A process and device for treating a glue film

Abstract

The present application relates to a process and device for treating a film, belonging to the technical field of film treatment. Among them, the process includes the following steps: adjusting the relative position of the film mold and the PCB board so that the line connecting the geometric centers of the film mold and the PCB board is perpendicular to the PCB board; laying a black film in the film mold and determining the outline of the projection of the lamp beads on the PCB board on the black film; using a laser system to cut the black film along the outline of the projection of the lamp beads to obtain laser holes corresponding to the lamp beads; adjusting the relative position of the film mold and the PCB board so that the black film covers the PCB board and the lamp beads correspond one by one to the corresponding laser holes. When the present application is used, laser holes can be opened on the black film, and the laser holes can accurately correspond to each lamp bead, enabling light to pass through the black film smoothly and reducing light loss caused by the coverage of the black film.

Description

Technical Field

[0001] This application relates to the technical field of film processing, and particularly to a film processing process and device. Background Art

[0002] With the continuous progress of display technology, especially the wide application of new display technologies such as LEDs, the contrast requirements of display devices are getting higher and higher. High contrast can significantly improve the display effect, making the picture clearer and the colors more vivid. Especially in HDR (High Dynamic Range) displays, high contrast is one of the key technical indicators.

[0003] To improve the contrast, traditional methods usually adopt the dispensing or inkjet process, that is, a black material is coated on specific areas of the display panel to reduce light leakage and improve black purity. However, with the continuous increase in the density of lamp beads, especially in Mini-LED and Micro-LED displays, the lamp bead pitch is getting smaller and smaller. Due to the limited accuracy of dispensing or inkjet, especially in the case of high-density lamp bead arrangements, uneven coating is likely to occur, resulting in inconsistent contrast of the display panel and affecting the overall display effect; and during the operation, the glue or ink may directly cover the lamp beads, causing the light output of the lamp beads to be blocked and affecting the display brightness and uniformity.

[0004] To solve these problems, the film laminating process came into being. The film laminating process covers the entire display device with a black film and then makes it closely adhere to the panel through a hot pressing process. This method simplifies the process flow to a certain extent and improves production efficiency. However, the film laminating process also has some problems: Since the film directly covers the lamp beads, it may affect the light output effect of the lamp beads. Especially in high-brightness displays, the light transmittance and reflectivity of the film may cause light loss. Summary of the Invention

[0005] The embodiments of this application provide a film processing process and device to solve the defect that the film directly covering the lamp beads in the related art may affect the light output effect of the lamp beads.

[0006] First aspect:

[0007] The embodiments of this application provide a film processing process, and the process includes the following steps:

[0008] Adjust the relative position of the glue film mold and the PCB board so that the line connecting the geometric centers of the glue film mold and the PCB board is perpendicular to the PCB board; lay a black glue film in the glue film mold, and determine the outline of the projection of the lamp beads on the PCB board on the black glue film; use a laser system to cut the black glue film along the outline of the projection of the lamp beads to obtain laser holes corresponding to the lamp beads; adjust the relative position of the glue film mold and the PCB board so that the black glue film covers the PCB board and the lamp beads correspond to the corresponding laser holes one by one.

[0009] In some embodiments, adjusting the relative position of the glue film mold and the PCB board so that the line connecting the geometric centers of the glue film mold and the PCB board is perpendicular to the PCB board specifically includes the following steps: obtain the geometric center position of the PCB board through an industrial camera; construct an XYZ coordinate system, where the plane formed by the X-axis and the Y-axis is parallel to the plane where the glue film mold is located, and the X-axis and the Y-axis are respectively parallel to two sides perpendicular to the glue film mold, and the Z-axis is perpendicular to the plane where the glue film mold is located; move the PCB board and detect the coordinates (X0, Y0, and Z0) of the geometric center of the PCB board in real time; compare the coordinates (X0, Y0, and Z0) of the geometric center of the PCB board with the coordinates (X1, Y1, and Z1) of the geometric center of the glue film mold; if X0 = X1, Y0 = Y1, and Z0 ≠ Z1, then the line connecting the geometric centers of the glue film mold and the PCB board is perpendicular to the PCB board; otherwise, continue to move the PCB board.

