Laminated assembly and vehicle

Abstract

The invention relates to a laminated assembly and a vehicle. The laminated assembly comprises a first transparent substrate, a first bonding layer, a functional layer, a second bonding layer and a second transparent substrate which are sequentially laminated, wherein a conducting layer is arranged on the surface, close to the first bonding layer, of the functional layer, and the first bonding layer is used for inhibiting or slowing down ion migration of the conducting layer. By adopting the laminated assembly, the problems of appearance discoloration and short circuit can be effectively improved.

Description

Technical Field

[0001] The present application relates to the field of glass technology, and in particular to a laminated component and a vehicle. Background Art

[0002] With the development of intelligent vehicles such as automobiles, intelligent glass is increasingly used in vehicles, such as realizing functions such as light emission, heating or display through intelligent glass. However, after long-term operation, intelligent glass will have the problem of discoloration. Summary of the invention

[0003] Based on this, it is necessary to provide a laminated component and a vehicle to address the above technical issues.

[0004] In a first aspect, the present application provides a laminated assembly, the laminated assembly comprising: a first transparent substrate, a first adhesive layer, a functional layer, a second adhesive layer, and a second transparent substrate stacked in sequence;

[0005] Wherein, a conductive layer is provided on the surface of the functional layer close to the first bonding layer, and the first bonding layer is used to inhibit or slow down the ion migration of the conductive layer.

[0006] In one embodiment, the material of the first adhesive layer is at least one of ethylene-vinyl acetate copolymer, polyethylene octene co-elastomer, water glue and optically transparent glue.

[0007] In one embodiment, the functional layer comprises:

[0008] A third transparent substrate is provided with a conductive layer on one side of the third transparent substrate close to the first bonding layer, and the projection of the third transparent substrate on the conductive layer covers the area where the conductive layer is located.

[0009] In one embodiment, the third transparent substrate is a transparent organic polymer film.

[0010] In one embodiment, the distance between the edge of the conductive layer and the edge of the third transparent substrate is 0 mm-5 mm, preferably 1 mm-3 mm.

[0011] In one embodiment, the third transparent substrate is retracted into the laminated component, and the distance between the edge of the third transparent substrate and the edge of the laminated component is greater than or equal to 3 mm, preferably 5 mm-10 mm.

[0012] In one embodiment, the thickness of the functional layer is 30 μm-250 μm, preferably 80 μm-200 μm, and more preferably 100 μm-150 μm.

[0013] In one embodiment, the thickness of the conductive layer is 3 μm-30 μm, preferably 5 μm-15 μm.

[0014] In one embodiment, the conductive layer includes: a metal mesh layer and an inert metal layer stacked in sequence, the metal mesh layer is adjacent to the third transparent substrate, and the mesh wire diameter of the metal mesh layer is 3 μm-30 μm.

[0015] In a second aspect, the present application also provides a vehicle comprising the laminated assembly in the above-mentioned embodiment.

[0016] The above-mentioned laminated assembly and vehicle have at least the following beneficial effects:

[0017] By placing a first adhesive layer capable of inhibiting or slowing down the ion migration of the conductive layer adjacent to the conductive layer and achieving bonding between the functional layer and the first transparent substrate, it is possible to effectively prevent the conductive layer from reacting with the adhesive material during long-term use, thereby preventing the metal atoms (such as copper and silver) of the conductive layer from migrating in the form of ions. This significantly reduces the problem of discoloration of the appearance caused by uneven distribution of metal atoms, which not only ensures the stability and reliability of the stacked component under long-term working conditions, but also extends its service life.

[0018] In addition, because the first adhesive layer can inhibit or slow down the migration of ions in the conductive layer, the stacked assembly provided in the embodiment of the present application can also reduce the short circuit problem caused by the uneven distribution of metal atoms, thereby improving the stability and reliability of the functional layer function. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0020] Figure 1 is one of the cross-sectional schematic diagrams of a stacked assembly in one or more embodiments;

[0021] Figure 2 is a second cross-sectional schematic diagram of a stacked assembly in one or more embodiments;

[0022] Figure 3 The third cross-sectional schematic diagram of a stacked assembly in one or more embodiments;

[0023] Figure 4 is a fourth cross-sectional schematic diagram of a stacked assembly in one or more embodiments;

[0024] Figure 5 FIG5 is a fifth schematic plan view of a stacked assembly in one or more embodiments;

[0025] Figure 6 This is the sixth cross-sectional schematic diagram of the stacked component in one or more embodiments.

