Substrate processing apparatus and method for removing air bubbles in filter

Abstract

A substrate processing apparatus (100) is provided with a substrate processing unit (10), a pipe (32), a filter (141), an upstream-side pipe (151), a downstream-side pipe (161), and a removal liquid supply unit (165). A substrate processing unit (10) processes a substrate (W). The piping (32) allows the processing liquid to flow to the substrate processing unit (10). The filter (141) is disposed in the pipe (32). The upstream pipe (151) is connected to the pipe (32) at the upstream side of the filter (141). The downstream pipe (161) is connected to the pipe (32) on the downstream side of the filter (141). The removal liquid supply unit (165) supplies the bubble removal liquid to either the upstream pipe (151) or the downstream pipe (161). A substrate processing apparatus (100) causes a bubble removal liquid to pass through one of an upstream pipe (151) and a downstream pipe (161) via a filter (141) through the other of the upstream pipe (151) and the downstream pipe (161).

Description

Technical Field

[0001] The invention relates to a substrate processing device and a bubble removal method of a filter. Background Art

[0002] In the past, there is a known substrate processing device for processing substrates. The substrate processing device is suitable for use in manufacturing semiconductor substrates. The substrate processing device uses a processing liquid such as a chemical solution to process the substrate. The processing liquid flows through a pipe equipped with a filter and a valve, etc., and processes the substrate. The filter captures particles contained in the processing liquid passing through the inside of the pipe. As such a substrate processing device, there is a known liquid processing device, which includes: a tank for storing the processing liquid; and a circulation line that is pulled out from the tank and returned to the tank; and the processing liquid is supplied to the liquid processing unit via the circulation line (for example, refer to patent document 1). The liquid processing device includes: a filter that removes particles contained in the processing liquid. In the liquid processing device of patent document 1, a filter that has been used for a predetermined time is replaced with a new filter.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2015-103662. Summary of the invention

[0006] Problems to be solved by the invention

[0007] However, for example, when a treatment liquid containing bubbles is circulated in a pipe, the bubbles may be retained in the filter. In this case, the portion of the filter in contact with the bubbles will dry out, and the treatment liquid will not be able to pass through the dry portion. Furthermore, when the treatment liquid containing bubbles is continuously circulated in the pipe, the portion of the filter in contact with the bubbles will increase, and thus the flow rate of the treatment liquid circulated in the pipe will not be ensured. Therefore, the filter needs to be replaced with a new filter.

[0008] However, since replacing the filter increases the environmental burden, it is desirable to suppress the replacement frequency of the filter from the viewpoint of reducing the environmental burden.

[0009] The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a substrate processing apparatus and a filter bubble removal method capable of suppressing the replacement frequency of a filter.

[0010] Means to solve problems

[0011] A substrate processing device according to one embodiment of the present invention comprises a substrate processing unit, a processing liquid piping, a filter, an upstream piping, a downstream piping, and a removal liquid supply unit. The substrate processing unit processes a substrate. The processing liquid piping supplies processing liquid to the substrate processing unit. The filter is arranged on the processing liquid piping. The upstream piping is connected to the processing liquid piping at the upstream side of the filter. The downstream piping is connected to the processing liquid piping at the downstream side of the filter. The removal liquid supply unit is connected to one of the upstream piping and the downstream piping. The removal liquid supply unit supplies a bubble removal liquid for removing bubbles clogged in the filter to one of the upstream piping and the downstream piping. The substrate processing device allows the bubble removal liquid to pass from one of the upstream piping and the downstream piping through the filter through the other of the upstream piping and the downstream piping.

[0012] In one embodiment, the substrate processing device further includes a cleaning pipe and a cleaning liquid supply unit. The cleaning pipe is connected to the processing liquid pipe at the upstream side or downstream side of the filter. The cleaning liquid supply unit is connected to the cleaning pipe. The cleaning liquid supply unit supplies cleaning liquid for flushing the processing liquid to the cleaning pipe. The substrate processing device allows the cleaning liquid to pass from the cleaning pipe through the filter through the other of the upstream pipe and the downstream pipe.

[0013] In a certain embodiment, the substrate processing device further includes a first valve, a second valve, a third valve, a fourth valve and a fifth valve. The first valve is arranged on the processing liquid piping at the upstream side of the filter. The second valve is arranged on the processing liquid piping at the downstream side of the filter. The third valve is arranged on the upstream side piping. The fourth valve is arranged on the downstream side piping. The fifth valve is arranged on the cleaning piping. The substrate processing device closes the third valve, the fourth valve and the fifth valve and opens the first valve and the second valve, thereby allowing the processing liquid to pass from the upstream side of the processing liquid piping to the downstream side of the processing liquid piping through the filter. The substrate processing device closes the first valve, the second valve and the fifth valve and opens the third valve and the fourth valve, thereby allowing the bubble removal liquid to pass from one of the upstream side piping and the downstream side piping through the filter through the other of the upstream side piping and the downstream side piping. The substrate processing device closes the first valve and the second valve, and one of the third valve and the fourth valve, and opens the other of the third valve and the fourth valve, and the fifth valve, thereby allowing the cleaning liquid to flow from the cleaning pipe through the filter through the upstream side pipe and the other of the downstream side pipe.

[0014] In one embodiment, the substrate processing apparatus further comprises: a flow meter disposed on the processing liquid piping for measuring the flow rate of the processing liquid passing through the filter. When the measured value of the flow meter is less than a threshold value, the substrate processing apparatus allows the bubble removal liquid to pass from one of the upstream piping and the downstream piping through the filter to the other of the upstream piping and the downstream piping.

[0015] In one embodiment, the substrate processing apparatus periodically passes the bubble removing liquid from one of the upstream pipe and the downstream pipe through the filter to the other of the upstream pipe and the downstream pipe.

[0016] In one embodiment, the substrate processing apparatus further comprises: a flow meter for measuring the flow rate of the liquid passing through the filter. After the substrate processing apparatus passes the bubble removing liquid from one of the upstream piping and the downstream piping through the filter through the other of the upstream piping and the downstream piping, if the measured value of the flow meter is less than a predetermined value, the substrate processing apparatus again passes the bubble removing liquid from one of the upstream piping and the downstream piping through the filter through the other of the upstream piping and the downstream piping.

[0017] According to another embodiment of the present invention, a bubble removal method for a filter includes: a processing liquid circulation process, in which a processing liquid for processing a substrate flows and passes through a filter arranged in a processing liquid piping, and the processing liquid piping is connected to a substrate processing unit; and a removal liquid circulation process, in which a bubble removal liquid for removing bubbles blocked in the filter passes from one of an upstream side piping and a downstream side piping through the filter through the other of the upstream side piping and the downstream side piping, the upstream side piping is connected to the processing liquid piping at the upstream side of the filter, and the downstream side piping is connected to the processing liquid piping at the downstream side of the filter.

