Display panel, preparation method thereof and electronic equipment

Abstract

The invention provides a display panel and a preparation method thereof, and electronic equipment, and the display panel comprises a first base layer, a second base layer, a circuit layer, an array film layer, a first electrode layer, a second electrode layer, a second electrode layer, a second electrode layer, a third electrode layer, a fourth electrode layer, a fifth electrode layer and a sixth electrode layer, wherein the first base layer is provided with a first connecting part penetrating through the first base layer; the second base layer is provided with a second connecting part penetrating through the second base layer; the array film layer is located on the surface of the side, away from the circuit layer, of the second base layer, and the conductive end of the array film layer is connected with the conductive end of the circuit layer through a second connecting part; the binding assembly is located on the surface of the side, away from the circuit layer, of the first base layer, the conductive end of the binding assembly is connected with the conductive film layer, and the conductive film layer is connected with the conductive end of the circuit layer through a first connecting part; according to the scheme, the frame wiring and the binding area metal wiring of the display panel are guided to the position between the two base layers, a frame wiring structure is omitted, and therefore the frame of the display panel is reduced, and the effect of an extremely narrow frame or even zero frame is achieved.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display panel, a preparation method thereof, and an electronic device. Background Art

[0002] Organic electroluminescent display (OLED) panels have gradually become the mainstream in the display field due to their excellent performance such as low power consumption, high color saturation, wide viewing angle, thin thickness, and flexibility. They can be widely used in terminal products such as smart phones, tablets, and TVs.

[0003] With the advancement of technology and the improvement of consumer aesthetics, terminal displays require the entire device to be lighter and thinner and the borders to be further compressed. Currently, the borders of OLED flexible display panel products are relatively large, and reducing the display panel borders has become a top priority for technological improvement. Summary of the invention

[0004] The object of the present invention is to provide a display panel, a method for manufacturing the same, and an electronic device to solve the technical problem of a large frame of a display panel in the prior art.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] In a first aspect, a display panel includes:

[0007] a first base layer, wherein a first connecting portion penetrating through the first base layer is provided on the first base layer;

[0008] A second base layer, wherein a second connecting portion penetrating through the second base layer is provided on the second base layer,

[0009] a circuit layer, wherein the circuit layer is located between the first base layer and the second base layer,

[0010] An array film layer, wherein the array film layer is located on a surface of the second base layer away from the circuit layer, and a conductive end of the array film layer is connected to a conductive end of the circuit layer through the second connecting portion;

[0011] A binding component, the binding component is located on a surface of the first base layer away from the circuit layer, and the binding component has a conductive end,

[0012] A conductive film layer is connected to the conductive end of the binding component, and the conductive film layer is connected to the conductive end of the circuit layer through the first connecting portion.

[0013] Furthermore, the first connecting portion includes a first through hole opened on the first base layer and a first metal wire arranged in the first through hole;

[0014] The second connection portion includes a second through hole opened on the second base layer and a second metal wire arranged in the second through hole.

[0015] Furthermore, an inorganic layer is disposed on a surface of the first base layer close to the circuit layer, and the inorganic layer is located between the first base layer and the circuit layer.

[0016] Furthermore, the binding component includes a flexible circuit board and a chip.

[0017] The conductive film layer includes a first conductive film layer and a second conductive film layer, wherein the conductive end of the flexible circuit board is electrically connected to the first conductive film layer, and the conductive end of the chip is electrically connected to the second conductive film layer;

[0018] Preferably, the conductive film layer comprises:

[0019] Conductive layer,

[0020] a first conductive adhesive layer located on the first surface of the conductive layer,

[0021] A second conductive adhesive layer located on the second surface of the conductive layer

[0022] Furthermore, a waterproof film layer is provided on a surface of the first base layer facing away from the circuit layer, and the waterproof film layer covers the binding component and the conductive film layer.

[0023] Furthermore, the display panel further includes:

[0024] A display layer, the display layer is located on the surface of the array film layer away from the second layer, the display layer includes a stacked structure consisting of a support layer, a display screen, and a polarizing layer,

[0025] A black-coated surface is provided on the surface of the display screen body close to the polarizing layer, and the black-coated surface is located at the frame portion of the display screen body;

[0026] A black glue layer is provided on the edge end surface of the display layer stacking structure, and the black glue layer is connected to the black-coated surface;

[0027] The color difference between the black-coated surface and the black glue layer is ΔE≤1.

