Computer self-adaptive heat dissipation device

Abstract

The invention discloses a computer self-adaptive heat dissipation device which comprises a supporting frame, a mounting plate is arranged in the supporting frame, a movable groove is formed in the mounting plate, and a first heat dissipation fan set is arranged on the movable groove and can move on the mounting plate in the arrangement direction of the movable groove; an air guide part is further arranged on the first cooling fan set, an air guide plate and a limiting frame are arranged on the air guide part, the air guide plate is rotationally connected to the air guide part and abuts against the limiting frame, the limiting frame is connected with the electric push rod, and the electric push rod drives the air guide plate to rotate on the air guide part when driving the limiting frame to move; a connecting frame is further arranged on the supporting frame and located above the first cooling fan set, a temperature sensor is movably arranged on the connecting frame, and the electric push rod is started after the temperature sensor is triggered. Compared with the prior art, the area of the heat dissipation area where the heat dissipation fan acts can be adjusted according to the size of the notebook computer, and the positions of a CPU and a GPU can be aligned for heat dissipation.

Description

Technical Field

[0001] The invention relates to the technical field of heat dissipation devices, in particular to a computer self-adaptive heat dissipation device. Background Art

[0002] Laptops are known for their portability, but their compact design often limits their heat dissipation performance compared to desktops. Given the high demand for portability among users such as students, laptops are still the first choice, even though desktops can provide better heat dissipation conditions in a fixed environment. However, when laptops perform high-load tasks such as running large software, gaming, or video rendering, the CPU and GPU need to run at full capacity to cope with complex calculations and graphics processing, which will generate significant heat accumulation in the process. Therefore, an effective heat dissipation mechanism is essential to ensure the stable operation of laptops and extend the service life of laptops. At present, most common laptop cooling devices on the market use large-area direct air blowing. Such cooling devices generally lack the ability to automatically adjust according to the specific size of the laptop, resulting in fixed heat dissipation direction and intensity. When the CPU and GPU are running at high load, facing the concentrated heat generated by them, such traditional cooling methods are difficult to accurately evacuate the CPU and GPU.

[0003] In order to solve the problems of the prior art, the present application provides a computer adaptive heat dissipation device. Summary of the invention

[0004] In view of the problem that the heat dissipation device in the prior art cannot adjust the position of the heat dissipation fan according to the size of the laptop computer and cannot accurately dissipate the position of the CPU and GPU, the present invention proposes a computer adaptive heat dissipation device.

[0005] The technical solution of the present invention is to disclose a computer adaptive heat dissipation device, comprising a support frame, a mounting plate is arranged inside the support frame, a movable groove is arranged on the mounting plate, a first heat dissipation fan group is arranged on the movable groove and can move on the mounting plate along the setting direction of the movable groove; The first cooling fan assembly is also provided with an air guide member, the air guide member is provided with an air guide plate and a limit frame, the air guide plate is rotatably connected to the air guide member and abuts against the limit frame, the limit frame is connected to an electric push rod, and when the electric push rod drives the limit frame to move, the air guide plate is driven to rotate on the air guide member; The support frame is also provided with a connecting frame, and the connecting frame is located above the first cooling fan group. A temperature sensor is movably provided on the connecting frame, and the electric push rod is started after the temperature sensor is triggered.

[0006] Furthermore, one end of the electric push rod is fixed to the mounting plate, and the other end is connected to the limit frame, the limit frame is provided with a plurality of through slots corresponding to the number of the air guide plates, and the through slots are provided with protrusions, and the electric push rod drives the limit frame to move so that the protrusions abut against or separate from the air guide plates.

[0007] Furthermore, there are a plurality of air guide plates, and each of the air guide plates is mounted on the air guide member via a connecting rod, one end of the guide plate is located in the through slot, and the guide rod can rotate in the through slot along the axial direction of the connecting rod.

[0008] Furthermore, the connection frame is provided with a plurality of positioning holes, and the bottom of the temperature sensor is provided with a positioning column matching the positioning hole, and the temperature sensor can be installed at the position where any positioning hole is located through the positioning column.

[0009] Furthermore, a guide pipe is provided on the upper surface of the connecting frame, and the guide pipe is arranged to avoid the positioning hole. A water tank for storing coolant is provided on one side of the supporting frame, and a water pump connected to the guide pipe is provided in the water tank.

[0010] Furthermore, one end of the flow guide pipe is connected to the water pump, and the other end thereof is located at the bottom of the water tank for circulating the coolant in the flow guide pipe.

