Circuit board module and network equipment

Abstract

The invention provides a circuit board module and network equipment, and relates to the technical field of electronics. A circuit board module comprises a bottom plate, a signal transceiver is arranged on the edge of one side of the bottom plate, and an input power supply is arranged on the edge of the other side of the bottom plate; the high-speed signal board is electrically connected with the bottom board, and a signal connector is arranged on the high-speed signal board; the power board is electrically connected with the bottom board and the high-speed signal board, a voltage conversion circuit is arranged on the power board, the power board receives the input voltage provided by the bottom board, voltage conversion is carried out on the input voltage through the voltage conversion circuit, and the working voltage formed after conversion is transmitted to the high-speed signal board; wherein the bottom plate, the power supply plate and the high-speed signal plate are stacked, and the signal connector on the high-speed signal plate is communicated with the signal transceiver on the bottom plate. Through the circuit board module, the power supply flexibility of the network equipment can be improved.

Description

Technical Field

[0001] The present specification relates to the field of communication technology, and in particular to a circuit board module and a network device. Background Art

[0002] With the development of network technology, more and more electronic devices are used in network equipment. In a network device, multiple voltages need to be converted for power supply. In a network device, the external input voltage is first connected to the mainboard of the network device, and then connected to the powered device after voltage conversion by the voltage conversion circuit.

[0003] On the motherboard, power transmission in the circuit board will cause losses, especially low-voltage long-distance power transmission. In order to reduce the loss of power transmission, the power supply or power conversion circuit needs to be as close to the powered device as possible. However, when the high-speed signal processing is set on the pinch board and the size of the pinch board is limited, it is difficult to implement the required power supply or power conversion circuit on the pinch board. Therefore, how to achieve power supply of multiple voltages under space constraints is an urgent problem to be solved by technical personnel in this field. Summary of the invention

[0004] In order to overcome the problems existing in the related art, this specification provides a circuit board module and a network device.

[0005] According to a first aspect of an embodiment of this specification, a circuit board module is provided, including:

[0006] A bottom plate, wherein a signal transceiver is arranged on one edge of the bottom plate, and an input power supply is arranged on the other edge of the bottom plate;

[0007] A high-speed signal board, electrically connected to the base board, and a signal connector is arranged on the high-speed signal board;

[0008] A power board, electrically connected to the base board and the high-speed signal board respectively, a voltage conversion circuit is arranged on the power board, the power board receives an input voltage provided by the base board, performs voltage conversion on the input voltage through the voltage conversion circuit, and transmits the converted working voltage to the high-speed signal board;

[0009] The base plate, the power plate and the high-speed signal plate are stacked, and the signal connector on the high-speed signal plate is connected to the signal transceiver on the base plate.

[0010] Optionally, the base plate comprises:

[0011] A power supply area, used to connect to an input power supply;

[0012] A first hollow area is arranged in the middle of the bottom plate;

[0013] A power supply connector, arranged at a corner of the first hollow area, and electrically connected to the power area through a power layer formed in the bottom plate;

[0014] The power board comprises:

[0015] A power receiving connector, arranged at a corner of the first surface of the power board, corresponding to the power supply connector;

[0016] A voltage conversion circuit is disposed between the power supply and receiving connectors and close to the outer edge of the power board;

[0017] The chip power supply connector is arranged in the middle of the second surface of the power board and corresponds to the chip power supply pin of the high-speed signal board.

[0018] Optionally, the voltage conversion circuit is disposed in the first hollow area.

[0019] Furthermore, the base plate further includes:

[0020] At least two second hollow areas are arranged on the outer peripheral side of the first hollow area, and the signal connector arranged on the surface of the high-speed signal board opposite to the chip is penetrated through the second hollow area.

[0021] Furthermore, a signal connector disposed on the surface of the high-speed signal board on the side opposite to the chip is connected to a signal transceiver located on the bottom surface of the base plate through a signal transmission line passing through the second hollow area.

[0022] Furthermore, a pinch plate connector is provided between the base plate and the high-speed signal plate;

[0023] The pinch plate connector is disposed outside the second hollow area, and the base plate and the high-speed signal board are electrically connected via the pinch plate connector.

[0024] Furthermore, the power supply connector is arranged in the first area of ​​the base plate, and the power receiving connector is arranged in the second area of ​​the power board;

[0025] At least one of the first area and the second area is formed with a depth control groove, through which the depth control groove ensures that the sum of the height of the power supply connector and the power receiving connector after connection and the height from the first surface of the power board to the bottom surface of the high-speed signal board is not less than the height of the pinch plate connector.

