Computing device and server cabinet

Abstract

The invention provides computing equipment and a server cabinet, and relates to the technical field of servers, the computing equipment comprises a machine shell, a first internal cold plate, a first mainboard and a second mainboard, the first internal cold plate, the first mainboard and the second mainboard are located in the machine shell, a first central processing unit is arranged on the side face of the first mainboard, and a second central processing unit is arranged on the side face of the second mainboard. The first central processing unit is attached to the first surface of the first internal cold plate; a second central processing unit is arranged on the side face of the second mainboard and attached to the second face of the first internal cold plate. The first internal cold plate is used for cooling the first central processing unit and the second central processing unit. According to the method provided by the embodiment of the invention, the computing power of the server cabinet can be improved.

Description

Technical Field

[0001] The present application relates to the technical field of servers, and in particular to a computing device and a server cabinet. Background Art

[0002] A server cabinet, also called a rack or cabinet, is a physical frame or structure that can be used to store and organize computer servers and other network equipment.

[0003] In the related art, multiple computing devices can be installed in a server cabinet, and the air cooling system can be used to assist the processor of the computing device in dissipating heat. However, the demand for computing power is currently growing exponentially, and the computing power demand of the computing devices that need to be installed in the server cabinet is increasing. The fans of the air cooling system occupy more space in the server cabinet, resulting in a lower computing power increase in the server cabinet. Summary of the invention

[0004] The embodiments of the present application provide computing equipment and a server cabinet to achieve the effect of improving the computing power of the server cabinet.

[0005] In a first aspect, an embodiment of the present application provides a computing device, comprising a housing, a first internal cold plate, a first main board, and a second main board, wherein the first internal cold plate, the first main board, and the second main board are respectively located inside the housing, wherein:

[0006] A first central processing unit is disposed on a side surface of the first mainboard, and the first central processing unit is disposed in contact with a first surface of the first internal cold plate;

[0007] A second central processing unit is disposed on the side surface of the second mainboard, and the second central processing unit is disposed in contact with the second surface of the first internal cold plate;

[0008] The first internal cold plate is used to cool the first central processing unit and the second central processing unit.

[0009] In a possible implementation, the computing device further includes a heat generating device, a second internal cold plate and a third internal cold plate, the heat generating device is between the second internal cold plate and the third internal cold plate, wherein:

[0010] The second internal cold plate and the third internal cold plate are used to cool the heating device;

[0011] The heating device, the second internal cold plate and the third internal cold plate are located at one end of the first internal cold plate, and a difference between a center height of the heating device and a center height of the first internal cold plate is less than or equal to a preset threshold.

[0012] In one possible implementation,

[0013] The thickness of the first internal cold plate is greater than the thickness of the second internal cold plate;

[0014] The thickness of the first internal cold plate is greater than the thickness of the third internal cold plate;

[0015] The second inner cold plate and the third inner cold plate have the same thickness.

[0016] In one possible implementation,

[0017] One end of the first internal cold plate is in communication with one end of the second internal cold plate, so that the coolant in the first internal cold plate and the coolant in the second internal cold plate can communicate with each other;

[0018] One end of the first internal cold plate is in communication with one end of the third internal cold plate, so that the coolants in the first internal cold plate and the third internal cold plate can communicate with each other.

[0019] In a possible implementation, the computing device further includes a plurality of memory modules, and the first motherboard includes a first surface and a second surface, wherein:

[0020] M memory modules among the plurality of memory modules are arranged flatly on the first surface of the first mainboard, where M is an integer greater than 1;

[0021] N memory modules among the multiple memory modules are arranged flatly on the second surface of the first mainboard, N is an integer greater than or equal to 1, and the second surface is the surface where the first central processing unit is arranged.

[0022] In one possible implementation,

[0023] The second internal cold plate is further used to cool down at least one memory module in the first mainboard and arranged toward the second internal cold plate;

[0024] The third internal cold plate is further used to cool down at least one memory module in the second mainboard that is disposed toward the third internal cold plate.

