Ultra-clean valve for semiconductor manufacturing

Abstract

The invention discloses an ultra-clean valve for semiconductor manufacturing, and relates to the technical field of parts for semiconductor manufacturing and parts of semiconductor production equipment, the ultra-clean valve mainly comprises an inlet joint, a discharge joint, a poppet core, an elastic piece, a dividing piece and a corrugated pipe main body, the dividing piece is fixed on the corrugated pipe main body and is positioned between two end surfaces of the corrugated pipe main body; the lifting core is fixedly connected with the dividing piece and can leave the inlet connector so that fluid can enter the discharging connector through the circulation space and the flowing channel. The ultra-clean valve for semiconductor manufacturing further comprises a pushing mechanism, and an output piece of the pushing mechanism is fixedly connected with the dividing piece and / or the poppet core and can drive the poppet core to move in the first direction. The friction between the poppet core and the inner wall of the ultra-clean valve for semiconductor manufacturing can be reduced, and the functions of the ultra-clean valve for semiconductor manufacturing and a common corrugated pipe valve can be achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of parts for semiconductor manufacturing and parts for semiconductor production equipment, and in particular to an ultra-clean valve for semiconductor manufacturing in an ultra-clean scenario for semiconductor manufacturing. Background Art

[0002] As a core area of ​​modern science and technology industry, semiconductor manufacturing has strict standards for the cleanliness of production environment and equipment. This is because in the semiconductor manufacturing process, even extremely small particle pollutants or impurities may have a significant negative impact on the performance, reliability and yield of semiconductor devices. Therefore, the semiconductor manufacturing process has high requirements for the valves used.

[0003] However, in current applications, the existing one-way valves have a more prominent problem. The guide mechanism of the poppet core of the existing one-way valve (generally directly using the inner wall of the one-way valve) is set inside the one-way valve. During use, the poppet core moves relative to the inner wall of the one-way valve or the guide mechanism, and the friction generated will inevitably generate particles. The appearance of these particles will seriously affect the cleanliness of the system. For some working environments with extremely high cleanliness requirements, such as gas pipelines used in semiconductor manufacturing, semiconductor manufacturing equipment such as lithography machines, and biopharmaceutical laboratories, it is undoubtedly a major hidden danger. Moreover, the current valve cannot be viewed from the outside to see whether it is open and closed, which is very inconvenient to use. Therefore, there is an urgent need for an ultra-clean valve for semiconductor manufacturing to solve the above technical problems. Summary of the invention

[0004] The object of the present invention is to provide an ultra-clean valve for semiconductor manufacturing to solve the problems existing in the above-mentioned prior art, so that the open and closed states are easy to observe and the friction between the poppet core and the inner wall of the ultra-clean valve for semiconductor manufacturing can be reduced.

[0005] To achieve the above object, the present invention provides the following solutions: In the first aspect, the present invention provides an ultra-clean valve for semiconductor manufacturing, comprising an inlet joint, an outlet joint, a poppet core, an elastic member, a partition and a bellows body, wherein the inlet joint, the bellows body and the outlet joint are sequentially arranged and connected along a first direction, the poppet core and the elastic member are sequentially arranged inside the bellows body along the first direction, the two ends of the elastic member are respectively abutted against the outlet joint and the poppet core, the partition is fixed on the bellows body, and the poppet core and the partition are fixedly connected by a connecting member.

[0006] In some embodiments, a guide rod is further included. The guide rod is arranged parallel to the outer side of the bellows body, and the guide rod is slidably connected to the inlet joint and / or the outlet joint, and the partition is fixedly connected to the guide rod.

[0007] In some embodiments, the dividing member is a dividing ring, and the connecting member is a plurality of connecting rods, the plurality of connecting rods are arranged along the circumference of the lifting core, and the two ends of the connecting rods are respectively fixedly connected to the dividing ring and the lifting core, the dividing ring is annular, and can divide the bellows body into a first bellows and a second bellows, the first bellows is fixedly connected to the inlet joint, and the second bellows is fixedly connected to the outlet joint.

[0008] In some embodiments, the split ring protrudes from the outer wall of the bellows body, the connecting rod passes through the outer wall of the bellows body, and the connecting rod is sealingly connected to the bellows body.

[0009] In a second aspect, the ultra-clean valve for semiconductor manufacturing provided by the present invention further comprises a driving mechanism, wherein an output member of the driving mechanism is fixedly connected to the partition member and / or the poppet core and can drive the poppet core to move along the first direction.

[0010] In some embodiments, the pushing mechanism includes a lead screw and a nut, wherein the lead screw is arranged outside the bellows body along the length direction of the bellows body and is fixedly connected to the guide rod, and the nut is rotatably arranged on the entry joint and can rotate around its own axis, and the nut is threadedly connected to the outside of the lead screw.

[0011] In some embodiments, a connecting bridge is further included, wherein the connecting bridge is sleeved on the outside of the bellows body, and two ends of the connecting bridge are respectively fixedly connected to the inlet joint and the outlet joint.

[0012] In some embodiments, a sliding member is further included, which is slidably mounted on the connecting bridge, and the sliding member forms an axially fixed and circumferentially rotatable connection with the nut, and a first limiting hole and a second limiting hole are respectively provided on the sliding member and the connecting bridge, and the limiting member can pass through the first limiting hole and the second limiting hole in sequence and limit the sliding member and the connecting bridge.

