Metal material electrochemical polishing optimization method and system based on LSV curve

Abstract

The invention discloses a metal material electrochemical polishing optimization method and system based on an LSV curve, and relates to the technical field of electrochemical polishing, an electrochemical polishing system and equipment are configured, and the system comprises an electrochemical polishing tank, a high-power power supply with a scanning function and a high-precision universal meter for receiving trigger signals; setting an external trigger signal, and determining a measuring range, an acquisition speed, a cycle index and trigger edge selection. According to the invention, the LSV curve is accurately monitored, the current limiting platform area is identified, the constancy of the current value in a certain potential range is reflected by using the stability index of the current limiting platform area, the width of the current limiting platform area is measured by using the width index of the current limiting platform area, and the current size index is analyzed to observe the size of the current limiting. The polishing parameters are automatically adjusted according to the indexes of stability, width and current magnitude, it is ensured that the optimal conditions are kept all the time in the polishing process, and therefore the high-precision and consistent polishing effect is achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of electrochemical polishing, and in particular to a method and system for optimizing electrochemical polishing of metal materials based on LSV curves. Background Art

[0002] Metals such as titanium alloys and stainless steel are widely used in aerospace, transportation, petrochemical, energy equipment and other fields due to their excellent mechanical properties, wear resistance and corrosion resistance. These metals usually need to be processed into parts with complex structures, including curved surfaces, cavities, grooves, microchannels and pores. These structures are prone to surface defects such as cracks, pits, impurities and high surface roughness during the manufacturing process, which affect the performance and life of the parts. In order to improve the performance and life of the parts, the surfaces of these metal parts need to be post-processed to eliminate or reduce the surface defects generated during the manufacturing process. Common post-processing methods include mechanical polishing, laser polishing and electrochemical polishing. Mechanical polishing may produce residual stress and has poor accessibility to parts with complex structures. Laser polishing may cause thermal stress, has high requirements for equipment and technology, and is expensive. Electrochemical polishing is an ideal choice for processing complex structural parts due to its high accessibility and ability to soften and remove highly wear-resistant surface materials.

[0003] In the prior art, there are the following problems:

[0004] 1. Before electrochemical polishing, it is crucial to measure a continuous and reasonable linear sweep voltammetry curve (LSV curve). However, the traditional measurement method uses a DC power supply to collect and record the plot point by point. The obtained LSV curve is not smooth and continuous, or needs further fitting, and cannot truly reflect the more detailed voltage or current signal in the limiting current platform area. The curve has poor repeatability and is difficult to objectively and accurately guide the polishing process. In addition, the curve cannot be fed back online in real time, resulting in reduced production efficiency;

[0005] 2. Realizing online monitoring of LSV curves requires high-precision and high-power instruments and equipment. Instruments such as source meters on the market often cannot meet high-power requirements, or face the situation of voltage increase and current limitation, or lack a DC power supply with a trigger design to achieve synchronous real-time monitoring of voltage delivery and electrical signal acquisition;

[0006] 3. The LSV curves under different polishing parameter settings are not exactly the same, but the correspondence between polishing parameters and LSV curves can be explored and used to guide the selection of polishing voltage. There is a lack of a database for the collection, analysis and processing of LSV curve data, which cannot guide the selection of polishing voltage under different parameter combinations. Summary of the invention

[0007] The purpose of the present invention is to provide a method and system for optimizing electrochemical polishing of metal materials based on LSV curves to solve the problems raised in the above-mentioned background technology.

[0008] In order to solve the above technical problems, the technical solution adopted by the present invention is:

[0009] In a first aspect, a method for optimizing electrochemical polishing of metal materials based on an LSV curve comprises the following steps:

[0010] Step 1: Configure the electrochemical polishing system and equipment, including the electrochemical polishing tank, a high-power programmable trigger power supply with scanning function, and a high-precision multimeter for receiving trigger signals, ensuring that all equipment is connected correctly and can meet the requirements of high power and high precision;

[0011] Step 2, set the external trigger signal, determine the measurement range, acquisition speed, number of cycles, and trigger edge selection (which can be the rising edge, the falling edge, or either edge, depending on the circuit connection and experimental settings), and preset the polishing voltage and current range according to the characteristics of the polishing material and the polishing conditions;

[0012] Step 3, output a scanning voltage signal through a high-power power supply, and set the action amplitude range (for use before polishing). With the voltage signal, the trigger signal sending port on the high-power power supply is triggered to work, and the signal is transmitted to the trigger signal receiving port, thereby starting the multimeter to collect the current signal. The time error of this process is extremely small, within 0.001-0.1s, which is allowed to achieve synchronous real-time monitoring of voltage sending and electrical signal collection;

[0013] Step 4: Analyze the changes in the limiting current platform area under different conditions according to the LSV curve collected in real time, and select the appropriate polishing voltage and current for polishing. In the actual polishing process, the polishing parameters need to be adjusted in time according to the changes in the limiting current platform area of ​​the LSV curve corresponding to different parameters to ensure the best polishing effect;

[0014] Step 5: Monitor the changes in the LSV curve or time-current curve and the abnormality of the current signal during scanning or polishing. If the current suddenly drops to 0 or the current value increases abnormally, stop polishing and check whether there is a problem with the equipment or sample. Meanwhile, record the relevant data during scanning or polishing for subsequent analysis and optimization.

[0015] Step 6: Collect electrical signals and update the LSV curve in real time, and display it dynamically on the monitoring equipment. By observing the changing trend of the LSV curve, the rhythm changes of the redox reaction and material dissolution, as well as whether there are any abnormal conditions, can be determined.

[0016] A further improvement of the technical solution of the present invention is that in step 1, the configuration process of the electrochemical polishing system and equipment is:

[0017] Step 101, according to the characteristics of the metal material and the polishing requirements, the required power and precision are determined, and a high-power programmable trigger power supply with a scanning function and a high-precision multimeter for receiving the trigger signal are configured;

[0018] Step 102, connecting the output end of the high-power power supply to the anode and cathode of the electrochemical polishing tank, and connecting the input end of the high-precision multimeter to the loop formed by the electrolytic cell and the power supply to monitor the voltage or current in real time;

[0019] Step 103, configure the scanning function of the high-power power supply, set the sending port and sending frequency of the trigger signal, configure the trigger signal receiving port of the multimeter to receive the trigger signal from the power supply, and control the software to monitor and record the data during the scanning and polishing process;

[0020] Step 104, calibrate the output of the high-power programmable trigger power supply and the output of the high-precision multimeter to ensure the accuracy of the voltage and current and the accuracy of the measurement results, and perform a system test before actual polishing to verify whether the connection and function of the equipment are normal, and record the models, specifications and configuration parameters of all equipment.