[0028] Furthermore, the display panel further includes:

[0029] Cover plate, optical adhesive layer and display layer, wherein:

[0030] The optical adhesive layer is located on the surface of the display layer close to the cover plate.

[0031] The optical adhesive layer comprises:

[0032] The blackened portion is located at a frame portion of the display layer on the projection surface of the display layer.

[0033] a transparent portion, wherein a projection surface of the transparent portion on the display layer is located in a display area in the middle of the display layer,

[0034] A black glue layer is provided on the edge end surface of the display layer, and the black glue layer is connected to the black-coated portion;

[0035] The color difference between the blackened portion and the black glue layer is ΔE≤1.

[0036] In a second aspect, a method for preparing a display panel is provided, the method comprising:

[0037] S1, providing a glass substrate, coating a first base layer on the glass substrate by a photoresist coating method,

[0038] S2, depositing an inorganic layer on the first base layer by chemical vapor deposition,

[0039] S3, depositing a circuit layer on the inorganic layer by physical vapor deposition, wherein the circuit layer includes a driving circuit and a metal wiring in a binding area,

[0040] S4, coating a second base layer on the circuit layer by a photoresist coating method, etching at least one second through hole on the second base layer by laser engraving, and forming a second metal wire in the second through hole by nanoimprinting,

[0041] S5, forming an array film layer on a surface of the second base layer away from the circuit layer, and electrically connecting the conductive end of the array film layer to the driving circuit through the second metal wire,

[0042] S6, coating an optical adhesive layer on the surface of the display layer facing away from the array film layer,

[0043] S7, forming a display layer on the array film layer, and performing a light shielding process on the display layer,

[0044] S8, providing a cover plate, and bonding the cover plate to the display layer through the optical adhesive layer,

[0045] S9, peeling the glass substrate from the first base layer, etching at least one first through hole on the first base layer by laser etching, and forming a first metal wire in the first through hole by nanoimprinting,

[0046] S10. Provide a binding component, wherein the binding component includes a flexible current plate and a chip, and connect the conductive end of the flexible current plate and the conductive end of the chip to a conductive film layer, and the conductive film layer is electrically connected to the metal wiring of the binding area through the first metal wire.

[0047] Furthermore, the display layer includes a laminated structure consisting of a support layer, a display screen and a polarizing layer, and the display panel preparation method includes:

[0048] A coating process is used to blacken the frame portion of the display screen body on the side surface close to the polarizing layer to form a blackened surface.

[0049] Apply black glue on the edge end surface of the display layer stacked structure to form a black glue layer, wherein the black glue layer is connected to the black-coated surface;

[0050] Preferably, the preparation method comprises:

[0051] Applying optical glue on the surface of the polarizing layer away from the display screen by inkjet printing, wherein the optical glue on the frame of the display assembly is black optical glue, and the optical glue on the middle display area of ​​the display assembly is transparent optical glue;

[0052] Black glue is spot-coated on the edge end surface of the display layer stacked structure to form a black glue layer, and the black glue layer is connected to the black-coated surface.

[0053] In a third aspect, the present invention further provides an electronic device, comprising the above-mentioned display panel.

[0054] It can be seen from the above scheme that the inkjet printing device and display panel preparation method provided by this scheme have the following advantages:

[0055] Two layers of base layers are set, and the border wiring of the display panel (GIP, VSS and other driving circuits) and the metal wiring of the binding area are guided between the two layers of base layers, and the border wiring structure is eliminated, thereby reducing the border of the display panel and achieving an extremely narrow border or even a zero border effect.

[0056] Holes are engraved on the base layer close to the display layer, and conductive metal wires are set in the holes to connect the AA area pixel circuit in the array film layer with the pre-wired GIP, VSS and other driving circuits and the binding area metal wiring, so that the display panel can display normally while the border is reduced.

