Semiconductor type radiator and use method

Abstract

A semiconductor-type heat sink and method of use includes a semiconductor heat sink within a first housing having a heat absorbing end and a heat releasing end. A first radiating pipe is arranged above the heat release end, and a heat conducting sheet is arranged between the first radiating pipe and the heat The first radiating pipe is connected with a hose through a first water pump, and the other end of the hose is connected with a main radiator. The total radiator is composed of a second shell, a second water pump, a second radiating pipe and a backflow water pipe, a plurality of uniformly distributed runners are arranged on the outer side of the second radiating pipe, and a backflow water pipe is arranged on the side far away from the shell. And a plurality of reflux water pumps which are uniformly distributed along the circumference are arranged at the top and are connected with the second radiating pipe and the reflux water pipe. The other end of the backflow water pipe is connected with a backflow water outlet and located above the second water pump. In addition, a cooling fan is arranged above the backflow water pump. Through semiconductor refrigeration, liquid circulation and air heat dissipation, efficient heat management is achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation devices for electronic equipment, and in particular to a semiconductor type heat sink and a use method thereof. Background Art

[0002] Semiconductor heat sink is a device used for heat dissipation, which is usually used in electronic components and computer hardware. It uses a combination of semiconductor refrigeration technology and heat pipe technology to achieve high-efficiency heat dissipation effect; in daily environment, common semiconductor heat sinks can help the core of the equipment to dissipate heat. In some open-pit mines, although the mine environment is relatively noisy and dusty, the overall temperature and humidity are still within the normal range of electronic equipment, and the semiconductor heat sink can still work normally; but when used in some deeper mines, due to the depth of the mine, monitoring centers are generally set up inside and outside the mine. However, unlike the normal environment outside the mine, the inside of the mine is mostly high temperature and high humidity, and there is a lot of dust in the air. At the same time, the mining equipment will also generate huge noise and vibration when it is started. In such an environment, conventional semiconductor heat sinks can hardly work normally, and the core of the electronic equipment cannot dissipate heat well, which seriously affects the overall monitoring efficiency of the mining system, and thus affects the overall efficiency of mining. Summary of the invention

[0003] In order to solve the problem that the above-mentioned traditional radiator is difficult to work in a mine and cannot adapt well to the mine environment, the present invention proposes a semiconductor radiator and a method of use to solve the above-mentioned problem.

[0004] A semiconductor radiator comprises a first shell, the first shell is an insulating heat-insulating material, a semiconductor radiator is installed inside the first shell, the two ends of the semiconductor radiator are respectively a heat absorbing end and a heat releasing end, the heat absorbing end is placed on the device core, a heat conducting block is arranged between the heat absorbing end and the device core to expand the heat conducting area, a first heat dissipating pipe is installed above the heat releasing end, a heat conducting sheet is arranged between the first heat dissipating pipe and the heat releasing end, the heat conducting sheet is located below the outer surface of the first heat dissipating pipe, the first heat dissipating pipe is connected to a first water pump, a first water pump outlet and a first water pump inlet are arranged on the surface of the first water pump, and the first water pump A hose is connected to the water inlet, one end of which is connected to the water inlet of the first water pump, and the other end of which is connected to the main radiator. Since the air temperature and humidity inside the cavity are relatively high, the use of a conventional air-cooled radiator will cause condensed water to gather on the surface of the radiator and eventually drip onto the circuit board, causing damage to the chip. In order to avoid the above phenomenon, a split heat dissipation method is designed, in which a semiconductor radiator is used to dissipate heat for the CPU, and a main radiator is used to dissipate heat for the semiconductor radiator, transferring the condensation phenomenon to the main radiator, and using condensed water to further dissipate heat, thereby improving the overall heat dissipation efficiency and better adapting to the special environment under the mine.

[0005] Furthermore, the main radiator includes a second shell, a second water pump is installed at the bottom of the second shell, the second water pump is an integration of multiple water pumps, and a heat dissipation component is installed above the second water pump; the second water pump includes a high-temperature water pump that pumps high-temperature water into the main radiator and a cooling water pump that pumps cooling water out, and an insulation layer is arranged between the two water pumps to prevent heat exchange from affecting the quality of cooling water.

