Temperature control structure, test mechanism and operation equipment

Abstract

A temperature control structure includes a heat exchanger and a heat insulation unit, the bottom of the heat exchanger is provided with a joint surface capable of conducting temperature to an electronic component, and the heat exchanger is internally provided with a first temperature control unit with fluid capable of controlling the temperature of the electronic component. The heat insulation unit is provided with a heat insulation piece at at least one part outside the heat exchanger and different from the joint surface; when the heat exchanger exchanges heat with the electronic element through the fluid of the first temperature control unit, the heat insulation piece of the heat insulation unit can be used for preventing the temperature loss of the heat exchanger, so that the heat exchanger quickly heats or cools the electronic element to the preset test temperature to execute the test operation, the temperature control energy cost is reduced, the test time is shortened, and the test efficiency is improved. And the production efficiency is improved.

Description

Technical Field

[0001] The present invention relates to a temperature control structure, a testing mechanism and an operating device which can effectively reduce the energy cost of temperature control and shorten the testing time to improve the production efficiency. Background Art

[0002] Nowadays, burn-in equipment or test equipment uses high-temperature gas or heating elements to test electronic components in an environment that simulates the temperature of future applications. Figure 1 Taking the pre-burning operation equipment as an example, the pre-burning furnace body 11 thereof is provided with an air inlet channel 111 for conveying gas with a preset high temperature to a holder 12 located in the furnace. The holder 12 is provided with a plurality of layers of supports 121 for respectively placing a circuit board 13 with a plurality of test sockets 14. The circuit board 13 is electrically connected to an electric control connection board (not shown) of the pre-burning operation equipment. The test sockets 14 are used to place and test electronic components 15. In order to more accurately control the test temperature of the electronic components 15, the industry has pivotally provided an openable and closable outer cover 16 on the top surface of the test socket 14. A heating element 17 is provided on the inner surface of the outer cover 16. The outer cover 16 covers the test socket 14 so that the heating element 17 is attached to the electronic components 15. The pre-burning operation equipment uses the high-temperature gas and the heating element 17 conveyed by the air inlet channel 111 to make the electronic components 15 perform the test operation at the preset temperature.

[0003] However, while one side of the heating element 17 conducts high temperature to the electronic component 15, the other side loses heat due to the heat dissipation of the outer cover 16, so that the heating element 17 cannot quickly heat up the electronic component 15. Not only does the heating element 17 of the pre-burning operation equipment have to consume higher power temperature control energy to make the electronic component 15 reach the preset test temperature, but it also increases the heating operation time, thereby increasing energy costs and reducing production efficiency. Summary of the invention

[0004] The purpose of the present invention is to provide a temperature control structure, a testing mechanism and operating equipment.

[0005] The present invention provides a temperature control structure, including a heat exchanger and a heat insulation unit. The bottom of the heat exchanger is provided with a joint surface to conduct temperature to an electronic component, and a first temperature control unit is provided to control the temperature of the electronic component. The heat insulation unit is provided with a heat insulation component outside the heat exchanger and at least one part different from the joint surface. When the first temperature control unit of the heat exchanger conducts high temperature or low temperature to the electronic component according to the operation requirements, the heat insulation component of the heat insulation unit can be used to prevent the temperature loss of the heat exchanger, so that the heat exchanger can quickly heat up or cool down the electronic component to a preset test temperature to facilitate the execution of the test operation, thereby reducing the temperature control energy cost and shortening the test time to improve production efficiency.

[0006] The present invention also provides a temperature control structure, which can suspend the energy consumption of the first temperature control unit (for example, suspend the delivery of fluid and / or turn off the cooling fan) when the heat exchanger reaches the preset test temperature, and use the insulation unit to prevent the temperature loss of the heat exchanger, so that the heat exchanger maintains the preset test temperature, thereby saving more energy costs.

[0007] The present invention also provides a temperature control structure, in which a thermal insulation unit is provided with at least one thermal insulation driver for driving one of the thermal insulation component and the heat exchanger to move relative to the other. When the temperature of the electronic component is too high, the thermal insulation driver is utilized to separate the heat exchanger from the thermal insulation component to facilitate heat dissipation of the heat exchanger, and the temperature of the electronic component is quickly adjusted to maintain at a preset test temperature, thereby improving the use efficiency.

