Hemispherical harmonic oscillator batch chemical polishing device and polishing method

Abstract

The invention provides a hemispherical harmonic oscillator batch chemical polishing device and method.The hemispherical harmonic oscillator batch chemical polishing device comprises a frame, a control motor, a transmission mechanism and a batch rotary clamping mechanism, and the control motor, the transmission mechanism and the batch rotary clamping mechanism are fixed in the frame; the batch rotating and clamping mechanism comprises a rotating support and a plurality of hemispherical harmonic oscillator clamping devices, the hemispherical harmonic oscillator clamping devices are evenly arranged in the circumferential direction of the rotating support, any hemispherical harmonic oscillator clamping device is used for clamping and fixing one hemispherical harmonic oscillator, and the control motor controls the rotating support to rotate around the axis of the rotating support through the transmission mechanism. And batch uniform chemical polishing of the hemispherical harmonic oscillator is realized. The technical problem that the polishing quality and the polishing efficiency of the hemispherical harmonic oscillator cannot meet the requirements in the prior art can be solved.

Description

Technical Field

[0001] The invention belongs to the technical field of hemispherical resonator chemical polishing, and in particular relates to a hemispherical resonator batch chemical polishing device and a polishing method. Background Art

[0002] The hemispherical resonator gyroscope is a new type of vibrating gyroscope that uses the standing wave precession effect of the hemispherical resonator to sense the rotation of the base. Its vibration sensitive component is the hemispherical resonator. The quality factor of the hemispherical resonator is a key parameter to measure the performance of the hemispherical resonator. After the hemispherical resonator is machined, the scratches and cracks remaining on the machined surface, as well as surface impurities, surface water molecule absorption, surface chemical bond vibration, surface alkali metal atom absorption and other factors will further increase the surface loss of the resonator and greatly reduce the quality factor level of the resonator. At present, chemical polishing is usually used to eliminate the surface defects of mechanical processing, improve its damping characteristics, and significantly improve the quality factor level of the hemispherical resonator.

[0003] During the chemical polishing reaction, factors such as the contact between the hemispherical resonator and the corrosive liquid, the distribution of the corrosive liquid concentration, the distribution of the corrosive liquid temperature, and the transport of the corrosion products will have a certain degree of influence on the consistency of chemical polishing and the polishing effect. The commonly used chemical polishing tank is a static water bath heating tank. The concentration and temperature uniformity of the corrosive liquid in the tank are poor, and the transport effect of the corrosion products is poor. Each factor has spatial fluctuations, which makes the rate difference between different workpieces and different stages of polishing, which is easy to cause the chemical polishing rate to be not uniform. The control of the processing consistency of batch polishing is difficult and the operation is complicated. Uneven polishing will lead to uneven removal of the surface defect layer of the hemispherical resonator, further affecting its damping uniformity. At the same time, different polishing amounts at different positions will lead to uneven overall quality of the hemispherical resonator, thereby affecting the frequency difference characteristics of the hemispherical resonator and adversely affecting the comprehensive performance of the hemispherical resonator. Therefore, how to achieve high uniformity chemical polishing of the hemispherical resonator and realize batch operation is an urgent need for the hemispherical resonator to improve accuracy and rapid application. Summary of the invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art.

[0005] According to one aspect of the present invention, a hemispherical resonator batch chemical polishing device is provided, which includes: a frame, a control motor, a transmission mechanism and a batch rotary clamping mechanism, wherein the control motor, the transmission mechanism and the batch rotary clamping mechanism are fixed in the frame, the batch rotary clamping mechanism includes a rotating bracket and a plurality of hemispherical resonator clamping devices, the plurality of hemispherical resonator clamping devices are evenly arranged along the circumference of the rotating bracket, any hemispherical resonator clamping device is used to clamp and fix a hemispherical resonator, the control motor controls the rotating bracket to rotate around its own axis through the transmission mechanism, and realizes batch uniform chemical polishing of the hemispherical resonator.

