Semiconductor manufacturing process auxiliary equipment control method, control assembly and manufacturing system
By introducing an energy-saving control system into the semiconductor process processing equipment and dynamically adjusting the operation of auxiliary equipment according to process parameters, the problem of energy and material waste in traditional semiconductor processes is solved, and the effect of energy saving and resource optimization is achieved.
Patent Information
- Application Number
- CN202311446708.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-11-02
- Publication Date
- 2025-05-06
AI Technical Summary
In traditional semiconductor processes, the continuous operation of semiconductor process auxiliary equipment leads to waste of energy and materials.
By introducing an energy-saving trigger analysis unit and an energy-saving control unit into the semiconductor process processing equipment, an energy adjustment signal is generated according to the process parameters, and the auxiliary equipment is controlled through this signal, 100% energy consumption or the use of materials are avoided.
It realizes the effect of saving energy and materials in the semiconductor process, and reduces unnecessary energy and material consumption by dynamically adjusting the operation mode of auxiliary equipment.
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Figure CN119943701A_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to an equipment control method, an electronic component and an electronic system, and in particular to a semiconductor process auxiliary equipment control method, a control component and a manufacturing system. Background Art
[0002] With the advancement of semiconductor technology, the manufacturing process of semiconductors has become increasingly complicated. Wafers must undergo thousands to tens of thousands of processes using a variety of semiconductor process equipment to complete the production of crystals.
[0003] During the operation of semiconductor process equipment, semiconductor process auxiliary equipment is required to perform operations such as vacuuming, gas purification, heating, and water injection to meet the requirements of chamber pressure, gas concentration, temperature, cleanliness, etc.
[0004] However, conventionally, when performing semiconductor manufacturing processes, semiconductor manufacturing auxiliary equipment will continue to operate, resulting in waste of energy or materials. Summary of the invention
[0005] The present disclosure relates to a semiconductor process auxiliary equipment control method, control component and manufacturing system, which can generate an energy adjustment signal according to the process parameters of the semiconductor process processing equipment during the operation of the semiconductor process processing equipment. Then, a corresponding auxiliary equipment control signal is generated according to the energy adjustment signal. By controlling the auxiliary equipment control signal, the semiconductor process auxiliary equipment will not use 100% of the energy consumption or materials for processing all the time, so as to achieve the effect of saving energy consumption or saving materials.
[0006] According to the first aspect of the present disclosure, a semiconductor process auxiliary equipment control method is proposed. The semiconductor process auxiliary equipment control method is used to control at least one semiconductor process auxiliary equipment. The semiconductor process auxiliary equipment control method includes the following steps: Obtain at least one process parameter of a semiconductor process processing equipment. Generate an energy adjustment signal based on the process parameter. Generate an auxiliary equipment control signal based on the energy adjustment signal. Control the semiconductor process auxiliary equipment based on the auxiliary equipment control signal.
[0007] According to a second aspect of the present disclosure, a control component is provided. The control component is used to control at least one semiconductor process auxiliary equipment. The control component includes an energy-saving trigger analysis unit and an energy-saving control unit. The energy-saving trigger analysis unit is used to generate an energy adjustment signal according to at least one process parameter of a semiconductor process processing equipment. The energy-saving control unit is used to generate an auxiliary equipment control signal according to the energy adjustment signal, and control the semiconductor process auxiliary equipment according to the auxiliary equipment control signal.
[0008] According to a third aspect of the present disclosure, a manufacturing system is provided. The manufacturing system includes a semiconductor process processing device, at least one semiconductor process auxiliary device and a control component. The semiconductor process processing device has at least one process parameter. The control component includes an energy-saving trigger analysis unit and an energy-saving control unit. The energy-saving trigger analysis unit is used to generate an energy adjustment signal according to the process parameter of the semiconductor process processing device. The energy-saving control unit is used to generate an auxiliary device control signal according to the energy adjustment signal, and control the semiconductor process auxiliary device according to the auxiliary device control signal.
[0009] In order to better understand the above and other aspects of the present disclosure, embodiments are given below and described in detail with reference to the accompanying drawings as follows: BRIEF DESCRIPTION OF THE DRAWINGS
[0010] Figure 1 An example is given to illustrate a method for controlling a semiconductor process processing equipment and a semiconductor process auxiliary equipment of a manufacturing system according to an embodiment.
