Solid state disk card device with heat dissipation function
By designing a heat dissipation chassis with multiple mounting holes and a pivotable heat dissipation module, the problem of difficulty in dissipating heat when installing a hard disk expansion card in the server and the need for special modules in different sizes is solved, and a solid-state hard disk card device that is adapted to multiple sizes is realized, reducing production and assembly complexity, and effectively dissipating heat.
Patent Information
- Application Number
- CN202311459839.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-11-03
- Publication Date
- 2025-05-06
AI Technical Summary
When existing hard disk expansion cards are installed internally on the server, it is difficult to effectively dissipate heat due to space limitations. Hard disk expansion cards of different sizes and specifications require specially designed heat dissipation modules, which increases production costs and assembly complexity.
A solid-state hard disk card device with heat dissipation function is designed, including a detachable heat dissipation chassis and a pivot heat dissipation module. The base wall of the heat dissipation chassis is equipped with multiple mounting holes to accommodate different lengths of solid-state hard disk cards. The fixed module is used to locate the solid-state hard disk card, and the pivot heat dissipation module can adjust its position as needed to contact and cover the solid-state hard disk card.
The device is able to adapt to SSD cards of a variety of different lengths, simplifies the production and assembly process, reduces costs, and prevents SSD cards from overheating through an effective heat dissipation mechanism.
Smart Images
Figure CN119937735A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of servers, and in particular to a solid state hard disk card device with a heat dissipation function. Background Art
[0002] In recent years, servers have often used hard disk expansion cards, such as M.2 hard disk expansion cards. Generally speaking, due to the limitation of the internal space of the server, the installation space of the hard disk expansion card is very limited and it is often set behind the high-heat electronic components such as the CPU, resulting in the heat energy generated during the operation of the hard disk expansion card cannot be effectively dissipated, causing the problem of overheating of the hard disk expansion card. Therefore, there is currently a heat dissipation module installed on the hard disk expansion card to effectively ensure the heat dissipation of the hard disk expansion card, but since the common size specifications of the M.2 hard disk expansion card are 2230 / 2242 / 2260 / 2280 and other specifications, generally speaking, the installed heat dissipation module is specially designed for a size specification of M.2 hard disk expansion card. If a different size specification of M.2 hard disk expansion card is used, it is necessary to open a production mold for the heat dissipation module separately, which not only increases the production cost but also requires trouble to find the corresponding heat dissipation module according to the different size specifications of the M.2 hard disk expansion card before the assembly action can be performed, causing trouble for users, which is worthy of careful consideration and further discussion and improvement by practitioners. Summary of the invention
[0003] Therefore, the purpose of the present invention is to provide a solid state hard disk card device with good applicability and heat dissipation function.
[0004] To achieve the above object, the present invention provides the following technical solutions:
[0005] A solid-state hard disk card device with a heat dissipation function can support a plurality of solid-state hard disk cards of different lengths to be combined with a motherboard device, the motherboard device includes a motherboard with a mounting area and a connector arranged in the mounting area on the motherboard, the solid-state hard disk card device with a heat dissipation function can be detachably arranged in the mounting area on the motherboard and electrically connected to the connector, and includes: a heat dissipation chassis combined with the motherboard, including a base wall detachably fixed on the motherboard, two side walls extending from two opposite sides of the base wall in a direction away from the base wall, and two pivot units respectively arranged on the side walls and close to the connector unit, the base wall and the side walls jointly define a accommodating space, the base wall has a plurality of solid-state hard disks corresponding to different lengths. The present invention relates to a mounting hole of a disk card; a connector that can be detachably inserted into the mainboard and combined with a solid-state hard disk card in the accommodating space of the heat dissipation chassis, wherein the solid-state hard disk card has a coupling portion located at two opposite ends, and a positioning portion, the coupling portion of the solid-state hard disk card is inserted and connected to the connector and the positioning portion corresponds to one of the mounting holes of the base wall of the heat dissipation chassis; a fixing module, the fixing module can be detachably fixed to any mounting hole of the base wall of the heat dissipation chassis and is used to position the positioning portion of the solid-state hard disk card; and a heat dissipation module that is pivotally connected to the pivot unit of the heat dissipation chassis and can cover the solid-state hard disk card, the heat dissipation module can be pivoted relative to the heat dissipation chassis to a heat dissipation position, and when in the heat dissipation position, the heat dissipation module contacts the solid-state hard disk card and covers the solid-state hard disk card.
