Display module preparation method and display module

By creating grooves on the substrate and using magnetic control to fix and bind the circuits, the problem of large screen bezels caused by substrate bending processes is solved, enabling a narrow bezel design for the display module and meeting the demand for thinner and lighter terminal displays.

CN119947421BActive Publication Date: 2026-05-08YUNGU GUAN TECH CO LTD +1
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Patent Information

Application Number
CN202510107258.X
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-01-22
Publication Date
2026-05-08
Estimated Expiration
2045-01-22

AI Technical Summary

Technical Problem

In the existing technology, the screen bezel of the display module is relatively large, which makes it impossible to achieve the requirement of an ultra-narrow bezel. This is mainly due to the circuit bonding problem caused by the substrate bending process.

Method used

A groove is made on the substrate, and bonding lines are laid in the groove. The bonding lines are fixed by magnetic control. Then, a hole is made on the substrate so that the screen lines can be directly bonded to the bonding area components through the hole on the back of the screen, eliminating the substrate bending process.

Benefits of technology

It effectively reduces the screen bezel, achieving a narrow bezel effect for the display module, meeting the requirements for thinner and lighter terminal displays and ultra-narrower bezels.

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Abstract

The application provides a display module preparation method and a display module. The preparation method comprises the following steps: providing a substrate, etching a groove on the surface of the substrate; placing a binding circuit in the groove; fixing the binding circuit in the groove by a magnetic control method; preparing a substrate on the surface of the substrate provided with the groove, the binding circuit being fixed on the side of the substrate close to the substrate; preparing a screen body layer on the side of the substrate away from the substrate, etching the screen body layer and the substrate to form a wire passing hole, the screen body layer comprising a screen body circuit, the screen body circuit being electrically connected with the binding circuit through the wire passing hole; peeling the substrate from the substrate to expose the binding circuit on the side of the substrate close to the substrate; and providing a binding assembly to electrically connect the binding circuit with the binding assembly. The method uses the magnetic control method to position and fix the binding circuit, which can effectively reduce the frame of the screen body.
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