[0006] Furthermore, the heat dissipation component includes a second heat dissipation pipe and a return water pipe. The second heat dissipation pipe is cylindrical as a whole. A flow channel is provided on the side of the second heat dissipation pipe close to the second shell. The flow channels are provided in plurality and are evenly distributed along the outer surface of the second heat dissipation pipe close to the second shell. The return water pipe is located on the side of the second heat dissipation pipe away from the second shell. A return water pump is installed on the top of the second heat dissipation pipe. The return water pumps are provided in plurality and are evenly distributed along the circumferential direction of the bottom surface of the second shell. The water inlet of the return water pump is connected to one end of the second heat dissipation pipe, and the water outlet of the return water pump is connected to the return water pipe. One end of the reflux water pipe is connected to a reflux water outlet at the other end, and the reflux water outlet is located on the top of the second water pump. A cooling fan is installed above the reflux water pump, and a dustproof net is installed above the cooling fan. A U-shaped flow channel is set to increase the contact area. Since the air temperature and humidity in the mine are relatively high, condensed water will condense on the surface of the second cooling pipe. In conjunction with the cooling fan set on the top, the air circulation inside the total radiator is accelerated, and the evaporation of condensed water is accelerated to help dissipate heat. The condensed water is blown downward in the other direction, so that the condensed water continues to move downward, so that the condensed water evaporates better, and the condensed water that has not completely evaporated enters the water collection tank.

[0007] Furthermore, the surface of the second shell is provided with cooling fins, the cooling fins are evenly arranged along the circumferential direction of the second shell, a hinge shaft is provided at the connection between the cooling fins and the second shell, and the outer surface of the second shell is evenly provided with vents, the vents are matched with dustproof nets, and the dustproof nets are bolted to the outer surface of the second shell; cooling fins are provided, and due to the action of the cooling fan, the temperature of the cooling fins is lower than the temperature inside the mine, so that condensed water condenses on the surface of the cooling fins, and under the action of the cooling fan, the dust-carrying air first contacts the cooling fins, and a part of it is adsorbed by the condensed water on the surface of the cooling fins, further reducing the dust entering the radiator.

[0008] Furthermore, a fin opening and closing motor is provided at the bottom of the second shell, and there are multiple fin opening and closing motors. The setting position of the fin opening and closing motor corresponds to the setting position of the cooling fins. The output end of the fin opening and closing motor is connected to the hinge shaft, and the hinge shaft connected to the output end of the fin opening and closing motor is located at the lower half of the cooling fins; ventilation holes are provided on the surface of the cooling fins, and there are multiple ventilation holes. The ventilation holes are arranged obliquely and evenly distributed along the surface of the cooling fins; the opening and closing degree of the cooling fins is controlled by the dust concentration data provided by the dust concentration sensor, so as to expand the contact area between the cooling fins and the dust, reduce the dust entering the total radiator, and cover the vents at the same time, block them when the dust concentration is high, and use the ventilation holes for preliminary ventilation.

[0009] Furthermore, the flow channel has a double-layer structure, the outermost layer of the flow channel is a heat-conducting layer, the inner layer of the flow channel is an anti-corrosion layer, the flow channel is U-shaped as a whole, and the two ends of the U-shape are connected to the second heat dissipation pipe as a whole; the heat-conducting layer is provided to help dissipate heat. At the same time, since there is dust and some harmful gases in the mine, corrosive liquid is formed after combining with water. The provision of an anti-corrosion layer can effectively improve the overall service life of the device.

[0010] Furthermore, the outer surface of the return water pipe is wrapped with an insulating and heat-insulating sleeve to prevent the cooling water temperature from being affected.