[0008] The present invention further provides a testing mechanism, comprising at least one tester and at least one temperature control structure of the present invention; at least one tester is provided with an electrically connected circuit board and a test socket, the test socket is used for testing electronic components, and is equipped with an outer cover; the temperature control structure is assembled on the outer cover of the tester, and when the outer cover is closed and contacts the electronic components, the heat exchanger of the temperature control structure can quickly perform the testing operation by controlling the electronic components to a preset test temperature through the outer cover, and an insulation unit is used to prevent the temperature loss of the heat exchanger, thereby saving energy costs and improving usage efficiency.

[0009] The present invention also provides a testing mechanism, comprising at least one tester and at least one temperature control structure of the present invention; at least one tester is provided with an electrically connected circuit board and a test socket, the test socket being used for testing electronic components; the temperature control structure is arranged above the tester, and a heat exchanger is mounted on a mount, one of the heat exchanger and the tester is displaced relative to the other, the heat exchanger of the temperature control structure can temperature control the electronic components to a preset test temperature and quickly perform the test operation, and an insulation unit is used to prevent the temperature loss of the heat exchanger, thereby saving energy costs and improving usage efficiency.

[0010] The present invention further provides an operating equipment, including a pre-burning furnace body and the temperature control structure of the present invention; the pre-burning furnace body is provided with at least one air inlet channel in the furnace for conveying gas with a preset test temperature, the temperature control structure is mounted in the furnace of the pre-burning furnace body by a mount, the mount is used to mount a heat exchanger, and has at least one layer of a support frame, one of the heat exchanger and the support frame is displaced relative to the other, the temperature control structure uses the support frame to support a circuit board with a test socket and electronic components, and uses the heat exchanger to temperature-control the electronic components to the preset test temperature, and can further use a heat insulation unit to prevent the temperature loss of the heat exchanger, so that the electronic components can perform testing operations inside the pre-burning furnace body, thereby improving the use efficiency.

[0011] The present invention also provides an operating equipment, including a machine, a feeding device, a receiving device, the testing mechanism of the present invention, a conveying device and a central control device; the feeding device is arranged on the machine, and is provided with at least one feeder for accommodating electronic components to be tested; the receiving device is arranged on the machine, and is provided with at least one receiver for accommodating tested electronic components; the testing mechanism of the present invention is arranged on the machine, and is provided with a tester and a temperature control structure, the tester is used to test electronic components, and the temperature control structure is used to control the temperature of the electronic components to maintain a preset test temperature and save energy costs; the conveying device is arranged on the machine, and is provided with at least one conveyor for conveying electronic components; the central control device is used to control and integrate the actions of various devices and mechanisms. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 This is a partial use schematic diagram of existing pre-burning operation equipment.

[0013] Figures 2 to 3 It is a schematic diagram of the first embodiment of the temperature control structure of the present invention.

[0014] Figures 4 to 5 It is a schematic diagram of the second embodiment of the temperature control structure of the present invention.

[0015] Figure 6 to Figure 7 This is a schematic diagram of the application of the temperature control structure of the present invention in pre-burning operation equipment.

[0016] Figure 8 It is a schematic diagram of a first embodiment of the testing mechanism of the present invention.

[0017] Figures 9 and 10 It is a schematic diagram of the second embodiment of the testing mechanism of the present invention applied to testing operation equipment.

[0018] Description of reference numerals: 11-pre-burning furnace body; 111-air inlet channel; 12-mounting device; 121-support frame; 13-circuit board; 14-test seat; 15-electronic component; 16-outer cover; 17-heating element; 20-temperature control structure; 21-heat exchanger; 211-body; 212-sealing plate; 213-channel; 214-inlet; 215-outlet; 216-inlet pipe; 217-outlet pipe; 218-joining surface; 22-heat insulation member; 221-first opening; 222-second opening; 23-transfer arm; 24-heat insulation driver; 25-mounting device; 251-working space; 252-first opening; 253-second opening; 254-support frame; 2541-bearing surface; 2542-loading surface; 26-crimping component; 261-suction part; 27-cooling chip; 31-circuit board; 32-test seat; 321-outer cover; 33-electronic component; 41-pre-burning furnace body; 411-air inlet channel; 412-air outlet channel; 50-machine table; 60-feeding device; 70-collecting device; 80-conveying device; 81-first conveyor; 82-second conveyor; 83-third conveyor; 84-fourth conveyor. DETAILED DESCRIPTION

[0019] In order to further understand the present invention, a preferred embodiment is given below with reference to the drawings:

[0020] See also Figure 2 , Figure 3 The first embodiment of the temperature control structure 20 of the present invention includes a heat exchanger 21 and a thermal insulation unit.

