Beam spot quality optimization device for electron gun

Abstract

The invention relates to a beam spot quality optimization device for an electron gun. The beam spot quality optimization device comprises a beam quality optimization regulation and control system and a beam spot morphology detection sensor, the beam spot morphology detection sensor is internally provided with a beam spot morphology detection substrate and a tungsten probe array which are respectively connected with the beam quality optimization regulation and control system; the beam quality optimization regulation and control system is respectively connected with an image elimination coil and a combined coil of the electron gun; the beam spot morphology detection substrate is used for detecting the beam spot morphology of an electron beam generated by the electron gun and transmitting a detection result to the beam quality optimization regulation and control system; the tungsten probe array is used for detecting beam spot energy distribution of the electron beam and transmitting a detection result to the beam quality optimization regulation and control system; the beam quality optimization regulation and control system is used for adjusting the driving current of the image elimination coil according to the detection result of the beam spot morphology detection substrate, so that the beam spot morphology of the electron beam is circular; the driving current of the combined coil is adjusted according to the detection result of the tungsten probe array, so that the beam spot energy of the electron beam is in Gaussian distribution from the center to the periphery.

Description

Technical Field

[0001] The present application relates to the technical field of electron gun processing, and in particular to a device for optimizing the quality of electron gun beam spot. Background Art

[0002] Electron beam is a high-energy particle flow formed by the electrostatic convergence and electromagnetic focusing of electrons accelerated by a high-voltage electric field. It has very important applications in welding, smelting, and additive manufacturing. The energy density of the electron beam is very high. After bombarding the surface of the material, the kinetic energy of the electrons is converted into thermal energy to achieve the melting and connection of the material. Good electron beam spot characteristics are the basic prerequisite for ensuring the quality of electron beam processing. Due to the constraints of factors such as cathode surface deformation and electron gun machining accuracy, the beam spot morphology of the electron beam acting on the material surface usually appears as an ellipse or irregular shape, and the energy center point is not at the center of the beam spot, making it difficult to obtain a high-quality electron beam processing process. However, the current electron beam spot is difficult to detect effectively, and it is very difficult to manually adjust the electron beam spot. In addition, the parameter values ​​adjusted by different operators are also very different, making it difficult to achieve relatively excellent beam spot quality requirements. Summary of the invention

[0003] The present application provides an electron gun beam spot quality optimization device to solve the current problem that the electron beam spot is difficult to effectively detect and optimize.

[0004] The present application provides an electron gun beam spot quality optimization device, comprising a beam quality optimization control system and a beam spot shape detection sensor; the beam spot shape detection sensor is provided with a beam spot shape detection substrate and a tungsten probe array respectively connected to the beam quality optimization control system; the beam quality optimization control system is respectively connected to the image elimination coil and the axis co-coupling coil of the electron gun;

[0005] The beam spot profile detection substrate is used to detect the beam spot profile of the electron beam generated by the electron gun, and transmit the detection result to the beam quality optimization and control system; the tungsten probe array is used to detect the beam spot energy distribution of the electron beam, and transmit the detection result to the beam quality optimization and control system;

[0006] The beam quality optimization and control system is used to adjust the driving current of the image elimination coil according to the detection results of the beam spot morphology detection substrate, so that the beam spot morphology of the electron beam is circular; and adjust the driving current of the axis-coupling coil according to the detection results of the tungsten probe array, so that the beam spot energy of the electron beam is Gaussian distributed from the center to the surroundings.

[0007] Furthermore, the beam quality optimization and control system includes a sampling circuit, a conversion circuit and a beam spot quality control software; the sampling circuit is respectively connected to the beam spot morphology detection substrate, the tungsten probe array and the conversion circuit, and the conversion circuit is respectively connected to the sampling circuit, the beam spot quality control software, the image elimination coil and the axis combination coil;

[0008] The sampling circuit is used to receive the detection results of the beam spot shape detection substrate and the tungsten probe array respectively, and output the detection results to the beam spot quality control software after being processed by the conversion circuit;

[0009] The beam spot quality control software is used to output a control signal of the image elimination coil driving current according to the detection result of the beam spot morphology detection substrate, and output a control signal of the coaxial coil driving current according to the detection result of the tungsten probe array.