[0006] Furthermore, the transmission mechanism includes a first steering gear, a rotating transmission rod and a second steering gear, the rotating bracket includes a bracket body and a third steering gear, the first steering gear is connected to the output shaft of the control motor, the rotating transmission rod is meshed with the first steering gear, the second steering gear is connected to the rotating transmission rod, the second steering gear is meshed with the third steering gear, and the third steering gear is connected to the bracket body.

[0007] Furthermore, any hemispherical resonator clamping device includes a base, a first sleeve and a second sleeve, the base is fixed on the bracket body, the hemispherical resonator is inserted into the second sleeve and the first sleeve in sequence, and the first sleeve is placed in the base.

[0008] Furthermore, the first sleeve has a plurality of gaps along the circumferential direction. When the hemispherical resonator is inserted into the first sleeve, the first sleeve is expanded outwards to fix and clamp the hemispherical resonator under the restriction of the base.

[0009] According to another aspect of the present invention, a method for batch chemical polishing of hemispherical resonators is provided. The method uses the batch chemical polishing device for hemispherical resonators as described above to achieve batch uniform chemical polishing of hemispherical resonators.

[0010] Further, the hemispherical resonator batch chemical polishing method comprises the following steps:

[0011] Step 1: clamping a plurality of hemispherical resonators on a rotating bracket through a plurality of hemispherical resonator clamping devices;

[0012] Step 2, adding a chemical polishing solution into the chemical etching tank;

[0013] Step 3, heating and circulating the polishing solution in real time;

[0014] Step 4, setting the speed of the control motor in the hemispherical resonator batch chemical polishing device;

[0015] Step 5, moving the hemispherical resonator batch chemical polishing device into the chemical etching tank body until the chemical polishing solution completely submerges the batch rotating clamping mechanism;

[0016] Step 6, controlling the chemical polishing time according to the chemical polishing amount requirement;

[0017] Step 7: After the chemical polishing is completed, the hemispherical resonator batch chemical polishing device is taken out and cleaned;

[0018] Step eight, control the motor to stop rotating, remove the hemispherical resonator, and complete the batch chemical polishing process.

[0019] Furthermore, in step 2, the chemical polishing solution is a mixture of hydrofluoric acid, concentrated sulfuric acid and propylene glycol, and the mixed volume ratio is 4: (2-3): (3-4).

[0020] Furthermore, in step three, the chemical polishing solution is heated to 50°C±3°C.

[0021] Furthermore, in step 4, the motor speed is controlled to be set to 15-20 rpm.

[0022] By applying the technical solution of the present invention, a batch chemical polishing device and polishing method of hemispherical resonators are provided. The device is provided with a plurality of hemispherical resonator clamping devices to realize batch clamping of a plurality of hemispherical resonators, and batch uniform chemical polishing of the hemispherical resonators is realized by controlling the rotation of the rotating bracket. The chemical polishing device of the present invention has a simple and effective structure, can realize batch improvement of the quality factor of hemispherical resonators, and provide strong technical support for improving the performance of hemispherical resonator gyroscopes. Compared with the prior art, the technical solution of the present invention can solve the technical problem that the polishing quality and polishing efficiency of hemispherical resonators in the prior art cannot meet the requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The included drawings are used to provide a further understanding of the embodiments of the present invention, which constitute a part of the specification, are used to illustrate the embodiments of the present invention, and together with the text description, explain the principles of the present invention. Obviously, the drawings in the following description are only some embodiments of the present invention, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0024] Figure 1 It shows a schematic structural diagram of a hemispherical resonator batch chemical polishing device provided according to a specific embodiment of the present invention;

[0025] Figure 2 It shows a structural schematic diagram of a batch rotary clamping mechanism provided according to a specific embodiment of the present invention;

[0026] Figure 3 A schematic structural diagram of a hemispherical resonator clamping device provided according to a specific embodiment of the present invention is shown;

[0027] Figure 4A schematic structural diagram of a hemispherical resonator provided according to a specific embodiment of the present invention is shown.

