High-speed glue dipping chip mounter

Abstract

The invention discloses a high-speed glue dipping chip mounter which comprises a machine base, and a glue dipping module, a substrate motion platform module, a material taking adjusting module, a wafer motion platform module and a chip mounting module are arranged on the machine base. The substrate motion platform module is used for placing a substrate to be dipped with glue and pasted; the glue dipping module is used for carrying out glue dipping treatment on the substrate on the substrate movement platform module; the wafer motion platform module is used for placing a chip to be subjected to chip mounting; the material taking adjusting module is used for obtaining the chip from the wafer motion platform module and adjusting the position of the chip; and the chip mounting module is used for moving the chip to the substrate for chip mounting treatment. According to the invention, glue dipping and chip mounting links are integrated and synchronized, and serial glue dipping and chip mounting in the prior art are changed into parallel glue dipping and chip mounting, so that the efficiency of the whole glue dipping and chip mounting is improved, and a group of visual positioning systems are saved by integrating glue dipping and chip mounting at the same station, so that better cost can be realized.

Description

Technical Field

[0001] The invention relates to the technical field of chip mounting, and in particular to a high-speed dipped glue mounting machine. Background Art

[0002] The dip-stick placement machine is a device used to accurately place chips on printed circuit boards (or substrates). It dips glue (usually epoxy resin or conductive silver paste, etc.) and applies it on the substrate, and then places the chip on the substrate to achieve chip fixation and electrical connection.

[0003] The dip-stick placement machine mainly includes a dip-stick head, a placement head, a conveying system and a control system. When performing dip-stick placement, the dip-stick process and the placement process are completed at two different workstations. The substrate first reaches the dip-stick station through the conveying system, and the dip-stick head coats the glue on the substrate. Then the conveying system further transports the substrate to the placement station, and the placement head mounts the chip on the substrate.

[0004] The above-mentioned dip-glue placement machine has the following problems in actual use: 1. The dip-glue process and the placement process belong to two different stations, which requires a certain amount of time in the transfer process of the substrate, greatly reducing the placement efficiency. 2. The substrate needs to be assisted by the visual positioning system when it arrives at the dip-glue station and the placement station, so two sets of visual positioning systems are required, which increases the cost. At the same time, the visual positioning system also takes a certain amount of time to work, which further reduces the placement efficiency. Summary of the invention

[0005] In view of the above-mentioned deficiencies in the prior art, the technical problem to be solved by the present invention is: how to provide a high-speed dip-glue placement machine that improves the efficiency of dip-glue placement and reduces the production cost.

[0006] In order to solve the above technical problems, the present invention adopts the following technical solutions: A high-speed dip-glue placement machine comprises a machine base, on which a dip-glue module, a substrate motion platform module, a material taking and adjusting module, a wafer motion platform module and a placement module are arranged; The substrate motion platform module is used to place the substrate on which the patch to be dipped in glue is placed; The glue dipping module is used to perform glue dipping treatment on the substrate on the substrate motion platform module; The wafer motion platform module is used to place the chip to be mounted; The material taking and adjusting module is used to take the chip from the wafer motion platform module and adjust the position of the chip; The patch module is used to obtain the chips after position adjustment from the material taking and adjusting module, and move the chips to the substrate for patch processing.

[0007] The working principle of the present invention is as follows: when the dipped glue placement machine of the present invention is in use, the substrate that needs to be dipped glue placement is placed on the substrate motion platform module, and then the dipped glue placement module first performs dipped glue placement on the substrate on the substrate motion platform module, and then the material taking and adjusting module obtains the chip from the wafer motion platform module, and after adjusting the chip position, the patch module moves the chip to the substrate for patch placement. Thus, the dipped glue placement process of the substrate is completed. Therefore, in the entire dipped glue placement process of the dipped glue placement machine of the present invention, the substrate is always located on the substrate motion platform module and does not move, the substrate is dipped glued by the movement of the dipped glue placement module, and the chip is bonded to the substrate by the movement of the material taking and adjusting module and the patch module, thereby reducing the time spent on the transmission of the substrate between different stations, and the efficiency of dipped glue placement is improved. At the same time, since the substrate is in the same station during the entire dipped glue placement process, a set of visual positioning systems can also be saved, the cost is reduced, and the efficiency is also improved.

[0008] In summary, the present invention integrates and synchronizes the process of dipping glue and patching, changing the serial process of dipping glue and patching in the prior art into parallel process, thereby improving the efficiency of the entire dipping glue patching process. In addition, by integrating dipping glue and patching into the same workstation, a set of visual positioning systems is saved, thereby achieving a better cost.

[0009] Preferably, the substrate motion platform module includes a substrate axial motion component, a substrate longitudinal motion component and a substrate mounting platform; The substrate mounting platform is used to place the patch to be dipped in glue; The substrate axial movement assembly is used to drive the substrate mounting platform to move axially, and the substrate longitudinal movement assembly is used to drive the substrate mounting platform to move longitudinally, so as to drive the substrate to move axially and longitudinally through the substrate mounting platform.

[0010] In this way, by setting the substrate axial movement component and the substrate longitudinal movement component to drive the substrate mounting platform to perform axial and longitudinal movements respectively, the substrate on the substrate mounting platform can be moved to a suitable position. At the same time, multiple substrates are arranged on the substrate mounting platform. When one of the substrates completes the task of dipping and patching, the substrate at the next position can be moved to the dipping and patching station by moving the substrate mounting platform, and then the next substrate can be processed by dipping and patching. In this way, the continuous dipping and patching processing of substrates at different positions on the substrate mounting platform is completed, and the efficiency of dipping and patching is further improved.