[0011] Furthermore, a second cooling fan group is respectively arranged on both sides of the first cooling fan group, and the air outlets of the first cooling fan group and the second cooling fan group are both arranged to be inclined toward the center of the support frame.

[0012] Furthermore, slide grooves are arranged on both sides of the upper surface of the mounting plate, the slide grooves are arranged obliquely toward the center of the mounting plate, and the second cooling fan group is movably installed in the slide grooves.

[0013] Furthermore, clamping blocks connected to the motor are provided on both sides of the support frame, and the two clamping blocks are respectively connected to two second cooling fan groups, and the motor drives the clamping blocks to move closer to or away from the support frame, and the second cooling fan group moves closer to or away from the center of the mounting plate as the clamping blocks move; The clamping block is also provided with a distance sensor, and when the distance sensor is triggered, the motor is turned off and the clamping block stops moving.

[0014] Furthermore, a wire management plate is provided on one side of the support frame, one end of the wire management plate is mounted on the support frame via a rotating shaft, and the other end of the wire management plate rotates with the rotating shaft to engage with or separate from the support frame.

[0015] Compared with the prior art, the present invention can adjust the area of ​​the heat dissipation region where the heat dissipation fan acts according to the size of the notebook computer, and can align the positions of the CPU and GPU for heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0017] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the mounting plate structure of the present invention; Figure 3 This is a schematic structural diagram of a first heat dissipation fan group of the present invention; Figure 4 This is a schematic diagram of the structure of the air guide member of the present invention; Figure 5 It is a schematic diagram of the structure of the limiting frame of the present invention; Figure 6 This is a schematic diagram of the water tank and the guide pipe structure of the present invention; Figure 7 This is a schematic diagram of the structure of the clamping block of the present invention; Figure 8 It is a schematic diagram of the structure of the wiring board of the present invention; Among them, the support frame 1; the mounting plate 2; the movable groove 21; the first cooling fan group 22; the electric push rod 23; the second cooling fan group 24; the slide groove 25; the air guide member 3; the air guide plate 31; the connecting rod 311; the limit frame 32; the through groove 321; the protrusion 322; the connecting frame 4; the temperature sensor 41; the positioning hole 42; the water tank 5; the guide pipe 51; the water pump 52; the clamping block 6; the motor 61; the distance sensor 62; the wire management plate 7; and the rotating shaft 71. DETAILED DESCRIPTION

[0018] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0019] Thus, a feature indicated in this specification will be used to illustrate one of the features of an embodiment of the present invention, rather than implying that each embodiment of the present invention must have the described feature. In addition, it should be noted that this specification describes many features. Although some features can be combined together to illustrate possible system designs, these features can also be used in other combinations that are not explicitly described. Thus, unless otherwise stated, the described combinations are not intended to be limiting.

[0020] In the description of the present application, the terms “first” and “second” are used for descriptive purposes only and should not be understood as indicating or implying relative importance.

[0021] In the description of the present application, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0022] The principle and structure of the present invention are described in detail below with reference to the accompanying drawings and embodiments.

[0023] A computer adaptive heat dissipation device includes a support frame 1, a mounting plate 2 is arranged inside the support frame 1, a movable groove 21 is arranged on the mounting plate 2, a first heat dissipation fan group 22 is arranged on the movable groove 21 and can move on the mounting plate 2 along the setting direction of the movable groove 21; an air guide member 3 is also arranged on the first heat dissipation fan group 22, an air guide plate 31 and a limit frame 32 are arranged on the air guide member 3, the air guide plate 31 is rotatably connected to the air guide member 3 and abuts against the limit frame 32, the limit frame 32 is connected to an electric push rod 23, and the electric push rod 23 drives the limit frame 32 to move, so as to drive the air guide plate 31 to rotate on the air guide member 3; a connecting frame 4 is also arranged on the support frame 1, the connecting frame 4 is located above the first heat dissipation fan group 22, a temperature sensor 41 is movably arranged on the connecting frame 4, and the electric push rod 23 is started after the temperature sensor 41 is triggered.

[0024] Furthermore, one end of the electric push rod 23 is fixed on the mounting plate 2, and the other end is connected to the limit frame 32. The limit frame 32 is provided with a plurality of through slots 321 corresponding to the number of the air guide plates 31, and the through slots 321 are provided with protrusions 322. The electric push rod 23 drives the limit frame 32 to move so that the protrusions 322 abut against or separate from the air guide plates 31.