[0021] A further improvement of the technical solution of the present invention is that in step 2, the preset process of the polishing voltage and current range is:

[0022] Step 201, analyzing the properties of metal polishing materials such as titanium alloy and stainless steel, as well as their respective electrochemical behaviors, and determining the required voltage and current ranges according to the material properties and polishing requirements, wherein the selected output reference value for stainless steel is between 15-30V, which needs to be determined specifically according to the polishing conditions, and the current is between 0.5A-2.5A, and the selected output reference value for titanium alloy is between 25-45V, which needs to be determined specifically according to the polishing conditions, and the current is between 1.0A-3.0A;

[0023] Step 202, according to the material characteristics and the experimental objectives, the voltage and current ranges in the polishing process are preset, and the voltage and current scanning procedures are set on the software end of the high-power programmable trigger power supply, including the starting point, the end point and the scanning rate;

[0024] Step 203, according to the preset polishing voltage and current range, set the range of the multimeter to ensure that it can cover the maximum value that may appear in the experiment, and determine the speed of data acquisition according to the experimental requirements and equipment capabilities to ensure that the rapid changes in the polishing process can be captured, set the number of cycles in combination with the experimental design, determine the number of times to repeat the measurement, and select the edge of the trigger signal according to the circuit connection and experimental settings;

[0025] Step 204, setting a transmission port of an external trigger signal on the high-power power supply so that it sends a trigger signal according to a preset program, and configuring a trigger signal receiving port of the multimeter so that it receives and responds to the trigger signal from the power supply;

[0026] Step 205, use the control software to set the external trigger signal, measurement range, acquisition speed, number of cycles, and trigger edge selection parameters to ensure that all devices can be synchronously controlled by the software, and set the data recording function in the software to automatically record the voltage, current, and trigger signal during the experiment.

[0027] A further improvement of the technical solution of the present invention is that in step 3, the process of starting the multimeter to collect current signals is:

[0028] Step 301, start the high-power program-controlled trigger power supply to start outputting a scanning voltage signal, ensure that the parameters of the scanning voltage signal (starting voltage, ending voltage, scanning rate) have been accurately set according to the experimental design, and when the scanning voltage reaches a preset threshold, the high-power power supply sends a DC voltage signal;

[0029] Step 302, the high-power program-controlled trigger power supply sends a DC voltage signal to the trigger signal receiving port of the multimeter. After receiving the signal, the multimeter immediately starts to collect the current signal, ensuring that the time error between the voltage signal and the trigger signal is controlled within 0.001-0.1 seconds to achieve synchronous monitoring;

[0030] Step 303, the multimeter converts the collected current signal into digital data and transmits it to the control software through the external interface, and uses the control software to record the voltage and current data, including the timestamp, voltage value and current value, for subsequent analysis;

[0031] Step 304, according to the experimental design, repeat the above steps 301 to 303 multiple times to obtain sufficient data for statistical analysis, by comparing the scanning results under different conditions, analyzing the voltage and current data, verifying whether the set voltage and current range is optimal, and adjusting the voltage and current range according to the data analysis results to optimize the polishing process.

[0032] A further improvement of the technical solution of the present invention is that in step 4, the analysis process of the change of the limiting current platform area under different conditions is:

[0033] Step 401, analyzing the shape and characteristics of the LSV curve, identifying the starting potential, the ending potential and the trend of the current changing with the potential of the curve, and evaluating the feasibility of the polishing process according to the stability, width and current size index of the limiting current platform area, wherein the stability index is used to evaluate whether the current value of the limiting current platform area is stable, that is, whether the current value remains relatively constant within a certain potential range. A stable platform area indicates that the polishing process is more controllable and consistent. The width index is used to measure the width of the limiting current platform area, that is, the potential range in which the current value remains stable. A wider platform area usually means a wider polishing condition window, which is conducive to the flexible adjustment of the polishing process. The current size index is used to observe the size of the limiting current, which is related to the polishing rate and efficiency. A higher current brings a faster polishing rate, but also increases the risk of surface roughness or damage. If the platform area is stable and has a moderate width, and the current size is within an acceptable range, the polishing process has a higher feasibility;

[0034] Step 402, based on the evaluation result of the feasibility of the polishing process, analyzing the change trend of the voltage range in the limiting current platform region under different conditions of the level spacing, temperature, polishing material type and additive composition;

[0035] Step 403, according to the analysis result of the limiting current platform area, set the preliminary polishing voltage and current parameters, and gradually adjust the polishing voltage and current according to the real-time changes of the surface finish, removal rate and time-current curve to achieve the best polishing effect. If the polishing effect is not good (surface roughness increases, removal rate is too slow, etc.), it is necessary to increase the current or adjust the voltage. If over-polishing or excessive damage to the precision occurs during the polishing process, it is necessary to reduce the current or adjust the voltage.

[0036] Step 404, recording the LSV curve data and polishing parameters under the preset polishing parameters, making the LSV curve data and the preset polishing parameters correspond to each other, integrating them into a data warehouse for storage, including the step spacing, temperature, polishing material category, and additive composition, and further performing data analysis and processing to clarify the relationship between each polishing parameter and the LSV curve;

[0037] Step 405, based on the relationship between the preset polishing parameters and the corresponding LSV curve, the estimated reference voltage area that can be used for polishing under different parameter combinations is deduced, and the surface quality obtained after polishing under an actual voltage is continuously corrected and optimized, and the fitting coefficient is calculated to provide a more accurate reference area for the polishing voltage selection under different parameters.

[0038] A further improvement of the technical solution of the present invention is that the expression for evaluating the feasibility of the polishing process is:

[0039]

[0040] Among them, F is the feasibility index of the polishing process. The value range of F is between 0 and 1. The closer the value is to 1, the more feasible the polishing process is. max is the maximum current value in the limiting current platform area, I min is the minimum current value of the limiting current platform area, W is the width of the limiting current platform area, that is, the potential range in which the current value remains stable, W opt is the optimal width of the limiting current platform area, S is the stability index of the limiting current platform area, that is, the degree to which the current value remains relatively constant within a certain potential range, S opt It is the best stability indicator.

[0041] A further improvement of the technical solution of the present invention is that in step 5, the process of handling abnormal situations is as follows:

[0042] Step 501, configure monitoring equipment to display the LSV curve or time-current curve in real time, and set an alarm threshold so that a corresponding alarm is issued when the current drops sharply to 0 or increases abnormally;

[0043] Step 502, during the polishing process, continuously observe the changes in the LSV curve or the time-current curve, analyze the abnormal situation that deviates from the expected trend, and if it is monitored that the current suddenly drops sharply to 0 or the current value increases abnormally, immediately stop the scanning or polishing process, and check the equipment connection to confirm whether there is a circuit break, short circuit or other electrical problems;

[0044] Step 503, if the current signal is abnormal, check whether the anode terminal of the sample is burned or physically damaged, confirm whether the electrolyte is normal, whether there is boiling or other abnormal physical or chemical changes;

[0045] Step 504, record all relevant data during the polishing process, including voltage, current, time and timestamps of any abnormal conditions, integrate them into the data warehouse, associate them with the LSV curve data and polishing parameters, and back up the data to ensure that key information is not lost in the event of equipment failure, analyze the recorded data, and determine the cause of the abnormal condition;

[0046] Step 505, according to the data analysis results, the polishing parameters are adjusted to optimize the scanning and polishing process. After the problem is solved, the scanning or polishing process is restarted. After the restart, the LSV curve and current signal for the first few minutes are closely monitored to ensure that the scanning or polishing process is carried out as expected;

[0047] Step 506: During scanning or polishing, continuously monitor the LSV curve or time-current curve to ensure the stability of the scanning or polishing process, regularly check the status of the equipment and samples, prevent abnormal situations, and prepare a scanning and polishing process report, including monitoring results, abnormal situations, measures taken, and optimized polishing parameters. The records are integrated into the data warehouse to realize the design, implementation, improvement and feedback system of the polishing plan.