[0013] In some embodiments, it also includes a guide cylinder, a second spring, a rocker arm, and a support rod. The first limiting hole and the second limiting hole are both smooth holes. The limiting member is a pin. The support rod is fixedly connected to the sliding member. The guide cylinder is hinged to the pin. The guide cylinder is slidably connected to the first end of the rocker arm. The second end of the rocker arm is hinged to the support rod. The second spring is sleeved on the rocker arm, and the second spring can be in a compressed state.

[0014] In some embodiments, it also includes a latch tooth and a buckle, wherein the latch tooth is fixedly disposed on the outer wall of the nut along the circumference of the nut, the buckle is fixedly connected to the rocker arm via a connecting rod, and the buckle can be engaged with the latch tooth.

[0015] Compared with the prior art, the present invention has achieved the following technical effects: The present invention provides an ultra-clean valve for semiconductor manufacturing, wherein a splitter can split a bellows body into a first part of the bellows and a second part of the bellows. When a fluid enters from an inlet joint, the fluid impacts a poppet core, and the poppet core moves in a direction away from the inlet joint, and then the splitter also moves in a direction away from the inlet joint. At this time, the first part of the bellows connected to the inlet joint is extended, and the second part of the bellows connected to the discharge joint is compressed and shortened. The poppet core only slides in the flow space in the first part of the bellows, and does not move relative to the second part of the bellows, and has no friction with the second part of the bellows. Compared with the prior art, the relative sliding of the poppet core and the inner wall of the sliding cavity is converted into the extension and compression of the bellows body, reducing the friction between the poppet core and the inner wall of the ultra-clean valve for semiconductor manufacturing, thereby reducing the particles generated by the friction, ensuring the clean environment in the ultra-clean valve for semiconductor manufacturing, and meeting the requirements for semiconductor manufacturing and semiconductor gas path cleanliness and other aspects for semiconductor manufacturing. Similarly, the opening and closing states of the valve can be observed by observing the compression and extension of the bellows body, which is simple to observe and can meet the scene and operation requirements of semiconductor manufacturing. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 This is a schematic diagram of the structure of an ultra-clean valve for semiconductor manufacturing in Embodiment 1 of the present invention; Figure 2 This is a three-dimensional structural diagram of an ultra-clean valve for semiconductor manufacturing in Embodiment 1 of the present invention; Figure 3This is a schematic diagram of an installation connection bridge for an ultra-clean valve for semiconductor manufacturing in Embodiment 1 of the present invention; Figure 4 This is a schematic diagram of the structure of an ultra-clean valve for semiconductor manufacturing in Embodiment 2 of the present invention; Figure 5 This is a schematic diagram of the structure of an ultra-clean valve for semiconductor manufacturing when a pin is inserted in Embodiment 3 of the present invention; Figure 6 This is a schematic diagram of the structure of an ultra-clean valve for semiconductor manufacturing when the pin is pulled out in the third embodiment of the present invention; Figure 7 This is a three-dimensional structural diagram of an ultra-clean valve for semiconductor manufacturing when a pin is inserted in Embodiment 3 of the present invention; Figure 8 This is a three-dimensional structural diagram of an ultra-clean valve for semiconductor manufacturing when a pin is inserted in Embodiment 3 of the present invention; Fig. 9 for Figure 8 Enlarged view of point A in the middle.

[0018] In the figure: 101-entry joint; 102-discharge joint; 1-lifting core; 2-dividing piece; 201-dividing ring; 202-connecting rod; 3-flow space; 4-sealing ring; 5-bellows body; 501-first bellows; 502-second bellows; 6-guide rod; 7-flange; 8-guide hole; 9-connecting bridge; 901-second limiting hole; 10-sliding piece; 11-bolt; 12-screw; 13-nut; 14-guide cylinder; 15-pin; 16-rocker; 17-connecting rod; 18-buckle; 19-support rod; 20-grip; 21-guide cylinder; 22-second spring; 23-first spring. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0020] The purpose of the present invention is to provide an ultra-clean valve for semiconductor manufacturing to solve the problems existing in the prior art, so that the open and closed states are easy to observe and the friction between the poppet core and the inner wall of the ultra-clean valve for semiconductor manufacturing can be reduced.

[0021] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0022] Embodiment 1 like Figure 1-Figure 3 As shown, the present invention provides an ultra-clean valve for semiconductor manufacturing, including an inlet joint 101, an outlet joint 102, a poppet core 1, an elastic member, a partition 2 and a bellows body 5, wherein the inlet joint 101, the bellows body 5 and the outlet joint 102 are sequentially arranged and connected along a first direction, wherein the inlet joint 101 and the outlet joint 102 are respectively connected to a hard pipe, thereby ensuring that the relative positions of the inlet joint 101 and the outlet joint 102 do not change, the poppet core 1 and the elastic member are sequentially arranged inside the bellows body 5 along the first direction, the two ends of the elastic member are respectively abutted against the outlet joint 102 and the poppet core 1, preferably fixedly connected, the elastic member is preferably a first spring 23, and the end of the poppet core 1 close to the inlet joint 101 can block the inlet joint 101. The partition 2 is fixed on the bellows body 5 and is located between the two end surfaces of the bellows body 5 in the first direction. The lifting core 1 and the partition 2 are fixedly connected by a connecting piece. A flow space 3 can be formed between the lifting core 1 and the bellows body 5 through the connecting piece. The flow space 3 allows the fluid to enter the lifting core 1. Specifically, the partition 2 can divide the bellows body 5 into a first bellows 501 and a second bellows 502. One end of the first bellows 501 is sealed and fixedly connected to the inlet joint 101, the other end of the first bellows 501 is sealed and fixedly connected to the first end of the partition 2, one end of the second bellows 502 is sealed and fixedly connected to the second end of the partition 2, and the other end of the second bellows 502 is sealed and fixedly connected to the outlet joint 102. The lifting core 1 is sealed and fixedly connected to the dividing piece 2, and the lifting core 1 includes a sealing end, which can seal the entry joint 101. The sealing end is arranged close to the entry joint 101, and under the elastic force of the elastic member, the sealing end can seal the entry joint 101. There is a flow space 3 between the outer wall of the lifting core 1 and the inner wall of the first corrugated tube 501, and the flow channel is farther away from the entry joint 101 than the sealing end.