[0006] Preferably, it also includes an elastic positioning module fixed on one of the side walls of the heat dissipation base and used to position the heat dissipation module, the heat dissipation module has a heat dissipation body pivotally connected to the pivot unit of the heat dissipation base and covering the solid-state hard disk card, and a limiting hole recessed in the heat dissipation body and corresponding to the elastic positioning module, the elastic positioning module has an elastic positioning controller fixed on the side wall and located on the side of the side wall away from the corresponding pivot unit, and a positioning pin that penetrates the side wall and can be moved into the limiting hole of the heat dissipation module under the control of the elastic positioning controller; when the heat dissipation module is located at the heat dissipation position, the positioning pin of the elastic positioning module extends into the limiting hole of the heat dissipation module and positions the heat dissipation body on the solid-state hard disk card.
[0007] Preferably, each pivot unit of the heat dissipation chassis has a pivot axis extending toward another pivot unit, and the heat dissipation body of the heat dissipation module has a pivot end pivotally connected to the pivot axis of the pivot unit.
[0008] Preferably, the mainboard of the mainboard device is provided with a guide hole located in the installation area and close to the connector, and a locking hole located in the installation area and away from the connector, and the heat dissipation base also includes a locking unit arranged on the base wall for fixing the base wall to the locking hole of the mainboard, and an alignment boss extending from the base wall toward the mainboard and capable of extending into the guide hole.
[0009] Preferably, the guide hole of the mainboard of the mainboard device is a gourd-shaped hole, and has a small hole portion close to the connector, and a large hole portion away from the connector. The alignment boss of the heat dissipation base extends into the large hole portion of the guide hole of the mainboard and causes the base wall of the heat dissipation base to move toward the direction close to the connector, thereby driving the alignment boss to move into the small hole portion of the guide hole. At this time, the locking unit of the heat dissipation base is aligned with the locking hole of the mainboard.
[0010] Preferably, the fixing module includes a support base detachably fixed to any mounting hole of the base wall of the heat dissipation chassis, and a limiting member elastically movably disposed on the support base and used to limit the positioning portion of the solid state hard disk card.
[0011] Preferably, the solid state drive card is an M.2 solid state drive card.
[0012] Compared with the prior art, the beneficial effect of the present invention is that: by fixing the base wall of the heat dissipation chassis on the mainboard and making the mounting holes of the base wall correspond to the length positions of SSD cards of different lengths, the joint part of the SSD card is inserted and connected to the connector and the positioning part corresponds to one of the mounting holes of the base wall of the heat dissipation chassis so that the positioning part of the SSD card is limited by the fixing module, and the overall applicability is good. In addition, with the ingenuity of the heat dissipation module pivotally connected to the pivot unit of the heat dissipation chassis, as long as the heat dissipation module is pivoted to the heat dissipation position, the heat dissipation module will contact and cover the SSD card, and effectively perform heat dissipation operations on the SSD card. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Other features and effects of the present invention will be clearly presented in the embodiments with reference to the accompanying drawings, in which:
[0014] Figure 1 is a three-dimensional exploded view illustrating the connection relationship between an embodiment of a solid state hard disk card device with heat dissipation function of the present invention and a motherboard device;
[0015] Figure 2 is a three-dimensional diagram, which assists in explaining the combination relationship between a pair of bosses of a heat dissipation chassis and a guide hole of a mainboard of the mainboard device in another perspective in the embodiment;
[0016] Figure 3 is a three-dimensional diagram illustrating the connection relationship between the heat dissipation chassis, a solid state hard disk card and a connector of the mainboard device in the embodiment;
[0017] Figure 4 is a three-dimensional diagram illustrating the connection relationship between a heat dissipation module and the heat dissipation chassis in the embodiment;
[0018] Figure 5 It is a three-dimensional diagram, which helps explain Figure 4 In the embodiment, the heat dissipation module pivots relative to the heat dissipation chassis;
[0019] Figure 6 is a three-dimensional diagram illustrating that the heat dissipation module is pivoted to a heat dissipation position in the embodiment;
[0020] Figure 7 is a partially enlarged stereoscopic diagram illustrating the connection relationship between an elastic positioning module and the heat dissipation module in the embodiment; and
[0021] Figure 8 It is a three-dimensional exploded schematic diagram, illustrating the combination relationship between a fixing module and any mounting hole in a base wall of the heat dissipation chassis in the embodiment.
