Film double-sided automatic positioning die cutting and laminating device

Abstract

The invention relates to a film double-face automatic positioning die cutting and laminating device, and belongs to the technical field of film die cutting and laminating, the film double-face automatic positioning die cutting and laminating device comprises a rack and mounting racks arranged on the upper side and the lower side of the rack, and one side, close to an electronic substrate, of each mounting rack is slidably provided with a mounting support plate in the vertical direction; an elastic piece used for pushing the mounting support plate to slide in the direction close to the electronic substrate is arranged on the mounting frame, a rotating cylinder is rotationally arranged on the mounting support plate, and a plurality of pressing sets are sequentially arranged on the rotating cylinder in the circumferential direction; each pressing set comprises a plurality of sliding rods arranged on the rotating drum in a sliding and penetrating mode and attaching pieces arranged on the sliding rods, the sliding rods of each pressing set are arranged at intervals in the rotating axis direction of the rotating drum, the attaching pieces are used for abutting against a film on the corresponding face of the electronic substrate, and an adjusting assembly is arranged on the rotating drum. The method has the advantage that the attaching effect of the thin film and the uneven electronic substrate is improved.

Description

Technical Field

[0001] The present application relates to the technical field of film die-cutting and laminating, and in particular to a film double-sided automatic positioning die-cutting and laminating device. Background Art

[0002] In the production process of electronic substrates, in order to protect the electronic substrates, it is usually necessary to use a film die-cutting and laminating device to cover and laminate a layer of optical film on both sides of the electronic substrates, and then cut the optical film between adjacent electronic substrates to obtain separate film-laminated electronic substrates.

[0003] In the related art, a Chinese patent document with publication number CN212097604U discloses a double-sided automatic positioning die-cutting and laminating device for a film, comprising a mounting plate, a first conveying mechanism is provided on the mounting plate, a film roller is provided on the upper and lower ends of one end of the first conveying mechanism, a film is rolled up on the film roller, two symmetrically arranged glue storage tanks are fixedly installed on one side of the first conveying mechanism, a glue coating roller is rotatably installed in the glue storage tank, a guide roller is provided on the mounting plate, the film is pulled to the corresponding side of the electronic substrate by the guide roller to be laminated, a mounting frame is provided on the mounting plate at one side of the guide roller, a pressure roller is connected to the mounting frame through a buffer spring, and a second conveying mechanism is provided on one side of the pressure roller. When in use, the film on the upper and lower sides is pulled out onto the electronic substrate, the upper and lower sides of the electronic substrate are coated with glue by the glue coating roller, the upper and lower sides of the electronic substrate are respectively laminated by the guide roller, the upper and lower sides of the electronic substrate are clamped by the pressure roller, so that the film is laminated on the upper and lower sides of the electronic substrate, and the film is transported by the first conveying mechanism and the second conveying mechanism to complete the lamination, and then the film is cut after drying.

[0004] Regarding the above-mentioned related technologies, since the surface of the electronic substrate is usually not flat, when the upper and lower pressing rollers clamp the electronic substrate and the upper and lower films, the bonding effect is not good. Summary of the invention

[0005] In order to help improve the lamination effect between a film and an uneven electronic substrate, the present application provides a film double-sided automatic positioning die-cutting lamination device.

[0006] The present application provides a film double-sided automatic positioning die-cutting and laminating device adopts the following technical solution: The cam is provided with a plurality of support members, each of which is provided with a plurality of support members, each of which is provided with a plurality of support members, each of which is provided with a plurality of support members, each of which is provided with a plurality of support members, each of which is provided with a plurality of support members, each of which is provided with a plurality of support members, each of which is provided with a plurality of support members, each of which is provided with a plurality of support members, each of which is provided with a plurality of support members, each of which is provided with a plurality of support members, each of which is provided with a plurality of support members, each of which is provided with a plurality of support members,

[0007] Preferably, the laminating member comprises an arc-shaped pressing piece arranged at one end of the sliding rod away from the rotating drum, the arc-shaped pressing pieces in the laminating group have the same curvature, and the arc-shaped pressing pieces are used to abut against the film on the corresponding side of the electronic substrate.

[0008] Preferably, adjacent arc-shaped pressing sheets of each pressing group abut against each other, and aligned arc-shaped pressing sheets in adjacent pressing groups abut against each other.