[0011] Preferably, the wafer motion platform module comprises a wafer motion platform, an axial motion component of the wafer motion platform and a longitudinal motion component of the wafer motion platform; The wafer motion platform is used to place the chip to be mounted; The axial motion component of the wafer motion platform is used to drive the axial motion of the wafer motion platform, and the longitudinal motion component of the wafer motion platform is used to drive the longitudinal motion of the wafer motion platform, so as to drive the axial and longitudinal motion of the chip through the wafer motion platform.

[0012] In this way, the wafer motion platform is used to place the chip to be mounted, and the wafer motion platform is driven to perform axial and longitudinal movements through the axial motion component of the wafer motion platform and the longitudinal motion component of the wafer motion platform respectively, so as to facilitate the adjustment of the position of the wafer motion platform, and then realize the position adjustment of the chip on the wafer motion platform, so as to better meet the usage requirements in different situations.

[0013] Preferably, the glue dipping module comprises a glue dipping mounting base, a glue dipping head assembly, a glue dipping plate assembly and a glue scraping head assembly, and the glue dipping head assembly, the glue dipping plate assembly and the glue scraping head assembly are all arranged on the glue dipping mounting base; The glue dipping tray assembly is used for placing glue, the glue scraping head assembly is used for adjusting the thickness of the glue in the glue dipping tray assembly, and the glue dipping head assembly is used for dipping the glue in the glue dipping tray assembly to the substrate patch to perform glue dipping treatment on the substrate.

[0014] In this way, when the glue dipping module is in use, the required glue is placed in the glue dipping tray assembly, the glue scraping head assembly adjusts the thickness of the glue in the glue dipping tray assembly according to the glue demand of the substrate, and then the glue dipping head assembly dips the glue in the glue dipping tray assembly to the substrate patch to complete the glue dipping process on the substrate.

[0015] Preferably, the glue dipping head assembly comprises a glue dipping head and a glue dipping head moving part; the glue dipping head moving part is used to drive the glue dipping head to move between the glue dipping tray assembly and the substrate, so that the glue dipping head can dip the glue in the glue dipping tray assembly to the substrate patch; The glue dipping disc assembly comprises a glue disc and a glue disc rotating component, wherein the glue disc is used to place glue, and the glue disc rotating component is used to drive the glue disc to rotate, so that the glue dipping head can dip glue at different positions of the glue disc through the rotation of the glue disc; The rubber scraper head assembly includes a rubber scraper head and a rubber scraper head adjustment component. The rubber scraper head extends into the rubber disc to limit the thickness of the rubber in the rubber disc. The rubber scraper head adjustment component is used to adjust the position of the rubber scraper head extending into the rubber disc, so as to adjust the thickness of the rubber in the rubber disc by adjusting the position of the rubber scraper head.

[0016] In this way, the glue disc in the glue dipping disc assembly is used to place glue, and the glue disc rotating component is used to drive the glue disc to rotate. During the glue dipping process, the glue disc rotating component drives the glue disc to rotate, so that the glue dipping head can dip into the glue at different positions in the glue disc, thereby meeting the glue dipping head's demand for glue. When different types of substrates are subjected to glue dipping treatment, the substrates have different requirements for the thickness of the glue dipping. At this time, the position of the glue scraping head extending into the glue disc is adjusted by the glue scraping head adjustment component, and the thickness of the glue in the glue disc is adjusted by the glue scraping head, so as to better meet the glue dipping requirements of different substrates. The glue dipping head moving component is used to drive the glue dipping head to move, first moving the glue dipping head to the glue disc for glue dipping, then making the glue dipping head move upward to leave the glue disc and move toward the substrate, and when it moves above the substrate, the glue dipping head is controlled to move downward to perform glue dipping treatment on the substrate. Therefore, the glue dipping head moving component as a whole drives the glue dipping head to perform a U-shaped reciprocating motion to complete the glue dipping treatment of the substrate.

[0017] Preferably, the glue disc rotating component includes a glue disc rotating motor, a driving wheel and a driven wheel, the glue disc rotating motor is arranged on a glue dipping mounting base, the driving wheel is connected to the rotating shaft of the glue disc rotating motor, so as to drive the driving wheel to rotate through the glue disc rotating motor, the driving wheel and the driven wheel are connected by a transmission belt, so that the driving wheel drives the driven wheel to rotate through the transmission belt, the driven wheel and the glue disc are connected by a glue disc rotating shaft, so as to drive the glue disc to rotate through the rotation of the driven wheel; the glue disc is also provided with an annular groove, the annular groove is used for placing glue, and the glue dipping head and the glue scraping head both extend into the annular groove.

[0018] In this way, when dipping glue, the glue disc rotating motor is started, so that the glue disc rotating motor drives the driving wheel to rotate, the driving wheel drives the driven wheel to rotate through the transmission belt, and the driven wheel further drives the glue disc to rotate through the glue disc rotating shaft, so that the glue dipping head can dip glue at different positions in the glue disc to meet the glue dipping head's demand for glue during the dipping process. An annular groove is set to place glue, and the glue dipping head and the glue scraping head are inserted into the annular groove to facilitate the storage and use adjustment of glue.

[0019] Preferably, the rubber scraper head adjustment component includes a rubber scraper head linear guide, a preload spring and an adjusting knob. The guide rail portion of the rubber scraper head linear guide is arranged on the rubber dipping mounting base. The slider portion of the rubber scraper head linear guide is connected to the rubber scraper head, so as to adjust the position of the rubber scraper head by moving the slider portion of the rubber scraper head linear guide along its guide rail. One end of the adjusting knob passes through the rubber dipping mounting base and is connected to the slider portion of the rubber scraper head linear guide. The preload spring is sleeved on the adjusting knob between the rubber dipping mounting base and the slider portion of the rubber scraper head linear guide, so as to drive the slider portion of the rubber scraper head linear guide to move along its guide rail by rotating the adjusting knob.