[0018] In a certain embodiment, the bubble removal method of the filter may also further include: a cleaning liquid circulation process, before the removal liquid circulation process, a cleaning liquid for flushing the treatment liquid is used to flow from a cleaning pipe through the filter through the upstream side pipe and the other of the downstream side pipes, and the cleaning pipe is connected to the treatment liquid pipe at the upstream side or downstream side of the filter.

[0019] In one embodiment, the flow rate of the treatment liquid passing through the filter may be measured in the treatment liquid flowing step; and when the flow rate of the treatment liquid is less than a threshold value, the removal liquid flowing step may be performed.

[0020] In one embodiment, the removal liquid circulating step may be performed periodically.

[0021] In a certain embodiment, the bubble removal method of the filter may further include: a measuring step of measuring the flow rate of the liquid passing through the filter after the removal liquid circulation step; and when the measured value of the flow meter is less than a predetermined value, performing the removal liquid circulation step again.

[0022] Effects of the Invention

[0023] According to the present invention, it is possible to provide a substrate processing apparatus and a filter bubble removal method capable of suppressing the replacement frequency of a filter. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic top view of the substrate processing apparatus according to the first embodiment.

[0025] Figure 2 It is a schematic diagram of a substrate processing unit in the substrate processing apparatus according to the first embodiment.

[0026] Figure 3 It is a schematic diagram for explaining the piping structure in the substrate processing apparatus according to the first embodiment.

[0027] Figure 4 It is a block diagram of a substrate processing apparatus according to a first embodiment.

[0028] Figure 5 It is a flowchart which shows the bubble removal method of the filter of 1st Embodiment.

[0029] Fig. 6A It is a schematic diagram for explaining the air bubble removal method according to the first embodiment, and is a diagram showing the flow of liquid in the vicinity of the filter unit by arrows.

[0030] Figure 6B It is a schematic diagram for explaining the air bubble removal method according to the first embodiment, and is a diagram showing the flow of liquid in the vicinity of the filter unit by arrows.

[0031] Figure 6C It is a schematic diagram for explaining the air bubble removal method according to the first embodiment, and is a diagram showing the flow of liquid in the vicinity of the filter unit by arrows.

[0032] Figure 7 It is a schematic diagram for explaining the piping structure in the substrate processing apparatus according to the second embodiment.

[0033] Figure 8 It is a flowchart which shows the bubble removal method of the filter of the second embodiment.

[0034] Fig. 9A It is a schematic diagram for explaining the air bubble removal method according to the second embodiment, and is a diagram showing the flow of liquid in the vicinity of the filter unit by arrows.

[0035] Fig. 9B It is a schematic diagram for explaining the air bubble removal method according to the second embodiment, and is a diagram showing the flow of liquid in the vicinity of the filter unit by arrows.

[0036] Fig. 9C It is a schematic diagram for explaining the air bubble removal method according to the second embodiment, and is a diagram showing the flow of liquid in the vicinity of the filter unit by arrows.

[0037] Fig.10 It is a schematic diagram for explaining the piping structure in the substrate processing apparatus according to the first variation.

[0038] Fig.11 It is a schematic diagram for explaining the piping structure in the substrate processing apparatus according to the second variation.

[0039] Fig.12 It is a flowchart which shows the bubble removal method of the filter of the third embodiment.

[0040] Fig.13 It is a flowchart which shows the bubble removal method of the filter of the 4th Embodiment.

[0041] Fig.14 It is a flowchart which shows the bubble removal method of the filter of the fifth embodiment.

[0042] Fig.15 It is a schematic diagram showing a piping structure in a substrate processing apparatus according to a sixth embodiment.

[0043] Fig.16 It is a flowchart which shows the bubble removal method of the filter of 7th Embodiment.

[0044] Fig.17 It is a schematic diagram for explaining the air bubble removal method according to the seventh embodiment, and is a diagram showing the flow of liquid in the vicinity of the filter unit by arrows. DETAILED DESCRIPTION

[0045] Hereinafter, the embodiments of the substrate processing device and the bubble removal method of the filter of the present invention are described with reference to the accompanying drawings. In addition, the same reference numerals are attached to the same or equivalent parts in the figures and the description is not repeated. In addition, in order to facilitate the understanding of the present invention, the description may record the X-axis, Y-axis and Z-axis that are orthogonal to each other. In this embodiment, the X-axis and the Y-axis are parallel to the horizontal direction, and the Z-axis is parallel to the vertical direction.

[0046] [First embodiment]

[0047] Reference Figures 1 to 5 , FIG. 6A to FIG. 6C A substrate processing apparatus 100 according to a first embodiment of the present invention will be described. Figure 1 It is a schematic top view of the substrate processing apparatus 100 according to the first embodiment.

[0048] The substrate processing apparatus 100 processes the substrate W. The substrate processing apparatus 100 processes the substrate W by performing at least one of etching, surface processing, imparting characteristics, forming a processing film, removing at least a portion of a film, and cleaning.

[0049] The substrate W is used as a semiconductor substrate. The substrate W includes a semiconductor wafer. For example, the substrate W is substantially disk-shaped. Here, the substrate processing apparatus 100 processes the substrate W piece by piece.

[0050] like Figure 1 As shown, the substrate processing apparatus 100 includes a plurality of substrate processing units 10, a processing liquid tank 110, a processing liquid tank 120, a plurality of load ports LP, an indexer robot IR, a center robot CR, and a control device 101. The control device 101 controls the load port LP, the indexer robot IR, and the center robot CR. The control device 101 includes a control unit 102 and a storage unit 104.

[0051] The loading port LP stacks and accommodates a plurality of substrates W. The indexer robot IR transports the substrates W between the loading port LP and the central robot CR. The central robot CR transports the substrates W between the indexer robot IR and the substrate processing unit 10. The substrate processing unit 10 sprays a processing liquid onto the substrates W to process the substrates W. The processing liquid includes, for example, a chemical solution, a cleaning solution, a removal solution, and / or a water repellent. The processing liquid cabinet 110 accommodates the processing liquid. In addition, the processing liquid cabinet 110 may also accommodate gas.

[0052] Specifically, the plurality of substrate processing units 10 form a plurality of towers TW (in Figure 1 The towers TW are arranged around the central robot CR in a top view. Each tower TW includes a plurality of substrate processing units 10 stacked up and down (in Figure 1 There are three substrate processing units 10 in the figure. The processing liquid tanks 120 correspond to the plurality of towers TW, respectively. The liquid in the processing liquid tank 110 is supplied to all the substrate processing units 10 contained in the tower TW corresponding to the processing liquid tank 120 via a certain processing liquid tank 120. In addition, the gas in the processing liquid tank 110 is supplied to all the substrate processing units 10 contained in the tower TW corresponding to the processing liquid tank 120 via any processing liquid tank 120.

[0053] In the substrate processing apparatus 100 , a boundary wall BW is disposed between an area where the central robot CR and the substrate processing unit 10 are installed and an area where the processing liquid tank 110 is installed. The processing liquid tank 110 partitions a part of the area outside the boundary wall BW in the substrate processing apparatus 100 .