[0010] In some embodiments, obtaining the geometric center position of the PCB board through an industrial camera specifically includes the following steps: use the industrial camera to cooperate with the light source on the PCB board to collect four edge images of the PCB board; calculate the geometric center of the PCB board according to the four edges of the PCB board.

[0011] In some embodiments, obtaining the geometric center position of the PCB board through an industrial camera specifically includes the following steps: set fiducial points around the PCB board; use the industrial camera to identify the fiducial points and calculate the geometric center of the PCB board according to the fiducial points.

[0012] In some embodiments, after laying the black glue film in the glue film mold, the process steps further include: fixing the black glue film by vacuum adsorption at the bottom of the glue film mold.

[0013] In some embodiments, adjusting the relative position of the film die and the PCB board specifically includes the following steps: controlling the film die to descend to a first height position at a first moving speed; at the first height position, starting to remove the bottom plate of the film die; controlling the film die to descend to a second height position at a second moving speed during the removal of the bottom plate, so that the bottom of the film die is completely open; releasing the fixation of the black film, so that the black film falls from the bottom of the film die onto the PCB board, and the lamp beads correspond to the corresponding laser holes one by one.

[0014] In some embodiments, the first moving speed is greater than the second moving speed.

[0015] In some embodiments, a vision system is used to monitor the size of the laser holes to ensure that the aperture of the laser holes is 1.01 - 1.5 times the size of the lamp beads.

[0016] Second aspect:

[0017] The embodiment of the present application provides a film processing device, which is applied to the above-mentioned film processing process. The device includes: a film die, in which an installation cavity adapted to the black film is formed in the middle; a moving system, which is connected to the film die and is used to drive the film die to move.

[0018] In some embodiments, the film die includes: a frame plate, the installation cavity is formed in the middle of the frame plate; a bottom plate, which is movably connected to the bottom of the frame plate; an adsorption device, which is connected to the bottom plate and communicates with the installation cavity.

[0019] The beneficial effects brought by the technical solution provided by the present application include:

[0020] The embodiment of the present application provides a film processing process and device. Since the film processing process adjusts the relative position of the film die and the PCB board, so that the connection line between the geometric center of the film die and the geometric center of the PCB board is perpendicular to the PCB board, it ensures that the black film can accurately correspond to the lamp beads on the PCB board when being laid. Then, a laser system is used to open laser holes in the black film, and these laser holes can accurately correspond to each lamp bead, so that light can pass through the black film smoothly, reducing the light loss caused by the coverage of the black film. At the same time, the laser hole opening technology has the characteristics of high precision and high efficiency, and can ensure the accuracy and consistency of the hole opening position. Description of the Drawings

[0021] To more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for description in the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0022] Figure 1 It is a schematic diagram showing the overall process of the film treatment process provided by the embodiment of the present application;

[0023] Figure 2 It is a schematic diagram showing the laying of the black film in the film treatment process provided by the embodiment of the present application;

[0024] Figure 3 It is a schematic diagram showing the film covering state of the black film and the PCB board in the film treatment process provided by the embodiment of the present application;

[0025] Figure 4 It is a schematic diagram of the hot pressing mold in the film treatment process provided by the embodiment of the present application

[0026] Figure 5 It is a schematic diagram of the film treatment device provided by the embodiment of the present application;

[0027] Figure 6 It is a schematic diagram of the film mold provided by the embodiment of the present application;

[0028] Reference numerals:

[0029] 1. Film mold; 10. Frame plate; 100. Installation cavity; 11. Bottom plate; 12. Adsorption device; 2. PCB board; 20. Lamp beads; 3. Black film; 30. Laser holes; 4. Hot pressing mold; 5. Bottom plate mold; 6. Marking points; 70. First lead screw nut structure; 71. First mounting plate; 72. Connecting rod; 73. Second mounting plate; 74. Second lead screw nut structure; 75. Third lead screw nut structure. Detailed implementation manners

[0030] To make the objectives, technical solutions and advantages of the embodiments of the present application clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of them. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present application.

[0031] The embodiments of the present application provide a film treatment process and device, which can solve the defect that in the related art, when the film is directly covered on the lamp beads, it may affect the light output effect of the lamp beads.