[0020] In this way, when different types of substrates require glue of different thicknesses, the adjusting knob is turned to drive the slider of the linear guide of the scraper head to move along its guide rail, and then the position of the scraper head is adjusted by the slider of the linear guide of the scraper head. The part of the scraper head extending into the annular groove will exert a force on the glue in the glue disc under the action of the preload spring, and then the thickness of the glue in the glue disc is adjusted to better meet the glue dipping requirements of different types of substrates.

[0021] Preferably, the portion of the scraper head extending into the annular groove has an arc structure adapted to the annular groove, and an inverted U-shaped groove is also provided at the portion of the scraper head extending into the annular groove, and the opening end of the inverted U-shaped groove is connected to the annular groove.

[0022] In this way, the part of the scraper head extending into the annular groove has an arc structure adapted to the annular groove, so that the scraper head can better cooperate with the annular groove to adjust the thickness of the glue, and the inverted U-shaped groove can be adjusted when the position of the scraper head is adjusted to provide a holding space for excess glue in the glue tray, so as to better achieve the adjustment of the thickness of the glue in the glue tray.

[0023] Preferably, the material fetching and adjusting module comprises a material fetching mechanism and an adjusting mechanism, wherein the material fetching mechanism is used to fetch chips from the wafer motion platform module and place them on the adjusting mechanism, and the adjusting mechanism is used to adjust the positions of the placed chips.

[0024] In this way, after the material picking mechanism obtains the chip from the wafer motion platform module, it is first placed on the adjustment mechanism, and the adjustment mechanism adjusts the position of the chip to ensure the accuracy of the chip position. Then the patch module moves the chip to the substrate for patch processing, which can ensure the accuracy of the chip position during the patch processing.

[0025] Preferably, the material taking mechanism is installed on the base through a material taking vertical movement assembly, so that the material taking mechanism can move vertically along the base; The material picking mechanism includes a material picking rotary motor, a material picking arm and a material picking head. The material picking rotary motor is installed on a vertical moving component. One end of the material picking arm is connected to the material picking rotary motor through a material picking transmission component, and the other end of the material picking arm is connected to the material picking head, so that when the material picking rotary motor rotates, the material picking head can be driven to rotate through the material picking arm. The material picking head is used to pick up chips, and the chips are moved from the wafer motion platform module to the adjustment mechanism through the rotation of the material picking head.

[0026] In this way, the overall vertical movement of the material picking mechanism can be achieved through the material picking vertical movement component, so that the material picking mechanism can better adapt to the position of the wafer motion platform module to obtain chips. When obtaining chips from the wafer motion platform module, the material picking rotary motor drives the material picking head to rotate through the material picking arm, so that the material picking head rotates to the top of the chip position, and then the material picking head contacts the chip through vertical movement to obtain the chip. After the material picking head obtains the chip, the material picking rotary motor drives the rotation of the material picking head again through the material picking arm, so that the material picking head moves the chip from the wafer motion platform module to the adjustment mechanism.

[0027] Preferably, the material picking mechanism also includes a vertical fine-tuning component, which includes a material picking linear motor, a contact sensor and a preload adjustment screw. The material picking linear motor is installed at one end of the material picking arm close to the material picking rotary motor. The material picking linear motor is used to drive the material picking arm to move in vertical fine-tuning. The contact sensor is located at one end of the material picking arm close to the material picking head. When the material picking head contacts the chip, the contact sensor sends a signal to the control mechanism of the material picking linear motor, so that when the material picking head contacts the chip, the material picking linear motor drives the material picking head to move in vertical fine-tuning through the material picking arm, and the material picking head generates a set clamping force on the chip when picking up the chip; the preload adjustment screw is used to pre-adjust the position of the material picking head.

[0028] In this way, the material picking head needs to exert a certain force on the chip during the process of picking up and moving the chip. Therefore, this solution achieves the effect of exerting force on the chip by fine-tuning the vertical position of the material picking head through the vertical fine-tuning component. When the material picking head contacts the chip, the contact sensor obtains the information and transmits the signal to the control mechanism of the material picking linear motor, so that the material picking linear motor drives the material picking head to move vertically through the material picking arm to meet the requirement of the material picking head exerting a certain force on the chip, and ensure the stability of the material picking head during the chip transfer process.

[0029] Preferably, the material picking linear motor is arranged vertically, and the stator of the material picking linear motor is connected to the rotor of the material picking rotary motor through a vertical base, so that the material picking rotary motor can drive the material picking linear motor to rotate synchronously, and the material picking arm is connected to the rotor of the material picking linear motor through a vertical moving block, so that the rotor of the material picking linear motor can drive the material picking arm to perform vertical fine-tuning movement.

[0030] In this way, when the retrieving linear motor is running, the stator of the retrieving linear motor is fixed on the vertical base, and the rotor of the retrieving linear motor drives the retrieving arm to move vertically through the vertical moving block, and the retrieving arm further drives the retrieving head to move vertically.

[0031] Preferably, the adjustment mechanism includes a transfer platform and an adjustment motor, the transfer platform is used to place the chip, the shaft of the adjustment motor is connected to the transfer platform, so that the transfer platform is driven to rotate by the rotation of the adjustment motor, and the rotation of the transfer platform adjusts the position of the chip.

[0032] In this way, when the material picking head moves the chip to the transfer platform, there may be deviations in the position of the chip. At this time, the rotation of the motor is adjusted to drive the transfer platform to rotate, and the position of the chip is adjusted by the rotation of the transfer platform, further ensuring that the patch module can obtain the chip in the correct position and ensure that the chip can be correctly bonded to the substrate.

[0033] Preferably, the adjustment mechanism also includes a visual component on the transfer platform and a visual component under the transfer platform. The visual component on the transfer platform is located directly above the transfer platform and is used to capture visual images of the chip on the transfer platform from directly above. The visual component under the transfer platform is located directly below the transfer platform and is used to capture visual images of the chip on the transfer platform from directly below.