[0054] Typically, the treatment liquid cabinet 110 has a modulation tank (drum tank) for modulating the treatment liquid. The treatment liquid cabinet 110 may have a modulation tank for one type of treatment liquid, or may have modulation tanks for multiple types of treatment liquids. In addition, the treatment liquid cabinet 110 may also have a pump, a nozzle, and / or a filter for circulating the treatment liquid.

[0055] Here, the processing liquid tank 110 includes a first processing liquid tank 110A and a second processing liquid tank 110B. The first processing liquid tank 110A and the second processing liquid tank 110B are arranged to face each other.

[0056] The control device 101 controls various operations of the substrate processing apparatus 100 .

[0057] The control device 101 includes a control unit 102 and a storage unit 104. The control unit 102 includes a processor. The control unit 102 includes, for example, a central processing unit (CPU). Alternatively, the control unit 102 may include a general-purpose computing unit.

[0058] The storage unit 104 stores data and computer programs. The data includes recipe data. The recipe data includes information indicating a plurality of recipes. The plurality of recipes respectively define the processing contents and processing order of the substrate W.

[0059] The storage unit 104 includes a main storage device and an auxiliary storage device. The main storage device is, for example, a semiconductor memory. The auxiliary storage device is, for example, a semiconductor memory and / or a hard disk drive. The storage unit 104 may also include a removable media. The control unit 102 executes the computer program stored in the storage unit 104 and performs the substrate processing operation.

[0060] Next, refer to Figure 2 The substrate processing unit 10 in the substrate processing apparatus 100 according to the first embodiment will be described. Figure 2 Schematic diagram of the substrate processing unit 10 in the substrate processing apparatus 100 according to the first embodiment.

[0061] The substrate processing unit 10 includes a chamber 11 , a substrate holding unit 20 , and a processing liquid supply unit 30 .

[0062] The chamber 11 is substantially box-shaped with an internal space. The chamber 11 accommodates the substrate W. Here, the substrate processing apparatus 100 is a single-chip type for processing the substrate W piece by piece, and the substrate W is accommodated piece by piece in the chamber 11. The substrate W is accommodated in the chamber 11 and processed in the chamber 11. The chamber 11 accommodates at least a portion of each of the substrate holding portion 20 and the processing liquid supply portion 30.

[0063] The substrate holding part 20 holds the substrate W. The substrate holding part 20 holds the substrate W horizontally in a manner that the upper surface (front surface) Wa of the substrate W faces upward and the back surface (lower surface) Wb of the substrate W faces vertically downward. In addition, the substrate holding part 20 rotates the substrate W while holding the substrate W. For example, a stacked structure having a recess is provided on the upper surface Wa of the substrate W. The substrate holding part 20 directly rotates the substrate W while holding the substrate W.

[0064] For example, the substrate holding portion 20 may be a clamping type for clamping the end of the substrate W. Alternatively, the substrate holding portion 20 may have any mechanism for holding the substrate W from the back side Wb. For example, the substrate holding portion 20 may be a vacuum type. In this case, the substrate holding portion 20 adsorbs the central portion of the back side Wb of the substrate W, which is a non-device forming surface, onto the upper surface, thereby holding the substrate W horizontally. Alternatively, the substrate holding portion 20 may be a combination of a clamping type and a vacuum type for contacting a plurality of chuck pins to the peripheral end surface of the substrate W.

[0065] For example, the substrate holding unit 20 includes a spin base 21, a chuck member 22, a shaft 23, an electric motor 24, and a housing 25. The chuck member 22 is provided on the spin base 21. The chuck member 22 holds the substrate W. Typically, a plurality of chuck members 22 are provided on the spin base 21.

[0066] The shaft 23 is a hollow shaft and extends in the vertical direction along the rotation axis Ax. The spin base 21 is coupled to the upper end of the shaft 23 . The substrate W is placed on the spin base 21 .

[0067] The spin base 21 is in the shape of a disk and is used to horizontally support the substrate W. The shaft 23 extends downward from the center of the spin base 21. The electric motor 24 applies a rotational force to the shaft 23. The electric motor 24 rotates the shaft 23 in the rotation direction, thereby rotating the substrate W and the spin base 21 around the rotation axis Ax. The housing 25 surrounds the shaft 23 and the electric motor 24.

[0068] The processing liquid supply unit 30 supplies the processing liquid to the substrate W. Typically, the processing liquid supply unit 30 supplies the processing liquid to the upper surface Wa of the substrate W. At least a portion of the processing liquid supply unit 30 is accommodated in the chamber 11 .

[0069] The processing liquid supply unit 30 supplies the processing liquid to the upper surface Wa of the substrate W. The processing liquid may also include a so-called chemical liquid. The chemical liquid may also include, for example, hydrofluoric acid (HF). For example, the hydrofluoric acid may be heated to a temperature of 40° C. to 70° C. or 50° C. to 60° C. However, the hydrofluoric acid may not be heated. In addition, the chemical liquid may include water or phosphoric acid.

[0070] Furthermore, the liquid may also include hydrogen peroxide. In addition, the liquid may also include SC1 (standard clean-1; first standard cleaning solution) (ammonia-hydrogen peroxide mixture), SC2 (standard clean-2; second standard cleaning solution) (hydrochloric acid-hydrogen peroxide mixture) or aqua regia (a mixture of concentrated hydrochloric acid and concentrated nitric acid).

[0071] Alternatively, the treatment liquid may include a so-called cleaning liquid (rinse liquid). The cleaning liquid may include, for example, any one of deionized water (DIW), carbonated water, electrolytic ionized water, ozone water, ammonia water, hydrochloric acid water of a diluted concentration (e.g., about 10 ppm to 100 ppm), and reduced water (hydrogen water).

[0072] The processing liquid supply unit 30 includes a pipe 32, a nozzle 34, and a valve 36. The pipe 32 is an example of the "processing liquid pipe" of the present invention. The nozzle 34 sprays the processing liquid onto the upper surface Wa of the substrate W. The nozzle 34 is connected to the pipe 32. The processing liquid is supplied to the pipe 32 from a supply source. The valve 36 opens and closes the flow path in the pipe 32. The nozzle 34 is preferably configured to be movable relative to the substrate W.

[0073] The valve 36 opens and closes the flow path in the pipe 32. The valve 36 adjusts the opening degree of the pipe 32, thereby adjusting the flow rate of the processing liquid supplied to the pipe 32. Specifically, the valve 36 includes: a valve body (not shown) having a valve seat disposed therein; a valve core that opens and closes the valve seat; and an actuator (not shown) that moves the valve core between an open position and a closed position.

[0074] The nozzle 34 is also movable. The nozzle 34 can be moved in the horizontal direction and / or the vertical direction by a moving mechanism controlled by the control unit 102. In addition, it should be noted that in order to avoid making the drawings too complicated, the moving mechanism is omitted in this specification.