[0011] Furthermore, the second outer shell surface is provided with a slide groove, and the slide groove is matched with a water collecting trough, and the water collecting trough includes two semicircular water collecting troughs, and the two semicircular water collecting troughs are fixed into a circular water collecting trough by bolts and are simultaneously inserted into the slide groove on the second outer shell surface, and the surface of the water collecting trough is provided with a drain outlet; embedding the water collecting trough into the second outer shell surface can effectively prevent cooling water from seeping out of the gap, and the use of two semicircular combinations makes disassembly and assembly more convenient, thereby improving efficiency.

[0012] Furthermore, a second water pump water inlet and a second water pump cooling water outlet are provided on the surface of the second shell, the second water pump cooling water outlet is connected to a cooling water pipe, and the surface of the cooling water pipe is wrapped with an insulating layer.

[0013] Furthermore, a control board is installed inside the second shell, and the control board is electrically connected to the first water pump, the reflux water pump, the second water pump and the fin opening and closing motor. A dust concentration sensor is also installed on the surface of the second shell, and the dust concentration sensor is electrically connected to the control board.

[0014] Furthermore, a hanging hole is provided on the surface of the dustproof net to help replace the dustproof net.

[0015] Furthermore, a foot is installed at the bottom of the second shell.

[0016] The working principle of the present invention is that the heat absorbing end of the semiconductor radiator transfers the heat generated by the CPU to the heat releasing end and conducts the heat to the heat dissipation liquid inside the first heat dissipation tube through the heat conducting sheet. The heat dissipation liquid moves along the first heat dissipation tube, and the temperature gradually increases. Finally, it is input into the second water pump through the water outlet of the first water pump through the heat insulating hose, and the heat dissipation liquid is pumped into the second heat dissipation tube through the water outlet of the second water pump. When the heat dissipation liquid flows in the second heat dissipation tube, it passes through one flow channel after another, and fully contacts with the heat conductive layer and the air to dissipate heat. At the same time, the heat dissipation fan keeps working, and the second heat dissipation tube at the top has a lower temperature, which will produce condensed water. The heat dissipation wind The fan blows the condensed water downward, so that the condensed water moves along the outer surface of the second heat dissipation pipe, and leaves a water layer in the process of movement to quickly evaporate and absorb heat, thereby helping to dissipate heat, while taking away the dust adhering to the outer surface of the second heat dissipation pipe, and finally enters the water collection tank. The heat dissipation liquid gradually moves upward and cools, and finally enters the reflux water pump. The reflux water pump pumps the heat dissipation liquid into the reflux water pipe and finally enters the reflux water outlet of the second water pump. The heat dissipation liquid is pumped out by the second water pump through the cooling water outlet of the second water pump into the heat insulation hose and enters the first water pump. The first water pump pumps the heat dissipation liquid with a lower temperature into the first heat dissipation pipe to help the semiconductor radiator dissipate heat;

[0017] During the working process, the cooling fan works continuously. Due to the effect of the cooling fan, the temperature of the cooling fins is lower than the temperature inside the mine, so that condensed water condenses on the cooling fins. Under the effect of the cooling fan, the dusty air first contacts the cooling fins and is partially adsorbed by the condensed water on the surface of the cooling fins, further reducing the dust entering the radiator. At the same time, the controller controls the opening and closing degree of the cooling fins through the dust concentration data provided by the dust concentration sensor, expands the contact area between the cooling fins and the dust, reduces the dust entering the total radiator, and covers the vents at the same time to block them when the dust concentration is high, and uses the vents for preliminary ventilation.