[0026] Description of reference numerals:

[0027] 2-first transparent substrate, 4-first bonding layer, 6-functional layer, 62-conductive layer, 622-metal mesh layer, 624-inert metal layer, 64-Mini-LED pixel array, 66-third transparent substrate, 8-second bonding layer, 10-second transparent substrate. DETAILED DESCRIPTION

[0028] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. Preferred embodiments of the present invention are provided in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0029] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0030] In this document, spatially related terms such as "upper" and "lower" are defined with reference to the accompanying drawings. Therefore, it will be understood that "upper" and "lower" are used interchangeably. It will be understood that when a layer is referred to as being "on" another layer, it can be directly formed on the other layer, or intervening layers may also be present. Therefore, it will be understood that when a layer is referred to as being "directly on" another layer, there are no intervening layers interposed therebetween.

[0031] In the accompanying drawings, the sizes of layers and regions may be exaggerated for clarity. It is understood that when a layer or element is referred to as being "on" another layer or substrate, the layer or element may be directly on the other layer or substrate, or there may be intervening layers. In addition, it is also understood that when a layer is referred to as being "between" two layers, the layer may be the only layer between the two layers, or there may be one or more intervening layers. In addition, the same reference numerals always represent the same elements.

[0032] Hereinafter, although terms such as "first", "second", etc. may be used to describe various components, these components are not necessarily limited to the above terms. The above terms are only used to distinguish one component from another component. It will also be understood that expressions used in the singular form include plural expressions, unless the expression in the singular form has a significantly different meaning in the context. In addition, in the following embodiments, it will also be understood that the terms "comprising" and / or "having" used herein illustrate the presence of the stated features or components, but do not exclude the presence or addition of one or more other features or components.

[0033] In the following embodiments, when a layer, region, or element is "connected", it can be interpreted that the layer, region, or element is not only directly connected but also connected through other constituent elements placed therebetween. For example, when a layer, region, element, etc. is described as being connected or electrically connected, the layer, region, element, etc. can be connected or electrically connected not only directly or directly, but also through another layer, region, element, etc. placed therebetween.

[0034] As used in the application documents, the term "and / or" includes any and all combinations of one or more of the related listed items. When a statement such as "at least one (one) of..." is placed after a list of elements (elements), it modifies the entire list of elements (elements), rather than modifying the individual elements (elements) in the list (elements).

[0035] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by those skilled in the art to which the present invention pertains. The terms used herein in the specification of the application are only for the purpose of describing specific embodiments and are not intended to limit the present application. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0036] It should also be understood that the terms “include / comprises” or “having” and the like specify the presence of stated features, wholes, steps, operations, components, parts or combinations thereof, but do not exclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts or combinations thereof.

[0037] As described in the background technology, the smart glass in the prior art will have the problem of appearance discoloration and short circuit under long-term operation. The inventors have found that the reason for this problem is that the smart glass in the prior art will generate heat when realizing intelligent functions such as heating, luminescence, display and touch control. The bonding layer of the glass will break the chemical molecular bonds of the bonding layer material under the heating state (including self-heating and thermal environment), and will degrade and decompose, producing water and oxygen molecules such as CO2, CO, H2O, and the decomposed molecules of the bonding layer will be free under the heating state. In order to realize the above-mentioned intelligent functions, a conductive layer will be set in the smart glass. The metal atoms on the conductive layer will react with the bonding material of the laminated glass under the action of the electric field force between the positive and negative electrodes when the conductive layer is powered on for a long time, thereby causing the metal atoms to migrate from the positive electrode to the negative electrode in the form of ions, and the water and oxygen molecules decomposed in the bonding layer will be freed together under the heating state, and at the same time form an oxidation-reduction reaction with the metal mesh layer. This process will further make the metal atoms between the positive and negative electrodes unevenly distributed, thereby causing the appearance discoloration and short circuit problems of the laminated glass.

[0038] Based on the above reasons, in an exemplary embodiment, Figure 1 As shown, the present application provides a laminated component, which includes: a first transparent substrate 2, a first adhesive layer 4, a functional layer 6, a second adhesive layer 8 and a second transparent substrate 10 stacked in sequence. Among them, a conductive layer 62 is provided on the surface of the functional layer 6 close to the first adhesive layer 4, and the first adhesive layer 4 is used to inhibit or slow down the ion migration of the conductive layer 62. In an optional embodiment, the first adhesive layer 4 can be a single-layer or multi-layer composite structure composed of a material that inhibits or slows down the ion migration of the conductive layer 62.

