Heat dissipation structure comprising micro-channel and packaging method
By introducing a microflower structure into the three-dimensional packaging structure, the problem of insufficient heat dissipation in traditional packaging is solved, and efficient heat dissipation of the bottom chip is achieved, which is suitable for efficient heat dissipation needs in multi-layer stacking.
Patent Information
- Application Number
- CN202510036134.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-09
- Publication Date
- 2025-05-06
AI Technical Summary
The traditional three-dimensional packaging structure has shortcomings in heat dissipation, especially the bottom chip lacks a suitable heat dissipation path, resulting in a large heat dissipation pressure. As the number of stacked layers increases, the effect of existing heat dissipation devices becomes less and less obvious.
A heat dissipation structure containing microflowers is adopted. By setting a microflower structure on the bottom substrate, it makes it come into contact with the bottom chip and conducting heat through thermally conductive glue, thereby achieving effective heat dissipation.
It significantly improves the heat dissipation ability of the internal devices of the three-dimensional package, and solves the problem of insufficient heat dissipation in traditional structures. Especially in the case of multi-layer stacking, the microflower structure can effectively bring out heat and improve the overall heat dissipation performance.
Smart Images
Figure CN119943778A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of semiconductor packaging, and in particular to a heat dissipation structure including a microchannel and a packaging method. Background Art
[0002] With the vigorous development of semiconductor technology, new products have put forward increasingly stringent requirements on chip performance, size, power consumption, etc. Conventional PCB boards often integrate a large number of SMT devices, finished chips, etc. due to the pursuit of high performance and multi-functions, resulting in large size and relatively high cost. Therefore, a packaging route was subsequently born, which replaced the finished chip with a bare die and then integrated it into the package substrate together with other devices.
[0003] Traditional FCBGA, like PCB, can only lay out devices and chips one by one, and the package size is still large. Therefore, POP packaging came into being. This package can stack two substrates up and down, and the chips can be stacked vertically, greatly reducing the package area.
[0004] However, since some chips are placed on the bottom substrate, there is no suitable heat dissipation path, resulting in greater heat dissipation pressure. Traditional heat dissipation methods such as heat sinks, air cooling, and liquid cooling can reduce the temperature of the surface of the three-dimensional package, but the heat of the inner layer devices is difficult to dissipate effectively, and as the number of stacked layers increases, the effect of existing heat dissipation devices becomes less and less obvious. Summary of the invention
[0005] The purpose of the present invention is to overcome the shortcomings of the prior art and provide a structure and packaging method that can effectively enhance the heat dissipation capacity of internal devices of a three-dimensional package. To solve the above problems, the present invention provides a heat dissipation structure including a microchannel, characterized in that it includes:
[0006] A top heat dissipation cover is arranged on the top substrate and contacts the top of the top chip to dissipate heat of the top chip;
[0007] A top chip is disposed on the top substrate;
[0008] a top substrate, disposed on the microfluidic channel structure;
[0009] A connector, used to connect the top substrate and the bottom substrate;
[0010] A microfluidic channel structure is arranged on the bottom substrate, wherein the bottom of the microfluidic channel structure contacts the bottom chip and the top of the microfluidic channel structure contacts the top substrate, and is used for heat dissipation of the bottom chip;
[0011] A bottom chip is disposed on the bottom substrate, and the top of the bottom chip is in contact with the microfluidic channel structure;
[0012] A bottom substrate, used for carrying the bottom chip;
[0013] The bottom planting ball is arranged at the bottom of the bottom substrate.
[0014] In one embodiment of the present invention, the microfluidic channel structure comprises:
[0015] A metal cover plate, wherein the top of the metal cover plate contacts the top substrate, and the bottom of the metal cover plate is welded to the adapter plate and the micro-channel through solder;
[0016] A microfluidic channel, wherein the top of the microfluidic channel contacts the metal cover plate, and the bottom contacts the adapter plate, for heat dissipation by conduction;
[0017] The adapter plate is arranged on the bottom substrate, the top of the adapter plate is connected to the metal cover plate and the microchannel, and the bottom of the adapter plate is in contact with the top of the bottom chip.
[0018] In another embodiment of the present invention, the bottoms of the top chip and the bottom chip are provided with bumps, which are used for connection with the top substrate and the bottom substrate respectively.
[0019] In another embodiment of the present invention, a pad opening is reserved on the top of the bottom substrate for interconnection with the top substrate package.
