Power module structure and electronic equipment

Abstract

The invention discloses a power module structure and electronic equipment, and the structure comprises a substrate which is provided with an electrode layer; a plurality of upper bridge arm switch tube elements connected in parallel, wherein the plurality of upper bridge arm switch tube elements are sequentially arranged on the electrode layer along a first arc-shaped path; the plurality of lower bridge arm switch tube elements are connected in parallel, the plurality of lower bridge arm switch tube elements are sequentially arranged on the electrode layer along a second arc-shaped path, and the upper bridge arm switch tube elements and the lower bridge arm switch tube elements are arranged in a one-to-one correspondence mode. The power module structure and the electronic equipment have good thermal performance.

Description

Technical Field

[0001] The present invention relates to the field of electronic power modules, and in particular to a power module structure and electronic equipment. Background Art

[0002] Power components are devices that reflect or detect the electrical power of a device or circuit. They are generally used in power and electrical systems to form different circuit topologies and are the core components for realizing power conversion.

[0003] The traditional power module layout structure has high parasitic inductance. The power chip is subjected to high overvoltage during the switching process, which increases the risk of overvoltage breakdown of the power chip. In order to improve the current capacity of the power module, multiple chips need to be connected in parallel in the power module. However, the existing multi-chip power modules are prone to local heat concentration and have poor thermal performance. Summary of the invention

[0004] The technical problem solved by the present invention is to provide a power module structure and an electronic device to improve thermal performance.

[0005] In order to solve the above technical problems, the technical solution of the present invention provides a power module structure, including: a substrate, which is provided with an electrode layer; a plurality of parallel upper bridge arm switch tube elements, which are sequentially arranged on the electrode layer along a first arc path; a plurality of parallel lower bridge arm switch tube elements, which are sequentially arranged on the electrode layer along a second arc path, and the upper bridge arm switch tube elements and the lower bridge arm switch tube elements are arranged in a one-to-one correspondence.

[0006] Optionally, the plurality of upper bridge arm switch tube elements are evenly spaced and distributed in a fan-shaped manner along the first arc-shaped path; and / or the plurality of lower bridge arm switch tube elements are evenly spaced and distributed in a fan-shaped manner along the second arc-shaped path.

[0007] Optionally, the plurality of upper bridge arm switch tube elements are distributed axially symmetrically, and the plurality of lower bridge arm switch tube elements are distributed axially symmetrically.

[0008] Optionally, the electrode layer includes a first AC electrode layer, a second AC electrode layer, a positive DC electrode layer, a negative DC electrode layer, a first signal electrode layer and a second signal electrode layer that are independent of each other; the upper bridge arm switch tube element is arranged on the positive DC electrode layer, and the upper bridge arm switch tube element includes a first control end and a first output end, the first control end is electrically connected to the first signal electrode layer through a first signal line, the first output end is electrically connected to the first AC electrode layer through a first power line, the first output end is electrically connected to the second AC electrode layer through a second power line, and the first power line and the second power line constitute an upper bridge arm power line group; the lower bridge arm switch tube element is arranged on the second AC electrode layer, and the lower bridge arm switch tube element includes a second control end and a second output end, the second control end is electrically connected to the second signal electrode layer through a second signal line, and the second output end is electrically connected to the negative DC electrode layer through a third power line.

[0009] Optionally, the difference in total line length between any two groups of the upper bridge arm power line groups ranges from 0 mm to 2 mm.

[0010] Optionally, the length difference between any two of the third power lines ranges from 0 mm to 4 mm.

[0011] Optionally, the first arc path and the second arc path have the same arch direction; the contours of the first AC electrode layer, the second AC electrode layer, the positive DC electrode layer, the negative DC electrode layer, the first signal electrode layer, and the second signal electrode layer are all stepped or arc-shaped, and the arch direction of the contours of the second AC electrode layer, the positive DC electrode layer, the negative DC electrode layer, the first signal electrode layer, and the second signal electrode layer is consistent with the arch direction of the first arc path.

[0012] Optionally, a resistor is connected in series between the first control end and the first signal electrode layer; and / or a resistor is connected in series between the second control end and the second signal electrode layer.

[0013] Optionally, the number of upper bridge arm switch tube elements is an odd number.

[0014] Correspondingly, the technical solution of the present invention further provides an electronic device, comprising the power module structure as described in any one of the above items.