[0039] Among them, the material that inhibits or slows down the migration of ions in the conductive layer can refer to a material that can work at a high voltage or a high current at room temperature, or work at a low voltage or a low current in a high temperature test box (not limited to the high temperature range), and has no discoloration in appearance and normal conductive function after aging for more than 1000 hours. The first transparent substrate 2 and the second transparent substrate 10 can be glass substrates. The functional layer 6 can refer to a structural layer with functions such as light emission, display, heat generation and touch control, such as Figure 1As shown, a conductive layer 62 is provided on the surface of the functional layer 6 close to the first bonding layer 4. The conductive layer 62 may refer to a metal mesh conductive film. The metal mesh conductive film is mainly formed by growing a conductive metal mesh pattern on a glass or PET plastic film using metal materials such as silver and copper, and has the characteristics of low resistivity and good bending resistance. In addition to the above-mentioned metal mesh conductive film, the conductive layer 62 may also be a commonly used ITO (indium tin oxide) film, or a nano silver wire laminated film. In the manufacturing process, the functional layer 6, the second bonding layer 8 and the second transparent substrate 10 may be pre-packaged to form an integral film layer, so that when the related products are assembled later, only the integral film layer needs to be installed at one time, reducing the cumbersome steps and time cost of installing each component one by one.

[0040] Exemplarily, the laminated assembly is composed of a first transparent substrate 2, a first adhesive layer 4, a functional layer 6 (including a conductive layer 62), a second adhesive layer 8 and a second transparent substrate 10 stacked in sequence. When the laminated assembly is bonded, the second adhesive layer 8 is not in contact with the conductive layer 62. The material selection of the second adhesive layer 8 can be based on the transmittance requirements, bonding process requirements, functional requirements (such as heat insulation, infrared insulation, ultraviolet insulation, sound insulation, etc.), etc. For example, polyvinyl butyral (PVB), thermoplastic polyurethane (TPU) and other materials can be selected. This is only for illustration and not for specific limitation. Since the first adhesive layer 4 is in direct contact with the conductive layer 62, the first adhesive layer 4 uses a material that can inhibit or slow down the migration of conductive layer ions. Since the material does not contain chloride ions, moisture, special functional group hydroxyl, etc. or contains a very low proportion, the material is stable in molecular decomposition under heat and does not ionize with the metal mesh electrons. It can effectively prevent or slow down the problem that metal atoms in the conductive layer 62 such as copper and silver react with the surrounding environment and migrate from the positive electrode to the negative electrode in the form of ions during long-term power-on and under the action of electric field force. The laminated assembly based on the above structure can significantly reduce or even avoid the appearance discoloration and short circuit problems caused by uneven distribution of metal atoms even in long-term use and continuous power supply.

[0041] In this embodiment, by using a material that can inhibit or slow down the migration of ions in the conductive layer as the adhesive material on the functional layer having a conductive layer on one side, the conductive layer is effectively prevented from reacting with the adhesive material during long-term use, thereby causing the metal atoms (such as copper and silver) of the conductive layer to migrate in the form of ions, thereby significantly reducing the appearance discoloration and short circuit problems caused by uneven distribution of metal atoms, which not only ensures the stability and reliability of the stacked component under long-term working conditions, but also extends its service life.

[0042] For better explanation, in the embodiment of the present application, an implementation scheme that takes into account both the functional realization of the functional layer and the problem of color change in the appearance of the stacked component is implemented by designing the first bonding layer. An example is provided here:

[0043] In an exemplary embodiment, taking the functional layer having a heat generating function as an example, Figure 2 As shown, the conductive layer 62 includes a metal mesh layer 622 and an inert metal layer 624 stacked in sequence, wherein the inert metal layer 624 is adjacent to the first bonding layer 4 .

[0044] For example, when current passes through the metal mesh layer 622, the metal mesh has a certain resistance, and the current will generate heat when passing through the resistance, and the adjacent inert metal layer 624 can play a role in assisting heat transfer, and can better transfer the heat generated by the metal mesh layer 622. When a material that can inhibit ion migration when the conductive layer is energized is selected as the first bonding layer 4, the heat generation function can be achieved while avoiding appearance discoloration and short circuit problems.

[0045] In an exemplary embodiment, taking the functional layer 6 having a light-emitting or display function as an example, Figure 3 As shown, the functional layer 6 may further include a Mini-LED pixel array 64 stacked on the conductive layer 62 and between the first bonding layer 4 .

