Display panel, preparation method thereof and electronic device

Abstract

The application provides a display panel, a preparation method thereof and an electronic device, comprising a first base layer, a first connecting part penetrating through the first base layer arranged on the first base layer, a second base layer, a second connecting part penetrating through the second base layer arranged on the second base layer, a circuit layer, the circuit layer being located between the first base layer and the second base layer, an array film layer, the array film layer being located on a surface of the second base layer away from the circuit layer, and a conductive end of the array film layer being connected with a conductive end of the circuit layer through the second connecting part; a binding assembly, the binding assembly being located on a surface of the first base layer away from the circuit layer, and a conductive end of the binding assembly being connected with a conductive film layer, the conductive film layer being connected with the conductive end of the circuit layer through the first connecting part; the scheme guides the frame wire and the binding area metal wire of the display panel to between the two base layers, cancels the frame wire structure, thereby reducing the frame of the display panel, and realizing the effect of extremely narrow frame or zero frame.

Description

Technical Field

[0001] This invention relates to the field of display technology, and in particular to a display panel, its manufacturing method, and electronic devices. Background Technology

[0002] Organic electroluminescent display (OLED) panels have gradually become the mainstream in the display field due to their excellent performance such as low power consumption, high color saturation, wide viewing angle, thinness, and flexibility. They can be widely used in terminal products such as smartphones, tablets, and televisions.

[0003] With technological advancements and rising consumer aesthetic standards, terminal displays require thinner and lighter designs and further reduction in bezel size. Currently, OLED flexible display panels have relatively large bezels, making the reduction of display panel bezels a top priority for technological improvement. Summary of the Invention

[0004] The purpose of this invention is to provide a display panel, its manufacturing method, and an electronic device to solve the technical problem of large bezels in existing display panels.

[0005] To achieve the above objectives, the present invention provides the following technical solution:

[0006] In a first aspect, a display panel includes:

[0007] The first base layer has a first connecting part that penetrates through it.

[0008] The second base layer has a second connecting part that penetrates through it.

[0009] The circuit layer is located between the first base layer and the second base layer.

[0010] An array film layer is located on the surface of the second base layer opposite to the circuit layer, and the conductive end of the array film layer is connected to the conductive end of the circuit layer through the second connecting portion;

[0011] A bonding component is located on the surface of the first base layer opposite to the wiring layer, and the bonding component has a conductive terminal.

[0012] A conductive film layer is connected to the conductive end of the bonding component, and the conductive film layer is connected to the conductive end of the circuit layer through the first connecting portion.

[0013] Furthermore, the first connecting portion includes a first through hole formed on the first base layer and a first metal wire disposed within the first through hole;

[0014] The second connecting portion includes a second through hole formed on the second base layer and a second metal wire disposed within the second through hole.

[0015] Furthermore, an inorganic layer is provided on the surface of the first base layer near the circuit layer, and the inorganic layer is located between the first base layer and the circuit layer.

[0016] Furthermore, the bonding component includes a flexible circuit board and a chip.

[0017] The conductive film layer includes a first conductive film layer and a second conductive film layer, wherein the conductive end of the flexible circuit board is electrically connected to the first conductive film layer, and the conductive end of the chip is electrically connected to the second conductive film layer.

[0018] Preferably, the conductive film layer comprises:

[0019] conductive layer

[0020] The first conductive adhesive layer is located on the first surface of the conductive layer.

[0021] The second conductive adhesive layer located on the second surface of the conductive layer

[0022] Furthermore, a waterproof membrane layer is provided on the surface of the first base layer facing away from the circuit layer, and the waterproof membrane layer covers the bonding component and the conductive membrane layer.

[0023] Furthermore, the display panel also includes:

[0024] The display layer is located on the surface of the array film layer opposite to the second layer. The display layer includes a stacked structure consisting of a support layer, a display body, and a polarizing layer.

[0025] A blackened surface is provided on the surface of the display body near the polarizing layer, and the blackened surface is located at the border of the display body.

[0026] A black adhesive layer is provided on the edge end face of the display layer stack structure, and the black adhesive layer is connected to the blackened surface;

[0027] The color difference ΔE between the blackened surface and the black adhesive layer is ≤1.