[0034] In this way, by setting up the visual component on the transfer platform and the visual component under the transfer platform, the visual component on the transfer platform and the visual component under the transfer platform are used to respectively collect visual images of the chip on the transfer platform, and the collected images can be further sent to the back-end image processing program. By comparing the collected images with the standard images, the position of the chip can be judged. When there is a deviation between the collected images and the standard images, the rotation of the transfer platform is driven by controlling the rotation of the adjustment motor, and the position of the chip is adjusted by the rotation of the transfer platform. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Attached Figure 1 It is a schematic diagram of the overall structure of the high-speed dipped glue placement machine of the present invention; Attached Figure 2 It is a front view of the high-speed dipped adhesive placement machine of the present invention; Attached Figure 3 It is a structural schematic diagram of a substrate motion platform module in a high-speed dip-glue placement machine of the present invention; Attached Figure 4 It is a structural schematic diagram of a wafer motion platform module in a high-speed dip-glue placement machine of the present invention; Attached Figure 5 It is a structural schematic diagram of the glue dipping module in the high-speed glue dipping placement machine of the present invention; Attached Figure 6 It is a structural schematic diagram of a glue dipping plate assembly and a glue scraping head assembly in a high-speed glue dipping placement machine of the present invention from one viewing angle; Attached Figure 7 It is a structural schematic diagram of the glue dipping plate assembly and the glue scraping head assembly in the high-speed glue dipping placement machine of the present invention from another perspective; Attached Figure 8 It is a motion schematic diagram of the glue dipping head in the high-speed glue dipping placement machine of the present invention; Attached Fig. 9 It is a structural schematic diagram of the material taking mechanism in the high-speed dipped glue placement machine of the present invention; Attached Fig.10 It is a partially enlarged schematic diagram of one viewing angle of the material taking head position in the material taking mechanism of the high-speed dipped glue placement machine of the present invention; Attached Fig.11 It is a partially enlarged schematic diagram of another viewing angle of the position of the material taking head in the material taking mechanism of the high-speed dipped glue placement machine of the present invention; Attached Fig.12 It is a partial enlarged schematic diagram of the material taking linear motor in the material taking mechanism of the high-speed dipped glue placement machine of the present invention; Attached Fig.13 It is a structural schematic diagram of the adjustment mechanism in the high-speed dip-glue placement machine of the present invention; Attached Fig.14 for Fig.13 A magnified schematic diagram of center A.

[0036] Description of the accompanying drawings: base 1, glue dipping module 2, glue dipping head 201, glue dipping head moving part 202, glue disc rotating motor 203, driving wheel 204, transmission belt 205, driven wheel 206, glue disc rotating shaft 207, glue disc 208, glue scraping head 209, glue scraping head linear guide 210, preload spring 211, adjustment knob 212, substrate motion platform module 3, substrate mounting platform 301, substrate axial motion component 302, substrate longitudinal motion component 303, substrate 4, patch module 5 , adjustment mechanism 6, adjustment motor 601, transfer platform 602, wafer motion platform module 7, wafer motion platform 701, wafer motion platform longitudinal motion component 702, wafer motion platform axial motion component 703, material picking mechanism 8, material picking rotary motor 801, material picking linear motor 802, vertical moving block 803, return spring 804, material picking arm 805, material picking head 806, preload adjustment screw 807, preload linear guide 808, contact sensor 809, vertical base 810. DETAILED DESCRIPTION

[0037] In order to make the purpose, technical scheme and advantages of the embodiments of the present invention clearer, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. The components of the embodiments of the present invention generally described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work belong to the scope of protection of the present invention.

[0038] As attached Figure 1 and attached Figure 2 As shown, in this specific embodiment, a high-speed dip-glue mounting machine is provided, including a machine base 1, on which are provided a dip-glue module 2, a substrate motion platform module 3, a material picking and adjusting module, a wafer motion platform module 7 and a mounting module 5; the substrate motion platform module 3 is used for placing a substrate 4 to be dipped and mounted; the dip-glue module 2 is used for performing a dip-glue treatment on the substrate 4 on the substrate motion platform module 3; the wafer motion platform 701 module is used for placing chips to be mounted; the material picking and adjusting module is used for obtaining chips from the wafer motion platform 701 module and adjusting the position of the chips; the mounting module 5 is used for obtaining the chips after position adjustment from the material picking and adjusting module, and moving the chips to the substrate 4 for mounting.

[0039] The working principle of the present invention is as follows: when the dipped glue placement machine of the present invention is used, the substrate 4 that needs to be dipped glue placement is placed on the substrate motion platform module 3, and then the dipped glue module 2 first performs the dipped glue placement on the substrate 4 on the substrate motion platform module 3, and then the material taking and adjusting module obtains the chip from the wafer motion platform 701 module, and after adjusting the chip position, the patch module 5 moves the chip to the substrate 4 for patch placement. Thus, the dipped glue placement process of the substrate 4 is completed. Therefore, in the entire dipped glue placement process of the dipped glue placement machine of the present invention, the substrate 4 is always located on the substrate motion platform module 3 and does not move, the substrate 4 is dipped glued by the movement of the dipped glue module 2, and the chip is bonded to the substrate 4 by the movement of the material taking and adjusting module and the patch module 5, thereby reducing the time spent on the transmission of the substrate 4 between different stations, and the dipped glue placement efficiency is improved. At the same time, since the substrate 4 is in the same station during the entire dipped glue placement process, a set of visual positioning systems can also be saved, the cost is reduced, and the efficiency is also improved.