[0032] See Figures 1 to 4 As shown, the embodiment of the present application provides a film treatment process, and the process includes the following steps: First, adjust the relative positions of the film die 1 and the PCB board 2 so that the line connecting the geometric centers of the film die 1 and the PCB board 2 is perpendicular to the PCB board 2. Doing so makes the film die 1 and the PCB board 2 absolutely aligned in the vertical direction, thereby providing a basis for accurately positioning and cutting the subsequent black film 3, avoiding deviations during subsequent laying and cutting processes, and improving the accuracy and efficiency of the overall process.

[0033] After adjusting the relative positions of the film die 1 and the PCB board 2, lay the black film 3 in the film die 1 and determine the outline of the projection of the lamp beads 20 on the PCB board 2 on the black film 3. Laying the black film 3 is to form a light-shielding layer on the PCB board 2 to reduce light interference and leakage, and determining the projection outline of the lamp beads 20 on the black film 3 is to provide an accurate cutting path for subsequent laser cutting. This step ensures the accuracy of laser cutting and also provides the necessary light-shielding effect for the lamp beads 20, helping to improve the optical performance of the product.

[0034] After confirming the projection outline of the lamp beads 20 on the black film 3, further use a laser system to cut the black film 3 along the outline of the projection of the lamp beads 20 to obtain the laser holes 30 corresponding to the lamp beads 20. Laser cutting is a high-precision, non-contact processing method that can accurately cut the black film 3 along a predetermined outline. Through this step, the laser holes 30 corresponding to the lamp beads 20 are formed, enabling light to emit smoothly from the lamp beads 20. The high precision of laser cutting ensures the accuracy and consistency of the laser holes 30, helping to improve the overall quality and performance of the product.

[0035] Finally, adjust the relative positions of the film die 1 and the PCB board 2 so that the black film 3 covers the PCB board 2, and the lamp beads 20 correspond one by one to the corresponding laser holes 30. Accurately cover the cut black film 3 on the PCB board 2 and ensure that each lamp bead 20 is aligned with its corresponding laser hole 30, ensuring that light can emit from the lamp beads 20 as expected and irradiate the target area through the laser holes 30. This helps to improve the light-emitting efficiency and optical performance of the product.

[0036] In this embodiment, the adhesive film treatment process further includes: after covering the black adhesive film 3 on the PCB board 2 and making the lamp beads 20 correspond to the corresponding laser holes 30 one by one, the laser system can be used to cut the black adhesive film 3 beyond the outline of the PCB board 2, and the vision system in the cutting system can be used for precise detection during the cutting process. After cutting the redundant black adhesive film 3, it is also necessary to operate the hot pressing die 4 to perform hot pressing treatment on the black adhesive film 3. The hardness of the hot pressing die 4 is 10-100D, and the material is general resin, rubber, high-temperature resistant elastomer and other materials, which has a certain amount of deformation, so as to ensure that the lamp beads 20 will not be violently pressed to death after pressing down, and ensure that the area except the lamp beads 20 can be well combined with the PCB substrate, so that the black adhesive film 3 and the PCB board 2 are effectively combined, avoiding the possibility of subsequent peeling and causing the failure of the display device.

