Adhesive film treatment process and device

Abstract

The invention relates to an adhesive film treatment process and device, and belongs to the technical field of adhesive film treatment. The process comprises the following steps: regulating and controlling the relative position of an adhesive film mold and a PCB (Printed Circuit Board), so that a connecting line of the geometric center of the adhesive film mold and the geometric center of the PCB is vertical to the PCB; laying a black adhesive film in the adhesive film mold, and determining the contour of the projection of the lamp beads on the PCB on the black adhesive film; a laser system is used for cutting the black adhesive film along the outline of the projection of the lamp bead, so that a laser hole corresponding to the lamp bead is obtained; and the relative position of the adhesive film mold and the PCB is adjusted, so that the PCB is covered with the black adhesive film, and the lamp beads correspond to the corresponding laser holes in a one-to-one mode. During use, the laser holes can be formed in the black adhesive film, the laser holes can accurately correspond to all the lamp beads, light can smoothly pass through the black adhesive film, and light loss caused by coverage of the black adhesive film is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of adhesive film processing, and in particular to an adhesive film processing process and device. Background Art

[0002] With the continuous advancement of display technology, especially the widespread application of new display technologies such as LED, the contrast requirements of display devices are getting higher and higher. High contrast can significantly improve the display effect, making the picture clearer and the colors more vivid. Especially in HDR (high dynamic range) display, high contrast is one of the key technical indicators.

[0003] In order to improve the contrast, the traditional method usually adopts dispensing or inkjet process, that is, coating black material in specific areas of the display panel to reduce light leakage and improve black purity. However, with the continuous increase in the density of lamp beads, especially in Mini-LED and Micro-LED displays, the distance between lamp beads is getting smaller and smaller. Due to the limited precision of dispensing or inkjet, especially under high-density lamp bead arrangement, uneven coating is prone to occur, resulting in inconsistent contrast of the display panel and affecting the overall display effect; and during the operation, glue or ink may directly cover the lamp beads, resulting in obstruction of the light emission of the lamp beads, affecting the display brightness and uniformity.

[0004] In order to solve these problems, the lamination process came into being. The lamination process uses a black film to cover the entire display device, and then uses a hot pressing process to make it fit tightly on the panel. This method simplifies the process flow to a certain extent and improves production efficiency. However, the lamination process also has some problems: since the film is directly covered on the lamp beads, it may affect the light output effect of the lamp beads, especially when displaying at high brightness, the light transmittance and reflectivity of the film may cause light loss. Summary of the invention

[0005] The embodiments of the present application provide a film processing process and device to solve the defect in the related art that the film is directly covered on the lamp bead, which may affect the light emitting effect of the lamp bead.

[0006] First aspect: The present invention provides a film processing process, which includes the following steps: The relative position of the film mold and the PCB board is regulated so that the line connecting the geometric center of the film mold and the geometric center of the PCB board is perpendicular to the PCB board; a black film is laid in the film mold, and the outline of the projection of the lamp beads on the PCB board on the black film is determined; the black film is cut along the outline of the projection of the lamp beads by using a laser system to obtain laser holes corresponding to the lamp beads; the relative position of the film mold and the PCB board is adjusted so that the black film covers the PCB board, and the lamp beads correspond to the corresponding laser holes one by one.

[0007] In some embodiments, regulating the relative position of the film mold and the PCB board so that the line connecting the geometric center of the film mold and the geometric center of the PCB board is perpendicular to the PCB board specifically comprises the following steps: obtaining the geometric center position of the PCB board by an industrial camera; constructing an XYZ coordinate system, wherein the plane formed by the X-axis and the Y-axis is parallel to the plane where the film mold is located, and the X-axis and the Y-axis are respectively parallel to the two sides perpendicular to the film mold, and the Z-axis is perpendicular to the plane where the film mold is located; moving the PCB board and detecting the coordinates (X0, Y0 and Z0) of the geometric center of the PCB board in real time; comparing the coordinates (X0, Y0 and Z0) of the geometric center of the PCB board with the coordinates (X1, Y1 and Z1) of the geometric center of the film mold (1); if X0=X1, Y0=Y1 and Z0≠Z1, then the line connecting the geometric center of the film mold and the geometric center of the PCB board is perpendicular to the PCB board; otherwise, continuing to move the PCB board.