[0028] Furthermore, the display panel also includes:

[0029] Cover plate, optical adhesive layer and display layer, wherein:

[0030] The optical adhesive layer is located on the surface of the display layer near the cover plate.

[0031] The optical adhesive layer includes:

[0032] The blackened portion is located on the border of the display layer, where its projection surface is situated.

[0033] A transparent portion, wherein the projection surface of the transparent portion on the display layer is located in the display area in the middle of the display layer.

[0034] A black adhesive layer is provided on the edge end face of the display layer, and the black adhesive layer is connected to the blackened part;

[0035] The color difference ΔE between the blackened part and the black adhesive layer is ≤1.

[0036] Secondly, a method for manufacturing a display panel, the method comprising:

[0037] S1. Provide a glass substrate, and coat a first base layer on the glass substrate using a photoresist coating method.

[0038] S2. An inorganic layer is deposited on the first substrate by chemical vapor deposition.

[0039] S3. A circuit layer is deposited on the inorganic layer using physical vapor deposition. The circuit layer includes a driving circuit and bonding area metal traces.

[0040] S4. A second base layer is coated on the circuit layer using a photoresist coating method, and at least one second through-hole is etched on the second base layer using a laser etching method. A second metal line is formed within the second through-hole using nanoimprinting.

[0041] S5. An array film layer is formed on the surface of the second base layer opposite to the circuit layer, and the conductive end of the array film layer is electrically connected to the driving circuit through the second metal wire.

[0042] S6. Apply an optical adhesive layer to the surface of the display layer on the side opposite to the array film layer.

[0043] S7. A display layer is formed on the array film layer, and the display layer is subjected to light-shielding treatment.

[0044] S8. Provide a cover plate and bond the cover plate to the display layer using the optical adhesive layer.

[0045] S9. Peel the glass substrate from the first base layer, etch at least one first through hole on the first base layer using laser etching, and form a first metal line within the first through hole using nanoimprinting.

[0046] S10. Provide a bonding component, the bonding component including a flexible current plate and a chip, connecting the conductive end of the flexible current plate and the conductive end of the chip to a conductive film layer, the conductive film layer being electrically connected to the metal trace of the bonding area through the first metal line.

[0047] Furthermore, the display layer comprises a stacked structure consisting of a support layer, a display body, and a polarizing layer, and the display panel manufacturing method includes:

[0048] A coating process is used to blacken the border area of ​​the display screen surface near the polarizing layer, forming a blackened surface.

[0049] Black glue is applied to the edge end face of the display layer stack structure to form a black glue layer, and the black glue layer is connected to the blackened surface.

[0050] Preferably, the preparation method includes:

[0051] Optical adhesive is applied to the surface of the polarizing layer away from the display screen body by inkjet printing. The optical adhesive used on the edge of the display component is black, and the optical adhesive used in the middle display area of ​​the display component is transparent.

[0052] Black glue is applied to the edge face of the display layer stack to form a black glue layer, which is connected to the blackened surface.

[0053] Thirdly, the present invention also provides an electronic device including the aforementioned display panel.

[0054] As can be seen from the above solution, the inkjet printing device and display panel manufacturing method provided in this solution have the following advantages:

[0055] Two base layers are set up, and the bezel traces (driving circuits such as GIP and VSS) and bonding area metal traces of the display panel are guided between the two base layers, eliminating the bezel trace structure, thereby reducing the bezel of the display panel and achieving an extremely narrow bezel or even zero bezel effect.

[0056] Holes are etched in the base layer near the display layer, and conductive metal lines are placed inside the holes to connect the pixel circuits in the AA area of ​​the array film layer with the pre-wired driving circuits such as GIP and VSS, as well as the metal traces in the bonding area, so that the display panel can display normally while the bezel is reduced.

[0057] Holes are etched in the base layer near the bonding area, and conductive metal lines are placed inside the holes. The metal lines in the bonding area are guided to the back of the display panel, allowing the chip (IC) and flexible circuit board (FPC) in the bonding area to conduct electricity.