[0009] Preferably, a fixed rod is provided on the mounting support plate, and the rotating drum is rotatably sleeved on the fixed rod, and the adjusting assembly includes a first spring arranged in the rotating drum and a pushing member arranged on the fixed rod, the first spring corresponds to the sliding rod one by one, the first spring is sleeved on the corresponding sliding rod, one end of the first spring is arranged on the sliding rod, and the other end is arranged on the inner wall of the rotating drum, the first spring is used to push the sliding rod to slide in a direction close to the rotating drum, and the pushing member is used to make the sliding rod on the rotating drum rotate to the side of the corresponding fixed rod close to the electronic substrate so that the sliding rod has a tendency to slide in a direction away from the fixed rod.

[0010] Preferably, the pushing member includes a first repulsive magnet arranged on the fixed rod and a second repulsive magnet arranged on the sliding rod, the first repulsive magnet is located on the side of the corresponding fixed rod close to the electronic substrate, the first repulsive magnet is used to drive the aligned second repulsive magnet away, and the repulsive force between the first repulsive magnet and the second repulsive magnet is greater than the elastic force of the first spring.

[0011] Preferably, a mounting groove is formed on a side of the fixing rod close to the electronic substrate, the mounting groove extends out of the rotating drum, and the first repelling magnet is detachably mounted in the mounting groove.

[0012] Preferably, the first repelling magnet extends out of one end of the rotating drum, and one end of the first repelling magnet located outside the rotating drum is connected to a corresponding fixing rod through a screw.

[0013] Preferably, an elastic cloth is arranged between the aligned arc-shaped pressing sheets in adjacent pressing groups, and the elastic cloth is located on a side of the arc-shaped pressing sheets close to the rotating drum.

[0014] Preferably, connecting plates are provided at both ends of the mounting frame located above the electronic substrate, and the connecting plates extend toward the side close to the electronic substrate. The rotating drum is located between the two connecting plates, and a limiting rod is passed through the connecting plates. The length direction of the limiting rod is parallel to the rotation axis of the rotating drum, and the limiting rod is provided with a limiting plate for abutting against the side of the electronic substrate.

[0015] Preferably, the elastic member includes a second spring for pushing the mounting support plate to slide in a direction close to the electronic substrate, one end of the second spring is arranged on the corresponding mounting frame, and the other end is arranged on the corresponding mounting support plate.

[0016] In summary, this application includes the following beneficial technical effects: When the electronic substrate with films laminated on the upper and lower parts passes between the rotating drums on the two mounting frames, the laminating piece on the sliding rod abuts against the film on the corresponding side of the electronic substrate. When the rotating drum drives the sliding rod to rotate to be perpendicular to the plane where the electronic substrate is located, the sliding rod is adjusted by the adjustment component to have a tendency to move toward the direction close to the electronic substrate. Since the multiple laminating pieces in the pressing group are independent of each other, the laminating pieces at different positions can adapt to the surface conditions of the corresponding positions on the electronic substrate, thereby helping to improve the laminating effect between the film and the uneven electronic substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the present application.

[0018] Figure 2 It is a partial structural diagram of an embodiment of the present application.

[0019] Figure 3 It is a structural cross-sectional view of the rotating drum in an embodiment of the present application.

[0020] Figure 4 yes Figure 3 Enlarged view of part A.

[0021] Explanation of the reference numerals in the accompanying drawings: 1. Frame; 2. Mounting frame; 3. Mounting support plate; 4. Rotating drum; 5. Arc-shaped pressing plate; 6. Fixing rod; 7. First spring; 8. Pushing member; 81. First repelling magnet; 82. Second repelling magnet; 9. Mounting groove; 10. Elastic cloth; 11. Connecting plate; 12. Limiting rod; 13. Limiting plate; 14. Second spring; 15. Telescopic rod; 16. Mounting cavity; 17. Sliding rod. DETAILED DESCRIPTION

[0022] The following combination Figure 1-Figure 4 This application is described in further detail.

[0023] The present application discloses a film double-sided automatic positioning die-cutting and laminating device. Figure 1 and Figure 2 The film double-sided automatic positioning die-cutting and laminating device includes a frame 1 and a mounting frame 2. The mounting frames 2 are fixedly arranged on the upper and lower sides of the frame 1. The two mounting frames 2 are located between the guide roller and the second conveying mechanism on the frame 1. The space between the two mounting frames 2 is used for electronic substrates with films laminated on the upper and lower sides to pass through, that is, the two sides of the electronic substrates passing between the two mounting frames 2 have been covered with films under the traction of the guide rollers.