[0011] Figure 2 A block diagram of a manufacturing system according to one embodiment is shown.
[0012] Figure 3 A flow chart of a semiconductor process auxiliary equipment control method according to an embodiment is shown.
[0013] Figure 4 A schematic diagram of a semiconductor process equipment according to an embodiment is shown.
[0014] Figure 5A A detailed flow chart of step S120 according to an embodiment is shown.
[0015] Figure 5B A detailed flow chart of step S120 according to another embodiment is shown.
[0016] Figure 6 A detailed schematic diagram of an energy-saving control unit according to an embodiment is shown.
[0017] Figures 7A-7B This example illustrates the energy-saving control of the nitrogen regulator and the exhaust pump.
[0018] Explanation of symbols:
[0019] 1000: Manufacturing System
[0020] 100_i: Semiconductor process equipment
[0021] 200_j: Semiconductor process auxiliary equipment
[0022] 210: Nitrogen regulator
[0023] 220:Vacuum pump
[0024] 230: Purification device
[0025] 300: Control components
[0026] 310: Energy saving trigger analysis unit
[0027] 320: Energy-saving control unit
[0028] 321: Packet receiving element
[0029] 322: Message Analysis Component
[0030] 323: Trigger control loop
[0031] 800: Nitrogen supply device
[0032] 900: Wafer
[0033] CTitj: Auxiliary equipment control signal
[0034] ECit: Energy Adjustment Signal
[0035] FCit: Process judgment results
[0036] IDL: Idle Phase
[0037] PS: Processor Phase
[0038] PMit: Process parameters
[0039] S110, S120, S121, S121', S122, S122', S140, S150, S160: Steps DETAILED DESCRIPTION
[0040] Please refer to Figure 1 and Figure 2 , Figure 1 The control method of the semiconductor process processing equipment 100_i and the semiconductor process auxiliary equipment 200_j of the manufacturing system 1000 according to an embodiment is described by way of example. Figure 2 A block diagram of a manufacturing system 1000 according to an embodiment is shown. The semiconductor process processing equipment 100_i is used to perform a semiconductor process on a wafer 900. The semiconductor process processing equipment 100_i is, for example, a lithography equipment, an etching equipment, a thin film deposition equipment, or a diffusion equipment used in the semiconductor process. The semiconductor process auxiliary equipment 200_j is connected to the semiconductor process processing equipment 100_i to maintain a processing environment of the semiconductor process processing equipment 100_i. Figure 2As shown, the semiconductor process auxiliary equipment 200_j, for example, includes a nitrogen regulator 210, a vacuum pump 220 and a scrubber 230. The vacuum pump 220, for example, extracts the gas in the chamber of the semiconductor process processing equipment 100_i to create a vacuum environment. Further, nitrogen is provided to the vacuum pump 220 to take away the powder generated by the condensation of the process exhaust gas. Then, the scrubber 230 is used to purify the toxic / flammable exhaust gas in the chamber extracted by the vacuum pump 220, convert the toxic / flammable exhaust gas into safe / clean exhaust gas, and discharge it to the factory system (not shown).
[0041] like Figure 1 As shown, the semiconductor process processing equipment 100_i provides a process parameter PMit to the energy-saving trigger analysis unit 310 of the control component 300. The energy-saving trigger analysis unit 310 is, for example, a circuit, a chip, a circuit board, or a storage device storing program code. In one embodiment, the energy-saving trigger analysis unit 310 can be an equipment automation program (EAP). The energy-saving trigger analysis unit 310 generates an energy adjustment signal ECit according to the process parameter PMit of the semiconductor process processing equipment 100_i.
[0042] The energy-saving control unit 320 of the control component 300 is used to generate an auxiliary equipment control signal CTitj according to the energy adjustment signal ECit. The energy-saving control unit 320 is, for example, a circuit, a chip, a circuit board, or a storage device storing program codes. Through the control of the auxiliary equipment control signal CTitj, the semiconductor process auxiliary equipment 200_j will not use 100% of the energy consumption or material for processing all the time.