[0025] In a possible implementation, the housing includes a first outer cold plate and a second outer cold plate, the first outer cold plate is connected to the first inner cold plate, and the second outer cold plate is connected to the first inner cold plate, wherein:

[0026] The first outer cold plate is used to cool down a plurality of memory modules in the first mainboard and arranged toward the first outer cold plate;

[0027] The second outer cold plate is used to cool down a plurality of memory modules in the second mainboard that are arranged toward the second outer cold plate.

[0028] In a possible implementation, the memory module includes a memory mainboard and a plurality of memory particles, the plurality of memory particles correspond to two data channels, and the data channels are used for data transmission of the memory module.

[0029] In a possible implementation, the computing device further includes a first microcontroller and a second microcontroller, wherein the first microcontroller is disposed on the second surface of the first mainboard, and the second microcontroller is disposed on the second surface of the second mainboard, wherein:

[0030] The first microcontroller contacts a first side surface of the first internal cold plate, and the second microcontroller contacts a second side surface of the first internal cold plate. The first side surface and the second side surface are symmetric surfaces of the first internal cold plate.

[0031] In a second aspect, an embodiment of the present application provides a server cabinet, which includes a power management device, any multiple computing devices described in the above embodiments, and a switching node, wherein the switching node is connected to the multiple computing devices, wherein the power management device is used to increase the power supply for the server cabinet; and the switching node is used for interconnection between an internal network and an external network.

[0032] The computing device and server cabinet provided by the embodiment of the present application, the computing device may include a casing, a first internal cold plate, a first mainboard and a second mainboard, and the first internal cold plate, the first mainboard and the second mainboard are respectively located inside the casing. A first central processing unit is arranged on the side of the first mainboard, and the first central processing unit is arranged in abutment with the first surface of the first internal cold plate; a second central processing unit is arranged on the side of the second mainboard, and the second central processing unit is arranged in abutment with the second side of the first internal cold plate; the first internal cold plate is used to cool the first central processing unit and the second central processing unit. A cold plate can be used to replace a fan for heat dissipation, thereby reducing the volume of the chassis, so that more computing devices can be installed in the server cabinet, and the computing power density of the server cabinet is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0034] Figure 1 A schematic diagram of an application scenario provided by an embodiment of the present application;

[0035] Figure 2 A schematic diagram of the architecture of a computing device provided in an embodiment of the present application;

[0036] Figure 3A A schematic diagram of the layout of a first mainboard provided in an embodiment of the present application;

[0037] Figure 3B A schematic diagram of the layout of a second mainboard provided in an embodiment of the present application;

[0038] Figure 4 A schematic diagram of another layout of a first mainboard provided in an embodiment of the present application;

[0039] Figure 5 A system topology diagram of a server cabinet provided in an embodiment of the present application.

[0040] The above drawings have shown clear embodiments of the present application, which will be described in more detail later. These drawings and text descriptions are not intended to limit the scope of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0041] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0042] The terms "first", "second", etc. in the specification and claims of this application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described herein, and the objects distinguished by "first", "second", etc. are generally of the same type, and the number of objects is not limited. For example, the first object can be one or more.

[0043] In addition, the term "and / or" in this article is only a description of the association relationship between the associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0044] The terms "at least one (item)", "at least one of" and the like in the specification and claims of this application refer to any one, any two or a combination of more than two of the objects included therein. For example, at least one (item) of a, b, and c can be represented by: "a", "b", "c", "a and b", "a and c", "b and c" and "a, b and c", where a, b, and c can be single or multiple. Similarly, "at least two (items)" refers to two or more, and its meaning is similar to that of "at least one (item)".

[0045] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0046] First, the terms involved in this application are explained:

[0047] Data Center: A data center is a specially designed facility that houses computer systems and their related components, such as telecommunications and storage systems. It provides support such as power, cooling, security, and network connectivity to ensure the proper functioning of the equipment. A data center can contain multiple server cabinets, providing a centralized environment to manage and operate a large number of servers.