[0025] Furthermore, there are multiple air guide plates 31 , and each air guide plate 31 is installed on the air guide member 3 through a connecting rod 311 , one end of the guide plate is located in the through slot 321 , and the guide rod can rotate in the through slot 321 along the axial direction of the connecting rod 311 .

[0026] In a specific embodiment, Figures 1 to 6 As shown, a computer adaptive heat dissipation device proposed in the present application is applied to the heat dissipation of a laptop computer. Its main body is a support frame 1, and the laptop computer is placed on the support frame 1. The laptop computer is lifted up by the support frame 1, which can speed up the air circulation at the bottom of the laptop computer and improve the heat dissipation effect.

[0027] A mounting plate 2 is also provided inside the support frame 1, and a movable groove 21 is provided through the mounting plate 2. The first cooling fan group 22 is provided on the movable groove 21, and can move on the mounting plate 2 along the setting direction of the movable groove 21. This design enables the user to manually adjust the position of the first cooling fan group 22 according to actual needs. Specifically, considering that the CPU and GPU in the notebook computer are the main sources of heat generation, this design enables the first cooling fan group 22 to be moved to directly below the CPU and GPU of notebook computers of different sizes when placed on the support frame 1, ensuring that the airflow blown by the first cooling fan can directly act on the area where the heat is most concentrated, thereby improving the cooling efficiency and cooling effect of the CPU and GPU of the notebook computer.

[0028] Among them, an air guide member 3 is also provided on the first cooling fan group 22, and the air guide member 3 includes mounting seats installed on the front and rear sides of the first cooling fan group 22, and a plurality of air guide plates 31 provided between the mounting seats on both sides. The two ends of the air guide plate 31 are respectively fixed on the mounting seats on the front and rear sides, and connecting rods 311 are provided on the two ends of the air guide plate 31, and mounting holes for accommodating the connecting rods 311 are provided on the mounting seats. This design enables the connecting rods 311 to rotate in the mounting holes, thereby realizing the function of the air guide plate 31 rotating on the air guide member 3. In addition, a limit frame 32 is also provided on the rear side mounting seat of the air guide member 3, and a plurality of through slots 321 are provided on the limit frame 32, and the number of these through slots 321 matches the number of the air guide plates 31. One end of the air guide plate 31 close to the rear mounting seat is embedded in the through slot 321, and a protrusion 322 is provided at the lower end of each through slot 321. When the air guide plate 31 enters the through slot 321, the lower end of the air guide plate 31 abuts against the protrusion 322, and the air guide plate 31 is blocked by the protrusion 322 and cannot rotate when abutting against the protrusion 322. It should be noted that an electric push rod 23 is also provided on the mounting plate 2, one end of the electric push rod 23 is fixed on the mounting plate 2, and the other end is connected to the limit frame 32. Starting the electric push rod 23 can control the limit frame 32 to move upward or downward.

[0029] During the downward displacement of the limit frame 32, the air guide plate 31 gradually penetrates into the through slot 321 until the air guide plate 31 exceeds the position of the protrusion 322 below the through slot 321 and is completely separated from the protrusion 322. In this dynamic process, the air guide plate 31 gradually tilts toward the horizontal direction under the constraint of the through slot 321 due to the action of gravity. Once the air guide plate 31 is completely out of contact with the protrusion 322, the upper end of the air guide plate 31 fits with the inner wall of the through slot 321 to form a stable support, preventing the air guide plate 31 from further rotating. At this time, compared with the initial state, the inclination of the air guide plate 31 toward the horizontal plane is greater, resulting in the airflow output by the first cooling fan group 22 After passing through the air guide plate 31, the effective area of ​​the airflow is reduced, thereby enhancing the concentration and flow rate of the airflow, so that the first cooling fan group 22 can accurately dissipate heat for the position of the CPU and GPU of the notebook computer directly above it, further improving the heat dissipation effect, which is conducive to ensuring the stable operation of the notebook computer under high-load tasks.

[0030] Here, a connecting frame 4 is also provided on the top of the supporting frame 1, and the connecting frame 4 is located above the first cooling fan group 22, and a temperature sensor 41 is also provided on the upper surface of the connecting frame 4, and the temperature sensor 41 is directly in contact with the bottom surface just below the CPU and GPU of the laptop computer.