[0024] Reference Figure 1 and Figure 2 A mounting support plate 3 is provided on one side of the mounting frame 2 close to the electronic substrate for sliding in the vertical direction. The mounting support plate 3 is U-shaped, and the opening of the mounting support plate 3 is arranged toward the side where the electronic substrate is located. In order to facilitate the sliding guidance of the mounting support plate 3, a telescopic rod 15 is fixed between the mounting support plate 3 and the mounting frame 2. The telescopic direction of the telescopic rod 15 is arranged along the vertical direction. An elastic member for pushing the mounting support plate 3 to slide toward the direction close to the electronic substrate is provided on the mounting frame 2.

[0025] Reference Figure 2 and Figure 3A fixing rod 6 is fixed in the mounting support plate 3, and the length direction of the fixing rod 6 is perpendicular to the conveying direction of the electronic substrate. A rotating drum 4 is rotatably sleeved on the fixing rod 6, and the rotation axis of the rotating drum 4 is parallel to the length direction of the fixing rod 6. A mounting cavity 16 is circumferentially opened on one side of the rotating drum 4 close to the fixing rod 6, so that there is a certain gap between the rotating drum 4 and the outer wall of the fixing rod 6. A plurality of laminating groups are sequentially arranged on the rotating drum 4 along the circumferential direction, and each laminating group includes a sliding rod 17 and a bonding piece. The sliding rod 17 is slidably arranged on the rotating drum 4, and the sliding direction of the sliding rod 17 is perpendicular to the rotation axis of the rotating drum 4. There are a plurality of sliding rods 17 in each laminating group distributed along the rotation axis direction of the rotating drum 4, and the bonding pieces correspond to the sliding rods 17 one by one. The bonding pieces are arranged at the end of the corresponding sliding rod 17 outside the rotating drum 4, and the bonding pieces are used to abut against the film on the corresponding side of the electronic substrate, and the adjacent bonding pieces in each laminating group abut against each other, and the aligned bonding pieces in the adjacent laminating groups abut against each other. An adjusting component is arranged on the rotating drum 4, and the adjusting component is used to adjust the sliding rod 17 to have a tendency to slide toward or away from the rotating drum 4.

[0026] When in use, the upper and lower surfaces of the electronic substrate passing through the guide roller are respectively laminated with films, and then when the electronic substrate with films laminated on the upper and lower sides passes between the rotating drums 4 of the two mounting frames 2, the laminating piece on the sliding rod 17 abuts against the film on the corresponding side of the electronic substrate. When the rotating drum 4 drives the sliding rod 17 to rotate to be perpendicular to the plane where the electronic substrate is located, the sliding rod 17 is adjusted by the adjusting component to have a tendency to move toward the direction close to the electronic substrate. Since the multiple laminating pieces in the pressing group are independent of each other, the laminating pieces at different positions can adapt to the surface conditions of the corresponding positions on the electronic substrate, so that the laminating pieces can press the film tightly against the electronic substrate, which helps to improve the laminating effect of the film and the uneven electronic substrate; when the rotating drum 4 drives the sliding rod 17 to move until the laminating piece is separated from the film, the sliding rod 17 is adjusted by the adjusting component to move toward the direction close to the rotating drum 4, so that the laminating piece on the sliding rod 17 is not easy to interfere with the normal transportation of the electronic substrate, so that the electronic substrate can be transported to the second conveying mechanism for die-cutting.

[0027] Reference Figure 2 In order to facilitate the sliding of the mounting support plate 3 toward the direction close to the electronic substrate, the elastic member includes a second spring 14. The second spring 14 corresponds to the telescopic rod 15 one by one. The extension direction of the second spring 14 is parallel to the telescopic direction of the corresponding telescopic rod 15. One end of the second spring 14 is fixed on the mounting frame 2, and the other end is fixed on the mounting support plate 3. The second spring 14 is used to push the mounting support plate 3 to move toward the direction of the electronic substrate so as to clamp the electronic substrate and the film.

[0028] Reference Figure 2 and Figure 3In order to facilitate the film to be closely attached to the electronic substrate, the attaching member includes an arc-shaped pressing sheet 5, which is fixedly arranged at the end of the sliding rod 17 away from the rotating cylinder 4. The arc-shaped pressing sheets 5 in the pressing group have the same curvature, and the arc-shaped pressing sheets 5 in multiple pressing groups can be spliced ​​into a cylinder. The arc-shaped pressing sheet 5 is used to abut against the film on the corresponding side of the electronic substrate. The arrangement of the arc-shaped pressing sheet 5 makes the film less likely to be damaged.