[0040] In summary, the present invention integrates and synchronizes the process of dipping glue and patching, changing the serial process of dipping glue and patching in the prior art into parallel process, thereby improving the efficiency of the entire dipping glue patching process. In addition, by integrating dipping glue and patching into the same workstation, a set of visual positioning systems is saved, thereby achieving a better cost.

[0041] As attached Figure 3 As shown, in this embodiment, the substrate motion platform module 3 includes a substrate axial motion component 302, a substrate longitudinal motion component 303 and a substrate mounting platform 301; the substrate axial motion component 302 and the substrate longitudinal motion component 303 can both adopt a linear motor plus a linear guide structure, which belongs to the prior art and will not be discussed in detail in the present invention.

[0042] The substrate mounting platform 301 is used to place the substrate 4 to be dipped in adhesive. The substrate axial motion assembly 302 is used to drive the substrate mounting platform 301 to move axially, and the substrate longitudinal motion assembly 303 is used to drive the substrate mounting platform 301 to move longitudinally, so as to drive the substrate 4 to move axially and longitudinally through the substrate mounting platform 301.

[0043] In this way, by setting the substrate axial movement component 302 and the substrate longitudinal movement component 303 to drive the substrate installation platform 301 to move axially and longitudinally respectively, the substrate 4 on the substrate installation platform 301 can be moved to a suitable position. At the same time, multiple substrates 4 are arranged on the substrate installation platform 301. When one of the substrates 4 completes the task of dipping and patching, the substrate 4 at the next position can be moved to the dipping and patching station by moving the substrate installation platform 301, and then the next substrate 4 is dipped and patched. In this way, the continuous dipping and patching of substrates 4 at different positions on the substrate installation platform 301 is completed, and the efficiency of dipping and patching is further improved.

[0044] As attached Figure 4 As shown, the wafer motion platform module 7 includes a wafer motion platform 701, an axial motion component 703 of the wafer motion platform and a longitudinal motion component 702 of the wafer motion platform; the axial motion component 703 of the wafer motion platform and the longitudinal motion component 702 of the wafer motion platform can both adopt a linear motor plus a linear guide structure, which belongs to the prior art and will not be discussed in detail in the present invention.

[0045] The wafer motion platform 701 is used to place the chip to be mounted. The wafer motion platform axial motion component 703 is used to drive the wafer motion platform 701 to move axially, and the wafer motion platform longitudinal motion component 702 is used to drive the wafer motion platform 701 to move longitudinally, so as to drive the chip to move axially and longitudinally through the wafer motion platform 701.

[0046] In this way, the wafer motion platform 701 is used to place the chip to be mounted, and the wafer motion platform 701 is driven to perform axial and longitudinal movements respectively through the wafer motion platform axial motion component 703 and the wafer motion platform longitudinal motion component 702, so as to facilitate the adjustment of the position of the wafer motion platform 701, and further realize the position adjustment of the chip on the wafer motion platform 701, so as to better meet the usage requirements in different situations.

[0047] As attached Figure 5 To the attached Figure 8 As shown, in this embodiment, the glue dipping module 2 includes a glue dipping mounting base, a glue dipping head assembly, a glue dipping plate assembly and a glue scraping head assembly, and the glue dipping head assembly, the glue dipping plate assembly and the glue scraping head assembly are all arranged on the glue dipping mounting base; The glue dipping tray 208 assembly is used to place glue, the glue scraping head assembly is used to adjust the thickness of the glue in the glue dipping tray assembly, and the glue dipping head assembly is used to dip the glue in the glue dipping tray assembly to the patch of the substrate 4 to perform glue dipping on the substrate 4. Specifically, the glue dipping head assembly includes a glue dipping head 201 and a glue dipping head moving part 202; the glue dipping head moving part 202 is used to drive the glue dipping head 201 to move between the glue dipping tray 208 assembly and the substrate 4, so that the glue dipping head 201 can dip the glue in the glue dipping tray assembly to the patch of the substrate 4; in this specific embodiment, the glue dipping head moving part 202 uses a mature module in the prior art. When specifically selecting, any module that can meet the movement requirements of the glue dipping head 201 of this solution can be used. Therefore, the glue dipping head moving part 202 is not described in detail in this specific embodiment. When those skilled in the art know the requirements for the movement of the glue dipping head 201, they can make a reasonable selection of the glue dipping head moving part 202 according to their needs.

[0048] Specifically, the glue disc assembly includes a glue disc 208 and a glue disc rotating component. The glue disc 208 is used to place glue, and the glue disc rotating component is used to drive the glue disc 208 to rotate, so that the glue dipping head 201 can dip glue at different positions of the glue disc 208 through the rotation of the glue disc 208. The glue disc rotating components include a glue disc rotating motor 203, a driving wheel 204 and a driven wheel 206. The glue disc rotating motor 203 is arranged on a glue dipping mounting base. The driving wheel 204 is connected to the rotating shaft of the glue disc rotating motor 203 so as to drive the driving wheel 204 to rotate through the glue disc rotating motor 203. The driving wheel 204 and the driven wheel 206 are connected by a transmission belt 205 so that the driving wheel 204 drives the driven wheel 206 to rotate through the transmission belt 205. The driven wheel 206 and the glue disc 208 are connected by a glue disc rotating shaft 207 so as to drive the glue disc 208 to rotate through the rotation of the driven wheel 206. The glue disc 208 is also provided with an annular groove for placing glue, and the glue dipping head 201 and the glue scraping head 209 both extend into the annular groove. Thus, when dipping glue, the glue tray rotating motor 203 is started, so that the glue tray rotating motor 203 drives the driving wheel 204 to rotate, and the driving wheel 204 drives the driven wheel 206 to rotate through the transmission belt 205, and the driven wheel 206 further drives the glue tray 208 to rotate through the glue tray rotating shaft 207, so that the glue dipping head 201 can dip glue at different positions in the glue tray 208, meeting the glue demand of the glue dipping head 201 during the dipping process. An annular groove is provided to place the glue, and the glue dipping head 201 and the glue scraping head 209 are extended into the annular groove, which is convenient for the storage and use adjustment of the glue.

