Roughening method of RTF electronic copper foil, RTF electronic copper foil and electronic product

Abstract

The invention relates to the technical field of electronic copper foils, in particular to a roughening method of an RTF electronic copper foil, the RTF electronic copper foil and an electronic product. The coarsening method comprises the following steps: coarsening the surfaces of the two sides of a raw foil by adopting a coarsening solution to form coarsened surfaces on the two sides; the roughening solution comprises the following components: 15g / L-40g / L of copper, 30g / L-60g / L of sulfuric acid, 1g / L-5g / L of phosphoric acid and water, and the roughened surface of the RTF electronic copper foil treated by the roughening solution can obtain ideal surface roughness, so that the surface area of a copper foil layer is remarkably increased, and a solid foundation is laid for subsequently improving the binding force with a base material.

Description

Technical Field

[0001] The present disclosure relates to the technical field of electronic copper foil, and in particular to a roughening method of RTF electronic copper foil, RTF electronic copper foil and electronic products. Background Art

[0002] As one of the basic materials of the electronics industry, RTF electronic copper foil is widely used in printed circuit boards (PCBs), lithium-ion batteries and other fields. Its performance directly affects the overall quality and performance of electronic products. In the traditional RTF electronic copper foil roughening process, it is difficult to simultaneously achieve an extremely low profile on the copper foil surface and effectively improve the bonding strength between the copper foil and the substrate. Summary of the invention

[0003] According to a first aspect of the present disclosure, a method for roughening an RTF electronic copper foil is provided, comprising the following steps: roughening the double-sided surfaces of the original foil with a roughening solution to form double-sided roughened surfaces; the roughening solution comprises the following components: 15 g / L to 40 g / L copper, 30 g / L to 60 g / L sulfuric acid, 1 g / L to 5 g / L phosphoric acid and water.

[0004] In an exemplary embodiment of the present disclosure, based on the above scheme, the temperature of the roughening solution is 15°C to 25°C.

[0005] In an exemplary embodiment of the present disclosure, based on the above-mentioned solution, the time of the roughening process is 3s to 10s.

[0006] In an exemplary embodiment of the present disclosure, based on the above-mentioned solution, the transmission speed of the raw foil in the roughening process is 0.5 m / min to 14 m / min.

[0007] In an exemplary embodiment of the present disclosure, based on the above scheme, the pH value of the roughening solution is 0.5-3.

[0008] In an exemplary embodiment of the present disclosure, based on the above scheme, the current density of the roughening treatment is 10A / dm 2 ~50A / dm 2 .

[0009] According to a second aspect of the present disclosure, there is provided an RTF electronic copper foil, which is roughened by the roughening method of the first aspect.

[0010] According to a third aspect of the present disclosure, an electronic product is provided, comprising the electronic copper foil according to the second aspect of the present disclosure.

[0011] It can be seen from the above technical solution that the present disclosure has the following positive effects:

[0012] In the roughening method of the RTF electronic copper foil disclosed in the present invention, the roughened surface of the RTF electronic copper foil treated with the roughening solution can obtain an ideal surface roughness, thereby significantly increasing the surface area of ​​the copper foil layer, laying a solid foundation for subsequently improving the bonding strength with the substrate.

[0013] Furthermore, the RTF electronic copper foil obtained by the RTF roughening method disclosed in the present invention has higher tensile strength and greater elongation, and can remain in a non-oxidized state under high-temperature baking at 250 degrees Celsius. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The above and other features and advantages of the present disclosure will become more apparent by describing in detail example embodiments thereof with reference to the attached drawings.

[0015] Figure 1 It is a schematic structural diagram of an RTF electronic copper foil in an embodiment of the present disclosure.

[0016] Figure 2 1 is a surface structure diagram of the roughened surface of the RTF electronic copper foil in Example 1 of the present disclosure.

[0017] The main components in the figure are described as follows:

[0018] 10. RTF electronic copper foil; 101. Roughened surface. DETAILED DESCRIPTION

[0019] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be comprehensive and complete and will fully convey the concepts of the example embodiments to those skilled in the art. The same reference numerals in the figures represent the same or similar structures, and thus their detailed description will be omitted.

[0020] An embodiment of the present disclosure provides a method for roughening an RTF electronic copper foil, comprising the following steps: roughening the double-sided surfaces of the original foil with a roughening solution to form a double-sided roughened surface. The roughening solution comprises the following components: 15 g / L to 40 g / L copper, 30 g / L to 60 g / L sulfuric acid, 1 g / L to 5 g / L phosphoric acid, and water. The roughened surface of the RTF electronic copper foil treated with the roughening solution can obtain an ideal surface roughness, thereby significantly increasing the surface area of ​​the copper foil layer, laying a solid foundation for subsequently improving the bonding strength with the substrate. Furthermore, the RTF electronic copper foil obtained by the RTF roughening method disclosed in the present disclosure has a high tensile strength and a large elongation, and can remain in an oxidation-free state under high-temperature baking at 250 degrees Celsius.

