Display device

Abstract

A display device according to an embodiment of the present disclosure includes: a board; a display panel disposed above the plate; a printed circuit board disposed below the board; and a circuit film configured to electrically connect the display panel and the printed circuit board. The board may include an extension bent in a manner corresponding to the bending of the circuit film.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2023-0150175, filed on November 2, 2023, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] The present disclosure relates to a display device. Background Art

[0004] As society has entered the comprehensive information age, various display devices have been developed to process and display a large amount of information. There are various types of display devices that display images, such as liquid crystal display devices, organic light emitting display devices, and inorganic light emitting display devices.

[0005] Applications for display devices are becoming more and more diverse, including not only personal portable devices, computer monitors, and televisions, but also in-vehicle display devices. Summary of the invention

[0006] Since the circuit film connected to the display panel in the display device is curved, flexible and thin, various types of research are being conducted to improve the crack defect of the circuit film. If cracks occur in the connection part of the circuit film in the display device, the reliability of the display device may be affected, resulting in problems in the performance of the display device.

[0007] Therefore, the inventors of the present disclosure recognized the above-mentioned problems, and invented a new display device capable of improving the reliability of the display device and capable of improving the crack defect of the connection portion of the circuit film in the display device.

[0008] An object to be solved by embodiments of the present disclosure is to provide a display device having improved reliability and preventing driving errors by improving a crack defect of a circuit film connected to a display panel.

[0009] Problems according to the embodiments of the present disclosure are not limited to the above-mentioned problems, and other problems not mentioned will be clearly understood by those skilled in the art through the following disclosure.

[0010] According to an embodiment of the present disclosure, a display device may include: a board; a display panel arranged above the board; a printed circuit board electrically connected to one side of the display panel; and at least one circuit film, one side and the other side of the at least one circuit film being electrically connected to the display panel and the printed circuit board, respectively, at least a portion of the at least one circuit film being bent toward the back side of the display panel, wherein at least a portion of the board includes at least one extension portion, and the at least one extension portion is configured to overlap with the circuit film on the back side of the circuit film and protrude from the side side of the display panel.

[0011] Specific details of other embodiments are set forth in the detailed description and accompanying drawings.

[0012] According to an embodiment of the present disclosure, an extension portion including a board applied to a display device can prevent cracks from occurring in a connection portion of a circuit film to avoid driving errors, thereby providing a low-power display device with an improved lifespan.

[0013] According to an embodiment of the present disclosure, since a board applied to a display device overlaps a driving chip, heat generated by the driving chip can be dissipated through the board, thereby providing a display device that improves a driving failure of the driving chip due to high temperature.

[0014] According to an embodiment of the present disclosure, a board applied to a display device can achieve fixing and supporting a circuit film and a printed circuit board, thereby providing a display device with improved reliability capable of replacing a separate guide bracket and preventing movement and breakage of the circuit film.

[0015] The effects of the present disclosure are not limited to the above-mentioned effects, and other effects not mentioned herein will be apparent to those skilled in the art through the following description.

[0016] The scope of the claims is not limited by the description of the present invention because the contents of the present invention as described in the above problems to be solved, means for solving the problems, and effects do not indicate essential features of the claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The above and other objects, features and advantages of the present disclosure will become more apparent to those skilled in the art by describing in detail exemplary embodiments of the present disclosure with reference to the accompanying drawings, in which:

[0018] Figure 1 is an exploded perspective view showing a display device according to one embodiment of the present disclosure;

[0019] Figure 2 is from Figure 1 A rear view of a display device with some components omitted;

[0020] Figure 3 It is along Figure 2 A cross-sectional view taken along line AA' in FIG.

[0021] Figure 4 is a plan view showing a panel of a display device according to an embodiment of the present disclosure;

[0022] Figure 5 is a diagram showing a display device according to another embodiment of the present disclosure;

[0023] Figure 6is a plan view showing a display device according to an embodiment of the present disclosure;

[0024] Figure 7 According to an embodiment of the present disclosure, Figure 6 A cross-sectional view of the display panel taken along line BB' in FIG.

[0025] Figure 8 is a diagram illustrating an example of use of a display device according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0026] The advantages and features of the present disclosure and the methods for achieving them will become apparent with reference to the preferred embodiments described in detail in conjunction with the accompanying drawings. However, the present disclosure is not limited to the embodiments to be described below and may be implemented in different forms, which are provided to fully disclose the present disclosure and fully convey the scope of the present disclosure to those skilled in the art, and the present disclosure is defined by the disclosed claims.

[0027] Since the shapes, sizes, ratios, angles, quantities, etc. disclosed in the drawings for describing the embodiments of the present disclosure are only exemplary, the present disclosure is not limited to the illustrated items. Throughout the specification, the same reference numerals indicate the same components. In addition, when describing the present disclosure, when it is determined that the detailed description of the relevant known technology may unnecessarily obscure the main points of the present disclosure, its detailed description will be omitted. When using "including", "having", "composition", etc. mentioned in the present disclosure, other parts may be added unless "only" is used. Unless otherwise expressly stated, the case of components expressed in the singular includes plural forms.

[0028] When explaining the components, it should be understood that the error range is included even if there is no separate explicit description.

[0029] In the case of describing a positional relationship, for example, when the positional relationship of two parts is described as "on", "upper", "lower", "beside", etc., one or more other parts may be located between the two parts, unless "immediately" or "directly" is used.

[0030] When describing a temporal context, such as "after", "subsequently", "next", or "before", it may also include non-sequential situations unless "immediately" or "directly" is used.

[0031] First, second, etc. are used to describe various components, but these components are not limited by these terms. These terms are only used to distinguish one component from another component. Therefore, within the technical spirit of the present disclosure, the first component mentioned below can be the second component.

[0032] Terms such as first, second, A, B, (a), (b) may be used to describe elements of embodiments of the present disclosure. These terms are intended only to distinguish one component from another and to define the nature, order, sequence, or quantity of these components. When a component is described as being "connected," "coupled," or "attached" to another component, it should be understood that the component may be directly connected or attached to the other component, but there may also be other components "interposed" between the various components, and the various components may be indirectly connected or attached without specific description.

[0033] It should be understood that the term "at least one" includes all possible combinations of one or more related components. For example, the meaning of "at least one of the first component, the second component, and the third component" includes not only the first component, the second component, or the third component, but also any combination of two or more of the first component, the second component, and the third component.

[0034] As used herein, a "display device" may include a narrow display device such as a liquid crystal module (LCM), an organic light emitting diode (OLED) module, or a quantum dot (QD) module, which includes a display panel and a driver for driving the display panel. The display device may also include a complete set of electronic devices or a complete set of apparatuses or a complete set of equipment such as a notebook computer, a television, a computer monitor, an in-vehicle display device, or other forms of device display devices included in a vehicle, and a mobile electronic device such as a smart phone or an electronic tablet, which is a complete product or finished product including an LCM, an OLED module, and a QD module.

[0035] Therefore, the display device described in this article may include the narrow display device itself, such as LCM, OLED module and QD module, and application products including LCM, QLED module and QD module, as well as complete sets and end-user devices.

[0036] In some cases, an LCM, an OLED module, and a QD module including a display panel and a driver may be described as a "display device" in a narrow sense, and an electronic device as a finished product including the LCM, the OLED module, and the QD module may be described as a "set of devices." For example, a display device in a narrow sense may include a liquid crystal display (LCD) panel, an organic light emitting diode (OLED) display panel, or a quantum dot (QD) display panel and a source PCB as a control unit for driving the display panel, and the set of devices may further include a set of PCBs that are a set of control units electrically connected to the source PCBs to control the entire set of devices.

[0037] The display panel used in the embodiments of the present disclosure may be any type of display panel, including a liquid crystal display panel, an organic light emitting diode (OLED) display panel, a quantum dot (QD) display panel, and an electroluminescent display panel. The display panel of this embodiment is a flexible substrate for an OLED display panel and a lower backplane support structure that allows the frame to bend, but is not limited to any specific display panel. In addition, the display panel used in the display device according to the embodiments of the present disclosure is not limited to the shape or size of the display panel.