[0049] The scraper head assembly includes a scraper head 209 and a scraper head adjustment component. The scraper head 209 extends into the rubber disc 208 to limit the thickness of the rubber in the rubber disc 208. The scraper head adjustment component is used to adjust the position of the scraper head 209 extending into the rubber disc 208, so as to adjust the thickness of the rubber in the rubber disc 208 by adjusting the position of the scraper head 209. The portion of the scraper head 209 extending into the annular groove has an arc structure adapted to the annular groove, and an inverted U-shaped groove is also provided at the portion of the scraper head 209 extending into the annular groove, and the opening end of the inverted U-shaped groove is connected to the annular groove. In this way, the portion of the scraper head 209 extending into the annular groove has an arc structure adapted to the annular groove, so that the scraper head 209 can better cooperate with the annular groove to adjust the thickness of the rubber, and the inverted U-shaped groove can be adjusted in the position of the scraper head 209 to provide a space for accommodating excess rubber in the rubber disc 208, so as to better adjust the thickness of the rubber in the rubber disc 208.

[0050] As attached Figure 6 and attached Figure 7 As shown, the rubber scraper head adjustment component includes a rubber scraper head linear guide 210, a preload spring 211 and an adjustment knob 212. The guide rail portion of the rubber scraper head linear guide 210 is arranged on a glue dipping mounting base. The slider portion of the rubber scraper head linear guide 210 is connected to the rubber scraper head 209, so as to adjust the position of the rubber scraper head 209 by moving the slider portion of the rubber scraper head linear guide 210 along its guide rail. One end of the adjustment knob 212 passes through the glue dipping mounting base and is connected to the slider portion of the rubber scraper head linear guide 210. The preload spring 211 is sleeved on the adjustment knob 212 between the glue dipping mounting base and the slider portion of the rubber scraper head linear guide 210, so as to drive the slider portion of the rubber scraper head linear guide 210 to move along its guide rail by rotating the adjustment knob 212. In this way, when different types of substrates 4 are processed and different thicknesses of glue are required, the adjusting knob 212 is turned so that the adjusting knob 212 drives the slider of the scraper head linear guide 210 to move along its guide rail, and then the position of the scraper head 209 is adjusted through the slider of the scraper head linear guide 210. The part of the scraper head 209 extending into the annular groove will exert a force on the glue in the glue disc 208 under the action of the pre-compression spring 211, and then the thickness of the glue in the glue disc 208 is adjusted to better meet the glue dipping requirements of different types of substrates 4.

[0051] In this way, the glue tray 208 in the glue tray assembly is used to place glue, and the glue tray rotating component is used to drive the glue tray 208 to rotate. When dipping glue, the glue tray rotating component drives the glue tray 208 to rotate, so that the glue dipping head 201 can dip glue at different positions of the glue tray 208, thereby meeting the glue dipping requirements of the glue dipping head 201. When different types of substrates 4 are dipped in glue, the substrates 4 have different requirements for the thickness of the dipped glue. At this time, the position of the scraper head 209 extending into the glue tray 208 is adjusted by the scraper head adjustment component, and the thickness of the glue in the glue tray 208 is adjusted by the scraper head 209, so as to better meet the glue dipping requirements of different substrates 4. The glue dipping head moving part 202 is used to drive the glue dipping head 201 to move. First, the glue dipping head 201 is moved to the glue tray 208 for dipping glue. Then, the glue dipping head 201 moves upward to leave the glue tray 208 and move to the substrate 4. When it moves to the top of the substrate 4, the glue dipping head 201 is controlled to move downward to dip the substrate 4. Therefore, the glue dipping head moving part 202 drives the glue dipping head 201 to make a U-shaped reciprocating motion as a whole to complete the dipping process of the substrate 4. Figure 7 shown.

[0052] As attached Fig. 9 To the attached Fig.12 As shown, in this embodiment, the material picking and adjusting module includes a material picking mechanism 8 and an adjusting mechanism 6. The material picking mechanism 8 is used to pick up chips from the wafer motion platform module 7 and place them on the adjusting mechanism 6. The adjusting mechanism 6 is used to adjust the position of the placed chips. Specifically, the material picking mechanism 8 is installed on the base through the material picking vertical moving component, so that the material picking mechanism 8 can move vertically along the base; the material picking mechanism 8 includes a material picking rotary motor 801, a material picking arm 805 and a material picking head 806. The material picking rotary motor 801 is installed on the vertical moving component. One end of the material picking arm 805 is connected to the material picking rotary motor 801 through the material picking transmission component, and the other end of the material picking arm 805 is connected to the material picking head 806, so that when the material picking rotary motor 801 rotates, the material picking head 806 can be driven to rotate through the material picking arm 805. The material picking head 806 is used to pick up chips, and the chips are moved from the wafer motion platform module 7 to the adjusting mechanism 6 by the rotation of the material picking head 806. In this way, the overall vertical movement of the material picking mechanism 8 can be achieved through the material picking vertical movement component, so that the material picking mechanism 8 can better adapt to the position of the wafer motion platform module 7 to obtain the chip. When obtaining the chip from the wafer motion platform module 7, the material picking rotary motor 801 drives the material picking head 806 to rotate through the material picking arm 805, so that the material picking head 806 rotates to the top of the chip position, and then the material picking head 806 is brought into contact with the chip through vertical movement to obtain the chip. After the material picking head 806 obtains the chip, the material picking rotary motor 801 drives the rotation of the material picking head 806 again through the material picking arm 805, so that the material picking head 806 moves the chip from the wafer motion platform 701 module to the adjustment mechanism 6.