[0021] When the roughening solution disclosed in the present invention roughens the RTF electronic copper foil, the copper ions, sulfuric acid and phosphoric acid cooperate with each other at corresponding concentrations to achieve fine control of the microstructure of the copper foil surface.

[0022] Among them, sulfuric acid with a concentration of 30g / L to 60g / L can effectively etch the surface of copper foil and control the surface roughness of copper foil. Phosphoric acid with a concentration of 1g / L to 5g / L can play a good role in buffering and assisting the etching of sulfuric acid, making the surface roughness of the roughened surface of the copper foil more uniform and reducing the risk of over-etching or uneven etching. During the roughening process, copper with a concentration of 15g / L-40g / L helps maintain the electrochemical balance of the solution and ensure the stability and sustainability of the roughening process. The roughened surface of the electronic copper foil treated with the roughening solution can obtain an ideal surface roughness, thereby significantly increasing the surface area of ​​the copper foil layer, laying a solid foundation for the subsequent improvement of the bonding strength with the substrate.

[0023] In some embodiments, when the surface of the electronic copper foil is roughened by the roughening solution of the present disclosure, the roughness Rz of the roughened surface of the electronic copper foil can be made less than 2 μm, thereby obtaining an extremely low-profile RTF electronic copper foil.

[0024] At the same time, compared with the existing roughening solution, the roughening solution disclosed in the present invention can increase the surface area of ​​the RTF electronic copper foil by 200% to 500%, greatly improving the bonding force between the roughened surface of the RTF electronic copper foil and the substrate.

[0025] It can be understood that in the roughening solution of the present disclosure, the concentration of each component is expressed based on the volume of the roughening solution, and the mass of each component is based on the concentration of the volume of the roughening solution.

[0026] For example, the concentration of copper indicates the concentration of the mass of copper based on the volume of the roughening solution. Optionally, the concentration of copper can be, but is not limited to, 15 g / L, 18 g / L, 20 g / L, 22 g / L, 25 g / L, 28 g / L, 30 g / L, 32 g / L, 35 g / L, 38 g / L, 40 g / L. It is understood that the concentration of copper can also be other suitable selections within the range of 15 g / L-40 g / L.

[0027] For example, the concentration of sulfuric acid indicates the mass of sulfuric acid based on the volume of the roughening solution. Optionally, the concentration of sulfuric acid can be, but is not limited to, 30 g / L, 32 g / L, 35 g / L, 38 g / L, 40 g / L, 42 g / L, 45 g / L, 48 g / L, 50 g / L, 52 g / L, 55 g / L, 58 g / L, 60 g / L. It is understood that the concentration of sulfuric acid can also be other suitable selections within the range of 30 g / L to 60 g / L.

[0028] For example, the concentration of phosphoric acid indicates the concentration of the mass of phosphoric acid based on the volume of the roughening solution. Optionally, the concentration of phosphoric acid can be, but is not limited to, 1 g / L, 1.2 g / L, 1.5 g / L, 1.8 g / L, 2 g / L, 2.2 g / L, 2.5 g / L, 2.8 g / L, 3 g / L, 3.2 g / L, 3.5 g / L, 3.8 g / L, 4 g / L, 4.2 g / L, 4.5 g / L, 4.8 g / L, 5 g / L. It is understood that the concentration of phosphoric acid can also be other suitable selections within the range of 1 g / L to 5 g / L.

[0029] In some embodiments, the roughening solution is composed of the following components: 15 g / L-40 g / L copper, 30 g / L-60 g / L sulfuric acid, 1 g / L-5 g / L phosphoric acid, and water. It is understood that in the roughening solution of this embodiment, the concentration of copper, the concentration of sulfuric acid, and the concentration of phosphoric acid can be selected from the concentrations listed above, which will not be repeated here.

[0030] In some embodiments, the pH value of the roughening solution is 0.5 to 3. The pH value in this range can further improve the roughening effect, so that the roughened surface of the RTF electronic copper foil can better balance the extremely low profile and the larger surface area. Optionally, the pH value of the roughening solution can be 0.5, 0.8, 1, 1.2, 1.5, 1.8, 2, 2.2, 2.5, 2.8, 3. It is understood that the pH value of the roughening solution can also be other suitable choices within the range of 0.5 to 3.