[0029] Reference Figure 3 and Figure 4 In order to facilitate the adjustment of the sliding rod 17 to drive the arc-shaped pressing piece 5 to slide, the adjusting component includes a first spring 7 and a pushing piece 8. The first spring 7 corresponds to the sliding rod 17 one by one. The first spring 7 is sleeved on the corresponding sliding rod 17. The first spring 7 is located in the installation cavity 16. One end of the first spring 7 is fixed to the side of the sliding rod 17 away from the arc-shaped pressing piece 5, and the other end is fixed to the inner wall of the installation cavity 16. The first spring 7 is used to push the sliding rod 17 to slide in the direction close to the rotating drum 4. When the first spring 7 is in a natural state, the outer walls of multiple arc-shaped pressing pieces 5 of multiple groups of pressing groups form a complete arc plane; the pushing piece 8 is arranged on the fixed rod 6, and the pushing piece 8 is used to make the sliding rod 17 on the rotating drum 4 rotate to the side of the fixed rod 6 close to the electronic substrate so that the sliding rod 17 has a tendency to slide in the direction away from the fixed rod 6.

[0030] Reference Figure 3 and Figure 4 In order to facilitate the sliding rod 17 on the rotating drum 4 to rotate to the side of the fixed rod 6 close to the electronic substrate so that the sliding rod 17 has a tendency to slide in the direction away from the fixed rod 6, a mounting groove 9 is provided on the side of the fixed rod 6 close to the electronic substrate, and the length direction of the mounting groove 9 is parallel to the length direction of the fixed rod 6. The pusher 8 includes a first repulsive magnet 81 and a second repulsive magnet 82. The first repulsive magnet 81 is installed in the mounting groove 9, and the second repulsive magnet 82 is fixed to the end of the sliding rod 17 away from the arc-shaped pressing sheet 5. The first repulsive magnet 81 is used to drive the aligned second repulsive magnet 82 away, and the repulsive force between the first repulsive magnet 81 and the second repulsive magnet 82 is greater than the elastic force of the first spring 7. When the second repulsive magnet 82 is aligned with the first repulsive magnet 81, the corresponding sliding rod 17 is perpendicular to the plane where the electronic substrate is located. When the first spring 7 is in a natural state, the distance between the second repulsive magnet 82 and the axis of the fixed rod 6 on the side away from the sliding rod 17 is equal to the radius of the fixed rod 6.

[0031] When the rotating drum 4 rotates until the second repelling magnet 82 on the sliding rod 17 is aligned with the first repelling magnet 81, that is, the rotating drum 4 drives the sliding rod 17 to rotate to the side of the fixed rod 6 close to the electronic substrate and perpendicular to the plane where the electronic substrate is located, since the first repelling magnet 81 has a repelling force on the second repelling magnet 82, each arc-shaped pressing sheet 5 has a tendency to move toward the direction close to the electronic substrate, and the independent sliding rod 17 and the arc-shaped pressing sheet 5 are pressed against the film of the electronic substrate, so that the arc-shaped pressing sheet 5 can press the film against the electronic substrate according to the shape of the electronic substrate at the corresponding position, thereby helping to improve the bonding effect of the film and the uneven electronic substrate. When the rotating drum 4 drives the sliding rod 17 to move until the arc-shaped pressing sheet 5 is separated from the film, that is, the second repelling magnet 82 is misaligned with the first repelling magnet 81, the sliding rod 17 moves toward the direction close to the rotating drum 4 under the pushing action of the first spring 7 and remains in the initial position, so that the arc-shaped pressing sheet 5 on the sliding rod 17 is not easy to interfere with the normal transportation of the electronic substrate.

[0032] Reference Figure 3 , the mounting groove 9 extends out of the rotating drum 4, and the first repelling magnet 81 is detachably mounted in the mounting groove 9; specifically, the first repelling magnet 81 extends out of one end of the rotating drum 4, and the end of the first repelling magnet 81 located outside the rotating drum 4 is connected to the corresponding fixing rod 6 by a screw. By detachably connecting the first repelling magnet 81 to the fixing rod 6, when the processed electronic substrate is in a flat form, the first repelling magnet 81 can be removed from the fixing rod 6 as needed, so that the first spring 7 on the sliding rod 17 is in a natural state, ensuring that the extrusion force on the film is uniform and appropriate, and can be adapted to a variety of usage scenarios.