[0008] In some embodiments, obtaining the geometric center position of the PCB board through an industrial camera specifically includes the following steps: using the industrial camera in conjunction with the light source on the PCB board to capture four edge images of the PCB board; and calculating the geometric center of the PCB board based on the four edges of the PCB board.

[0009] In some embodiments, obtaining the geometric center position of the PCB board through an industrial camera specifically includes the following steps: setting marker points around the PCB board; using an industrial camera to identify the marker points, and calculating the geometric center of the PCB board based on the marker points.

[0010] In some embodiments, after laying the black film in the film mold, the process step further includes: fixing the black film by vacuum adsorption at the bottom of the film mold.

[0011] In some embodiments, adjusting the relative position of the film mold and the PCB board specifically includes the following steps: controlling the film mold to descend to a first height position at a first moving speed; at the first height position, starting to remove the bottom plate of the film mold; controlling the film mold to descend to a second height position at a second moving speed during the removal of the bottom plate, so that the bottom of the film mold is completely open; releasing the fixation of the black film, so that the black film falls from the bottom of the film mold onto the PCB board, and the lamp beads correspond one-to-one with the corresponding excitation holes.

[0012] In some embodiments, the first moving speed is greater than the second moving speed.

[0013] In some embodiments, a vision system is used to monitor the size of the laser hole to ensure that the aperture of the laser hole is 1.01-1.5 times the size of the lamp bead.

[0014] Second aspect: An embodiment of the present application provides a film processing device, which is applied to the above-mentioned film processing process. The device includes: a film mold, a mounting cavity adapted to a black film is formed in the middle thereof; and a moving system, which is connected to the film mold and is used to drive the film mold to move.

[0015] In some embodiments, the film mold includes: a frame plate, the installation cavity is formed in the middle of the frame plate; a bottom plate, which is movably connected to the bottom of the frame plate; and an adsorption device, which is connected to the bottom plate and communicated with the installation cavity.

[0016] The beneficial effects of the technical solution provided by this application include: The embodiment of the present application provides a film processing process and device. Since the film processing process adjusts the relative position of the film mold and the PCB board so that the line connecting the geometric center of the film mold and the geometric center of the PCB board is perpendicular to the PCB board, it ensures that the black film can accurately correspond to the lamp beads on the PCB board when laying. Then a laser system is used to open laser holes in the black film. These laser holes can accurately correspond to each lamp bead, so that light can pass through the black film smoothly, reducing the light loss caused by the black film covering. At the same time, the laser opening technology has the characteristics of high precision and high efficiency, which can ensure the accuracy and consistency of the opening position. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0018] Figure 1 A schematic diagram of the overall process of the adhesive film treatment process provided in the embodiment of the present application; Figure 2 A schematic diagram of laying a black adhesive film in the adhesive film treatment process provided in an embodiment of the present application; Figure 3 A schematic diagram showing the coating state of a black adhesive film and a PCB board in an adhesive film processing process provided in an embodiment of the present application; Figure 4 Schematic diagram of the hot pressing mold in the film processing process provided in the embodiment of the present application Figure 5 A schematic diagram of a display film processing device provided in an embodiment of the present application; Figure 6A schematic diagram of a display film mold provided in an embodiment of the present application; Reference numerals: 1. Film mold; 10. Frame plate; 100. Installation cavity; 11. Bottom plate; 12. Adsorption device; 2. PCB board; 20. Lamp beads; 3. Black film; 30. Laser hole; 4. Hot pressing mold; 5. Bottom plate mold; 6. Marking point; 70. First screw nut structure; 71. First mounting plate; 72. Connecting rod; 73. Second mounting plate; 74. Second screw nut structure; 75. Third screw nut structure. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0020] The embodiments of the present application provide a film processing process and device, which can solve the defect in the related art that the film is directly covered on the lamp bead, which may affect the light emitting effect of the lamp bead.

[0021] See also Figures 1 to 4 As shown, the embodiment of the present application provides a film processing process, which includes the following steps: first, the relative position of the film mold 1 and the PCB board 2 is adjusted so that the line connecting the geometric center of the film mold 1 and the geometric center of the PCB board 2 is perpendicular to the PCB board 2. In this way, the film mold 1 and the PCB board 2 are absolutely aligned in the vertical direction, thereby providing a basis for accurate positioning and cutting of the black film 3 in the subsequent steps, avoiding deviations in the subsequent laying and cutting processes, and improving the accuracy and efficiency of the overall process.