[0022] Explanation of the numbers in the figure: 1. solid state hard disk card device; 2. heat dissipation chassis; 21. base wall; 211. mounting hole; 22. side wall; 23. pivot unit; 231. pivot axis; 24. accommodating space; 25. locking unit; 26. alignment boss; 3. solid state hard disk card; 31. joint; 32. positioning portion; 4. fixing module; 41. support seat; 42. limiter; 5. heat dissipation module; 51. heat dissipation body; 511. pivot end; 52. limit hole; 6. elastic positioning module; 61. elastic positioning controller; 62. positioning pin; 90. mainboard device; 91. mainboard; 911. mounting area; 912. guide hole; 913. small hole portion; 914. large hole portion; 915. locking hole; 92. connector. DETAILED DESCRIPTION
[0023] Before the present invention is described in detail, it should be noted that similar elements are denoted by the same reference numerals in the following description.
[0024] See also Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6The solid-state hard disk card device 1 with heat dissipation function of the present invention can support a plurality of solid-state hard disk cards 3 of different lengths to be combined with a motherboard device 90. The motherboard device 90 includes a motherboard 91 having a mounting area 911, and a connector 92 disposed in the mounting area 911 on the motherboard 91. The solid-state hard disk card device 1 with heat dissipation function can be detachably disposed in the mounting area 911 on the motherboard 91 and electrically connected to the connector 92, and includes a heat dissipation chassis 2 combined with the motherboard 91, a connector 92 detachably inserted into the motherboard 91 and combined with the solid-state hard disk card 3 in the heat dissipation chassis 2, a fixing module 4 detachably fixed in the heat dissipation chassis 2 and used to position the solid-state hard disk card 3, and a heat dissipation module 5 pivotally connected to the heat dissipation chassis 2 and capable of covering the solid-state hard disk card 3.
[0025] The heat dissipation chassis 2 includes a base wall 21 detachably fixed to the motherboard 91, two side walls 22 extending from opposite sides of the base wall 21 in a direction away from the base wall 21, and two pivot units 23 respectively disposed on the side walls 22 and close to the connector 92. The base wall 21 and the side walls 22 together define a receiving space 24. The base wall 21 has a plurality of mounting holes 211 corresponding to the solid state drive cards 3 of different lengths.
[0026] The solid state drive card 3 is combined in the accommodation space 24 of the heat dissipation chassis 2, and has a combination portion 31 and a positioning portion 32 located at two opposite ends. The combination portion 31 of the solid state drive card 3 is inserted and connected to the connector 92, and the positioning portion 32 corresponds to one of the mounting holes 211 of the base wall 21 of the heat dissipation chassis 2.
[0027] The fixing module 4 can be detachably fixed to any mounting hole 211 of the base wall 21 of the heat dissipation chassis 2 and is used to position the positioning portion 32 of the solid state drive card 3 .
[0028] The heat dissipation module 5 is pivotally connected to the pivot unit 23 of the heat dissipation chassis 2 and can cover the solid state drive card 3. The heat dissipation module 5 can be pivoted to a heat dissipation position relative to the heat dissipation chassis 2. In the heat dissipation position, the heat dissipation module 5 contacts the solid state drive card 3 and covers the solid state drive card 3.