[0075] The substrate processing unit 10 further includes a cup 80. The cup 80 recovers the processing liquid scattered from the substrate W. The cup 80 rises and falls. For example, the cup 80 rises vertically above to the side of the substrate W during the entire period in which the processing liquid supply unit 30 supplies the processing liquid to the substrate W. In this case, the cup 80 recovers the processing liquid scattered from the substrate W due to the rotation of the substrate W. In addition, when the period in which the processing liquid supply unit 30 supplies the processing liquid to the substrate W ends, the cup 80 descends from the side of the substrate W to the vertical below.

[0076] As described above, the control device 101 includes the control unit 102 and the storage unit 104. The control unit 102 controls the substrate holding unit 20, the processing liquid supply unit 30 and / or the cup 80. In one example, the control unit 102 controls the electric motor 24, the valve 36 and / or the cup 80.

[0077] The substrate processing apparatus 100 of this embodiment is suitable for use in manufacturing a semiconductor component provided with a semiconductor. Typically, in a semiconductor component, a conductive layer and an insulating layer are stacked on a substrate. The substrate processing apparatus 100 is suitable for use in cleaning and / or processing (e.g., etching, property change, etc.) the conductive layer and / or the insulating layer when manufacturing a semiconductor component.

[0078] In addition, Figure 2 In the substrate processing unit 10 shown, the processing liquid supply unit 30 can supply one type of processing liquid. However, the present embodiment is not limited to this. The processing liquid supply unit 30 can also supply multiple types of processing liquids. For example, the processing liquid supply unit 30 can also supply multiple types of processing liquids with different uses to the substrate W in sequence. Alternatively, the processing liquid supply unit 30 can also supply multiple types of processing liquids with different uses to the substrate W simultaneously.

[0079] Next, refer to Figures 1 to 3 The piping structure of the substrate processing apparatus 100 according to the first embodiment will be described. Figure 3Schematic diagram for explaining the piping structure in the substrate processing apparatus 100 according to the first embodiment. Figure 1 as well as Figure 2 As can be understood, it is preferred that the substrate processing apparatus 100 has a plurality of substrate processing units 10 and the substrate W can be processed by a plurality of processing liquids. However, in order to avoid overly complicated description, a method of supplying one type of processing liquid to one substrate processing unit 10 is described here.

[0080] like Figure 3 As shown, the substrate processing apparatus 100 includes a modulation tank 112, a heater 113, a pump 114, a valve 115, a filter unit 140, a flow meter 116, and a valve 117. The valve 115 is an example of the "first valve" of the present invention. The valve 117 is an example of the "second valve" of the present invention.

[0081] The modulation tank 112 stores a processing liquid. The processing liquid is supplied to the substrate processing unit 10 to process the substrate W. Typically, the processing liquid is a chemical liquid. The processing liquid is not particularly limited, and is, for example, an alkaline chemical liquid. In the first embodiment, the processing liquid is a foaming chemical liquid containing a surfactant. In addition, in the first embodiment, the processing liquid is, for example, TMAH (tetramethylammonium hydroxide). In addition, the processing liquid may also contain, for example, TEAOH (tetraethylammonium hydroxide) or citric acid. In addition, the processing liquid may also be a cleaning liquid. The processing liquid is modulated in the modulation tank 112. Typically, the modulation tank 112 is disposed in the processing liquid cabinet 110.

[0082] The pipe 32 connects the modulation tank 112 and the substrate processing unit 10. The pipe 32 is provided with a heater 113, a pump 114, a valve 115, a filter unit 140, a flow meter 116, a valve 117, and a valve 36. The heater 113, the pump 114, the valve 115, the filter unit 140, the flow meter 116, the valve 117, and the valve 36 constitute the processing liquid supply unit 30. Figure 3 Although only one valve 36 is shown in FIG. 1 , the valve 36 is provided for each nozzle 34 . Therefore, a plurality of valves 36 are provided for one filter unit 140 .

[0083] The processing liquid tank 110 has a housing 111. Typically, a preparation tank 112, a heater 113, a pump 114, a valve 115, a filter unit 140, a flow meter 116, and a valve 117 are accommodated in the housing 111.

[0084] The processing liquid tank 120 has a frame 121. Typically, the valve 36 is accommodated in the frame 121.

[0085] The pipe 32 extends from the processing liquid tank 110 through the processing liquid tank 120 to the substrate processing unit 10. After being conditioned in the conditioning tank 112, the processing liquid flows from the conditioning tank 112 through the pipe 32 to the substrate processing unit 10. The pipe 32 is formed of, for example, resin.

[0086] The heater 113 heats the liquid passing through the pipe 32. In the first embodiment, the heater 113 heats the processing liquid passing through the pipe 32 to a predetermined temperature.

[0087] The pump 114 delivers the processing liquid in the modulation tank 112 toward the nozzle 34 .

[0088] The valve 115 is connected to the pipe 32 at the upstream side of the filter 141 described later. The valve 115 opens and closes the flow path in the pipe 32. In detail, the valve 115 opens and closes the flow path of the upstream portion 32a of the pipe 32 which is upstream of the filter unit 140. The valve 115 adjusts the opening degree of the pipe 32, thereby adjusting the flow rate of the treatment liquid supplied to the pipe 32. Specifically, the valve 115 includes: a valve body (not shown) having a valve seat provided therein; a valve core which opens and closes the valve seat; and an actuator (not shown) which moves the valve core between an open position and a closed position.

[0089] The filter unit 140 is mounted on the pipe 32. The filter unit 140 can be installed and removed from the pipe 32. When the filter unit 140 is installed on the pipe 32, the treatment liquid flows through the filter unit 140. On the other hand, the filter unit 140 can be removed from the pipe 32. Therefore, when the filter unit 140 is deteriorated, the filter unit 140 is replaced.

[0090] The filter unit 140 is formed of, for example, resin. Typically, the filter unit 140 is formed by resin molding. In one example, the filter unit 140 is manufactured by cutting a resin formation with a metal processing tool. In addition, the filter unit 140 may also be formed of metal.

[0091] The filter unit 140 filters the treatment liquid flowing in the piping 32. The filter unit 140 includes a filter 141 and a filter housing 142. The filter 141 is arranged in the piping 32. The filter 141 has, for example, a porous shape. The filter 141 allows the liquid component of the treatment liquid to pass through. On the other hand, the filter 141 captures particles contained in the treatment liquid. In addition, the filter 141 captures a part of the bubbles contained in the treatment liquid. In other words, a part of the bubbles contained in the treatment liquid will not pass through the filter 141.

[0092] The filter housing 142 accommodates the filter 141. The filter housing 142 has: an upstream chamber 142a, which is arranged on the upstream side of the filter 141; and a downstream chamber 142b, which is arranged on the downstream side of the filter 141. In addition, a vent pipe for discharging gas to the outside and a drain pipe for discharging liquid to the outside may be connected to the upstream chamber 142a and the downstream chamber 142b. However, even in the case where the exhaust pipe is connected to the upstream chamber 142a, for example, in the case where the treatment liquid in the modulation tank 112 contains a large number of bubbles as described later, the gas cannot be fully discharged through the exhaust pipe. Therefore, as described later, bubbles are retained in the filter 141.