[0038] For example, when the display panel is an OLED display panel, the display panel may include a plurality of gate lines and a plurality of data lines, and pixels formed at the intersections of the gate lines and / or data lines. In addition, the display panel may include: an array including thin film transistors as elements for selectively applying voltages to individual pixels; a light emitting element layer on the array; and an encapsulation substrate or an encapsulation layer disposed on the array to cover the light emitting element layer. The encapsulation layer may protect the thin film transistor and the light emitting element layer from external impacts and prevent moisture or oxygen from penetrating into the light emitting element layer. In addition, the layer formed on the array may include an inorganic light emitting layer, for example, a nano-sized material layer or quantum dots.

[0039] The various features of the various embodiments described herein may be combined or combined with each other in whole or in part, and may be technically related and operated in various ways, and the various embodiments may be performed independently of each other or in combination.

[0040] Hereinafter, embodiments of the present disclosure are described by way of drawings and examples. The sizes of components shown in the drawings are drawn to scale for illustration purposes only and are not proportional to the actual components shown in the drawings.

[0041] Figure 1 is an exploded perspective view showing a display device according to one embodiment of the present disclosure. Figure 2 is from Figure 1 A rear view of a display device with some components omitted. Figure 3 is a cross-sectional view of a display device according to an embodiment of the present disclosure. Figure 3 It is along Figure 2 A cross-sectional view taken along line AA' in FIG.

[0042] The display device according to an embodiment of the present disclosure may be installed on a vehicle, for example, to provide the driver and passengers of the vehicle with videos or images required for driving the vehicle. However, it may not be limited to these uses, and may also be used when carried by a user without being installed on a vehicle. The following describes a display device installed on, for example, a vehicle according to an embodiment of the present disclosure. The display device installed on a vehicle is an example for illustrating the present disclosure, and the embodiments of the present disclosure are not limited thereto.

[0043] Now refer to Figures 1 to 3 , a display device according to an embodiment of the present disclosure may include a display panel 100 , a board 60 on the rear surface of the display panel 100 , a printed circuit board (PCB) 300 electrically connected to the display panel 100 , and a circuit film 400 .

[0044] A video or image may be played on the display panel 100. The played video or image may be, for example, navigation information required for driving, an image captured by a camera mounted on the vehicle, or various other contents required by the driver or passengers. The embodiments of the present disclosure are not limited to the above.

[0045] The printed circuit board 300 may be electrically connected to the display panel 100. The printed circuit board 300 may include a device for communicating with an external device such as a camera or a main control module of a vehicle and a device for driving the display panel 100 to play a video or an image, may be provided with an internal circuit, and may include various other active and passive elements.

[0046] One side of the circuit film 400 may be electrically connected to the display panel 100, and the other side of the circuit film 400 may be electrically connected to the printed circuit board 300. A portion of the circuit film 400 may be disposed to be bent toward the rear surface of the display panel 100. Figure 1 An example of the circuit film 400 in an unfolded state is shown.

[0047] The circuit film 400 may be formed of a thin and bendable flexible material. The circuit film 400 may electrically connect the display panel 100 and the printed circuit board 300. For example, the circuit film 400 may be provided with various active elements and passive elements, and may be provided with a driving circuit for driving the display panel 100.

[0048] The driving circuit for driving the display panel 100 may also be arranged to be distributed on the printed circuit board 300 and the circuit film 400. Figure 3 The circuit film 400 may be provided with a driving chip 500, and the driving chip 500 forms at least a part of a driving circuit for the display panel 100. There may be a plurality of circuit films 400. Figure 2 , at least one circuit film 400 may be arranged to be spaced a certain distance from each other.

[0049] The display device according to an embodiment of the present disclosure may further include a cover member 10, a first adhesive member 20, a functional film 30, and a second adhesive member 40 in sequence on the top side of the display panel 100. A plate 60 may be included as a support structure under the display panel 100. The components included in the display device may be formed in a thin shape to manufacture a thin display panel.

[0050] The cover member 10 may be disposed at the front surface of the display panel 100 to protect the display panel 100. The cover member 10 may be formed of a transparent material so that light irradiated from the cover member 10 may pass through the cover member 10.

[0051] In an embodiment, the functional film 30 may include a wide-angle adjustment structure for adjusting the visible range of the image displayed on the display panel 100. The wide-angle adjustment structure may be arranged in the functional film 30 in a trapezoidal pattern, in which the angle is adjusted to match the desired visible range when viewed in a cross section. The trapezoidal pattern may be formed by a light shielding material, and the embodiments of the present disclosure are not limited thereto. For example, the functional film 30 may also include a polarizing plate, etc., to control display characteristics (e.g., external light reflection, color accuracy, brightness, etc.). In some cases, the functional film 30 may be incorporated into the pattern on the top surface of the display panel 100 or the inner surface of the cover member 10 without a separate configuration. The embodiments of the present disclosure are not limited thereto. The first adhesive member 20 may be arranged between the cover member 10 and the functional film 30. One surface of the first adhesive member 20 may be adhered to the cover member 10, and the other surface may be adhered to the functional film 30, thereby adhering the functional film 30 to the cover member 10.

[0052] For example, the second adhesive member 40 may be disposed between the functional film 30 and the display panel 100. One surface of the second adhesive member 40 may be adhered to the functional film 30, and the other surface may be adhered to the display panel 100, thereby adhering the functional film 30 to the display panel 100. In an embodiment, the second adhesive member 40 may be disposed between the cover member 10 and the display panel 100.

[0053] The first adhesive member 20 and the second adhesive member 40 may be formed of a transparent material having good adhesiveness, such as an optically clear adhesive (OCA), a pressure sensitive adhesive (PSA), or an optically clear resin (OCR). The embodiments of the present disclosure are not limited thereto.

[0054] For example, the board 60 may be disposed on the rear side of the display panel 100. For example, the board 60 may function as a heat sink for cooling the display panel 100 by radiating heat generated from the display panel 100 to the outside. The embodiments of the present disclosure are not limited to the above.

[0055] The plate 60 may be made of a metal plate that is easy to process by a metal plate, has a high heat transfer rate (thermal conductivity) and has excellent resistance, such as aluminum (Al), copper (Cu), etc. Alternatively, the plate 60 may be made of a graphite material. In other words, the plate 60 may be a metal plate or a graphite plate of aluminum (Al), copper (Cu) having a curved shape. The embodiments of the present disclosure are not limited to the above.

[0056] Figure 2is a rear view of the display device, wherein, for ease of description, Figure 1 Some components such as bonding members are omitted. For example, Figure 2 is shown in a bent state Figure 1 400 is a plan view of the circuit film.

[0057] Figure 3 It is along Figure 2 A cross-sectional view taken along the line A-A' in FIG. Figure 2 and Figure 3 , the circuit film 400 may be bendable. For example, one side of the circuit film 400 may be connected to the display panel 100, and the other side may be connected to the printed circuit board 300. One side of the circuit film 400 may be electrically connected to the display panel 100. The other side of the circuit film 400 may be electrically connected to the printed circuit board 300. When the circuit film 400 is bent, the other side of the circuit film 400 and the printed circuit board 300 may be disposed on the back side of the display panel 100. For example, at least one circuit film 400 may be formed of a bendable thin and flexible material. At least a portion of at least one circuit film 400 may be bendable. For example, the circuit film 400 may be bent so that the printed circuit board 300 is electrically connected to one side of the display panel 100. Referring to Figure 3 According to an embodiment of the present disclosure, the display device may further include a driving chip 500 , and the driving chip 500 may be on the circuit film 400 .

[0058] Figure 4 is a plan view showing a panel of a display device according to an embodiment of the present disclosure.

[0059] Figure 5 is a rear view of a display device including a panel according to another embodiment of the present disclosure.

[0060] Reference Figure 3 and Figure 4According to an embodiment, the board 60 may include at least one extension 61 protruding from the side of the display panel 100. For example, in the non-display area of ​​the display device, the extension 61 of the board 60 may overlap the circuit film 400 on the back of the circuit film 400. For example, the circuit film 400 may be bent toward the back of the display panel 100. For example, the extension 61 of the board 60 may be bent from one side of the board 60 toward the back of the display panel 100. For example, the circuit film 400 and the extension 61 of the board 60 may be bent in the same direction. For example, the extension 61 of the board 60 may support (or guide) the circuit film 400 to prevent the connection portion 450 of the thin circuit film 400 from breaking. For example, even if an external force is applied to the attachment area of ​​the display panel 100 and the flexible circuit film 400 due to a collision or the like during transportation or movement of the display device module or product, the extension 61 of the board 60 may prevent one side of the circuit film 400 from being separated from the display panel 100. For example, a driving failure may be prevented by preventing a circuit connection failure. The embodiments of the present disclosure are not limited to the above.