[0058] The bonding area on the back of the screen uses a conductive film structure with a conductive material in the middle and double-sided conductive adhesive on the top and bottom to replace the original ACF (anisotropic conductive adhesive) for high-temperature bonding with ICs and FPCs. This allows the bonding requirements of ICs and FPCs to be met without having to meet high temperature and high pressure conditions during the bonding process, thus solving the problem of damage to the screen caused by excessive temperature and pressure.

[0059] After the conductive film on the back of the screen is connected to the IC and FPC, a high-temperature resistant transparent waterproof protective film is attached to solve the problem of water erosion of the conductive film and make it easy to check the attachment status, preventing problems such as loose connections and corrosion.

[0060] A layer of black material is applied to the surface of the screen bezel encapsulation layer through exposure and development, vapor deposition, or inkjet printing, or the bezel area of ​​the optical adhesive layer is dyed black to reduce light leakage and edge leakage caused by back light transmission, replacing the original edge ink structure and reducing the width of the display panel bezel.

[0061] Black glue is applied around the screen body layer, and the color difference ΔE between the black glue and the blackened area is ≤1, which solves the problem of light leakage at the edge of the screen body. Furthermore, the integrated structure of the black glue and the blackened area replaces the cover plate ink design, achieving the effect of a narrow bezel in the terminal. Attached Figure Description

[0062] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0063] Figure 1 This is a schematic diagram of the display panel structure in one embodiment of the present invention.

[0064] Figure 2 This is a schematic diagram of the blackened area and black adhesive structure of the display layer in one embodiment of the present invention.

[0065] Figure 3 This is a schematic diagram of the display panel structure in another embodiment of the present invention.

[0066] Figure 4 This is a schematic diagram of the blackened area and black glue structure of the display layer in another embodiment of the present invention.

[0067] Figure 5 This is a schematic diagram of the conductive film structure in one embodiment of the present invention.

[0068] Figure 6 This is a schematic diagram of the angle of the black tape on the left and right sides of an embodiment of the present invention. Figure 1 .

[0069] Figure 7 This is a schematic diagram of the angle of the black tape on the left and right sides of an embodiment of the present invention. Figure 2 .

[0070] Figure 8 This is a schematic diagram of the angle of the black tape on the left and right sides of an embodiment of the present invention. Figure 3 .

[0071] Figure 9 This is a schematic diagram of the angle of the upper frame black tape in one embodiment of the present invention. Figure 1 .

[0072] Figure 10 This is a schematic diagram of the angle of the upper frame black tape in one embodiment of the present invention. Figure 2 .

[0073] Figure 11 This is a schematic diagram of the angle of the upper frame black tape in one embodiment of the present invention. Figure 3 .

[0074] Figure 12 This is a flowchart of a display panel manufacturing method in another embodiment of the present invention.

[0075] Figure 13 This is a flowchart of a display layer encapsulation method in another embodiment of the present invention.

[0076] Figure 14 This is a flowchart of a display layer encapsulation method in another embodiment of the present invention.

[0077] The components in the diagram are shown below:

[0078] 1. First base layer; 11. First metal wire; 2. Second base layer; 21. Second metal wire; 3. Inorganic layer; 4. Circuit layer; 5. Array film layer; 6. Flexible circuit board; 7. Chip; 8. First conductive film layer; 9. Second conductive film layer; 91. Conductive film; 92. First conductive adhesive layer; 93. Second conductive adhesive layer; 10. Waterproof film layer; 110. Display layer; 111. Support layer; 112. Display screen body; 113. Polarizing layer; 12. Optical adhesive layer; 13. Cover plate; 14. Blackened surface; 15. Blackened part; 16. Transparent part; 17. Black adhesive layer. Detailed Implementation

[0079] The following description, with reference to the accompanying drawings, illustrates preferred embodiments of the present invention, demonstrating its implementability. These embodiments provide a complete overview of the invention for those skilled in the art, making its technical content clearer and easier to understand. The present invention can be embodied in many different forms of embodiments, and the scope of protection of the present invention is not limited to the embodiments mentioned herein.