[0048] Server cabinet: A server cabinet, also known as a rack, is a frame used to mount and organize servers and other network equipment. It provides physical support, ventilation, and security protection. Server cabinets are usually placed in data centers and can be used to store multiple server chassis, which can optimize space utilization and equipment management.

[0049] Server chassis: The server chassis is the outer shell of the server, which contains all the internal components, such as the motherboard, CPU, memory, hard disk and power supply. It provides physical protection and structural support. The computing device provided in this application may include a server chassis and a server.

[0050] Central Processing Unit (CPU): The CPU is the core processing unit of a computer, responsible for executing instructions and processing data. It is one of the most important components in a server and determines the computing power of the server. The CPU is installed on the motherboard inside the server chassis and performs the computing tasks of the server.

[0051] Cold Plate: A sealed heat sink that allows for the flow of liquid, usually bonded to the heat generating device through a thermally conductive interface material, thereby removing heat from the heat generating device.

[0052] Multiple server cabinets can be placed in a data center. The data center can provide centralized computing resources and services by organizing and managing multiple server cabinets. Each server cabinet can include multiple computing devices. The computing devices are the core computing devices of the data center. The computing devices can be responsible for processing data, running applications, and providing various services (such as web services, database services, etc.). Among them, computing devices are called computing nodes or computing units.

[0053] In the related art, an air cooling system can be used to assist the processor of a computing device in dissipating heat. The air cooling system can use fans to push air to take away the heat from the processor. However, the demand for computing power is currently growing exponentially. The computing power demand of computing devices that need to be installed in server cabinets is increasing. The fans of the air cooling system occupy more space of computing devices, resulting in fewer computing devices that can be installed in the server cabinet, resulting in a lower computing power density of the server cabinet.

[0054] The computing device provided in the embodiment of the present application can use a cold plate instead of a fan for heat dissipation, thereby reducing the volume of the computing device, allowing more computing devices to be installed in the server cabinet, and improving the computing power density of the server cabinet.

[0055] Figure 1 This is a schematic diagram of an application scenario provided by an embodiment of the present application. Figure 1 The server cabinet 100 may include multiple computing devices 101, multiple switching nodes 102, and at least one power management device 103. A computing device 101 may occupy a height of 1U. The server cabinet 100 has a total height of 45U, a width of 540 millimeters (mm), and a depth of 1200 millimeters (mm), where "U" refers to the height specification of the computing device. 1U represents a rack unit (Unit), which is approximately equal to 1.75 inches (about 4.45 centimeters). In a data center or server cabinet, the height of the equipment is usually measured in U units.

[0056] 42 computing devices 101 out of the plurality of computing devices 101 may be arranged on the first side of the server cabinet 100, and 38 computing devices 101 out of the plurality of computing devices 101 may be arranged on the second side of the server cabinet 100, wherein 6 switching nodes 102 may be arranged on the second side of the server cabinet 100, and two switching nodes 102 may be arranged at a height of 1U.

[0057] A power management device 103 is provided at the bottom of the first side and the bottom of the second side of the server cabinet 100. The power management device 103 can be used to centrally power the server cabinet 100, and the power management device 103 can convert a 380V alternating current (VC) power supply into a 54V direct current (DC) power supply.

[0058] The server cabinet 100 also includes a cable tree, a power distribution system, and a manifold. The cable tree is used to organize and manage the structure of the cables in the cabinet, which can provide a clear cable path and simplify the installation, maintenance and replacement of the cables. The power distribution system can distribute power from the main power input of the cabinet to various devices (e.g., computing devices). The manifold can distribute cooling liquid to various cold plates in the cabinet (e.g., the first internal cold plate, etc.). The cable tree, the power distribution system, and the manifold can be set in the middle of the first side and the second side of the server cabinet 100.