[0018] A method for using a semiconductor radiator;

[0019] S1. Install the semiconductor radiator: install the semiconductor radiator above the electronic device core, place a heat conduction block between the semiconductor radiator and the electronic device core, apply heat dissipation silicone between the heat conduction block and the electronic device core, and then fix the semiconductor radiator with special bolts;

[0020] S2. Connect the main radiator: Use a heat-insulating hose to connect and tighten the first water pump outlet and the second water pump inlet of the first water pump, and then use a heat-insulating hose to connect and tighten the first water pump inlet and the second water pump cooling water outlet;

[0021] S3, adding coolant: connect the cooling water outlet of the second water pump at the other end of the main radiator to the coolant tank through a transparent hose, connect the water inlet of the second water pump to the liquid adding pump through a transparent hose, open the liquid adding port of the liquid adding pump to add coolant thereto, start the liquid adding pump and then start the main radiator and the first water pump, while continuously adding coolant to the liquid adding pump, and slowly block the cooling water outlet of the second water pump, observe the number of bubbles in the transparent hose connected to the cooling water outlet of the second water pump, close the cooling water outlet of the second water pump after almost no bubbles are visible, then close the main radiator and the first water pump, and then block the water inlet of the second water pump to complete the liquid addition;

[0022] S4. Start working: Connect the control panel to the main control system and start the device to work

[0023] Compared with the prior art, the present invention has the following beneficial effects:

[0024] The main radiator is used to dissipate the heat of the semiconductor radiator, and the condensation phenomenon is transferred to the main radiator. At the same time, the condensed water is used to further dissipate the heat, thereby improving the overall heat dissipation efficiency and better adapting to the special environment under the mine. A U-shaped flow channel is set to increase the contact area. Due to the high air temperature and high humidity, the condensed water will condense on the surface of the second heat dissipation pipe. In conjunction with the cooling fan set on the top, the air circulation inside the main radiator is accelerated, and the evaporation of the condensed water is accelerated to help dissipate heat. The condensed water is blown downward in the other direction, so that the condensed water continues to move downward, so that the condensed water evaporates better, and the condensed water that has not completely evaporated enters the water collection tank.

[0025] Cooling fins are set up. Due to the action of the cooling fan, the temperature of the cooling fins is lower than the temperature inside the mine, so that condensed water will condense on the cooling fins. Under the action of the cooling fan, the dusty air first contacts the cooling fins and is partially absorbed by the condensed water on the surface of the cooling fins, further reducing the dust entering the radiator.

[0026] Setting up a thermal conductive layer helps dissipate heat. At the same time, since there is dust and some harmful gases in the mine, which combine with water to form corrosive liquids, setting up an anti-corrosion layer can effectively increase the overall service life of the device; enable the device to adapt to the special environment in the mine, and help electronic equipment work normally in the mine environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0028] Figure 1 It is a schematic diagram of the structure of a semiconductor heat sink;

[0029] Figure 2 It is a cross-sectional structural diagram of a semiconductor heat sink;

[0030] Figure 3 is a schematic diagram of the total radiator structure;

[0031] Figure 4 A is the cross-sectional structural diagram of the total radiator;

[0032] Figure 5 It is the cross-sectional structural diagram B of the total radiator;

[0033] Figure 6 It is the cross-sectional structural diagram C of the total radiator;

[0034] Figure 7 This is an enlarged view of part A;

[0035] Figure 8 This is an enlarged view of part B.

[0036] In the figure: 1. semiconductor radiator; 101. heat absorbing end; 102. heat releasing end; 103. heat conducting block; 2. first heat dissipation pipe; 201. heat conducting sheet; 3. first water pump; 301. water outlet of first water pump; 302. water inlet of first water pump; 4. first shell; 5. second heat dissipation pipe; 501. heat conducting layer; 502. flow channel; 6. return water pipe; 7. return water pump; 8. cooling fan; 9. dustproof net; 901. hanging hole; 10. cooling fin; 11. hinge shaft; 12. ventilation hole; 13. water collecting tank; 1301. drain outlet; 14. fin opening and closing motor; 15. second shell; 16. return water outlet; 17. second water pump; 1701. water inlet of second water pump; 1702. water outlet of second water pump; 18. cooling water outlet of second water pump. DETAILED DESCRIPTION

[0037] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0038] The application principle of the present invention is further described below in conjunction with the accompanying drawings and specific embodiments.