[0033] Reference Figure 3 The space between the two aligned arc-shaped pressing sheets 5 in the adjacent pressing groups is covered with an elastic cloth 10, and the elastic cloth 10 is located on a side of the arc-shaped pressing sheet 5 close to the rotating drum 4. By setting the elastic cloth 10, when the aligned arc-shaped pressing sheets 5 in the adjacent pressing groups slide relative to each other, the elastic cloth 10 can still squeeze the gap between the two arc-shaped pressing sheets 5.

[0034] Reference Figure 2 and Figure 3 Connecting plates 11 are fixed at both ends of the mounting frame 2 located above the electronic substrate. The connecting plates 11 extend toward the side close to the electronic substrate. The rotating drum 4 is located between the two connecting plates 11. A limiting rod 12 is fixedly penetrated on the connecting plates 11. The length direction of the limiting rod 12 is parallel to the rotation axis of the rotating drum 4. A limiting plate 13 for abutting against the side of the electronic substrate is fixedly provided at one end of the limiting rod 12 close to the electronic substrate.

[0035] The arrangement of the limiting plates 13 on both sides of the electronic substrate helps to guide and position the electronic substrate during transportation, so that the electronic substrate and the film are not easily deflected during transportation.

[0036] The implementation principle of the embodiment of the present application is as follows: when in use, the two sides of the electronic substrate passing through the guide roller are respectively laminated with thin films, and then the electronic substrate with thin films laminated on the upper and lower sides passes between the rotating drums 4 of the two mounting frames 2, and the arc-shaped pressing piece 5 on the sliding rod 17 abuts against the thin film on the corresponding side of the electronic substrate. When the rotating drum 4 drives the sliding rod 17 to rotate to the side of the fixed rod 6 close to the electronic substrate and perpendicular to the plane where the electronic substrate is located, at this time, the second repulsive magnet 82 on the sliding rod 17 close to the side of the electronic substrate is aligned with the first repulsive magnet 81. Since the first repulsive magnet 81 has a repulsive force on the second repulsive magnet 82, the single arc-shaped pressing piece 5 has a tendency to move toward the direction close to the electronic substrate, and the independent sliding rod 17 automatically presses the corresponding arc-shaped pressing piece 5 against the thin film of the electronic substrate, so that the arc-shaped pressing piece 5 can press the thin film against the electronic substrate at the corresponding position, thereby helping to improve the lamination effect between the thin film and the uneven electronic substrate.

[0037] When the rotating drum 4 drives the sliding rod 17 to rotate until the second repelling magnet 82 on the sliding rod 17 is misaligned with the first repelling magnet 81, the sliding rod 17 has a tendency to move toward the rotating drum 4 under the action of the first spring 7, so that the second repelling magnet 82 abuts against the outer wall of the fixed rod 6 and remains in the initial position, so that the arc-shaped pressing sheet 5 on the sliding rod 17 is not easy to interfere with the normal transportation of the electronic substrate, so that the electronic substrate after film pasting can be transported to the second conveying mechanism for die-cutting.

[0038] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A film double-sided automatic positioning die-cutting and laminating device, comprising a frame (1) and mounting frames (2) arranged on the upper and lower sides of the frame (1), wherein an electronic substrate with films laminated on the upper and lower sides passes between the two mounting frames (2), characterized in that: A mounting support plate (3) is slidably arranged on one side of the mounting frame (2) close to the electronic substrate in a vertical direction, an elastic member is arranged on the mounting frame (2) for pushing the mounting support plate (3) to slide in a direction close to the electronic substrate, a rotating drum (4) is rotatably arranged on the mounting support plate (3), the rotating axis of the rotating drum (4) is perpendicular to the conveying direction of the electronic substrate, and a plurality of pressing groups are sequentially arranged on the rotating drum (4) along the circumferential direction, each of the pressing groups comprising a plurality of pressing groups slidably arranged on the rotating drum (4) A plurality of sliding rods (17) and a bonding member arranged on the sliding rods (17), wherein the plurality of sliding rods (17) of each group of the bonding group are arranged at intervals along the direction of the rotation axis of the rotating drum (4), the sliding direction of the sliding rods (17) is perpendicular to the rotation axis of the rotating drum (4), the bonding member is used to abut against the film on the corresponding side of the electronic substrate, and an adjustment component is provided on the rotating drum (4), wherein the adjustment component is used to adjust the sliding rods (17) to have a tendency to slide in a direction close to or away from the rotating drum (4).