[0061] For example, at least one extension 61 of the board 60 may be bent from one side of the board 60 toward the back side of the display panel 100. For example, the display panel 100 may have a driving chip 500 on the back side of the display panel 100. The driving chip 500 may be, for example, a driving integrated circuit chip (DIC). For example, the driving chip 500 may be disposed between the circuit film 400 and the board 60. The embodiments of the present disclosure are not limited to the above.

[0062] Reference Figure 3 For example, when an external force is applied due to a collision or the like during transportation of the display device module, the connection portion 450 between the circuit film 400 and the display panel 100 may not be smoothly connected, thereby causing the connection portion 450 to be disconnected due to the contact between the pad 140 (see FIG. 1 ) and the display panel 100. Figure 7 ) and cause electrical signal failure. For example, the board 60 may include at least one extension 61 protruding from the side and back of the display panel 100. For example, the extension 61 of the board 60 may support and guide the thin circuit film 400. For example, a driving failure of the display screen may be avoided by preventing a short circuit at the connection portion 450 where the thin circuit film 400 is connected to the display panel 100. For example, the board 60 may at least partially overlap the circuit film 400. For example, the extension 61 of the board 60 may be replaced with a guide bracket to guide the circuit film 400 and / or the printed circuit board 300.

[0063] For example, the extension portion 61 of the plate 60 may include a first region 61 a , a second region 61 b ​​, a third region 61 c , and a fourth region 61 d .

[0064] In an embodiment, the extension portion 61 of the plate 60 may protrude outward from the first region 61a toward the outer circumference of the display panel 100. The embodiments of the present disclosure are not limited to the above.

[0065] In an embodiment, the board 60 may include an upper layer 62 and a lower layer 63 formed by a hemming process of bending and pressing metal. For example, the board 60 may be hemmed so that at least a portion of the upper layer 62 and at least a portion of the lower layer 63 of the board 60 face each other. The display panel 100 may be supported by the upper layer 62 of the board 60, and the circuit film 400 and / or the printed circuit board 300 may be supported by the lower layer 63 of the board 60. For example, there may be a difference between the thickness of the board 60 and the thickness of the printed circuit board 300, so that the end portion, which is at least a portion of the extension 61, may be bent using a hemming process to form a bent portion 64, and the bent portion 64 may be used to support the circuit film 400 and / or the printed circuit board 300. For example, the board 60 may include an extension 61 bent in a manner corresponding to the bending of the circuit film 400.

[0066] In an embodiment, the extension 61 of the plate 60 may overlap with the buffer member 350 in the second region 61b. For example, the buffer member 350 may be disposed between the upper layer 62 and the lower layer 63 of the plate 60, and may include a foam strip or a foam pad. The buffer member 350 may prevent the upper layer 62 and the lower layer 63 of the plate 60 from being squeezed, impacted, etc. The buffer member 350 may have a shock-absorbing function that can reduce the impact and squeezing of various components that may contact the plate 60. At least a portion of the buffer member 350 may contact the extension 61 of the plate 60. For example, the buffer member 350 may be a buffer layer, but is not limited to the term. For example, the buffer member 350 may include a material such as an epoxy or acrylic polymer or resin. The embodiments of the present disclosure are not limited to the above. For example, the buffer member 350 may include a foam 320 and a third adhesive member 310. For example, the plate 60 and the foam 320 may be bonded or fixed to each other by the third adhesive member 310. The third adhesive member 310 may be made of at least one layer of at least one transparent material having good adhesiveness, such as a transparent optically clear adhesive (OCA), a transparent optically clear resin (OCR), or a pressure sensitive adhesive (PSA). The embodiments of the present disclosure are not limited to the above.

[0067] In an embodiment, the extension 61 of the board 60 may overlap with the driver chip 500 in the third region 61c. For example, the extension 61 of the board 60 may contact the driver chip 500 in the third region 61c. The driver chip 500 may be disposed between the lower layer 63 of the board 60 and the circuit film 400. For example, when the board 60 contacts the driver chip 500, the extension 61 of the board 60 disposed on the driver chip 500 may effectively dissipate and radiate (release) a large amount of heat caused by the driving of the driver chip 500. For example, heat can be effectively dissipated when exposed to a high temperature environment (for example, in a vehicle-mounted display device). The embodiments of the present disclosure are not limited to those described above.

[0068] In an embodiment, the extension 61 of the plate 60 may fix the end of the printed circuit board 300 in the first direction by contact in the fourth region 61d. At least a portion of the extension 61 of the plate 60 may contact at least a portion of the printed circuit board 300. In an embodiment, the extension 61 of the plate 60 may be bent in the fourth region 61d, thereby keeping the printed circuit board 300 in place even when it shakes due to the movement of the printed circuit board 300 during transportation (or movement). For example, referring to Figure 3 and Figure 4 , the extension 61 of the plate 60 can be used as a stopper to support one side of the printed circuit board 300 when assembling the printed circuit board 300. Therefore, the extension 61 of the plate 60 can prevent the printed circuit board 300 from moving outward relative to the first direction (e.g., the Y-axis direction). For example, the outward direction can represent a direction from the center to the edge of the display device.

[0069] For example, when the printed circuit board 300 is not fixed, the printed circuit board 300 may deviate due to work deviations based on the installation position of the printed circuit board 300, thereby deforming the shape of the circuit film 400, which may cause tensile or compressive tension to be applied to the connection portion 450 of the circuit film 400, thereby causing the occurrence of cracks. For example, in the fourth area 61d, the end of the lower layer 63 of the board 60 may contact at least a portion of the upper layer 62. The embodiments of the present disclosure are not limited to the above.

[0070] For example, the thickness of the printed circuit board 300 may be greater than or equal to 0.6 mm and less than or equal to 1.0 mm. The thickness of the board 60 may be greater than or equal to 0.3 mm and less than or equal to 0.5 mm. Since the thickness of the printed circuit board 300 may be thicker than that of the board 60, the end of the board 60 in the fourth region 61 d may be thicker or bent to effectively fix the printed circuit board 300.

[0071] Reference Figure 5In an embodiment, the side end of the plate 60 may include a protrusion 65. The protrusion 65 of the plate 60 may hold the printed circuit board 300 in a second direction perpendicular to the first direction. For example, the plate 60 may include a protrusion 65 in a region overlapping with an end of the printed circuit board 300. The extension 61 and the protrusion 65 of the plate 60 may fix the printed circuit board 300 and prevent the circuit film 400 from being broken due to shaking, thereby preventing a driving failure of the display device. For example, a driving failure may be prevented in an unstable high temperature environment such as found in a vehicle-mounted display device.

[0072] For example, at least one (e.g., two) protrusions 65 may be formed to protrude from the back side of the board 60. The two protrusions 65 may be spaced apart from each other so that they have a predetermined interval. In addition, the two protrusions 65 may guide the arrangement of the printed circuit board 300 so that the printed circuit board 300 is disposed between the two protrusions 65. For example, the protrusion 65 may be formed in a second direction (e.g., an X-axis direction) perpendicular to the first direction.

[0073] In an embodiment, the protrusion 65 may protect the printed circuit board 300 from external impact. For example, the protrusion 65 may be formed integrally with the board 60.

[0074] Now refer to Figure 3 and Figure 4 , for example, at least one extension 61 of the board 60 may be a plurality of extensions spaced apart from each other. The number of extensions 61 of the board 60 according to an embodiment of the present disclosure may be the same as the number of circuit films 400. For example, at least one extension 61 of the board 60 may overlap with at least one circuit film 400. For example, at least a portion of the board 60 may be at least partially in contact with at least one circuit film 400. For example, at least one extension 61 of the board 60 may be at least partially in contact with at least one circuit film 400. For example, the extensions 61 of the board 60 may be disposed on the back of the circuit film 400 in a one-to-one correspondence. The embodiments of the present disclosure are not limited to the above.

[0075] For example, there may be a region in which the extension portions 61 of the board 60 are not spaced apart but joined into one so as not to overlap with the circuit film 400 .