[0021] The heat exchanger 21 is provided with at least one joint surface, which can exchange heat with the electronic component, and is provided with at least one first temperature control unit, which can temperature control the electronic component. Furthermore, the heat exchanger can include a main body and a sealing plate with a joint surface, or include at least one panel with a joint surface. According to operational requirements, the joint surface of the heat exchanger 21 can directly exchange heat with the electronic component, or the joint surface can exchange heat with the electronic component via an outer cover or a crimping component. According to operational requirements, the first temperature control unit can be provided with a flow channel with a fluid in the heat exchanger 21, for example, the heat exchanger 21 includes a main body and a sealing plate with a joint surface, and the first temperature control unit is provided with a flow channel with a fluid between the main body and the sealing plate. Or the first temperature control unit is provided with a plurality of fins in the heat exchanger 21, for example, the heat exchanger 21 is provided with at least one panel with a joint surface, and the first temperature control unit is provided with a plurality of fins on the panel. Alternatively, the first temperature control unit is provided with a plurality of fins and fluids on the heat exchanger 21, for example, the heat exchanger 21 includes a panel with a joint surface and a body, the first temperature control unit is provided with a plurality of fins on the panel, and a flow channel with fluid is provided on the body, and the fluid can flow between the plurality of fins. Alternatively, a plurality of fins and a fan are provided on the heat exchanger 21, for example, the heat exchanger 21 includes a panel with a joint surface, and the first temperature control unit is provided with a plurality of fins and a fan on the panel. Therefore, the heat exchanger 21 of the aforementioned manner can temperature control electronic components.

[0022] In this embodiment, the heat exchanger 21 includes a main body 211 and a sealing plate 212, and the sealing plate 212 cover is placed on the top of the main body 211. The first temperature control unit is provided with a flow channel 213 between the main body 211 and the sealing plate 212. The flow channel 213 connects the inlet 214 and the outlet 215 of the sealing plate 212. The inlet 214 is connected to the air inlet pipe 216 for a gas supply device (not shown) to input gas with a preset temperature into the flow channel 213. The outlet 215 is connected to the air outlet pipe 217 for discharging the gas after heat exchange. In addition, a joint surface 218 is provided on the bottom surface of the main body 211 of the heat exchanger 21 for contacting electronic components or assembling the second temperature control unit (not shown).

[0023] The heat insulation unit is outside the heat exchanger 21, and at least one heat insulation member 22 is provided at least at one position different from the joint surface 218. According to the operation requirements, the heat insulation member 22 can be fixed to the heat exchanger 21, or the heat insulation member 22 and the heat exchanger 21 can be attached to or separated from each other. In this embodiment, the heat insulation member 22 is attached to the surrounding side surfaces of the body 211 of the heat exchanger 21 and the top surface of the sealing plate 212. The heat insulation member 22 is provided with a first opening 221 and a second opening 222 at the positions corresponding to the inlet 214 and the outlet 215 of the body 211. The first opening 221 is for inserting the air pipe 216, and the second opening 222 is for inserting the air pipe 217.

[0024] According to the operation requirements, the temperature control structure 20 further includes at least one mounting device (not shown), and the mounting device is used to mount the heat exchanger 21. The mounting device can be a vehicle frame, a furnace frame or a machine frame. The heat exchanger 21 can be fixed or movably mounted on the mounting device. For example, the heat exchanger 21 is fixed on the mounting device, and the electronic component moves relative to the heat exchanger 21. For example, the heat exchanger 21 is movably mounted on the mounting device, so that the heat exchanger 21 moves relative to the electronic component.