[0080] In the accompanying drawings, components with the same structure are indicated by the same numerical designation, and components with similar structures or functions are indicated by similar numerical designations. The dimensions and thicknesses of each component shown in the drawings are arbitrary, and the present invention does not limit the dimensions and thicknesses of each component. To make the illustrations clearer, the thickness of components is appropriately exaggerated in some places in the drawings.

[0081] Furthermore, the following descriptions of the embodiments of the invention are made with reference to the accompanying illustrations, illustrating specific embodiments in which the invention can be implemented. Directional terms used in this invention, such as "upper," "lower," "front," "rear," "left," "right," "inner," "outer," and "side," are merely directional references to the accompanying drawings. Therefore, the use of directional terms is for better and clearer explanation and understanding of the invention, and does not indicate or imply that the referred device or element must have a specific orientation, or be constructed and operated in a specific orientation; therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0082] When a component is described as being "on" another component, the component may be placed directly on the other component; alternatively, there may be an intermediate component on which the component is placed, and the intermediate component is placed on the other component. When a component is described as being "installed to" or "connected to" another component, both can be understood as being directly "installed" or "connected" to, or as being indirectly "installed to" or "connected to" another component via an intermediate component.

[0083] Overview

[0084] As described in the background section, current OLED flexible display panel products have relatively large bezels because the bezel area contains driving circuits such as GIP and VSS, as well as bonding area traces. Additionally, in the bonding area on the back of the display body (the part corresponding to the light-emitting area of ​​the display panel, also called the screen body), ICs (chips) and FPCs (flexible printed circuit boards) are connected to ACFs (anisotropic conductive adhesive). During the bonding process, hot pressing at high temperatures is required, which can cause damage to the screen body (OLED screen bodies can withstand temperatures below 90℃). Furthermore, during the display body encapsulation process, conventional solutions involve applying ink to the edge of the cover plate to cover the bezel traces and edge light leakage areas. However, this cover plate ink can widen the display panel bezel and cause light leakage.

[0085] In response to the above situation, the inventor improved the display panel, and the specific improvement scheme is as follows:

[0086] Two base layers are set up, and the bezel traces (driving circuits such as GIP and VSS) and bonding area metal traces of the display panel are guided between the two base layers, eliminating the bezel trace structure, thereby reducing the bezel of the display panel and achieving an extremely narrow bezel or even zero bezel effect.

[0087] Holes are etched in the base layer near the display layer, and conductive metal lines are placed inside the holes to connect the pixel circuits in the AA area of ​​the array film layer with the pre-wired driving circuits such as GIP and VSS, as well as the metal traces in the bonding area, so that the display panel can display normally while the bezel is reduced.

[0088] Holes are etched in the base layer near the bonding area, and conductive metal lines are placed inside the holes. The metal lines in the bonding area are guided to the back of the display panel, allowing the chip (IC) and flexible circuit board (FPC) in the bonding area to conduct electricity.

[0089] The bonding area on the back of the screen uses a conductive film structure with a conductive material in the middle and double-sided conductive adhesive on the top and bottom to replace the original ACF (anisotropic conductive adhesive) for high-temperature bonding with ICs and FPCs. This allows the bonding requirements of ICs and FPCs to be met without having to meet high temperature and high pressure conditions during the bonding process, thus solving the problem of damage to the screen caused by excessive temperature and pressure.

[0090] After the conductive film on the back of the screen is connected to the IC and FPC, a high-temperature resistant transparent waterproof protective film is attached to solve the problem of water erosion of the conductive film and make it easy to check the attachment status, preventing problems such as loose connections and corrosion.

[0091] A black material is coated on the surface of the screen bezel encapsulation layer to form a black surface, or the bezel area of ​​the optical adhesive layer is dyed black to reduce light leakage and edge leakage caused by back light transmission, replacing the original edge ink structure and reducing the width of the display panel bezel.

[0092] Black glue is applied around the screen body layer, and the color difference ΔE between the black glue and the blackened area is ≤1, which solves the problem of light leakage at the edge of the screen body. Furthermore, the integrated structure of the black glue and the blackened area replaces the cover plate ink design, achieving the effect of a narrow bezel in the terminal.

[0093] Based on the above concept, the present application will be described exemplarily below with reference to the accompanying drawings.