[0028] The above drawings include the following reference numerals:

[0029] 1. Frame, 2. Control motor, 3. Rotating bracket, 4. First steering gear, 5. Rotating transmission rod, 6. Second steering gear, 7. Hemispherical resonator clamping device, 8. Hemispherical resonator, 9. Bracket body, 10. Third steering gear, 11. Base, 12. First sleeve, 13. Second sleeve. DETAILED DESCRIPTION

[0030] It should be noted that, in the absence of conflict, the embodiments in this application and the features in the embodiments can be combined with each other. The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is by no means intended to limit the present invention and its application or use. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0032] Unless otherwise specifically stated, the relative arrangement, numerical expressions and numerical values ​​of the parts and steps set forth in these embodiments do not limit the scope of the present invention. Meanwhile, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to the actual proportional relationship. The technology, method and equipment known to those of ordinary skill in the relevant art may not be discussed in detail, but in appropriate cases, the technology, method and equipment should be considered as a part of the specification. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, and therefore, once a certain item is defined in an accompanying drawing, it does not need to be further discussed in subsequent drawings.

[0033] like Figures 1 to 4As shown, according to a specific embodiment of the present invention, a hemispherical resonator batch chemical polishing device is provided, and the device includes: a frame 1, a control motor 2, a transmission mechanism and a batch rotation clamping mechanism, the control motor 2, the transmission mechanism and the batch rotation clamping mechanism are fixed in the frame 1, the batch rotation clamping mechanism includes a rotating bracket 3 and a plurality of hemispherical resonator clamping devices 7, the plurality of hemispherical resonator clamping devices 7 are evenly arranged along the circumference of the rotating bracket 3, any hemispherical resonator clamping device 7 is used to clamp and fix a hemispherical resonator, the control motor 2 controls the rotating bracket 3 to rotate around its own axis through the transmission mechanism, so as to realize batch uniform chemical polishing of the hemispherical resonator.

[0034] By applying this configuration, a batch chemical polishing device for hemispherical resonators is provided, wherein a plurality of hemispherical resonator clamping devices are provided to realize batch clamping of a plurality of hemispherical resonators, and batch uniform chemical polishing of the hemispherical resonators is realized by controlling the rotation of the rotating bracket. The chemical polishing device of the present invention has a simple and effective structure, can realize batch improvement of the quality factor of hemispherical resonators, and provides strong technical support for improving the performance of hemispherical resonator gyroscopes.

[0035] Further, in the present invention, the transmission mechanism can be configured to include a first steering gear 4, a rotation transmission rod 5 and a second steering gear 6, the rotating bracket 3 includes a bracket body 9 and a third steering gear 10, the first steering gear 4 is connected to the output shaft of the control motor 2, the rotation transmission rod 5 is meshed with the first steering gear 4, the second steering gear 6 is connected to the rotation transmission rod 5, the second steering gear 6 is meshed with the third steering gear 10, and the third steering gear 7 is connected to the bracket body 9. Through the above transmission setting, the control motor can realize the rotation control of the rotating bracket.

[0036] Further, in the present invention, any hemispherical resonator clamping device 7 can be configured to include a base 11, a first sleeve 12 and a second sleeve 13, the base 11 is fixed on the bracket body 9, the hemispherical resonator 8 is inserted into the second sleeve 13 and the first sleeve 12 in sequence, and the first sleeve 12 is placed in the base 11. Through the setting of the above-mentioned clamping device, the hemispherical resonator can be effectively clamped, which is convenient for the installation and removal of the hemispherical resonator.

[0037] As a specific embodiment of the present invention, the first sleeve 12 has a plurality of gaps along the circumferential direction. When the hemispherical resonator 8 is inserted into the first sleeve 12 , the first sleeve 12 is expanded outwards and fixedly clamps the hemispherical resonator under the restriction of the base 11 .

[0038] The beneficial effects of the present invention compared with the prior art are as follows:

[0039] (1) The present invention proposes a batch chemical polishing device for hemispherical resonators, which can achieve batch and rapid improvement of the quality factor of hemispherical resonators;

[0040] (1) The hemispherical resonator batch chemical polishing device proposed in the present invention can realize the revolution of the hemispherical resonator during the chemical polishing process, ensure the uniformity of chemical polishing at each position of the resonator, and solve the adverse effects of factors such as uneven contact between the hemispherical resonator and the etching liquid, uneven distribution of etching liquid concentration, uneven distribution of etching liquid temperature, and untimely transportation of corrosion products on the consistency and polishing effect of chemical polishing.