[0048] A further improvement of the technical solution of the present invention is that in step 6, the observation process of the change trend of the LSV curve is:

[0049] Step 601, analyzing the LSV curve data and polishing parameters in the data warehouse, combining the collected voltage and current data, using the control software to analyze the real-time collected current value and the corresponding voltage value to draw the LSV curve, ensuring that the software can automatically update the data points, reflect the latest measurement results on the chart, and dynamically display the LSV curve on the monitoring device, so that the experimenter can observe the changes of the curve in real time, adjust the refresh rate of the chart, and ensure that the dynamic update of the curve is synchronized with the data collection;

[0050] Step 602, monitor the changing trend of the LSV curve, observe the peak potential and peak current of the curve, identify the voltage area where the current density does not change significantly - the limiting current density platform area, and judge whether the rhythm of the redox reaction and material dissolution is balanced by analyzing the changing trend of the limiting current platform area of ​​the LSV line, so as to conduct subsequent formation principle analysis of the surface quality after polishing.

[0051] Step 603, judging the rhythm of the redox reaction, by observing the peaks and valleys on the LSV curve, judging the starting and ending points of the redox reaction equilibrium, analyzing the changing trends of the peak potential and the peak current, and understanding the rhythm changes;

[0052] Step 604, judging the dissolution of the material, judging the dissolution of the material on the electrode according to the change of the current on the IT curve. If the current fluctuates significantly with the change of the potential, it indicates that the material is dissolving or other electrochemical processes are occurring;

[0053] Step 605, for abnormal situation judgment, observe whether the LSV curve has abnormal fluctuations or deviates from the expected trend. If it is found that the current suddenly drops sharply to 0 or the current value increases abnormally, check the cause, including the anode terminal burning out, physical circuit breakage or electrolyte boiling.

[0054] A further improvement of the technical solution of the present invention is that in the judgment of the redox reaction rhythm, the expression for analyzing the change trend of the peak potential and the peak current is:

[0055]

[0056] Among them, I peak is the peak current, that is, at the peak potential E peak I0 is the maximum current, i.e. the current value when the electrode reaction is most intense, and E is the potential, i.e. the potential value at any point on the LSV curve. peak is the peak potential, that is, the potential value when the current reaches the maximum value on the LSV curve. k is a constant related to the rate of electrode reaction and the properties of the electrolyte.

[0057] In the judgment of the dissolution equilibrium of the material, the expression for analyzing the fluctuation of the current with the change of the potential is:

[0058]

[0059] Among them, I is the current, that is, the current value at any point on the LSV curve, I0 is the maximum current, that is, the current value when the electrode reaction is most intense, E is the potential, that is, the potential value at any point on the LSV curve, E0 is the starting potential, that is, the potential value when the LSV curve starts scanning, and k is a constant related to the rate of the electrode reaction and the properties of the electrolyte;

[0060] In the abnormal situation judgment, the expression for analyzing the abnormal fluctuation or deviation of the LSV curve from the expected trend is:

[0061]

[0062] Where I is the current, that is, the current value at any point on the LSV curve, I base is the reference current, that is, the current value expected under normal circumstances, ΔI is the current change, that is, the value of the current deviation from the reference current, E is the potential, that is, the potential value at any point on the LSV curve, E0 is the reference potential, that is, the potential value expected under normal circumstances, and k is a constant related to the rate of electrode reaction and the properties of the electrolyte.

[0063] In the second aspect, a metal material electrochemical polishing optimization system based on an LSV curve is used to implement a metal material electrochemical polishing optimization method based on an LSV curve, wherein the electrochemical polishing optimization system includes a data acquisition and monitoring module, a signal processing and analysis module, a parameter setting and adjustment module, an abnormality processing module, a data recording and backup module, and a report generation and feedback module, wherein electrical signals are connected between the modules;

[0064] The data acquisition and monitoring module is used to monitor the LSV curve or time-current curve during electrochemical scanning or polishing in real time, collect key data during the polishing process, including voltage, current, time, and timestamps of abnormal conditions, ensure the accuracy and integrity of the data, and provide a reliable basis for subsequent analysis and optimization;

[0065] The signal processing and analysis module is used to process the collected signals, analyze the shape and characteristics of the LSV curve, identify the starting potential, the ending potential and the trend of the current changing with the potential, evaluate the stability, width and current size of the limiting current platform area, and provide a scientific basis for the optimization of the polishing process;

[0066] The parameter setting and adjustment module sets and feeds back the voltage and current parameters during the polishing process according to the LSV curve analysis results, and realizes dynamic adjustment of the polishing process to achieve the best polishing effect;

[0067] The abnormality handling module monitors abnormal conditions during scanning or polishing, including a sharp drop or abnormal increase in current, and automatically stops the scanning or polishing process when an abnormality is detected, ensuring safe operation, preventing equipment damage and sample damage, and responding to and handling abnormal conditions in a timely manner;

[0068] The data recording and backup module records and backs up all relevant data during the scanning and polishing process, including voltage, current, time, and timestamps of abnormal conditions, to ensure persistent storage of key information and provide a basis for subsequent data analysis, fault diagnosis, and polishing process optimization;

[0069] The report generation feedback module prepares a polishing process report, including monitoring results, abnormal conditions, measures taken and optimized polishing parameters, and provides detailed polishing process records and optimization suggestions to help operators understand and improve the polishing process.

[0070] Due to the adoption of the above technical solution, the present invention has the following technical advances compared with the prior art:

[0071] 1. The present invention provides an optimization method and system for electrochemical polishing of metal materials based on the LSV curve. The LSV curve is monitored in real time to accurately identify the limiting current platform area. The stability index of the limiting current platform area is used to reflect the constancy of the current value within a certain potential range. The width index of the limiting current platform area is used to measure the width of the limiting current platform area. A wider platform area means a wider polishing condition window, which is conducive to the flexible adjustment of the polishing process. The current size index is analyzed to observe the size of the limiting current. The stability, width, and current size indicators are combined to automatically adjust the polishing parameters to ensure that the optimal conditions are always maintained during the polishing process, thereby achieving a high-precision and consistent polishing effect.

[0072] 2. The present invention provides an optimization method and system for electrochemical polishing of metal materials based on the LSV curve. By analyzing the shape and characteristics of the LSV curve, it is possible to identify the trend of current change with potential, and optimize polishing parameters accordingly. The set polishing voltage and current parameters are based on the stability, width and current size indicators of the limiting current platform area, which helps to improve the polishing efficiency. If the polishing effect is not good, such as increased surface roughness or too slow removal rate, the current is increased or the voltage is adjusted in time. Conversely, if over-polishing or damage occurs, the current is reduced or the voltage is adjusted to ensure the efficiency of the polishing process, while avoiding material loss and surface damage caused by over-polishing, thereby improving the material removal rate and surface finish.