[0094] Exemplary Structure

[0095] This embodiment provides a display panel, such as Figure 1 and Figure 3 As shown, including

[0096] A first base layer 1 is formed on the first base layer 1, and a first through hole 1a is provided in the first through hole 1a.

[0097] A second base layer 2 is provided, and a second through hole 2a is formed therein. A second metal wire 21 is installed in the second through hole 2a.

[0098] A bonding assembly is disposed on the upper surface (back side) of the first base layer 1. The bonding assembly includes an IC (chip 7) and an FPC (flexible printed circuit board 6). An inorganic layer 3 is deposited on the lower surface (front side) of the first base layer 1. The inorganic layer 3 is used to isolate water and oxygen. A circuit layer 4 is deposited on the lower surface of the inorganic layer 3. The circuit layer 4 is located between the inorganic layer 3 and the second base layer 2. The driving circuit includes driving circuits such as GIP and VSS, as well as metal traces in the bonding area.

[0099] An array film layer 5 is disposed on the lower surface of the second base layer 2. The array film layer 5 includes the pixel circuitry for driving the AA area of ​​the display screen body 112.

[0100] The conductive end of the pixel circuit in area AA passes through the second metal wire 21 in the second through hole, passes through the second base layer 2, and is led to the circuit layer 4 and electrically connected to the driving circuits such as GIP and VSS.

[0101] The conductive end of the flexible circuit board 6 is electrically connected to the first conductive film layer 8.

[0102] The conductive terminal of chip 7 is electrically connected to the second conductive film layer 9;

[0103] Both the first conductive film layer 8 and the second conductive film layer 9 pass through the first metal line 11 in the first through hole and are led to the bonding area metal trace through the first base layer 1, thereby making the IC and FPC electrically connected to the driving circuits such as GIP and VSS;

[0104] As can be seen in the above embodiments, the bezel traces (driving circuits such as GIP and VSS) and bonding area metal traces of the display panel are guided between the two base layers, eliminating the bezel trace structure and reducing the bezel of the display panel; holes are etched on the base layer near the display layer 110, and conductive metal lines are set in the holes, so that the pixel circuits of the AA area in the array film layer 5 are connected to the pre-wired driving circuits such as GIP and VSS and the bonding area metal traces, so that the display panel can display normally while the bezel is reduced; and holes are etched on the base layer near the bonding area, and conductive metal lines are set in the holes, so that the metal lines of the bonding area are guided to the back of the display panel, so that the chip 7 (IC) and the flexible circuit board 6 (FPC) in the bonding area can be electrically connected.

[0105] It should be noted that after holes are etched on the first base layer 1 and the second base layer 2, metal wires for conduction are formed inside the holes by nanoimprinting.

[0106] In some embodiments, such as Figure 5 As shown, the first conductive film layer 8 and the second conductive film layer 9 described above have the same structure, both including:

[0107] A conductive film, a first conductive adhesive layer 92 located on the upper surface of the conductive film, and a second conductive adhesive layer 93 located on the lower surface of the conductive film;

[0108] Using a conductive film layer instead of ACF (Anisotropic Conductive Adhesive), traditional ACF requires high temperature and high pressure to bond with ICs and FPCs. Since OLED screens can withstand temperatures below 90°C, using ACF for bonding on the back of the screen can cause screen damage. However, using a conductive film layer allows bonding with ICs and FPCs without high temperature and high pressure, while still achieving the same conductivity as ACF.

[0109] It should be noted that the conductive film layer structure has a conductive film in the middle, which is made of conductive material, such as metal or conductive fiber. The upper and lower surfaces of the conductive film are attached with double-sided conductive adhesive, which is required to have excellent adhesion to various objects and pass high temperature and high humidity (e.g., 85℃ / 85%) tests and salt spray tests.

[0110] The conductive film layer has good electrical conductivity and good electromagnetic shielding effect;

[0111] The conductive film layer is halogen-free and has excellent cutting performance;

[0112] The conductive film layer is flexible and has excellent adhesion to non-flat areas;

[0113] Conductive film layers can be used for electromagnetic wave shielding or grounding.