[0046] For example, the specific stacking relationship between the conductive layer 62 and the Mini-LED pixel array 64 is as follows: Figure 3 As shown. The conductive layer 62 can provide the required electrical energy for the Mini-LED pixel array 64. When the electrical energy is transmitted to the Mini-LED pixel array 64 through the conductive layer 62, each tiny light-emitting unit in the Mini-LED pixel will work according to the received electrical signal. Under the current drive, the semiconductor structure inside them undergoes corresponding physical processes such as electron and hole recombination, thereby generating photons and emitting light outward. Many Mini-LED pixels work together, and through the combination of different pixel points turning on and off, color changes, etc., the overall light-emitting or display function of the functional layer 6 is finally realized. When used in conjunction with the first bonding layer 4 of a material that can inhibit ion migration when the conductive layer 62 is powered on, the light-emitting or display function can be realized without causing the problem of discoloration of the appearance.

[0047] In an exemplary embodiment, the material of the first adhesive layer 4 is at least one of ethylene-vinyl acetate copolymer, polyethylene octene co-elastomer, water glue and optically transparent glue.

[0048] For example, ethylene-vinyl acetate copolymer (EVA) has good chemical corrosion resistance and electrical insulation, and is not easy to react with metal atoms in the conductive layer 62, so it can effectively prevent the migration of metal atoms. At the same time, EVA can flow and solidify under heating conditions, which is suitable for hot pressing molding process, which helps to form a tight and uniform bonding layer, improve the overall strength and sealing of the entire laminated assembly, and compared with some other high-performance materials, the cost of EVA is relatively low. In addition to using ethylene-vinyl acetate copolymer as the material of the first bonding layer 4, polyethylene octene co-elastomer (POE) can also be used as the material of the first bonding layer 4. POE also has good chemical inertness. When the conductive layer 62 is powered on for a long time, POE will not react chemically with the conductive layer 62 to cause ion migration. Secondly, the first bonding layer 4 can also use water glue and optically clear adhesive (OCA, Optically Clear Adhesive), which can meet the high transmittance requirements while avoiding the first bonding layer 4 from reacting with the metal atoms in the conductive layer 62.

[0049] In this embodiment, materials such as EVA, POE, water-based glue and optically transparent glue that can inhibit or slow down the migration of ions in the conductive layer are selected as the material of the first bonding layer. Based on the ability of such materials to inhibit or slow down the migration of ions in the conductive layer, as well as their comprehensive excellent mechanical properties, chemical stability and processing characteristics, the laminated component of the present application can effectively solve the discoloration problem and ensure the long-term reliability of the product.

[0050] In an exemplary embodiment, Figure 2 and Figure 3 As shown, the functional layer 6 includes a third transparent substrate 66. A conductive layer 62 is provided on one side of the third transparent substrate 66 close to the first adhesive layer 4, and the projection of the third transparent substrate 66 on the conductive layer 62 covers the area where the conductive layer 62 is located.

[0051] For example, since the material of the conductive layer 62 is sensitive to the environment, especially to the components in some organic or inorganic adhesives. If the second junction layer directly contacts the conductive layer 62 during the packaging process of manufacturing, a chemical reaction may occur, resulting in discoloration of the film layer, or even degradation of the film layer performance, such as increased resistance or reduced transparency. The projection of the third transparent substrate 66 on the conductive layer 62 covers the entire area where the conductive layer 62 is located, and the third transparent substrate 66 is used as a barrier to ensure that the conductive layer 62 and the second adhesive layer 8 are effectively isolated, and the second adhesive layer 8 is prevented from directly contacting the conductive layer 62, thereby preventing possible chemical reactions or physical changes between the two, such as the components of the adhesive material penetrating into the conductive film layer, causing it to discolor or even degrade in performance. Therefore, under the above-mentioned structural design, the choice of materials for the second adhesive layer 8 is more extensive, and the materials for the second adhesive layer 8 can be more diversified according to the transmittance requirements, the bonding process requirements, the product functional requirements, etc.

[0052] In this embodiment, the conductive layer is fully covered by the third transparent substrate, which effectively isolates the second bonding layer from the conductive layer to prevent performance degradation caused by chemical reactions or physical changes. At the same time, the selection of the second bonding layer material is more flexible and diverse, and can be freely selected according to the transmittance, bonding process and product functional requirements. This ensures the stability and reliability of the functional layer while improving the design flexibility and scope of application of the entire device.

[0053] In an exemplary embodiment, the third transparent substrate 66 may be a single-layer or multi-layer composite structure composed of a thin film material with high transmittance and low haze.