[0010] Furthermore, a plurality of tungsten detection components are arranged on the beam spot shape detection substrate, and each tungsten detection component is connected to the sampling circuit through a sampling resistor; the tungsten detection component is used to collect the beam signal when the electron beam scans on the beam spot shape detection substrate, and output the beam signal to the sampling circuit through the sampling resistor.

[0011] Furthermore, the tungsten detection component includes two tungsten detection sheets arranged in parallel, and ceramic insulating plates are respectively arranged on the outer sides of the two tungsten detection sheets; the tungsten detection sheets are connected to the sampling circuit through the sampling resistor.

[0012] Furthermore, the tungsten probe array is annular, including multiple tungsten probes evenly distributed and located in the same plane; each tungsten probe is connected to a sampling circuit through a sampling resistor; the tungsten probe is used to collect a beam signal when the electron beam passes through the middle of the tungsten probe array, and output the beam signal to the sampling circuit through the sampling resistor.

[0013] Furthermore, the tungsten probe array is parallel to the coaxial coil and is on the same axis as the electron gun.

[0014] Furthermore, it also includes an erasing coil driving circuit and an axis-combining coil driving circuit; the conversion circuit is connected to the erasing coil through the erasing coil driving circuit and is connected to the axis-combining coil through the axis-combining coil driving circuit.

[0015] Furthermore, it also includes a scanning coil driving circuit; a scanning coil is also provided in the beam spot shape detection sensor, and the beam quality optimization control system also includes a waveform generating circuit; the waveform generating circuit is connected to the scanning coil through the scanning coil driving circuit;

[0016] The waveform generating circuit is used to output the scanning waveform to the scanning coil driving circuit, the scanning coil driving circuit is used to adjust the driving current of the scanning coil, and the scanning coil is used to control the electron beam to scan on the beam spot shape detection substrate.

[0017] Furthermore, it also includes a focusing coil driving circuit; the conversion circuit is also connected to the focusing coil of the electron gun through the focusing coil driving circuit; the focusing coil driving circuit is used to adjust the driving current of the focusing coil.

[0018] Furthermore, a water-cooled target is also provided in the beam spot profile detection sensor, and the water-cooled target is connected to the sampling circuit via a sampling resistor; the water-cooled target is used to receive the bombardment of the electron beam and take away the heat generated by the bombardment of the electron beam.

[0019] The above technical solution of the present application has the following advantages:

[0020] The electron gun beam spot quality optimization device provided in the present application detects the beam spot shape of the electron beam generated by the electron gun through a beam spot shape detection substrate, detects the beam spot energy distribution of the electron beam through a tungsten probe array, and then adjusts the driving current of the image elimination coil according to the detection result of the beam spot shape detection substrate through a beam quality optimization and control system, so that the beam spot shape of the electron beam is circular, and adjusts the driving current of the axis co-coil according to the detection result of the tungsten probe array, so that the beam spot energy of the electron beam is Gaussian distributed from the center to the surrounding, thereby achieving the purpose of effectively detecting the electron beam spot and optimizing the electron beam spot quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the specific implementation methods of the present application or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0022] Figure 1 A schematic diagram of an electron gun beam spot quality optimization device provided in this application;

[0023] Figure 2 A schematic diagram of the structure of the electron gun provided for this application;

[0024] Figure 3 A schematic diagram of a beam spot profile detection substrate provided in this application;

[0025] Figure 4 A schematic diagram of characteristic signal sampling provided for this application;

[0026] Figure 5 It is the beam sampling signal value measured on the tungsten detection piece provided in this application.

[0027] Figure numerals: 1. beam quality optimization and control system; 101. conversion circuit; 102. sampling circuit; 103. waveform generation circuit; 104. beam spot quality control software; 2. electron beam; 3. beam spot morphology detection substrate; 301. first ceramic insulating plate; 302. first tungsten detection plate; 303. second tungsten detection plate; 304. second ceramic insulating plate; 305. third ceramic insulating plate; 306. third tungsten detection plate; 307. fourth tungsten detection plate; 308. fourth ceramic insulating plate; 4. coaxial coil; 401. coaxial X-direction coil driving circuit; 402. coaxial Y-direction coil driving circuit; 5. image elimination coil; 501. image elimination X-direction coil driving circuit; 502. image elimination Y-direction coil driving circuit; 6. focusing coil; 601. focusing Focus coil driving circuit; 7. Beam spot shape detection sensor; 701. Beam spot shape detection sensor top cover; 702. Beam spot shape detection sensor upper shell; 703. Insulating gasket between shells; 704. Beam spot shape detection sensor lower shell; 705. Insulating bottom plate of beam spot shape detection sensor; 8. Water-cooled target; 801. Water inlet of water-cooled target; 802. Water outlet of water-cooled target; 9. Scanning coil; 901. Scanning coil driving circuit; 10. Electron gun; 11. Tungsten probe array; 1101. First tungsten probe; 1102. Second tungsten probe; 1103. Third tungsten probe; 1104. Fourth tungsten probe; 1105. Fifth tungsten probe; 1106. Sixth tungsten probe; 1107. Seventh tungsten probe; 1108. Eighth tungsten probe. DETAILED DESCRIPTION