[0057] Holes are cut on the base layer near the binding area, and conductive metal wires are set in the holes, so that the metal wires in the binding area are guided to the back of the display panel, so that the chip (IC) and the flexible circuit board (FPC) in the binding area can be electrically connected.

[0058] The binding area on the back of the screen uses a conductive film structure with a conductive material in the middle and attached with double-sided conductive adhesive on the top and bottom to replace the original ACF (anisotropic conductive adhesive) and IC and FPC high-temperature binding. Therefore, during the IC and FPC binding process, the binding requirements of IC and FPC do not need to be met under high temperature and high pressure conditions, thus preventing damage to the screen caused by excessive temperature and pressure.

[0059] After the conductive film on the back of the screen is connected to the IC and FPC, a layer of high temperature resistant transparent waterproof protective film is attached to prevent the conductive film from being eroded by water and to make it easy to check the attachment status, preventing false connection and corrosion problems.

[0060] A layer of black material is coated on the surface of the screen frame packaging layer through an exposure and development process, a vapor deposition process, or an inkjet printing process, or the frame area of ​​the optical adhesive layer is dyed black to reduce light leakage and edge leakage caused by light passing through the back, replace the original edge ink structure, and reduce the width of the display panel frame.

[0061] Black glue is applied around the screen laminate, and the color difference between the black glue and the blackened area is ΔE≤1, which solves the light leakage problem at the edge of the screen. The integrated structure of the black glue and the blackened area replaces the cover ink design to achieve the effect of a narrow border on the terminal. BRIEF DESCRIPTION OF THE DRAWINGS

[0062] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0063] Figure 1 FIG. 4 is a schematic diagram of a display panel structure in an embodiment of the present invention.

[0064] Figure 2 Schematic diagram of the black-dyed area and black glue structure of the display layer in one embodiment of the present invention.

[0065] Figure 3 FIG. 4 is a schematic diagram of the structure of a display panel in another embodiment of the present invention.

[0066] Figure 4 It is a schematic diagram of the black-dyed area and black glue structure of the display layer in another embodiment of the present invention.

[0067] Figure 5 FIG. 4 is a schematic diagram of a conductive film structure in an embodiment of the present invention.

[0068] Figure 6 Schematic diagram of the left and right frame vinyl tape angles in one embodiment of the present invention Figure 1 .

[0069] Figure 7 Schematic diagram of the left and right frame vinyl tape angles in one embodiment of the present invention Figure 2 .

[0070] Figure 8 Schematic diagram of the left and right frame vinyl tape angles in one embodiment of the present invention Figure 3 .

[0071] Fig. 9 Schematic diagram of the upper frame black tape angle in one embodiment of the present invention Figure 1 .

[0072] Fig.10 Schematic diagram of the upper frame black tape angle in one embodiment of the present invention Figure 2 .

[0073] Fig.11 The upper frame black tape angle diagram in one embodiment of the present invention Figure 3 .

[0074] Fig.12 FIG. 4 is a flow chart of a method for manufacturing a display panel in yet another embodiment of the present invention.

[0075] Fig.13 The figure is a flow chart of a display layer encapsulation method in yet another embodiment of the present invention.

[0076] Fig.14 This is a flow chart of a display layer encapsulation method in yet another embodiment of the present invention.

[0077] The components in the figure are shown as follows:

[0078] 1. First base layer; 11. First metal wire; 2. Second base layer; 21. Second metal wire; 3. Inorganic layer; 4. Circuit layer; 5. Array film layer; 6. Flexible circuit board; 7. Chip; 8. First conductive film layer; 9. Second conductive film layer; 91. Conductive film; 92. First conductive adhesive layer; 93. Second conductive adhesive layer; 10. Waterproof film layer; 110. Display layer; 111. Support layer; 112. Display screen; 113. Polarizing layer; 12. Optical adhesive layer; 13. Cover plate; 14. Black-coated surface; 15. Black-coated portion; 16. Transparent portion; 17. Black adhesive layer. DETAILED DESCRIPTION

[0079] The preferred embodiments of the present invention are described below with reference to the drawings in the specification to prove that the present invention can be implemented. The embodiments of the invention can fully introduce the present invention to those skilled in the art, making its technical content clearer and easier to understand. The present invention can be embodied through many different forms of embodiments of the invention, and the protection scope of the present invention is not limited to the embodiments mentioned in the text.