[0054] Among them, thin film materials with high transmittance and low haze need to meet the conditions of working with high voltage or high current at room temperature, or working with low voltage or low current in a high temperature test chamber (not limited to high temperature range), and not changing color in appearance and functioning normally after aging for more than 1000 hours.

[0055] In an exemplary embodiment, the third transparent substrate 66 is a transparent organic polymer film.

[0056] For example, the third transparent substrate 66 uses an organic polymer film (such as a PET film) as a material, which has the advantages of being light, thin, flexible, and having good optical transparency, which not only helps to improve the flexibility and durability of the entire laminated component, but also can effectively reduce the overall weight and simplify the manufacturing process. Moreover, under the premise of using an organic polymer film as the third transparent substrate 66, due to the high transmittance of the organic polymer film, when the laminated component is used as automotive glass, the material selection of the second adhesive layer 8 is more flexible, and can be based on the transmittance requirements of the laminated component, such as selecting EVA with a higher transmittance, or PVB with a lower transmittance, which will not be given one by one here. In addition, the use of organic polymer films can also provide excellent chemical resistance and environmental aging resistance, thereby ensuring the stability and reliability of the conductive layer 62 under long-term working conditions.

[0057] In an exemplary embodiment, the functional layer further includes a heating layer, and the heating layer is disposed as follows Figure 3 Between the third transparent substrate 66 and the second adhesive layer 8 shown.

[0058] For example, when the functional layer includes a Mini-LED pixel array, by adding a heating layer, the functional layer, in addition to being able to realize the original light-emitting and display functions based on the Mini-LED pixel array, also has the functions of heating for defogger, defrost, and maintaining its own temperature in a low-temperature environment to ensure the stability of related performance such as display, so that it can be better used in scenarios such as outdoors and in-vehicle that may face complex environmental conditions such as low temperature and high humidity, further improving the practicality and adaptability of the entire functional layer.

[0059] In an exemplary embodiment, Figure 4 and Figure 5 As shown, the distance L1 between the edge of the conductive layer 62 and the edge of the third transparent substrate 66 is 0 mm-5 mm, preferably 1 mm-3 mm.

[0060] Exemplarily, the distance L1 between the edge of the conductive layer 62 and the edge of the third transparent substrate 66 is 0mm-5mm, which can ensure that even if a slight offset occurs during manufacturing or use, the second adhesive layer 8 will not directly contact the conductive layer 62 at this distance, thereby avoiding potential chemical reactions or physical changes, such as discoloration, increased resistance or reduced transparency. In addition, even if the adhesive material may spread slightly at the edge, the distance of 0mm-5mm also provides a certain safety buffer, reducing the risk of the adhesive material penetrating into the conductive layer 62. Further, the distance L1 between the edge of the conductive layer 62 and the edge of the third transparent substrate 66 is limited to 1mm-3mm, which can effectively isolate the second adhesive layer 8 and the conductive layer 62 without causing the gap to be too large, thereby avoiding the structural complexity and additional cost caused by the wide edge. In addition, the distance L1 between the edge of the conductive layer 62 and the edge of the third transparent substrate 66 is limited to between 1mm-3mm, which can also more effectively manage the edge area, reduce the uneven stress or heat distribution problems caused by the edge effect, and thus improve the reliability and stability of the entire functional layer 6.

[0061] In this embodiment, by setting the distance between the edge of the conductive layer and the edge of the third transparent substrate to 0mm-5mm, preferably 1mm-3mm, not only is a sufficient safety buffer zone provided during the manufacturing or use process to prevent the second adhesive layer from directly contacting the conductive layer and inducing chemical reactions or physical changes, but the risk of edge penetration is also effectively reduced; at the same time, the distance is further limited to 1mm-3mm, which not only ensures effective isolation, but also avoids the structural complexity and cost increase caused by the excessively wide edge, thereby improving the reliability and stability of the functional layer.

[0062] In an exemplary embodiment, Figure 4 and Figure 5 As shown, the third transparent substrate is retracted into the laminated assembly, and the distance L2 between the edge of the third transparent substrate 66 and the edge of the laminated assembly is greater than or equal to 3 mm, preferably 5 mm-10 mm.