[0037] In this application, adjusting the relative position of the adhesive film die 1 and the PCB board 2 so that the line connecting the geometric centers of the adhesive film die 1 and the PCB board 2 is perpendicular to the PCB board 2 specifically includes the following steps: First, obtain the geometric center position of the PCB board 2 through an industrial camera. The high-precision industrial camera can capture the image of the PCB board 2 and use image processing technology to determine the geometric center position of the PCB board 2. This provides accurate data support for subsequent positioning and adjustment; The second step is to construct an XYZ coordinate system, where the plane formed by the X-axis and the Y-axis is parallel to the plane where the adhesive film die 1 is located, and the X-axis and the Y-axis are respectively parallel to two sides perpendicular to the adhesive film die 1, and the Z-axis is perpendicular to the plane where the adhesive film die 1 is located. This XYZ coordinate system provides a unified reference framework; The fourth step is to start moving the PCB board 2 and detect the coordinates (X0, Y0, and Z0) of the geometric center of the PCB board 2 in real time. This step is carried out during the process of continuously adjusting and detecting the position of the PCB board 2. By detecting the coordinates of the geometric center of the PCB board 2 in real time, the current position state of the PCB board 2 can be dynamically understood; The fifth step is to compare the coordinates (X0, Y0, and Z0) of the geometric center of the PCB board 2 with the coordinates (X1, Y1, and Z1) of the geometric center of the adhesive film die 1. This is the key to judging whether the position of the PCB board 2 meets the requirements. By comparing the coordinates of the two geometric centers, the relative position relationship between them can be intuitively understood, so as to judge whether the connecting line is perpendicular to the PCB board 2; The comparison result shows that if X0 = X1, Y0 = Y1 and Z0 ≠ Z1, X0 = X1, Y0 = Y1 means that the adhesive film die 1 and the PCB board 2 are on the same horizontal plane and the horizontal positions coincide. The adhesive film die 1 and the PCB board 2 are on the same horizontal plane and the horizontal positions coincide. Z0 ≠ Z1 indicates that the coordinates of the adhesive film die 1 and the PCB board 2 on the Z-axis are not equal, that is, there is a vertical distance between the adhesive film die 1 and the PCB board 2, that is, the line connecting the geometric centers of the adhesive film die 1 and the PCB board 2 is perpendicular to the PCB board 2; At this time, the movement of the PCB board 2 can be stopped, otherwise, continue to move the PCB board 2.

[0038] In this application, obtaining the geometric center position of the PCB board 2 by an industrial camera (not shown in the figure) specifically includes the following steps: First, use the industrial camera to cooperate with the light source on the PCB board 2 to collect the four-edge images of the PCB board 2. The light source provides uniform illumination for the PCB board 2 to ensure that the industrial camera can capture clear edge images. By collecting the four-edge images of the PCB board 2, the complete contour of the PCB board 2 in the two-dimensional plane can be obtained. The selection of the four-edge images is to ensure that the shape and size of the PCB board 2 can be fully reflected, providing accurate data for subsequent calculation of the geometric center. Then, according to the four edges of the PCB board 2, use the edge detection algorithm to extract the edge contour of the PCB board 2. After the edge contour is extracted, the geometric center of the PCB board 2 can be determined by calculating the centroid or geometric center of the contour. The centroid calculation usually involves weighted averaging of the coordinates of all points on the contour to obtain the coordinates of the center point.

[0039] In some other alternative embodiments, obtaining the geometric center position of the PCB board 2 by an industrial camera specifically includes the following steps: First, set marking points 6 around the PCB board 2. The marking points 6 are usually called Mark points and are reference marks for PCB positioning and device centering; then use the industrial camera to identify the marking points 6 and calculate the geometric center of the PCB board 2 according to the marking points 6 by using the corner detection algorithm.

[0040] In this application, for the method of obtaining the geometric center position of the PCB board 2 by the industrial camera, the edge detection algorithm and the corner detection algorithm can be selected alternatively, or both can be used together to improve the accuracy.

[0041] In this application, by setting the PCB board 2 on the bottom plate mold 5, the geometric center position of the PCB board 2 can be conveniently obtained. The specific method is: install the industrial camera on the bottom plate mold 5, and set a plurality of vacuum adsorption holes (not shown in the figure) at the bottom of the bottom plate mold 5. An adsorption device 12 (not shown in the figure) is connected to the vacuum adsorption holes. When starting the vacuum adsorption during use, negative pressure is quickly generated in the adsorption holes, firmly adsorbing the PCB board 2. At this time, the adsorption pressure is controlled within a certain range to avoid excessive suction causing deformation of the PCB board 2. Then, move the bottom plate mold 5 to drive the movement of the PCB board 2 to quickly identify the actual position of the PCB board 2.

[0042] In this application, after laying the black film 3 in the film mold 1, the process steps further include: using the adsorption device 12 to fix the black film 3 by vacuum adsorption at the bottom of the film mold 1. The size of the black film 3 is slightly larger than that of the film mold 1. During the laying process, the edge of the black film 3 will naturally fit the inner wall of the mold. When the black film 3 is adsorbed, the air pressure precision control system adjusts the vacuum degree to ensure that there are no wrinkles or bubbles on the surface of the black film 3.