[0073] 3. The present invention provides an optimization method and system for electrochemical polishing of metal materials based on the LSV curve. By collecting LSV curve data under different polishing parameter settings, data collection and analysis are performed to explore the correspondence between polishing parameters and LSV curves to guide the selection of polishing voltage, so that the polishing voltage selected under different parameter combinations has a reference voltage area. BRIEF DESCRIPTION OF THE DRAWINGS

[0074] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0075] Figure 1 is a flow chart of the method of the present invention;

[0076] Figure 2 A trend diagram of the voltage range change in the current limiting platform region under the step spacing condition of the present invention;

[0077] Figure 3 A trend diagram of the voltage range change in the limiting current platform region under the temperature conditions of the present invention;

[0078] Figure 4 A trend diagram of the voltage range change in the limiting current platform region under the polishing material type conditions of the present invention;

[0079] Figure 5 A trend diagram of the voltage range change in the limiting current platform region under the additive composition conditions of the present invention;

[0080] Figure 6 It is a system module diagram of the present invention. DETAILED DESCRIPTION

[0081] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0082] Embodiment 1, as Figure 1 As shown, the present invention provides a method for optimizing electrochemical polishing of metal materials based on LSV curves, comprising the following steps:

[0083] Step 1: Configure the electrochemical polishing system and equipment, including the electrochemical polishing tank, a high-power power supply with scanning function, and a high-precision multimeter that receives trigger signals. Ensure that all equipment is connected correctly and can meet the needs of high power and high precision. According to the characteristics of the metal material and the polishing requirements, clarify the required power and precision, and configure a high-power power supply with scanning function and a high-precision multimeter that receives trigger signals. The high-power power supply has a scanning function and can gradually adjust the output current or voltage according to the preset program to meet the needs of different polishing stages. Connect the output end of the high-power power supply to the anode and cathode of the electrochemical polishing tank. Connect the input of the high-precision multimeter to the corresponding measuring point to monitor the voltage and current in real time, configure the scanning function of the high-power power supply, set the sending port and sending frequency of the trigger signal, configure the trigger signal receiving port of the multimeter to receive the trigger signal from the power supply, and integrate the control software to monitor and record the data during the scanning and polishing process, calibrate the output of the high-power power supply and the output of the high-precision multimeter to ensure the accuracy of the voltage and current and the accuracy of the measurement results, and perform system testing before actual polishing to verify whether the connection and function of the equipment are normal, and record the model, specification and configuration parameters of all equipment;

[0084] Step 2, set the external trigger signal, determine the measurement range, acquisition speed, number of cycles and trigger edge selection (can be rising edge, falling edge or any edge, depending on the circuit connection and experimental settings), and preset the polishing voltage and current range according to the characteristics of the polishing material and the polishing conditions, analyze the metal polishing material characteristics of titanium alloy and stainless steel, as well as their respective electrochemical behaviors, and determine the required voltage and current range according to the material characteristics and polishing requirements. Among them, the selected output reference value for stainless steel is between 15-30V, which depends on the specific polishing conditions, and the current is between 0.5A-2.5A. The selected output reference value for titanium alloy is 25-45V It depends on the polishing conditions. The current is between 1.0A and 3.0A. The characteristics of titanium alloy are light weight, high strength and corrosion resistance. In electrochemical polishing, the electrochemical behavior of titanium alloy shows a relatively stable potential, but care should be taken to avoid surface burns caused by excessive current density. The characteristics of high-temperature alloys are high melting point, high thermal strength, good oxidation resistance and thermal corrosion resistance. The electrochemical polishing of high-temperature alloys requires higher voltage and current to overcome its high melting point and hardness, but it needs to be carefully controlled to avoid thermal damage. The characteristics of stainless steel are corrosion resistance, heat resistance and good mechanical properties. Stainless steel usually shows a good response in electrochemical polishing, but attention should be paid to the uniformity of current density to avoid For partial over-polishing, according to the material characteristics and experimental objectives, preset the voltage and current ranges during the polishing process, and set the voltage and current scanning program on the high-power power supply, including the starting point, end point and scanning rate. According to the preset polishing voltage and current ranges, set the multimeter range to ensure that it can cover the maximum value that may appear in the experiment. According to the experimental requirements and equipment capabilities, determine the speed of data acquisition to ensure that the rapid changes in the polishing process can be captured. Set the number of cycles in combination with the experimental design to determine the number of repeated measurements. According to the circuit connection and experimental settings, select the edge of the trigger signal (rising edge, falling edge or any edge, where rising edge trigger means when Data acquisition is triggered when the signal changes from low level to high level; the falling edge trigger is the opposite. If the circuit allows, any edge trigger can be selected, that is, the signal can be triggered when it rises or falls). Set the external trigger signal sending port on the high-power power supply so that it sends the trigger signal according to the preset program. Configure the trigger signal receiving port of the multimeter so that it receives and responds to the trigger signal from the power supply. Use the control software to set the external trigger signal, measurement range, acquisition speed, number of cycles, and trigger edge selection parameters to ensure that all devices can be synchronously controlled by the software, and set the data recording function in the software to automatically record the voltage, current and trigger signal during the experiment;

[0085] Step 3, output a scanning voltage signal through a high-power power supply, and set the action amplitude range. With the voltage signal given, the trigger signal sending port on the high-power power supply is triggered to work, and the signal is transmitted to the trigger signal receiving port, thereby starting the multimeter to collect the current signal. The time error of this process is extremely small, within 0.001-0.01, which is allowed to achieve synchronous real-time monitoring of voltage sending and electrical signal collection. Start the high-power power supply to start outputting the scanning voltage signal, and ensure that the parameters of the scanning voltage signal (starting voltage, ending voltage, scanning rate) have been accurately set according to the experimental design;

[0086] When the scanning voltage reaches a preset threshold, the high-power power supply sends a DC voltage signal, and the high-power power supply sends the DC voltage signal to the trigger signal receiving port of the multimeter. After receiving the signal, the multimeter immediately starts to collect the current signal, ensuring that the time error between the voltage signal and the trigger signal is controlled within 0.001-0.1 seconds to achieve synchronous monitoring. The multimeter converts the collected current signal into digital data and transmits it to the control software through an external interface. The control software is used to record the voltage and current data, including timestamps, voltage values, and current values, for subsequent analysis. According to the experimental design, the above steps 301 to 303 are repeated multiple times to obtain sufficient data for statistical analysis. By comparing the scanning results under different conditions, the voltage and current data are analyzed to verify whether the set voltage and current ranges are optimal, and according to the data analysis results, the voltage and current ranges are adjusted to optimize the polishing process;

[0087] Step 4: Analyze the changes in the limiting current platform area under different conditions according to the LSV curve collected in real time, and select the appropriate polishing voltage and current for polishing. In the actual polishing process, the polishing parameters need to be adjusted in time according to the changes in the limiting current platform area of ​​the LSV curve corresponding to different parameters to ensure the best polishing effect;

[0088] Step 5: Monitor the changes in the LSV curve or time-current curve and the abnormality of the current signal during scanning or polishing. If the current suddenly drops sharply to 0 or the current value increases abnormally, stop scanning or polishing for processing, check whether there is a problem with the equipment or sample, and record the relevant data during the scanning or polishing process for subsequent analysis and optimization;

[0089] Step 6: Collect electrical signals and update the LSV curve in real time, and display it dynamically on the monitoring equipment. By observing the changing trend of the LSV curve, the rhythm changes of the redox reaction and material dissolution, as well as whether there are any abnormal conditions, can be determined.