[0041] According to another aspect of the present invention, a method for batch chemical polishing of hemispherical resonators is provided. The method uses the batch chemical polishing device for hemispherical resonators as described above to achieve batch uniform chemical polishing of hemispherical resonators.

[0042] Specifically, the hemispherical resonator batch chemical polishing method comprises the following steps:

[0043] Step 1: clamp a plurality of hemispherical resonators on the rotating bracket 3 through a plurality of hemispherical resonator clamping devices 7;

[0044] Step 2, adding a chemical polishing solution into the chemical etching tank;

[0045] Step 3, heating and circulating the polishing solution in real time;

[0046] Step 4, setting the speed of the control motor 2 in the hemispherical resonator batch chemical polishing device;

[0047] Step 5, moving the hemispherical resonator batch chemical polishing device into the chemical etching tank body until the chemical polishing solution completely submerges the batch rotating clamping mechanism;

[0048] Step 6, controlling the chemical polishing time according to the chemical polishing amount requirement;

[0049] Step 7: After the chemical polishing is completed, the hemispherical resonator batch chemical polishing device is taken out and cleaned;

[0050] Step eight, control the motor to stop rotating, remove the hemispherical resonator, and complete the batch chemical polishing process.

[0051] The batch chemical polishing method of the hemispherical resonator provided by the present invention can realize the revolution of the hemispherical resonator during the chemical polishing process, ensure the uniformity of chemical polishing at each position of the resonator, and solve the adverse effects on the consistency and polishing effect of chemical polishing caused by factors such as uneven contact between the hemispherical resonator and the etching liquid, uneven distribution of the etching liquid concentration, uneven distribution of the etching liquid temperature, and untimely transportation of corrosion products.

[0052] In order to have a further understanding of the present invention, the batch chemical polishing method of the hemispherical resonator of the present invention is described in detail below in conjunction with specific embodiments.

[0053] According to a specific embodiment of the present invention, a hemispherical resonator batch chemical polishing method is provided, which includes the following steps.

[0054] Step 1: clamp a plurality of hemispherical resonators on the rotating bracket 3 through a plurality of hemispherical resonator clamping devices 7;

[0055] Step 2: Add a chemical polishing solution into the chemical etching tank, wherein the chemical polishing solution is a mixture of hydrofluoric acid, concentrated sulfuric acid and propylene glycol, and the mixed volume ratio is 4: (2-3): (3-4);

[0056] Step 3, heating the chemical polishing solution to 50°C ± 3°C, and realizing real-time circulation of the chemical polishing solution through a circulating filter pump to ensure uniformity of concentration and temperature in the chemical polishing solution;

[0057] Step 4, setting the speed of the control motor 2 in the hemispherical resonator batch chemical polishing device to 15-20 rpm;

[0058] Step 5, moving the hemispherical resonator batch chemical polishing device into the chemical etching tank body until the chemical polishing solution completely submerges the batch rotating clamping mechanism;

[0059] Step 6, start timing, and control the chemical polishing time according to the chemical polishing amount requirement;

[0060] Step 7: After the time is up, take out the hemispherical resonator batch chemical polishing device and rinse it thoroughly in deionized water;

[0061] Step 8: Control the motor to stop rotating, remove the hemispherical resonator, and complete the batch chemical polishing process.

[0062] In summary, the present invention provides a hemispherical resonator batch chemical polishing device and polishing method, the device is provided with a plurality of hemispherical resonator clamping devices to achieve batch clamping of a plurality of hemispherical resonators, and batch uniform chemical polishing of the hemispherical resonators is achieved by controlling the rotation of the rotating bracket. The chemical polishing device of the present invention has a simple and effective structure, can achieve batch improvement of the quality factor of the hemispherical resonator, and provide strong technical support for the performance improvement of the hemispherical resonator gyroscope. Compared with the prior art, the device can solve the technical problem that the polishing quality and polishing efficiency of the hemispherical resonator in the prior art cannot meet the requirements.