[0020] In another embodiment of the present invention, the microfluidic channel structure is in contact with the bottom chip via a thermally conductive adhesive, and the microfluidic channel structure is bonded to the bottom substrate via an adhesive.
[0021] In another embodiment of the present invention, the connecting member is a copper core ball or a connector.
[0022] The present invention also provides a method for packaging a heat dissipation structure including a microchannel, characterized by comprising:
[0023] Step 1, mount the top chip on the top substrate, and then apply heat dissipation glue on the top of the top chip and mount the heat dissipation cover;
[0024] Step 2, planting copper core balls or assembling connectors on the back of the top substrate;
[0025] Step 3, mounting the bottom chip to the bottom substrate, and reserving a pad opening on the top of the bottom substrate for interconnection with the top substrate package;
[0026] Step 4, placing the microfluidic structure on the bottom substrate, and applying heat dissipation glue on the surface of the bottom chip to contact the microfluidic structure, wherein the microfluidic structure is bonded to the bottom substrate by an adhesive;
[0027] Step 5, interconnect the solder balls or connectors on the back of the top substrate in step 2 with the solder pads reserved on the top of the bottom substrate by reflow, and complete the ball planting under the bottom substrate.
[0028] In one embodiment of the present invention, the bottom of the microfluidic structure in step 4 has a groove for accommodating the bottom chip.
[0029] In another embodiment of the present invention, the width of the top substrate is smaller than the width of the micro-channel structure.
[0030] In another embodiment of the present invention, the top of the microfluidic structure in step 5 has a groove for supporting the top substrate.
[0031] The present invention adopts a microchannel structure to dissipate heat for the bottom chip, which has the following beneficial effects:
[0032] (1) Apply the microfluidic structure to the design of the dual-substrate structure to solve the serious heat dissipation problem.
[0033] (2) The external structure and substrate of the microfluidic channel are optimized to adapt to the dual-substrate structure, ensuring sufficient IO transmission while achieving optimal heat dissipation performance. BRIEF DESCRIPTION OF THE DRAWINGS
[0034] Figure 1 A front view of a microfluidic channel packaging structure in one embodiment of the present invention is shown;
[0035] Figure 2 A top view of a microfluidic channel packaging structure in one embodiment of the present invention is shown;
[0036] FIG. 3A to FIG. 3E A microfluidic channel packaging flow chart in one embodiment of the present invention is shown;
[0037] Figure 4 A front view of a microfluidic channel packaging structure in another embodiment of the present invention is shown;
[0038] Figure 5 A top view of a microfluidic packaging structure in another embodiment of the present invention is shown. DETAILED DESCRIPTION
[0039] In the following description, the present invention is described with reference to various embodiments. However, those skilled in the art will recognize that various embodiments may be implemented without one or more specific details or with other replacement and / or additional methods, materials or components. In other cases, well-known structures, materials or operations are not shown or described in detail to avoid obscuring the inventive point of the present invention. Similarly, for the purpose of explanation, specific quantities, materials and configurations are set forth to provide a comprehensive understanding of embodiments of the present invention. However, the present invention is not limited to these specific details.
[0040] In addition, it should be understood that the embodiments shown in the drawings are illustrative representations and are not necessarily drawn to the correct scale. In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than explicitly or implicitly indicating that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention.
[0041] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as expressing or implying relative importance. In this specification, reference to "one embodiment" or "the embodiment" means that a particular feature, structure or characteristic described in conjunction with the embodiment is included in at least one embodiment of the present invention. The phrase "in one embodiment" appearing in various places in this specification does not necessarily refer to the same embodiment.
[0042] like Figure 1 As shown, in one embodiment of the present invention, a front view of a heat dissipation structure including a microfluidic channel is provided, which includes from top to bottom: a top heat dissipation cover 120, a top chip 122, bumps 121 of the top chip 122, a top substrate 119, a connector 123, a bottom chip 116, bumps 117 of the bottom chip, a bottom substrate 114, and a bottom planting ball 115. The chips are all arranged on the corresponding substrates through corresponding bumps.
[0043] The top substrate 119 is connected to the bottom substrate 114 through a connector 123. In one embodiment of the present invention, the connector 123 is a copper core ball. In another embodiment of the present invention, the connector 123 is a connector. The top of the bottom substrate 114 has a reserved pad opening for interconnection with the top substrate 119.