[0028] In the following description, specific details such as specific system structures, technologies, etc. are provided for the purpose of illustration rather than limitation, so as to provide a thorough understanding of the embodiments of the present application. However, it should be clear to those skilled in the art that the present application may also be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to prevent unnecessary details from obstructing the description of the present application.

[0029] It should be understood that when used in the present specification and the appended claims, the term "comprising" indicates the presence of described features, wholes, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or combinations thereof.

[0030] In addition, in the description of the present application specification and the appended claims, the terms "first", "second", "third", etc. are only used to distinguish the descriptions and cannot be understood as indicating or implying relative importance.

[0031] References to "one embodiment" or "some embodiments" etc. described in the specification of this application mean that one or more embodiments of the present application include specific features, structures or characteristics described in conjunction with the embodiment. Therefore, the statements "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear in different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways. "Multiple" means "two or more".

[0032] In view of the current situation that electron beam spot is difficult to effectively detect and optimize, this application provides an electron gun beam spot quality optimization device. By controlling the electron beam to quickly scan on the beam spot shape detection substrate, the beam spot shape distribution parameters are obtained and the image elimination coil current is adjusted; by detecting the beam current size received by the tungsten probe array to measure the beam spot energy distribution, and adjusting the coaxial coil drive current accordingly, the purpose of optimizing the electron beam spot quality is achieved.

[0033] The specific implementation methods of the present application are further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present application but are not intended to limit the scope of the present application.

[0034] The present application embodiment provides an electron gun beam spot quality optimization device, such as Figure 1 and Figure 2 As shown, it includes a beam quality optimization and control system 1 and a beam spot shape detection sensor 7; the beam spot shape detection sensor 7 is provided with a beam spot shape detection substrate 3 and a tungsten probe array 11 respectively connected to the beam quality optimization and control system 1; the beam quality optimization and control system 1 is respectively connected to the image elimination coil 5 and the axis cooperating coil 4 of the electron gun 10; the beam spot shape detection substrate 3 is used to detect the beam spot shape of the electron beam 2 generated by the electron gun 10, and transmit the detection result to the beam quality optimization and control system 1; the tungsten probe array 11 is used to detect the beam spot energy distribution of the electron beam 2, and transmit the detection result to the beam quality optimization and control system 1; the beam quality optimization and control system 1 is used to adjust the driving current of the image elimination coil 5 according to the detection result of the beam spot shape detection substrate 3, so that the beam spot shape of the electron beam 2 is circular; according to the detection result of the tungsten probe array 11, the driving current of the axis cooperating coil 4 is adjusted, so that the beam spot energy of the electron beam 2 is Gaussian distributed from the center to the surrounding.

[0035] The beam spot shape information is obtained through the beam spot shape detection substrate 3 and transmitted to the beam quality optimization and control system 1 for comparison, analysis and calculation, and the driving current of the image elimination coil 5 is adjusted to make the beam spot shape tend to be circular; then the beam spot is made to pass through the center of the tungsten probe array 11, and the focusing current value is adjusted. The energy distribution information of the beam is received by the tungsten probe and input into the beam quality optimization and control system 1 for comparison, analysis and calculation, and the driving current of the co-axial coil 4 is adjusted to optimize the beam spot energy distribution of the electron beam, thereby achieving the purpose of effectively detecting the electron beam spot and optimizing the quality of the electron beam spot.