[0023] Under the impact of the fluid, the lifting core 1 can leave the inlet joint 101 so that the fluid can enter the outlet joint 102 through the flow space 3 and the flow channel in sequence. Since the lifting core 1 is fixed compared to the partition 2, the partition 2 is fixedly connected to the first bellows 501 and the second bellows 502. When the fluid enters from the inlet joint 101, the fluid impacts the lifting core 1, and the lifting core 1 moves in the direction away from the inlet joint 101, and then the partition 2 also moves in the direction away from the inlet joint 101. At this time, the first bellows 501 connected to the inlet joint 101 is extended, and the second bellows 502 connected to the outlet joint 102 is compressed and shortened. The lifting core 1 only moves in the flow space 3 in the first bellows 501, and does not move relative to the second bellows 502, and has no friction with the second bellows 502. Compared with the prior art, the relative sliding between the poppet core 1 and the inner wall of the sliding cavity is converted into the extension and compression of the bellows body 5, reducing the friction between the poppet core 1 and the inner wall of the ultra-clean valve for semiconductor manufacturing, thereby reducing the particles generated by friction, and ensuring the clean environment in the ultra-clean valve for semiconductor manufacturing. It meets the requirements for semiconductor manufacturing scene cleanliness and semiconductor gas path cleanliness, etc.

[0024] As a preferred embodiment, the splitter 2 is a split ring 201, the connecting member is a connecting rod 202, and multiple of them are arranged along the circumference of the poppet core 1. The split ring 201 is fixedly connected to one end of the multiple connecting rods 202, and the poppet core 1 is fixedly connected to the other end of the multiple connecting rods 202. The connecting rods 202 are at a certain distance from the inner wall of the bellows body 5. The space supported by the connecting rods 202 is the flow space 3 mentioned above. The diameter of the split ring 201 is the same as the outer diameter of the bellows body 5 and is annular. Further preferably, the split ring 201 protrudes from the outer wall of the bellows body 5, that is, the first bellows 501 and the second bellows 502 are fixedly connected by the split ring 201, and the split ring 201 can be exposed on the outside of the bellows body 5. The staff can know the opening and closing state of the ultra-clean valve for semiconductor manufacturing by observing the position of the splitter 2. The visibility of the switch can be achieved without resorting to extra structures or operations, which meets the requirements for semiconductor manufacturing scene cleanliness, semiconductor gas path cleanliness, and other aspects.

[0025] Compared with the bellows valve of the existing patent, the ultra-clean valve for semiconductor manufacturing in this embodiment is equipped with a mechanical structure, such as a partition 2, on the outside of the bellows body 5, so that the user can observe the switch state of the ultra-clean valve for semiconductor manufacturing, and the mechanical structure is arranged on the outside of the bellows body 5 so that the particulate matter inside the bellows body 5 is reduced. The bellows valve of the existing patent isolates the mechanical structure inside the bellows through the bellows, and the fluid flows in the space between the outside of the bellows and the outer shell. This setting method is to reduce the particulate matter outside the bellows. However, the outside of the bellows is squeezed by the fluid and other media, and the bellows is easy to sink inward and deform, resulting in a reduced service life. The inside of the bellows body 5 of this embodiment is extremely clean, and will not be sunken and deformed by the pressure of the fluid, and has a long service life, which meets the requirements for semiconductor manufacturing such as the cleanliness of the semiconductor manufacturing scene and the cleanliness of the semiconductor gas path.

[0026] Moreover, the split ring may not protrude from the outer wall of the bellows body 5, that is, the split ring is completely located inside the bellows body 5. At this time, observing the elongation and shortening of the two parts of the bellows body 5 can also determine the opening and closing status of the ultra-clean valve for semiconductor manufacturing.

[0027] It should be noted that the split ring 201 can also be arranged in other ways, such as being arranged inside the bellows body 5 and not protruding from the bellows body 5, or being flush with the outer wall of the bellows body 5. The connection piece can also be arranged in other ways, such as being arranged as a cylinder with a plurality of openings on the side wall.

[0028] Other things that need to be explained are: Figure 3 As shown, when the inlet connector 101 and the outlet connector 102 are connected to the hoses respectively, a connecting bridge 9 needs to be arranged between the inlet connector 101 and the outlet connector 102. The two ends of the connecting bridge 9 are respectively fixedly connected to the inlet connector 101 and the outlet connector 102. The connecting bridge 9 can be a cylindrical structure or a plurality of rods arranged around the circumference of the bellows body 5. The connecting bridge 9 can clamp the bellows body 5, reduce the risk of the bellows body 5 bursting due to excessive internal fluid pressure, and better meet the requirements for semiconductor manufacturing scene cleanliness and semiconductor gas path cleanliness and other aspects.