[0090] Embodiment 2, as Figures 2 to 5As shown, based on Example 1, the present invention provides a technical solution: Preferably, in step 4, the analysis process of the change of the limiting current platform area under different conditions is:

[0091] The shape and characteristics of the LSV curve are analyzed, the starting potential, the ending potential and the trend of the current changing with the potential of the curve are identified, and the feasibility of the polishing process is evaluated based on the stability, width and current size indicators of the limiting current platform area. Among them, the stability index is used to evaluate whether the current value in the limiting current platform area is stable, that is, whether the current value remains relatively constant within a certain potential range. A stable platform area indicates that the polishing process is more controllable and consistent. The width index is used to measure the width of the limiting current platform area, that is, the potential range in which the current value remains stable. A wider platform area usually means a wider polishing condition window, which is conducive to the flexible adjustment of the polishing process. The current size index is used to observe the size of the limiting current, which is related to the polishing rate and efficiency. A higher current brings a faster polishing rate, but it also increases the risk of surface roughness or damage. If the platform area is stable and the width is moderate, and the current size is within an acceptable range, the polishing process has a higher feasibility. Based on the evaluation results of the feasibility of the polishing process, the change of the voltage range of the limiting current platform area under different conditions of step spacing, temperature, polishing material type and additive composition is analyzed. According to the analysis results of the limiting current platform area, the preliminary polishing voltage and current parameters are set, and according to the real-time changes of the surface finish, removal rate and time-current curve, the polishing voltage and current are gradually adjusted to achieve the best polishing effect. If the polishing effect is not good (surface roughness increases, removal rate is too slow, etc.), the current needs to be increased or the voltage needs to be adjusted. If over-polishing or excessive precision damage occurs during the polishing process, the current needs to be reduced or the voltage needs to be adjusted. The LSV curve data and polishing parameters under the preset polishing parameters are recorded, and the LSV curve data and the preset polishing parameters are corresponded to each other and integrated into the data warehouse for storage, including the step spacing, temperature, polishing material category and additive composition, etc., and further data analysis and processing are performed to clarify the relationship between each polishing parameter and the LSV curve; according to the relationship between the preset polishing parameters and the corresponding LSV curve, the reference voltage area that can be used for polishing under different parameter combinations is calculated, and the surface quality obtained after polishing under an actual voltage is continuously corrected and optimized, and the fitting coefficient is calculated to provide a more accurate reference area for the selection of polishing voltage under different parameters.

[0092] Furthermore, the expression for evaluating the feasibility of the polishing process is:

[0093]

[0094] Among them, F is the feasibility index of the polishing process. The value range of F is between 0 and 1. The closer the value is to 1, the more feasible the polishing process is.max is the maximum current value in the limiting current platform area, I min is the minimum current value of the limiting current platform area, W is the width of the limiting current platform area, that is, the potential range in which the current value remains stable, W opt is the optimal width of the limiting current platform area, S is the stability index of the limiting current platform area, that is, the degree to which the current value remains relatively constant within a certain potential range, S opt is the optimal stability index, I max and I min The value range of I depends on the electrochemical properties of the material and the composition of the electrolyte. max Greater than I min The value range of W depends on the rate of electrode reaction and the properties of electrolyte. The wider the W is, the wider the polishing condition window is, which is conducive to the flexible adjustment of the polishing process. The value range of W is between 0 and 1. The closer the value is to 1, the more stable the limiting current platform area is. The feasibility of the polishing process is evaluated by comprehensively considering the stability, width and current size of the limiting current platform area. In the electrochemical polishing process, the appropriate polishing voltage and current are selected to ensure that the feasibility index F of the polishing process is maximized, thereby achieving efficient and uniform polishing effect;

[0095] Furthermore, under different conditions of level spacing, temperature, polishing material type and additive composition, the change trend of the voltage range in the limiting current platform area is as follows:

[0096] like Figure 2 As shown in the figure, for the influence of step spacing conditions, in the alkoxide electrolyte system, the LSV curve of titanium alloy was measured at 25°C. As the step spacing increases, the potential range of the limiting current platform gradually decreases, indicating that the ability of mass transfer to limit the dissolution of reaction products decreases, the thickness of the diffusion layer decreases, and the path length of ion diffusion becomes shorter, which accelerates the dissolution rate of reaction products on the sample surface, and the balance between surface reaction and dissolution is gradually broken. When the polishing voltage area is gradually reduced to an inconspicuous level, if the voltage is continuously applied, corrosion pits will appear on the surface, and it is not suitable to continue polishing.

[0097] like Figure 3As shown in the figure, for the influence of temperature conditions, the LSV curve of titanium alloy is measured under the step spacing of 10mm in the alkoxide electrolyte system. As the temperature increases, the potential range of the limiting current platform first moves to the left and then to the right. When the temperature rises by 40℃, the viscosity of the electrolyte decreases, the ion movement rate accelerates, and the dissolution of the electrolysis product accelerates. The same current density can be achieved at a lower voltage, and the balance between surface layer material modification and dissolution is achieved, showing the result of the platform shifting to the left. However, when it rises to 60℃, the current density increases rapidly, the surface dissolved cations increase, and a difficult-to-dissolve passivation layer is formed. The passivation film thickens, and the polishing voltage needs to be increased to break it down, so that the film layer dissolves and the polishing effect is achieved, so it moves to the right.

[0098] like Figure 4 As shown in the figure, for the influence of the type of polishing material, the same electrolytic formula and temperature are used, and the potential range of the limiting current platform presented by different polishing materials is different under the alkoxide electrolyte system, 60℃, and 10mm step spacing. It is directly related to the element type and content of the material itself. Compared with titanium alloy, stainless steel is easier to achieve the polishing effect, and the voltage value of the limiting current platform is relatively small, and the polishing voltage area is relatively left. The voltage value of the limiting current platform of titanium alloy will be higher, and the voltage area is on the right. Compared with pure titanium, titanium alloy TC4 contains a certain proportion of Al and V. Different elements lead to inconsistent composition of the formed passivation film, which is more susceptible to breakdown. The elements of pure titanium are relatively single, and the formed passivation film is dense and difficult to break down. Under the set scanning voltage range of 0-40V, the polishing voltage that can break it down is not reached. The curve is on the right side of the polishing area of ​​titanium alloy. It is necessary to increase the voltage and detect the LSV curve again to find the polishing voltage.

[0099] like Figure 5As shown in the figure, for the influence of additive composition, the LSV curve of TC4 titanium alloy was tested at 10mm inter-electrode spacing and 50℃. Under the same electrolyte, the potential range of the limiting current platform presented by different additives was inconsistent, which was related to the generation and removal of surface products during electrochemical polishing. In sodium chloride-ethylene glycol electrolyte, TiCl4 film was generated on the surface of TC4 titanium alloy during electrochemical polishing. The dissolution and removal rate of TiCl4 film would directly affect the energy required for the mutual balance between the modification reaction and the dissolution process during polishing, thereby affecting the left and right movement of the limiting current platform area. The additive ethanol has a high solubility in TiCl4, which can accelerate the dissolution and removal of TiCl4 film on the surface of titanium alloy, and can reach the limiting current platform area at a lower energy. Compared with the curve of pure sodium chloride-ethylene glycol electrolyte, the platform area of ​​the curve moved to the left after adding ethanol. Water, as a good oxygen supply reagent, can react with TiCl4 to produce T iO2 promotes the formation of passive film on the surface of titanium alloy, making it difficult to remove the passive film on the surface. A higher voltage is required to break it down and dissolve it. Therefore, it is necessary to reach the limiting current platform area under higher energy. Therefore, compared with the curve of pure sodium chloride-ethylene glycol electrolyte, the LSV curve platform area of ​​adding water shifts to the right;