[0043] like Figure 1 As shown, when the semiconductor process processing equipment 100_i is in the processing stage PS, the semiconductor process auxiliary equipment 200_j uses higher energy consumption or uses more materials to maintain the processing environment required by the semiconductor process processing equipment 100_i. When the semiconductor process processing equipment 100_i is in the idle stage IDL, the semiconductor process auxiliary equipment 200_j uses lower energy consumption or uses less materials to achieve the effect of saving energy and materials.
[0044] like Figure 2As shown in the block diagram of , the manufacturing system 1000, for example, includes the above-mentioned semiconductor process processing equipment 100_i, the above-mentioned control component 300, the above-mentioned semiconductor process auxiliary equipment 200_j and a nitrogen supply device 800. In this embodiment, during the operation of the semiconductor process processing equipment 100_i, an energy adjustment signal ECit can be generated according to the process parameter PMit of the semiconductor process processing equipment 100_i. Then, according to the energy adjustment signal ECit, a corresponding auxiliary equipment control signal CTitj is generated. By controlling the auxiliary equipment control signal CTitj, the semiconductor process auxiliary equipment 200_j will not use 100% of the energy consumption or materials for processing all the time, so as to achieve the effect of energy saving or material saving. The following is a flowchart to explain in detail the operation of the above-mentioned components.
[0045] Please refer to Figure 3 , which depicts a flow chart of a semiconductor process auxiliary equipment control method according to an embodiment. Figure 3 In step S110, the energy-saving trigger analysis unit 310 of the control component 300 obtains the process parameter PMit of the semiconductor process processing equipment 100_i from the semiconductor process processing equipment 100_i. The process parameter PMit includes, for example, an energy setting value, a pressure setting value, a temperature setting value, or a gas valve position. The energy setting value is, for example, the energy (RF power) of the radio frequency plasma source, the temperature setting value is, for example, the cavity temperature, the pressure setting value is, for example, the cavity pressure, and the gas valve position is, for example, the gas valve position between the pump and the cavity, which is not limited here. The process parameter PMit of the semiconductor process processing equipment 100_i is, for example, the content described in Table 1 below.
[0046]
[0047]
[0048] Table 1
[0049] Please refer to Figure 4 , which illustrates a schematic diagram of a semiconductor process processing device 100_i according to an embodiment. In the semiconductor manufacturing process, a variety of different semiconductor process processing devices 100_i (such as lithography equipment, etching equipment, thin film deposition equipment or diffusion equipment) are required to perform semiconductor processes. Each semiconductor process processing device 100_i can transmit a process parameter PMit to the energy-saving trigger analysis unit 310. The semiconductor process processing device 100_i and the energy-saving trigger analysis unit 310 communicate with each other, for example, using a wireless network, an LTE transmission system, or a wired network.
[0050] Then, in Figure 3 In step S120, Figure 2As shown, the energy-saving trigger analysis unit 310 generates an energy adjustment signal ECit according to the process parameter PMit. Figure 5A , which depicts a detailed flow chart of step S120 according to an embodiment. Step S120, for example, includes steps S121 to S122. Figure 5A In step S121, as shown in Table 2, the energy-saving trigger analysis unit 310 determines whether a single process parameter PMit (e.g., "Pressure Target") meets a process judgment condition, and generates a process judgment result FCit. For example, the process judgment condition is, for example, "Pressure Target is greater than 0". When the value of "Pressure Target" is greater than 0, the process judgment result FCit is "1"; when the value of "Pressure Target" is not greater than 0, the process judgment result FCit is "0".
[0051]
[0052] Table 2
[0053] Then, in Figure 5A In step S122, Figure 2 As shown, the energy-saving trigger analysis unit 310 generates an energy adjustment signal ECit according to the process judgment result FCit. For example, when the process judgment result FCit is "0", it means that the semiconductor process auxiliary equipment 200_j is in production and energy saving is not being performed, so the energy adjustment signal ECit can be set to "0" and no energy saving is performed; when the process judgment result FCit is "1", it means that the semiconductor process auxiliary equipment 200_j is not in production and energy saving is required, so the energy adjustment signal ECit can be set to "1" to save energy.
[0054] In the above steps S121 - S122 , analysis is performed according to a single process parameter PMit, and an energy adjustment signal ECit is generated accordingly.