[0015] Compared with the prior art, the technical solution of the embodiment of the present invention has the following beneficial effects:

[0016] In the power module structure and electronic device provided by the technical solution of the present invention, since a plurality of parallel upper bridge arm switch tube elements are arranged on the electrode layer along a first arc path, and a plurality of parallel lower bridge arm switch tube elements are arranged on the electrode layer along a second arc path, the upper bridge arm switch tube elements are staggered and the lower bridge arm switch tube elements are staggered, so that the upper bridge arm switch tube elements are more dispersed and the lower bridge arm switch tube elements are more dispersed, so that the heat distribution in the power module structure is uniform, thereby improving the thermal performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a three-dimensional structural diagram of a power module structure according to a first embodiment of the present invention;

[0018] Figure 2 is a schematic diagram of a top view of a power module structure according to a first embodiment of the present invention;

[0019] Figure 3 1 is a schematic structural diagram of an upper bridge arm switch tube element and a first embodiment of the present invention;

[0020] Figure 4 is a schematic structural diagram of a lower bridge arm switch tube element and a first embodiment of the present invention;

[0021] Figure 5 is a schematic structural diagram of an electrode layer according to a first embodiment of the present invention;

[0022] Figure 6 is a current waveform diagram of the power module structure in the first embodiment of the present invention;

[0023] Figure 7 This is a crosstalk waveform diagram of the power module structure in the first embodiment of the present invention.

[0024] Figure 8 is a schematic diagram of the three-dimensional structure of an electronic device according to an embodiment of the present invention;

[0025] Fig. 9 is a three-dimensional structural diagram of a power module structure according to a second embodiment of the present invention;

[0026] Fig.10 is a schematic diagram of a top view of a power module structure according to a second embodiment of the present invention;

[0027] Fig.11 is a three-dimensional structural diagram of a power module structure according to a third embodiment of the present invention;

[0028] Fig.12 is a schematic top view of a power module structure according to a third embodiment of the present invention;

[0029] Fig.13is a schematic top view of a power module structure according to a fourth embodiment of the present invention;

[0030] Fig.14 is a schematic structural diagram of an electrode layer according to a fourth embodiment of the present invention;

[0031] Fig.15 is a schematic top view of a power module structure according to a fifth embodiment of the present invention;

[0032] Fig.16 is a schematic structural diagram of an electrode layer according to a sixth embodiment of the present invention;

[0033] Fig.17 FIG. 1 is a schematic top view of a power module structure according to a seventh embodiment of the present invention.

[0034] Description of reference numerals:

[0035] 100-substrate; 110-electrode layer; 120-positive DC terminal; 130-negative DC terminal; 140-AC terminal; 200-upper bridge arm switch tube element; 210-first control terminal; 220-first output terminal; 300-lower bridge arm switch tube element; 310-second control terminal; 320-second output terminal; 410-upper bridge arm power line group; 411-first power line; 412-second power line; 421-first signal line; 422-second signal line; 430-third power line. DETAILED DESCRIPTION

[0036] As described in the background art, existing multi-chip power modules are prone to local heat concentration and have poor thermal performance.

[0037] In order to solve the above technical problems, the technical solution of the present invention provides a power module structure and an electronic device. The power module structure includes: a substrate, the substrate is provided with an electrode layer; a plurality of upper bridge arm switch tube elements connected in parallel, the plurality of upper bridge arm switch tube elements are arranged on the electrode layer along a first arc path; a plurality of lower bridge arm switch tube elements connected in parallel, the plurality of lower bridge arm switch tube elements are arranged on the electrode layer along a second arc path, and the upper bridge arm switch tube elements and the lower bridge arm switch tube elements are arranged in a one-to-one correspondence. By making a plurality of upper bridge arm switch tube elements connected in parallel be arranged on the electrode layer along the first arc path, and a plurality of lower bridge arm switch tube elements connected in parallel be arranged on the electrode layer along the second arc path, the upper bridge arm switch tube elements are staggered, and the lower bridge arm switch tube elements are staggered, so that the upper bridge arm switch tube elements are more dispersed, and the lower bridge arm switch tube elements are more dispersed, so that the heat distribution in the power module structure is uniform, thereby improving the thermal performance.