[0029] In some embodiments, the ultra-clean valve for semiconductor manufacturing further includes a guide rod 6, which is arranged on the outside of the bellows body 5 in parallel with the axial direction of the bellows body 5, and the guide rod 6 is slidably connected to the inlet joint 101 and / or the outlet joint 102, and the partition 2 is fixedly connected to the guide rod 6. By observing the movement of the guide rod 6, the opening and closing state of the ultra-clean valve for semiconductor manufacturing can be determined.

[0030] As a preferred embodiment, one end of the guide rod 6 is slidably connected to the inlet joint 101, and the other end is slidably connected to the outlet joint 102, and the partition 2 is fixedly connected to the guide rod 6. Specifically, flanges 7 are provided on the inlet joint 101 and the outlet joint 102, and guide holes 8 are provided on the flange 7. The guide rod 6 can only slide along the guide hole 8, and the partition 2 is fixed to the guide rod 6, so that the partition 2 and the poppet core 1 connected thereto are constrained and guided by the guide rod 6 during the movement, and can only move linearly along the length direction of the guide rod 6, which can effectively avoid the occurrence of instability such as offset and shaking under fluid impact, and can improve the stability of the movement of the valve internal components of the entire semiconductor manufacturing ultra-clean valve, thereby ensuring the reliability of the operation of the semiconductor manufacturing ultra-clean valve, so that the cleanliness of the semiconductor manufacturing scene and the cleanliness of the semiconductor gas path and other requirements for semiconductor manufacturing can be guaranteed. In this embodiment, the opening and closing state of the semiconductor manufacturing ultra-clean valve can be determined by observing the extended length of the guide rod 6 relative to the outlet joint 102. Furthermore, scale lines may be provided on the guide rod 6 or different color segments may be marked at different lengths, so that the degree of opening and closing of the ultra-clean valve for semiconductor manufacturing can be observed more clearly.

[0031] It should be noted that one end of the guide rod 6 can be fixed to the inlet joint 101 and the other end can be slidably connected to the outlet joint 102; or one end of the guide rod 6 can be slidably connected to the inlet joint 101 and the other end can be fixedly connected to the inlet joint 101.

[0032] As a preferred embodiment, multiple guide rods 6 are arranged along the circumference of the bellows body 5. Multiple guide rods 6 are distributed along the circumference. Multiple constraint points constrain and guide the partition 2 and the poppet core 1. Compared with a single guide rod 6, it can more effectively prevent them from deflecting, swinging or rotating during movement, making the movement trajectory of the poppet core 1 more stable and precise, ensuring that the poppet core 1 can accurately reach the predetermined position during the opening and closing process of the ultra-clean valve for semiconductor manufacturing, and realize reliable one-way conduction or cutoff function, which meets the requirements for semiconductor manufacturing scene cleanliness and semiconductor gas path cleanliness and other aspects.

[0033] In some embodiments, a water inlet is provided on the side of the poppet core 1, a water outlet is provided at one end of the poppet core 1 away from the inlet joint, and a flow space 3 exists between the outer wall of the poppet core 1 and the inner wall of the first bellows 501. After the fluid enters through the inlet joint 101, it can sequentially pass through the flow space 3, the water inlet, the flow channel, the water outlet, the second bellows 502 and the outlet joint 102. The blocking end of the poppet core 1 fits the inlet joint, which can block the inlet joint 101, so that the ultra-clean valve for semiconductor manufacturing is closed, and can effectively prevent the fluid from flowing in the direction opposite to the first direction. When the fluid flows in the first direction, under the impact of the fluid, the blocking end of the poppet core 1 leaves the entry joint, so that the ultra-clean valve for semiconductor manufacturing is opened. The fluid mainly passes through the internal channel of the poppet core 1 and the flow space 3, integrating the functions of fluid guidance, control and unidirectional conduction in a relatively compact structure, reducing additional components and connections, making the structure of the entire ultra-clean valve for semiconductor manufacturing more concise and compact, not only saving installation space, but also reducing the complexity and potential failure points of the system, and improving the reliability and maintainability of the system. It meets the requirements for semiconductor manufacturing, such as the cleanliness of semiconductor manufacturing scenes and the cleanliness of semiconductor gas paths.

[0034] In some embodiments, the ultra-clean valve for semiconductor manufacturing further includes a sealing ring 4, which is fixedly arranged at one end of the inlet joint 101 near the poppet core 1. When the poppet core 1 blocks the inlet joint 101, the sealing ring 4 can fill the small gap between the poppet core 1 and the inlet joint 101, effectively preventing the fluid from leaking from these gaps, ensuring the sealing of the ultra-clean valve for semiconductor manufacturing when it is closed, preventing the fluid from flowing in the direction opposite to the first direction, and improving the working reliability of the ultra-clean valve for semiconductor manufacturing. The sealing ring 4 can select suitable materials (such as rubber, polytetrafluoroethylene, etc.) according to different working environments and fluid media, so as to adapt to different working conditions such as temperature, pressure and chemical corrosion. For example, a high temperature resistant sealing ring material can be selected in a high temperature environment, and a corrosion resistant sealing ring material can be selected in a corrosive medium. Moreover, the sealing ring 4 usually has a certain elasticity and flexibility, and can play a buffering role during the contact and separation process between the poppet core 1 and the inlet connector 101, reducing the direct friction and wear between the two, which can not only extend the service life of the poppet core 1 and the inlet connector 101, but also reduce the pollution of the fluid in the valve by particles generated by wear, which helps to maintain a clean environment in the valve and maintain the normal operation of ultra-clean valves for semiconductor manufacturing. It meets the requirements for semiconductor manufacturing scene cleanliness and semiconductor gas path cleanliness, and is particularly suitable for semiconductor manufacturing and production.