[0093] The flow meter 116 measures the flow rate of the liquid passing through the pipe 32 .

[0094] The valve 117 is arranged in the piping 32 at the downstream side of the filter 141. The valve 117 opens and closes the flow path in the piping 32. Specifically, the valve 117 opens and closes the flow path of the downstream portion 32b of the piping 32 which is further downstream than the filter unit 140. The valve 117 adjusts the opening degree of the piping 32, thereby adjusting the flow rate of the treatment liquid passing through the piping 32. Specifically, the valve 117 includes: a valve body (not shown) having a valve seat provided therein; a valve core which opens and closes the valve seat; and an actuator (not shown) which moves the valve core between an open position and a closed position.

[0095] The substrate processing apparatus 100 includes: a processing liquid supply unit 210 for supplying processing liquid to the modulation tank 112. The processing liquid supply unit 210 includes a pipe 211 and a valve 212. The processing liquid is supplied to the pipe 211 from a supply source. The valve 212 adjusts the degree of opening of the flow path in the pipe 211, thereby adjusting the flow rate of the processing liquid supplied to the pipe 211. Specifically, the valve 212 includes: a valve body (not shown) having a valve seat disposed therein; a valve core for opening and closing the valve seat; and an actuator (not shown) for moving the valve core between an open position and a closed position.

[0096] In the first embodiment, the substrate processing apparatus 100 includes: a cleaning liquid supply unit 220 for supplying cleaning liquid to the modulation tank 112. The cleaning liquid supply unit 220 includes a pipe 221 and a valve 222. Cleaning liquid is supplied to the pipe 221 from a supply source. The cleaning liquid supplied by the cleaning liquid supply unit 220 is, for example, deionized water (DIW). The valve 222 adjusts the openness of the flow path in the pipe 211, thereby adjusting the flow rate of the cleaning liquid supplied to the pipe 221. Specifically, the valve 222 includes: a valve body (not shown) having a valve seat disposed therein; a valve core for opening and closing the valve seat; and an actuator (not shown) for moving the valve core between an open position and a closed position.

[0097] In the first embodiment, the substrate processing apparatus 100 includes: a gas supply unit 230 for supplying gas to the modulation tank 112. The gas supply unit 230 includes a pipe 231 and a valve 232. The pipe 231 is connected to the lower surface of the modulation tank 112, for example. Gas is supplied to the pipe 231 from a supply source. In the first embodiment, the gas supplied by the gas supply unit 230 is, for example, N2 gas. In addition, the gas supplied by the gas supply unit 230 may also be, for example, air. The valve 232 adjusts the openness of the flow path in the pipe 231, thereby adjusting the flow rate of the gas supplied to the pipe 231. Specifically, the valve 232 includes: a valve body (not shown) having a valve seat disposed therein; a valve core that opens and closes the valve seat; and an actuator (not shown) that moves the valve core between an open position and a closed position.

[0098] The dissolved oxygen in the treatment liquid can be reduced by supplying gas from the gas supply unit 230 to the preparation tank 112. When the gas is supplied from the gas supply unit 230 to the preparation tank 112, bubbles are generated in the treatment liquid.

[0099] In addition, in the first embodiment, the substrate processing apparatus 100 includes: a liquid discharge unit 240 for discharging liquid from the modulation tank 112. The liquid discharge unit 240 includes a pipe 241 and a valve 242. The pipe 241 is connected to the lower surface of the modulation tank 112, for example. The valve 242 adjusts the openness of the flow path in the pipe 241, thereby adjusting the flow rate of the liquid discharged from the pipe 241. Specifically, the valve 242 includes: a valve body (not shown) having a valve seat provided therein; a valve core for opening and closing the valve seat; and an actuator (not shown) for moving the valve core between an open position and a closed position.

[0100] Next, refer to Figure 3 The substrate processing apparatus 100 will be described. The substrate processing apparatus 100 includes an upstream pipe 151 and a downstream pipe 161 .

[0101] The upstream pipe 151 is connected to the pipe 32 at the upstream side of the filter 141. The upstream pipe 151 is connected to the upstream portion 32a of the pipe 32 at the upstream side of the filter 141. In the first embodiment, the upstream pipe 151 is directly connected to the pipe 32. In other words, the upstream pipe 151 is connected to the pipe 32 without passing through the filter unit 140.

[0102] The downstream pipe 161 is connected to the pipe 32 at the downstream side of the filter 141. The downstream pipe 161 is connected to the downstream portion 32b of the pipe 32 at the downstream side of the filter 141. In the first embodiment, the downstream pipe 161 is directly connected to the pipe 32. In other words, the downstream pipe 161 is connected to the pipe 32 without passing through the filter unit 140.

[0103] The substrate processing apparatus 100 includes a valve 152 and a valve 162. The valve 152 is disposed in the upstream piping 151. The valve 152 adjusts the degree of opening of the flow path in the upstream piping 151, thereby adjusting the flow rate of the liquid passing through the upstream piping 151. The valve 162 is disposed in the downstream piping 161. The valve 162 adjusts the degree of opening of the flow path in the downstream piping 161, thereby adjusting the flow rate of the liquid passing through the downstream piping 161. Specifically, the valve 152 and the valve 162 respectively include: a valve body (not shown) having a valve seat disposed therein; a valve core that opens and closes the valve seat; and an actuator (not shown) that moves the valve core between an open position and a closed position. In addition, the valve 152 is an example of the "third valve" of the present invention. In addition, the valve 162 is an example of the "fourth valve" of the present invention.

[0104] The substrate processing apparatus 100 includes a removal liquid supply unit 165. The removal liquid supply unit 165 is connected to one of the upstream piping 151 and the downstream piping 161. The removal liquid supply unit 165 supplies a bubble removal liquid for removing bubbles clogged in the filter 141 to one of the upstream piping 151 and the downstream piping 161. The removal liquid supply unit 165 includes, for example, a drum tank for storing the bubble removal liquid and / or a pump for delivering the bubble removal liquid. In the first embodiment, the removal liquid supply unit 165 is connected to the upstream piping 151 to supply the bubble removal liquid to the upstream piping 151. The bubble removal liquid is not particularly limited as long as it is a liquid for removing bubbles, and includes, for example, IPA (isopropyl alcohol) or PGMEA (propylene glycol monomethyl ether acetate). In the first embodiment, the bubble removal liquid includes IPA. In the first embodiment, the bubble removal liquid is, for example, diluted IPA.

[0105] Next, refer to Figures 1 to 4 A substrate processing apparatus 100 according to a first embodiment will be described. Figure 4 1 is a block diagram of a substrate processing apparatus 100 according to the first embodiment.