[0025] According to the operation requirements, the temperature control structure further includes at least one transfer arm, which is mounted on the mounting device and can drive the heat exchanger 21 and the thermal insulation 22 to move in at least one direction. Furthermore, the transfer arm is driven to move by a driving source (not shown in the figure), which can be a linear motor, a pressure cylinder, or a motor and a transmission group, and the transmission group can be a pulley group or a screw seat group. In this embodiment, the transfer arm 23 of the temperature control structure 20 is mounted on a mounting device (not shown in the figure, such as a furnace rack), and is driven by the driving source to move in the Z direction to connect and drive the heat exchanger 21 and the thermal insulation 22 to move in the Z direction.

[0026] Taking the thermal testing of electronic components as an example, a test socket 32 ​​on a circuit board 31 holds an electronic component 33, and the transfer arm 23 of the temperature control structure 20 drives the heat exchanger 21 and the heat insulation member 22 to move downward in the Z direction, so that the joint surface 218 of the heat exchanger 21 is pressed against the electronic component 33 of the test socket 32. The heat exchanger 21 uses the air inlet pipe 216 to transport high-temperature gas to the flow channel 213 of the body 211 through the inlet 214. The gas flows along the flow channel 213 and exchanges heat with the body 211 to heat up the body 211, and conducts the high temperature to the electronic component 33 through the joint surface 218 of the body 211; however In the process of the gas gradually heating up the main body 211, since the insulation unit is coated with an insulation member 22 on the outside of the main body 211 and the sealing plate 212 of the heat exchanger 21, the heat loss of the heat exchanger 21 can be prevented, so that the heat exchanger 21 quickly controls the temperature of the electronic component 33 to reach the preset test temperature so as to start the test operation; the gas after heat exchange in the flow channel 213 of the heat exchanger 21 is discharged through the outlet 215 of the main body 211 and the exhaust pipe 217; therefore, the temperature control structure 20 does not need to increase the power of the heating gas, which not only saves energy costs, but also reduces the operation time of the heating electronic component 33.

[0027] Furthermore, when the heat exchanger 21 is temporarily stopped to input high-temperature gas in the flow channel 213, the heat insulation member 22 of the heat insulation unit can be used to prevent the surrounding sides and top surface of the heat exchanger 21 from exchanging heat with the outside, so as to reduce the heat loss of the heat exchanger 21, so that the joint surface 218 of the body 211 maintains the preset temperature and temperature controls the electronic components 33, thereby saving energy costs. When the electronic components are temperature-controlled again, since the high temperature of the heat exchanger 21 is not lost in large quantities, the operation time of the temperature-raising heat exchanger 21 can be reduced, so that the temperature of the heat exchanger 21 quickly reaches the preset test temperature, so as to facilitate rapid temperature control of the electronic components.

[0028] When the test temperature of the electronic component 33 is too high, the temperature control structure 20 can switch to supply low-temperature gas (or reduce the temperature of high-temperature gas), so that the air inlet pipe 216 inputs low-temperature gas to the flow channel 213 of the heat exchanger 21, so that the low-temperature gas exchanges heat with the body 211, and conducts the low temperature to the electronic component 33 through the joint surface 218 of the body 211, so as to help the electronic component 33 cool down to the preset test temperature.

[0029] According to the operation requirements, the temperature control structure can assemble a crimping component (not shown) on the joint surface 218 of the heat exchanger 21 for crimping or crimping and picking up electronic components.

[0030] According to the operation requirements, the temperature control structure further includes at least one second temperature control unit (not shown), which is arranged below the heat exchanger 21 to control the temperature of the electronic component 33. Furthermore, the second temperature control unit can be a heating element or a cooling chip. The second temperature control unit can be directly arranged on the joint surface 218 of the heat exchanger 21; or a crimping component (not shown) is assembled on the joint surface 218, and the second temperature control unit is assembled inside or on the bottom of the crimping component; the second temperature control unit is matched with the first temperature control unit to more accurately control the temperature of the electronic component 33.

[0031] See also Figure 4 , Figure 5 The second embodiment of the temperature control structure 20 of the present invention has a substantially similar structure to the first embodiment, except that the heat insulation unit further includes a heat insulation driver 24, which is used to drive one of the heat exchanger 21 and the heat insulation member 22 to move relative to the other to separate or fit. Furthermore, the heat insulation driver 24 is provided with at least one transmission member, which is connected to the heat exchanger 21 or the heat insulation member 22 to be driven to move. Furthermore, the heat insulation driver 24 is a linear motor, a cylinder, or includes a motor and at least one transmission group, and the transmission group can be a screw seat group or a pulley group.