[0059] The computing device provided in the embodiment of the present application may include a housing, a first internal cold plate, a first mainboard, and a second mainboard, wherein the first internal cold plate, the first mainboard, and the second mainboard are respectively located inside the housing. A first central processing unit is arranged on the side of the first mainboard, and the first central processing unit is arranged in abutment with the first surface of the first internal cold plate; a second central processing unit is arranged on the side of the second mainboard, and the second central processing unit is arranged in abutment with the second surface of the first internal cold plate; the first internal cold plate is used to cool the first central processing unit and the second central processing unit. A cold plate can be used to replace a fan for heat dissipation, thereby reducing the volume of the chassis, so that more computing devices can be installed in the server cabinet, and the computing power density of the server cabinet is improved.

[0060] The technical solution of the present application and how the technical solution of the present application solves the above-mentioned technical problems are described in detail below with specific embodiments. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. The embodiments of the present application will be described below in conjunction with the accompanying drawings.

[0061] Figure 2 This is a schematic diagram of the architecture of a computing device provided in an embodiment of the present application. Figure 2 The computing device may include a housing, a first internal cold plate, a first main board, and a second main board. The first internal cold plate, the first main board, and the second main board are respectively located inside the housing.

[0062] A first central processing unit is disposed on a side surface of the first mainboard, a first CPU slot may be disposed on the first mainboard, and the first central processing unit may be inserted into the first mainboard through the first CPU slot. The first central processing unit is disposed in contact with a first side surface of the first internal cold plate.

[0063] A second central processing unit is arranged on the side of the second mainboard, a second CPU slot can be arranged on the second mainboard, and the second central processing unit can be inserted into the second mainboard through the second CPU slot. The second central processing unit is arranged in close contact with the second side of the first internal cold plate.

[0064] The first internal cold plate can be connected to a liquid supply main line, and the liquid supply main line can distribute cooling liquid to the first internal cold plate to achieve the flow of liquid inside the first internal cold plate. The first internal cold plate can be used to cool the first central processing unit and the second central processing unit. In the embodiment of the present application, the specific structure and working principle of the first internal cold plate are not described in detail.

[0065] Cold plates can be used instead of fans for heat dissipation, reducing the size of the chassis, allowing more computing devices to be installed in the server cabinet, thereby improving the computing power density of the server cabinet.

[0066] In some embodiments, the computing device further includes a heat generating device, a second internal cold plate and a third internal cold plate, the heat generating device is between the second internal cold plate and the third internal cold plate, and the second internal cold plate and the third internal cold plate can be used to cool the heat generating device.

[0067] See also Figure 2 The heating device, the second internal cold plate and the third internal cold plate can be located at one end of the first internal cold plate, and the difference between the center height of the heating device and the center height of the first internal cold plate is less than or equal to a preset threshold.

[0068] The heat generating device may be an Open Compute Project (OCP) or a hard disk or other heat generating device other than a CPU and a memory module. For example, the hard disk may be an M.2 hard disk, where "M.2" is an interface standard, originally known as Next Generation Form Factor (NGFF), and the M.2 interface may be used to connect a solid state drive (SSD) and other devices.

[0069] While the first central processing unit and the second central processing unit are cooled by the first internal cold plate, the heat generating device can be cooled by the second internal cold plate and the third internal cold plate, thereby improving the heat dissipation efficiency of the computing device.

[0070] Since the CPU has a high power, the CPU generates a lot of heat, and the thickness of the first internal cold plate may be greater than the thickness of the second internal cold plate and the third internal cold plate.

[0071] To facilitate production and unify specifications, the thickness of the second internal cold plate and the third internal cold plate may be the same.

[0072] For example, the first inner cold plate may be 10 mm thick, the second inner cold plate may be 4 mm thick, and the third inner cold plate may be 4 mm thick.

[0073] The thickness of the second internal cold plate and the thickness of the third internal cold plate are smaller than the thickness of the first internal cold plate, which can reduce the height of the computing device occupied by the second internal cold plate and the third internal cold plate, allowing the computing device to install more memory modules in a limited space, thereby improving the storage capacity of the computing device.

[0074] In some possible embodiments, one end of the first internal cold plate is connected to one end of the second internal cold plate so that the coolant in the first internal cold plate and the second internal cold plate can communicate with each other; one end of the first internal cold plate is connected to one end of the third internal cold plate so that the coolant in the first internal cold plate and the third internal cold plate can communicate with each other.