[0114] In some embodiments, a waterproof membrane layer 10 is provided on the surface of the first base layer 1 facing away from the circuit layer 4, and the waterproof membrane layer 10 covers the bonding component and the conductive membrane layer.

[0115] In some embodiments, such as Figure 2 As shown, the display panel also includes a display layer 110, which comprises a stacked structure consisting of a support layer 111, a display screen body 112, and a polarizing layer 113.

[0116] A blackened surface 14 is provided on the lower surface of the display body 112, and the blackened surface 14 is located at the border of the display body 112; a black adhesive layer 17 is provided on the edge end face of the display layer 110 stacked structure, the black adhesive layer 17 is connected to the blackened surface 14, and the color difference ΔE between the blackened surface 14 and the black adhesive layer 17 is ≤1.

[0117] It should be noted that a coating process is used to blacken the bezel on the lower surface of the display body 112. The blackening material is an organic material plus pigment, carbon powder, or inorganic material, which can effectively block the bottom light projection and reduce the bezel brightness. The OD value of this material is ≥5.

[0118] Coating processes include exposure and development processes, vapor deposition processes, and inkjet printing processes, but are not limited to these; they also include coating processes that can achieve the same or similar functions.

[0119] It should be noted that black adhesive is applied to the edge face of the display layer 110 stacked structure. The adhesive application process can be controlled by adjusting the viscosity, pressure, and speed of the adhesive. The black adhesive material can be acrylic, silicone, fluorine, or polyurethane. The black-coated surface 14 and the black adhesive layer 17 achieve an overall integrated black design, completely replacing ink. The OD value of the black adhesive around the screen is adjusted by controlling the density and material of the black particles in the adhesive, ensuring that the color difference between the black adhesive and the black-coated surface 14 meets ΔE≤1, thus achieving an integrated black effect for the module bezel.

[0120] In some embodiments, such as Figure 4 As shown, the display panel also includes a cover plate 13 and an optical adhesive layer 12, wherein:

[0121] The optical adhesive layer 12 is located between the cover plate 13 and the display layer 110, specifically between the cover plate 13 and the polarizing layer 113 of the display layer 110.

[0122] The optical adhesive layer 12 includes:

[0123] The blackened portion 15 is located on the border of the display layer 110 on the projection surface of the display layer 110.

[0124] The transparent portion 16, the projection surface of the transparent portion 16 on the display layer 110 is located in the display area in the middle of the display layer 110.

[0125] A black adhesive layer 17 is provided on the edge end face of the display layer 110. The black adhesive layer 17 is connected to the blackened part 15. The color difference ΔE between the blackened part 15 and the black adhesive layer 17 is ≤1.

[0126] It should be noted that black OCR adhesive is applied to the lower surface of the polarizing layer 113 of the display layer 110 using inkjet printing process to block light. Black adhesive is printed at the bezel position, transparent adhesive is printed at the display area, and black adhesive (transmittance < 0.0001) is printed at the bezel position to achieve the effect of blocking the bezel of the screen.

[0127] The black coating 15 and the black adhesive layer 17 achieve an overall integrated black design, completely replacing the ink. The OD value of the black adhesive around the screen is adjusted by controlling the density and material of the black particles in the adhesive, and the color difference between the black coating 15 and the black coating 14 meets ΔE≤1.

[0128] It should be noted that in the above two embodiments, the structure of eliminating the integrated design of the blackened border and black glue for the cover plate 13 ink can reduce the module border by 0.15mm, and can achieve the effect of AA~VA distance a=0.

[0129] It should be noted that during the application of black glue, glue may drip, meaning the actual shape of the glue will have some taper. To avoid light leakage, the following conditions must be met:

[0130] like Figures 6 to 11 As shown, the taper angles of the black glue coating on the left and right edges must satisfy θ1 > 55° and θ2 < 35°, and the taper angles of the black glue coating on the top edge must satisfy θ3 > 54° and θ4 < 36°. At this time, no light will be emitted from the edge of the black glue. If it is outside the above angles, some light will be emitted, resulting in slight light leakage.