[0029] During assembly, the heat dissipation chassis 2 is first placed in the mounting area 911 of the motherboard 91 and the base wall 21 of the heat dissipation chassis 2 is fixed to the motherboard 91. Then, the fixing module 4 is combined with the mounting hole 211 corresponding to the positioning portion 32 of the solid state hard disk card 3 according to the length of the solid state hard disk card 3 to be combined (refer to Figure 8), then the coupling portion 31 of the solid state drive card 3 is inserted and connected to the connector 92 and the positioning portion 32 of the solid state drive card 3 is positioned and fixed by the fixing module 4. In simple terms, the mounting holes 211 of the base wall 21 of the heat dissipation chassis 2 are respectively designed to correspond to the length positions of the solid state drive cards 3 of different lengths. The fixing module 4 is firstly arranged according to the position of the mounting hole 211 corresponding to the length size of the solid state drive card 3 to be combined. Figure 8 After being combined with the mounting hole 211 corresponding to the solid state drive card 3 as shown, the connector 92 is inserted and connected to the joint portion 31 of the solid state drive card 3 so that the positioning portion 32 of the solid state drive card 3 can be positioned and fixed by the fixing module 4, so the heat dissipation chassis 2 can support the assembly requirements of solid state drive cards 3 of different lengths. In other words, as long as the heat dissipation chassis 2 of this embodiment is used, the assembly requirements of solid state drive cards 3 of different lengths and sizes can be universally met, that is, a set of molds of the heat dissipation chassis 2 can support solid state drive cards 3 of different lengths and sizes, which effectively improves the problem that multiple sets of molds need to be prepared separately when using solid state drive cards 3 of different sizes and specifications in the past. Therefore, the heat dissipation chassis 2 of this embodiment can be assembled according to the actual length size of the solid state drive card 3 to make the positioning portion 32 of the solid state drive card 3 correspond to one of the mounting holes 211 of the base wall 21 of the heat dissipation chassis 2 and make the positioning portion 32 of the solid state drive card 3 be positioned and fixed by the fixing module 4 to complete the assembly. Finally, the heat dissipation module 5 is pivoted to the pivot unit 23 of the heat dissipation chassis 2 and the heat dissipation module 5 can be pivoted relative to the heat dissipation chassis 2 to complete the assembly operation. As long as the heat dissipation module 5 is pivoted to the heat dissipation position, at this time, the heat dissipation module 5 contacts the solid state drive card 3 and is as shown in FIG. Figure 6 As shown, the solid state hard disk card 3 is covered, and heat dissipation operation is effectively performed on the solid state hard disk card 3.
[0030] In contrast, if the solid state drive card 3 is to be detached, the heat dissipation module 5 can be pivoted relative to the heat dissipation chassis 2 by first removing the heat dissipation module 5. Figure 5As shown, the card is pivoted in a direction A away from the solid state drive card 3 and pivoted to one end tilted away from the solid state drive card 3, and then the fixing module 4 does not block the positioning portion 32 of the solid state drive card 3, and then the coupling portion 31 of the solid state drive card 3 can be directly detached from the connector 92 and removed from the accommodating space 24 of the heat dissipation chassis 2, and the detachment action of the solid state drive card 3 is completed. If a solid state drive card 3 of another length specification size is to be replaced later, the fixing module 4 is first detached from the original position and re-attached to the mounting hole 211 corresponding to the positioning portion 32 of the solid state drive card 3 to be installed, and then the coupling portion 31 of the solid state drive card 3 to be installed is inserted and connected to the connector 92 and the positioning portion 32 of the solid state drive card 3 is positioned and fixed by the fixing module 4. Finally, the heat dissipation module 5 is pivoted toward a direction B close to the solid state drive card 3 and pivoted to the heat dissipation position, so that the heat dissipation module 5 contacts the solid state drive card 3 and covers the solid state drive card 3, and the solid state drive card 3 can be cooled. In this embodiment, the solid state drive card 3 is in the form of an M.2 solid state drive card 3, but it is not limited thereto, and can also be in the form of a PCI E card or other hard disk expansion card.
[0031] By fixing the base wall 21 of the heat dissipation chassis 2 on the mainboard 91 and making the mounting holes 211 of the base wall 21 correspond to the length positions of the SSD cards 3 of different lengths, the joint portion 31 of the SSD card 3 is inserted and connected to the connector 92, and the positioning portion 32 corresponds to one of the mounting holes 211 of the base wall 21 of the heat dissipation chassis 2, so that the positioning portion 32 of the SSD card 3 is limited by the fixing module 4, and the overall applicability is good. In addition, with the ingenuity of the heat dissipation module 5 being pivotally connected to the pivot unit 23 of the heat dissipation chassis 2, as long as the heat dissipation module 5 is pivoted to the heat dissipation position, the heat dissipation module 5 will contact the SSD card 3 and cover the SSD card 3, and effectively perform heat dissipation operations on the SSD card 3.