[0080] In the drawings, components with the same structure are indicated by the same numerical reference numerals, and components with similar structures or functions are indicated by similar numerical reference numerals. The size and thickness of each component shown in the drawings are arbitrarily shown, and the present invention does not limit the size and thickness of each component. In order to make the illustration clearer, the thickness of the components is appropriately exaggerated in some places in the drawings.

[0081] In addition, the following descriptions of the various embodiments of the invention are made with reference to the attached diagrams to illustrate specific embodiments of the invention that the present invention can be implemented with. The directional terms mentioned in the present invention, such as "upper", "lower", "front", "back", "left", "right", "inner", "outer", "side", etc., are only with reference to the directions of the attached drawings. Therefore, the directional terms used are for better and clearer description and understanding of the present invention, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third", etc. are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0082] When some components are described as being "on" another component, the component may be directly placed on the other component; there may also be an intermediate component on which the component is placed, and the intermediate component is placed on the other component. When a component is described as being "mounted on" or "connected to" another component, the two may be understood to be directly "mounted on" or "connected", or one component may be indirectly "mounted on" or "connected to" another component via an intermediate component.

[0083] Overview

[0084] As described in the background technology, the current OLED flexible display panel products have relatively large bezels, because the bezel of the display panel has driving circuits such as GIP, VSS, and binding area wiring. In addition, in the binding area on the back of the display screen (the part corresponding to the light-emitting area of ​​the display panel, also called the screen), the IC (chip) and FPC (flexible circuit board) are connected to the ACF (anisotropic conductive adhesive). During the binding process, hot pressing at high temperature is required, which will cause damage to the screen (the OLED screen can withstand temperatures below 90°C). At the same time, during the packaging process of the display screen, the conventional solution is to apply ink on the edge of the cover plate to block the screen frame wiring and the edge light leakage area. The cover plate ink will cause the display panel frame to become wider, and light leakage will occur.

[0085] In view of the above situation, the inventor has improved the display panel, and the specific improvement scheme is as follows:

[0086] Two layers of base layers are set, and the border wiring of the display panel (GIP, VSS and other driving circuits) and the metal wiring of the binding area are guided between the two layers of base layers, and the border wiring structure is eliminated, thereby reducing the border of the display panel and achieving an extremely narrow border or even a zero border effect.

[0087] Holes are engraved on the base layer close to the display layer, and conductive metal wires are set in the holes to connect the AA area pixel circuit in the array film layer with the pre-wired GIP, VSS and other driving circuits and the binding area metal wiring, so that the display panel can display normally while the border is reduced.

[0088] Holes are cut on the base layer near the binding area, and conductive metal wires are set in the holes, so that the metal wires in the binding area are guided to the back of the display panel, so that the chip (IC) and the flexible circuit board (FPC) in the binding area can be electrically connected.

[0089] The binding area on the back of the screen uses a conductive film structure with a conductive material in the middle and attached with double-sided conductive adhesive on the top and bottom to replace the original ACF (anisotropic conductive adhesive) and IC and FPC high-temperature binding. Therefore, during the IC and FPC binding process, the binding requirements of IC and FPC do not need to be met under high temperature and high pressure conditions, thus preventing damage to the screen caused by excessive temperature and pressure.

[0090] After the conductive film on the back of the screen is connected to the IC and FPC, a layer of high temperature resistant transparent waterproof protective film is attached to prevent the conductive film from being eroded by water and to make it easy to check the attachment status, preventing false connection and corrosion problems.

[0091] Black material is coated on the surface of the screen frame encapsulation layer to form a black surface, or the frame area of ​​the optical adhesive layer is dyed black to reduce light leakage and edge leakage caused by light passing through the back, replace the original edge ink structure, and reduce the width of the display panel frame.

[0092] Black glue is applied around the screen laminate, and the color difference between the black glue and the blackened area is ΔE≤1, which solves the light leakage problem at the edge of the screen. The integrated structure of the black glue and the blackened area replaces the cover ink design to achieve the effect of a narrow border on the terminal.