[0100] In step 5, the abnormal situation is handled as follows:

[0101] Configure monitoring equipment to display the LSV curve and current signal in real time, and set alarm thresholds so that corresponding alarms can be issued when the current drops sharply to 0 or increases abnormally. During the polishing process, continuously observe the changes in the LSV curve and analyze abnormal situations that deviate from the expected trend. If the current is monitored to drop sharply to 0 or the current value increases abnormally, stop the polishing process immediately and check the equipment connection to confirm whether there is a circuit break, short circuit or other electrical problems. If the current signal is abnormal, check whether the sample has a problem of burning or physical damage to the anode terminal, confirm whether the electrolyte is normal, whether there is boiling or other abnormal physical or chemical changes, record all relevant data during the polishing process, including voltage, current, time and timestamps of any abnormal situations, and integrate them into a single file. Integrate into the data warehouse, associate with LSV curve data and polishing parameters, and back up data to ensure that key information is not lost in the event of equipment failure. Analyze the recorded data to determine the cause of the abnormal situation. According to the data analysis results, adjust the polishing parameters to optimize the polishing process. After the problem is solved, restart the scanning or polishing process. After restarting, closely monitor the LSV curve and current signal for the first few minutes to ensure that the scanning or polishing process proceeds as expected. During the scanning or polishing process, continuously monitor the LSV curve or time-current curve to ensure the stability of the scanning or polishing process. Regularly check the status of the equipment and samples to prevent abnormal situations, and prepare scanning and polishing process reports, including monitoring results, abnormal situations, measures taken, and optimized polishing parameters. The records are integrated into the data warehouse to realize the design, implementation, improvement and feedback system of the polishing plan.

[0102] In step 6, the observation process of the IT curve change trend is:

[0103] Analyze the LSV curve data and polishing parameters in the data warehouse, combine the collected voltage and current data, use the control software to analyze the real-time collected current value and the corresponding voltage value to draw the LSV curve, reflect the latest measurement results on the chart, and dynamically display the LSV curve on the monitoring equipment, adjust the refresh rate of the chart, and ensure that the dynamic update of the curve is synchronized with data acquisition; monitor the changing trend of the LSV curve, observe the peak potential and peak current of the curve, identify the voltage area where the current density does not change significantly-the limiting current density platform area, and by analyzing the changing trend of the limiting current platform area of ​​the LSV curve, judge whether the rhythm of the redox reaction and material dissolution is balanced, so as to conduct subsequent formation principle analysis of the surface quality after polishing.

[0104] For judging the rhythm of the redox reaction, the starting and ending points of the redox reaction equilibrium can be judged by observing the peaks and valleys on the LSV curve, and the changing trends of the peak potential and peak current can be analyzed to understand the rhythm changes. For judging the dissolution of the material, the dissolution of the material on the electrode can be judged according to the changes in the current on the IT curve. If the current fluctuates significantly with the change in potential, it indicates that the material is dissolving or other electrochemical processes are occurring. For judging abnormal situations, observe the LSV curve for abnormal fluctuations or deviations from the expected trend. If the current is found to suddenly drop sharply to 0 or the current value increases abnormally, check the existing causes, including burning of the anode sample terminal, physical disconnection, or boiling of the electrolyte.

[0105] Furthermore, in the rhythm judgment of the redox reaction, the expression for analyzing the peak current and the peak current change trend is:

[0106]

[0107] Among them, I peak is the peak current, that is, at the peak potential E peak I0 is the maximum current, i.e. the current value when the electrode reaction is most intense, and E is the potential, i.e. the potential value at any point on the LSV curve. peak is the peak potential, that is, the potential value when the current reaches the maximum value on the LSV curve. k is a constant related to the rate of electrode reaction and the properties of the electrolyte. I peak The value range depends on the values ​​of I0 and k. peak will be less than I0, E peak The value range of E depends on the electrochemical properties of the material and the composition of the electrolyte. peak It will change as the electrochemical polishing proceeds. The value range of k depends on the rate of the electrode reaction and the properties of the electrolyte. k will increase with the increase of temperature. The changing trend of the peak potential and peak current on the LSV curve is analyzed to understand the rhythm changes of the redox reaction. During the electrochemical polishing process, the changes in the peak potential and peak current reflect the redox reaction on the material surface and help select the optimal polishing voltage and current.

[0108] In the judgment of the equilibrium of material dissolution, the expression for analyzing the fluctuation of current with potential change is:

[0109]

[0110] Among them, I is the current, that is, the current value at any point on the LSV curve, I0 is the maximum current, that is, the current value when the electrode reaction is most intense, E is the potential, that is, the potential value at any point on the LSV curve, E0 is the starting potential, that is, the potential value when the LSV curve starts to scan, k is a constant, which is related to the rate of electrode reaction and the properties of the electrolyte, the value range of I depends on the values ​​of I0 and k, I will increase with the increase of potential until it reaches the maximum value I0, the value range of E depends on the electrochemical properties of the material and the composition of the electrolyte, E will change with the progress of electrochemical polishing, the value range of k depends on the rate of electrode reaction and the properties of the electrolyte, k will increase with the increase of temperature, analyze the change of current on the LSV curve, and thus judge the dissolution of the material on the electrode. During the electrochemical polishing process, the current fluctuates significantly with the change of potential, indicating that the material is dissolving or other electrochemical processes are occurring, which can help select the best polishing voltage and current to achieve efficient material dissolution and polishing effects;

[0111] In abnormal situation judgment, the expression for analyzing abnormal fluctuations or deviations from the expected trend of the LSV curve is:

[0112]

[0113] Where I is the current, that is, the current value at any point on the LSV curve, I base is the reference current, i.e. the current value expected under normal circumstances, ΔI is the current change, i.e. the value of the current deviating from the reference current, E is the potential, i.e. the potential value at any point on the LSV curve, E0 is the reference potential, i.e. the potential value expected under normal circumstances, k is a constant related to the rate of electrode reaction and the properties of the electrolyte, and the value range of I depends on I base , ΔI and k values. I will increase with the increase of potential until it reaches a maximum value. The value range of E depends on the electrochemical properties of the material and the composition of the electrolyte. E will change as the electrochemical polishing proceeds. The value range of k depends on the rate of the electrode reaction and the properties of the electrolyte. k will increase with the increase of temperature. Analyze the abnormal fluctuation of current on the LSV curve or the deviation from the expected trend. During the electrochemical polishing process, if the current is found to suddenly drop sharply to 0 or the current value increases abnormally, it indicates that there is an abnormal situation, such as the anode terminal burning out, physical circuit breakage or electrolyte boiling, etc., which can help determine the type and cause of the abnormal situation, so as to take appropriate measures to deal with it.