[0039] Example 1

[0040] like Figure 1-7As shown; a semiconductor radiator comprises a first shell 4, a semiconductor radiator 1 is installed inside the first shell 4, the two ends of the semiconductor radiator 1 are respectively a heat absorbing end 101 and a heat releasing end 102, a first heat dissipating tube 2 is installed above the heat releasing end 102, a heat conducting sheet 201 is arranged between the first heat dissipating tube 2 and the heat releasing end 102, the heat conducting sheet 201 is located below the outer surface of the first heat dissipating tube 2, the first heat dissipating tube 2 is connected to a first water pump 3, a first water pump outlet 301 and a first water pump inlet 302 are arranged on the surface of the first water pump 3, the first water pump inlet 302 is connected to a hose, one end of the hose is connected to the first water pump inlet 302, and the other end of the hose is connected to the main radiator;

[0041] The total radiator comprises a second housing 15, a second water pump 17 is installed at the bottom of the second housing 15, the second water pump 17 is an integration of multiple water pumps, and a heat dissipation component is installed above the second water pump 17;

[0042] The heat dissipation component includes a second heat dissipation pipe 5 and a reflux water pipe 6. The second heat dissipation pipe 5 is cylindrical as a whole. A flow channel 502 is arranged on the side of the second heat dissipation pipe 5 close to the second shell 15. There are multiple flow channels 502, and the multiple flow channels 502 are evenly distributed along the outer surface of the second heat dissipation pipe 5 close to the second shell 15. The reflux water pipe 6 is located on the side of the second heat dissipation pipe 5 away from the second shell 15. A reflux water pump 7 is installed on the top of the second heat dissipation pipe 5. There are multiple reflux water pumps 7, and the multiple reflux water pumps 7 are evenly distributed along the circumferential direction of the bottom surface of the second shell 15. The water inlet of the reflux water pump 7 is connected to one end of the second heat dissipation pipe 5, and the water outlet of the reflux water pump 7 is connected to one end of the reflux water pipe 6. The other end of the reflux water pipe 6 is connected to a reflux water outlet 16, and the reflux water outlet 16 is located on the top of the second water pump 17. A heat dissipation fan 8 is installed above the reflux water pump 7, and a dustproof net 9 is installed above the heat dissipation fan 8.

[0043] The surface of the second shell 15 is provided with heat dissipation fins 10, and the heat dissipation fins 10 are evenly arranged along the circumferential direction of the second shell 15. A hinge shaft 11 is provided at the connection between the heat dissipation fins 10 and the second shell 15. The outer surface of the second shell 15 is evenly provided with ventilation holes, and the ventilation holes are equipped with dustproof nets 9. The dustproof nets 9 are bolted to the outer surface of the second shell 15.

[0044] A fin opening and closing motor 14 is arranged at the bottom of the second shell 15, and there are multiple fin opening and closing motors 14. The setting position of the fin opening and closing motor 14 corresponds to the setting position of the heat dissipation fin 10. The output end of the fin opening and closing motor 14 is connected to the hinge shaft 11, and the hinge shaft 11 connected to the output end of the fin opening and closing motor 14 is located at the lower half of the heat dissipation fin 10; ventilation holes 12 are opened on the surface of the heat dissipation fin 10, and there are multiple ventilation holes 12. The ventilation holes 12 are arranged obliquely and evenly distributed along the surface of the heat dissipation fin 10.

[0045] The flow channel 502 is a double-layer structure, the outermost layer of the flow channel 502 is a heat-conducting layer 501, and the inner layer of the flow channel 502 is an anti-corrosion layer. The flow channel 502 is U-shaped as a whole, and both ends of the U-shape are connected to the second heat dissipation pipe 5 as a whole.

[0046] The outer surface of the return water pipe 6 is wrapped with an insulating and heat-insulating sleeve.

[0047] The surface of the second shell 15 is provided with a slide groove, and the slide groove is matched with a water collecting trough 13. The water collecting trough 13 includes two semicircular water collecting troughs 13. The two semicircular water collecting troughs 13 are fixed into a circular water collecting trough by bolts and are simultaneously inserted into the slide groove on the surface of the second shell 15. The surface of the water collecting trough 13 is provided with a drain outlet 1301.