[0076] For example, the number of at least one extension 61 of the board 60 may be different from the number of at least one film 400. The number of circuit films 400 and / or the number of extensions 61 of the board 60 shown in the drawings according to the embodiments of the present disclosure are only examples, and the embodiments of the present disclosure are not limited thereto.

[0077] For example, the material of the plate 60 may be different from the material of the circuit film 400. The plate 60 may be made of a material (e.g., an aluminum material) that is easy to manufacture by metal plate processing, has a high heat transfer rate (thermal conductivity) and has excellent resistance. The embodiments of the present disclosure are not limited to as described above. The plate 60 of the display device according to the embodiment of the present disclosure may include a heat dissipation metal such as aluminum or an aluminum alloy as a base layer and an outer coating on the base layer. The material of the circuit film 400 may include, for example, polyimide (PI). The embodiments of the present disclosure are not limited to as described above.

[0078] For example, the thickness of the plate 60 may be different from the thickness of the circuit film 400. For example, the plate 60 may be thicker than the thickness of the circuit film 400 connecting the printed circuit board 300 and the display panel 100, because the plate 60 supports the display panel 100 and has a heat dissipation function. For example, the plate 60 may be configured to be thicker than the display panel 100 to provide a supporting function and a heat dissipation function. The thickness of the plate 60 may be more than 0.2 mm and less than 1 mm. The embodiments of the present disclosure are not limited to as described above. For example, the circuit film 400 may be formed of a thin and bendable flexible material. The thickness of the circuit film 400 may be configured to be more than 0.01 mm and less than 0.1 mm. The embodiments of the present disclosure are not limited to as described above.

[0079] The circuit film 400 of the display device according to an embodiment of the present disclosure may be formed of a thin and flexible material so that the display panel 100 and the printed circuit board 300 are electrically connected when bent.

[0080] In an embodiment, the circuit film 400 may have a predetermined elasticity due to its material. Therefore, a predetermined tension may be applied to the circuit film 400, which in turn applies a predetermined stress to the connection portion 450. For example, since a predetermined tension is applied to the circuit film 400, when a predetermined load is additionally applied to the circuit film 400, the circuit film 400 may be easily damaged. For example, if a stress exceeding the yield stress is applied to the connection portion 450, the connection portion 450 in turn applies a predetermined load to the circuit film 400, the circuit film 400 may be damaged or separated at the connection portion 450.

[0081] The display device according to an embodiment of the present disclosure can prevent the circuit film 400 from being separated from the display panel 100 by supporting the circuit film 400 using the extension portion 61 of the bendable plate 60 against a predetermined load applied to the circuit film 400. For example, the extension portion 61 can guide bending of the circuit film 400. For example, the plate 60 and the extension portion 61 can be integrally formed.

[0082] For example, the end of the extension portion 61 in a folded or bent state by the curling process can stably support the printed circuit board 300, thereby preventing the printed circuit board 300 from moving in the first direction. For example, the bent end of the extension portion 61 can be referred to as a bent portion 64, and even if the thickness of the plate 60 is less than the thickness of the printed circuit board 300, one side of the circuit film 400 can be supported by the bent portion 64.

[0083] The display device according to an embodiment of the present disclosure may use the buffer member 350 attached between the upper layer 62 and the lower layer 63 of the board 60 to allow the buffer member to absorb a load exceeding the yield stress applied to the extension portion 61 of the board 60 .

[0084] The display device according to an embodiment of the present disclosure may prevent the printed circuit board 300 from moving in the second direction while protecting the printed circuit board 300 from impact in the second direction by using the protrusions 65 supporting opposite ends of the printed circuit board 300 in the second direction.

[0085] Figure 6 is a plan view showing a display device according to an embodiment of the present disclosure.

[0086] The display device according to an embodiment of the present disclosure may include a display panel 100. The display panel 100 may include a display area AA disposed on a substrate 101 and a non-display area NA disposed around the display area AA.

[0087] For example, the material of the substrate 101 may be glass. For example, the substrate 101 may be formed of a plastic material having flexibility that allows bending. For example, the substrate 101 may be made of materials such as PI (polyimide), PET (polyethylene terephthalate), PEN (polyethylene naphthalate), PC (polycarbonate), PES (polyether sulfone), PAR (polyarylate), PSF (polysulfone) and COC (cyclic olefin copolymer), but the embodiments of the present disclosure are not limited thereto. In another embodiment of the present disclosure, the substrate 101 may be made of a semiconductor material such as a silicon wafer.

[0088] The display area AA may be an area in which a plurality of sub-pixels PX are provided to display an image. Each of the plurality of sub-pixels PX may be an independent unit that emits light. A light-emitting element and a driving circuit may be provided in each of the plurality of sub-pixels PX. For example, a display element for displaying an image and a circuit unit for driving the display element may be provided in the plurality of sub-pixels PX. For example, when the display device is an organic light-emitting display device, the display element may include an organic light-emitting element, and when the display device is a liquid crystal display device, the display element may include a liquid crystal element. The plurality of sub-pixels PX may include, but are not limited to, a red sub-pixel PX, a green sub-pixel PX, a blue sub-pixel PX and / or a white sub-pixel PX.

[0089] The non-display area NA may be an area where no image is displayed. The non-display area NA may be an area where various wirings and driving ICs for driving the plurality of sub-pixels PX disposed in the display area AA are disposed. For example, at least one of the data driver 95 and the gate driver 91 may be disposed in the non-display area NA, and the embodiments of the present disclosure are not limited to the above.

[0090] The non-display area NA may be an area surrounding the display area AA. For example, the non-display area NA may be located around the display area AA. For example, the non-display area NA may be an area extending from the display area AA, or may be an area where a plurality of sub-pixels PX are not disposed, and the embodiments of the present disclosure are not limited to the above.

[0091] The non-display area NA where no image is displayed may be a bezel area, or may further include a bending area BA where the substrate 101 is bent, and the embodiments of the present disclosure are not limited to the above.

[0092] A plurality of data lines DL and a plurality of gate lines GL may be arranged in the display area AA. For example, the plurality of data lines DL may be arranged in rows or columns, and the plurality of gate lines GL may be arranged in columns or rows. The subpixels PX may be disposed in an area formed by the data lines DL and / or the gate lines GL.

[0093] The sub-pixel PX of the display area AA may include a thin film transistor, which includes a semiconductor layer. For example, the thin film transistor may include an oxide semiconductor material, and the embodiments of the present disclosure are not limited to the above. For example, the thin film transistor may be a transistor, but is not limited to this term.

[0094] According to an embodiment of the present disclosure, a gate driver 91 including a gate driving circuit may be disposed in the non-display area NA. The gate driving circuit of the gate driver 91 may sequentially drive each pixel row in the display area AA by sequentially supplying a scan signal to a plurality of gate lines GL. For example, a pixel row may be a row of pixels connected to a single gate line. The gate driving circuit may also be referred to as a scan driving circuit, but is not limited to this term.

[0095] According to an embodiment of the present disclosure, the gate driver 91 may be configured to have bilateral symmetry on opposite sides of the display area AA, but the embodiments of the present disclosure are not limited thereto. For example, the gate driver 91 may include a scan driver and / or an EM driver.

[0096] The gate driving circuit may include a thin film transistor having a polycrystalline semiconductor layer, may include a thin film transistor having an oxide semiconductor layer, or may include a pair of thin film transistors having a polycrystalline semiconductor layer and a thin film transistor having an oxide semiconductor layer. When the thin film transistors disposed in the non-display area NA and the display area AA use the same semiconductor material, they may be configured simultaneously in the same process, and the embodiments of the present disclosure are not limited to the above.

[0097] The gate driving circuit may include a shift register and a level shifter.

[0098] As in the display device according to the embodiment of the present disclosure, the gate driving circuit may be implemented in the form of a gate in panel (GIP) and directly disposed on the substrate 101 .

[0099] The gate driver 91 including a gate driving circuit may sequentially supply a scan signal of an on voltage or an off voltage to a plurality of gate lines.

[0100] The gate driver 91 according to an embodiment of the present disclosure may be directly formed on the substrate 101 by using a polycrystalline semiconductor material as a semiconductor layer, or may be formed by configuring a thin film transistor as a C-MOS by using a polycrystalline semiconductor material as a semiconductor layer and using an oxide material as an insulating layer.