[0114] Embodiment 3, as Figure 6As shown, on the basis of Examples 1-2, the present invention further provides a metal material electrochemical polishing optimization system based on the LSV curve, which is used to implement a metal material electrochemical polishing optimization method based on the LSV curve. The electrochemical polishing optimization system includes a data acquisition monitoring module, a signal processing and analysis module, a parameter setting and adjustment module, an abnormality processing module, a data recording and backup module, and a report generation and feedback module, wherein the electrical signals between the modules are connected;

[0115] Data acquisition and monitoring module, used to monitor the LSV curve and current signal in real time during electrochemical polishing, collect key data during polishing, including voltage, current, time and timestamps of abnormal conditions, ensure the accuracy and integrity of data, and provide a reliable basis for subsequent analysis and optimization;

[0116] Signal processing and analysis module, used to process the collected signals, analyze the shape and characteristics of the LSV curve, identify the starting potential, the ending potential and the trend of the current changing with the potential, evaluate the stability, width and current size of the limiting current platform area, and provide a scientific basis for the optimization of the polishing process;

[0117] The parameter setting and adjustment module sets and adjusts the voltage and current parameters during the polishing process according to the LSV curve analysis results, and realizes dynamic adjustment of the polishing process to achieve the best polishing effect;

[0118] The abnormality handling module monitors abnormal conditions during the polishing process, including a sharp drop or abnormal increase in current, and automatically stops the polishing process when an abnormality is detected, ensuring safe operation, preventing equipment damage and sample damage, and responding to and handling abnormal conditions in a timely manner;

[0119] Data recording and backup module records and backs up all relevant data during the polishing process, including voltage, current, time, and timestamps of abnormal conditions, to ensure persistent storage of key information and provide a basis for subsequent data analysis, fault diagnosis, and polishing process optimization;

[0120] The report generation feedback module compiles a polishing process report, including monitoring results, abnormal conditions, measures taken and optimized polishing parameters, providing detailed polishing process records and optimization suggestions to help operators understand and improve the polishing process.

[0121] The above are only specific implementation methods of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be covered by the protection scope of the present application.

Claims

1. The electrochemical polishing optimization method of metal materials based on LSV curve is characterized by: The following steps are involved: Step 1, configure the electrochemical polishing system and equipment, including an electrochemical polishing tank, a high-power programmable trigger power supply with a scanning function, and a high-precision multimeter that can receive a trigger signal; Step 2, set the external trigger signal, determine the measurement range, acquisition speed, number of cycles and trigger edge selection, and preset the polishing voltage and current range according to the characteristics of the polishing material and polishing conditions; Step 3, output a scanning voltage signal through a high-power programmable trigger power supply, and set the action amplitude range. When the voltage signal is given, the trigger signal sending port on the high-power power supply is triggered to work, and the signal is transmitted to the trigger signal receiving port, thereby starting the multimeter to collect the current signal; Step 4, according to the collected LSV curve, analyze the changes in the limiting current platform area under different conditions, and select appropriate polishing voltage and current for polishing; Step 5, during the scanning or polishing process, monitor the changes in the LSV curve or the time-current curve and the abnormality of the current signal, stop the scanning or polishing process and process it, check whether there is a problem with the equipment or the sample, and record the relevant data during the scanning or polishing process; Step 6, collect electrical signals and update the LSV curve in real time, and judge whether the rhythm of redox reaction and material dissolution is balanced and whether there is any abnormality by observing the change trend of the width of the limiting current platform area of ​​the LSV curve.

2. The method for optimizing electrochemical polishing of metal materials based on LSV curve according to claim 1, characterized in that: In step 1, the configuration process of the electrochemical polishing system and equipment is as follows: Step 101, according to the characteristics of the metal material and the polishing requirements, the required power and precision are determined, and a high-power programmable trigger power supply with a scanning function and a high-precision multimeter for receiving the trigger signal are configured; Step 102, connecting the output end of the high-power power supply to the anode and cathode of the electrochemical polishing tank, and connecting the input end of the high-precision multimeter to the loop formed by the electrolytic cell and the power supply to monitor the voltage or current in real time; Step 103, configure the scanning function of the high-power power supply, set the sending port and sending frequency of the trigger signal, configure the trigger signal receiving port of the multimeter to receive the trigger signal from the power supply, and control the software to monitor and record the data during the scanning and polishing process; Step 104, calibrate the output of the high-power programmable trigger power supply and the output of the high-precision multimeter, and perform a system test before actual scanning and polishing to verify whether the connection and function of the equipment are normal, and record the models, specifications and configuration parameters of all equipment.

3. The method for optimizing electrochemical polishing of metal materials based on LSV curve according to claim 2, characterized in that: In step 2, the preset process of polishing voltage and current range is: Step 201, analyzing the metal material properties of titanium alloy and stainless steel, as well as their respective electrochemical behaviors, and determining the required voltage and current ranges according to the material properties and polishing requirements, wherein the selected output reference values ​​for stainless steel are between 15-30V and 0.5A-2.5A, and the selected output reference values ​​for titanium alloy are between 25-45V and 1.0A-3.0A; Step 202, according to the material characteristics and the experimental objectives, the voltage and current ranges in the polishing process are preset, and the voltage and current scanning procedures are set on the software end of the high-power programmable trigger power supply, including the starting point, the end point and the scanning rate; Step 203, according to the preset polishing voltage and current range, set the range of the multimeter, and determine the speed of data acquisition according to the experimental requirements and equipment capabilities, set the number of cycles in combination with the experimental design, determine the number of times the measurement needs to be repeated, and select the edge of the trigger signal according to the circuit connection and experimental settings; Step 204, setting a transmission port of an external trigger signal on the high-power power supply so that it sends a trigger signal according to a preset program, and configuring a trigger signal receiving port of the multimeter so that it receives and responds to the trigger signal from the power supply; Step 205, use the control software to set the parameters of the external trigger signal, measurement range, acquisition speed, number of cycles and trigger edge selection, and set the data recording function in the software.

4. The method for optimizing electrochemical polishing of metal materials based on LSV curve according to claim 3, characterized in that: In step 3, the process of starting the multimeter to collect current signals is as follows: Step 301, start the high-power program-controlled trigger power supply to start outputting a scanning voltage signal, ensure that the parameters of the scanning voltage signal have been accurately set according to the experimental design, and when the scanning voltage reaches a preset threshold, the high-power power supply sends a DC voltage signal; Step 302, the high-power program-controlled trigger power supply sends a DC voltage signal to the trigger signal receiving port of the multimeter. After receiving the signal, the multimeter immediately starts to collect the current signal, ensuring that the time error between the voltage signal and the trigger signal is controlled within 0.001-0.1 seconds to achieve synchronous monitoring; Step 303, the multimeter converts the collected current signal into digital data and transmits it to the control software through the external interface, and uses the control software to record the voltage and current data, including the timestamp, voltage value and current value, for subsequent analysis; Step 304, according to the experimental design, repeat the above steps 301 to 303 multiple times to obtain data for statistical analysis, by comparing the scanning results under different conditions, analyzing the voltage and current data, verifying whether the set voltage and current range is optimal, and adjusting the voltage and current range according to the data analysis results to optimize the polishing process.