[0131] Exemplary methods

[0132] This embodiment provides a method for manufacturing a display panel, such as... Figure 12 As shown, the preparation method includes:

[0133] S1. Provide a glass substrate, and coat the first layer onto the glass substrate using a photoresist coating method.

[0134] S2. An inorganic layer is deposited on the first base layer by chemical vapor deposition.

[0135] S3. A circuit layer is deposited on the inorganic layer using physical vapor deposition. The circuit layer includes drive circuitry and bonding area metal traces.

[0136] S4. A second base layer is coated on the circuit layer using a photoresist coating method, and at least one second through-hole is etched on the second base layer using a laser etching method. A second metal line is formed in the second through-hole using nanoimprinting.

[0137] S5. An array film layer is formed on the surface of the second substrate away from the circuit layer, and the conductive ends of the array film layer are electrically connected to the driving circuit through a second metal wire.

[0138] S6. Apply an optical adhesive layer to the surface of the display layer on the side opposite to the array film layer.

[0139] S7. Form a display layer on the array film layer and perform a light-shielding treatment on the display layer.

[0140] S8. Provide a cover plate and bond the cover plate to the display layer using an optical adhesive layer;

[0141] S9. The glass substrate is peeled off from the first base layer. At least one first through hole is etched on the first base layer using laser etching. A first metal line is formed within the first through hole by nanoimprinting.

[0142] S10. Provide a bonding component, which includes a flexible current plate and a chip, and connect the conductive ends of the flexible current plate and the conductive ends of the chip to a conductive film layer. The conductive film layer is electrically connected to the metal traces of the bonding area through a first metal line.

[0143] In some embodiments, the display layer includes a stacked structure consisting of a support layer, a display body, and a polarizing layer, such as... Figure 13 As shown, the display panel manufacturing method includes:

[0144] S71. A coating process is used to blacken the bezel area on the surface of the display screen near the polarizing layer, forming a blackened surface.

[0145] S72. Apply black glue to the edge face of the display layered structure to form a black glue layer, and connect the black glue layer with the blackened surface.

[0146] Preferably,

[0147] like Figure 14 As shown, the preparation method includes:

[0148] S71. Optical adhesive is applied to the surface of the polarizing layer away from the display screen body by inkjet printing. The optical adhesive used is black at the edge of the display component and transparent at the middle display area of ​​the display component.

[0149] S72. Apply black glue to the edge face of the display layered structure to form a black glue layer, and connect the black glue layer to the blackened surface.

[0150] Exemplary electronic devices

[0151] The present invention also provides an electronic device, including the display panel of any of the above embodiments.

[0152] While the invention has been described herein with reference to specific embodiments, it should be understood that these embodiments are merely examples of the principles and applications of the invention. Therefore, it should be understood that many modifications can be made to the exemplary embodiments, and other arrangements can be designed without departing from the spirit and scope of the invention as defined by the appended claims. It should be understood that different dependent claims and features described herein can be combined in ways different from those described in the original claims. It is also understood that features described in conjunction with individual embodiments can be used in other described embodiments.

Claims

1. A display panel, characterized in that, include: A first base layer, wherein a first connecting portion penetrating the first base layer is provided on the first base layer; The second base layer has a second connecting part that penetrates through the second base layer; A wiring layer, wherein the wiring layer is located between the first base layer and the second base layer; An array film layer is located on the surface of the second base layer opposite to the circuit layer, and the conductive end of the array film layer is connected to the conductive end of the circuit layer through the second connecting portion; A bonding component, the bonding component being located on the surface of the first base layer opposite to the wiring layer, and the bonding component having a conductive terminal; and A conductive film layer electrically connected to the conductive end of the bonding component, and the conductive film layer is connected to the conductive end of the circuit layer through the first connecting portion.

2. The display panel as described in claim 1, characterized in that, The first connecting portion includes a first through hole formed on the first base layer and a first metal wire disposed within the first through hole; The second connecting portion includes a second through hole formed on the second base layer and a second metal wire disposed within the second through hole.

3. The display panel as described in claim 1, characterized in that, An inorganic layer is provided on the surface of the first base layer near the circuit layer, and the inorganic layer is located between the first base layer and the circuit layer.