[0022] After adjusting the relative position of the film mold 1 and the PCB board 2, the black film 3 is laid in the film mold 1, and the outline of the projection of the lamp beads 20 on the PCB board 2 on the black film 3 is determined. The purpose of laying the black film 3 is to form a light-shielding layer on the PCB board 2 to reduce light interference and leakage, and determining the projection outline of the lamp beads 20 on the black film 3 is to provide an accurate cutting path for subsequent laser cutting. This step ensures the accuracy of laser cutting, and also provides the necessary light-shielding effect for the lamp beads 20, which helps to improve the optical performance of the product.

[0023] After confirming the projection outline of the lamp bead 20 on the black film 3, the laser system is further used to cut the black film 3 along the projection outline of the lamp bead 20 to obtain the laser hole 30 corresponding to the lamp bead 20. Laser cutting is a high-precision, non-contact processing method that can accurately cut the black film 3 along the predetermined outline. Through this step, the laser hole 30 corresponding to the lamp bead 20 is formed, so that the light can be smoothly emitted from the lamp bead 20. The high precision of laser cutting ensures the accuracy and consistency of the laser hole 30, which helps to improve the overall quality and performance of the product.

[0024] Finally, the relative position of the film mold 1 and the PCB board 2 is adjusted so that the black film 3 covers the PCB board 2, and the lamp beads 20 correspond to the corresponding laser holes 30 one by one. The cut black film 3 is accurately covered on the PCB board 2, and each lamp bead 20 is aligned with its corresponding laser hole 30, ensuring that the light can be emitted from the lamp bead 20 as expected and irradiated to the target area through the laser hole 30. This helps to improve the luminous efficiency and optical performance of the product.

[0025] In this embodiment, the film processing process also includes: after the black film 3 is covered on the PCB board 2, and the lamp beads 20 correspond to the corresponding laser holes 30 one by one, the laser system can continue to be used to cut the black film 3 that exceeds the outline of the PCB board 2. During the cutting process, the visual system in the cutting system can be used for precise detection. After the excess black film 3 is cut, the hot pressing mold 4 needs to be operated to perform hot pressing on the black film 3. The hardness of the hot pressing mold 4 is 10-100D, and the material is general resin, rubber, high temperature resistant elastomer and other materials. It has a certain deformation amount, which can ensure that after pressing down, the lamp beads 20 will not be violently crushed to death, and ensure that the area other than the lamp beads 20 can be well combined with the PCB substrate, so as to achieve effective combination of the black film 3 and the PCB board 2, and avoid the possibility of subsequent peeling, causing the display device to fail.

[0026] In the present application, the relative position of the film mold 1 and the PCB board 2 is regulated so that the line connecting the geometric center of the film mold 1 and the geometric center of the PCB board 2 is perpendicular to the PCB board 2, which specifically includes the following steps: first, the geometric center position of the PCB board 2 is obtained by an industrial camera. The high-precision industrial camera can capture the image of the PCB board 2 and use image processing technology to determine the geometric center position of the PCB board 2. This provides accurate data support for subsequent positioning and adjustment; the second step is to construct an XYZ coordinate system, in which the plane formed by the X-axis and the Y-axis is parallel to the plane where the film mold 1 is located, and the X-axis and the Y-axis are respectively parallel to the two sides perpendicular to the film mold 1, and the Z-axis is perpendicular to the plane where the film mold 1 is located. This XYZ coordinate system provides a unified reference frame; the fourth step is to start moving the PCB board 2 and detect the coordinates of the geometric center of the PCB board 2 (X0, Y0 and Z0) in real time. This step is performed in the process of continuously adjusting and detecting the position of the PCB board 2. By detecting the coordinates of the geometric center of the PCB board 2 in real time, the current position status of the PCB board 2 can be dynamically understood; the fifth step is to compare the coordinates of the geometric center of the PCB board 2 (X0, Y0 and Z0) with the coordinates of the geometric center of the film mold 1 (1) (X1, Y1 and Z1), the key to judging whether the position of PCB board 2 meets the requirements, by comparing the coordinates of the two geometric centers, the relative position relationship between them can be intuitively understood, so as to judge whether the connecting line is perpendicular to PCB board 2; the comparison result shows: if X0=X1, Y0=Y1 and Z0≠Z1, X0=X1, Y0=Y1 means that the film mold 1 and PCB board 2 are on the same horizontal plane and the horizontal positions coincide, the film mold 1 and PCB board 2 are on the same horizontal plane and the horizontal positions coincide, Z0≠Z1 means that the coordinates of the film mold 1 and PCB board 2 on the Z axis are not equal, that is, there is a vertical distance between the film mold 1 and PCB board 2, that is, the connecting line between the geometric center of the film mold 1 and the geometric center of the PCB board 2 is perpendicular to the PCB board 2; at this time, the movement of PCB board 2 can be stopped, otherwise, the PCB board 2 is continued to be moved.