[0044] The top heat dissipation cover 120 is disposed on the top substrate 119 and has a groove therein for accommodating the top chip 122 disposed on the top substrate 119. The top of the top chip 122 is coated with heat dissipation glue and is in contact with the top heat dissipation cover 120. The top heat dissipation cover 120 dissipates heat for the top chip 122. The heat generated by the bottom chip 116 carried on the bottom substrate 114 is dissipated by the microchannel structure.
[0045] The width of the top substrate 119 is smaller than the width of the microfluidic structure, thereby combining Figure 2, A side view of the heat dissipation structure including a microchannel in an embodiment of the present invention, from which the schematic diagram of the microchannel structure in the present invention can be intuitively seen.
[0046] As Figure 2 shown, the microchannel structure specifically includes: a metal cover plate 111, an adapter plate 113, and a microchannel passage 118. The microchannel passage 118 is provided on the adapter plate 113, and the metal cover plate 111 is welded to the adapter plate and the microchannel passage 118 through a solder 112. The metal cover plate 111 has a groove for accommodating the top substrate 119, and also has two openings, as shown by the arrows in the figure, forming a complete passage of the microchannel. The arrow direction is the inlet and outlet passage of the fluid, and the heat generated by the bottom chip 116 is taken out through the microchannel structure, thereby realizing the heat dissipation of the bottom chip 116.
[0047] The top of the adapter plate 113 is provided with a microchannel passage 118, which is welded to the metal cover plate 111 through a solder 112. The top of the adapter plate 113 has a groove for accommodating the microchannel passage 118, so that the top of the microchannel passage 118 is at the same horizontal height as the top of the adapter plate 113. The bottom of the adapter plate 113 also has a groove for accommodating the bottom chip 116. The adapter plate 113 is bonded to the bottom substrate 114 through an adhesive. The top of the bottom chip 116 is coated with a heat dissipation gel and contacts the bottom of the adapter plate 113, thereby realizing the heat conduction from the bottom chip 116 to the microchannel structure and realizing the heat dissipation of the bottom chip 116.
[0048] Therefore, the present invention also provides a packaging method for a heat dissipation structure including a microchannel, which includes:
[0049] Step 1, mounting a top chip on the top substrate, and then coating a heat dissipation gel on the top of the top chip and mounting a heat dissipation cover;
[0050] Step 2, implanting copper core balls or assembling connectors on the back of the top substrate;
[0051] Step 3, mounting the bottom chip on the bottom substrate, and reserving a pad opening on the top of the bottom substrate for interconnection with the top substrate package;
[0052] Step 4, placing the microchannel structure on the bottom substrate, and coating the surface of the bottom chip with a heat dissipation gel to contact the microchannel structure, wherein the microchannel structure is bonded to the bottom substrate through an adhesive;
[0053] Step 5, interconnecting the solder balls or connectors on the back of the top substrate in Step 2 with the pads reserved on the top of the bottom substrate through reflow, and completing the ball implantation under the bottom substrate.
[0054] As Figure 3AAs shown, in step 1, a top chip 122 (blue part) is attached to the top substrate (black part) 119, and then a top heat dissipation cover 120 (red part) is attached after applying heat dissipation glue normally.
[0055] In step 2, if Figure 3B As shown, copper core balls or assembled connectors are planted on the back of the top substrate 119 for connecting with the bottom substrate 114 .
[0056] In step 3, if Figure 3C As shown, a pad opening is reserved at the top of the bottom substrate 114 (green part) for connecting to the copper core ball or connector on the back of the top substrate 119 in step 2, and mounting the bottom chip 116 (purple part) on the bottom substrate 114.
[0057] In step 4, if Figure 3D As shown, the microfluidic structure is placed on the bottom chip 116, the microfluidic structure and the chip are in contact through TIM glue, and are normally connected to the bottom substrate 114 through adhesive. It can be seen from the figure that the width of the microfluidic structure is consistent with the bottom substrate 114, and the length is smaller than the bottom substrate 114.
[0058] In step 5, the solder balls or connectors at the bottom of the structural member in step 2 are interconnected with the solder pads reserved on the top of the bottom substrate 114 by reflow, and the ball planting under the bottom substrate 114 is completed, and finally the structure is as shown in FIG. Figure 3E As shown in the simplified three-dimensional structure diagram, it can be seen that the width of the top substrate 119 is smaller than the width of the micro-channel structure.