[0106] like Figure 4As shown, the control device 101 controls various operations of the substrate processing apparatus 100. The control device 101 controls the indexer robot IR, the center robot CR, the substrate holding part 20, the processing liquid supply part 30, the valves 152 and 162, the processing liquid replenishing part 210, the cleaning liquid supply part 220, the gas supply part 230, and the liquid discharge part 240. Specifically, the control device 101 sends control signals to the indexer robot IR, the center robot CR, the substrate holding part 20, the processing liquid supply part 30, the valves 152 and 162, the processing liquid replenishing part 210, the cleaning liquid supply part 220, the gas supply part 230, and the liquid discharge part 240, thereby controlling the indexer robot IR, the center robot CR, the substrate holding part 20, the processing liquid supply part 30, the valves 152 and 162, the processing liquid replenishing part 210, the cleaning liquid supply part 220, the gas supply part 230, and the liquid discharge part 240.

[0107] More specifically, the control unit 102 controls the indexer robot IR to receive and transfer the substrate W via the indexer robot IR.

[0108] The control unit 102 controls the central robot CR to receive and transfer the substrate W through the central robot CR. For example, the central robot CR receives an unprocessed substrate W and moves the substrate W into any one of the plurality of substrate processing units 10. In addition, the central robot CR receives a processed substrate W from the substrate processing unit 10 and moves the substrate W out.

[0109] The control unit 102 controls the substrate holding unit 20 to control the start of rotation of the substrate W, change of the rotation speed, and stop of rotation of the substrate W. For example, the control unit 102 controls the substrate holding unit 20 to change the rotation speed of the substrate holding unit 20. Specifically, the control unit 102 changes the rotation speed of the electric motor 24 of the substrate holding unit 20, thereby changing the rotation speed of the substrate W.

[0110] The control unit 102 controls the valve 115, the valve 117, and the valve 36, so that the states of the valves 115, the valve 117, and the valve 36 can be switched between an open state and a closed state. Specifically, the control unit 102 sets the valve 115 to an open state or a closed state, thereby allowing the liquid in the upstream portion 32a of the pipe 32 to pass through or not to pass through the liquid in the upstream portion 32a of the pipe 32. In addition, the control unit 102 sets the valve 117 to an open state or a closed state, thereby allowing the liquid in the downstream portion 32b of the pipe 32 to pass through or not to pass through the liquid in the downstream portion 32b of the pipe 32. In addition, the control unit 102 sets the valve 36 to an open state or a closed state, thereby allowing the liquid that has passed through the valve 117 to be supplied to the nozzle 34 or not to supply the liquid that has passed through the valve 117 to the nozzle 34.

[0111] The control unit 102 controls the heater 113 to heat the liquid passing through the pipe 32. The control unit 102 controls the heater 113 to heat the liquid passing through the pipe 32 to a predetermined temperature. The control unit 102 controls the pump 114 to transport the liquid in the modulation tank 112 to the downstream side. Specifically, the control unit 102 drives the pump 114 to send the liquid in the modulation tank 112 toward the nozzle 34. The measurement result of the flow meter 116 is sent to the control unit 102.

[0112] The control unit 102 controls the valve 152 so that the state of the valve 152 can be switched between an open state and a closed state. Specifically, the control unit 102 sets the valve 152 to an open state or a closed state, thereby allowing the liquid in the upstream side piping 151 to pass through or not to pass through the liquid in the upstream side piping 151. In addition, the control unit 102 controls the valve 162 so that the state of the valve 162 can be switched between an open state and a closed state. Specifically, the control unit 102 sets the valve 162 to an open state or a closed state, thereby allowing the liquid in the downstream side piping 161 to pass through or not to pass through the liquid in the downstream side piping 161.

[0113] The control unit 102 controls the processing liquid replenishing unit 210 to control the replenishment of the processing liquid to the modulation tank 112. Specifically, the control unit 102 sets the valve 212 to an open state or a closed state, thereby replenishing the processing liquid to the modulation tank 112 or stopping the replenishment of the processing liquid to the modulation tank 112.

[0114] The control unit 102 controls the cleaning liquid supply unit 220 to control the supply of the cleaning liquid to the preparation tank 112. Specifically, the control unit 102 sets the valve 222 to an open state or a closed state, thereby supplying the cleaning liquid to the preparation tank 112 or stopping the supply of the cleaning liquid to the preparation tank 112.

[0115] The control unit 102 controls the gas supply unit 230 to control the supply of gas to the modulation tank 112. Specifically, the control unit 102 sets the valve 232 to an open state or a closed state, thereby enabling the supply of gas to the modulation tank 112 or stopping the supply of gas to the modulation tank 112.

[0116] The control unit 102 controls the liquid discharge unit 240 to control the discharge of liquid from the preparation tank 112. Specifically, the control unit 102 sets the valve 242 to an open state or a closed state, thereby enabling the discharge of liquid from the preparation tank 112 or stopping the discharge of liquid from the preparation tank 112.

[0117] As described above, the storage unit 104 may store a plurality of rule data. The plurality of rules may define the processing contents and processing order for removing the bubbles clogged in the filter unit 140.

[0118] The substrate processing apparatus 100 of the first embodiment is suitable for use in forming a semiconductor component. For example, the substrate processing apparatus 100 is suitable for use in processing a substrate W used as a semiconductor component of a stacked structure. The semiconductor component is a so-called 3D (three-dimensional) structured memory (storage device). As an example, the substrate W is suitable for use as a NAND (NOT-AND) type flash memory.

[0119] Next, refer to Figure 5 , Fig. 6A , Figure 6B as well as Figure 6C A method of removing bubbles from the filter 141 of the substrate processing apparatus 100 according to the first embodiment will be described. Figure 5 It is a flowchart which shows the bubble removal method of the filter 141 of 1st Embodiment. FIG. 6A to FIG. 6C 1 is a schematic diagram for explaining the bubble removal method of the first embodiment, and is a diagram showing the flow of liquid in the vicinity of the filter unit 140 by arrows. The bubble removal method of the filter 141 of the first embodiment includes steps S101 to S108. Steps S101 to S108 are executed by the control unit 102. In addition, step S101 is an example of the "processing liquid circulation process" of the present invention. In addition, step S105 is an example of the "removal liquid circulation process" of the present invention. In addition, step S106 is an example of the "cleaning liquid circulation process" of the present invention.

[0120] like Figure 5 As shown, in step S101, the control unit 102 determines whether the flow rate of the processing liquid passing through the piping 32 is less than a threshold value. The threshold value is a predetermined value. Specifically, in step S101, valves 115 and 117 are turned into an open state, and valves 152 and 162 are turned into a closed state. Valve 36 is switched to an open state and a closed state in accordance with the timing of spraying the processing liquid onto the substrate W. That is, in step S101, the processing liquid is made to flow and pass through the filter 141 disposed on the piping 32. In addition, in step S101, the processing liquid is made to circulate in the piping 32 and supplied to the substrate processing unit 10. The control unit 102 determines whether the measured value of the flow meter 116 is less than the threshold value when the processing liquid can pass through the piping 32 (for example, the valve 36 is in an open state). In addition, for example, when the filter 141 is a new product, the measured value of the flow meter 116 is above the threshold value. On the other hand, when the bubbles clog the filter 141, the flow rate of the treatment liquid passing through the filter 141 decreases, so the measured value of the flow meter 116 decreases. Furthermore, when the amount of bubbles clogged in the filter 141 becomes greater than a predetermined amount, the measured value of the flow meter 116 becomes less than a threshold value.