4. The display panel as described in claim 1, characterized in that, The bonding component includes a flexible circuit board and a chip; the conductive film layer includes a first conductive film layer and a second conductive film layer; wherein, the conductive end of the flexible circuit board is electrically connected to the first conductive film layer, and the conductive end of the chip is electrically connected to the second conductive film layer.

5. The display panel as described in claim 4, characterized in that, The conductive film layer includes: a conductive layer, A first conductive adhesive layer located on the first surface of the conductive layer, and a second conductive adhesive layer located on the second surface of the conductive layer.

6. The display panel as described in claim 1, characterized in that, A waterproof membrane layer is provided on the surface of the first base layer facing away from the circuit layer, and the waterproof membrane layer covers the bonding component and the conductive membrane layer.

7. The display panel as described in claim 1, characterized in that, Also includes: The display layer is located on the surface of the array film layer opposite to the second base layer. The display layer includes a stacked structure consisting of a support layer, a display screen body, and a polarizing layer. A blackened surface is provided on the surface of the display body near the polarizing layer, and the blackened surface is located at the border of the display body. A black adhesive layer is provided on the edge end face of the display layer stack structure, and the black adhesive layer is connected to the blackened surface; The color difference between the blackened surface and the black adhesive layer .

8. The display panel as described in claim 1, characterized in that, Also includes: Cover plate, optical adhesive layer and display layer, wherein: The optical adhesive layer is located on the surface of the display layer near the cover plate. The optical adhesive layer includes: The blackened portion is located on the border of the display layer, where its projection surface is situated. A transparent portion, wherein the projection surface of the transparent portion on the display layer is located in the display area in the middle of the display layer. A black adhesive layer is provided on the edge end face of the display layer, and the black adhesive layer is connected to the blackened part; The color difference between the blackened part and the black adhesive layer .

9. A method for manufacturing a display panel, characterized in that, The preparation method includes: S1. Provide a glass substrate, and coat a first base layer on the glass substrate using a photoresist coating method. S2. An inorganic layer is deposited on the first substrate by chemical vapor deposition. S3. A circuit layer is deposited on the inorganic layer using physical vapor deposition. The circuit layer includes a driving circuit and bonding area metal traces. S4. A second base layer is coated on the circuit layer using a photoresist coating method, and at least one second through-hole is etched on the second base layer using a laser etching method. A second metal line is formed within the second through-hole using nanoimprinting. S5. An array film layer is formed on the surface of the second base layer opposite to the circuit layer, and the conductive end of the array film layer is electrically connected to the driving circuit through the second metal wire. S6. A display layer is formed on the array film layer, and the display layer is subjected to light-shielding treatment. S7. Apply an optical adhesive layer to the surface of the display layer on the side opposite to the array film layer. S8. Provide a cover plate and bond the cover plate to the display layer using the optical adhesive layer; S9. Peel the glass substrate from the first base layer, etch at least one first through hole on the first base layer using laser etching, and form a first metal line within the first through hole using nanoimprinting. S10. Provide a bonding component, the bonding component including a flexible current plate and a chip, connecting the conductive end of the flexible current plate and the conductive end of the chip to a conductive film layer, the conductive film layer being electrically connected to the metal trace of the bonding area through the first metal line.

10. The method for manufacturing a display panel as described in claim 8, characterized in that, The display layer comprises a stacked structure consisting of a support layer, a display body, and a polarizing layer. The method for manufacturing the display panel includes: A blackened border is formed on the edge of the display screen near the polarizing layer using a coating process. Black glue is then applied to the edge of the display layer stack to form a black glue layer, which is connected to the blackened surface.

11. The method for manufacturing a display panel as described in claim 10, characterized in that, The preparation method includes: Optical adhesive is applied to the surface of the polarizing layer away from the display screen body by inkjet printing. The optical adhesive used on the edge of the display screen body is black, and the optical adhesive used in the middle display area of ​​the display screen body is transparent. Black glue is applied to the edge face of the display layer stack to form a black glue layer, which is connected to the blackened surface.

12. An electronic device, characterized in that, Includes the display panel as described in any one of claims 1 to 8.

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