[0036] In some embodiments, Figure 1 As shown, the beam quality optimization and control system 1 includes a sampling circuit 102, a conversion circuit 101 and a beam spot quality control software 104; the sampling circuit 102 is respectively connected to the beam spot shape detection substrate 3, the tungsten probe array 11 and the conversion circuit 101, and the conversion circuit 101 is respectively connected to the sampling circuit 102, the beam spot quality control software 104, the image elimination coil 5 and the axis cooperating coil 4; the sampling circuit 102 is used to receive the detection results of the beam spot shape detection substrate 3 and the tungsten probe array 11 respectively, and output the detection results to the beam spot quality control software 104 after being processed by the conversion circuit 101; the beam spot quality control software 104 is used to output a control signal of the image elimination coil driving current according to the detection result of the beam spot shape detection substrate 3, and output a control signal of the axis cooperating coil driving current according to the detection result of the tungsten probe array 11.

[0037] In some embodiments, Figure 3 As shown, a plurality of tungsten detection components are arranged on the beam spot shape detection substrate 3, and each tungsten detection component is connected to the sampling circuit 102 through a sampling resistor; the tungsten detection component is used to collect the beam signal when the electron beam 2 scans on the beam spot shape detection substrate 3, and output the beam signal to the sampling circuit 102 through the sampling resistor.

[0038] In some embodiments, Figure 3 As shown, the tungsten detection assembly includes two tungsten detection sheets arranged in parallel, and ceramic insulating plates are respectively arranged on the outer sides of the two tungsten detection sheets; the tungsten detection sheets are connected to the sampling circuit 102 through the sampling resistor.

[0039] In some embodiments, Figure 4 As shown, the tungsten probe array 11 is ring-shaped, including a plurality of tungsten probes evenly distributed and located in the same plane; each tungsten probe is connected to the sampling circuit 102 through a sampling resistor; the tungsten probe is used to collect the beam signal when the electron beam 2 passes through the middle of the tungsten probe array 11, and output the beam signal to the sampling circuit 102 through the sampling resistor.

[0040] In some embodiments, the tungsten probe array 11 is parallel to the coaxial coil 4 and is on the same axis as the electron gun 10 .

[0041] In some embodiments, Figure 1 As shown, it also includes an erasing coil driving circuit and an axis-coupling coil driving circuit; the conversion circuit 101 is connected to the erasing coil 5 through the erasing coil driving circuit, and is connected to the axis-coupling coil 4 through the axis-coupling coil driving circuit.

[0042] In some embodiments, Figure 1 As shown, it also includes a scanning coil driving circuit 901; a scanning coil 9 is also arranged in the beam spot shape detection sensor 7, and the beam quality optimization and control system 1 also includes a waveform generating circuit 103; the waveform generating circuit 103 is connected to the scanning coil 9 through the scanning coil driving circuit 901; the waveform generating circuit 103 is used to output a scanning waveform to the scanning coil driving circuit 901, the scanning coil driving circuit 901 is used to adjust the driving current of the scanning coil 9, and the scanning coil 9 is used to control the electron beam 2 to scan on the beam spot shape detection substrate 3.

[0043] In some embodiments, Figure 1 As shown, it also includes a focusing coil driving circuit 601; the conversion circuit 101 is also connected to the focusing coil 6 of the electron gun 10 through the focusing coil driving circuit 601; the focusing coil driving circuit 601 is used to adjust the driving current of the focusing coil 6.

[0044] In some embodiments, Figure 1 As shown, a water-cooled target 8 is also provided in the beam spot profile detection sensor 7 , and the water-cooled target 8 is connected to the sampling circuit 102 through a sampling resistor; the water-cooled target 8 is used to receive the bombardment of the electron beam 2 and take away the heat generated by the bombardment of the electron beam 2 .

[0045] The present application is a device that optimizes and adjusts the parameters of the electron gun coaxial coil and the image elimination coil online according to the characteristic parameters of the detected beam spot through computer software analysis, so that the beam spot morphology is calibrated and the beam quality of the electron gun is quickly optimized. The electron gun beam spot quality optimization device includes a beam quality optimization and control system 1, a beam spot morphology detection substrate 3, a coaxial image elimination focusing coil and a driving circuit, a beam spot morphology detection sensor 7, a water-cooled target 8, a scanning coil and a driving circuit, an electron gun 10 and a tungsten probe array 11. The electron beam 2 is generated by the electron gun 10 and quickly scanned on the beam spot morphology detection substrate 3 through the scanning coil 9; the tungsten detection piece located on the beam spot morphology detection substrate 3 detects the beam spot morphology, and transmits the detection result to the beam quality control system 1 for calibration, analysis and calculation, and adjusts the beam spot morphology distribution; the tungsten probe array 11 detects the beam spot energy distribution, and adjusts the driving current of the coaxial coil 4 by detecting and comparing the beam current values ​​obtained on the 8 tungsten probes, so as to achieve a Gaussian distribution of the beam spot energy density from the center to the surroundings.