[0035] Embodiment 2 like Figure 4As shown, this embodiment can also provide a convertible ultra-clean valve for semiconductor manufacturing on the basis of the first embodiment, including a push mechanism and the ultra-clean valve for semiconductor manufacturing in the first embodiment, and the output member of the push mechanism is fixedly connected to the partition 2 and / or the poppet core 1. Preferably, the output member of the push mechanism is fixedly connected to the partition 2, and the output member of the push mechanism can drive the partition 2 to move along the length direction of the bellows body 5, thereby driving the poppet core 1 to move. When the output member of the push mechanism finally drives the poppet core 1 to leave the entry joint 101, the ultra-clean valve for semiconductor manufacturing plays the role of a bellows valve, and the fluid can flow in both directions. When the output member of the push mechanism moves to different positions, the distance of the poppet core 1 from the entry joint 101 changes, and the opening of the ultra-clean valve for semiconductor manufacturing also changes. When the output member of the push mechanism makes the poppet core 1 fit the entry joint, the ultra-clean valve for semiconductor manufacturing still plays the role of a one-way valve. The ultra-clean valves used in semiconductor manufacturing can quickly and conveniently switch their working states, which is more applicable in the small space scenarios of semiconductor manufacturing. Compared with valves with other settings, they can occupy a smaller space, making it easier to ensure the cleanliness of the small space during the semiconductor manufacturing process. This can meet the requirements for semiconductor manufacturing, such as the cleanliness of semiconductor manufacturing scenarios and the cleanliness of semiconductor gas paths.

[0036] It needs to be explained in detail that when the pushing mechanism is arranged on the outside of the bellows body, the output member of the pushing mechanism is fixedly connected to the dividing member 2; when the pushing mechanism is arranged inside the bellows body, the output member of the pushing mechanism is fixedly connected to the lifting core 1. Specifically, a small electrically driven driving member may be arranged, and the main body of the small driving member may be arranged inside the entry joint 101 and fixedly connected to the entry joint 101. The small driving member may be provided with a push rod, and the push rod is fixedly connected to the lifting core 1.

[0037] In some embodiments, the pushing mechanism includes a lead screw 12 and a nut 13. The nut 13 is rotatably arranged on the entry joint 101 and can rotate around its own axis. The lead screw 12 is arranged along the length direction of the bellows body 5 and is fixedly connected to the splitter 2. Further preferably, the lead screw 12 is arranged in parallel with the guide rod 6 and a connecting component is arranged on the lead screw 12. The lead screw 12 is fixedly connected to the guide rod 6 through the connecting component, and the lead screw 12 and the nut 13 are threadedly connected. Among them, the lead screw 12 is a hollow bolt, and the hollow bolt is sleeved outside the bellows body 5. By turning the nut 13, the movement of the lead screw 12 can be controlled, and the lead screw 12 drives the splitter 2 to move. The splitter 2 changes the length of the first bellows 501 and the second bellows 502, and can also change the position of the lifting core 1. When the lead screw 12 drives the partition 2 to move toward the side close to the discharge connector 102, the poppet core 1 can leave the inlet connector 101, and when it moves to different positions, the distance between the poppet core 1 and the inlet connector 101 changes, which can change the opening of the ultra-clean valve for semiconductor manufacturing. At this time, the original ultra-clean valve for semiconductor manufacturing is a bellows valve, which can realize the two-way circulation of the fluid and the regulation of the flow rate. When the poppet core 1 contacts the inlet connector 101, the function of the one-way valve can be realized. It can integrate the functions of the one-way valve and the bellows valve. By screwing the nut 13, the two working modes can be flexibly switched. It can be used as a one-way valve, which only allows the fluid to flow in one direction, meeting the need to prevent the fluid from flowing back under specific working conditions; it can also be converted into a bellows valve when needed to realize the two-way circulation of the fluid, greatly improving the scope of application of the ultra-clean valve for semiconductor manufacturing in this embodiment, reducing the types and number of valves in the system, and being more applicable in the small space scene of semiconductor manufacturing, meeting the requirements for semiconductor manufacturing such as the cleanliness of the semiconductor manufacturing scene and the cleanliness of the semiconductor gas path.

[0038] It should be noted that the screw 12 can also be arranged in other ways, for example, instead of being arranged as a hollow bolt, it can be arranged as an ordinary screw rod. When only one screw rod is arranged above the bellows body 5, the nut can be rotatably arranged above the entry joint 101. When multiple screw rods are arranged along the circumference of the bellows body 5, the nut 13 can be arranged as a ring nut and sleeved on the entry joint 101.

[0039] It should also be noted that, when the guide rod 6 is not provided, the lead screw 12 can also be directly fixedly connected to the partition 2 via a connecting component.

[0040] As a feasible embodiment, the driving mechanism can also adopt other structures, such as a hydraulic cylinder, the hydraulic rod of the hydraulic cylinder is fixedly connected to the partition, but when the ultra-clean valve used in semiconductor manufacturing plays the role of a one-way valve, the movement of the hydraulic rod must be ensured to be the same as the movement of the lifting core.