[0055] Please refer to Figure 5B , which depicts a detailed flow chart of step S120 according to another embodiment. Step S120, for example, includes steps S121' to S122'. Figure 5B In step S121', Figure 2 As shown, the energy-saving trigger analysis unit 310 determines whether a plurality of process parameters PMit meet any one of a plurality of process determination conditions, and generates a process determination result FCit.
[0056] Then, in Figure 5B In step S122', Figure 2As shown, the energy-saving trigger analysis unit 310 generates an energy adjustment signal ECit according to these process judgment results FCit. In the above steps S121'-S122', analysis is performed based on a number of process parameters and the energy adjustment signal ECit is generated accordingly. For example, when any one of these process judgment conditions is met and any process judgment result FCit is "1", it means that the semiconductor process auxiliary equipment 200_j is not in production and energy saving is being performed, so the energy adjustment signal ECit can be set to "1" to perform energy saving; when all process judgment conditions are not met and all process judgment results FCit are "0", it means that the semiconductor process auxiliary equipment 200_j is in production and energy saving is not required, so the energy adjustment signal ECit can be set to "0" and no energy saving is performed.
[0057] Then, in Figure 3 In step S140, Figure 6 As shown, the energy-saving control unit 320 generates an auxiliary device control signal CTitj according to the energy adjustment signal ECit. For example, Figure 6 A detailed schematic diagram of an energy-saving control unit 320 according to an embodiment is shown. The energy-saving control unit 320 includes, for example, a packet receiving element 321, a message analyzing element 322, and a trigger control loop 323. The packet receiving element 321 is used to receive the energy adjustment signal ECit. The message analyzing element 322 is used to parse the content of the energy adjustment signal ECit to determine which semiconductor process auxiliary equipment 200_j is to be energy-saving. The trigger control loop 323 is used to generate the auxiliary equipment control signal CTitj.
[0058] Then, in Figure 3 In step S150, Figure 6 As shown, the energy-saving control unit 320 transmits the auxiliary equipment control signal CTitj to the semiconductor process auxiliary equipment 200_j.
[0059] Then, in Figure 3 In step S160, the semiconductor process auxiliary equipment 200_j is controlled according to the auxiliary equipment control signal CTitj. For example, the nitrogen regulator 210 includes a flow regulating valve. The auxiliary equipment control signal CTitj is used to provide a flow regulating valve switching instruction or a switching actuation voltage of the nitrogen regulator 210 to switch the flow regulating valve to a low flow mode.
[0060] Please refer to Figures 7A-7B, which illustrates the energy-saving control of the nitrogen regulator 210 and the exhaust pump 220. The nitrogen supply device 800 passes nitrogen into the exhaust pump 220 through the regulation of the nitrogen regulator 210 to remove the powder generated by the condensation of the process exhaust gas. The exhaust pump 220 itself does not have an energy-saving function, but by controlling the nitrogen regulator 210, the effect of saving energy and materials can be achieved. Fig. 7A As shown, when the energy-saving control unit 320 does not provide the auxiliary equipment control signal CTitj to the nitrogen regulator 210, the flow regulating valve of the nitrogen regulator 210 is in the high flow mode, and the exhaust pump 220 provides more nitrogen into the chamber to take away the powder generated by condensation of the process exhaust gas.
[0061] like Figure 7B As shown, when the energy-saving control unit 320 provides the auxiliary equipment control signal CTitj to the nitrogen regulator 210, the flow regulating valve of the nitrogen regulator 210 is in the low flow mode, and the vacuum pump 220 provides less nitrogen to the chamber to achieve the effect of saving energy and materials.
[0062] For another example, the purification device 230 includes a heating end, a cooling end and a plurality of valves. When the energy-saving control unit 320 does not provide the auxiliary device control signal CTitj to the valve, the exhaust gas and nitrogen are injected into the heating end and flow to the exhaust pipe after being cooled at the cooling end.
[0063] When the energy-saving control unit provides the auxiliary equipment control signal CTitj to the valve, the valve controls the nitrogen reduction, and the valve controls the cooling water reduction to achieve the effect of saving energy and materials. The above-mentioned illustrated examples are not intended to limit the scope and implementation of the present invention.