[0075] See also Figure 2 The right ends of the second internal cold plate and the third internal cold plate are aligned, the heating device is arranged between the second internal cold plate and the third internal cold plate, the thickness of the first internal cold plate is greater than the thickness of the second internal cold plate, the thickness of the first internal cold plate is greater than the thickness of the third internal cold plate, the right end of the second internal cold plate is interconnected with the left end of the first internal cold plate, and the right end of the third internal cold plate is interconnected with the left end of the first internal cold plate.

[0076] When the main liquid supply line provides cooling liquid for the first internal cold plate connection, the cooling liquid can flow through the first internal cold plate, the second internal cold plate and the third internal cold plate through the connecting part, which can simplify the liquid supply path and reduce the space occupied by the liquid supply path.

[0077] See also Figure 2 The computing device also includes multiple memory modules, and the first motherboard includes a first surface and a second surface, wherein M memory modules among the multiple memory modules are arranged flatly on the first surface of the first motherboard, and M is an integer greater than 1; N memory modules among the multiple memory modules are arranged flatly on the second surface of the first motherboard, and N is an integer greater than or equal to 1, and the second surface of the first motherboard is a surface for setting the first central processing unit.

[0078] The height occupied by the memory module is less than that of the first central processing unit, so that there can be space between the second internal cold plate and the first motherboard, which can be used to lay the memory modules flat on the first motherboard, thereby increasing the number of memory modules set on the first motherboard.

[0079] The memory module can be connected to the first mainboard via a Compression Attached Memory Module 2 (CAMM2) connector.

[0080] Compared to a vertically inserted dual in-line memory module (DIMM) connector, the CAMM2 connector reduces the occupied height in a computing device, thereby reducing the occupied height of the computing device.

[0081] The second internal cold plate is also used to cool down at least one memory module in the first mainboard and arranged toward the second internal cold plate. The third internal cold plate is also used to cool down at least one memory module in the second mainboard and arranged toward the third internal cold plate.

[0082] See also Figure 2 , since the thickness of the first internal cold plate is greater than the thickness of the second internal cold plate and the third internal cold plate, and the first central processing unit is inserted into the first mainboard through the first CPU socket and occupies a certain height, and the second central processing unit is inserted into the second mainboard through the second CPU socket and occupies a certain height. The occupied height of the second internal cold plate, the heating device, and the third internal cold plate at one end of the first internal cold plate is less than the occupied height of the first CPU socket, the first central processing unit, the first internal cold plate, the second central processing unit, and the second CPU socket. Therefore, when N memory modules are arranged on the second side of the first mainboard, the N memory modules can be arranged between the first mainboard and the second internal cold plate. When N memory modules are arranged on the first side of the second mainboard, the N memory modules can be arranged between the second mainboard and the third internal cold plate. The second internal cold plate can cool down at least one memory module arranged on the second internal cold plate in the first mainboard, and the third internal cold plate can cool down at least one memory module arranged on the second mainboard toward the third internal cold plate.

[0083] In some possible embodiments, a housing of a computing device may include a first outer cold plate and a second outer cold plate, the first outer cold plate being connected to the first inner cold plate, and the second outer cold plate being connected to the first inner cold plate, wherein the first outer cold plate is used to cool a plurality of memory modules in a first mainboard and arranged toward the first outer cold plate; and the second outer cold plate is used to cool a plurality of memory modules in a second mainboard and arranged toward the second outer cold plate.

[0084] See also Figure 2 , M memory modules are arranged flatly on the first surface of the first mainboard, the first surface of the first mainboard is the surface of the first mainboard facing the first outer cold plate, and the M memory modules of the first mainboard can be cooled by the first outer cold plate. M memory modules are arranged flatly on the first surface of the second mainboard, the first surface of the second mainboard is the surface of the second mainboard facing the second outer cold plate, and the M memory modules of the second mainboard can be cooled by the second outer cold plate.