[0041] In some embodiments, the ultra-clean valve for semiconductor manufacturing further includes a connecting bridge 9, which is sleeved on the outside of the bellows body 5, and the two ends of the connecting bridge 9 are respectively fixedly connected to the inlet joint 101 and the outlet joint 102. The connecting bridge 9 can realize the relative position fixation of the inlet joint 101 and the outlet joint 102, and the connecting bridge 9 can enclose the bellows body 5. Even if the fluid pressure inside the bellows body 5 is too high, the connecting bridge 9 can clamp the bellows body 5, reducing the risk of the bellows body 5 bursting, so that the service life of the ultra-clean valve for semiconductor manufacturing is longer, and it is more in line with the requirements for semiconductor manufacturing such as the cleanliness of the semiconductor manufacturing scene and the cleanliness of the semiconductor gas path.

[0042] As a preferred embodiment, it is different from using the upper lead screw nut to adjust the opening of the ultra-clean valve for semiconductor manufacturing. This embodiment sets up an ultra-clean valve for semiconductor manufacturing, which also includes a sliding member 10 and a connecting bridge 9. The connecting bridge 9 is sleeved on the outside of the bellows body 5 and is fixedly connected to the inlet joint 101 and the outlet joint 102. The sliding member 10 is slidably sleeved on the connecting bridge 9, and the sliding member 10 and the nut 13 form an axially fixed and circumferentially rotatable connection. Specifically, it can be connected through a bearing, the sliding member 10 is fixedly connected to the inner ring of the bearing, and the nut 13 is fixedly connected to the outer ring of the bearing. The sliding member 10 and the connecting bridge 9 are respectively provided with a first limiting hole and a second limiting hole 901, and the limiting member can pass through the first limiting hole and the second limiting hole 901 in sequence, and can lock the sliding member 10 and the connecting bridge 9 to limit the position. When it is necessary to adjust the opening of the ultra-clean valve for semiconductor manufacturing to play the role of a bellows valve, it is only necessary to pull the sliding member to slide relative to the connecting bridge, and the sliding member 10 drives the partition 2 and the lead screw 12 and the nut 13 to move as a whole. After the opening is adjusted appropriately, the limiter is sequentially passed through the first limit hole and the second limit hole aligned therewith, so that the ultra-clean valve for semiconductor manufacturing is kept in a normally open state and acts as a bellows valve. The connecting bridge 9 is sleeved on the outside of the bellows body 5 and is fixedly connected to the inlet connector 101 and the outlet connector 102, which plays a role of strengthening and protection, and can enhance the stability of the entire bellows body 5. The sliding member 10 is slidably arranged on the connecting bridge 9, and the sliding member 10 cannot rotate relative to the connecting bridge 9. By dragging the sliding member 10, the sliding member 10 can drive the lead screw 12 and the nut 13 to slide as a whole, and then the position of the partition 2 can be directly adjusted, and the back-and-forth conversion from a one-way valve to a bellows valve can be realized. The opening of the bellows valve can be adjusted by sliding the sliding part of the sliding part of this embodiment, and the opening of the bellows valve can also be adjusted by the screw nut mechanism. The two operation methods can be flexibly selected according to the usage scenario and adjustment requirements, which meets the requirements of semiconductor manufacturing scene cleanliness, semiconductor gas path cleanliness and other aspects for semiconductor manufacturing.

[0043] It should be noted that the sliding member 10 may be a sliding cylinder or a sliding block, and the connecting bridge 9 may be a connecting cylinder or a connecting rod.

[0044] As a preferred embodiment, a plurality of first limiting holes are provided in the length direction of the sliding member 10, a plurality of second limiting holes 901 are provided in the length direction of the connecting bridge 9, and both the first limiting hole and the second limiting hole 901 are bolt holes, and the limiting member is a bolt 11. By inserting the limiting member into the first limiting hole and the second limiting hole 901 at different positions, the opening of the ultra-clean valve for semiconductor manufacturing can be adjusted. When the sliding member 10 is dragged to move in the direction close to the discharge joint 102, the limiting member can be controlled to insert into the first limiting hole and the second limiting hole 901 closest to the discharge joint 102, and the poppet core 1 is in a state of leaving the entry joint 101. At this time, the ultra-clean valve for semiconductor manufacturing plays the role of a bellows valve, and the opening is the largest at this time. When the sliding member 10 is dragged to move in the direction close to the entry joint 101 until the blocking end of the poppet core 1 is attached to the entry joint 101, the limiting member can be controlled to insert into the first limiting hole and the second limiting hole 901 closest to the entry joint 101. At this time, the ultra-clean valve for semiconductor manufacturing plays the role of a one-way valve. By dragging the sliding part 10 to change the working state of the ultra-clean valve for semiconductor manufacturing, it is more direct and faster to adjust than through the screw nut structure. It saves more operation time in the precise environment of semiconductor manufacturing and meets the requirements of semiconductor manufacturing scene cleanliness, semiconductor gas path cleanliness and other aspects for semiconductor manufacturing.

[0045] It should be noted that the nut end of the bolt 11 can be set to be magnetic or a rope can be wound around the nut end. When a magnetic nut is used, the nut end of the bolt 11 can be adsorbed on the sliding member 10 or the connecting bridge 9 after the bolt 11 is unscrewed. When a rope-tethered nut is used, the rope can be tied to the sliding member 10 or the connecting bridge 9 to avoid the loss of the bolt 11. In addition, the number of the first limiting hole can be one, and the number of the second limiting holes 901 can be multiple.

[0046] It should also be noted that the bolt 11 can also adopt other forms of structures, such as a magnetic rod, and the first limiting hole and the second limiting hole 901 are both set as through holes without threads, and the magnetic rod is limited in the first limiting hole and the second limiting hole 901 through magnetic adsorption.