[0026] Optionally, the chip on the high-speed signal board corresponds to the first hollow area.

[0027] Furthermore, the base plate further includes:

[0028] At least two second hollow areas are arranged on the outer peripheral side of the first hollow area, and the signal connector arranged on the surface of the high-speed signal board on the side where the chip is arranged passes through the second hollow area.

[0029] Furthermore, a signal connector disposed on the surface of the high-speed signal board on one side of which the chip is disposed is connected to a signal transceiver located on the bottom surface of the base plate through a signal transmission line passing through the second hollow area.

[0030] According to a second aspect of an embodiment of this specification, a network device is provided, comprising a circuit board module as described in any one of the above items.

[0031] The technical solutions provided by the embodiments of this specification may have the following beneficial effects:

[0032] In the embodiments of the present specification, in a network device, a circuit board module is composed of a base plate, a high-speed signal board and a power board. The power board is respectively connected to the base plate and the high-speed signal board. The power on the base plate is transmitted to the power board for voltage conversion, and then the power board transmits the converted voltage to the high-speed signal board for use. This avoids the size limitation of the high-speed signal board and the difficulty in setting up the voltage conversion circuit, thereby improving the flexibility of power supply in the network device.

[0033] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present specification. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the specification and, together with the description, serve to explain the principles of the specification.

[0035] Figure 1 It is a structural schematic diagram of a bottom plate in a circuit board module involved in an embodiment of the present application;

[0036] Figure 2 : is a schematic diagram of the structure of a high-speed signal board in a circuit board module involved in an embodiment of the present application, wherein: Figure 2 (A) is a schematic diagram of a high-speed signal board with a chip on one side of the surface. Figure 2 (B) is a schematic diagram of a surface on the opposite side of the high-speed signal board where a chip is arranged;

[0037] Figure 3 is a schematic diagram of the structure of a power board in a circuit board module involved in an embodiment of the present application, wherein: Figure 3 (A) is a schematic diagram of the first surface of the power board, Figure 3 (B) is a schematic diagram of the second surface of the power board;

[0038] Figure 4 It is a structural schematic diagram of a circuit board module involved in an embodiment of the present application;

[0039] Figure 5 It is a partial structural schematic diagram of a circuit board module involved in an embodiment of the present application;

[0040] Figure 6 : is a schematic diagram of the structure of a high-speed signal board in a circuit board module involved in an embodiment of the present application, wherein: Figure 6 (A) is a schematic diagram of a high-speed signal board with a chip on one side of the surface. Figure 6 (B) is a schematic diagram of the opposite side surface of the high-speed signal board where the chip is arranged. DETAILED DESCRIPTION

[0041] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementations described in the following exemplary embodiments do not represent all implementations consistent with this specification. Instead, they are merely examples of devices and methods consistent with some aspects of this specification as detailed in the appended claims.

[0042] The terms used in this specification are for the purpose of describing specific embodiments only and are not intended to limit this specification. The singular forms "a", "the" and "the" used in this specification and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items.

[0043] It should be understood that although the terms first, second, third, etc. may be used in this specification to describe various information, this information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of this specification, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining".

[0044] The present application provides a circuit board module 100, such as Figure 1-4 As shown, including:

[0045] Base plate 1, such as Figure 1 As shown, a signal transceiver 10 is provided on one side edge of the bottom plate 1, and an input power supply 11 is provided on the other side edge;

[0046] High-speed signal board 2, such as Figure 2 As shown, it is electrically connected to the base plate 1, and a signal connector 20 is provided on the high-speed signal board 2;

[0047] Power board 3, such as Figure 3 As shown, they are electrically connected to the base plate 1 and the high-speed signal plate 2 respectively, and a voltage conversion circuit 30 is arranged on the power supply plate 3. The power supply plate 3 receives the input voltage provided by the base plate 1, converts the input voltage through the voltage conversion circuit 30, and transmits the converted working voltage to the high-speed signal plate 2;

[0048] Among them, Figure 4 As shown, the base plate 1, the power board 3 and the high-speed signal board 2 are stacked, and the signal connector 20 on the high-speed signal board 2 is connected to the signal transceiver 10 on the base plate.