[0038] In order to make the above-mentioned objects, features and beneficial effects of the present invention more obvious and easy to understand, specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0039] [First embodiment]

[0040] Please refer to Figures 1 to 5 The power module structure 10 includes: a substrate 100, a plurality of upper bridge arm switch tube elements 200 and a plurality of lower bridge arm switch tube elements 300. The upper bridge arm switch tube elements 200 and the lower bridge arm switch tube elements 300 are arranged in a one-to-one correspondence to form a bridge arm.

[0041] The substrate 100 is provided with an electrode layer 110 .

[0042] The electrode layer 110 includes: a first AC electrode layer AC1, a second AC electrode layer AC2, a positive DC electrode layer DC+, a negative DC electrode layer DC-, a first signal electrode layer S1 and a second signal electrode layer S2.

[0043] The first AC electrode layer AC1, the second AC electrode layer AC2, the positive DC electrode layer DC+, the negative DC electrode layer DC-, the first signal electrode layer S1 and the second signal electrode layer S2 are independent of each other.

[0044] In this embodiment, the power module structure 10 further includes: a positive DC terminal 120 , a negative DC terminal 130 and an AC terminal 140 .

[0045] The positive DC terminal 120 is connected to the positive DC electrode layer DC+, and the negative DC terminal 130 is connected to the negative DC electrode layer DC-. The positive DC terminal 120 and the negative DC terminal 130 both extend out of the substrate 100, and are located on the same side of the substrate 100 and overlapped, thereby reducing parasitic inductance.

[0046] The AC terminal 140 is connected to the first AC electrode layer AC1 . The AC terminal 140 extends out of the substrate 100 and is located on a different side of the substrate 100 from the positive DC terminal 120 and the negative DC terminal 130 .

[0047] It should be noted that, for ease of understanding and explanation, Figure 1 The positive DC terminal 120 , the negative DC terminal 130 , and the AC terminal 140 are not shown.

[0048] In this embodiment, the contours of the first AC electrode layer AC1, the second AC electrode layer AC2, the positive DC electrode layer DC+, the negative DC electrode layer DC-, the first signal electrode layer S1 and the second signal electrode layer S2 are all stepped.

[0049] Multiple upper arm switch tube elements 200 are connected in parallel and sequentially arranged along the first arc path on the electrode layer 110. Thus, the upper arm switch tubes are staggered, so that the upper arm switch tubes are more dispersed, which is conducive to uniform heat distribution in the power module structure 10.

[0050] The first arc path may be an arc path such as a circular arc or an elliptical arc.

[0051] In some embodiments, a plurality of upper bridge arm switch tube elements 200 are evenly spaced and distributed in a fan-shaped manner along the first arc path. In this way, on the basis of staggered arrangement of the upper bridge arm switch tube elements 200, the distribution uniformity of the upper bridge arm switch tube elements 200 is further improved, thereby being more conducive to uniform heat distribution in the power module structure 10.

[0052] Furthermore, the plurality of upper bridge arm switch tube elements 200 are distributed in an axisymmetric manner, thereby further improving the distribution uniformity of the upper bridge arm switch tube elements 200 and further improving the uniformity of heat distribution in the power module structure 10 .

[0053] In this embodiment, the number of the upper bridge arm switch tube elements 200 is an odd number.

[0054] Specifically, the number of the upper bridge arm switch tube elements 200 is five.

[0055] In some other embodiments, the number of the upper bridge arm switch tube elements 200 may also be an even number or an odd number other than five.

[0056] The upper bridge arm switch element 200 includes but is not limited to HMET, MOSFET or IGBT.

[0057] Specifically, the upper bridge arm switch tube element 200 has an upper bridge arm switch tube element top surface and an upper bridge arm switch tube element bottom surface opposite to each other, the upper bridge arm switch tube element 200 is arranged on the positive DC electrode layer DC+, and the upper bridge arm switch tube element bottom surface is in contact with the positive DC electrode layer DC+. In addition, the upper bridge arm switch tube element 200 includes a first control terminal 210 and a first output terminal 220.

[0058] The drain of the upper arm switch tube element 200 is located at the bottom surface of the upper arm switch tube element; the first control terminal 210 and the first output terminal 220, namely the gate and source of the upper arm switch tube element 200, are located at the top surface of the upper arm switch tube element.