[0047] Embodiment 3 like Figure 5-Figure 9As shown, unlike the first limiting hole and the second limiting hole of the second embodiment, bolt holes are used, and the limiting member is a bolt. The ultra-clean valve for semiconductor manufacturing of this embodiment includes a guide cylinder 21, a second spring 22, a swing rod 16 and a support rod 19. The first limiting hole and the second limiting hole 901 are both smooth holes, and the limiting member is a pin 15. The support rod 19 is fixedly connected to the sliding member 10, the guide cylinder 21 is hinged to the pin 15, the first end of the swing rod 16 is slidably connected to the guide cylinder 21, the second end of the swing rod 16 is hinged to the support rod 19, and the second spring 22 is sleeved on the swing rod 16, and the spring is in a compressed state. Through the linkage of the swing rod 16, the guide cylinder 21 and other components, the operator only needs to press or lift the swing rod 16 to quickly insert or pull out the pin 15 into or out of the smooth hole, so as to adjust the position of the sliding member 10, thereby adjusting the valve opening and working mode, and maintaining the pull-out or insertion state of the pin 15 through the second spring 22. Compared with the bolt connection method, there is no need to use tools to tighten or loosen the bolts, the operation is faster and more convenient, the valve state can be changed in a short time, and the work efficiency is improved. Preferably, a guide cylinder 14 is also provided above the first limit hole of the sliding member 10, and the pin 15 can pass through the guide cylinder 14, the first limit hole and the second limit hole 901 in sequence. The setting of the guide cylinder 14 makes the insertion and extraction operation of the pin 15 smoother and more accurate. When the operator operates the rocker 16, the pin 15 can be inserted into or pulled out of the smooth hole more stably along the path of the guide cylinder 14, which can reduce the possibility of deviation or jamming during the insertion of the pin 15, further improving the convenience and efficiency of the operation, and meeting the requirements for semiconductor manufacturing such as the cleanliness of the semiconductor manufacturing scene and the cleanliness of the semiconductor gas path.

[0048] It should be further explained that, when the pin 15 is fully inserted into the guide cylinder 14, and when the pin 15 is pulled out of the guide cylinder 14, the compression amount of the second spring 22 is the smallest in these two cases; when the swing rod 16 and the sliding member 10 are in a parallel state, that is, when the second spring 22 is in a horizontal state, the compression amount of the second spring 22 is the largest. The setting of the second spring 22 allows the pull-out state and the insertion state of the pin 15 to remain relatively stable, and can facilitate the buckle 18 and the buckle 20. It makes the operation smoother and simpler, greatly saves time in the semiconductor manufacturing process, and can improve the production quality of semiconductors to a certain extent.

[0049] In some embodiments, the ultra-clean valve for semiconductor manufacturing further includes a latch 20 and a buckle 18, wherein the latch 20 is fixedly arranged on the outer wall of the nut 13 along the circumference of the nut 13, and the buckle 18 is fixedly connected to the swing rod 16 through the connecting rod 17, and the latch 20 is engaged with the buckle 18. The latch 20 cannot rotate around its own axis, and thus the nut 13 cannot rotate around its own axis. When the ultra-clean valve for semiconductor manufacturing plays the role of a one-way valve, the poppet core 1 drives the splitter 2 to move along the length direction of the bellows body 5, and the splitter 2 drives the lead screw 12 to move along the length direction of the bellows body 5. Since the nut 13 cannot rotate, the lead screw 12 drives the nut 13 to move along the length direction of the bellows body 5, and the nut 13 is connected to the sliding member 10 through a bearing, so that the poppet core 1 finally drives the sliding member 10 to slide on the connecting bridge 9. Preferably, the connecting bridge 9 and the sliding member 10 can be connected by a slider slot structure, and a slot can be set on the connecting bridge 9, and a slider can be set on the sliding member 10. The slider slides in the slide groove. On the one hand, the slider slide groove structure can provide a sliding guide, and on the other hand, it can prevent the slider 10 from rotating relative to the connecting bridge 9. Ensuring the stability of the connection and avoiding connection failure is very important for semiconductor manufacturing. The manufacturing of semiconductors requires relatively precise operations, and a stable connection can meet the requirements for semiconductor manufacturing scene cleanliness and semiconductor gas path cleanliness.

[0050] Specifically, the slide structure can be set as a dovetail groove or a T-shaped groove, and the slider is set to a dovetail slider or a T-shaped slider with a corresponding cross section. The setting of the latch 20 and the buckle 18 can realize the interlocking or interlocking relationship between the rotation operation of the nut 13 and the action of the swing rod 16. When it is necessary to adjust the opening of the ultra-clean valve for semiconductor manufacturing or switch the working mode, the action of the swing rod 16 drives the connecting rod 17, thereby causing the latch 20 to interact with the buckle 18. Only when the pin 15 is in the inserted state, the latch 20 can be separated from the buckle 18, allowing the nut 13 to rotate, and the opening of the ultra-clean valve for semiconductor manufacturing can be adjusted by the screw 12 nut 13 mechanism. When the pin 15 is away from the guide cylinder 14, the latch 20 is engaged with the buckle 18, and the nut 13 cannot rotate at this time, which can avoid the rotation of the nut 13 due to the sliding of the lifting core 1, thereby reducing the wear of the nut 13. Therefore, this interlocking or interlocking mechanism can improve the sealing reliability and sealing accuracy of the ultra-clean valve for semiconductor manufacturing, reduce the risk of leakage, and the open state can be kept stable. And the stable state is maintained so that the flow coefficient (CV value) of the ultra-clean valve for semiconductor manufacturing remains fixed. It should be noted that the latch 20 is preferably a Y-shaped latch, and the buckle 18 slides in from the upper part of the Y-shaped latch and is stuck in the lower part of the Y-shaped latch. It is not easy to slide out, and the clamping is relatively stable, so that the requirements for semiconductor manufacturing such as the cleanliness of the semiconductor manufacturing scene and the cleanliness of the semiconductor gas path can be met.