[0063] For example, the distance between the edge of the third transparent substrate 66 and the edge of the stacked assembly may be as follows: Figure 4 and Figure 5The distance L2 between the edge of the third transparent substrate 66 and the edge of the second transparent substrate 10 (or the first transparent substrate 2) shown in the figure, if the edge of the third transparent substrate 66 is too close to the edge of the second transparent substrate 10 (or the first transparent substrate 2) (such as a distance less than 3mm), then during the manufacturing process, especially in the steps of alignment and bonding, it may cause higher process difficulty. Smaller edge spacing requires higher precision control, which increases the complexity and error risk in the production process. In addition, too close edges may also cause the material in the edge area to be stretched or deformed, affecting the overall quality and reliability of the product. Maintaining a certain edge distance can reduce stress concentration in the edge area and avoid structural damage or performance degradation caused by edge effects. For example, the edge area is susceptible to external environmental influences, such as moisture penetration or mechanical damage, and an appropriate edge distance helps protect the internal structure. Although a larger edge distance (such as a distance greater than 20mm) can further reduce the process difficulty and provide better protection, it will also increase material costs and occupy more space. Therefore, the distance can be limited to between 3mm-20mm, especially preferably 5mm-10mm, which can avoid unnecessary material waste and cost increase while ensuring sufficient process tolerance and structural stability.

[0064] In this embodiment, by setting the distance between the edge of the third transparent substrate and the edge of the stacked component (such as the second transparent substrate or the first transparent substrate) to be greater than or equal to 3 mm, preferably 5 mm-10 mm, not only the difficulty of alignment and bonding in the manufacturing process is reduced, the stress concentration in the edge area and the potential risk of structural damage are reduced, but also moisture penetration and mechanical damage are effectively prevented. At the same time, while ensuring sufficient process tolerance and structural stability, unnecessary material waste and cost increase are avoided, thereby improving the overall quality and reliability of the product.

[0065] In some embodiments, the combination of the laminated assembly can be: the first transparent substrate 2 and the second transparent substrate 10 are both glass substrates, the third transparent substrate 66 is a PET film, the first adhesive layer 4 is an EVA adhesive material, and the second adhesive layer 8 is a PVB material. Among them, the distance L1 between the edge of the conductive layer 62 and the edge of the third transparent substrate 66 is 0mm, and the distance L2 between the edge of the third transparent substrate 66 and the edge of the first transparent substrate 2 (or the second transparent substrate 10) is 5mm. The combination of the laminated assembly can also be: the first transparent substrate 2 and the second transparent substrate 10 are both glass substrates, the third transparent substrate 66 is a PET film, the first adhesive layer 4 is an EVA adhesive material, and the second adhesive layer 8 is a PVB material. Among them, the distance L1 between the edge of the conductive layer 62 and the edge of the third transparent substrate 66 is 2mm, and the distance L2 between the edge of the third transparent substrate 66 and the edge of the first transparent substrate 2 (or the second transparent substrate 10) is 5mm. The above-mentioned stacked components were subjected to reliability verification under the following conditions: 12V voltage was applied continuously and the working temperature of the functional layer 6 was maintained at 50°C ± 5°C for 1000 hours. After the reliability verification, no discoloration or short circuit problems were found in the stacked components.

[0066] In some embodiments, the combination of the laminated components can be: the first transparent substrate 2 and the second transparent substrate 10 are both glass substrates, the third transparent substrate 66 is a PET film, and the first adhesive layer 4 and the second adhesive layer 8 are both EVA adhesive materials. Among them, the distance L1 between the edge of the conductive layer 62 and the edge of the third transparent substrate 66 is 0mm, and the distance L2 between the edge of the third transparent substrate 66 and the edge of the first transparent substrate 2 (or the second transparent substrate 10) is 5mm. The combination of the laminated components can also be: the first transparent substrate 2 and the second transparent substrate 10 are both glass substrates, the third transparent substrate 66 is a PET film, and the first adhesive layer 4 and the second adhesive layer 8 are both EVA adhesive materials. Among them, the distance L1 between the edge of the conductive layer 62 and the edge of the third transparent substrate 66 is 2mm, and the distance L2 between the edge of the third transparent substrate 66 and the edge of the first transparent substrate 2 (or the second transparent substrate 10) is 5mm. The above-mentioned laminated components were subjected to reliability verification, and the verification conditions were: applying 12V voltage to continuously power on, and keeping the working temperature of the functional layer 6 at 50℃±5℃ for 1000 hours. After reliability verification, no discoloration problems were found in the laminated components. Furthermore, the reliability in high temperature environment was further verified by applying 12V voltage for continuous power supply and maintaining the working temperature of the functional layer 6 at 90°C for 1000 hours. No discoloration or short circuit problems were found in the laminated components.

[0067] Therefore, the laminated component in the above-mentioned embodiment can be used or placed for a long time without discoloration, short circuit problems and poor heating problems. When the laminated component is used as vehicle glass, the heating function of its functional layer can remove frost, fog and snow on its surface, thereby helping driving safety and improving the driving experience.