[0031] Specifically, a preset temperature T1 can be set first, and the temperature detected by the temperature sensor 41 is T2. When the temperature T2 detected by the temperature sensor 41 is greater than the preset temperature T1+3°C, it means that the temperatures of the CPU and GPU of the laptop computer are relatively high and the heat dissipation needs to be increased. At this time, the electric push rod 23 is started to move the limit frame 32 downward, and the air guide plate 31 is tilted toward the horizontal plane to reduce the effective area of ​​the airflow and thereby increase the flow rate of the airflow, so that the airflow blown out by the first cooling fan group 22 is more concentrated on the position of the CPU and GPU of the laptop computer, thereby improving the heat dissipation effect; when the temperature T2 detected by the temperature sensor 41 is less than the preset temperature T1-3°C, it means that the temperatures of the CPU and GPU of the laptop computer are already in the normal range. At this time, the electric push rod 23 moves the limit frame 32 upward, and the air guide plate 31 is reset to restore the effective area of ​​the airflow blown out by the first cooling fan group 22.

[0032] Furthermore, the temperature sensor 41 is movably mounted on the connecting frame 4. This design ensures that no matter how the layout of the CPU and GPU inside different laptop computers changes, the temperature sensor 41 can be attached to the bottom surface of the laptop computer facing the CPU and GPU, thereby realizing the detection of the temperature of the area where the CPU and GPU are located, making the present application applicable to laptop computers of different models and sizes, thereby increasing the scope of application.

[0033] Furthermore, a plurality of positioning holes 42 are provided on the connecting frame 4 , and a positioning column matching the positioning hole 42 is provided at the bottom of the temperature sensor 41 , and the temperature sensor 41 can be installed at the position where any positioning hole 42 is located through the positioning column.

[0034] Furthermore, a guide pipe 51 is provided on the upper surface of the connecting frame 4 , and the guide pipe 51 is arranged to avoid the positioning hole 42 . A water tank 5 for storing coolant is provided on one side of the supporting frame 1 , and a water pump 52 connected to the guide pipe 51 is provided in the water tank 5 .

[0035] Furthermore, one end of the flow guide pipe 51 is connected to the water pump 52 , and the other end thereof is located at the bottom of the water tank 5 for circulating the coolant in the flow guide pipe 51 .

[0036] In a specific embodiment, Figure 6 As shown, the connecting frame 4 is provided with a plurality of positioning holes 42, and a positioning column matching the positioning hole 42 is provided at the bottom of the temperature sensor 41. The temperature sensor 41 can be installed at any position in the central area of ​​the connecting frame 4 through the cooperation of the positioning column and the positioning hole 42. The user can adjust the installation position of the temperature sensor 41 according to the position of the CPU and GPU of the notebook computer currently in use, ensuring that the temperature sensor 41 can always be located on the bottom surface directly below the CPU and GPU of the notebook computer for temperature detection.

[0037] Among them, a group of guide tubes 51 are arranged on the upper surface of the connecting frame 4, and the guide tubes 51 are arranged to avoid all the positioning holes 42 to ensure that the guide tubes 51 will not affect the installation of the temperature sensor 41. This design is intended to provide a cooling and heat dissipation solution for the laptop computer through heat conduction and liquid circulation mechanism. Specifically, a water tank 5 is installed on the left side of the support frame 1, and the water tank 5 is used to store the coolant. In this embodiment, the coolant is water, and other coolants with good heat conduction performance can also be used in other embodiments. A water pump 52 connected to the guide tube 51 is arranged inside the water tank 5. The water pump 52 serves as a power source and is responsible for driving the coolant to flow continuously in the guide tube 51. One end of the guide tube 51 is connected to the output end of the water pump 52 to ensure that the coolant obtains sufficient power under the action of the water pump 51 and can flow along the guide tube 51. The other end of the guide tube 51 extends to the bottom of the water tank 5 after passing through the upper surface of the connecting frame 4, forming a closed-loop cooling circuit. This design allows the coolant to fully absorb the heat emitted from the bottom of the laptop computer when flowing through the guide tube 51, and then return to the bottom of the water tank 5 to release the heat in the water tank 5, preparing for the next cycle. In order to achieve direct and effective heat exchange with the laptop computer, the guide tube 51 is in direct contact with the bottom of the laptop computer. This direct contact method greatly improves the heat conduction efficiency, so that the heat generated by the laptop computer during operation can be quickly absorbed and taken away by the coolant, thereby reducing the operating temperature of the laptop computer and further ensuring the stable operation of the laptop computer under high load conditions.

[0038] Furthermore, a second cooling fan group 24 is respectively disposed on both sides of the first cooling fan group 22 , and the air outlets of the first cooling fan group 22 and the second cooling fan group 24 are both inclined toward the center of the support frame 1 .