[0027] In the present application, obtaining the geometric center position of the PCB board 2 by an industrial camera (not shown in the figure) specifically includes the following steps: First, the industrial camera is used in conjunction with the light source on the PCB board 2 to collect four edge images of the PCB board 2. The light source provides uniform illumination for the PCB board 2, ensuring that the industrial camera can capture clear edge images. By collecting the four edge images of the PCB board 2, the complete outline of the PCB board 2 on the two-dimensional plane can be obtained. The four edge images are selected to ensure that the shape and size of the PCB board 2 can be fully reflected, providing accurate data for the subsequent calculation of the geometric center. Then, according to the four edges of the PCB board 2, the edge contour of the PCB board 2 is extracted using an edge detection algorithm. After the edge contour is extracted, the geometric center of the PCB board 2 can be determined by calculating the centroid or geometric center of the contour. The centroid calculation usually involves weighted averaging the coordinates of all points on the contour to obtain the coordinates of the center point.

[0028] In some other optional embodiments, obtaining the geometric center position of the PCB board 2 through an industrial camera specifically includes the following steps: first, setting marker points 6 around the PCB board 2, the marker points 6 are usually called Mark points and are reference marks for PCB positioning and device centering; then, using an industrial camera to identify the marker points 6, and calculating the geometric center of the PCB board 2 based on the marker points 6 using a corner detection algorithm.

[0029] In the present application, the method for the industrial camera to obtain the geometric center position of the PCB board 2 can also select an edge detection algorithm and a corner point detection algorithm to be selected, or the two can be used together to improve the accuracy.

[0030] In the present application, the PCB board 2 is set on the bottom plate mold 11 to conveniently obtain the geometric center position of the PCB board 2. The specific method is: install an industrial camera on the bottom plate mold 11, and set a plurality of vacuum adsorption holes (not shown in the figure) at the bottom of the bottom plate mold 11. The vacuum adsorption holes are connected to an adsorption device 12 (not shown in the figure). When the vacuum adsorption is started during use, the adsorption holes quickly generate negative pressure to firmly adsorb the PCB board 2. At this time, the adsorption pressure is controlled within a certain range to avoid deformation of the PCB board 2 caused by excessive suction. Then, the movement of the PCB board 2 is driven by moving the bottom plate mold 11 to quickly identify the actual position of the PCB board 2.

[0031] In the present application, after laying the black film 3 in the film mold 1, the process step further includes: fixing the black film by vacuum adsorption using the adsorption device 12 at the bottom of the film mold 1. The size of the black film 3 is slightly larger than the film mold 1. During the laying process, the edge of the black film 3 will naturally fit the inner wall of the mold. When the black film 3 is adsorbed, the air pressure precision control system adjusts the vacuum degree to ensure that there are no wrinkles or bubbles on the surface of the black film 3.

[0032] In the present application, adjusting the relative position of the film mold 1 and the PCB board 2 specifically includes the following steps: controlling the film mold 1 to descend to a first height position at a first moving speed, and this step is an initial descending stage, the purpose of which is to move the film mold 1 from the initial position to a height close to the PCB board 2 but not yet in contact with it; then, at the first height position, starting to remove the bottom plate 11 of the film mold 1, removing the bottom plate 11 so that the subsequent black film 3 can be smoothly attached to the PCB board 2; controlling the film mold 1 to descend to a second height position at a second moving speed during the removal of the bottom plate 11, so that the bottom of the film mold 1 is completely open, and the second moving speed is The moving speed provides a smoother transition for the lamination of the black film 3 and reduces the error caused by excessive speed; after there is no obstruction from the bottom plate 11, the fixation of the black film 3 is released so that the black film 3 falls from the bottom of the film mold 1 onto the PCB board 2, and the lamp beads 20 correspond to the corresponding laser holes one by one. The fixation of the black film 3 can be released by releasing the adsorption of the black film 3 by the bottom of the film mold 1, and the timing and method of releasing the fixation can be accurately controlled, ensuring that the black film 3 can be accurately and completely laminated on the PCB board 2, and the lamp beads 20 correspond to the corresponding laser holes one by one, meeting the product design and functional requirements.