[0063] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0064] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. If not otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of the present invention.

[0065] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A hemispherical resonator batch chemical polishing device, characterized in that: The hemispherical resonator batch chemical polishing device comprises: a frame (1), a control motor (2), a transmission mechanism and a batch rotary clamping mechanism. The control motor (2), the transmission mechanism and the batch rotary clamping mechanism are fixed in the frame (1). The batch rotary clamping mechanism comprises a rotary bracket (3) and a plurality of hemispherical resonator clamping devices (7). The plurality of hemispherical resonator clamping devices (7) are evenly arranged along the circumference of the rotary bracket (3). Any hemispherical resonator clamping device (7) is used to clamp and fix a hemispherical resonator. The control motor (2) controls the rotary bracket (3) to rotate around its own axis through the transmission mechanism, thereby realizing batch uniform chemical polishing of the hemispherical resonators.

2. The hemispherical resonator batch chemical polishing device according to claim 1 is characterized in that: The transmission mechanism comprises a first steering gear (4), a rotating transmission rod (5) and a second steering gear (6); the rotating bracket (3) comprises a bracket body (9) and a third steering gear (10); the first steering gear (4) is connected to the output shaft of the control motor (2); the rotating transmission rod (5) is meshed with the first steering gear (4); the second steering gear (6) is connected to the rotating transmission rod (5); the second steering gear (6) is meshed with the third steering gear (10); and the third steering gear (7) is connected to the bracket body (9).

3. The hemispherical resonator batch chemical polishing device according to claim 1 is characterized in that: Any hemispherical resonator clamping device (7) comprises a base (11), a first sleeve (12) and a second sleeve (13); the base (11) is fixed on the bracket body (9); the hemispherical resonator (8) is inserted into the second sleeve (13) and the first sleeve (12) in sequence; and the first sleeve (12) is placed in the base (11).

4. The hemispherical resonator batch chemical polishing device according to claim 3 is characterized in that: The first sleeve (12) has a plurality of slits along the circumferential direction. When the hemispherical resonator (8) is inserted into the first sleeve (12), the first sleeve (12) is expanded outwards to fix and clamp the hemispherical resonator under the restriction of the base (11).

5. A hemispherical resonator batch chemical polishing method, characterized in that: The method uses the hemispherical resonator batch chemical polishing device as described in claims 1 to 4 to achieve batch uniform chemical polishing of hemispherical resonators.

6. The hemispherical resonator batch chemical polishing method according to claim 5, characterized in that: The hemispherical resonator batch chemical polishing method comprises the following steps: Step 1: clamping a plurality of hemispherical resonators on a rotating bracket through a plurality of hemispherical resonator clamping devices; Step 2, adding a chemical polishing solution into the chemical etching tank; Step 3, heating and circulating the polishing solution in real time; Step 4, setting the speed of the control motor in the hemispherical resonator batch chemical polishing device; Step 5, moving the hemispherical resonator batch chemical polishing device into the chemical etching tank body until the chemical polishing solution completely submerges the batch rotating clamping mechanism; Step 6, controlling the chemical polishing time according to the chemical polishing amount requirement; Step 7: After the chemical polishing is completed, the hemispherical resonator batch chemical polishing device is taken out and cleaned; Step eight, control the motor to stop rotating, remove the hemispherical resonator, and complete the batch chemical polishing process.

7. The hemispherical resonator batch chemical polishing method according to claim 6, characterized in that: In step 2, the chemical polishing solution is a mixture of hydrofluoric acid, concentrated sulfuric acid and propylene glycol, and the mixed volume ratio is 4: (2-3): (3-4).

8. The hemispherical resonator batch chemical polishing method according to claim 6, characterized in that: In step three, the chemical polishing solution is heated to 50°C ± 3°C.

9. The hemispherical resonator batch chemical polishing method according to claim 6, characterized in that: In step 4, the motor speed is controlled to be set to 15-20 rpm.

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