[0046] The implementation process of the electron gun beam spot quality optimization device is as follows: the electron beam 2 is generated by the electron gun 10 and directly irradiated onto the water-cooled target 8 in the beam spot shape detection sensor 7. At this time, the beam quality optimization and control system 1 outputs a control signal to the scanning coil drive circuit 901, and controls the electron beam 2 to quickly scan on the beam spot shape detection substrate 3 through the scanning coil 9. When the electron beam scans the tungsten detection piece placed on the beam spot shape detection substrate 3, the beam received by the tungsten detection piece will be converted into a voltage signal through the sampling resistor and transmitted to the beam quality optimization and control system 1 for detection and analysis. Through the beam signals measured by the tungsten detection piece in different directions, the beam quality optimization and control system 1 will construct a preliminary beam spot shape distribution map. According to the obtained beam spot shape, by adjusting the driving current of the image elimination coil 5, the beam spot shape is made to be circular. After the beam spot shape correction, the scanning device is turned off, the tungsten probe array 11 is placed, and the beam is applied to pass through the center of the tungsten probe array 11. The beam values ​​measured by the tungsten probes are converted into voltage signals through their respective sampling resistors and transmitted to the beam quality optimization and control system 1. The beam quality optimization and control system 1 obtains the preliminary energy distribution diagram of the beam spot according to the beam size measured on the 8 tungsten probes, and fine-tunes the drive current of the axis-coupling coil 4 to make the beams obtained on the 8 tungsten probes basically equal, thereby improving the energy distribution of the electron beam spot. This device has the advantages of simple operation and accurate measurement. The heat generated by the electron beam hitting the water-cooled target 8 is taken away by water cooling. It can detect the beam spot morphology of high-power electron beams such as above 30kW, and quickly optimize the beam spot quality.

[0047] The beam quality optimization control system 1 is composed of an analog-to-digital / digital-to-analog conversion circuit 101 , a sampling circuit 102 , a waveform generation circuit 103 and a beam spot quality control software 104 . The waveform generating circuit 103 generates an electron beam deflection signal which is input into the scanning driving circuit 901, driving the scanning coil 9 to generate a deflection current, thereby realizing rapid scanning of the electron beam on the beam spot shape detection substrate 3; the sampling circuit 102 receives the sampling signal of the beam current from the beam spot shape detection substrate 3 and the tungsten probe array 11, and inputs it into the beam spot quality control software 104 after being processed by the analog-to-digital / digital-to-analog conversion circuit 101; the beam spot quality control software 104 constructs a preliminary morphology and energy distribution diagram of the beam spot according to the information transmitted by the sampling circuit 102, and compares it with the set beam spot state, outputs the signal to the analog-to-digital / digital-to-analog conversion circuit 101, converts it into an analog signal, and then inputs it into the axis coordinating, image erasing, and focusing driving circuits respectively, changes the driving current of the axis coordinating, image erasing, and focusing coils, thereby changing the beam spot shape and energy distribution, and realizing beam spot shape and energy distribution correction.

[0048] like Figure 1 and Figure 2As shown, the electron beam 2 is generated by an electron gun 10; the coaxial coil 4, the image elimination coil 5, and the focusing coil 6 are all installed inside the electron gun 10 for optimizing and calibrating the quality of the electron beam spot. Figure 3 As shown, the beam spot profile detection substrate 3 includes a first ceramic insulating plate 301, a first tungsten detection piece 302, a second tungsten detection piece 303, a second ceramic insulating plate 304, a third ceramic insulating plate 305, a third tungsten detection piece 306, a fourth tungsten detection piece 307, and a fourth ceramic insulating plate 308; the scanning track of the electron beam on the beam spot profile detection substrate 3 is OABCDO, or ODCBAO; the thickness of the first tungsten detection piece 302, the second tungsten detection piece 303, the third tungsten detection piece 306, and the fourth tungsten detection piece 307 are all 0.1mm, and the first tungsten detection piece 302 and the second tungsten detection piece 303 are spaced 1mm apart; the third tungsten detection piece 306 and the fourth tungsten detection piece 307 are spaced 1mm apart. Figure 5 As shown, when the electron beam 2 scans on the beam spot shape detection substrate 3, if the roundness of the beam spot shape is good, the time period t1-t0 when the beam passes through the first tungsten detection piece, the time period t3-t2 when the beam passes through the second tungsten detection piece, the time period t5-t4 when the beam passes through the third tungsten detection piece, and the time period t7-t6 when the beam passes through the fourth tungsten detection piece should be t1-t0=t3-t2=t5-t4=t7-t6; otherwise, adjust the driving current value of the image elimination coil 5 to improve the beam spot shape.