[0049] Figure 1 is a schematic diagram of the structure of the base plate 1, Figure 2 It is a structural diagram of the high-speed signal board 2. Figure 3 is a schematic diagram of the structure of the power board 3, Figure 4 Schematic diagram of the structure of the circuit board module 100 formed by plugging the base plate 1, the high-speed signal board 2 and the power board 3. Figure 2 (A) is a schematic diagram of a surface 2A on one side of a high-speed signal board 2, Figure 2 (B) is a schematic diagram of the surface 2B on the other side of the high-speed signal board 2, Figure 3 (A) is a schematic diagram of the first surface 3A side of the power board 3, Figure 3 (B) is a schematic diagram of the second surface 3B side of the power board 3.

[0050] In the network device, a circuit board module 100 is provided, and the circuit board module 100 refers to a whole formed by installing and connecting a plurality of circuit boards with different functions.

[0051] On a circuit board, long-distance transmission of low voltage will result in greater transmission loss. Therefore, in the circuit board module 100 , the power board 3 is provided as an independent circuit board so that it can be provided closer to the high-speed signal board 2 .

[0052] The power board 3 can be directly plugged into the base plate 1 through a plug-in connector, or an electrical connection can be achieved across a certain distance through a cable connector. It can be set according to actual needs and there is no limitation to this.

[0053] In the circuit board module 100, the base plate 1 is arranged at the bottom layer as an overall support, and the stacking position relationship between the high-speed signal board 2 and the power board 3 depends on the specific structure. For example, the high-speed signal board 2, the power board 3 and the base plate 1 can be stacked in sequence from top to bottom, or the power board 3, the high-speed signal board 2 and the base plate 1 can be stacked in sequence from top to bottom, and there is no limitation on this.

[0054] The input power of the network device is connected to the bottom plate 1 and transmitted to the power connector provided on the bottom plate 1 and connected to the power board 3 through the power layer formed in the circuit board of the bottom plate 1. The input voltage provided by the input power is transmitted to the power board 3 through the power connector.

[0055] Multiple types of voltage conversion circuits 30, also called BUCK circuits, can be provided on the power board 3 to realize the conversion between direct currents of different voltages. Each type of voltage conversion circuit 30 can perform different voltage conversions, such as converting the input voltage into the working voltage, which can generally include 12 volts, etc. The working voltage can include 12 volts, 3.3 volts, 1 volt, 0.9 volts and 0.8 volts, etc., and there is no limitation on this. If the selected working voltage includes 12 volts, which is the same as the input voltage, the input voltage can be provided to the high-speed signal board 2 through the power board 3 without voltage conversion.

[0056] Through the above-mentioned circuit board module 100, the voltage conversion circuit and the high-speed signal board can be separated, thereby avoiding the problem that when the high-speed signal board 2 requires a variety of voltage power supply, the size of the high-speed signal board 2 is limited and insufficient to be set. In addition, the power supply board 3 is connected to the base plate 1 to receive power supply through a separately set power supply board 3, and the converted power supply is output to the high-speed signal board 2 for use through the voltage conversion circuit set by itself. When the power supply board 3 and the high-speed signal board 2 are close to each other, the power supply loss of the converted voltage is small, which reduces the power supply loss and improves the flexibility of power supply in the network equipment.

[0057] It should be noted that the signal transceiver 10 can be an optical transceiver or a combination of an electrical network interface and one end of a cable connector. The signal connector 20 can be an optical engine or the other end of a cable connector. The signal transmission line between the signal transceiver 10 and the signal connector 20 can be an optical fiber or a signal cable. It can be set according to actual needs without any limitation.

[0058] Specifically, the bottom plate 1, such as Figure 1 , 4 As shown, including:

[0059] The power supply area 12 is used to connect to the input power supply 11. The power supply area 12 can be a connection area for the input power supply or a connection area for a large current transmission device such as a bus bar. It can be set according to actual needs and there is no restriction on this. Figure 1 The figure only shows the approximate position of the power supply area 12 by way of example, and is not intended to limit the form of the power supply area 12;

[0060] The first hollow area 13 is arranged in the middle of the bottom plate 1, wherein the middle refers to the middle position on the bottom plate 1, and is not limited to being located in the middle of the bottom plate 1, and can be arranged eccentrically on the bottom plate 1;