[0121] In step S101, when the control unit 102 determines that the flow rate of the processing liquid passing through the pipe 32 is greater than or equal to the threshold value, the process repeats step S101. In other words, when the measured value of the flow meter 116 is greater than or equal to the threshold value, the process repeats step S101.

[0122] On the other hand, in step S101, when the control unit 102 determines that the flow rate of the processing liquid passing through the pipe 32 is less than the threshold value, the process moves to step S102. In other words, when the measured value of the flow meter 116 is less than the threshold value, the process moves to step S102.

[0123] Next, in step S102, the control unit 102 stops supplying the processing liquid. Specifically, the control unit 102 switches the valve 115 and the valve 117 from an open state to a closed state.

[0124] Next, in step S103, the control unit 102 replaces the inside of the modulation tank 112 with the cleaning solution from the treatment solution. Specifically, the control unit 102 switches the valve 242 from the closed state to the open state. Thus, the treatment solution in the modulation tank 112 is discharged via the pipe 241. Afterwards, the control unit 102 returns the valve 242 from the open state to the closed state. Moreover, the control unit 102 switches the valve 222 from the closed state to the open state. Thus, the cleaning solution is sent to the modulation tank 112, so that the inside of the modulation tank 112 is replaced with the cleaning solution. Afterwards, the control unit 102 returns the valve 222 from the open state to the closed state.

[0125] Next, in step S104, the control unit 102 allows the cleaning liquid to flow through the filter 141. Specifically, the control unit 102 switches the valve 115 and the valve 162 from the closed state to the open state. Fig. 6A As shown, the cleaning solution in the modulation tank 112 passes through the pipe 32 and the filter unit 140 and is discharged through the downstream pipe 161. Then, the control unit 102 returns the valve 115 from the open state to the closed state. In this way, the inside of the filter unit 140 is replaced by the cleaning solution from the treatment solution. In addition, in the present embodiment, although the valve 117 is switched from the open state to the closed state in step S102, the timing of switching the valve 117 from the open state to the closed state may also be, for example, step S104, or may also be step S103.

[0126] Next, in step S105, the control unit 102 allows the bubble removal liquid to flow through the filter 141. Specifically, the control unit 102 switches the valve 152 from the closed state to the open state. Figure 6BAs shown, the bubble removing liquid of the removing liquid supply unit 165 passes through the upstream piping 151 and the filter unit 140, and is then discharged through the downstream piping 161. At this time, the bubble removing liquid passes through the filter 141, thereby removing the bubbles that are blocked in the filter 141. That is, the performance of the filter 141 that allows the liquid to flow and pass through is restored. Next, the control unit 102 returns the valve 152 from the open state to the closed state.

[0127] Next, in step S106, the control unit 102 allows the cleaning liquid to flow through the filter 141. Specifically, the control unit 102 switches the valve 115 from the closed state to the open state. Fig. 6A As shown, the cleaning liquid in the preparation tank 112 passes through the pipe 32 and the filter unit 140 and is discharged through the downstream pipe 161. Then, the control unit 102 returns the valve 115 from the open state to the closed state. In this way, the interior of the filter unit 140 is replaced by the cleaning liquid from the bubble removal liquid.

[0128] Next, in step S107, the control unit 102 replaces the interior of the modulation tank 112 with the treatment liquid from the cleaning liquid. Specifically, the control unit 102 switches the valve 242 from the closed state to the open state. Thus, the cleaning liquid in the modulation tank 112 is discharged via the pipe 241. Afterwards, the control unit 102 returns the valve 242 from the open state to the closed state. Moreover, the control unit 102 switches the valve 212 from the closed state to the open state. Thus, the treatment liquid is sent to the modulation tank 112, so that the interior of the modulation tank 112 is replaced with the treatment liquid. Afterwards, the control unit 102 returns the valve 212 from the open state to the closed state.

[0129] Next, in step S108, the control unit 102 starts supplying the treatment liquid again. Specifically, the control unit 102 switches the valve 115 and the valve 117 from the closed state to the open state, and switches the valve 162 from the open state to the closed state. Figure 6C As shown, the treatment liquid in the preparation tank 112 passes through the filter unit 140 and the valve 117.

[0130] In detail, the control unit 102 switches the valve 115 from the closed state to the open state. As a result, the cleaning liquid in the pipe 32 and the filter unit 140 is discharged via the downstream pipe 161. The control unit 102 switches the valve 162 from the open state to the closed state after a predetermined time has passed since the valve 115 was switched from the closed state to the open state, and switches the valve 117 from the closed state to the open state. Therefore, it is possible to suppress the cleaning liquid in the pipe 32 and the filter unit 140 from passing through the valve 117. In addition, it is also possible to switch the valve 117 from the closed state to the open state, and switch the valve 162 from the open state to the closed state at the timing of switching the valve 115 from the closed state to the open state.

[0131] As described above, the removal of bubbles from the filter 141 of the first embodiment is completed.

[0132] Above, refer to Figures 1 to 5 , FIG. 6A to FIG. 6C The first embodiment of the present invention is described. As described above, in the first embodiment, the bubble removal liquid is passed from the upstream pipe 151 through the filter 141 through the downstream pipe 161. Therefore, the bubbles that clog the filter 141 can be removed. That is, the performance of the filter 141 for allowing the liquid to flow and pass can be restored. Therefore, the replacement frequency of the filter 141 can be suppressed. As a result, the environmental burden can be reduced.

[0133] Furthermore, by suppressing the replacement frequency of the filter 141, the time required for replacement and recovery of the filter 141 (also referred to as down time) can be reduced.

[0134] In addition, as described above, the cleaning liquid is passed from the cleaning pipe 171 through the filter 141 through the downstream pipe 161. Therefore, it is possible to suppress the treatment liquid from mixing or contacting with the bubble removal liquid. In the case where the treatment liquid and the bubble removal liquid react with each other, for example, there may be the following situation: the high temperature and high pressure are reached, thereby causing adverse effects on the pipe 32, the pump 114, the valve 115, the filter unit 140, the flow meter 116 or the valve 117, etc. Therefore, in the first embodiment, the cleaning liquid is passed, thereby suppressing the treatment liquid from mixing or contacting with the bubble removal liquid, thereby suppressing the treatment liquid and the bubble removal liquid from becoming high temperature and high pressure. As a result, it is possible to suppress adverse effects on the pipe 32, the pump 114, the valve 115, the filter unit 140, the flow meter 116 or the valve 117, etc.