[0031] In some embodiments, when preparing RTF electronic copper foil, the thickness of the original foil is 4 μm to 12 μm, and based on the original foil within this thickness range, RTF electronic copper foil with better performance can be obtained. Further preferably, the thickness of the original foil is 4 μm, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, or 12 μm.

[0032] It is understandable that the raw foil can be a copper foil obtained by electrolytic deposition, or a copper foil obtained by electrolytic deposition after some surface treatment. It is also understandable that when naming the copper foil, the "raw foil" and "copper foil" in the present disclosure do not strictly distinguish the copper foil, and the "raw foil" and "copper foil" are only formally distinguished between copper foils at different processing stages.

[0033] In some embodiments, the temperature of the roughening solution is 15°C to 25°C. During the roughening treatment, if the temperature of the roughening solution is too low, the roughening efficiency is low, and the activity of the roughening solution is low, it is difficult to obtain a good roughening effect; when the temperature of the roughening solution is too high, on the one hand, too much energy is consumed, and on the other hand, the roughening speed may be too fast, making it difficult to control the stable growth of the surface area of ​​the roughened surface of the RTF electronic copper foil. Optionally, during the roughening treatment, the temperature of the roughening solution can be but is not limited to 15°C, 16°C, 17°C, 18°C, 19°C, 20°C, 21°C, 22°C, 23°C, 24°C, 25°C. It is understandable that the temperature of the roughening solution can also be other suitable choices within the range of 15°C to 25°C.

[0034] In some embodiments, the current density of the roughening process is 10A / dm 2 ~50A / dm 2 During the roughening treatment, if the current density of the roughening treatment is too small, it is difficult to obtain a high roughening efficiency, and if the current density of the roughening treatment is too large, it may be difficult to obtain a roughened surface with good consistency. Optionally, during the roughening treatment, the current density of the roughening treatment can be but is not limited to 10A / dm 2 、15A / dm 2 、20A / dm 2 、25A / dm 2 、30A / dm 2 、35A / dm 2 、40A / dm 2 、45A / dm 2 、50A / dm 2 It is understood that the current density of the roughening treatment can also be 10A / dm 2 ~50A / dm 2 Make other appropriate choices within the scope.

[0035] In some embodiments, the time of the roughening treatment is 3s to 10s. During the roughening treatment, if the time of the roughening treatment is too short, it is difficult to obtain a good roughening effect. If the time of the roughening treatment is too long, on the one hand, it will produce higher energy consumption, and on the other hand, it may cause excessive damage to the RTF electronic copper foil, affecting the performance of the RTF electronic copper foil. Optionally, during the roughening treatment, the time of the roughening treatment can be but is not limited to 3s, 4s, 5s, 6s, 7s, 8s, 9s, 10s. It is understandable that the time of the roughening treatment can also be other suitable choices within the range of 3s to 10s.

[0036] In some embodiments, the transmission speed of the original foil in the roughening process is 0.5m / min to 14m / min. During the roughening process, if the transmission speed of the original foil is too small, it may result in excessive roughening, which may cause excessive damage to the RTF electronic copper foil and affect the performance of the RTF electronic copper foil. If the transmission speed of the original foil is too large, it is difficult to obtain a sufficient roughening effect, which affects the performance of the roughened surface of the RTF electronic copper foil. Optionally, during the roughening process, the transmission speed of the original foil can be but is not limited to 0.5m / min, 0.8m / min, 1m / min, 2m / min, 3m / min, 4m / min, 5m / min, 6m / min, 7m / min, 8m / min, 9m / min, 10m / min, 11m / min, 12m / min, 13m / min, 14m / min. It is understandable that during the roughening process, the transmission speed of the original foil can also be other suitable choices within the range of 0.5m / min to 14m / min.

[0037] An embodiment of the present disclosure provides an RTF electronic copper foil, which is roughened by the above-mentioned roughening method.

[0038] An embodiment of the present disclosure provides a method for preparing an RTF electronic copper foil, comprising the following steps: obtaining a roughened copper foil by using the above-mentioned roughening method;

[0039] performing an anti-oxidation treatment on the surface of the roughened copper foil to obtain an anti-oxidation copper foil;

[0040] The roughened surface of the anti-oxidation copper foil is subjected to silane coating treatment. Optionally, the RTF electronic copper foil can be prepared by an integrated electronic copper foil production device, which can continuously produce the three key processes of foil production, roughening and anti-oxidation online, thereby improving the production efficiency of the electronic copper foil.