[0101] For example, the oxide semiconductor material may include at least one of nIGZO (InGaZnO) type oxide semiconductor material, IZO (InZnO) type oxide semiconductor material, IGZTO (InGaZnSnO) type oxide semiconductor material, ITZO (InSnZnO) type oxide semiconductor material, FIZO (FeInZnO) type oxide semiconductor material, ZnO type oxide semiconductor material, SIZO (SiInZnO) type oxide semiconductor material and ZnON (Zn-oxynitride) type oxide semiconductor material, but the embodiments of the present disclosure are not limited thereto.

[0102] The combination of a thin film transistor having an oxide semiconductor layer and a thin film transistor having a polycrystalline semiconductor layer can achieve high electron mobility in a channel, thereby achieving high resolution and low power.

[0103] The display device 1 according to an embodiment of the present disclosure may further include a data driver 95, which includes a data driving circuit. When a gate driver 91 including a gate driving circuit turns on a specific gate line, the data driving circuit may convert image data into an analog data voltage and supply the analog data voltage to a plurality of data lines. For example, the gate driver 91 may be symmetrically disposed on the left and right sides of the display area AA, and the embodiments of the present disclosure are not limited to the above.

[0104] The plurality of gate lines GL disposed on the substrate 101 may include a plurality of scan lines and a plurality of light emission control lines. The plurality of scan lines and the plurality of light emission control lines may be wirings for transmitting different types of gate signals (e.g., scan signals, light emission control signals) to gate nodes of different types of transistors (e.g., scan transistors, light emission control transistors).

[0105] The gate driver 91 including the gate driving circuit may include a scan driving circuit outputting scan signals to a plurality of scan lines as one type of gate lines GL and a light emitting driving circuit outputting light emitting control signals to a plurality of light emitting control lines as another type of gate lines GL.

[0106] The display panel 100 according to an embodiment of the present disclosure may further include a bending area BA where the substrate 101 is bent, and the embodiment of the present disclosure is not limited thereto. The bending area BA may be an area where the substrate 101 is bent. The substrate 101 may remain flat in an area outside the bending area BA. The data line DL may be arranged to pass through the bending area BA, and a plurality of data lines DL may be arranged to be connected to the data pad.

[0107] Figure 7 According to an embodiment of the present disclosure, Figure 6 A cross-sectional view of the display panel taken along line BB' in FIG.

[0108] Although a display device using an organic light emitting display is described below as an example, other light emitting display devices such as a quantum dot light emitting display device may be included, and embodiments of the present disclosure are not limited thereto.

[0109] The display panel 100 of the display device 1 according to one embodiment of the present disclosure may include a substrate 101 , a thin film transistor TF, a planarization layer 107 , a light emitting element 115 , a bank 110 , a pad 140 , a dam 190 , and a touch part 160 .

[0110] For example, in the display area AA, the thin film transistor TF, the light emitting element 115 and various functional layers are located on the substrate 101. For example, various driving circuits (eg, GIP), electrodes, wirings, functional structures, etc. may be located in the non-display area NA on the substrate 101.

[0111] The substrate 101 may support various components of the display device. The substrate 101 may be formed of a transparent insulating material (e.g., an insulating material such as glass, plastic, etc.). The substrate (array substrate) may also be referred to as a concept including devices and functional layers formed on the substrate 101, such as a switching TFT (thin film transistor), a driving TFT, a light emitting element, a protective film, etc.

[0112] The buffer layer 103 may be located on the substrate 101. The buffer layer is a functional layer that protects a thin film transistor (TFT) to prevent impurities such as alkali ions from leaking from the substrate 101 or a layer below the substrate 101. The buffer layer 103 may be made of silicon oxide (SiO x ), silicon nitride (SiN x ) or a multilayer thereof. The buffer layer 103 may include a multi-buffer and / or an active buffer. The thin film transistor TF may be disposed on the substrate 101 or the buffer layer 103. The thin film transistor may have a semiconductor layer (active layer), a gate insulating layer, a gate, an interlayer dielectric layer ILD, and a source and a drain stacked in sequence. In an embodiment, referring to Figure 7 , the thin film transistor TF may be in the form of a gate electrode 104 , a first insulating layer 105 , a semiconductor layer 102 , and source and drain electrodes 108 which are sequentially arranged.

[0113] For example, the semiconductor layer 102 may be made of polycrystalline silicon (p-Si), in which case the predetermined region may be doped with impurities. For example, the semiconductor layer 102 may also be made of amorphous silicon (a-Si). For example, the semiconductor layer 102 may include oxide. The embodiments of the present disclosure are not limited to the above.

[0114] The gate 104 may be formed of various conductive materials, for example, magnesium (Mg), aluminum (Al), nickel (Ni), chromium (Cr), molybdenum (Mo), tungsten (W), gold (Au), or alloys thereof.

[0115] The first insulating layer 105 and the interlayer dielectric layer ILD may be made of, for example, silicon oxide (SiO x ), silicon nitride (SiN x ) and the like, and alternatively, may be formed of an insulating organic material, etc. For example, the first insulating layer 105 may be a gate insulating layer. By selectively removing the first insulating layer 105 and the interlayer dielectric layer ILD, a contact hole exposing the source region and the drain region may be formed.

[0116] The source and drain electrodes 108 are formed as a single or multiple electrode material layers on the first insulating layer 105 or the interlayer dielectric layer ILD. In an embodiment, a passivation layer 109 made of an inorganic insulating material may cover the source and drain electrodes 108 .

[0117] The planarization layer 107 may be located on the thin film transistor TF. The planarization layer 107 may protect the thin film transistor and may planarize the upper portion of the thin film transistor. The planarization layer 107 may be made of various forms, for example, an organic insulating film such as benzocyclobutene (BCB) or acrylic, or a silicon nitride (SiN x ) or silicon oxide (SiO x) and can be formed as a single layer or double layer or multiple layers, etc. For example, the planarization layer 107 can be formed of an organic film such as acrylic resin, epoxy resin, phenol resin, polyamide resin, polyimide resin, etc.

[0118] The light emitting element 115 may have a first electrode 112, a light emitting layer 114, and a second electrode 116 arranged in sequence. For example, the light emitting element 115 may include a first electrode 112 formed on the planarization layer 107, a light emitting layer 114 on the first electrode 112, and a second electrode 116 on the light emitting layer 114.

[0119] The first electrode 112 is electrically connected to the drain electrode 108 of the driving thin film transistor TF via a contact hole. For example, when the display device is a top-emitting display device, the first electrode 112 may be made of an opaque conductive material having a high reflectivity. For example, the first electrode 112 may be formed of silver (Ag), aluminum (Al), gold (Au), molybdenum (Mo), tungsten (W), chromium (Cr) or an alloy thereof. For example, the first electrode 112 may be an anode of an organic light emitting diode. The embodiments of the present disclosure are not limited to the above.

[0120] The bank 110 may be formed in a region other than the light emitting region. Therefore, the bank 110 has a bank hole exposing the first electrode 112 corresponding to the light emitting region. The bank 110 may be made of, for example, silicon nitride (SiN x ), silicon oxide (SiO x ) or an organic insulating material such as BCB, acrylic-based resin or polyimide-based resin.

[0121] The light emitting layer 114 may be located on the first electrode 112 exposed by the bank 110. The light emitting layer 114 may include a light emitting layer, an electron injection layer, an electron transport layer, a hole transport layer, a hole injection layer, etc. The light emitting layer may be configured as a single light emitting layer structure that emits single light, or may be configured as a structure of multiple light emitting layers that emit white light.