[0068] In an exemplary embodiment, the thickness of the functional layer 6 is 30 μm-250 μm, preferably 80 μm-200 μm, and more preferably 100 μm-150 μm.

[0069] Exemplarily, when the functional layer is used as a heating layer, the thickness of the functional layer 6 directly affects its thermal resistance and electrical conductivity. Although a thinner functional layer 6 (such as a thickness of less than 30 μm) can reduce thermal resistance and speed up the transfer of heat to the environment, it may cause the resistance to be too low, resulting in insufficient heat generated when the current passes through. On the contrary, an overly thick functional layer 6 (such as a thickness greater than 250 μm) will increase thermal resistance, slow down the heat transfer rate, and may increase resistance, resulting in unnecessary energy loss. Therefore, selecting a thickness of 30 μm-250 μm for the functional layer 6, preferably a thickness of 80 μm-200 μm, can achieve a better balance between thermal conductivity efficiency and resistance. Appropriate thickness helps to ensure a more uniform temperature distribution within the functional layer 6. If the functional layer 6 is too thin, local hot spots may be more likely to form, resulting in uneven temperatures; while being too thick may cause heat to be concentrated inside and the surface temperature to rise slowly. A thickness range of 100 μm-150 μm can provide good thermal diffusion properties, allowing the entire functional layer 6 to generate heat more evenly. Secondly, the functional layer 6 needs to have a certain mechanical strength to ensure structural stability, and also needs sufficient flexibility to adapt to different applications. A thickness of 80μm-200μm can provide good mechanical support to prevent damage due to stress concentration or bending during use. In particular, a thickness of 100μm-150μm maintains sufficient strength and good flexibility, which is suitable for a variety of application scenarios. In addition, an overly thick functional layer 6 not only increases material costs, but may also increase manufacturing difficulty and time. By controlling the thickness to 80μm-200μm, especially 100μm-150μm, effective cost control can be achieved while ensuring efficient heat generation.

[0070] In this embodiment, by setting the thickness of the functional layer to 30μm-250μm, preferably 80μm-200μm, and more preferably 100μm-150μm, not only a good balance is achieved between thermal conduction efficiency and resistance, ensuring uniform temperature distribution and efficient heat generation, but also sufficient mechanical strength and flexibility are provided to adapt to a variety of application scenarios, while effectively controlling material costs and manufacturing difficulty, thereby achieving the best comprehensive effect in improving heating efficiency, ensuring structural stability and economy.

[0071] In an exemplary embodiment, the thickness of the conductive layer 62 is 3 μm-30 μm, preferably 5 μm-15 μm.

[0072] For example, when the functional layer is used as a heating layer, in addition to the overall thickness of the functional layer affecting the heating effect, the thickness of the conductive layer on the functional layer will also affect its heating effect. The thickness of the conductive layer 62 directly affects its resistance value. A thinner film layer (such as a thickness of less than 3 μm) has a lower resistance, which can reduce the voltage drop, but may cause an increase in current density, which may cause local overheating. On the contrary, an overly thick film layer (such as a thickness greater than 30 μm) will increase the resistance. Although it can provide higher heating power, it may cause unnecessary energy loss and uneven heat distribution. Therefore, selecting a thickness of 3 μm-30 μm for the conductive layer 62, preferably a thickness of 5 μm-15 μm, can achieve a better balance between resistance and heat generation, ensuring uniform and efficient heat generation. Secondly, an appropriate thickness helps to ensure a more uniform temperature distribution within the conductive layer 62. If the film layer is too thin, local hot spots may be more likely to form, resulting in uneven temperature; while being too thick may cause heat to be concentrated inside and the surface temperature to rise slowly. The thickness range of 5 μm-15 μm can provide good heat diffusion characteristics, so that the entire film layer can generate heat more evenly, thereby improving the overall heating efficiency. The conductive layer 62 needs to have not only good conductivity, but also high transparency. In the range of 3 μm-30 μm, especially 5 μm-15 μm, it can ensure that the film layer has sufficient conductivity without significantly affecting transparency.

[0073] In this embodiment, by setting the thickness of the conductive layer to 3μm-30μm, preferably 5μm-15μm, not only a good balance is achieved between resistance and heat generation, ensuring uniform and efficient heat generation, but also the uniformity of temperature distribution within the film layer is guaranteed while maintaining a high degree of transparency, thereby achieving a better comprehensive effect in improving heating efficiency, optimizing thermal diffusion performance and maintaining optical quality.