[0032] It should be further explained that, in this embodiment, it also includes an elastic positioning module 6 fixed on one of the side walls 22 of the heat dissipation chassis 2 and used to position the heat dissipation module 5. The heat dissipation module 5 has a heat dissipation body 51 pivotally connected to the pivot unit 23 of the heat dissipation chassis 2 and covering the solid state hard disk card 3, and a limiting hole 52 recessed in the heat dissipation body 51 and corresponding to the elastic positioning module 6. The elastic positioning module 6 has an elastic positioning controller 61 fixed on the side wall 22 and located on the side of the side wall 22 away from the corresponding pivot unit 23, and a positioning pin 62 that penetrates the side wall 22 and can be controlled by the elastic positioning controller 61 to move and penetrate the limiting hole 52 of the heat dissipation module 5. When the heat dissipation module 5 is located in the heat dissipation position, the positioning pin 62 of the elastic positioning module 6 extends into the limiting hole 52 of the heat dissipation module 5 and positions the heat dissipation body 51 on the solid state hard disk card 3. In other words, it is through such as Figure 7 The elastic positioning module 6 shown is fixed on one of the side walls 22 of the heat dissipation chassis 2 and is designed to be inserted into the limiting hole 52 of the heat dissipation module 5 with the positioning pin 62 of the elastic positioning module 6. In the process of the heat dissipation body 51 of the heat dissipation module 5 pivoting in the direction B close to the solid state drive card 3, the elastic positioning controller 61 is first used to control the position of the positioning pin 62 without blocking the heat dissipation body 51 from pivoting in the direction close to the solid state drive card 3. After the heat dissipation body 51 of the heat dissipation module 5 pivots to the heat dissipation position, the positioning pin 62 is aligned with the limiting hole 52 of the heat dissipation module 5. Finally, the heat dissipation body 51 can be positioned by controlling the positioning pin 62 to move in the direction close to the limiting hole 52 of the heat dissipation module 5 and to penetrate into the limiting hole 52 through the elastic positioning controller 61, but the present invention is not limited thereto. In addition, in the present embodiment, each pivot unit 23 of the heat dissipation chassis 2 has a pivot shaft 231 extending in the direction of another pivot unit 23. The heat dissipation body 51 of the heat dissipation module 5 has a pivot end 511 pivotally connected to the pivot shaft 231 of the pivot unit 23. In simple terms, the heat dissipation body 51 is connected to the pivot shaft 231 of the pivot unit 23 through the pivot end 511 so that the pivot end 511 of the heat dissipation body 51 can cooperate with the pivot shaft 231 to pivot and the heat dissipation body 51 can achieve a pivoting action, but the present invention is not limited thereto.