[0059] like Figure 4 and Figure 5 As shown, the present invention is not limited to the POP structure, but also applicable to the server, motherboard and other structures. In another embodiment of the present invention, the structure is similar to the above, except that:
[0060] 131 changes to DDR modules, which can contain tiled combinations of multiple DDRs;
[0061] 133 is changed to a PCB mainboard with a CPU chip 116 mounted thereon.
[0062] In this embodiment, the module can realize vertical stacking of DDR modules and CPU, greatly improving the integration level, and at the same time, due to the existence of the microchannel structure, the heat dissipation problem of the CPU chip can be greatly optimized.
[0063] Based on the idea that microfluidic channels have good heat dissipation, the present invention applies it to the design of a dual-substrate structure to solve the serious heat dissipation problem. At the same time, the microfluidic channel external structure and substrate are optimized to adapt to the dual-substrate structure, ensuring sufficient IO transmission while achieving optimal heat dissipation performance.
[0064] Obviously, the above embodiments are merely examples for clear explanation and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived from these are still within the protection scope of the invention.
Claims
1. A heat dissipation structure comprising a microchannel, characterized in that: include; A top heat dissipation cover is arranged on the top substrate and contacts the top of the top chip to dissipate heat of the top chip; A top chip is disposed on the top substrate; a top substrate, disposed on the microfluidic channel structure; A connector, used to connect the top substrate and the bottom substrate; A microfluidic channel structure is arranged on the bottom substrate, wherein the bottom of the microfluidic channel structure contacts the bottom chip and the top of the microfluidic channel structure contacts the top substrate, and is used for heat dissipation of the bottom chip; A bottom chip is disposed on the bottom substrate, and the top of the bottom chip is in contact with the microfluidic channel structure; A bottom substrate, used for carrying the bottom chip; The bottom planting ball is arranged at the bottom of the bottom substrate.
2. The heat dissipation structure comprising a microchannel as claimed in claim 1, characterized in that: The microfluidic channel structure comprises: A metal cover plate, wherein the top of the metal cover plate contacts the top substrate, and the bottom of the metal cover plate is welded to the adapter plate and the micro-channel through solder; A microfluidic channel, wherein the top of the microfluidic channel contacts the metal cover plate, and the bottom contacts the adapter plate, for heat dissipation by conduction; The adapter plate is arranged on the bottom substrate, the top of the adapter plate is connected to the metal cover plate and the microchannel, and the bottom of the adapter plate is in contact with the top of the bottom chip.
3. The heat dissipation structure comprising a microchannel according to claim 1, characterized in that: The bottoms of the top chip and the bottom chip are provided with bumps, which are used for connection with the top substrate and the bottom substrate respectively.
4. The heat dissipation structure comprising a microchannel according to claim 1, characterized in that: A pad opening is reserved on the top of the bottom substrate for interconnection with the top substrate package.
5. The heat dissipation structure comprising a microchannel according to claim 1, characterized in that: The microchannel structure is in contact with the bottom chip through a heat-conducting adhesive, and the microchannel structure is bonded to the bottom substrate through an adhesive.
6. The heat dissipation structure comprising a microchannel according to claim 1, characterized in that: The connecting piece is a copper core ball or a connector.
7. A method for packaging a heat dissipation structure including a microchannel, characterized in that: include: Step 1, mount the top chip on the top substrate, and then apply heat dissipation glue on the top of the top chip and mount the heat dissipation cover; Step 2, planting copper core balls or assembling connectors on the back of the top substrate; Step 3, mounting the bottom chip to the bottom substrate, and reserving a pad opening on the top of the bottom substrate for interconnection with the top substrate package; Step 4, placing the microfluidic structure on the bottom substrate, and applying heat dissipation glue on the surface of the bottom chip to contact the microfluidic structure, wherein the microfluidic structure is bonded to the bottom substrate by an adhesive; Step 5, interconnect the solder balls or connectors on the back of the top substrate in step 2 with the solder pads reserved on the top of the bottom substrate by reflow, and complete the ball planting under the bottom substrate.
8. The method for packaging a heat dissipation structure containing a microchannel according to claim 7, characterized in that: In step 4, the bottom of the microfluidic structure has a groove for accommodating the bottom chip.
9. The method for packaging a heat dissipation structure containing a microchannel according to claim 7, characterized in that: The width of the top substrate is smaller than the width of the micro-channel structure.
10. The method for packaging a heat dissipation structure containing a microchannel according to claim 7, characterized in that: In step 5, the top of the microfluidic structure has a groove for supporting the top substrate.