Thermal insulation chip packaging structure

Abstract

The invention relates to the technical field of chip packaging, in particular to a thermal insulation chip packaging structure. Comprising a shell, a power layer, a hollow layer, a middle partition plate, a functional layer and a sealing top, the functional layer, the hollow layer, the middle partition plate, the functional layer and the sealing top are sequentially stacked in the shell from bottom to top, the periphery of the middle partition plate is attached to the inner wall of the shell, an air inlet is formed in the middle partition plate, the hollow layer is communicated with the air inlet, and an air outlet is formed in the shell and communicated with the hollow layer. The packaging structure is changed, the middle interlayer is designed between the power layer and the functional layer, the hollow layer for air circulation is isolated, meanwhile, the air inlet and the air outlet are additionally formed in the structure, cold air enters from one end, passes through the whole power layer and then is exhausted from the air outlet, and heat dissipated by the power layer is taken away.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging, and in particular to a temperature-insulating chip packaging structure. Background Art

[0002] With the rapid development of the electronics industry, integration and miniaturization have become a trend, and the technology of vertical packaging of power circuits and functional circuits has emerged.

[0003] In order to save space as much as possible between the power circuit and the functional circuit, semi-solid / solid materials such as silicone gel, epoxy resin or polyurethane are used for potting to improve its insulation ability and ensure system safety. In the actual process, the functional circuit will generate a lot of heat, which will be dissipated through the radiator on the one hand, and will also be conducted to the PCB through the solid / semi-solid packaging material, which will inevitably cause the temperature of the functional circuit PCB to rise, and finally form a heat balance, which will cause the system life to decrease.

[0004] The thickness of the potting material between the power part and the functional part determines its thermal resistance, and thus determines the final temperature of the PCB. In order to make the PCB reach a safe temperature range, it is inevitable to increase the thickness of the potting material, which will cause a large cost increase.

[0005] After the power layer and the functional layer are packaged together, because the power layer generates more heat and has higher high-temperature resistance than the functional layer, during long-term operation, the temperature of the functional layer is often too high and the whole machine is in over-temperature protection. The main reason for this phenomenon is that the power layer transfers a large amount of heat to the functional layer. Summary of the invention

[0006] In view of the shortcomings of the prior art, the purpose of the present invention is to:

[0007] 1. Reducing the heat transferred from the power layer to the functional layer can make the functional layer more stable and operate for a long time, avoiding excessive temperature of the functional layer.

[0008] To achieve the above object, the present invention provides the following technical solutions:

[0009] A temperature-insulating chip packaging structure comprises an outer shell, a power layer, a hollow layer, a middle partition, a functional layer and a capping, wherein the functional layer, the hollow layer, the middle partition, the functional layer and the capping are stacked in sequence from bottom to top in the outer shell, the periphery of the middle partition is in contact with the inner wall of the outer shell, the middle partition is provided with an air inlet, the hollow layer is connected to the air inlet, the outer shell is provided with an air outlet, and the air outlet is connected to the hollow layer.

[0010] This solution uses air as a heat-insulating medium to prevent the heat generated by the power layer from being transferred to the functional layer, thereby reducing the overall thermal balance data of the device, making the functional layer more stable and operating for a long time, and avoiding excessive temperature of the functional layer.

[0011] Optionally, a heat insulation sticker is also provided on the side of the middle partition close to the functional layer.

[0012] The thermal insulation sticker can be made of any material with good thermal insulation performance, preferably a polyimide sticker.

[0013] Optionally, a plurality of grooves parallel to each other are provided at the contact point between the middle partition and the thermal insulation sticker.

[0014] The groove is used to increase the effective area of ​​the thermal insulation paste and is also used for positioning the device during production, prompting the robot arm or manual operation with the corresponding installation position.

[0015] Optionally, the air inlet is arranged above the middle partition, and the air inlet passes through the capping.

[0016] Optionally, the air outlet is in the shape of an elongated strip.

[0017] Optionally, a mounting groove is provided on the air inlet.

[0018] The mounting groove is used to locate the relative position of the air inlet when connected to the output end of the air pump.

[0019] Optionally, the air inlet is in the shape of a cylindrical tube.

[0020] Optionally, a base plate is also provided at the bottom of the shell.

[0021] As another optional technical solution, a second partition is further provided at the hollow layer, and the secondary partition divides the hollow layer into a primary air-cooling zone adjacent to the middle partition and a secondary air-cooling zone adjacent to the power layer.