[0061] The power supply connector 14 is arranged at a corner 15 of the first hollow area 13 (to avoid confusion, only one corner is marked), and is electrically connected to the power area 12 through a power layer formed in the base plate 1. The base plate 1 can also be a pressed circuit board formed by a multi-layer substrate. Circuit traces, such as signal lines, power lines, and ground lines, can be pre-formed on each layer of the circuit board. A power layer with a whole surface covered with copper (or other conductive materials) can be formed on at least one layer of the base plate 1. The corner can refer to the range around the four corners of the first hollow area 13. Taking the rectangle formed by the outer contour of the first hollow area 13 as an example, the corner 15 can refer to the area outside the four corners of the rectangle, or it can refer to the area of ​​the four corners inside the rectangle. It can be set according to actual needs. Figure 1 As shown in , four power supply connectors 14 are provided, and each power supply connector 14 is located at a corner position in the first hollow area 13;

[0062] The power board 3, such as Figure 3 , 4 As shown, including:

[0063] The power receiving connector 31 is arranged at the corner 32 of the first surface 3A of the power board 3, corresponding to the power supply connector 14. In order to make the power supply more uniform, the power receiving connector 31 and the power supply connector 14 can be provided with multiple, such as Figure 2 As shown, the position of the power receiving connector 31 corresponds to the position of the power supply connector 14, that is, when the base plate 1 and the power board 3 are stacked, the power receiving connector 31 overlaps the power supply connector 14 in the vertical direction;

[0064] The voltage conversion circuit 30 is arranged between the power supply receiving connectors 31, close to the outer edge of the power board 3, wherein being arranged between the voltage conversion circuit 30 means being arranged between a plurality of power supply receiving connectors 31. The voltage conversion circuit 30 is similar to the voltage conversion circuit currently used, and will not be described in detail. The voltage conversion circuit 30 may include multiple types, for example, a voltage conversion circuit is required to convert 12 volts to 3.3 volts, and another voltage conversion circuit is required to convert 12 volts to 1 volt. Of course, according to actual needs, multiple voltage conversion circuits for converting the same voltage may also be provided, and there is no limitation to this. In order to reduce the loss caused during the current transmission process, generally speaking, a voltage conversion circuit 30 of an output voltage will be close to the power supply position corresponding to the chip 21;

[0065] The chip power supply connector 33 is disposed in the middle of the second surface 3B of the power board 3 , corresponding to the chip power supply pin 21A of the high-speed signal board 2 .

[0066] A chip 21 is plugged into the high-speed signal board 2. The chip 21 refers to a chip for data processing and forwarding. The chip 21 includes a chip power pin 21A and a chip signal pin 21B. The chip signal pin 21B is led out to the signal connector 20 on the high-speed signal board 2 through a signal line 22 inside the high-speed signal board 2. The chip power pin 21A is guided from one side surface of the high-speed signal board 2 to the pad on the other side surface of the high-speed signal board 2 through a power line 23 inside the high-speed signal board 2, so that the chip power pin 21A can be closer to one side of the power board 3. Figure 2 (A) and Figure 2 In (B), the approximate range of the chip power pin 21A and the chip signal pin 21B is shown by way of example, and is not intended to be a specific limitation on the location of the pins.

[0067] On the power board 3, the chip power connector 33 can be implemented in a variety of forms. For example, the chip power connector 33 can be formed on the second surface 3B of the power board 3, and the chip power connector 33 can be a pad formed on the second surface 3B, and the chip power connector 33 and the pad connected to the chip power pin of the high-speed signal board 2 are directly connected by welding. In addition, the chip power connector 33 can also be a connecting pin formed on one side of the power board 3 or the high-speed signal board 2, and a connecting hole matched with the connecting pin is formed on the other side. The connecting hole can be a conductive through hole, and the chip power pin and the connecting pin are respectively plugged into the connecting hole to achieve conduction, and welding can be performed in the connecting hole to achieve reliable connection between the power pin and the connecting pin in the connecting hole.

[0068] Optionally, the voltage conversion circuit 30 is disposed in the first hollow area 13 .

[0069] like Figure 4 As shown, in the vertical direction, the high-speed signal board 2, the power board 3 and the bottom board 1 are arranged in sequence from top to bottom, the first surface 3A of the power board 3 is arranged toward the bottom board 1, and the second surface 3B of the power board 3 is arranged toward the high-speed signal board 2. In this way, the voltage conversion circuit 30 located on the first surface 3A of the power board 3 can be inserted into the first hollow area 13, and the overall height of the bottom board 1 and the power board 3 plugged into the bottom board 1 is reduced, and the high-speed signal board 2 can also be connected to the power board 3 at a lower height, thereby reducing the overall height of the circuit board module, and increasing the layout space in the network device that accommodates the circuit board module.