[0039] Furthermore, slide grooves 25 are provided on both sides of the upper surface of the mounting plate 2 . The slide grooves 25 are inclined toward the center of the mounting plate 2 . The second cooling fan group 24 is movably installed in the slide grooves 25 .

[0040] Furthermore, clamping blocks 6 connected to the motor 61 are provided on both sides of the support frame 1. The two clamping blocks 6 are respectively connected to the two second cooling fan groups 24. The motor 61 drives the clamping block 6 to move closer to or away from the support frame 1, and the second cooling fan group 24 moves closer to or away from the center of the mounting plate 2 as the clamping block 6 moves; a distance sensor 62 is also provided on the clamping block 6. When the distance sensor 62 is triggered, the motor 61 is turned off and the clamping block 6 stops moving.

[0041] In a specific embodiment, Figure 7As shown, a second cooling fan group 24 is respectively arranged on the left and right sides of the first cooling fan group 22, and the first cooling fan group 22 and the second cooling fan group 24 are both arranged obliquely on the mounting plate 2, and the air outlets of the first cooling fan group 22 and the second cooling fan group 24 are both oriented toward the center of the support frame 1. This is because the CPU and GPU are usually arranged at the center of the notebook computer, and this arrangement enables the first cooling fan group 22 and the second cooling fan group 24 to blow air toward the bottom surface below the CPU and GPU of the notebook computer, which is more conducive to the heat dissipation of the CPU and GPU.

[0042] In addition, at the connection between the mounting plate 2 and the second cooling fan group 24, a slide groove 25 is provided on the mounting plate 2. These slide grooves 25 are arranged obliquely toward the center of the mounting plate 2, and are located on a ray extending from the middle position of the mounting plate 2 toward the surrounding of the mounting plate 2. The second cooling fan group 24 is movably installed in the slide groove 25. Through the guiding effect of the slide groove 25, the second cooling fan group 24 can move along the slide groove 25 on the mounting plate 2 to approach or move away from the center of the mounting plate 2. This design is intended to provide a flexible installation and adjustment mechanism for the second cooling fan group 24, so that the effective area of ​​the airflow blown out by the second cooling fan group 24 can be adjusted according to laptop computers of different sizes.

[0043] Here, a clamping block 6 is respectively arranged on the left and right sides of the support frame 1, and a motor 61 is arranged on the side of each clamping block 6 away from the support frame 1, and two second cooling fan groups 24 are respectively connected to the ends of the two clamping blocks 6 close to the support frame 1. This design makes the second cooling fan group 24 move with the motor 61 when the clamping block 6 moves. And a distance sensor 62 is also arranged on the top of each clamping block 6. When the clamping block 6 contacts the edges of the two sides of the laptop, the distance sensor 62 is triggered, and the motor 61 is turned off at this time, so that the clamping block 6 stops moving. This design ensures that no matter what size of laptop is placed on the support frame 1, the clamping block 6 can accurately clamp it, and the second cooling fan group 24 can adaptively adjust the wind action area according to the specific size of the laptop. For a laptop with a larger size, the two second cooling fan groups 24 will move away from each other to expand the heat dissipation area; while for a laptop with a smaller size, the two second cooling fan groups 24 will move closer to each other to dissipate heat more concentratedly, which can avoid the waste of wind power of the second cooling fan group 24 and improve the heat dissipation efficiency.

[0044] Furthermore, a wire management plate 7 is provided on one side of the support frame 1 , one end of the wire management plate 7 is mounted on the support frame 1 via a rotating shaft 71 , and the other end of the wire management plate 7 rotates with the rotating shaft 71 to engage with or separate from the support frame 1 .

[0045] In a specific embodiment, Figure 8 As shown, a wire management board 7 is provided on the rear side of the support frame 1 to solve the common problem of messy line layout of laptop computers and their external devices (such as power adapters, etc.) during use. One end of the wire management board 7 is mounted on the support frame 1 through a rotating shaft 71, and the other end is engaged or separated from the support frame 1 with the rotation of the rotating shaft 71. When the user needs to place the laptop on the support frame 1 and wants to organize its power cord, data cable and other wires, the upper end of the wire management board 7 can be separated from the support frame 1. The separated wire management board 7 provides a flat table, and the user can place the power adapter of the laptop on the wire management board 7. In addition, a plurality of grooves are designed on the wire management board 7, which are used to accommodate the common power cords, data cables and other wires behind the laptop. The user can arrange and engage these wires along these grooves, fix the wires on the wire management board 7, avoid the entanglement of wires and cause the lines to be messy, and make the line layout behind the laptop more neat and orderly.