[0093] Based on the above concept, the present application will be exemplarily described below in conjunction with the accompanying drawings.

[0094] Exemplary Structure

[0095] This embodiment provides a display panel such as Figure 1 and Figure 3 Shown, including

[0096] A first base layer 1 is provided with a first through hole 1a, and a first metal wire 11 is arranged in the first through hole 1a.

[0097] A second base layer 2 is provided with a second through hole 2a, and a second metal wire 21 is arranged in the second through hole 2a.

[0098] A binding component is arranged on the upper surface (back side) of the first base layer 1, and the binding component includes an IC (chip 7) and an FPC (flexible circuit board 6). An inorganic layer 3 is deposited on the lower surface (front side) of the first base layer 1, and the inorganic layer 3 is used to isolate water and oxygen. A circuit layer 4 is deposited on the lower surface of the inorganic layer 3, and the circuit layer 4 is located between the inorganic layer 3 and the second base layer 2. The driving circuit includes driving circuits such as GIP and VSS, and metal wiring in the binding area;

[0099] An array film layer 5 is disposed on the lower surface of the second base layer 2. The array film layer 5 includes an AA region pixel circuit for driving the display screen 112.

[0100] The conductive end of the pixel circuit in the AA area is led to the circuit layer 4 through the second metal wire 21 in the second through hole through the second base layer 2 and is electrically connected to the driving circuits such as GIP and VSS;

[0101] The conductive end of the flexible circuit board 6 is electrically connected to the first conductive film layer 8.

[0102] The conductive end of the chip 7 is electrically connected to the second conductive film layer 9;

[0103] The first conductive film layer 8 and the second conductive film layer 9 are both led to the metal wiring of the binding area through the first metal wire 11 in the first through hole through the first base layer 1, so that the IC and FPC are electrically connected with the driving circuits such as GIP and VSS;

[0104] It can be seen in the above embodiments that the frame wiring (GIP, VSS and other driving circuits) and the metal wiring in the binding area of ​​the display panel are guided between the two layers of the base layer, the frame wiring structure is eliminated, and the frame of the display panel is reduced; holes are engraved on the base layer close to the display layer 110, and conductive metal wires are arranged in the holes, so that the AA area pixel circuit in the array film layer 5 is connected with the GIP, VSS and other driving circuits and the metal wiring in the binding area that are wired in advance, so that the display panel can display normally while the frame is reduced; and holes are engraved on the base layer close to the binding area, and conductive metal wires are arranged in the holes, so that the metal wires in the binding area are guided to the back of the display panel, so that the chip 7 (IC) and the flexible circuit board 6 (FPC) in the binding area can be electrically conductive.

[0105] It should be noted that after holes are engraved on the first base layer 1 and the second base layer 2 , metal wires for conduction are formed in the holes by nano-imprinting.

[0106] In some embodiments, Figure 5 As shown, the first conductive film layer 8 and the second conductive film layer 9 have the same structure, and both include:

[0107] A conductive film, a first conductive adhesive layer 92 located on the upper surface of the conductive film, and a second conductive adhesive layer 93 located on the lower surface of the conductive film;

[0108] A conductive film layer is used to replace ACF (anisotropic conductive adhesive). Traditional ACF needs to be bonded with IC and FPC under high temperature and high pressure environment. Because the OLED screen can withstand a temperature below 90°C, using ACF to bind on the back of the screen will cause damage to the screen. The conductive film layer can be bonded with IC and FPC without using high temperature and high pressure conditions, and also meets the conductivity performance of ACF.

[0109] It should be noted that the conductive film layer structure has a conductive film in the middle, which is made of conductive material and can be metal, conductive fiber or other materials. The upper and lower surfaces of the conductive film are attached with double-sided conductive adhesive, which requires excellent adhesion to a variety of objects and can pass high temperature and high humidity (such as 85℃ / 85%) tests, salt spray tests, etc.

[0110] The conductive film layer has good conductivity and good electromagnetic shielding effect;

[0111] The conductive film layer does not contain halogen and has excellent cutting performance;

[0112] The conductive film layer is flexible and has excellent adhesion to non-flat parts;

[0113] The conductive film layer can be used for electromagnetic wave shielding or grounding.