[0070] Optionally, the bottom plate 1, such as Figure 1 , 4 As shown, it also includes:

[0071] At least two second hollow areas 16 are arranged on the outer peripheral side of the first hollow area 13 , and the signal connector 20 arranged on the surface of the high-speed signal board 2 opposite to the chip 21 is penetrated through the second hollow areas 16 .

[0072] In some cases, the network device may be provided with a large number of signal transceivers 10. Correspondingly, the high-speed signal board 2 also needs to be provided with a large number of signal connectors 20 connected to the signal transceivers 10. Since the size of the high-speed signal board 2 is limited, when the number of signal connectors 20 increases, it is necessary to respectively provide signal connectors 20 on both sides of the high-speed signal board 2, such as Figure 4 As shown, a signal connector 20 is disposed on a surface 2B on the high-speed signal board 2 opposite to the chip 21 and on a surface 2A on one side of the chip 21 .

[0073] In order to avoid the problem of insufficient distance between the high-speed signal board 2 and the base plate 1 to meet the height of the signal connector 20, a second hollow area 16 corresponding to the signal connector 20 located on the surface 2B side of the high-speed signal board 2 needs to be opened on the base plate 1. The number of the second hollow areas 16 can correspond to the number of signal connectors 20 set on the surface 2B.

[0074] The second hollow area 16 is arranged so as to avoid the first hollow area 13 , the power area 12 , the connector between the base plate 1 and the high-speed signal board 2 , and the pillars 19 supporting the high-speed signal board 2 and / or the power board 3 .

[0075] Furthermore, the signal connector 20 disposed on the surface 2B of the high-speed signal board 2 opposite to the chip 21 is connected to the signal transceiver 10 located on the bottom surface 1B of the base plate 1 through the signal transmission line 24 passing through the second hollow area 16 .

[0076] When the signal connector 20 and the signal transceiver 10 are connected via a signal transmission line 24, in order to avoid the devices arranged on the base plate 1 to achieve the signal connection between the signal connector 20 and the signal transceiver 10, the signal transmission line 24 can be passed through the second hollow area 16 from the upper side of the base plate 1 and connected from the lower side of the base plate 1 to the signal transceiver 10 located on the lower surface 1B of the base plate 1.

[0077] Optionally, a pinch plate connector 17 is provided between the base plate 1 and the high-speed signal plate 2;

[0078] The pinch board connector 17 is disposed outside the second hollow area 16 , and the base plate 1 and the high-speed signal board 2 are electrically connected via the pinch board connector 17 .

[0079] The pinch board connector 17 can realize the transmission of signals from the base board 1 to the high-speed signal board 2, and can also realize the power supply from the input power source 11 to the high-speed signal board 2. The pinch board connector 17 can include a male connector and a female connector for plugging.

[0080] Further, such as Figure 5 As shown, the power supply connector 14 is arranged in the first area of ​​the base plate 1, and the power receiving connector 31 is arranged in the second area of ​​the power board 3, the first area corresponds to the corner 15 on the base plate 1, and the second area corresponds to the corner 32 of the power board 3;

[0081] At least one of the first area and the second area is formed with a depth control groove 18 (35), and the depth control groove 18 (35) ensures that the sum of the height h1 of the power supply connector 14 and the power receiving connector 31 after connection and the height h2 from the first surface 3A of the power board 3 to the bottom surface 2B of the high-speed signal board 2 is not less than the height H of the pinch board connector 17.

[0082] exist Figure 5In the figure, part of the structure of the base plate 1 is omitted to show the size relationship more clearly. The size of the power supply connector 14 and the power receiving connector 31 may be large. After the two are connected, the high-speed signal board 2 will be too far away from the base plate 1, making it impossible to reliably plug in the buckle plate connector 17. Since the size of the power supply connector 14 and the power receiving connector 31 is difficult to adjust, in order to avoid the above problems, it is necessary to reduce the size of the power supply connector 14 and the power receiving connector 31, that is, to reduce the size of the base plate 1 and / or the power board 3 in the first area and the second area. During preparation, the thickness of the first area and the second area can be thinned by controlled depth milling. In this way, after the power board 3 is plugged into the base plate 1, the high-speed signal board 2 and the base plate 1 can be reliably plugged in while avoiding interference between the devices on the high-speed signal board 2 and the power board 3.