[0064] According to the above embodiment, during the operation of the semiconductor process processing equipment 100_i, an energy adjustment signal ECit can be generated according to the process parameter PMit of the semiconductor process processing equipment 100_i. Then, a corresponding auxiliary equipment control signal CTitj is generated according to the energy adjustment signal ECit. Through the control of the auxiliary equipment control signal CTitj, the semiconductor process auxiliary equipment 200_j will not use 100% of the energy consumption or materials for processing all the time, so as to achieve the effect of energy saving or material saving.
[0065] In summary, although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. A person skilled in the art of the present invention may make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be defined by the appended claims.
Claims
1. A semiconductor process auxiliary equipment control method for controlling at least one semiconductor process auxiliary equipment, the semiconductor process auxiliary equipment control method comprising: Obtaining at least one process parameter of a semiconductor process processing equipment; generating an energy adjustment signal according to the process parameter; generating an auxiliary device control signal according to the energy adjustment signal; as well as The at least one semiconductor process auxiliary equipment is controlled according to the auxiliary equipment control signal.
2. The semiconductor process auxiliary equipment control method as claimed in claim 1, wherein the step of generating the energy adjustment signal comprises: Determine whether a single process parameter of the process parameter meets the process determination condition, and generate a process determination result; as well as The energy adjustment signal is generated according to the process determination result.
3. The semiconductor process auxiliary equipment control method as claimed in claim 1, wherein the step of generating the energy adjustment signal comprises: Determining whether the multiple process parameters of the process parameter meet any one of the multiple process determination conditions, and generating a process determination result; as well as The energy adjustment signal is generated according to the process determination result.
4. The semiconductor process auxiliary equipment control method as claimed in claim 1, wherein the process parameter comprises an energy setting value, a temperature setting value, a pressure setting value, or a gas valve position.
5. The semiconductor process auxiliary equipment control method as claimed in claim 1, wherein the semiconductor process processing equipment is used to perform semiconductor processing on wafers, and the semiconductor process auxiliary equipment is connected to the semiconductor process processing equipment to provide a processing environment for the semiconductor process processing equipment. 6 . The semiconductor process auxiliary equipment control method according to claim 1 , wherein the at least one semiconductor process auxiliary equipment is plural in number, and the semiconductor process auxiliary equipment is controlled differently according to the auxiliary equipment control signal.
7. The semiconductor process auxiliary equipment control method as claimed in claim 1, wherein the semiconductor process processing equipment is a lithography equipment, an etching equipment, a thin film deposition equipment or a diffusion equipment.
8. The semiconductor process auxiliary equipment control method as claimed in claim 1, wherein the semiconductor process auxiliary equipment is a vacuum pump or a purification device.
9. A control component for controlling at least one semiconductor process auxiliary equipment, the control component comprising: An energy-saving trigger analysis unit, for generating an energy adjustment signal according to at least one process parameter of a semiconductor process processing device; as well as The energy-saving control unit is used to generate an auxiliary equipment control signal according to the energy adjustment signal, and control the at least one semiconductor process auxiliary equipment according to the auxiliary equipment control signal.
10. The control component of claim 9, wherein the energy-saving trigger analysis unit is used to determine whether a single process parameter of the process parameters meets a process determination condition to generate a process determination result, and generate the energy adjustment signal according to the process determination result.
11. The control component as claimed in claim 9, wherein the energy-saving trigger analysis unit is used to generate a process judgment result according to whether multiple process parameters of the process parameters meet any one of multiple process judgment conditions, and generate the energy adjustment signal according to the process judgment result.
12. The control component as claimed in claim 9, wherein the at least one semiconductor process auxiliary equipment is plural in number, and the energy-saving control unit is used to perform different controls on the semiconductor process auxiliary equipment according to the auxiliary equipment control signal.
13. A manufacturing system comprising: Semiconductor process processing equipment, having at least one process parameter; At least one semiconductor process auxiliary equipment; as well as Control components, including: An energy-saving trigger analysis unit, used for generating an energy adjustment signal according to the process parameter of the semiconductor process processing equipment; and The energy-saving control unit is used to generate an auxiliary equipment control signal according to the energy adjustment signal, and control the at least one semiconductor process auxiliary equipment according to the auxiliary equipment control signal.