[0033] In addition, the first moving speed is greater than the second moving speed. By setting different moving speeds, the entire operation process is optimized and controlled. A faster moving speed is used in the initial descending stage to save time; and a slower moving speed is used when approaching the PCB board 2 and performing the bonding operation to ensure the stability and accuracy of the operation. This speed change design helps to improve the overall operation efficiency and product quality.

[0034] The size of the laser hole 30 is monitored by a vision system to ensure that the aperture of the laser hole 30 is 1.01-1.5 times the size of the lamp bead 20. The vision system uses a high-resolution camera and advanced image processing algorithms to accurately measure the aperture of the laser hole 30. This high-precision measurement ensures that the aperture of each laser hole 30 is within a predetermined range, thereby improving the processing accuracy, and during mass production, the vision system can continuously monitor the size of the laser hole 30 to ensure that the aperture of each hole remains consistent.

[0035] See also Figure 5 and Figure 6 The embodiment of the present application provides a film processing device, which is applied to the above-mentioned film processing process. The device includes: a film mold 1 and a moving system. The film mold 1 has an installation cavity 100 adapted to the black film 3 formed in the middle, and the black mold is laid in the installation cavity 100; the moving system is connected to the film mold 1 and is used to drive the film mold 1 to move.

[0036] In the present application, the moving system includes but is not limited to: a first screw nut structure 70, a first mounting plate 71, a connecting rod 72, a second mounting plate 73, a second screw nut structure 74 and a third screw nut structure 75, wherein the first screw nut structure 70 is connected to both sides of the film mold 1, the first mounting plate 71 is connected between the first screw nut structures 70, one end of the connecting rod 72 is fixed to the first mounting plate 71, and the other end is fixed to the second screw nut structure 74, and the second screw nut structure 74 is arranged on the second mounting plate 73, and the third screw nut structure 75 is connected to both sides of the second mounting plate 73. When in use, the first screw nut structure 70 is used to drive the film mold 1 to move closer to or away from the PCB board 2 in the vertical direction, and the second screw nut structure 74 is used to drive the connecting rod 72 to move left and right along the first mounting plate 71. When the connecting rod 72 moves, it also drives the first mounting plate 71 to move together, thereby realizing the driving of the film mold 1 in the left and right directions. Finally, the third screw nut structure 75 can be used to move in the front and back directions along the second mounting plate 73, thereby driving the entire film mold 1 to move forward and backward. The purpose of doing this is to enable the film mold 1 to move forward, backward, left and right and downward, so that the film mold 1 can be accurately adjusted according to the scene during use. It should also be noted that the drive of the screw nut structure in this application can be directly completed by using a high-precision servo motor.

[0037] In the present application, the film mold 1 is provided including: a frame plate 10, a bottom plate 11 and an adsorption device 12. The frame plate 10 can be provided in a rectangular shape, and the mounting cavity 100 is formed in the middle of the frame plate 10. The bottom plate 11 is movably connected to the bottom of the frame plate 10. When in use, the bottom plate 11 can be removed by means including but not limited to a robot. The adsorption device 12 is connected to the bottom plate 11 and is connected to the mounting cavity 100. When in use, the adsorption force on the black film 3 is increased to ensure that there are no wrinkles or bubbles on the surface of the black film 3.

[0038] In the description of the present application, it should be noted that the terms "upper", "lower", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. Unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be a connection between the two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0039] It should be noted that, in this application, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0040] The above description is only a specific implementation of the present application, so that those skilled in the art can understand or implement the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest range consistent with the principles and novel features applied for herein.