[0083] Optional, such as Figure 6 As shown, the chip 21 on the high-speed signal board 2 corresponds to the first hollow area 13 .

[0084] In other cases, in the circuit board module 100, the power board 3, the high-speed signal board 2 and the bottom board 1 are arranged in sequence from top to bottom, that is, different from Figure 2 , 4 , the power board 3 is arranged above the high-speed signal board 2. The chip 21 of the high-speed signal board 2 needs to face the bottom board 1, corresponding to the first hollow area 13. Figure 6 (A) is a schematic diagram of the surface 2A on which the chip 21 is provided. Figure 6 (B) is a schematic diagram of the surface 2B on the opposite side where the chip 21 is provided. Figure 6 (A) Figure 6 (B) with Figure 2 (A) Figure 2 (B) The chip soldering position is reversed.

[0085] At this time, the power board 3 is arranged above the high-speed signal board 2, and the voltage conversion circuit 30 can be arranged upward, that is, away from the side of the bottom plate 1, to prevent the voltage conversion circuit 30 from blocking the signal connector 20 of the high-speed signal board 2 and the signal cable connected to the signal connector 20, but this will slightly increase the height of the circuit board module 100. Of course, the voltage conversion circuit 30 can also be arranged toward the bottom plate 1, but the size of the power board 3 needs to be enlarged so that a certain space can be left on the outside of the voltage conversion circuit 30 for the signal connector 20 and the signal cable connected to the signal connector 20. This can slightly reduce the height of the circuit board module 100, but it will increase the difficulty of layout of the components on the bottom plate 1 and the high-speed signal board 2 in the circuit board module 100. The specific settings can be adjusted according to actual needs and are not limited here.

[0086] In this case, the chip 21 on the high-speed signal board 2 corresponds to the first hollow area 13, which means that the position of the first hollow area 13 corresponds to the chip 21, and the first hollow area 13 can make the size of the chip 21 or the power supply area (chip capacitor layout area) of the chip 21.

[0087] Optionally, the base plate 1 further includes:

[0088] At least two second hollow areas 16 are arranged on the outer peripheral side of the first hollow area 13 , and the signal connector 20 arranged on the surface 21A of the high-speed signal board 2 on the side where the chip 21 is arranged passes through the second hollow areas 16 .

[0089] The signal connector 20 disposed on the surface 21A of one side of the chip 21 passes through the second hollow area 16. Based on the structural change of the high-speed signal board 2, the structures of the base board 1 and the power board 3 are adaptively changed, which will not be described again.

[0090] Furthermore, the signal connector 20 disposed on the surface 21A of the high-speed signal board 2 on the side where the chip 21 is disposed is connected to the signal transceiver 10 located on the bottom surface 1B of the base plate 1 through the signal transmission line 24 passing through the second hollow area 16 .

[0091] Relative to Figure 6 As shown, when the signal connector 20 arranged on the surface 21A of the high-speed signal board 2 is passed through the second hollow area 16, the signal transmission line 24 connected to the signal connector 20 can pass through the second hollow area 16 and extend from the bottom surface 1B of the base plate 1 to the signal transceiver 10 arranged on the bottom surface 1B of the base plate 1, thereby avoiding the signal transmission line 24 from passing through the top surface 1A of the base plate 1 and occupying the space of the top surface 1A of the base plate 1.

[0092] Correspondingly, the present application also provides a network device, such as Figure 4 As shown, it includes a circuit board module as described in any one of the above items.

[0093] The technical solutions provided by the embodiments of this specification may have the following beneficial effects:

[0094] In the embodiments of the present specification, in a network device, a circuit board module is composed of a base plate, a high-speed signal board and a power board. The power board is respectively connected to the base plate and the high-speed signal board. The power on the base plate is transmitted to the power board for voltage conversion, and then the power board transmits the converted voltage to the high-speed signal board for use. This avoids the size limitation of the high-speed signal board and the difficulty in setting up the voltage conversion circuit, improves the flexibility of power supply in the network device, and can reduce the transmission loss of the network device and improve the power supply efficiency of the network device.

[0095] The implementation process of the functions and effects of each module in the above-mentioned device is specifically described in the implementation process of the corresponding steps in the above-mentioned method, which will not be repeated here.