[0051] Another thing that needs to be generally explained is that the fixed connections between the various components in Embodiment 1, Embodiment 2 and Embodiment 3 all need to be set as sealed fixed connections to increase safety in use.

[0052] The present invention uses specific examples to illustrate the principles and implementation methods of the present invention. The above examples are only used to help understand the method and core ideas of the present invention. At the same time, for those skilled in the art, according to the ideas of the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as limiting the present invention.

Claims

1. An ultra-clean valve for semiconductor manufacturing, characterized in that: The invention comprises an inlet joint (101), an outlet joint (102), a lifting core (1), an elastic member, a partition (2) and a bellows body (5); the inlet joint (101), the bellows body (5) and the outlet joint (102) are arranged in sequence and connected along a first direction; the lifting core (1) and the elastic member are arranged in sequence inside the bellows body (5) along the first direction; two ends of the elastic member are respectively in contact with the outlet joint (102) and the lifting core (1); the partition (2) is fixed to the bellows body (5); and the lifting core (1) and the partition (2) are fixedly connected via a connecting member.

2. The ultra-clean valve for semiconductor manufacturing according to claim 1, characterized in that: It also comprises a guide rod (6), the guide rod (6) being arranged parallel to the outside of the bellows body (5), the guide rod (6) being slidably connected to the inlet joint (101) and / or the outlet joint (102), and the partition (2) being fixedly connected to the guide rod (6).

3. The ultra-clean valve for semiconductor manufacturing according to claim 1, characterized in that: The splitting member (2) is a splitting ring (201), and the connecting member is a plurality of connecting rods (202). The plurality of connecting rods (202) are arranged along the circumference of the lifting core (1), and the two ends of the connecting rods (202) are respectively fixedly connected to the splitting ring (201) and the lifting core (1). The splitting ring (201) is annular and can split the bellows body into a first bellows (501) and a second bellows (502). The first bellows (501) is fixedly connected to the inlet joint (101), and the second bellows (502) is fixedly connected to the outlet joint (102).

4. The ultra-clean valve for semiconductor manufacturing according to claim 3, characterized in that: The split ring (201) protrudes from the outer wall of the bellows body (5), the connecting rod (202) passes through the outer wall of the bellows body (5), and the connecting rod (202) is sealedly connected to the bellows body (5).

5. The ultra-clean valve for semiconductor manufacturing according to claim 2, characterized in that: It also comprises a pushing mechanism, wherein an output member of the pushing mechanism is fixedly connected to the partition member (2) and / or the poppet core (1), and is capable of driving the poppet core (1) to move along the first direction.

6. The ultra-clean valve for semiconductor manufacturing according to claim 5, characterized in that: The pushing mechanism comprises a lead screw (12) and a nut (13); the lead screw (12) is arranged outside the bellows body (5) along the length direction of the bellows body (5) and is fixedly connected to the guide rod (6); the nut (13) is rotatably arranged on the entry joint (101) and can rotate around its own axis; the nut (13) is threadedly connected to the outside of the lead screw (12).

7. The ultra-clean valve for semiconductor manufacturing according to claim 6, characterized in that: It also comprises a connecting bridge (9), the connecting bridge (9) being sleeved on the outside of the bellows body (5), and the two ends of the connecting bridge (9) being fixedly connected to the inlet joint (101) and the outlet joint (102) respectively.

8. The ultra-clean valve for semiconductor manufacturing according to claim 7, characterized in that: The invention also comprises a sliding member (10), wherein the sliding member (10) is slidably mounted on the connecting bridge (9), and the sliding member (10) forms an axially fixed and circumferentially rotatable connection with the nut (13), and a first limiting hole and a second limiting hole (901) are respectively provided on the sliding member (10) and the connecting bridge (9), and the limiting member can pass through the first limiting hole and the second limiting hole (901) in sequence and limit the sliding member (10) and the connecting bridge (9).

9. The ultra-clean valve for semiconductor manufacturing according to claim 8, characterized in that: The invention also comprises a guide cylinder (21), a second spring (22), a rocker arm (16), and a support rod (19); the first limiting hole and the second limiting hole (901) are both smooth holes; the limiting member is a pin (15); the support rod (19) is fixedly connected to the sliding member (10); the guide cylinder (21) is hinged to the pin (15); the guide cylinder (21) is slidably connected to the first end of the rocker arm (16); the second end of the rocker arm (16) is hinged to the support rod (19); the second spring (22) is sleeved on the rocker arm (16), and the second spring (22) can be in a compressed state.

10. The ultra-clean valve for semiconductor manufacturing according to claim 9, characterized in that: It also includes a latching tooth (20) and a buckle (18), wherein the latching tooth (20) is fixedly arranged on the outer wall of the nut (13) along the circumference of the nut (13), and the buckle (18) is fixedly connected to the swing rod (16) via a connecting rod (17), and the buckle (18) and the latching tooth (20) can be engaged with each other.

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