[0049] like Figure 1 As shown, the beam spot shape detection sensor 7 is composed of a beam spot shape detection sensor top cover 701, an upper shell 702 of the beam spot shape detection sensor, an insulating gasket 703 between the shells, a lower shell 704 of the beam spot shape detection sensor, and an insulating bottom plate 705 of the beam spot shape detection sensor. The water-cooled target 8 receives the long-term bombardment of the electron beam 2 and removes the heat generated by the electron beam bombardment through water cooling.

[0050] like Figure 4 As shown, the tungsten probe array 11 consists of a first tungsten probe 1101, a second tungsten probe 1102, a third tungsten probe 1103, a fourth tungsten probe 1104, a fifth tungsten probe 1105, a sixth tungsten probe 1106, a seventh tungsten probe 1107, and an eighth tungsten probe 1108. Each tungsten probe is installed on the same horizontal plane, and the ends of the probes are evenly distributed on a circle with a diameter of 2 mm. The angle between the probes is 45°; the horizontal plane of the probe array is parallel to the coaxial coil 4 and is on the same axis as the electron gun; by controlling the driving current of the focusing coil 6 and adjusting the beam focus, each tungsten probe can detect the beam signal, and after converting it into a voltage signal through a sampling resistor, it is transmitted to the sampling circuit 102; when the voltage signals detected by each tungsten probe are the same, it indicates that the coaxiality of the beam is high, and there is no need to adjust the X-direction and Y-direction coil current signals of the coaxial coil; otherwise, coaxial calibration is performed.

[0051] In the application, the electron beam 2 is generated by the electron gun 10 and bombards the water-cooled target 8. At this time, the waveform generating circuit 103 outputs the scanning waveform to the scanning coil driving circuit 901, and changes the driving current of the scanning coil 9 through the scanning coil driving circuit 901, so as to realize the electron beam 2 to quickly scan on the beam spot shape detection substrate 3, and detect the beam spot shape distribution information through each tungsten detection piece on the beam spot shape detection substrate 3, and transmit it to the beam spot quality control software 104 through the sampling circuit 102 for comparison, analysis and calculation, so as to output the control signal, change the driving current of the image elimination coil 5, and realize the beam spot shape tends to be circular. Then, the driving signal of the scanning coil 9 is turned off, the current value of the focusing coil 6 is adjusted, the energy distribution of the beam spot is detected by the tungsten probe array 11, and after being processed by the sampling circuit 102, it is transmitted to the beam spot quality control software 104 for comparison, analysis and calculation, so as to output the control signal, change the driving current in the coaxial coil 4, and optimize the beam spot energy distribution of the electron beam. Through the above method, the beam spot shape of the electron beam is finally calibrated into a circle, and the beam spot energy presents a Gaussian distribution from the center to the surroundings, thereby optimizing the electron beam spot quality.

[0052] Regarding the embodiments of the present application, it should also be noted that, in the absence of conflict, the embodiments of the present application and the features therein can be combined with each other to obtain new embodiments.

[0053] Those skilled in the art can clearly understand that for the convenience and simplicity of description, only the division of the above-mentioned functional units and modules is used as an example for illustration. In actual applications, the above-mentioned functions can be assigned to different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiments can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. In addition, the specific names of the functional units and modules are only for the convenience of distinguishing each other, and are not used to limit the scope of protection of this application.

