenoid valve is provided on the drainage pipe. Two groups of limiting shafts are fixedly connected to the base, and the limiting shafts are movably fitted with the processing component.

9. A polishing method for a semiconductor wafer polishing device according to any one of claims 1 to 8, characterized in that: The grinding method comprises: Bonding the semiconductor wafer to the wafer stage for fixation; Adjust the grinding and polishing mechanism until the grinding disc moves to the edge of the semiconductor wafer; The protective tube rotates to move the processing assembly threadedly connected to the outer wall of the protective tube downward until the processing end of the grinding and polishing mechanism contacts the surface of the semiconductor wafer, thereby grinding the semiconductor wafer; The regulating block rotates, driving the grinding and polishing mechanism to perform spiral grinding on the surface of the semiconductor wafer.

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