2. The film double-sided automatic positioning die-cutting and laminating device according to claim 1, characterized in that: The laminating member comprises an arc-shaped pressing sheet (5) arranged at one end of the sliding rod (17) away from the rotating drum (4); the arc-shaped pressing sheets (5) in the laminating group have the same curvature; and the arc-shaped pressing sheets (5) are used to abut against the film on the corresponding side of the electronic substrate.

3. The film double-sided automatic positioning die-cutting and laminating device according to claim 2, characterized in that: Adjacent arc-shaped pressing sheets (5) of each pressing group abut against each other, and aligned arc-shaped pressing sheets (5) in adjacent pressing groups abut against each other.

4. The film double-sided automatic positioning die-cutting and laminating device according to claim 2, characterized in that: A fixing rod (6) is arranged on the mounting support plate (3), and the rotating cylinder (4) is rotatably sleeved on the fixing rod (6). The adjusting assembly comprises a first spring (7) arranged in the rotating cylinder (4) and a pushing member (8) arranged on the fixing rod (6). The first spring (7) corresponds to the sliding rod (17) one by one. The first spring (7) is sleeved on the corresponding sliding rod (17). One end of the first spring (7) is arranged on the sliding rod (17), and the other end is arranged on the inner wall of the rotating cylinder (4). The first spring (7) is used to push the sliding rod (17) to slide in a direction close to the rotating cylinder (4). The pushing member (8) is used to make the sliding rod (17) on the rotating cylinder (4) rotate to a side of the corresponding fixing rod (6) close to the electronic substrate so that the sliding rod (17) has a tendency to slide in a direction away from the fixing rod (6).

5. The film double-sided automatic positioning die-cutting and laminating device according to claim 4, characterized in that: The pushing member (8) comprises a first repulsive magnet (81) arranged on the fixed rod (6) and a second repulsive magnet (82) arranged on the sliding rod (17), wherein the first repulsive magnet (81) is located on a side of the corresponding fixed rod (6) close to the electronic substrate, and the first repulsive magnet (81) is used to drive the aligned second repulsive magnet (82) away, and the repulsive force between the first repulsive magnet (81) and the second repulsive magnet (82) is greater than the elastic force of the first spring (7).

6. The film double-sided automatic positioning die-cutting and laminating device according to claim 5, characterized in that: A mounting groove (9) is provided on a side of the fixing rod (6) close to the electronic substrate, the mounting groove (9) extends out of the rotating drum (4), and the first repelling magnet (81) is detachably mounted in the mounting groove (9).

7. The film double-sided automatic positioning die-cutting and laminating device according to claim 6, characterized in that: The first repelling magnet (81) extends out of one end of the rotating drum (4), and the end of the first repelling magnet (81) located outside the rotating drum (4) is connected to a corresponding fixing rod (6) via a screw.

8. The film double-sided automatic positioning die-cutting and laminating device according to claim 2, characterized in that: An elastic cloth (10) is arranged between the aligned arc-shaped pressing sheets (5) in the adjacent pressing groups, and the elastic cloth (10) is located on a side of the arc-shaped pressing sheets (5) close to the rotating drum (4).

9. The film double-sided automatic positioning die-cutting and laminating device according to claim 1, characterized in that: Both ends of the mounting frame (2) located above the electronic substrate are provided with connecting plates (11), the connecting plates (11) extending toward a side close to the electronic substrate, the rotating drum (4) being located between the two connecting plates (11), a limiting rod (12) passing through the connecting plates (11), the length direction of the limiting rod (12) being parallel to the rotation axis of the rotating drum (4), and a limiting plate (13) for abutting against a side edge of the electronic substrate being provided on the limiting rod (12).

10. A film double-sided automatic positioning die-cutting and laminating device according to any one of claims 1 to 9, characterized in that: The elastic member comprises a second spring (14) for pushing the mounting support plate (3) to slide in a direction close to the electronic substrate; one end of the second spring (14) is arranged on the corresponding mounting frame (2), and the other end is arranged on the corresponding mounting support plate (3).

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