[0059] Further, the first control terminal 210 is electrically connected to the first signal electrode layer S1 through a first signal line 421. The first output terminal 220 is electrically connected to the first AC electrode layer AC1 through a first power line 411, and the first output terminal 220 is electrically connected to the second AC electrode layer AC2 through a second power line 412. The first power line 411 and the second power line 412 constitute an upper bridge arm power line group 410. The first power line 411, the second power line 412 and the first signal line 421 include but are not limited to connecting copper wires, bonding wires, copper ribbons and aluminum ribbons.

[0060] The upper bridge arm power line group 410 has a total line length, and the total line length of the upper bridge arm power line group 410 is: the sum of the line length of the first power line 411 and the line length of the second power line 412 in the upper bridge arm power line group 410 .

[0061] In some embodiments, the total length difference between any two groups of upper bridge arm power line groups 410 is in the range of 0 mm to 2 mm. Therefore, the total length of any two groups of upper bridge arm power line groups 410 is the same or close to the same, so that the total impedance between each upper bridge arm switch tube element 200 is equal or close to the same, which is conducive to improving current sharing and crosstalk. In addition, since the current sharing is improved, it is also conducive to improving the uniformity of heat distribution, thereby further improving the thermal performance.

[0062] Specifically, the total impedance corresponding to any upper arm switch tube element 200 is: the impedance between the positive DC terminal 120 and the drain of the upper arm switch tube element 200 plus the impedance between the source of the upper arm switch tube element 200 and the AC terminal 140 .

[0063] In this embodiment, the arching directions of the contours of the first AC electrode layer AC1, the second AC electrode layer AC2, the positive DC electrode layer DC+, the negative DC electrode layer DC-, the first signal electrode layer S1, and the second signal electrode layer S2 are consistent with and matched with the arching direction of the first arc path. Therefore, each electrode layer is more in line with the arrangement of the upper bridge arm switch tube element 200, which is conducive to shortening the line lengths of the first power line 411, the second power line 412, and the first signal line 421, thereby reducing impedance, reducing parasitic parameters, and achieving performance improvement of the power module structure 10.

[0064] Multiple lower bridge arm switch tube elements 300 are connected in parallel and sequentially arranged along the second arc path on the electrode layer 110. In this way, the lower bridge arm switch tubes are staggered, so that the lower bridge arm switch tubes are more dispersed, which is conducive to uniform heat distribution in the power module structure 10.

[0065] In this embodiment, by staggering the upper arm switch tube elements 200 and staggering the lower arm switch tube elements 300, the upper arm switch tube elements 200 are more dispersed than other arrangements such as a straight-line arrangement, and the lower arm switch tube elements 300 are more dispersed, so that the heat distribution in the power module structure 10 is uniform, thereby improving the thermal performance, reliability and power conversion efficiency.

[0066] The second arc path may be an arc path such as a circular arc or an elliptical arc.

[0067] In some embodiments, the plurality of lower bridge arm switch tube elements 300 are evenly spaced and distributed in a fan-shaped manner along the second arc path. In this way, on the basis of the staggered arrangement of the lower bridge arm switch tube elements 300, the distribution uniformity of the lower bridge arm switch tube elements 300 is further improved, thereby being more conducive to uniform heat distribution in the power module structure 10.

[0068] Furthermore, the plurality of lower bridge arm switch tube elements 300 are distributed in an axisymmetric manner, thereby further improving the distribution uniformity of the lower bridge arm switch tube elements 300 and further improving the uniformity of heat distribution in the power module structure 10 .

[0069] The lower bridge arm switch element 300 includes but is not limited to HMET, MOSFET or IGBT.

[0070] Specifically, the lower bridge arm switch tube element 300 has a lower bridge arm switch tube element top surface and a lower bridge arm switch tube element bottom surface opposite to each other, the lower bridge arm switch tube element 300 is disposed on the second AC electrode layer AC2, and the lower bridge arm switch tube element bottom surface is in contact with the second AC electrode layer AC2. In addition, the lower bridge arm switch tube element 300 includes a second control terminal 310 and a second output terminal 320.

[0071] The drain of the lower arm switch tube element 300 is located at the bottom surface of the lower arm switch tube element; the second control terminal 310 and the second output terminal 320, namely the gate and source of the lower arm switch tube element 300, are located at the top surface of the lower arm switch tube element.

[0072] Furthermore, the second control terminal 310 is electrically connected to the second signal electrode layer S2 via a second signal line 422, and the second output terminal 320 is electrically connected to the negative DC electrode layer DC- via a third power line 430. The second signal line 422 and the third power line 430 include but are not limited to connecting copper wires, bonding wires, copper ribbons, and aluminum ribbons.