[0048] The second shell 15 is provided with a second water pump water inlet 1701 and a second water pump cooling water outlet 18. The second water pump cooling water outlet 18 is connected to a cooling water pipe, and the surface of the cooling water pipe is wrapped with an insulating layer.

[0049] A control board is installed inside the second housing 15, and the control board is electrically connected to the first water pump 3, the reflux water pump 7, the second water pump 17 and the fin opening and closing motor 14. A dust concentration sensor is also installed on the surface of the second housing 15, and the dust concentration sensor is electrically connected to the control board.

[0050] The surface of the dustproof net 9 is provided with hanging holes 901 .

[0051] A foot is installed at the bottom of the second housing 15 .

[0052] Example 2

[0053] like Figure 1-7As shown: the working principle of the present invention is: the heat absorbing end 101 of the semiconductor radiator 1 transfers the heat generated by the CPU to the heat releasing end 102 through the heat conducting block 103, and conducts the heat to the heat dissipating liquid inside the first heat dissipating tube 2 through the heat conducting sheet 201. The heat dissipating liquid moves along the first heat dissipating tube 2, and the temperature gradually increases. Finally, it is input into the second water pump 17 through the heat insulating hose through the first water pump outlet 301 and the heat dissipating liquid is pumped into the second heat dissipating tube 5 through the second water pump outlet 1702. When the heat dissipating liquid flows in the second heat dissipating tube 5, it passes through the flow channels 502 one by one, and fully contacts with the air with the help of the heat conducting layer 501 to dissipate heat. At the same time, the heat dissipating fan 8 keeps working, and the temperature of the second heat dissipating tube 5 above is Condensed water will be generated at a lower temperature. The cooling fan 8 blows the condensed water downward, so that the condensed water moves along the outer surface of the second heat dissipation tube 5, and leaves a water layer in the process of movement to quickly evaporate and absorb heat, thereby helping to dissipate heat and taking away the dust adhering to the outer surface of the second heat dissipation tube 5. Finally, it enters the water collecting tank 13. The cooling liquid gradually moves upward and cools, and finally enters the reflux water pump 7. The reflux water pump 7 pumps the cooling liquid into the reflux water pipe 6 and finally enters the reflux water outlet 16 of the second water pump 17. The cooling liquid is pumped out by the second water pump 17 through the second water pump cooling water outlet 18 into the heat insulation hose and enters the first water pump 3. The first water pump 3 pumps the cooling liquid with a lower temperature into the first heat dissipation tube 2 to help the semiconductor radiator 1 dissipate heat.

[0054] During the operation, the cooling fan keeps working. Due to the action of the cooling fan 8, the temperature of the cooling fins 10 is lower than the temperature inside the mine, so that condensed water condenses on the surface of the cooling fins 10. Under the action of the cooling fan 8, the dusty air first contacts the cooling fins 10, and is partially adsorbed by the condensed water on the surface of the cooling fins 10, further reducing the dust entering the radiator. At the same time, the controller controls the opening and closing degree of the cooling fins 10 through the dust concentration data provided by the dust concentration sensor, expands the contact area between the cooling fins 10 and the dust, reduces the dust entering the total radiator, and covers the vents at the same time to block them when the dust concentration is high. At the same time, the vents 12 are used for preliminary ventilation and heat dissipation. The total radiator can be connected to multiple semiconductor radiators 1 for heat dissipation.