[0032] In this embodiment, the thermal insulation driver 24 of the thermal insulation unit is assembled on the main body 211 of the heat exchanger 21, and is connected to the thermal insulation member 22 by a transmission member, so as to drive the thermal insulation member 22 to move in the Z direction; the heat exchanger 21 inputs high-temperature gas into the flow channel 213 of the main body 211 through the air inlet pipe 216, and the gas flows along the flow channel 213 and exchanges heat with the main body 211, so as to facilitate the joint surface 218 of the main body 211 to conduct high temperature to the electronic component 33. Since the thermal insulation driver 24 of the thermal insulation unit has not been activated, the thermal insulation member 22 is covered on the outside of the main body 211 and the sealing plate 212 of the heat exchanger 21 to prevent heat loss of the heat exchanger 21, which is beneficial for the heat exchanger 21 to quickly heat up the electronic component 33 to the preset test temperature, so that the electronic component 33 performs the test operation on the test seat 32 to improve the test capacity.

[0033] When the test temperature of the electronic component 33 is too high, the temperature control structure 20 continuously or temporarily delivers high-temperature gas to the heat exchanger 21, or inputs low-temperature gas into the heat exchanger 21 according to the operation requirements. The thermal insulation unit drives the thermal insulation component 22 to move upward in the Z direction through the transmission part of the thermal insulation driver 24, so that the thermal insulation component 22 is separated from the main body 211 and the sealing plate 212 of the heat exchanger 21, so that the main body 211 and the sealing plate 212 can be properly dissipated to facilitate the temperature control electronic component 33 to cool down to the preset test temperature, so as to ensure the test yield of the electronic component 33.

[0034] See also Figures 4 to 7 The operating equipment of the present invention includes a pre-burning furnace body 41 and at least one temperature control structure. The pre-burning furnace body 41 is provided with at least one air inlet channel in the furnace for conveying gas with a pre-burning test temperature; at least one temperature control structure 20 includes a heat exchanger 21, a heat insulation unit and a holder 25. The holder 25 is arranged inside the pre-burning furnace body 41. The holder 25 is provided with at least one layer of support frame. One of the heat exchanger 21 and the support frame of the temperature control structure 20 is displaced relative to the other. According to the operation requirements, the temperature control structure 20 further includes at least one transfer arm 23, and the transfer arm 23 is used to drive the heat exchanger 21 to move in at least one direction. According to the operation requirements, the holder 25 can be a fixed frame, a movable frame, or a fixed frame and a movable frame. For example, the holder 25 is a movable transport frame for moving into or out of the furnace of the pre-burning furnace body 41. For example, the holder 25 is a fixed furnace frame of the pre-burning furnace body 41.

[0035] Based on the above, the mounting device (not shown) also includes a movable frame, a fixed frame and a driving unit. The movable frame is provided with at least one supporting frame for supporting a circuit board with a test socket. The fixed frame is provided with at least one cross frame above the supporting frame, and the cross frame is used to assemble the heat exchanger 21. The driving unit is used to drive the movable frame and the supporting frame to move toward the heat exchanger 21.

[0036] In this embodiment, the pre-burning furnace body 41 is provided with an air inlet channel 411 on one side for inputting gas with a pre-burning test temperature, so as to perform a pre-burning test operation on electronic components, and an air outlet channel 412 is provided on the other side for exhausting gas. The holder 25 of the temperature control structure 20 is a furnace rack and is installed in the furnace of the pre-burning furnace body 41. One side of the holder 25 is provided with a first opening 252 that communicates with the working space 251 and the air inlet channel 411, so that gas can flow into the working space 251, so that the working space 251 forms a test environment with a pre-burning test temperature. The other side of the holder 25 is provided with a second opening 253 that communicates with the working space 251 and the air outlet channel 412, so that gas can flow out. The holder 25 is provided with a plurality of horizontally arranged supports 254 in the working space 251, and the first surface (for example, the top surface) of each support 254 is a bearing surface 254. 1, for holding a tester, the tester includes an electrically connected circuit board 31 and a plurality of test sockets 32, each test socket 32 ​​has an outer cover 321, and holds an electronic component 33, the second surface (e.g., the bottom surface) of the support frame 254 is a receiving surface 2542, for setting a plurality of transfer arms 23, the transfer arms 23 drive the heat exchanger 21 to move in the Z direction and contact the outer cover 321 of the test socket 32, so that the heat exchanger 21 controls the temperature of the electronic component 33 through the outer cover 321, and the heat insulation unit 22 prevents the heat exchanger 21 from losing heat, so that the electronic component 33 performs a pre-burning test operation in the pre-burning furnace body 41.