[0122] The light-emitting element 115 may include more than two light-emitting sections. The light-emitting section may be expressed as a stack, but is not limited by the term. The two or more light-emitting sections may include a first light-emitting section and a second light-emitting section. The first light-emitting section and the second light-emitting section may include a red light-emitting layer that emits red light, a green light-emitting layer that emits green light, and a blue light-emitting layer that emits blue light for each sub-pixel. The two or more light-emitting layers included in the first light-emitting section and the second light-emitting section may be light-emitting layers that emit light of the same color. In other examples, the first light-emitting layer included in the first light-emitting section may be a blue light-emitting layer, a sky blue light-emitting layer, a dark blue light-emitting layer, a blue light-emitting layer and a red light-emitting layer, a sky blue light-emitting layer and a red light-emitting layer, a dark blue light-emitting layer and a red light-emitting layer, but the embodiments of the present disclosure are not limited to the above. For example, the second light-emitting layer included in the second light-emitting portion may be a yellow light-emitting layer, a yellow-green light-emitting layer, a green light-emitting layer, a yellow light-emitting layer and a red light-emitting layer, a green light-emitting layer and a red light-emitting layer, a combination of a yellow light-emitting layer, a yellow-green light-emitting layer, a green light-emitting layer and a red light-emitting layer, a combination of two yellow-green light-emitting layers and one green light-emitting layer, a combination of one yellow-green light-emitting layer and two green light-emitting layers, a combination of two yellow-green light-emitting layers, one green light-emitting layer and a red light-emitting layer, and a combination of one yellow-green light-emitting layer, two green light-emitting layers and a red light-emitting layer, but the embodiments of the present disclosure are not limited to the above. The charge generation layer may be arranged between the first light-emitting portion and the second light-emitting portion. The charge generation layer may include an n-type charge generation layer and a p-type charge generation layer. Each of the first light-emitting portion and the second light-emitting portion may include one or more of a hole injection layer, a hole transport layer, a hole blocking layer, an electron blocking layer, an electron transport layer, and an electron injection layer, but the embodiments of the present disclosure are not limited to the above.

[0123] The two or more light-emitting portions may include a first light-emitting portion, a second light-emitting portion, and a third light-emitting portion. The first light-emitting layer included in the first light-emitting portion may be the same as described above. The second light-emitting layer included in the second light-emitting portion may be the same as described above. The third light-emitting layer included in the third light-emitting portion may be configured in the same manner as the first light-emitting layer, and the embodiments of the present disclosure are not limited to the above. The first charge generation layer may be configured between the first light-emitting portion and the second light-emitting portion. The first charge generation layer may include an n-type charge generation layer and a p-type charge generation layer. The second charge generation layer may be formed between the second light-emitting portion and the third light-emitting portion. The second charge generation layer may include an n-type charge generation layer and a p-type charge generation layer. Each of the first light-emitting portion, the second light-emitting portion, and the third light-emitting portion may include one or more of a hole injection layer, a hole transport layer, a hole blocking layer, an electron blocking layer, an electron transport layer, and an electron injection layer, but the embodiments of the present disclosure are not limited to the above.

[0124] The two or more light-emitting units may include a first light-emitting unit, a second light-emitting unit, a third light-emitting unit, and a fourth light-emitting unit. At least two light-emitting layers of the first light-emitting unit, the second light-emitting unit, the third light-emitting unit, and the fourth light-emitting unit may be composed of light-emitting layers that emit light of the same color. For example, at least two light-emitting layers of the first light-emitting unit, the second light-emitting unit, the third light-emitting unit, and the fourth light-emitting unit may be composed of blue light-emitting layers, but the embodiments of the present disclosure are not limited to the above. At least one light-emitting layer of the first light-emitting unit, the second light-emitting unit, the third light-emitting unit, and the fourth light-emitting unit may include a light-emitting layer different from the blue light-emitting layer. For example, at least one light-emitting layer of the first light-emitting portion, the second light-emitting portion, the third light-emitting portion, and the fourth light-emitting portion may be a yellow light-emitting layer, a yellow-green light-emitting layer, a green light-emitting layer, a yellow light-emitting layer and a red light-emitting layer, a green light-emitting layer and a red light-emitting layer, a combination of a yellow light-emitting layer, a yellow-green light-emitting layer, a green light-emitting layer, and a red light-emitting layer, a combination of two yellow-green light-emitting layers and one green light-emitting layer, a combination of two yellow-green light-emitting layers, a combination of a green light-emitting layer and a red light-emitting layer, and a combination of a yellow-green light-emitting layer, two green light-emitting layers, and a red light-emitting layer, but the embodiments of the present disclosure are not limited to the above. The first charge generation layer may be arranged between the first light-emitting portion and the second light-emitting portion. The first charge generation layer may include an n-type charge generation layer and a p-type charge generation layer. The second charge generation layer may be formed between the second light-emitting portion and the third light-emitting portion. The second charge generation layer may include an n-type charge generation layer and a p-type charge generation layer. The third charge generation layer may be formed between the third light-emitting portion and the fourth light-emitting portion. The third charge generation layer may include an n-type charge generation layer and a p-type charge generation layer. Each of the first light-emitting portion, the second light-emitting portion, the third light-emitting portion, and the fourth light-emitting portion may include one or more of a hole injection layer, a hole transport layer, a hole blocking layer, an electron blocking layer, an electron transport layer, and an electron injection layer, but the embodiments of the present disclosure are not limited to the above.

[0125] For example, the second electrode 116 is located on the light emitting layer 114. When the organic light emitting display device is a top emission type display device, the second electrode 116 is formed of a transparent conductive material such as indium tin oxide (ITO) or indium zinc oxide (IZO) to emit light generated in the light emitting layer 114 to the top of the second electrode 116. For example, the second electrode 116 may be a cathode of an organic light emitting diode. The embodiments of the present disclosure are not limited to the above.

[0126] The encapsulation part 150 is disposed on the light emitting element 115. The encapsulation part 150 is a sealing member that protects the light emitting material and the electrode material of the light emitting element 115 from external moisture, oxygen, impact, etc. to prevent oxidation of the light emitting material and the electrode material. The encapsulation part 150 can be arranged to cover the entire display area AA where the light emitting element 115 is arranged, and the encapsulation part 150 can also be arranged to cover a part of the non-display area NA extending from the display area AA. The encapsulation part 150 may include a first inorganic encapsulation layer 151 made of an inorganic material, an organic encapsulation layer 152 disposed on the first inorganic encapsulation layer 151 and made of an organic material, and a second inorganic encapsulation layer 153 disposed on the organic encapsulation layer 152, but the embodiments of the present disclosure are not limited to the above.

[0127] The first inorganic encapsulation layer 151 seals the display area AA to protect the light emitting element 115 from oxygen and moisture penetrating into the display area AA. The first inorganic encapsulation layer 151 may be disposed not only in the display area AA but also in the non-display area NA extending from the display area AA, and may be disposed to cover the dam 190 in the non-display area NA. The first inorganic encapsulation layer 151 may be made of, for example, but not limited to, silicon nitride (SiN x ), silicon oxide (SiO x ), silicon oxide nitride (SiON) and other inorganic materials.

[0128] The organic encapsulation layer 152 is disposed on the first inorganic encapsulation layer 151. The organic encapsulation layer 152 may planarize the upper portion of the first inorganic encapsulation layer 151, may fill cracks that may occur in the first inorganic encapsulation layer 151, and may planarize the upper portion of foreign matter when foreign matter is formed on the first inorganic encapsulation layer 151. The organic encapsulation layer 152 may be disposed in the display area AA, may be disposed in a portion of the non-display area NA extending from the display area AA, and may be disposed on the inner side of the dam 190. The organic encapsulation layer 152 may be made of an epoxy-based polymer or an acrylic-based polymer, but is not limited thereto.

[0129] The second inorganic encapsulation layer 153 is disposed on the organic encapsulation layer 152. The second inorganic encapsulation layer 153 may be combined with the first inorganic encapsulation layer 151 to seal the organic encapsulation layer 152 in a manner that the first inorganic encapsulation layer 151 is adjacent to the first inorganic encapsulation layer 151 at the periphery of the display device 1. The second inorganic encapsulation layer 153 may also be disposed in a portion of the non-display area NA extending from the display area AA, and the second inorganic encapsulation layer 153 may be disposed adjacent to the first inorganic encapsulation layer 151 disposed in the non-display area NA. The second inorganic encapsulation layer 153 may be made of, for example, but not limited to, silicon nitride (SiN x ), silicon oxide (SiO x ), silicon oxide nitride (SiON) and other inorganic materials.

[0130] although Figure 7 The encapsulation part 150 is shown to include a first inorganic encapsulation layer 151 , an organic encapsulation layer 152 , and a second inorganic encapsulation layer 153 , but the number of inorganic encapsulation layers and organic encapsulation layers included in the encapsulation part 150 is not limited thereto.