[0085] Since the power consumption of the memory module is lower than that of the CPU, the heat generated by the memory module is lower than that of the CPU, and the thickness of the first outer cold plate and the second outer cold plate can be smaller than the thickness of the first inner cold plate.

[0086] In addition, one end of the first outer cold plate is connected to one end of the first inner cold plate so that the coolant in the first outer cold plate and the first inner cold plate can communicate with each other; one end of the second outer cold plate is connected to one end of the first inner cold plate so that the coolant in the second outer cold plate and the first inner cold plate can communicate with each other.

[0087] In some possible embodiments, the first outer cold plate and the second outer cold plate may be connected to a main liquid supply line respectively, and cooling liquid may be directly supplied to the first outer cold plate and the second outer cold plate through the main liquid supply line.

[0088] The first outer cold plate and the second outer cold plate can replace the housing to realize a "chassis-less" design of the computing device, thereby improving the efficiency of the cooling process of the computing device.

[0089] In some embodiments, the memory module may include a memory motherboard and a plurality of memory particles, and the plurality of memory particles correspond to two data channels.

[0090] Memory chips refer to the basic memory chips used to make memory modules. Memory chips are semiconductor chips that can store and retrieve data.

[0091] The memory cell may be a data bit memory cell or an error correction code (Error Correction Code, ECC) memory cell. The data bit memory cell may be used to store actual data bits, and the ECC memory cell may be used to store an error correction code.

[0092] The data channel can be a channel, which can be used for data transmission of the memory module. One data channel can correspond to half of the memory chips in the multiple memory chips. For example, assuming that the memory module has 40 memory chips in total and 2 data channels in total, data channel 1 corresponds to 20 memory chips, and the 20 memory chips include 16 data bit memory chips and 4 ECC memory chips. If the memory size of each data bit memory chip is 8GB, the memory size of each data channel is 128GB. Data channel 2 corresponds to the other 20 memory chips.

[0093] In some embodiments, multiple memory chips can be arranged on the front and back sides of the memory module. For example, 40 memory chips can be arranged on each side of the memory module, and 40 memory chips can be arranged in one memory module.

[0094] Setting two data channels in the memory module can improve the data transmission efficiency of the memory module and improve the data processing efficiency of the computing device.

[0095] The computing device also includes a first microcontroller and a second microcontroller, wherein the first microcontroller is arranged on the second side of the first mainboard, and the second microcontroller is arranged on the second side of the second mainboard, wherein the first microcontroller contacts one side of the first internal cold plate, and the second microcontroller contacts the other side of the first internal cold plate.

[0096] For ease of understanding, below, combined Figure 3A and Figure 3B , a layout diagram of the first main board and the second main board provided in an embodiment of the present application is described.

[0097] Figure 3A A schematic diagram of the layout of a first mainboard provided in an embodiment of the present application. Figure 3A , Figure 3A The first side and the second side of the first mainboard are schematic diagrams, wherein the first side is the side of the first mainboard where the first central processing unit is not arranged, and the second side is the side of the first mainboard where the first central processing unit is arranged.

[0098] A complex programmable logic device (CPLD) and two memory modules are arranged on the first surface of the first mainboard, and the first central processing unit inserted into the second surface of the first mainboard is located between the two memory modules.

[0099] The first central processing unit and four memory modules are arranged on the second side of the first motherboard. Six CPU voltage regulators (VR) are also arranged on the second side of the first motherboard. The CPU VR is responsible for providing a stable and appropriate voltage for the first central processing unit. A PCIe bus is also arranged on the second side of the first motherboard. The PCIe bus can connect the heating device through a high-density connector. A first baseboard management controller (BMC) is also arranged on the second side of the first motherboard. The first BMC can be responsible for managing and monitoring the status of the system hardware.