[0037] See also Figure 8 The first embodiment of the testing mechanism of the present invention comprises at least one tester and at least one temperature control structure 20. The tester is provided with an electrically connected circuit board 31 and a test socket 32. The test socket 32 ​​is used for testing electronic components and is provided with at least one outer cover 321. The temperature control structure 20 is assembled on the outer cover 321 of the tester to control the temperature of the electronic components. In this embodiment, the body 211 of the heat exchanger 21 of the temperature control structure 20 is assembled on the outer cover 321 of the test socket 32, and the gas with a preset temperature is input into the flow channel 213 of the body 211 through the air inlet pipe 216, so that the gas exchanges heat with the body 211, and the temperature is transferred to the electronic components through the outer cover 321 through the joint surface 218 of the body 211, and the heat insulation member 22 of the heat insulation unit prevents the heat loss of the heat exchanger 21, so that the heat exchanger 21 quickly controls the temperature of the electronic components to reach the preset test temperature and perform the test operation.

[0038] See also Fig. 9 , Fig.10The second embodiment of the test mechanism of the present invention comprises at least one tester and at least one temperature control structure 20. The tester is provided with an electrically connected circuit board 31 and a test socket 32. The test socket 32 ​​is used to test an electronic component 33. The temperature control structure 20 is arranged above the tester. The heat exchanger 21 of the temperature control structure 20 and the tester are displaced relative to each other. According to the operation requirements, the temperature control structure further comprises at least one transfer arm 23. The transfer arm 23 is used to drive the heat exchanger 21 and the heat insulation unit to move in at least one direction.

[0039] The second embodiment of the testing mechanism of the present invention is applied to an operating equipment, which includes a machine 50, the testing mechanism of the present invention, a feeding device 60, a receiving device 70, a conveying device 80 and a central control device (not shown). The feeding device 60 is mounted on the machine 50 and is provided with at least one feeder to accommodate at least one electronic component to be tested; the receiving device 70 is mounted on the machine 50 and is provided with at least one receiver to accommodate at least one electronic component that has been tested; the testing mechanism of the present invention is configured on the machine 50 and is provided with at least one tester and at least one temperature control structure 20, the tester is provided with an electrically connected circuit board 31 and a test socket 32, the test socket 32 ​​is for holding and testing electronic components; the temperature control structure 20 is provided with a circuit board 31 and a test socket 32, the test socket 32 ​​is provided ... The rack is used as a mounter and is provided with a transfer arm 23 driven by a driving source to move the heat exchanger 21 and the heat insulation member 22 in the Z direction. A crimping component 26 with a suction portion 261 is mounted on the heat exchanger 21 for crimping and picking up electronic components. A second temperature control unit is arranged between the crimping component 26 and the heat exchanger 21. The second temperature control unit is a cooling chip 27 for temperature control of the electronic components. The conveying device 80 is mounted on the machine 50 and is provided with at least one conveyor. , to convey electronic components. In this embodiment, the conveying device 80 is provided with a first conveyor 81 to take out the electronic components to be tested from the feeder of the feeding device 60 and transfer them to the second conveyor 82. The second conveyor 82 carries the electronic components to be tested to the side of the testing mechanism. The testing mechanism takes out the electronic components from the second conveyor 82 with a crimping component 26, and transfers and crimps them to the test socket 32, and uses the temperature control structure 20 to make the electronic components in a simulated future application temperature environment to perform the test operation, and then uses the crimping component 26 to move the tested electronic components into the third conveyor 83 of the conveying device 80 and carry them out. The fourth conveyor 84 of the conveying device 80 takes out the tested electronic components from the third conveyor 83, and according to the test results, the tested electronic components are conveyed to the receiver of the receiving device 70 for classification and storage; the central control device (not shown) is used to control and integrate the actions of various devices and mechanisms to perform automated operations, thereby achieving the practical benefit of improving the operation efficiency.