[0073] In some embodiments, the length difference between any two third power lines 430 ranges from 0 mm to 4 mm. Therefore, the lengths of any two third power lines 430 are the same or close to the same, so that the impedances between the lower bridge arm switch tube elements 300 are equal or close to the same, which is beneficial to improving the current sharing and crosstalk. In addition, since the current sharing is improved, it is also beneficial to improve the uniformity of heat distribution, thereby further improving the thermal performance.

[0074] Specifically, the impedance corresponding to any lower arm switch element 300 is: the impedance between the AC terminal 140 and the drain of the lower arm switch element 300 plus the impedance between the source of the lower arm switch element 300 and the negative DC terminal 130 .

[0075] In this embodiment, the first arcuate path and the second arcuate path have the same arching direction.

[0076] Furthermore, the arching directions of the contours of the second AC electrode layer AC2, the negative DC electrode layer DC-, and the second signal electrode layer S2 are consistent with and adapted to the second arc path. Therefore, each electrode layer is more in line with the arrangement of the lower bridge arm switch tube element 300, thereby facilitating shortening the length of the third power line 430 and the second signal line 422, thereby reducing impedance, reducing parasitic parameters, and achieving performance improvement of the power module structure 10.

[0077] Figure 6 : is a current waveform diagram of the power module structure in the first embodiment of the present invention, such as Figure 6 As shown, in the power module structure of this embodiment, the current difference of each parallel upper bridge arm switch tube element 200 and the current difference of each parallel lower bridge arm switch tube element 300 are both less than 1.05 times, while the prior art is usually more than 1.5 times, so the current sharing is significantly improved.

[0078] Figure 7 : is a crosstalk waveform diagram of the power module structure in the first embodiment of the present invention, such as Figure 7 As shown, the crosstalk amplitude of the power module structure of this embodiment is about 0.3V, which is significantly improved compared with the crosstalk of the prior art. Usually the threshold voltage of the chip is 2.5V, and the crosstalk amplitude in this embodiment is much smaller than the threshold voltage of the chip, so there is no risk of mis-conduction.

[0079] Accordingly, an embodiment of the present invention further provides an electronic device, please refer to Figure 8 , the electronic device includes a plurality of power module structures 10.

[0080] [Second embodiment]

[0081] This embodiment is a modified embodiment of the first embodiment.

[0082] Please refer to Fig. 9 and Fig.10 The main difference between this embodiment and the first embodiment is that the number of upper bridge arm switch tube elements 200 and the number of lower bridge arm switch tube elements 300 are different.

[0083] In this embodiment, the number of the upper bridge arm switch tube elements 200 is three, and the number of the lower bridge arm switch tube elements 300 is three.

[0084] [Third embodiment]

[0085] This embodiment is a modified embodiment of the first embodiment.

[0086] Please refer to Fig.11 and Fig.12 The main difference between this embodiment and the first embodiment is that the number of upper bridge arm switch tube elements 200 and the number of lower bridge arm switch tube elements 300 are different.

[0087] In this embodiment, the number of the upper bridge arm switch tube elements 200 is an even number. Specifically, the number of the upper bridge arm switch tube elements 200 is 6, and the number of the lower bridge arm switch tube elements 300 is 6.

[0088] [Fourth embodiment]

[0089] This embodiment is a modified embodiment of the first embodiment.

[0090] Please refer to Fig.13 and Fig.14 The main difference between this embodiment and the first embodiment is that in this embodiment, the outline of the first AC electrode layer AC1, the outline of the second AC electrode layer AC2, the outline of the positive DC electrode layer DC+, the outline of the negative DC electrode layer DC-, the outline of the first signal electrode layer S1 and the outline of the second signal electrode layer S2 are all rectangular.

[0091] [Fifth embodiment]

[0092] This embodiment is a modified embodiment of the third embodiment.

[0093] Please refer to Fig.15 The main difference between this embodiment and the third embodiment is that in this embodiment, the outline of the first AC electrode layer AC1, the outline of the second AC electrode layer AC2, the outline of the positive DC electrode layer DC+, the outline of the negative DC electrode layer DC-, the outline of the first signal electrode layer S1 and the outline of the second signal electrode layer S2 are all rectangular.