[0046] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A computer adaptive heat dissipation device, comprising a support frame (1), characterized in that: A mounting plate (2) is arranged inside the support frame (1), a movable groove (21) is arranged on the mounting plate (2), and a first cooling fan group (22) is arranged on the movable groove (21) and can move on the mounting plate (2) along the setting direction of the movable groove (21); The first cooling fan group (22) is also provided with an air guide member (3), the air guide member (3) is provided with an air guide plate (31) and a limit frame (32), the air guide plate (31) is rotatably connected to the air guide member (3) and abuts against the limit frame (32), the limit frame (32) is connected to the electric push rod (23), and when the electric push rod (23) drives the limit frame (32) to move, it drives the air guide plate (31) to rotate on the air guide member (3); The support frame (1) is also provided with a connecting frame (4), the connecting frame (4) is located above the first cooling fan group (22), and a temperature sensor (41) is movably provided on the connecting frame (4), and the electric push rod (23) is activated when the temperature sensor (41) is triggered.

2. The computer adaptive heat dissipation device according to claim 1, characterized in that: One end of the electric push rod (23) is fixed on the mounting plate (2), and the other end is connected to the limiting frame (32); the limiting frame (32) is provided with a plurality of through slots (321) corresponding to the number of the air guide plates (31); the through slots (321) are provided with protrusions (322); the electric push rod (23) drives the limiting frame (32) to move so that the protrusions (322) abut against or separate from the air guide plates (31).

3. A computer adaptive heat dissipation device according to claim 2, characterized in that: There are a plurality of wind guide plates (31), and each wind guide plate (31) is mounted on the wind guide member (3) via a connecting rod (311); one end of the guide plate is located in the through slot (321), and the guide rod can rotate in the through slot (321) along the axial direction of the connecting rod (311).

4. The computer adaptive heat dissipation device according to claim 1, characterized in that: The connecting frame (4) is provided with a plurality of positioning holes (42), the bottom of the temperature sensor (41) is provided with a positioning column matching the positioning hole (42), and the temperature sensor (41) can be installed at the position where any positioning hole (42) is located through the positioning column.

5. The computer adaptive heat dissipation device according to claim 4, characterized in that: The upper surface of the connecting frame (4) is also provided with a guide tube (51), and the guide tube (51) is arranged to avoid the positioning hole (42). A water tank (5) for storing coolant is provided on one side of the supporting frame (1), and a water pump (52) connected to the guide tube (51) is provided in the water tank (5).

6. The computer adaptive heat dissipation device according to claim 5, characterized in that: One end of the flow guide pipe (51) is connected to the water pump (52), and the other end is located at the bottom of the water tank (5) and is used to circulate the coolant in the flow guide pipe (51).

7. The computer adaptive heat dissipation device according to claim 1, characterized in that: A second cooling fan group (24) is respectively arranged on both sides of the first cooling fan group (22), and the air outlets of the first cooling fan group (22) and the second cooling fan group (24) are both arranged to be inclined toward the center of the support frame (1).

8. The computer adaptive heat dissipation device according to claim 7, characterized in that: Slide grooves (25) are arranged on both sides of the upper surface of the mounting plate (2), and the slide grooves (25) are arranged obliquely toward the center of the mounting plate (2), and the second cooling fan group (24) is movably installed in the slide grooves (25).

9. The computer adaptive heat dissipation device according to claim 8, characterized in that: Clamping blocks (6) connected to a motor (61) are also provided on both sides of the support frame (1); the two clamping blocks (6) are respectively connected to two second cooling fan groups (24); the motor (61) drives the clamping blocks (6) to move closer to or farther from the support frame (1); and the second cooling fan groups (24) move closer to or farther from the center of the mounting plate (2) as the clamping blocks (6) move; The clamping block (6) is also provided with a distance sensor (62), and when the distance sensor (62) is triggered, the motor (61) is turned off and the clamping block (6) stops moving.

10. The computer adaptive heat dissipation device according to claim 1, characterized in that: A wire management plate (7) is also provided on one side of the support frame (1); one end of the wire management plate (7) is mounted on the support frame (1) via a rotating shaft (71); the other end of the wire management plate (7) rotates with the rotating shaft (71) to engage with or disengage from the support frame (1).

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