[0041] See also Figure 1 , which shows an RTF electronic copper foil 10 in an embodiment of the present disclosure. The RTF electronic copper foil 10 has two roughened surfaces 101 arranged opposite to each other. The roughness Rz of the two roughened surfaces 101 of the RTF electronic copper foil in an embodiment of the present disclosure is less than 2 μm.

[0042] Example 1

[0043] The roughening method of the RTF electronic copper foil in this embodiment includes the following steps:

[0044] The roughening solution is used to roughen the double-sided surface of the original foil to form a double-sided roughened surface to obtain a roughened copper foil. The roughening solution includes the following components: 25g / L copper, 45g / L sulfuric acid, 3g / L phosphoric acid and water. The temperature of the roughening solution is 20°C. The current density of the roughening treatment is 20A / dm 2The roughening treatment time was 5 s. The conveying speed of the original foil during the roughening treatment was 5 m / min.

[0045] See also Figure 2 , which shows the surface structure of the roughened surface 101 of the RTF electronic copper foil 10 in Example 1. As can be seen from the figure, the roughened surface has good density and large specific surface area.

[0046] Examples 2 to 5, Comparative Examples 1 to 6

[0047] Compared with Example 1, the differences between Examples 2 to 5 and Comparative Examples 1 to 6 are shown in Table 1.

[0048] Comparative Example 7

[0049] The roughening method of the RTF electronic copper foil in this comparative example comprises the following steps:

[0050] The roughening solution was used to roughen the double-sided surfaces of the original foil with a thickness of 5 μm to form a double-sided roughened surface, thereby obtaining a roughened copper foil. The roughening solution included the following components: 10 g / L copper, 80 g / L sulfuric acid, 1 g / L iron, 2 g / L molybdenum, and water. The temperature of the roughening solution was 20°C.

[0051] The roughness of the roughened surface of the RTF electronic copper foil obtained in Examples 1 to 5 and Comparative Examples 1 to 7 (Rz, in micrometers), the peel strength between the roughened surface and the epoxy resin substrate after hot pressing at 200°C for 3 hours (in kg / cm), and the tensile strength of the RTF electronic copper foil (in kg / mm 2 ), the elongation of the RTF electronic copper foil and the oxidation condition of the RTF electronic copper foil after baking at 200°C for 3h were tested, and the results are shown in Table 1.

[0052] Table 1

[0053]

[0054] It can be seen from Table 1 that the roughened surface of the RTF electronic copper foil in the embodiment has a smaller Rz and has good bonding strength with the substrate. At the same time, the RTF electronic copper foil has higher tensile strength and greater elongation, and has better anti-oxidation performance.

[0055] It should be understood that the present disclosure does not limit its application to the detailed structure and arrangement of the components proposed in the present disclosure. The present disclosure can have other embodiments and can be implemented and executed in a variety of ways. The aforementioned variations and modifications fall within the scope of the present disclosure. It should be understood that the present disclosure and the limited present disclosure extend to all alternative combinations of two or more individual features mentioned or evident in the text and / or the drawings. All of these different combinations constitute multiple alternative aspects of the present disclosure. The embodiments described in the present disclosure illustrate the best modes known for implementing the present disclosure and will enable those skilled in the art to utilize the present disclosure.

Claims

1. A method for roughening RTF electronic copper foil, characterized in that: The steps include: The double-sided surfaces of the original foil are roughened by using a roughening solution to form double-sided roughened surfaces; the roughening solution includes the following components: 15 g / L to 40 g / L copper, 30 g / L to 60 g / L sulfuric acid, 1 g / L to 5 g / L phosphoric acid and water.

2. The method for roughening the RTF electronic copper foil according to claim 1, characterized in that: The temperature of the roughening solution is 15°C to 25°C.

3. The method for roughening the RTF electronic copper foil according to claim 1, characterized in that: The roughening treatment time is 3s to 10s.

4. The method for roughening RTF electronic copper foil according to claim 1, characterized in that: The transmission speed of the original foil during the roughening treatment is 0.5 m / min to 14 m / min.

5. The method for roughening RTF electronic copper foil according to claim 1, characterized in that: The pH value of the roughening solution is 0.5-3.

6. The method for roughening the RTF electronic copper foil according to any one of claims 1 to 5, characterized in that: The current density of the roughening treatment is 10A / dm 2 ~50A / dm 2 .

7. An RTF electronic copper foil, characterized in that: The roughening method is performed by the roughening method according to any one of claims 1 to 6.

8. An electronic product, characterized in that: The invention comprises the RTF electronic copper foil as claimed in claim 7.

Images