[0131] For example, the substrate 101 and the organic / inorganic layers 105, 107, and 120, etc. may be present in the non-display area NA. For example, in the non-display area NA, the materials used to construct the display area AA may be arranged in the same layer for different purposes. For example, the same metal 104' as the gate 104 of the thin film transistor TF in the display area AA, or the same metal 108' as the source / drain, may be arranged in the non-display area NA for wiring or electrodes. In an embodiment, the same metal 112' as one electrode (e.g., an anode) of an organic light emitting diode may be arranged in the non-display area NA for wiring or electrodes.

[0132] The substrate 101, the buffer layer 103, the first insulating layer 105, the planarization layer 107, etc. in the non-display area NA may be the same as those described in the display area AA. For example, the dam 190 may be provided in the non-display area NA on the substrate 101. The dam 190 is provided to control the expansion of the organic encapsulation layer 152 of the encapsulation part 150, and the encapsulation part 150 is provided to cover the display area AA. For example, the dam 190 may suppress the overflow of the organic encapsulation layer 152 of the encapsulation part 150. The dam 190 may be composed of more than one dam, but there is no limit to the number of dams to be provided.

[0133] Various circuits and electrodes / wires disposed in the non-display area NA may be made of a gate metal 104' and / or a source / drain metal 108'. In this case, the gate metal 104' may be formed of the same material as the gate of the TFT in the same process, and the source / drain metal 108' may be formed of the same material as the source / drain of the TFT in the same process.

[0134] For example, the source / drain metal may be used as a wiring 108' for a power source (e.g., a base power source (VSS)). In this case, the power wiring 108' may be connected to the metal layer 112', and the second electrode 116 of the light emitting diode may be powered by the connection with the source / drain metal 108' and the metal layer 112'. The metal layer 112' may contact the power wiring 108', and may extend along the outermost sidewall of the planarization layer 107 to contact the second electrode 116 at the upper portion of the planarization layer 107. For example, the metal layer 112' may be a metal layer formed on the same layer, from the same material, and in the same process as the first electrode 112 of the organic light emitting diode. The embodiments of the present disclosure are not limited to the above.

[0135] The pad 140 may be provided in the non-display area NA. The pad 140 may be provided outside the dam 190. A signal may be input to a circuit portion, a driver chip (circuit chip), etc. formed on the substrate 101 through the pad 140. For example, the pad 140 may supply an externally supplied signal to the circuit portion, the driver chip (circuit chip), etc. of the substrate 101. For example, the pad 140 may supply a signal to the touch portion 160 to drive the touch portion 160, and may receive a signal from the touch portion 160 in response to a touch input of a user.

[0136] In an embodiment, the touch unit 160 may be disposed on the encapsulation unit 150. The embodiments of the present disclosure are not limited to the above. The touch unit 160 may be disposed in the display area AA including the light emitting element 115 to sense a touch input. The touch unit 160 may detect external touch information, such as detecting external touch information from a user's finger or a touch pen. The touch unit 160 may include a first protective layer 161, a second protective layer 162, an organic insulating layer 167, a first touch electrode 164, and a second touch electrode 165.

[0137] The first protective layer 161 may be disposed on the encapsulation part 150. The first protective layer 161 may contact the second inorganic encapsulation layer 153 of the encapsulation part 150. The first protective layer 161 may be made of an inorganic material. For example, it may be made of, for example, silicon nitride (SiN x ), silicon oxide (SiO x ), silicon oxide nitride (SiON x ) etc., but the embodiments of the present disclosure are not limited thereto.

[0138] The first touch electrode 164 is disposed on the first protective layer 161. The first touch electrode 164 is disposed on the first protective layer 161 in the display area AA. The individual first touch electrodes 164 may be spaced apart from each other and disposed in the X-axis direction and the Y-axis direction. For example, the first touch electrode 164 may include a plurality of patterns spaced apart and arranged in the X-axis direction and a plurality of patterns arranged in the Y-axis direction. For example, the X-axis direction may be in the second direction, and the Y-axis direction may be in the first direction, but these directions are not necessarily limited thereto. The first touch electrode 164 supplies a touch drive signal to drive the touch portion 160. In addition, the first touch electrode 164 may transmit the touch information sensed by the touch portion 160 to the driver IC. The first touch electrode 164 may be in, but not limited to, a grid form. The first touch electrode 164 may be made of, but not limited to, a metal material.

[0139] The second protective layer 162 may be disposed on the first touch electrodes 164 and the first protective layer 161. The second protective layer 162 may prevent adjacent first touch electrodes 164 from being short-circuited.

[0140] The second touch electrode 165 is disposed on the second protective layer 162. The second protective layer 162 may be made of an inorganic material. For example, the second protective layer 162 may be made of, for example but not limited to, silicon nitride (SiN x ), silicon oxide (SiO x ), silicon oxide nitride (SiON x ) and other inorganic materials.

[0141] In an embodiment, an organic insulating layer 167 may be disposed on the second touch electrode 165. The organic insulating layer 167 may be made of at least one of the following organic insulating materials: acrylic resin, epoxy resin, phenolic resin, polyamide resin, or polyamide resin, but the embodiments herein are not limited to the above.

[0142] The pad 140 and the second touch electrode 165 may be electrically connected to the circuit film 400 via the conductive adhesive layer 395 .

[0143] Figure 8 is a diagram showing an application of a display device according to one embodiment of the present disclosure, for example, a form in which the display device is provided inside a vehicle.

[0144] like Figure 8 As shown in , the display device 1 can be disposed on at least a portion of a vehicle dashboard. The vehicle dashboard includes a configuration disposed in front of a front seat (e.g., driver seat, passenger seat) of the vehicle. For example, the vehicle dashboard can have input configurations for operating various features in the vehicle (e.g., air conditioning, audio system, navigation system).

[0145] In an embodiment, the display device 1 can be set on the dashboard of the vehicle and work as an input unit to operate at least some of the various features of the vehicle. The display device 1 can provide various information related to the vehicle, such as information about the operation of the vehicle (e.g., the current speed of the vehicle, the remaining fuel, mileage), information about the components of the vehicle (e.g., the degree of damage to the tires of the vehicle).

[0146] In an embodiment, the display device 1 may be arranged across a driver seat and a passenger seat arranged in the front seat of a vehicle. The user of the display device 1 may be a vehicle driver and a passenger on a passenger seat. Both the driver and the passenger of the vehicle may use the display device 1.

[0147] In an embodiment, Figure 8 The display device 1 shown in FIG. 1 is only partially shown. Figure 8 The display device 1 shown may represent a display panel among various components that may be included in the display device 1. Among the components of the display device 1, except Figure 8Components other than those shown may be mounted within the interior of the vehicle (or at least within a portion of the vehicle).

[0148] A display device mounted on a vehicle is an example for describing the present disclosure, and embodiments herein are not limited thereto.

[0149] The display device according to the embodiment of the present disclosure can be applicable to mobile devices, videophones, smart watches, watch phones, wearable devices, foldable devices, rollable devices, bendable devices, flexible devices, bending devices, sliding devices, variable devices, electronic notebooks, electronic books, portable multimedia players (PMP), personal digital assistants (PDA), MP3 players, mobile medical devices, desktop PCs, laptop PCs, netbook computers, workstations, navigation devices, vehicle-mounted navigation devices, vehicle-mounted display devices, vehicle-mounted devices, cinema devices, cinema display devices, televisions, wallpaper devices, signage devices, game devices, laptop computers, monitors, cameras, video cameras, and household appliances. In addition, the display device of the present disclosure can be applicable to organic light-emitting lighting devices or inorganic light-emitting lighting devices.

[0150] A display device according to an embodiment of the present disclosure can be described as follows.

[0151] A display device according to an embodiment of the present disclosure may include: a board; a display panel disposed above the board; a printed circuit board disposed below the board; and a circuit film configured to electrically connect the display panel and the printed circuit board, wherein the board includes an extension portion bent in a manner corresponding to the bending of the circuit film.

[0152] According to some embodiments of the present disclosure, the extension portion of the board may be bent from one side of the board toward the back side of the display panel.

[0153] According to some embodiments of the present disclosure, the display device may further include: a driving chip on a rear surface of the display panel, wherein the driving chip may be disposed between the circuit film and the extension portion of the board.

[0154] According to some embodiments of the present disclosure, a board may include an upper layer and a lower layer, and the upper layer may be disposed on the lower layer.

[0155] According to some embodiments of the present disclosure, the driving chip may be disposed between the lower layer of the board and the circuit film.