[0074] In an exemplary embodiment, Figure 6As shown, the conductive layer 62 includes: a metal mesh layer 622 and an inert metal layer 624 stacked in sequence, the metal mesh layer 622 is adjacent to the third transparent substrate 66, and the mesh wire diameter of the metal mesh layer 622 is 3 μm-30 μm.

[0075] Exemplarily, the inert metal layer 624 can be made of a metal or alloy (such as gold, platinum, etc.) with stable chemical properties, which is not easy to oxidize or react with other substances at high temperatures. By covering the metal mesh layer 622 with a layer of inert metal layer 624, the metal mesh layer 622 can be effectively prevented from changing color due to oxidation or other chemical reactions during use, which not only maintains the appearance quality of the conductive layer 62, but also ensures its long-term stable working performance. The mesh wire diameter of the metal mesh layer 622 directly affects its resistance value and heat generation efficiency. A finer wire diameter (such as a wire diameter less than 3μm) can reduce the amount of material used and reduce the overall resistance, but may cause an increase in local current density, thereby generating hot spots. On the contrary, a thicker wire diameter (such as a wire diameter greater than 30μm) will increase resistance and may cause unnecessary energy loss. Selecting a wire diameter of 3μm-30μm can achieve a better balance between resistance and heat generation, ensuring uniform and efficient heat generation. In addition, an appropriate wire diameter also helps to optimize the heat diffusion characteristics, so that the entire film layer can generate heat more evenly, thereby improving the overall heating efficiency.

[0076] In this embodiment, by covering the metal mesh layer with an inert metal layer, discoloration due to oxidation or other chemical reactions is effectively prevented, thereby ensuring the long-term stability and appearance quality of the conductive layer; at the same time, the mesh wire diameter of the metal mesh layer is set to 3μm-30μm, which not only achieves a good balance between resistance and heat generation, avoiding local overheating and unnecessary energy loss, but also optimizes the heat diffusion characteristics, thereby improving the overall heating efficiency and uniformity.

[0077] Based on the same inventive concept, the present application also provides a vehicle (not shown) comprising the laminated assembly in the above embodiment.

[0078] It can be understood that the means of transportation in the embodiments of the present application can be any means of transportation with light transmission requirements, such as cars, airplanes, high-speed trains, etc., and the embodiments disclosed in the present application are not limited to this.

[0079] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0080] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A laminated assembly, characterized in that: The stacked assembly comprises: a first transparent substrate, a first adhesive layer, a functional layer, a second adhesive layer and a second transparent substrate stacked in sequence; Wherein, a conductive layer is provided on the surface of the functional layer close to the first bonding layer, and the first bonding layer is used to inhibit or slow down the ion migration of the conductive layer.

2. The stacked assembly according to claim 1, characterized in that: The material of the first adhesive layer is at least one of ethylene-vinyl acetate copolymer, polyethylene octene co-elastomer, water glue and optically transparent glue.

3. The stacked assembly according to any one of claims 1 to 2, characterized in that: The functional layer comprises: A third transparent substrate, wherein the conductive layer is disposed on a side of the third transparent substrate close to the first bonding layer, and a projection of the third transparent substrate on the conductive layer covers an area where the conductive layer is located.

4. The stacked assembly according to claim 3, characterized in that: The third transparent substrate is a transparent organic polymer film.

5. The stacked assembly according to claim 3, characterized in that: The distance between the edge of the conductive layer and the edge of the third transparent substrate is 0 mm-5 mm, preferably 1 mm-3 mm.

6. The stacked assembly according to claim 3, characterized in that: The third transparent substrate is retracted into the stacked component, and the distance between the edge of the third transparent substrate and the edge of the stacked component is greater than or equal to 3 mm, preferably 5 mm-10 mm.

7. The stacked assembly according to claim 3, characterized in that: The thickness of the functional layer is 30 μm-250 μm, preferably 80 μm-200 μm, and more preferably 100 μm-150 μm.

8. The stacked assembly according to claim 3, characterized in that: The thickness of the conductive layer is 3 μm-30 μm, preferably 5 μm-15 μm.

9. The stacked assembly according to claim 3, characterized in that: The conductive layer includes: a metal mesh layer and an inert metal layer stacked in sequence, the metal mesh layer is adjacent to the third transparent substrate, and the mesh wire diameter of the metal mesh layer is 3 μm-30 μm.

10. A means of transport, characterized in that: Comprising a stacked assembly as described in any one of claims 1-9.

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