[0114] In some embodiments, a waterproof film layer 10 is disposed on a surface of the first base layer 1 facing away from the circuit layer 4 , and the waterproof film layer 10 covers the binding component and the conductive film layer.

[0115] In some embodiments, Figure 2 As shown, the display panel further includes a display layer 110, and the display layer 110 includes a laminated structure consisting of a support layer 111, a display screen body 112 and a polarizing layer 113.

[0116] A black-coated surface 14 is provided on the lower surface of the display screen body 112, and the black-coated surface 14 is located in the frame portion of the display screen body 112; a black glue layer 17 is provided on the edge end surface of the display layer 110 laminated structure, and the black glue layer 17 is connected to the black-coated surface 14, and the color difference ΔE between the black-coated surface 14 and the black glue layer 17 is ≤1.

[0117] It should be noted that the bottom surface of the display screen 112 is coated with a black border. The blackened material is an organic material plus a pigment, carbon powder, or an inorganic material. It can effectively block the bottom light projection and reduce the brightness of the border. The OD value of this material is ≥5.

[0118] The coating process includes an exposure and development process, an evaporation process, and an inkjet printing process, but is not limited thereto, and also includes a coating process that can achieve the same or similar functions.

[0119] It should be noted that black glue is applied to the edge end surface of the display layer 110 laminated structure, and the glue application process can be regulated by adjusting the viscosity, pressure and speed of the glue material. The black glue material can be acrylic, silicone, fluorine and polyurethane. The black-coated surface 14 and the black glue layer 17 realize an overall one-piece black design to achieve the effect of completely replacing ink. The black glue around the screen body adjusts the OD value by controlling the density and material of the black particles in the glue material, and the color difference with the black-coated surface 14 satisfies ΔE≤1, achieving the effect of one-piece black of the module frame.

[0120] In some embodiments, Figure 4 As shown, the display panel further includes a cover plate 13 and an optical adhesive layer 12, wherein:

[0121] The optical adhesive layer 12 is located between the cover plate 13 and the display layer 110, specifically between the cover plate 13 and the polarizing layer 113 of the display layer 110.

[0122] The optical adhesive layer 12 includes:

[0123] The blackened portion 15 is located at the frame portion of the display layer 110 on the projection surface of the display layer 110.

[0124] The transparent portion 16, the projection surface of the transparent portion 16 on the display layer 110 is located in the display area in the middle of the display layer 110,

[0125] The edge end surface of the display layer 110 is provided with a black glue layer 17, the black glue layer 17 is connected to the black coating portion 15, and the color difference ΔE between the black coating portion 15 and the black glue layer 17 is ≤1;

[0126] It should be noted that black OCR glue is coated on the lower surface of the polarizing layer 113 of the display layer 110 through an inkjet printing process for shading, black glue is printed at the frame position, transparent glue is printed in the display area, and black glue (transmittance < 0.0001) is printed at the frame position to achieve the effect of shielding the screen frame.

[0127] The black coated portion 15 and the black glue layer 17 realize an integral black design, achieving the effect of completely replacing ink. The black glue around the screen body adjusts the OD value by controlling the density and material of black particles in the glue material, and the color difference with the black coated surface 14 satisfies ΔE≤1.

[0128] It should be noted that in the above two embodiments, the elimination of the blackening of the ink frame of the cover plate 13 and the structure of the integrated black glue design can reduce the module frame by 0.15 mm and achieve the effect of AA-VA distance a=0.

[0129] It should be noted that during the process of applying black glue, the glue will sag, that is, the shape of the actual black glue has a certain taper. The following conditions must be met to avoid light leakage:

[0130] like Figure 6 to Figure 11 As shown, the left and right frame black glue coating taper angles need to satisfy θ1>55°, θ2<35°, and the upper frame black glue coating taper angles need to satisfy θ3>54°, θ4<36°. At this time, no light is emitted from the edge of the black glue. If some light is emitted outside the above angles, slight light leakage will occur.