[0053] As attached Fig.10 To the attached Fig.12 As shown, specifically, the material picking mechanism 8 also includes a vertical fine-tuning component, which includes a material picking linear motor 802, a contact sensor 809, a preload adjustment screw 807 and a preload linear guide 808. The material picking linear motor 802 is installed at one end of the material picking arm 805 close to the material picking rotary motor 801. The material picking linear motor 802 is used to drive the material picking arm 805 to move along the vertical fine-tuning. Specifically, the material picking linear motor 802 is arranged vertically, and the stator of the material picking linear motor 802 is connected to the rotor of the material picking rotary motor 801 through the vertical base 810, so as to drive the material picking linear motor 802 to rotate synchronously through the material picking rotary motor 801, and the material picking arm 805 is connected to the rotor of the material picking linear motor 802 through the vertical moving block 803, so as to drive the material picking arm 805 to perform vertical fine-tuning movement through the rotor of the material picking linear motor 802. In this way, when the material picking linear motor 802 is running, the stator of the material picking linear motor 802 is fixed on the vertical base 810, and the rotor of the material picking linear motor 802 drives the material picking arm 805 to move vertically through the vertical moving block 803, and the material picking arm 805 further drives the material picking head 806 to move vertically, and a return spring 804 is also provided on the vertical moving block 803. The contact sensor 809 is located at one end of the material picking arm 805 close to the material picking head 806. When the material picking head 806 contacts the chip, the contact sensor 809 sends a signal to the control mechanism of the material picking linear motor 802, so that when the material picking head 806 contacts the chip, the material picking linear motor 802 drives the material picking head 806 to move vertically through the material picking arm 805, and the material picking head 806 generates a set pressing force on the chip when picking up the chip; the preload adjustment screw 807 is used to pre-adjust the position of the material picking head 806. In this way, when the material picking head 806 is picking up and moving the chip, the material picking head 806 needs to exert a certain force on the chip. Therefore, this solution achieves the effect of exerting force on the chip by fine-tuning the vertical position of the material picking head 806 through the vertical fine-tuning component. When the material picking head 806 contacts the chip, the contact sensor 809 obtains the information and transmits the signal to the control mechanism of the material picking linear motor 802, so that the material picking linear motor 802 drives the material picking head 806 to move along the vertical fine-tuning through the material picking arm 805, so as to meet the requirement that the material picking head 806 exerts a certain force on the chip, and ensure the stability of the material picking head 806 in the process of transferring the chip.

[0054] As attached Fig.13 and attached Fig.14As shown, in this embodiment, the adjustment mechanism 6 includes a transfer platform 602, an adjustment motor 601, a visual component on the transfer platform, and a visual component under the transfer platform. The transfer platform 602 is used to place the chip. The rotating shaft of the adjustment motor 601 is connected to the transfer platform 602, so that the transfer platform 602 is driven to rotate by the rotation of the adjustment motor 601. The rotation of the transfer platform 602 adjusts the position of the chip. The visual component on the transfer platform is located directly above the transfer platform 602, and is used to collect visual images of the chip on the transfer platform 602 from directly above. The visual component under the transfer platform is located directly below the transfer platform 602, and is used to collect visual images of the chip on the transfer platform 602 from directly below.

[0055] In this way, when the material picking head 806 moves the chip to the transfer platform 602, there may be a deviation in the position of the chip at this time. By setting a visual component on the transfer platform and a visual component under the transfer platform, the visual component on the transfer platform and the visual component under the transfer platform are used to respectively collect visual images of the chip on the transfer platform 602. The collected images can be further sent to the back-end image processing program. By comparing the collected images with the standard images, the position of the chip can be judged. When there is a deviation between the collected images and the standard images, the rotation of the transfer platform 602 is driven by controlling the rotation of the adjustment motor 601, and then the position of the chip is adjusted by using the rotation of the transfer platform 602, further ensuring that the patch module 5 can obtain the chip in the correct position and ensure that the chip can be correctly bonded to the substrate 4.

[0056] The complete working principle of the present invention is as follows: the substrate installation platform 301 moves the substrate 4 that needs to be patched to the dipped patch station, and then the dipped glue head in the dipped glue module dips the glue in the glue tray to the patch of the substrate 4 through a U-shaped reciprocating motion, and at the same time, the material picking arm 805 will pick up the chip on the wafer motion platform 701 through rotation and vertical movement and move it to the transfer platform 602, and then the transfer platform 602 will perform angle compensation on the chip according to the photographing results of the visual component on the transfer platform 602 and the visual component under the transfer platform 602, and then the patch module 5 will move to the transfer platform 602 to remove the chip and then move to the dipped patch station for patching. After that, the substrate installation platform 301 will move a group of positions to move another substrate 4 that needs to be patched to the dipped patch station, and then the dipped glue head will continue to dip the glue, and the subsequent actions will be cyclically performed until all the substrates 4 on the entire substrate installation platform 301 are patched.

[0057] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention rather than to limit the technical solution. Those skilled in the art should understand that those modifications or equivalent substitutions of the technical solution of the present invention that do not depart from the purpose and scope of the technical solution should be included in the scope of the claims of the present invention.

Claims

1. A high-speed dipped adhesive placement machine, characterized in that: It includes a machine base, on which a glue dipping module, a substrate motion platform module, a material taking and adjusting module, a wafer motion platform module and a patch module are arranged; The substrate motion platform module is used to place the substrate on which the patch to be dipped in glue is placed; The glue dipping module is used to perform glue dipping treatment on the substrate on the substrate motion platform module; The wafer motion platform module is used to place the chip to be mounted; The material taking and adjusting module is used to take the chip from the wafer motion platform module and adjust the position of the chip; The patch module is used to obtain the chips after position adjustment from the material taking and adjusting module, and move the chips to the substrate for patch processing.