Claims

1. A film processing process, characterized in that: The process comprises the following steps: Regulating the relative position of the film mold (1) and the PCB board (2) so that the line connecting the geometric center of the film mold (1) and the geometric center of the PCB board (2) is perpendicular to the PCB board (2); Laying a black adhesive film (3) in the adhesive film mold (1), and determining the outline of the projection of the lamp beads (20) on the PCB board (2) on the black adhesive film (3); Using a laser system, the black adhesive film (3) is cut along the outline of the projection of the lamp bead (20) to obtain a laser hole (30) corresponding to the lamp bead (20); The relative position of the adhesive film mold (1) and the PCB board (2) is adjusted so that the black adhesive film (3) covers the PCB board (2) and the lamp beads (20) correspond to the corresponding laser holes (30) one by one.

2. A film processing process according to claim 1, characterized in that: Regulating the relative position of the film mold (1) and the PCB board (2) so that the line connecting the geometric center of the film mold (1) and the geometric center of the PCB board (2) is perpendicular to the PCB board (2) specifically comprises the following steps: Acquiring the geometric center position of the PCB board (2) by means of an industrial camera; Constructing an XYZ coordinate system, wherein the plane formed by the X-axis and the Y-axis is parallel to the plane where the film mold (1) is located, and the X-axis and the Y-axis are respectively parallel to the two sides perpendicular to the film mold (1), and the Z-axis is perpendicular to the plane where the film mold (1) is located; Moving the PCB board (2) and detecting the coordinates (X0, Y0 and Z0) of the geometric center of the PCB board (2) in real time; Comparing the coordinates (X0, Y0 and Z0) of the geometric center of the PCB board (2) with the coordinates (X1, Y1 and Z1) of the geometric center of the film mold (1); If X0 = X1, Y0 = Y1 and Z0 ≠ Z1, then the line connecting the geometric center of the film n'h'j mold (1) and the geometric center of the PCB board is perpendicular to the PCB board (2); Otherwise, continue to move the PCB board (2).

3. A film processing process according to claim 2, characterized in that: Acquiring the geometric center position of the PCB board (2) by means of an industrial camera specifically comprises the following steps: Using an industrial camera in conjunction with a light source on the PCB board (2) to collect four edge images of the PCB board (2); The geometric center of the PCB board (2) is calculated based on the four edges of the PCB board (2).

4. A film processing process as claimed in claim 2, characterized in that: Acquiring the geometric center position of the PCB board (2) by means of an industrial camera specifically comprises the following steps: Setting marking points (6) around the PCB board (2); An industrial camera is used to identify the marking point (6), and the geometric center of the PCB board (2) is calculated based on the marking point (6).

5. The adhesive film processing process according to claim 1, after laying the black adhesive film (3) in the adhesive film mold (1), the process steps further include: The black film (3) is fixed by vacuum adsorption at the bottom of the film mold (1).

6. The film processing process according to claim 1, characterized in that: Adjusting the relative position of the film mold (1) and the PCB board (2) specifically includes the following steps: Controlling the film mold (1) to descend to a first height position at a first moving speed; At the first height position, starting to remove the bottom plate (11) of the film mold (1); controlling the film mold (1) to descend to a second height position at a second moving speed during the process of removing the bottom plate (11), so that the bottom of the film mold (1) is completely open; The fixation of the black adhesive film (3) is released, so that the black adhesive film (3) falls from the bottom of the adhesive film mold (1) onto the PCB board, and the lamp beads (20) correspond to the corresponding laser holes (30) one by one.

7. A film processing process according to claim 6, characterized in that: The first moving speed is greater than the second moving speed.

8. The film processing process according to claim 1, characterized in that: A visual system is used to monitor the size of the laser hole (30) to ensure that the aperture of the laser hole (30) is 1.01-1.5 times the size of the lamp bead (20).

9. A film processing device, characterized in that: The device is applied to a film processing process as described in any one of claims 1 to 8, and the device comprises: A film mold (1), wherein a mounting cavity (100) adapted to fit the black film (3) is formed in the middle thereof; A moving system is connected to the adhesive film mold (1) and is used to drive the adhesive film mold (1) to move.

10. The film processing device according to claim 9, characterized in that: The film mold (1) comprises: A frame plate (10), wherein the mounting cavity (100) is formed in the middle of the frame plate (10); A bottom plate (11) movably connected to the bottom of the frame plate (10); An adsorption device (12) is connected to the bottom plate (11) and communicates with the installation cavity (100).

Images