[0055] Example 3

[0056] A method for using a semiconductor radiator;

[0057] S1. Install the semiconductor radiator 1: install the semiconductor radiator 1 above the electronic device core, place a heat conducting block 103 between the semiconductor radiator 1) and the electronic device core, apply heat dissipation silicone between the heat conducting block 103 and the electronic device core, and then fix the semiconductor radiator 1) with special bolts;

[0058] S2. Connect the main radiator: Use a heat-insulating hose to connect and tighten the first water pump outlet 301 and the second water pump inlet 1701 of the first water pump 3, and then use a heat-insulating hose to connect and tighten the first water pump inlet 302 and the second water pump cooling water outlet 18;

[0059] S3, adding coolant: connect the cooling water outlet 18 of the second water pump at the other end of the main radiator to the coolant tank through a transparent hose, connect the water inlet 1701 of the second water pump to the liquid filling pump through a transparent hose, open the liquid filling port of the liquid filling pump to add coolant thereto, start the liquid filling pump, then start the main radiator and the first water pump 3, and continue to add coolant to the liquid filling pump, and slowly block the cooling water outlet 18 of the second water pump, observe the number of bubbles in the transparent hose connected to the cooling water outlet 18 of the second water pump, and close the cooling water outlet 18 of the second water pump when the bubbles are almost invisible, then close the main radiator and the first water pump 3, and then block the water inlet 1701 of the second water pump to complete the liquid addition;

[0060] S4. Start working: Connect the control panel to the main control system and start the device to work.

[0061] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be considered exemplary and non-restrictive in all respects, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention.

Claims

1. A semiconductor heat sink, characterized in that: The invention comprises a first shell (4), wherein a semiconductor radiator (1) is installed inside the first shell (4), wherein two ends of the semiconductor radiator (1) are respectively a heat absorbing end (101) and a heat releasing end (102), wherein a first heat dissipation pipe (2) is installed above the heat releasing end (102), wherein a heat conducting sheet (201) is arranged between the first heat dissipation pipe (2) and the heat releasing end (102), wherein the heat conducting sheet (201) is located below the outer surface of the first heat dissipation pipe (2), wherein the first heat dissipation pipe (2) is connected to a first water pump (3), wherein a first water pump water outlet (301) and a first water pump water inlet (302) are arranged on the surface of the first water pump (3), wherein the first water pump water inlet (302) and the first water pump water outlet (301) are both connected to a hose, wherein one end of the hose is connected to the first water pump (3), and the other end of the hose is connected to a main radiator; The total radiator comprises a second housing (15), a second water pump (17) is installed at the bottom of the second housing (15), the second water pump (17) is an integration of multiple water pumps, and a heat dissipation component is installed above the second water pump (17); The heat dissipation component comprises a second heat dissipation pipe (5) and a return water pipe (6); the second heat dissipation pipe (5) is cylindrical in shape as a whole; a flow channel (502) is provided on the side of the second heat dissipation pipe (5) close to the second shell (15); a plurality of the flow channels (502) are provided; the plurality of the flow channels (502) are evenly distributed along the outer surface of the second heat dissipation pipe (5) close to the second shell (15); the return water pipe (6) is located on the side of the second heat dissipation pipe (5) away from the second shell (15); a return water pump (7) is installed on the top of the second heat dissipation pipe (5); A plurality of reflux water pumps (7) are provided, and the plurality of reflux water pumps (7) are evenly distributed along the circumferential direction of the bottom surface of the second shell (15); a water inlet of the reflux water pump (7) is connected to one end of the second heat dissipation pipe (5); a water outlet of the reflux water pump (7) is connected to one end of the reflux water pipe (6); the other end of the reflux water pipe (6) is connected to a reflux water outlet (16); the reflux water outlet (16) is located at the top of the second water pump (17); a heat dissipation fan (8) is installed above the reflux water pump (7); and a dustproof net (9) is installed above the heat dissipation fan (8).

2. A semiconductor heat sink according to claim 1, characterized in that: The surface of the second shell (15) is provided with heat dissipation fins (10), and the heat dissipation fins (10) are evenly arranged along the circumferential direction of the second shell (15). A hinge shaft (11) is provided at the connection between the heat dissipation fins (10) and the second shell (15). The outer surface of the second shell (15) is evenly provided with ventilation holes, and the ventilation holes are matched with dustproof nets (9). The dustproof nets (9) are bolted to the outer surface of the second shell (15).