[0043] In this application, adjusting the relative position between the film die 1 and the PCB board 2 specifically includes the following steps: controlling the film die 1 to descend to the first height position at the first moving speed. This step is the initial descent stage, and the purpose is to move the film die 1 from the initial position to a height close to the PCB board 2 but not yet in contact; then at the first height position, start removing the bottom plate 11 of the film die 1. Removing the bottom plate 11 enables the subsequent black film 3 to be smoothly attached to the PCB board 2; controlling the film die 1 to descend to the second height position at the second moving speed during the removal of the bottom plate 11, so that the bottom of the film die 1 is completely open. The second moving speed provides a smoother transition for the attachment of the black film 3 and reduces the error caused by too fast a speed; after there is no obstruction from the bottom plate 11, release the fixation of the black film 3, so that the black film 3 falls from the bottom of the film die 1 onto the PCB board 2, and the lamp beads 20 correspond one by one to the corresponding laser holes. Releasing the fixation of the black film 3 can be achieved by releasing the adsorption of the black film 3 by the bottom of the film die 1. Precise control of the timing and manner of releasing the fixation ensures that the black film 3 can be accurately and completely attached to the PCB board 2, and the lamp beads 20 correspond one by one to the corresponding laser holes, meeting the product design and functional requirements.

[0044] In addition, the first moving speed is greater than the second moving speed. By setting different moving speeds, the optimization and control of the entire operation process are realized. Using a faster moving speed in the initial descent stage can save time; while when approaching the PCB board 2 and performing the attachment operation, using a slower moving speed can ensure the stability and accuracy of the operation. This design of speed change helps to improve the overall operation efficiency and product quality.

[0045] Use a vision system to monitor the size of the laser holes 30 to ensure that the aperture of the laser holes 30 is 1.01 - 1.5 times the size of the lamp beads 20. The vision system can achieve precise measurement of the aperture of the laser holes 30 through a high-resolution camera and advanced image processing algorithms. This high-precision measurement ensures that the aperture of each laser hole 30 is within the predetermined range, thereby improving the processing accuracy. And during mass production, the vision system can continuously monitor the size of the laser holes 30 to ensure that the aperture of each hole remains consistent.

[0046] See Figure 5 and Figure 6 As shown in [relevant figures], the embodiment of this application provides a film processing device. The device is applied to the above-mentioned film processing process. The device includes: a film die 1 and a moving system. An installation cavity 100 adapted to the black film 3 is formed in the middle of the film die 1, and the black film 3 is laid in the installation cavity 100; the moving system is connected to the film die 1 and is used to drive the film die 1 to move.

[0047] In this application, the mobile system includes, but is not limited to: a first lead screw nut structure 70, a first mounting plate 71, a connecting rod 72, a second mounting plate 73, a second lead screw nut structure 74, and a third lead screw nut structure 75. The first lead screw nut structure 70 is connected to both sides of the film die 1. The first mounting plate 71 is connected between the first lead screw nut structures 70. One end of the connecting rod 72 is fixed to the first mounting plate 71, and the other end is fixed to the second lead screw nut structure 74. The second lead screw nut structure 74 is arranged on the second mounting plate 73. The third lead screw nut structure 75 is connected to both sides of the second mounting plate 73. During use, the first lead screw nut structure 70 is used to drive the film die 1 to move closer to or away from the PCB board 2 in the vertical direction. The second lead screw nut structure 74 is used to drive the connecting rod 72 to move left and right along the first mounting plate 71. When the connecting rod 72 moves, it also drives the first mounting plate 71 to move together, thereby realizing the driving of the film die 1 in the left and right directions. Finally, the third lead screw nut structure 75 can move in the front and back directions along the second mounting plate 73, thereby driving the entire film die 1 to move back and forth. The purpose of this is to enable the film die 1 to move in the front, back, left, and right directions and downwards, so that the film die 1 can be precisely adjusted according to the scenario during use. It should be noted that in this application, the driving of the lead screw nut structure can be directly completed by a high-precision servo motor.

[0048] In this application, the provided film die 1 includes: a frame plate 10, a bottom plate 11, and an adsorption device 12. The frame plate 10 can be set as a rectangle, and an installation cavity 100 is formed in the middle of the frame plate 10. The bottom plate 11 is movably connected to the bottom of the frame plate 10, and during use, the removal of the bottom plate 11 can be completed by, but is not limited to, a manipulator. The adsorption device 12 is connected to the bottom plate 11 and communicates with the installation cavity 100. During use, it increases the adsorption force on the black film 3 to ensure that there are no wrinkles or bubbles on the surface of the black film 3.