[0033] Here, it is particularly noted that, in this embodiment, the mainboard 91 of the mainboard device 90 is provided with a guide hole 912 located in the installation area 911 and close to the connector 92, and a locking hole 915 located in the installation area 911 and away from the connector 92. The heat dissipation chassis 2 further includes a locking unit 25 disposed on the base wall 21 for fixing the base wall 21 to the locking hole 915 of the mainboard 91, and an alignment boss 26 extending from the base wall 21 toward the mainboard 91 and capable of extending into the guide hole 912. In simple terms, during the assembly process of placing the heat dissipation chassis 2 in the mounting area 911 of the mainboard 91 and fixing the base wall 21 of the heat dissipation chassis 2 on the mainboard 91, the alignment boss 26 located below the base wall 21 of the heat dissipation chassis 2 can be used to align with the guide hole 912 of the mainboard 91 and move the base wall 21 of the heat dissipation chassis 2 toward the mainboard 91 so that the alignment boss 26 penetrates the guide hole 912 and moves the base wall 21 to be placed on the mainboard 91. At this time, the base wall 21 of the heat dissipation chassis 2 is located in the mounting area 911, which effectively assists the heat dissipation chassis 2 to be combined with the required installation position in the mounting area 911 of the mainboard 91. Further, in this embodiment, the guide hole 912 of the mainboard 91 of the mainboard device 90 is in the shape of a gourd hole, and has a small hole portion 913 close to the connector 92, and a large hole portion 914 away from the connector 92. The alignment boss 26 of the heat dissipation base 2 extends into the large hole portion 914 of the guide hole 912 of the mainboard 91 and moves the base wall 21 of the heat dissipation base 2 toward the connector 92, thereby driving the alignment boss 26 to move into the small hole portion 913 of the guide hole 912. At this time, the locking unit 25 of the heat dissipation base 2 is aligned with the locking hole 915 of the mainboard 91. That is to say, during the assembly process, after the base wall 21 is placed on the mainboard 91 by aligning the alignment boss 26 of the heat dissipation chassis 2 with the large hole portion 914 of the guide hole 912 of the mainboard 91 and penetrating into the large hole portion 914 of the guide hole 912, the base wall 21 of the heat dissipation chassis 2 only needs to be moved toward the connector 92 to drive the alignment boss 26 to move into the small hole portion 913 of the guide hole 912, so that the locking unit 25 of the heat dissipation chassis 2 will be aligned with the locking hole 915 of the mainboard 91, which effectively facilitates the subsequent locking operation. Finally, the locking unit 25 only needs to be locked into the fixed hole to fix the base wall 21 on the mainboard 91, but it is not limited to this. In this embodiment, the guide hole 912 is in the shape of a gourd hole, but it is not limited to this.
[0034] In addition, it should be particularly noted that, in this embodiment, the fixing module 4 includes a support seat 41 that is detachably fixed to any mounting hole 211 of the base wall 21 of the heat dissipation chassis 2 and can support the positioning portion 32 of the solid state drive card 3, and a limiting member 42 that is elastically movably disposed on the support seat 41 and is used to limit the positioning portion 32 of the solid state drive card 3. The limiting member 42 can be moved in a direction close to the connector 92 and moved to a fixed position, at which time, the limiting member 42 at least partially blocks the positioning portion 32 of the solid state drive card 3 and the positioning portion 32 is blocked and limited by the limiting member 42; the limiting member 42 can be moved in a direction away from the connector 92 and moved to a non-fixed position, at which time, the limiting portion of the limiting member 42 does not block the positioning portion 32 of the solid state drive card 3 and the positioning portion 32 is not blocked and limited by the limiting member 42. In simple terms, the support base 41 of the fixing module 4 can support the positioning portion 32 of the solid-state hard disk card 3 and cooperate with the design of the limiting member 42 to be movable to the fixed position to block the positioning portion 32 of the solid-state hard disk card 3, so that the fixing module 4 can position and fix the positioning portion 32 of the solid-state hard disk card 3. However, this is not limited to this, and other fixing modules 4 can also be used according to actual needs as long as they can position the positioning portion 32 of the solid-state hard disk card 3.
[0035] In summary, the present invention has good overall applicability by fixing the base wall 21 of the heat dissipation chassis 2 on the mainboard 91 and making the mounting holes 211 of the base wall 21 correspond to the length positions of the solid state drive cards 3 of different length sizes, so that the coupling portion 31 of the solid state drive card 3 is inserted and connected to the connector 92 and the positioning portion 32 corresponds to one of the mounting holes 211 of the base wall 21 of the heat dissipation chassis 2, so that the positioning portion 32 of the solid state drive card 3 is limited by the fixing module 4. In addition, the heat dissipation module 5 is pivotally connected to the pivot unit 23 of the heat dissipation chassis 2. As long as the heat dissipation module 5 is pivoted to the heat dissipation position, the heat dissipation module 5 will contact the solid state drive card 3 and cover the solid state drive card 3, and effectively perform heat dissipation operations on the solid state drive card 3.
[0036] However, what is described above is only an embodiment of the present invention and should not be used to limit the scope of implementation of the present invention. All simple equivalent changes and modifications made according to the scope of the patent application of the present invention and the content of the patent specification are still within the scope covered by the patent of the present invention.