[0054] The embodiments described above are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. An electron gun beam spot quality optimization device, characterized in that: It includes a beam quality optimization and control system and a beam spot shape detection sensor; the beam spot shape detection sensor is provided with a beam spot shape detection substrate and a tungsten probe array respectively connected to the beam quality optimization and control system; the beam quality optimization and control system is respectively connected to the image elimination coil and the axis co-coil of the electron gun; The beam spot shape detection substrate is used to detect the beam spot shape of the electron beam generated by the electron gun, and transmit the detection result to the beam quality optimization and control system; The tungsten probe array is used to detect the beam spot energy distribution of the electron beam and transmit the detection result to the beam quality optimization and control system; The beam quality optimization and control system is used to adjust the driving current of the image elimination coil according to the detection result of the beam spot morphology detection substrate, so that the beam spot morphology of the electron beam is circular; and adjust the driving current of the axis co-coil according to the detection result of the tungsten probe array, so that the beam spot energy of the electron beam is Gaussian distributed from the center to the surroundings.

2. The electron gun beam spot quality optimization device according to claim 1, characterized in that: The beam quality optimization and control system comprises a sampling circuit, a conversion circuit and a beam spot quality control software; the sampling circuit is respectively connected to the beam spot morphology detection substrate, the tungsten probe array and the conversion circuit, and the conversion circuit is respectively connected to the sampling circuit, the beam spot quality control software, the image elimination coil and the co-axial coil; The sampling circuit is used to receive the detection results of the beam spot shape detection substrate and the tungsten probe array respectively, and output the detection results to the beam spot quality control software after being processed by the conversion circuit; The beam spot quality control software is used to output a control signal of the image erasing coil driving current according to the detection result of the beam spot shape detection substrate, and output a control signal of the coaxial coil driving current according to the detection result of the tungsten probe array.

3. The electron gun beam spot quality optimization device according to claim 2, characterized in that: A plurality of tungsten detection components are arranged on the beam spot shape detection substrate, and each of the tungsten detection components is connected to the sampling circuit through a sampling resistor; the tungsten detection component is used to collect the beam signal when the electron beam scans on the beam spot shape detection substrate, and output the beam signal to the sampling circuit through the sampling resistor.

4. The electron gun beam spot quality optimization device according to claim 3, characterized in that: The tungsten detection assembly comprises two tungsten detection sheets arranged in parallel, and ceramic insulating plates are respectively arranged on the outer sides of the two tungsten detection sheets; the tungsten detection sheets are connected to the sampling circuit via a sampling resistor.

5. The electron gun beam spot quality optimization device according to claim 2, characterized in that: The tungsten probe array is ring-shaped and includes a plurality of tungsten probes that are evenly distributed and located in the same plane; each of the tungsten probes is connected to the sampling circuit via a sampling resistor; the tungsten probes are used to collect beam signals when the electron beam passes through the middle of the tungsten probe array, and output the beam signals to the sampling circuit via the sampling resistor.

6. The electron gun beam spot quality optimization device according to claim 1, characterized in that: The tungsten probe array is parallel to the coaxial coil and is on the same axis as the electron gun.

7. The electron gun beam spot quality optimization device according to claim 2, characterized in that: It also includes an image erasure coil driving circuit and an axis-combining coil driving circuit; the conversion circuit is connected to the image erasure coil through the image erasure coil driving circuit and is connected to the axis-combining coil through the axis-combining coil driving circuit.

8. The electron gun beam spot quality optimization device according to claim 1, characterized in that: It also includes a scanning coil driving circuit; the beam spot shape detection sensor is also provided with a scanning coil, and the beam quality optimization and control system also includes a waveform generating circuit; the waveform generating circuit is connected to the scanning coil through the scanning coil driving circuit; The waveform generating circuit is used to output a scanning waveform to the scanning coil driving circuit, the scanning coil driving circuit is used to adjust the driving current of the scanning coil, and the scanning coil is used to control the electron beam to scan on the beam spot shape detection substrate.

9. The electron gun beam spot quality optimization device according to claim 2, characterized in that: It also includes a focusing coil driving circuit; the conversion circuit is also connected to the focusing coil of the electron gun through the focusing coil driving circuit; the focusing coil driving circuit is used to adjust the driving current of the focusing coil.

10. The electron gun beam spot quality optimization device according to claim 2, characterized in that: A water-cooled target is also provided in the beam spot profile detection sensor, and the water-cooled target is connected to the sampling circuit via a sampling resistor; the water-cooled target is used to receive the bombardment of the electron beam and take away the heat generated by the bombardment of the electron beam.

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