[0096] For the device embodiment, since it basically corresponds to the method embodiment, the relevant parts can refer to the partial description of the method embodiment. The device embodiment described above is only schematic, wherein the modules described as separate components may or may not be physically separated, and the components displayed as modules may or may not be physical modules, that is, they may be located in one place, or they may be distributed on multiple network modules. Some or all of the modules may be selected according to actual needs to achieve the purpose of the scheme of this specification. A person of ordinary skill in the art can understand and implement it without paying creative labor.

[0097] Those skilled in the art will readily appreciate other embodiments of the specification after considering the specification and practicing the invention claimed herein. The specification is intended to cover any variations, uses or adaptations of the specification that follow the general principles of the specification and include common knowledge or customary techniques in the art that are not claimed in the specification. The specification and examples are to be considered exemplary only, and the true scope and spirit of the specification are indicated by the following claims.

[0098] It should be understood that the present description is not limited to the precise structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present description is limited only by the appended claims.

[0099] The above description is only a preferred embodiment of this specification and is not intended to limit this specification. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of this specification should be included in the scope of protection of this specification.

Claims

1. A circuit board module, characterized in that: include: A bottom plate, wherein a signal transceiver is arranged on one edge of the bottom plate, and an input power supply is arranged on the other edge of the bottom plate; A high-speed signal board, electrically connected to the base board, and a signal connector is arranged on the high-speed signal board; A power board, electrically connected to the base board and the high-speed signal board respectively, a voltage conversion circuit is arranged on the power board, the power board receives an input voltage provided by the base board, performs voltage conversion on the input voltage through the voltage conversion circuit, and transmits the converted working voltage to the high-speed signal board; The base plate, the power plate and the high-speed signal plate are stacked, and the signal connector on the high-speed signal plate is connected to the signal transceiver on the base plate.

2. The circuit board module according to claim 1, characterized in that: The base plate comprises: A power supply area, used to connect to an input power supply; A first hollow area is arranged in the middle of the bottom plate; A power supply connector, arranged at a corner of the first hollow area, and electrically connected to the power area through a power layer formed in the bottom plate; The power board comprises: A power receiving connector, arranged at a corner of the first surface of the power board, corresponding to the power supply connector; A voltage conversion circuit is disposed between the power supply and receiving connectors and close to the outer edge of the power board; The chip power supply connector is arranged in the middle of the second surface of the power board and corresponds to the chip power supply pin of the high-speed signal board.

3. The circuit board module according to claim 2, characterized in that: The voltage conversion circuit is disposed in the first hollow area.

4. The circuit board module according to claim 3, characterized in that: The base plate further comprises: At least two second hollow areas are arranged on the outer peripheral side of the first hollow area, and the signal connector arranged on the surface of the high-speed signal board opposite to the chip is penetrated through the second hollow area.

5. The circuit board module according to claim 4, characterized in that: The signal connector arranged on the surface of the high-speed signal board on the side opposite to the chip is connected to the signal transceiver located on the bottom surface of the base plate through a signal transmission line passing through the second hollow area.

6. The circuit board module according to claim 4, characterized in that: A pinch plate connector is provided between the base plate and the high-speed signal plate; The pinch plate connector is disposed outside the second hollow area, and the base plate and the high-speed signal board are electrically connected via the pinch plate connector.

7. The circuit board module according to claim 6, characterized in that: The power supply connector is arranged in the first area of ​​the base plate, and the power receiving connector is arranged in the second area of ​​the power board; At least one of the first area and the second area is formed with a depth control groove, through which the depth control groove ensures that the sum of the height of the power supply connector and the power receiving connector after connection and the height from the first surface of the power board to the bottom surface of the high-speed signal board is not less than the height of the pinch plate connector.

8. The circuit board module according to claim 2, characterized in that: The chip on the high-speed signal board corresponds to the first hollow area.

9. The circuit board module according to claim 8, characterized in that: The base plate further comprises: At least two second hollow areas are arranged on the outer peripheral side of the first hollow area, and the signal connector arranged on the surface of the high-speed signal board on the side where the chip is arranged passes through the second hollow area.

10. The circuit board module according to claim 9, characterized in that: The signal connector disposed on the surface of the high-speed signal board on the side where the chip is disposed is connected to the signal transceiver located on the bottom surface of the base plate through a signal transmission line passing through the second hollow area.

11. A network device, characterized in that: A circuit board module comprising any one of claims 1-10.

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