3. A semiconductor heat sink according to claim 2, characterized in that: A fin opening and closing motor (14) is arranged at the bottom of the second housing (15), and a plurality of the fin opening and closing motors (14) are arranged. The arrangement position of the fin opening and closing motor (14) corresponds to the arrangement position of the heat sink fin (10). The output end of the fin opening and closing motor (14) is connected to a hinge shaft (11), and the hinge shaft (11) to which the output end of the fin opening and closing motor (14) is connected is located at the lower half of the heat sink fin (10); ventilation holes (12) are arranged on the surface of the heat sink fin (10), and a plurality of the ventilation holes (12) are arranged. The ventilation holes (12) are arranged obliquely, and the ventilation holes (12) are evenly distributed along the surface of the heat sink fin (10).

4. A semiconductor heat sink according to claim 1, characterized in that: The flow channel (502) is a double-layer structure, the outermost layer of the flow channel (502) is a heat-conducting layer (501), the inner layer of the flow channel (502) is an anti-corrosion layer, and the flow channel (502) is U-shaped as a whole, with both ends of the U-shaped structure being connected to the second heat dissipation pipe (5) as a whole.

5. The semiconductor heat sink according to claim 1, characterized in that: The outer surface of the return water pipe (6) is wrapped with an insulating and heat-insulating sleeve.

6. A semiconductor heat sink according to claim 1, characterized in that: The surface of the second shell (15) is provided with a slide groove, and the slide groove is matched with a water collecting trough (13). The water collecting trough (13) includes two semicircular water collecting troughs (13). The two semicircular water collecting troughs (13) are fixed into a circular water collecting trough by bolts and are simultaneously inserted into the slide groove on the surface of the second shell (15). The surface of the water collecting trough (13) is provided with a drain outlet (1301).

7. The semiconductor heat sink according to claim 1, characterized in that: The surface of the second shell (15) is provided with a second water pump water inlet (1701) and a second water pump cooling water outlet (18); the second water pump cooling water outlet (18) is connected to a cooling water pipe; the surface of the cooling water pipe is wrapped with an insulating layer.

8. The semiconductor heat sink according to claim 1, characterized in that: A control panel is installed inside the second housing (15), and the control panel is electrically connected to the first water pump (3), the reflux water pump (7), the second water pump (17) and the fin opening and closing motor (14). A dust concentration sensor is also installed on the surface of the second housing (15), and the dust concentration sensor is electrically connected to the control panel.

9. The semiconductor heat sink according to claim 1, characterized in that: The surface of the dustproof net (9) is provided with a hanging hole (901), the top of the second heat dissipation pipe (5) is connected, and a foot base is installed at the bottom of the second shell (15).

10. A method for using a semiconductor heat sink, characterized in that: The steps include: S1. Installing the semiconductor radiator (1): installing the semiconductor radiator (1) above the electronic device core, placing a heat conducting block (103) between the semiconductor radiator (1) and the electronic device core, applying heat dissipation silicone between the heat conducting block (103) and the electronic device core, and then fixing the semiconductor radiator (1) with special bolts; S2. Connecting the main radiator: using a heat-insulating hose to connect and tighten the first water pump outlet (301) of the first water pump (3) and the second water pump inlet (1701), and then using a heat-insulating hose to connect and tighten the first water pump inlet (302) and the second water pump cooling water outlet (18); S3, adding coolant: connect the cooling water outlet (18) of the second water pump at the other end of the main radiator to the coolant tank through a transparent hose, connect the water inlet (1701) of the second water pump to the liquid adding pump using a transparent hose, open the liquid adding port of the liquid adding pump to add coolant thereto, start the liquid adding pump and then start the main radiator and the first water pump (3), while continuously adding coolant to the liquid adding pump, and slowly block the cooling water outlet (18) of the second water pump, observe the number of bubbles in the transparent hose connected to the cooling water outlet (18) of the second water pump, and close the cooling water outlet (18) of the second water pump until the bubbles are almost invisible, then close the main radiator and the first water pump (3), and then block the water inlet (1701) of the second water pump to complete the liquid addition; S4. Start working: Connect the control panel to the main control system and start the device to work.

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