[0094] [Sixth embodiment]

[0095] This embodiment is a modified embodiment of the first embodiment.

[0096] Please refer to Fig.16 The main difference between this embodiment and the first embodiment is that in this embodiment, the contour of the first AC electrode layer AC1, the contour of the second AC electrode layer AC2, the contour of the positive DC electrode layer DC+, the contour of the negative DC electrode layer DC-, the contour of the first signal electrode layer S1 and the contour of the second signal electrode layer S2 are all arc-shaped.

[0097] [Seventh embodiment]

[0098] This embodiment is a modified embodiment of the first embodiment.

[0099] Please refer to Fig.17 The main difference between this embodiment and the first embodiment is that:

[0100] In this embodiment, a resistor R1 is connected in series between the first control terminal 210 and the first signal electrode layer S1, and a resistor R2 is connected in series between the second control terminal 220 and the second signal electrode layer S2.

[0101] In some other embodiments, a resistor R1 is connected in series between the first control terminal 210 and the first signal electrode layer S1 , or a resistor R2 is connected in series between the second control terminal 220 and the second signal electrode layer S2 .

[0102] Although the present invention is disclosed as above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope defined by the claims.

Claims

1. A power module structure, characterized in that: include: A substrate, wherein the substrate is provided with an electrode layer; A plurality of upper bridge arm switch tube elements connected in parallel, wherein the plurality of upper bridge arm switch tube elements are sequentially arranged on the electrode layer along a first arc path; A plurality of lower bridge arm switch tube elements are connected in parallel, wherein the plurality of lower bridge arm switch tube elements are sequentially arranged on the electrode layer along a second arc path, and the upper bridge arm switch tube elements are arranged in a one-to-one correspondence with the lower bridge arm switch tube elements.

2. The power module structure according to claim 1, characterized in that: The plurality of upper bridge arm switch tube elements are evenly spaced and distributed in a fan shape along the first arc-shaped path; and / or the plurality of lower bridge arm switch tube elements are evenly spaced and distributed in a fan shape along the second arc-shaped path.

3. The power module structure according to claim 2, characterized in that: The plurality of upper bridge arm switch tube elements are distributed in an axisymmetric manner, and the plurality of lower bridge arm switch tube elements are distributed in an axisymmetric manner.

4. The power module structure according to claim 1, characterized in that: The electrode layer includes a first AC electrode layer, a second AC electrode layer, a positive DC electrode layer, a negative DC electrode layer, a first signal electrode layer and a second signal electrode layer which are independent of each other; The upper bridge arm switch tube element is arranged on the positive DC electrode layer, and the upper bridge arm switch tube element comprises a first control end and a first output end, the first control end is electrically connected to the first signal electrode layer through a first signal line, the first output end is electrically connected to the first AC electrode layer through a first power line, the first output end is electrically connected to the second AC electrode layer through a second power line, and the first power line and the second power line constitute an upper bridge arm power line group; The lower bridge arm switch tube element is arranged on the second AC electrode layer, and the lower bridge arm switch tube element includes a second control end and a second output end, the second control end is electrically connected to the second signal electrode layer through a second signal line, and the second output end is electrically connected to the negative DC electrode layer through a third power line.

5. The power module structure according to claim 4, characterized in that: The difference in total line length between any two groups of upper bridge arm power line groups ranges from 0 mm to 2 mm.

6. The power module structure according to claim 4, characterized in that: The length difference between any two of the third power lines ranges from 0 mm to 4 mm.

7. The power module structure according to any one of claims 4 to 6, characterized in that: The first arc-shaped path and the second arc-shaped path have the same arching direction; The contours of the first AC electrode layer, the second AC electrode layer, the positive DC electrode layer, the negative DC electrode layer, the first signal electrode layer, and the second signal electrode layer are all stepped or arc-shaped, and the arching direction of the contours of the second AC electrode layer, the positive DC electrode layer, the negative DC electrode layer, the first signal electrode layer, and the second signal electrode layer is consistent with the arching direction of the first arc path.

8. The power module structure according to claim 4, characterized in that: A resistor is connected in series between the first control end and the first signal electrode layer; and / or a resistor is connected in series between the second control end and the second signal electrode layer.

9. The power module structure according to claim 1, characterized in that: The number of the upper bridge arm switch tube elements is an odd number.

10. An electronic device, characterized in that: include: A power module structure as claimed in any one of claims 1 to 9.

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