[0100] Figure 3B A schematic diagram of the layout of a second mainboard provided in an embodiment of the present application. Figure 3B , Figure 3B Schematic diagrams of the first and second sides of the second main board. The layout of the schematic diagram of the first side of the second main board can be found in Figure 3A The first side schematic diagram of the first motherboard in FIG. 1 is not repeated here. The layout of the second side schematic diagram of the second motherboard can be seen in FIG. Figure 3AA schematic diagram of the second surface of the first main board in the figure, wherein the second BMC of the second main board and the first BMC of the first main board are staggered in position so that the first BMC contacts the first side surface of the first internal cold plate and the second BMC contacts the second side surface of the second internal cold plate.

[0101] The first BMC and the second BMC are arranged at positions that are staggered with each other, so that there is no structural interference between the first BMC and the second BMC, and the height of the computing device can be reduced.

[0102] The computing device improved in the present application can set the first mainboard on the surface of the first central processing unit, and the second mainboard on the surface of the second central processing unit, sandwich the first internal cold plate, the second internal cold plate, the third internal cold plate, and the heating device in the middle, and stagger the first BMC and the second BMC to form a "sandwich" structure, which can reduce the height of the computing device, so that more computing devices can be installed in the server cabinet, thereby improving the computing power density of the server cabinet.

[0103] The computing device provided in the embodiment of the present application can use a cold plate instead of a fan for heat dissipation, reduce the volume of the chassis, allow more computing devices to be installed in the server cabinet, improve the computing power density of the server cabinet, effectively compress the floor space of the server cabinet in the computer room, and improve the utilization rate of the cabinet space in the computer room.

[0104] Figure 4 This is another schematic diagram of the layout of the first mainboard provided in the embodiment of the present application. Figure 4 , Figure 4 Schematic diagrams of the first and second sides of the first mainboard. Figure 3A Based on the first schematic diagram, two memory modules are set. The first motherboard has a total of 8 memory modules, each with two channels, which can achieve 16 channels supported by the CPU. The layout of the second schematic diagram of the first motherboard can be seen in Figure 3A The second side schematic diagram of the first main board is shown in FIG.

[0105] In one possible embodiment, a server cabinet may include a power management device, any multiple computing devices in the above embodiments, and a switching node, wherein the switching node is connected to multiple computing devices, wherein the power management device is used to increase power supply for the server cabinet; and the switching node is used to interconnect an internal network and an external network.

[0106] The internal space of general computing equipment can be compressed by improving memory modules, using large cold plates for heat dissipation, and other methods to achieve ultra-high-density device node configuration. The simplicity and efficiency of the computing equipment design can be ensured by centralized power supply through power management devices, improving the chassis structure of computing equipment, and other methods. At the same time, a unique "sandwich" structure, multi-layer cold plates and chassis-free design are used to compress the internal space of computing equipment to the extreme, allowing server cabinets to achieve high density and liquid cooling.

[0107] Figure 5 A system topology diagram of a server cabinet provided in an embodiment of the present application. Figure 5 The server cabinet includes multiple computing devices, each of which may include a first mainboard and a second mainboard. The first mainboard is provided with a first central processing unit and a first heating device, and a second central processing unit and a second heating device may be provided between the first central processing unit and the first heating device via the second mainboard.

[0108] The first central processor and the second central processor can communicate with each other through high-speed interconnection technology, and the first central processor can be connected to the switching node through a first network interface controller (NIC) and a first interface. The second central processor can be connected to the switching node through a second NIC and a second interface.

[0109] The first central processor may be connected to the first NIC via a serial-to-parallel converter (serders), and the first NIC is connected to the first interface via the serders. The second central processor may be connected to the second NIC via the serders, and the second NIC is connected to the second interface via the serders.

[0110] When the first interface and the second interface can be connected to the interactive node through a cable, since multiple computing devices require multiple cables to be connected to the interactive node, the multiple cables can be protected by a cable tray.

[0111] The server cabinet can exchange information with the upper-layer switch through the high-density optical module interface (Quad Small Form-factor Pluggable Double Density, QSFP-DD) of the switching node.