5. The method for optimizing electrochemical polishing of metal materials based on LSV curve according to claim 4, characterized in that: In step 4, the analysis process of the change of the limiting current platform area under different conditions is as follows: Step 401, analyzing the shape and characteristics of the LSV curve, identifying the starting potential, the ending potential and the trend of the current changing with the potential of the curve, and evaluating the feasibility of the polishing process according to the stability, width and current magnitude index of the limiting current platform area, wherein the stability index is used to evaluate whether the current value of the limiting current platform area is stable, the width index is used to measure the width of the limiting current platform area, that is, the potential range in which the current value remains stable, and the current magnitude index is used to observe the magnitude of the limiting current; Step 402, based on the evaluation result of the feasibility of the polishing process, analyzing the change trend of the voltage range in the limiting current platform region under different conditions of the level spacing, temperature, polishing material type and additive composition; Step 403, according to the analysis result of the limiting current platform area, the preliminary polishing voltage and current parameters are set, and according to the real-time changes of the surface finish, the removal rate and the time-current curve, the polishing voltage and current are gradually adjusted to achieve the best polishing effect, wherein, if the polishing effect is not good, the current needs to be increased or the voltage needs to be adjusted, and if over-polishing or excessive precision damage occurs during the polishing process, the current or voltage needs to be reduced; Step 404, recording the LSV curve data under the preset polishing parameters, making the LSV curve data correspond to the preset polishing parameters, integrating them into the data warehouse for storage, including the step spacing, temperature, polishing material type and additive composition, and further data analysis and processing to clarify the relationship between each polishing parameter and the LSV curve; Step 405, based on the relationship between the preset polishing parameters and the corresponding LSV curve, the reference voltage region that can be used for polishing under different parameter combinations is deduced, and the surface quality obtained after polishing under an actual voltage is continuously corrected and optimized to calculate the fitting coefficient.

6. The method for optimizing electrochemical polishing of metal materials based on LSV curve according to claim 5, characterized in that: The expression for evaluating the feasibility of the polishing process is: Among them, F is the feasibility index of the polishing process, I max is the maximum current value in the limiting current platform area, I min is the minimum current value of the limiting current platform area, W is the width of the limiting current platform area, that is, the potential range in which the current value remains stable, W opt is the optimal width of the limiting current platform area, S is the stability index of the limiting current platform area, S opt It is the best stability indicator.

7. The method for optimizing electrochemical polishing of metal materials based on LSV curve according to claim 6, characterized in that: In step 5, the process of handling abnormal situations is as follows: Step 501, configure monitoring equipment, display LSV curve or time-current curve in real time, and set alarm threshold; Step 502, observe the changes in the LSV curve or the time-current curve, analyze the abnormal situation that deviates from the expected trend, and if it is monitored that the current suddenly drops sharply to 0 or the current value increases abnormally, immediately stop the scanning or polishing process, and check the equipment connection to confirm whether there is a circuit break, short circuit or other electrical problems; Step 503, if the current signal is abnormal, check whether the anode terminal of the sample is burned or physically damaged, confirm whether the electrolyte is normal, whether there is boiling or other abnormal physical or chemical changes; Step 504, record all relevant data during the polishing process, including voltage, current, time, and timestamps of abnormal conditions, integrate them into the data warehouse, associate them with the LSV curve data and polishing parameters, and back up the data; Step 505, according to the data analysis results, adjust the polishing parameters to optimize the scanning and polishing process, after the problem is solved, restart the scanning or polishing process, and monitor the initial LSV curve or time-current curve; Step 506, during the scanning or polishing process, continuously monitor the LSV curve or time-current curve, regularly check the status of the equipment and samples, prevent abnormal situations, and prepare a scanning and polishing process report, including monitoring results, abnormal situations, measures taken and optimized polishing parameters, and integrate the records into the data warehouse to realize the design, implementation, improvement and feedback loop of the polishing plan.

8. The method for optimizing electrochemical polishing of metal materials based on LSV curve according to claim 7, characterized in that: In step 6, the observation process of the LSV curve change trend is: Step 601, analyzing the LSV curve data and polishing parameters in the data warehouse, combining the collected voltage and current data, using the control software to analyze the real-time collected current value and the corresponding voltage value to draw the LSV curve, reflecting the latest measurement results on the chart, and dynamically displaying the LSV curve on the monitoring device, adjusting the refresh rate of the chart, and ensuring that the dynamic update of the curve is synchronized with the data collection; Step 602, monitoring the change trend of the LSV curve, observing the peak potential and peak current of the curve, identifying the voltage region where the current density does not change significantly - the limiting current density platform region, and judging whether the rhythm of the redox reaction and the material dissolution is balanced by analyzing the change trend of the limiting current platform region of the LSV curve, so as to subsequently analyze the formation principle of the surface quality after polishing; Step 603, judging the rhythm of the redox reaction, by observing the peaks and valleys on the LSV curve, judging the starting and ending points of the redox reaction equilibrium, analyzing the changing trends of the peak potential and the peak current, and understanding the rhythm changes; Step 604, judging the dissolution of the material, judging the dissolution of the material on the electrode according to the change of the current on the IT curve. If the current fluctuates significantly with the change of the potential, it indicates that the material is dissolving or other electrochemical processes are occurring; Step 605, for abnormal situation judgment, observe whether the LSV curve has abnormal fluctuations or deviates from the expected trend. If it is found that the current suddenly drops sharply to 0 or the current value increases abnormally, check the cause, including the anode terminal burning out, physical disconnection or electrolyte boiling.

9. The method for optimizing electrochemical polishing of metal materials based on LSV curve according to claim 8, characterized in that: In the determination of the redox reaction rhythm, the expression for analyzing the change trend of peak potential and peak current is: Among them, I peak is the peak current, that is, at the peak potential E peak I0 is the maximum current, that is, the current value when the electrode reaction is most intense, E is the potential, and E peak is the peak potential, that is, the potential value when the current reaches the maximum value on the LSV curve, and k is a constant; In the judgment of the dissolution equilibrium of the material, the expression for analyzing the fluctuation of the current with the change of the potential is: Where I is the current, I0 is the maximum current, i.e. the current value when the electrode reaction is most intense, E is the potential, E0 is the starting potential, i.e. the potential value when the LSV curve starts scanning, and k is a constant; In the abnormal situation judgment, the expression for analyzing the abnormal fluctuation or deviation of the LSV curve from the expected trend is: Where I is the current, I base is the reference current, that is, the current value expected under normal circumstances, ΔI is the current change, that is, the value of the current deviation from the reference current, E is the potential, E0 is the reference potential, that is, the potential value expected under normal circumstances, and k is a constant.

10. A metal material electrochemical polishing optimization system based on LSV curve, used to implement the metal material electrochemical polishing optimization method based on LSV curve according to any one of claims 1 to 9, characterized in that: The electrochemical polishing optimization system includes a data acquisition and monitoring module, a signal processing and analysis module, a parameter setting and adjustment module, an abnormality handling module, a data recording and backup module, and a report generation and feedback module, wherein the electrical signals between the modules are connected; The data acquisition and monitoring module is used to monitor the LSV curve or time-current curve during scanning or polishing in real time, and collect key data during the polishing process, including voltage, current, time, and timestamps of abnormal conditions; The signal processing and analysis module is used to process the collected signals, analyze the shape and characteristics of the LSV curve, identify the starting potential, the ending potential and the trend of the current changing with the potential, and evaluate the stability, width and current size of the limiting current platform area; The parameter setting and adjustment module sets and feeds back the voltage and current parameters during the polishing process according to the LSV curve analysis results, thereby realizing dynamic adjustment of the polishing process; The abnormality handling module monitors abnormal conditions during scanning or polishing, including a sharp drop or abnormal increase in current, and automatically stops the scanning or polishing process when an abnormality is detected; The data recording and backup module records and backs up all relevant data during the scanning and polishing process, including voltage, current, time, and timestamps of abnormal conditions; The report generation feedback module prepares a scanning and polishing process report, including monitoring results, abnormal conditions, measures taken and optimized polishing parameters.

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