[0156] According to some embodiments of the present disclosure, the board may be hemmed such that at least a portion of the lower layer faces at least a portion of the upper layer.

[0157] According to some embodiments of the present disclosure, a buffer member may be further provided between the upper layer and the lower layer of the board.

[0158] According to some embodiments of the present disclosure, the buffer member may include foam and an adhesive member, and the plate and the foam are fixed using the adhesive member.

[0159] According to some embodiments of the present disclosure, the extension portion of the plate may contact an end portion of the printed circuit board to fix the printed circuit board in the first direction.

[0160] According to some embodiments of the present disclosure, the end of the board may be bent in a region where the extension of the board contacts the end of the printed circuit board.

[0161] According to some embodiments of the present disclosure, the board may further include a protrusion, and the protrusion of the board may be configured to fix the printed circuit board in the second direction.

[0162] According to some embodiments of the present disclosure, the at least one extension of the plate may include a plurality of extensions spaced apart from each other.

[0163] According to some embodiments of the present disclosure, a pad may be disposed in a non-display area of ​​a display panel, and the pad is electrically connected to a circuit film via a conductive adhesive layer.

[0164] According to some embodiments of the present disclosure, the display panel may further include a touch electrode, and the display panel may be electrically connected to the circuit film via the touch electrode and the conductive adhesive layer.

[0165] According to some embodiments of the present disclosure, the material of the board may be different from the material of the circuit film, and the thickness of the board may be different from the thickness of the circuit film.

[0166] According to some embodiments of the present disclosure, the circuit film may include polyimide, and the board may include any one of aluminum, copper, and graphite.

[0167] A display device according to an embodiment of the present disclosure may include: a board; a display panel arranged above the board; a printed circuit board electrically connected to one side of the display panel; and at least one circuit film electrically connected to the printed circuit board, a portion of at least one circuit film being bent, wherein the board may include an upper layer and a lower layer, the upper layer may be arranged on the lower layer, and a driving chip may be arranged between the lower layer of the board and the circuit film.

[0168] According to some embodiments of the present disclosure, the board may include at least one extension protruding from a side of the display panel.

[0169] According to some embodiments of the present disclosure, the board may have different heights in a central area overlapping with the display area and in an end area overlapping with the non-display area.

[0170] According to some embodiments of the present disclosure, at least a portion of the extension contacts at least a portion of the printed circuit board.

[0171] According to some embodiments of the present disclosure, the display device may further include a bent portion formed by bending an end portion of the extending portion, wherein the bent portion may be in contact with the circuit film.

[0172] According to some embodiments of the present disclosure, the display device may further include a buffer member attached to a rear surface of the board, wherein at least a portion of the buffer member may contact the extending portion.

[0173] According to some embodiments of the present disclosure, the display device may further include a driving chip disposed on the circuit film, wherein the driving chip may be disposed opposite to the extending portion.

[0174] Although the embodiments of the present disclosure have been described in more detail with reference to the accompanying drawings, the present disclosure is not limited thereto and can be implemented in many different forms without departing from the technical concept of the present disclosure. Therefore, the embodiments disclosed in the present disclosure are provided for illustrative purposes only and are not intended to limit the technical concept of the present disclosure. The scope of the technical concept of the present disclosure is not limited thereto. Therefore, it should be understood that the above-mentioned embodiments are illustrative in all aspects and do not limit the present disclosure. The scope of protection of the present disclosure should be interpreted based on the attached claims, and all technical concepts within their equivalent ranges should be interpreted as falling within the scope of the present disclosure.

[0175] [Explanation of Reference Numerals]

[0176] 1: Display device

[0177] 60: Plate

[0178] 100: Display panel

[0179] 400: Circuit film

Claims

1. A display device, comprising: plate; A display panel is disposed above the board; a printed circuit board disposed below the board; as well as a circuit film configured to electrically connect the display panel and the printed circuit board, The plate includes an extension portion that is bent in a manner corresponding to a bending of the circuit film.

2. The display device according to claim 1, wherein: The extension portion of the plate is bent from one side of the plate toward a rear surface of the display panel.

3. The display device according to claim 1, further comprising: A driving chip, on the back of the display panel, Wherein, the driving chip is arranged between the circuit film and the extending portion of the board.

4. The display device according to claim 3, wherein: The plate includes an upper layer and a lower layer, and The upper layer is disposed on the lower layer.

5. The display device according to claim 4, wherein: The driving chip is disposed between the lower layer of the board and the circuit film.

6. The display device according to claim 4, wherein: The panel is hemmed such that at least a portion of the lower layer faces at least a portion of the upper layer.

7. The display device according to claim 6, wherein: An end of the lower layer of the plate contacts at least a portion of the upper layer.

8. The display device according to claim 4, wherein: A buffer member is further provided between the upper layer and the lower layer of the plate.

9. The display device according to claim 8, wherein: The cushioning member includes foam and an adhesive member, and The plate and the foam are fixed using the adhesive member.

10. The display device according to claim 1, wherein: The extending portion of the plate contacts an end portion of the printed circuit board to fix the printed circuit board in a first direction.

11. The display device according to claim 10, wherein: The end portion of the board is bent at a region where the extended portion of the board contacts the end portion of the printed circuit board.

12. The display device according to claim 1, wherein: The plate further includes a protrusion, and The protrusion of the plate is configured to fix the printed circuit board in a second direction.

13. The display device according to claim 1, wherein: The at least one extension of the plate includes a plurality of extensions spaced apart from each other.

14. The display device according to claim 1, wherein: A pad is provided in a non-display area of ​​the display panel, and The pad is electrically connected to the circuit film via a conductive adhesive layer.

15. The display device according to claim 14, wherein: The display panel further includes a touch electrode, and The display panel is electrically connected to the circuit film via the touch electrode and the conductive adhesive layer.

16. The display device according to claim 1, wherein: The material of the plate is different from that of the circuit film, and The thickness of the board is different from the thickness of the circuit film.

17. The display device according to claim 1, wherein: The circuit film includes polyimide, and The plate includes any one of aluminum, copper, and graphite.

18. A display device comprising: plate; A display panel, disposed above the board; a printed circuit board electrically connected to one side of the display panel; as well as at least one circuit film electrically connected to the printed circuit board, and a portion of the at least one circuit film is bent, and, wherein the plate comprises an upper layer and a lower layer, and The upper layer is disposed on the lower layer, and a driving chip is disposed between the lower layer of the board and the circuit film.

19. The display device according to claim 18, wherein: The plate includes at least one extension protruding from a side of the display panel.

20. The display device according to claim 18, wherein: The plate includes a protrusion in an area where the plate overlaps an end portion of the printed circuit board.

21. A display device comprising: plate; A display panel, disposed above the board; a printed circuit board electrically connected to one side of the display panel; as well as at least one circuit film, one side and the other side of the at least one circuit film being electrically connected to the display panel and the printed circuit board, respectively, and at least a portion of the at least one circuit film being bent toward the back side of the display panel, Wherein, at least a portion of the plate includes at least one extending portion, and the at least one extending portion is configured to overlap with the circuit film on the back surface of the circuit film and protrude from a side surface of the display panel.

22. The display device according to claim 21, wherein: At least a portion of the extension portion contacts at least a portion of the printed circuit board.

23. The display device according to claim 22, further comprising: a bent portion formed by bending an end portion of the extending portion, Wherein, the bent portion contacts the circuit film.

24. The display device according to claim 22, wherein: The plate also includes two protrusions protruding from the back side of the plate, and The printed circuit board is located between the two protrusions.

25. The display device according to claim 24, further comprising: a cushioning member attached to the back surface of the panel, At least a portion of the buffer member is in contact with the extending portion.

26. The display device according to claim 21, further comprising: A driving chip is arranged on the circuit film. Wherein, the driving chip is arranged opposite to the extending portion.

27. A display device comprising: Display panel; A panel, arranged on the back of the display panel; a printed circuit board disposed on the back side of the board; as well as a circuit film having one side electrically connected to one side of the display panel and the other side electrically connected to the printed circuit board, The board includes an extension portion, the extension portion is bent toward the printed circuit board and extends from an end portion of the board on a side close to the display panel to a position of the back side of the board close to the printed circuit board, and At least a portion of the circuit film extends along the extending portion of the board and is supported by the extending portion.

28. The display device according to claim 27, wherein: The plate is a metal plate or a graphite plate having a curved shape.

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