Claims

1. A temperature control structure, characterized in that: Include: The heat exchanger is provided with at least one joint surface capable of exchanging heat with the electronic component, and is provided with at least one first temperature control unit capable of temperature controlling the electronic component; The heat insulation unit is provided with at least one heat insulation member outside the heat exchanger and at least one part different from the joint surface, so as to reduce the temperature loss of the heat exchanger.

2. The temperature control structure according to claim 1, characterized in that: The heat exchanger includes a main body and a cover with a sealing plate placed on the main body. The first temperature control unit is provided with at least one flow channel with an inlet and an outlet between the main body and the sealing plate. The inlet and the outlet are provided for assembling an air inlet pipe and an air outlet pipe for conveying fluid. The bottom of the main body is provided with at least one such joint surface. The thermal insulation component is provided with a first opening and a second opening for respectively assembling the air inlet pipe and the air outlet pipe.

3. The temperature control structure according to claim 1, characterized in that: The heat exchanger is provided with at least one panel having the joint surface, and the first temperature control unit is provided with a plurality of fins on the panel.

4. The temperature control structure according to claim 1, characterized in that: The heat insulation unit further comprises at least one heat insulation driver, which is used to drive one of the heat exchanger and the heat insulation component to move relative to the other to separate or fit together.

5. The temperature control structure according to claim 1, characterized in that: It also includes at least one second temperature control unit, which is arranged below the heat exchanger to control the temperature of the electronic component.

6. The temperature control structure according to any one of claims 1 to 5, characterized in that: The invention also comprises at least one mounting device, wherein the mounting device is used for mounting the heat exchanger.

7. The temperature control structure according to claim 6, characterized in that: The mounting device is provided with at least one support frame for assembling the heat exchanger.

8. The temperature control structure according to claim 6, characterized in that: The mounting device comprises a movable frame, a fixed frame and a driving unit. The movable frame is provided with at least one supporting frame. The fixed frame is provided with at least one cross frame above the supporting frame. The cross frame is used for assembling the heat exchanger. The driving unit is used for driving the movable frame and the supporting frame to move toward the heat exchanger.

9. The temperature control structure according to claim 6, characterized in that: The device also comprises at least one transfer arm, which is mounted on the mounting device and can drive the heat exchanger and the heat insulation unit to move in at least one direction.

10. A testing mechanism, characterized in that: Include: At least one tester is provided with an electrically connected circuit board and a test socket, the test socket is used for testing electronic components, and is provided with at least one outer cover; At least one temperature control structure as claimed in any one of claims 1 to 5 is mounted on the outer cover of the tester to control the temperature of electronic components.

11. A testing mechanism, characterized in that: Include: At least one tester, provided with an electrically connected circuit board and a test socket, the test socket being used for testing electronic components; At least one temperature control structure as claimed in claim 6 is disposed above the tester, and one of the heat exchanger of the temperature control structure and the tester is displaced relative to the other.

12. The testing mechanism according to claim 11, characterized in that: The temperature control structure further comprises at least one transfer arm, and the transfer arm is used to drive the heat exchanger to move in at least one direction.

13. An operating device, characterized in that: Include: The pre-burning furnace body is provided with at least one air inlet channel for conveying gas having a pre-burning test temperature; At least one temperature control structure as claimed in claim 6 is arranged inside the pre-firing furnace body by a holder, the holder is provided with at least one layer of support frame, and one of the heat exchanger of the temperature control structure and the support frame is displaced relative to the other.

14. The working equipment according to claim 13, characterized in that: The temperature control structure further comprises at least one transfer arm, and the transfer arm is used to drive the heat exchanger to move in at least one direction.

15. An operating device, characterized in that: Include: Machine; A feeding device is arranged on the machine platform and is provided with at least one feeder for accommodating the electronic components to be tested; A receiving device is arranged on the machine platform and is provided with at least one receiving device for accommodating the tested electronic components; At least one testing mechanism as claimed in claim 11, arranged on the machine for testing electronic components; A conveying device, disposed on the machine, and provided with at least one conveyor for conveying electronic components; Central control device for controlling and integrating the operations of various devices and mechanisms.

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