[0131] Exemplary Methods

[0132] This embodiment provides a method for preparing a display panel. Fig.12 As shown, the preparation method comprises:

[0133] S1, providing a glass substrate, coating a first base layer on the glass substrate by a photoresist coating method,

[0134] S2, depositing an inorganic layer on the first base layer by chemical vapor deposition,

[0135] S3, a circuit layer is formed on the inorganic layer by physical vapor deposition, the circuit layer includes a driving circuit and a metal wiring in the binding area,

[0136] S4, coating a second base layer on the circuit layer by a photoresist coating method, etching at least one second through hole on the second base layer by laser engraving, and forming a second metal wire in the second through hole by nanoimprinting,

[0137] S5, forming an array film layer on the surface of the second base layer away from the circuit layer, and electrically connecting the conductive end of the array film layer to the driving circuit through a second metal wire,

[0138] S6, coating an optical adhesive layer on the surface of the display layer facing away from the array film layer,

[0139] S7, forming a display layer on the array film layer, and performing light shielding treatment on the display layer,

[0140] S8, providing a cover plate, and bonding the cover plate to the display layer through an optical adhesive layer;

[0141] S9, peeling the glass substrate from the first base layer, etching at least one first through hole on the first base layer by laser etching, and forming a first metal line in the first through hole by nanoimprinting,

[0142] S10, providing a binding component, the binding component comprising a flexible current plate and a chip, connecting the conductive end of the flexible current plate and the conductive end of the chip to the conductive film layer, and the conductive film layer is electrically connected to the metal routing of the binding area through a first metal wire.

[0143] In some embodiments, the display layer includes a laminated structure consisting of a support layer, a display screen body, and a polarizing layer, such as Fig.13 As shown, the display panel preparation method includes:

[0144] S71, using a coating process to blacken the frame portion of the display screen body on the side close to the polarizing layer to form a black-coated surface,

[0145] S72, applying black glue on the edge end surface of the display layer stacking structure to form a black glue layer, and the black glue layer is connected to the black-coated surface;

[0146] Preferably,

[0147] like Fig.14 As shown, the preparation method comprises:

[0148] S71, applying optical glue on the surface of the polarizing layer away from the display screen by inkjet printing, wherein the optical glue on the frame of the display assembly is black optical glue, and the optical glue on the display area in the middle of the display assembly is transparent optical glue;

[0149] S72, applying black glue on the edge end surface of the display layer stacking structure to form a black glue layer, and the black glue layer is connected to the black-coated surface.

[0150] Exemplary Electronic Devices

[0151] The present invention further provides an electronic device, comprising the display panel of any one of the above embodiments.

[0152] Although the present invention is described herein with reference to specific embodiments, it should be understood that these embodiments are merely examples of the principles and applications of the present invention. It should therefore be understood that many modifications may be made to the exemplary embodiments and that other arrangements may be devised without departing from the spirit and scope of the present invention as defined by the appended claims. It should be understood that the various dependent claims and features described herein may be combined in a manner different from that described in the original claims. It should also be understood that features described in conjunction with individual embodiments may be used in other described embodiments.

Claims

1. A display panel, characterized in that: include: A first base layer, wherein a first connecting portion penetrating through the first base layer is provided on the first base layer; A second base layer, wherein a second connecting portion penetrating through the second base layer is provided on the second base layer; A circuit layer, wherein the circuit layer is located between the first base layer and the second base layer; An array film layer, wherein the array film layer is located on a surface of the second base layer away from the circuit layer, and a conductive end of the array film layer is connected to a conductive end of the circuit layer through the second connecting portion; a binding component, the binding component is located on a surface of the first base layer facing away from the circuit layer, and the binding component has a conductive end; and A conductive film layer is electrically connected to the conductive end of the binding component, and the conductive film layer is connected to the conductive end of the circuit layer through the first connecting portion.

2. The display panel according to claim 1, wherein: The first connecting portion includes a first through hole opened on the first base layer and a first metal wire arranged in the first through hole; The second connection portion includes a second through hole opened on the second base layer and a second metal wire arranged in the second through hole.

3. The display panel according to claim 1, wherein: An inorganic layer is disposed on a surface of the first base layer close to the circuit layer, and the inorganic layer is located between the first base layer and the circuit layer.