[0049] In the description of this application, it should be noted that the orientation or positional relationship indicated by terms such as "upper" and "lower" is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, so it cannot be understood as a limitation to this application. Unless otherwise clearly specified and defined, the terms "installation", "connection", and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0050] It should be noted that in this application, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising an..." does not exclude the presence of additional identical elements in the process, method, article or device comprising the said element.

[0051] The above are only specific embodiments of the present application, which enable those skilled in the art to understand or implement the present application. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to these embodiments shown herein, but rather will conform to the broadest scope consistent with the principles and novel features claimed herein.

Claims

1. A process for treating a film, characterized in that, The process includes the following steps: Adjust the relative position of the film die (1) and the PCB board (2) so that the line connecting the geometric centers of the film die (1) and the PCB board (2) is perpendicular to the PCB board (2); Lay a black film (3) in the film die (1). The bottom of the film die (1) uses vacuum adsorption to fix the black film (3), and determine the contour of the projection of the lamp beads (20) on the PCB board (2) on the black film (3); Use a laser system to cut the black film (3) along the contour of the projection of the lamp beads (20) to obtain laser holes (30) corresponding to the lamp beads (20); Adjust the relative position of the film die (1) and the PCB board (2) so that the black film (3) covers the PCB board (2), and the lamp beads (20) correspond one-to-one with the corresponding laser holes (30); Adjusting the relative position of the film die (1) and the PCB board (2) specifically includes the following steps: Control the film die (1) to descend to the first height position at the first moving speed; At the first height position, start removing the bottom plate (11) of the film die (1); control the film die (1) to descend to the second height position at the second moving speed during the removal of the bottom plate (11) so that the bottom of the film die (1) is completely open; Release the fixation of the black film (3) so that the black film (3) falls from the bottom of the film die (1) onto the PCB board, and the lamp beads (20) correspond one-to-one with the corresponding laser holes (30).

2. The adhesive film processing method according to claim 1, wherein: Adjusting the relative position of the film die (1) and the PCB board (2) so that the line connecting the geometric centers of the film die (1) and the PCB board (2) is perpendicular to the PCB board (2) specifically includes the following steps: Obtain the geometric center position of the PCB board (2) through an industrial camera; Construct an XYZ coordinate system, where the plane formed by the X-axis and the Y-axis is parallel to the plane where the film die (1) is located, and the X-axis and the Y-axis are respectively parallel to two sides perpendicular to the film die (1), and the Z-axis is perpendicular to the plane where the film die (1) is located; Move the PCB board (2) and detect the coordinates (X0, Y0, and Z0) of the geometric center of the PCB board (2) in real time; Compare the coordinates (X0, Y0, and Z0) of the geometric center of the PCB board (2) with the coordinates (X1, Y1, and Z1) of the geometric center of the film die (1); If X0 = X1, Y0 = Y1, and Z0 ≠ Z1, then the line connecting the geometric centers of the film die (1) and the PCB board is perpendicular to the PCB board (2); Otherwise, continue to move the PCB board (2).

3. The film treatment process according to claim 2, wherein: Obtaining the geometric center position of the PCB board (2) through an industrial camera specifically includes the following steps: Use an industrial camera to cooperate with the light source on the PCB board (2) to collect four edge images of the PCB board (2); Calculate the geometric center of the PCB board (2) based on the four edges of the PCB board (2).

4. The adhesive film processing method according to claim 2, wherein: Obtaining the geometric center position of the PCB board (2) through an industrial camera specifically includes the following steps: Set fiducial points (6) around the PCB board (2); Use an industrial camera to identify the fiducial points (6) and calculate the geometric center of the PCB board (2) based on the fiducial points (6).

5. A film treatment process as claimed in claim 1, characterized in that: The first moving speed is greater than the second moving speed.

6. The adhesive film treatment process according to claim 1, characterized in that: Use a vision system to monitor the size of the laser holes (30) to ensure that the aperture of the laser holes (30) is 1.01 - 1.5 times the size of the lamp beads (20).

Images