[0022] When the heat dissipation air enters from the air inlet, it should first pass through the primary cooling zone, first absorb the heat on one side of the middle partition, then pass through the secondary cooling zone, absorb the heat on one side of the power layer, and then be discharged from the air outlet. This design helps to keep the temperature on one side of the middle partition at a lower state and reduce the heat transferred from the air medium to the middle partition from the air inlet to the air outlet.

[0023] Optionally, the shell does not have the aforementioned air outlet, and the air outlet is arranged on the second partition plate, and the air outlet extends out from the air inlet.

[0024] This design uses the original air inlet pipe as the installation position of the air outlet. When in use, the corresponding air cooling equipment needs to be connected to the air inlet pipe and the air outlet pipe. The advantage of this design is that the air medium that absorbs the heat of the power layer will not come into direct contact with the middle partition through the overlapping design of the air inlet and the air outlet. At the same time, the design of the air outlet is omitted, so that the device produced by this technical solution can be arranged tightly.

[0025] Optionally, when in use, an air pump can be connected to the air outlet, and the air inlet is connected to the outside atmosphere. The cooling air enters the air inlet from the outside atmosphere, flows from the air inlet to the primary air cooling area and absorbs the heat on one side of the middle partition, and then sinks into the secondary air cooling area after passing through the primary air cooling area to absorb the heat on one side of the power layer, and finally is pumped out by the air pump through the air outlet pipe to complete the heat dissipation.

[0026] The beneficial technical effect of the present invention is: by changing the packaging structure, a middle partition layer is designed between the power layer and the functional layer to isolate a hollow layer for air circulation, and at the same time, an air inlet and an exhaust port are added to the structure to allow cold air to enter at one end, pass through the entire power layer, and then be discharged from the exhaust port, taking away the heat dissipated by the power layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic diagram of the three-dimensional structure of Example 1 of the present invention;

[0028] Figure 2 This is a schematic diagram of the structure of the middle partition in Example 1 of the present invention;

[0029] Figure 3 It is a side partial cross-sectional view of Example 1 of the present invention;

[0030] Figure 4 Schematic diagram of the cross-sectional structure of the middle partition in Example 1 of the present invention;

[0031] Figure 5 It is a side partial cross-sectional view of Example 2 of the present invention;

[0032] Figure 6 It is a schematic diagram of the cross-sectional structure of the middle partition and the secondary partition in Example 2 of the present invention.

[0033] Figure numbers: 1-shell, 2-power layer, 3-hollow layer, 4-middle partition, 5-functional layer, 6-top, 7-air inlet, 8-air outlet, 9-installation groove, 10-thermal insulation paste, 11-primary air cooling zone, 12-secondary air cooling zone, 13-secondary partition, 14-air pump, 15-bottom plate. DETAILED DESCRIPTION

[0034] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. The same parts are represented by the same reference numerals. It should be noted that the words "front", "rear", "left", "right", "upper" and "lower" used in the following description refer to directions in the accompanying drawings, and the words "bottom surface" and "top surface", "inner" and "outer" refer to directions toward or away from the geometric center of a specific component, respectively.

[0035] Reference Figure 1-4 As shown, a thermal insulation chip packaging structure includes a housing 1, a power layer 2, a hollow layer 3, a middle partition 4, a functional layer 5 and a capping 6. The functional layer 5, the hollow layer 3, the middle partition 4, the functional layer 5 and the capping 6 are sequentially stacked from bottom to top in the housing 1. A bottom plate 15 is also provided at the bottom of the housing.

[0036] The periphery of the middle partition 4 is in contact with the inner wall of the outer shell 1. The middle partition 4 is provided with an air inlet 7, which is arranged above the middle partition 4 and penetrates the cap 6. The hollow layer 3 is connected with the air inlet 7. The outer shell 1 is provided with an air outlet 8, which is connected with the hollow layer 3. The air outlet 8 is in a long strip shape. The air inlet 7 is provided with a mounting groove 9.

[0037] A polyimide sticker is also provided on one side of the middle partition plate 4 near the functional layer 5 as a heat insulation sticker 10. A plurality of grooves parallel to each other are provided at the contact point between the middle partition plate 4 and the heat insulation sticker 10.

[0038] This solution uses air as a heat-insulating medium to prevent the heat generated by the power layer 2 from being transferred to the functional layer 5, thereby reducing the overall thermal balance data of the device, making the functional layer 5 more stable and operating for a long time, and avoiding excessive temperature of the functional layer 5. The groove on the middle partition 4 is used to increase the effective area of ​​the heat-insulating sticker 10, and is also used for positioning during device production, prompting the corresponding installation position for the robot arm or manual operation.