[0112] It should also be noted that the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, commodity or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, commodity or device. In the absence of more restrictions, the elements defined by the sentence "comprises a ..." do not exclude the existence of other identical elements in the process, method, commodity or device including the elements.

[0113] The above are only embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included within the scope of the claims of the present application.

Claims

1. A computing device, characterized in that: The invention comprises a housing, a first internal cold plate, a first main board and a second main board, wherein the first internal cold plate, the first main board and the second main board are respectively located inside the housing, wherein: A first central processing unit is disposed on a side surface of the first mainboard, and the first central processing unit is disposed in contact with a first surface of the first internal cold plate; A second central processing unit is disposed on the side surface of the second mainboard, and the second central processing unit is disposed in contact with the second surface of the first internal cold plate; The first internal cold plate is used to cool the first central processing unit and the second central processing unit.

2. The computing device according to claim 1, wherein: The computing device further includes a heat generating device, a second internal cold plate, and a third internal cold plate, wherein the heat generating device is between the second internal cold plate and the third internal cold plate, wherein: The second internal cold plate and the third internal cold plate are used to cool the heating device; The heating device, the second internal cold plate and the third internal cold plate are located at one end of the first internal cold plate, and a difference between a center height of the heating device and a center height of the first internal cold plate is less than or equal to a preset threshold.

3. The computing device according to claim 2, characterized in that The thickness of the first internal cold plate is greater than the thickness of the second internal cold plate; The thickness of the first internal cold plate is greater than the thickness of the third internal cold plate; The second inner cold plate and the third inner cold plate have the same thickness.

4. The computing device according to claim 2, wherein: One end of the first internal cold plate is in communication with one end of the second internal cold plate, so that the coolant in the first internal cold plate and the coolant in the second internal cold plate can communicate with each other; One end of the first internal cold plate is in communication with one end of the third internal cold plate, so that the coolants in the first internal cold plate and the third internal cold plate can communicate with each other.

5. The computing device according to claim 4, characterized in that The computing device further includes a plurality of memory modules, the first motherboard includes a first surface and a second surface, wherein: M memory modules among the plurality of memory modules are arranged flatly on the first surface of the first mainboard, where M is an integer greater than 1; N memory modules among the multiple memory modules are arranged flatly on the second surface of the first mainboard, N is an integer greater than or equal to 1, and the second surface is the surface where the first central processing unit is arranged.

6. The computing device according to any one of claims 2 to 5, characterized in that: The second internal cold plate is further used to cool down at least one memory module in the first mainboard and arranged toward the second internal cold plate; The third internal cold plate is further used to cool down at least one memory module in the second mainboard that is disposed toward the third internal cold plate.

7. The computing device according to any one of claims 1 to 6, characterized in that: The housing includes a first outer cold plate and a second outer cold plate, the first outer cold plate is connected to the first inner cold plate, and the second outer cold plate is connected to the first inner cold plate, wherein: The first outer cold plate is used to cool down a plurality of memory modules in the first mainboard and arranged toward the first outer cold plate; The second outer cold plate is used to cool down a plurality of memory modules in the second mainboard that are arranged toward the second outer cold plate.

8. The computing device according to claim 7, characterized in that The memory module includes a memory mainboard and a plurality of memory particles, the plurality of memory particles correspond to two data channels, and the data channels are used for data transmission of the memory module.

9. The computing device according to any one of claims 1 to 8, characterized in that: The computing device further includes a first microcontroller and a second microcontroller, wherein the first microcontroller is disposed on the second surface of the first mainboard, and the second microcontroller is disposed on the second surface of the second mainboard, wherein: The first microcontroller contacts a first side surface of the first internal cold plate, and the second microcontroller contacts a second side surface of the first internal cold plate. The first side surface and the second side surface are symmetric surfaces of the first internal cold plate.

10. A server cabinet, characterized in that: The server cabinet includes a power management device, a plurality of computing devices as described in claims 1-9, and a switching node, wherein the switching node is connected to the plurality of computing devices, wherein the power management device is used to increase power supply for the server cabinet; and the switching node is used to interconnect an internal network and an external network.

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