2. The high-speed dipped adhesive placement machine according to claim 1, characterized in that: The substrate motion platform module includes a substrate axial motion component, a substrate longitudinal motion component and a substrate mounting platform; The substrate mounting platform is used to place the patch to be dipped in glue; The substrate axial movement assembly is used to drive the substrate mounting platform to move axially, and the substrate longitudinal movement assembly is used to drive the substrate mounting platform to move longitudinally, so as to drive the substrate to move axially and longitudinally through the substrate mounting platform.

3. The high-speed dipped adhesive placement machine according to claim 1, characterized in that: The wafer motion platform module includes a wafer motion platform, an axial motion component of the wafer motion platform and a longitudinal motion component of the wafer motion platform; The wafer motion platform is used to place the chip to be mounted; The axial motion component of the wafer motion platform is used to drive the axial motion of the wafer motion platform, and the longitudinal motion component of the wafer motion platform is used to drive the longitudinal motion of the wafer motion platform, so as to drive the axial and longitudinal motion of the chip through the wafer motion platform.

4. The high-speed dipped adhesive placement machine according to claim 1, characterized in that: The glue dipping module comprises a glue dipping mounting base, a glue dipping head assembly, a glue dipping plate assembly and a glue scraping head assembly, and the glue dipping head assembly, the glue dipping plate assembly and the glue scraping head assembly are all arranged on the glue dipping mounting base; The glue dipping tray assembly is used for placing glue, the glue scraping head assembly is used for adjusting the thickness of the glue in the glue dipping tray assembly, and the glue dipping head assembly is used for dipping the glue in the glue dipping tray assembly to the substrate patch to perform glue dipping treatment on the substrate.

5. The high-speed dipped adhesive placement machine according to claim 4, characterized in that: The glue dipping head assembly includes a glue dipping head and a glue dipping head moving part; the glue dipping head moving part is used to drive the glue dipping head to move between the glue dipping tray assembly and the substrate, so that the glue dipping head can dip the glue in the glue dipping tray assembly to the substrate patch; The glue dipping disc assembly comprises a glue disc and a glue disc rotating component, wherein the glue disc is used to place glue, and the glue disc rotating component is used to drive the glue disc to rotate, so that the glue dipping head can dip glue at different positions of the glue disc through the rotation of the glue disc; The rubber scraper head assembly includes a rubber scraper head and a rubber scraper head adjustment component. The rubber scraper head extends into the rubber disc to limit the thickness of the rubber in the rubber disc. The rubber scraper head adjustment component is used to adjust the position of the rubber scraper head extending into the rubber disc, so as to adjust the thickness of the rubber in the rubber disc by adjusting the position of the rubber scraper head.

6. The high-speed dipped adhesive placement machine according to claim 5, characterized in that: The rubber scraper head adjustment component includes a rubber scraper head linear guide, a preload spring and an adjusting knob. The guide rail portion of the rubber scraper head linear guide is arranged on the rubber dipping mounting base. The slider portion of the rubber scraper head linear guide is connected to the rubber scraper head, so as to adjust the position of the rubber scraper head by moving the slider portion of the rubber scraper head linear guide along its guide rail. One end of the adjusting knob passes through the rubber dipping mounting base and is connected to the slider portion of the rubber scraper head linear guide. The preload spring is sleeved on the adjusting knob between the rubber dipping mounting base and the slider portion of the rubber scraper head linear guide, so as to drive the slider portion of the rubber scraper head linear guide to move along its guide rail by rotating the adjusting knob.

7. The high-speed dipped adhesive placement machine according to claim 1, characterized in that: The material fetching and adjusting module comprises a material fetching mechanism and an adjusting mechanism. The material fetching mechanism is used to fetch chips from the wafer motion platform module and place them on the adjusting mechanism. The adjusting mechanism is used to adjust the position of the placed chips.

8. The high-speed dipped adhesive placement machine according to claim 7, characterized in that: The material taking mechanism is installed on the base through a material taking vertical moving assembly, so that the material taking mechanism can move vertically along the base; The material picking mechanism includes a material picking rotary motor, a material picking arm and a material picking head. The material picking rotary motor is installed on a vertical moving component. One end of the material picking arm is connected to the material picking rotary motor through a material picking transmission component, and the other end of the material picking arm is connected to the material picking head, so that when the material picking rotary motor rotates, the material picking head can be driven to rotate through the material picking arm. The material picking head is used to pick up chips, and the chips are moved from the wafer motion platform module to the adjustment mechanism through the rotation of the material picking head.

9. The high-speed dipped adhesive placement machine according to claim 8, characterized in that: The material picking mechanism also includes a vertical fine-tuning component, which includes a material picking linear motor, a contact sensor and a preload adjustment screw. The material picking linear motor is installed at one end of the material picking arm close to the material picking rotary motor. The material picking linear motor is used to drive the material picking arm to move in vertical fine-tuning. The contact sensor is located at one end of the material picking arm close to the material picking head. When the material picking head contacts the chip, the contact sensor sends a signal to the control mechanism of the material picking linear motor, so that when the material picking head contacts the chip, the material picking linear motor drives the material picking head to move in vertical fine-tuning through the material picking arm, and the material picking head generates a set clamping force on the chip when picking up the chip; the preload adjustment screw is used to pre-adjust the position of the material picking head.

10. The high-speed dipped adhesive placement machine according to claim 9, characterized in that: The adjustment mechanism includes a transfer platform and an adjustment motor. The transfer platform is used to place the chip. The rotating shaft of the adjustment motor is connected to the transfer platform so that the transfer platform can be driven to rotate by the rotation of the adjustment motor. The rotation of the transfer platform adjusts the position of the chip.

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