4. The display panel according to claim 1, wherein: The binding component includes a flexible circuit board and a chip; the conductive film layer includes a first conductive film layer and a second conductive film layer; wherein the conductive end of the flexible circuit board is electrically connected to the first conductive film layer, and the conductive end of the chip is electrically connected to the second conductive film layer; Preferably, the conductive film layer comprises: a conductive layer, A first conductive adhesive layer is located on the first surface of the conductive layer, and a second conductive adhesive layer is located on the second surface of the conductive layer.

5. The display panel according to claim 1, wherein: A waterproof film layer is disposed on a surface of the first base layer facing away from the circuit layer, and the waterproof film layer covers the binding component and the conductive film layer.

6. The display panel according to claim 1, wherein: Also includes: A display layer, the display layer is located on the surface of the array film layer away from the second base layer, and the display layer includes a laminated structure consisting of a support layer, a display screen, and a polarizing layer. A black-coated surface is provided on the surface of the display screen body close to the polarizing layer, and the black-coated surface is located at the frame portion of the display screen body; A black glue layer is provided on the edge end surface of the display layer stacking structure, and the black glue layer is connected to the black-coated surface; The color difference between the black-coated surface and the black glue layer is ΔE≤1.

7. The display panel according to claim 1, wherein: Also includes: Cover plate, optical adhesive layer and display layer, wherein: The optical adhesive layer is located on the surface of the display layer close to the cover plate. The optical adhesive layer comprises: The blackened portion is located at a frame portion of the display layer on the projection surface of the display layer. a transparent portion, wherein a projection surface of the transparent portion on the display layer is located in a display area in the middle of the display layer, A black glue layer is provided on the edge end surface of the display layer, and the black glue layer is connected to the black-coated portion; The color difference between the blackened portion and the black glue layer is ΔE≤1.

8. A method for preparing a display panel, characterized in that: The preparation method comprises: S1, providing a glass substrate, coating a first base layer on the glass substrate by a photoresist coating method, S2, depositing an inorganic layer on the first base layer by chemical vapor deposition, S3, depositing a circuit layer on the inorganic layer by physical vapor deposition, wherein the circuit layer includes a driving circuit and a metal wiring in a binding area, S4, coating a second base layer on the circuit layer by a photoresist coating method, etching at least one second through hole on the second base layer by laser engraving, and forming a second metal wire in the second through hole by nanoimprinting, S5, forming an array film layer on a surface of the second base layer away from the circuit layer, and electrically connecting the conductive end of the array film layer to the driving circuit through the second metal wire, S6, coating an optical adhesive layer on the surface of the display layer facing away from the array film layer, S7, forming a display layer on the array film layer, and performing a light shielding process on the display layer, S8, providing a cover plate, and bonding the cover plate to the display layer through the optical adhesive layer; S9, peeling the glass substrate from the first base layer, etching at least one first through hole on the first base layer by laser etching, and forming a first metal wire in the first through hole by nanoimprinting, S10. Provide a binding component, wherein the binding component includes a flexible current plate and a chip, and connect the conductive end of the flexible current plate and the conductive end of the chip to a conductive film layer, and the conductive film layer is electrically connected to the metal wiring of the binding area through the first metal wire.

9. The method for preparing a display panel according to claim 8, wherein: The display layer includes a laminated structure consisting of a support layer, a display screen and a polarizing layer. The display panel preparation method includes: using a coating process to blacken the frame portion of the display screen on the side surface close to the polarizing layer to form a black-coated surface, and applying black glue on the edge end surface of the display layer laminated structure to form a black glue layer, wherein the black glue layer is connected to the black-coated surface; Preferably, the preparation method comprises: Optical glue is applied on the surface of the polarizing layer away from the display screen by inkjet printing, the optical glue on the frame of the display component is black, and the optical glue on the middle display area of ​​the display component is transparent; black glue is applied on the edge end surface of the display layer stacking structure to form a black glue layer, and the black glue layer is connected to the black-coated surface.

10. An electronic device, characterized in that: The invention comprises the display panel according to any one of claims 1 to 7.

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