[0039] When in use, the output end of the air pump 14 is installed on the air inlet 7 through the mounting groove 9, and the cold air for heat dissipation enters the hollow layer 3 from the air inlet 7. The cold air contacts the power layer 2 below the hollow layer 3, absorbs heat and is discharged from the air outlet 8 to complete the heat dissipation.

[0040] Compared with the potting design in the existing design, this solution retains the vertical packaging structure while reducing the heat transferred from the power layer 2 to the functional layer 5 through active heat dissipation, which can make the functional layer 5 more stable and operate for a long time, and avoid excessive temperature of the functional layer 5.

[0041] Example 2

[0042] This embodiment 2 is a technical concept further generated based on the technical solution of embodiment 1. The difference between it and embodiment 1 is that the design of the air outlet 8 is cancelled, and an additional secondary partition 13 is added in the hollow layer 3 to divide the hollow layer 3 into a primary air-cooling zone 11 adjacent to the middle partition 4 and a secondary air-cooling zone 12 adjacent to the power layer 2.

[0043] When the heat dissipation air enters from the air inlet 7, it should first pass through the primary air cooling zone 11, first absorb the heat on one side of the middle partition 4, then pass through the secondary air cooling zone 12, absorb the heat on one side of the power layer 2, and then be discharged from the air outlet 8. This design helps to keep the temperature on one side of the middle partition 4 at a lower state, and reduce the heat transferred from the air medium to the middle partition 4 when it moves from the air inlet 7 to the air outlet 8.

[0044] This design uses the original air inlet 7 pipe as the installation position of the air outlet 8. When in use, the corresponding air cooling equipment needs to be connected to the air inlet 7 pipe and the air outlet 8 pipe. The advantage of this design is that the overlapping design of the air inlet 7 and the air outlet 8 ensures that the air medium after absorbing the heat of the power layer 2 will not come into direct contact with the middle partition 4, reducing the efficiency of the air after absorbing heat to conduct heat to the functional layer 5. At the same time, the design of the air outlet 8 is omitted, so that the device produced by this technical solution can be arranged tightly.

[0045] In the method of using the technical solution based on Example 2, the air pump can be connected to the air outlet 8 during use, and the air inlet 7 is connected to the outside atmosphere. The cooling air enters the air inlet 7 from the outside atmosphere, flows from the air inlet 7 to the primary air cooling area 11 and absorbs the heat on one side of the middle partition 4, and then sinks into the secondary air cooling area 12 after passing through the primary air cooling area 11 to absorb the heat on one side of the power layer 2, and finally is pumped out by the air pump through the air outlet 8 pipeline to complete the heat dissipation.

[0046] The above is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiments. All technical solutions under the concept of the present invention belong to the protection scope of the present invention. It should be pointed out that for ordinary technicians in this technical field, some improvements and modifications without departing from the principle of the present invention should also be regarded as the protection scope of the present invention.

Claims

1. A temperature-insulating chip packaging structure, characterized in that: It comprises an outer shell, a power layer, a hollow layer, a middle partition, a functional layer and a capping, wherein the functional layer, the hollow layer, the middle partition, the functional layer and the capping are sequentially stacked in the outer shell from bottom to top. The periphery of the middle partition is in contact with the inner wall of the outer shell, the middle partition is provided with an air inlet, the hollow layer is connected with the air inlet, the outer shell is provided with an air outlet, the air outlet is connected with the hollow layer.

2. The thermal insulation chip packaging structure according to claim 1, characterized in that: A heat insulation sticker is also arranged on one side of the middle partition close to the functional layer.

3. The thermal insulation chip packaging structure according to claim 2, characterized in that: A plurality of grooves parallel to each other are arranged at the contact point between the middle partition plate and the heat insulation sticker.

4. A temperature-insulating chip packaging structure according to any one of claims 1 to 3, characterized in that: The air inlet is arranged above the middle partition plate, and the air inlet passes through the capping.

5. A temperature-insulating chip packaging structure according to any one of claims 1 to 3, characterized in that: The air outlet is in the shape of an elongated strip.

6. A temperature-insulating chip packaging structure according to any one of claims 1 to 3, characterized in that: The bottom of the shell is also provided with a bottom plate.

7. The thermal insulation chip packaging structure according to claim 4, characterized in that: The air inlet is in a cylindrical tube shape.

8. The thermal insulation chip packaging structure according to claim 4, characterized in that: The air inlet is provided with a mounting groove.

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