Claims
1. A solid state hard disk card device with heat dissipation function, which can support a plurality of solid state hard disk cards of different lengths to be combined with a motherboard device, wherein the motherboard device comprises a motherboard having a mounting area and a connector disposed in the mounting area on the motherboard, characterized in that: The solid state hard disk card device with heat dissipation function is detachably arranged in the installation area on the mainboard and electrically connected to the connector, and includes: a heat dissipation chassis combined with the mainboard, comprising a base wall detachably fixed on the mainboard, two side walls extending from two opposite sides of the base wall in a direction away from the base wall, and two pivot units respectively arranged on the side walls and close to the connector unit, the base wall and the side walls jointly define an accommodation space, and the base wall has a plurality of mounting holes corresponding to solid state hard disk cards of different lengths; A solid state hard disk card detachably inserted into the connector of the mainboard and combined with the accommodation space of the heat dissipation chassis, the solid state hard disk card having a combination portion and a positioning portion located at two opposite ends, the combination portion of the solid state hard disk card being inserted and connected to the connector and the positioning portion corresponding to one of the mounting holes of the base wall of the heat dissipation chassis; a fixing module, which is detachably fixed to any mounting hole of the base wall of the heat dissipation chassis and is used to position the positioning portion of the solid state hard disk card; and A heat dissipation module is pivotally connected to the pivot unit of the heat dissipation base and can cover the solid state hard disk card. The heat dissipation module can be pivoted to a heat dissipation position relative to the heat dissipation base. When in the heat dissipation position, the heat dissipation module contacts the solid state hard disk card and covers the solid state hard disk card.
2. The solid state hard disk card device with heat dissipation function according to claim 1, characterized in that: The heat dissipation module further comprises an elastic positioning module fixed on one of the side walls of the heat dissipation base and used for positioning the heat dissipation module, the heat dissipation module comprises a heat dissipation body pivotally connected to the pivot unit of the heat dissipation base and covering the solid state hard disk card, and a limiting hole recessed in the heat dissipation body and corresponding to the elastic positioning module, the elastic positioning module comprises an elastic positioning controller fixed on the side wall and located on a side of the side wall away from the corresponding pivot unit, and a positioning pin penetrating the side wall and controllably movable into the limiting hole of the heat dissipation module under the control of the elastic positioning controller, when the heat dissipation module is located at the heat dissipation position, the positioning pin of the elastic positioning module extends into the limiting hole of the heat dissipation module and positions the heat dissipation body on the solid state hard disk card.
3. The solid state hard disk card device with heat dissipation function according to claim 2, characterized in that: Each pivot unit of the heat dissipation chassis has a pivot axis extending toward another pivot unit, and the heat dissipation body of the heat dissipation module has a pivot end pivotally connected to the pivot axis of the pivot unit.
4. The solid state hard disk card device with heat dissipation function according to claim 3, characterized in that: The mainboard of the mainboard device is provided with a guide hole located in the installation area and close to the connector, and a locking hole located in the installation area and away from the connector. The heat dissipation base also includes a locking unit arranged on the base wall for fixing the base wall to the locking hole of the mainboard, and an alignment boss extending from the base wall toward the mainboard and capable of extending into the guide hole.
5. The solid state hard disk card device with heat dissipation function according to claim 4, characterized in that: The guide hole of the motherboard of the motherboard device is a gourd-shaped hole, and has a small hole portion close to the connector, and a large hole portion away from the connector. The alignment boss of the heat dissipation base extends into the large hole portion of the guide hole of the motherboard and moves the base wall of the heat dissipation base toward the connector to drive the alignment boss to move into the small hole portion of the guide hole. At this time, the locking unit of the heat dissipation base is aligned with the locking hole of the motherboard.
6. The solid state hard disk card device with heat dissipation function according to claim 1, characterized in that: The fixing module includes a support base detachably fixed to any mounting hole of the base wall of the heat dissipation chassis, and a limiting member elastically movably arranged on the support base and used to limit the positioning portion of the solid state hard disk card.
7. The solid state hard disk card device with heat dissipation function according to claim 1, characterized in that: The solid state drive card is an M.2 solid state drive card.