[0135] In addition, as described above, the flow rate of the treatment liquid passing through the filter 141 is measured, and when the flow rate of the treatment liquid is less than a threshold value, the bubble removal liquid is passed from the upstream side pipe 151 through the filter 141 through the downstream side pipe 161. Therefore, the blockage of bubbles that is difficult to directly observe can be easily confirmed using the flow meter 116. In addition, since the bubbles are removed when the flow rate of the treatment liquid becomes less than a certain threshold value, the bubble removal can be performed before a large number of bubbles are blocked. Therefore, it is possible to suppress the time when the treatment liquid and the cleaning liquid flow and pass through the filter 141 from becoming longer.

[0136] [Second embodiment]

[0137] Next, refer to Figure 7 as well as Figure 8 A substrate processing apparatus 100 according to a second embodiment of the present invention will be described. Figure 7Schematic diagram for explaining the piping structure in the substrate processing apparatus 100 according to the second embodiment. In the second embodiment, the following example is described: a cleaning piping 171 and a cleaning liquid supply unit 175 are provided, the cleaning piping 171 is connected to the piping 32, and the cleaning liquid supply unit 175 is connected to the cleaning piping 171.

[0138] like Figure 7 As shown in FIG. 1 , the substrate processing apparatus 100 includes a cleaning pipe 171, a valve 172, and a cleaning liquid supply unit 175. The valve 172 is an example of the "fifth valve" of the present invention.

[0139] The cleaning pipe 171 is connected to the pipe 32 at the upstream side or downstream side of the filter 141. In the second embodiment, the cleaning pipe 171 is connected to the pipe 32 at the upstream side of the filter 141. In addition, in the second embodiment, the cleaning pipe 171 is directly connected to the pipe 32. In other words, the cleaning pipe 171 is connected to the pipe 32 without passing through the filter unit 140. In addition, as Figure 7 As shown, the cleaning pipe 171 may be connected to the pipe 32 after converging to the upstream pipe 151. In other words, a part of the cleaning pipe 171 and a part of the upstream pipe 151 may be connected to the pipe 32 as a common pipe. In addition, although not shown, the cleaning pipe 171 may be connected to the pipe 32 without converging to the upstream pipe 151.

[0140] The valve 172 is disposed in the cleaning pipe 171. The valve 172 adjusts the degree of opening of the flow path in the cleaning pipe 171, thereby adjusting the flow rate of the liquid passing through the cleaning pipe 171. Specifically, the valve 172 includes: a valve body (not shown) having a valve seat disposed therein; a valve core that opens and closes the valve seat; and an actuator (not shown) that moves the valve core between an open position and a closed position.

[0141] The cleaning liquid supply unit 175 is connected to the cleaning pipe 171. The cleaning liquid supply unit 175 supplies the cleaning liquid to the cleaning pipe 171. The cleaning liquid supply unit 175 includes, for example: a drum tank for storing the cleaning liquid; and / or a pump for delivering the cleaning liquid. The cleaning liquid may also include, for example, any one of deionized water (DIW), carbonated water, electrolyzed ionized water, ozone water, ammonia water, hydrochloric acid water with a diluted concentration (for example, about 10 ppm to 100 ppm), and reduced water (hydrogen water). In the second embodiment, the cleaning liquid supplied by the cleaning liquid supply unit 175 is deionized water (DIW).

[0142] The control unit 102 can control the valve 172 to switch the state of the valve 172 to an open state and a closed state. Specifically, the control unit 102 sets the valve 172 to an open state or a closed state, thereby allowing the liquid in the cleaning pipe 171 to pass through or not to pass through the liquid in the cleaning pipe 171. In addition, in the second embodiment, the cleaning liquid supply unit 220 may not be provided.

[0143] The other configurations of the second embodiment are the same as those of the first embodiment.

[0144] Next, refer to Figure 8 , Fig. 9A , Fig. 9B as well as Fig. 9C A method of removing bubbles from the filter 141 of the substrate processing apparatus 100 according to the second embodiment will be described. Figure 8 It is a flowchart showing the method of removing bubbles from the filter 141 according to the second embodiment. 9A to 9C 1 is a schematic diagram for illustrating the bubble removal method of the second embodiment, and is a diagram in which arrows are used to indicate the flow of liquid in the vicinity of the filter unit 140. The bubble removal method of the filter 141 of the second embodiment includes steps S101, S102, S204, S105, S206, and S108. In addition, unlike the first embodiment, the second embodiment does not include a step for replacing the liquid in the modulation tank 112. Steps S204 and S206 of the second embodiment correspond to steps S104 and S106 of the first embodiment. In addition, step S206 is an example of the "cleaning liquid circulation process" of the present invention.

[0145] like Figure 8 As shown, in step S101, the control unit 102 determines whether the flow rate of the processing liquid passing through the pipe 32 is less than a threshold value. In step S101, the valve 172 is closed.

[0146] In step S101 , when the control unit 102 determines that the flow rate of the processing liquid passing through the pipe 32 is equal to or greater than the threshold value, the process repeats step S101 .

[0147] On the other hand, when the control unit 102 determines in step S101 that the flow rate of the processing liquid passing through the pipe 32 is smaller than the threshold value, the process proceeds to step S102 .

[0148] Next, in step S102, the control unit 102 stops supplying the processing liquid. Specifically, the control unit 102 switches the valve 115 and the valve 117 from an open state to a closed state.

[0149] Next, in step S204, the control unit 102 allows the cleaning liquid to flow through the filter 141. Specifically, the control unit 102 switches the valve 172 and the valve 162 from the closed state to the open state. Fig. 9A As shown, the cleaning liquid of the cleaning liquid supply unit 175 passes through the cleaning pipe 171 and the filter unit 140 and is discharged through the downstream pipe 161. Then, the control unit 102 returns the valve 172 from the open state to the closed state. In this way, the inside of the filter unit 140 is replaced by the cleaning liquid from the treatment liquid.

[0150] Next, in step S105, the control unit 102 allows the bubble removal liquid to flow through the filter 141. Specifically, the control unit 102 switches the valve 152 from the closed state to the open state. Fig. 9B As shown in FIG. 1 , the removal liquid of the removal liquid supply unit 165 passes through the upstream pipe 151 and the filter unit 140 and is discharged through the downstream pipe 161. At this time, the removal liquid passes through the filter 141, thereby removing the bubbles that clog the filter 141. That is, the performance of the filter 141 for allowing the liquid to flow and pass through is restored. Next, the control unit 102 returns the valve 152 from the open state to the closed state.

[0151] Next, in step S206, the control unit 102 allows the cleaning liquid to flow through the filter 141. Specifically, the control unit 102 switches the valve 172 from the closed state to the open state. Fig. 9A As shown, the cleaning liquid of the cleaning liquid supply unit 175 passes through the cleaning pipe 171 and the filter unit 140 and is discharged through the downstream pipe 161. Then, the control unit 102 returns the valve 172 from the open state to the closed state. In this way, the interior of the filter unit 140 is replaced by the cleaning liquid from the bubble removal liquid.

[0152] Next, in step S108, the control unit 102 starts supplying the processing liquid again. Fig. 9C As shown, the treatment liquid in the preparation tank 112 passes through the filter unit 140 and the valve 117.

[0153] As described above, the removal of bubbles from the filter 141 of the second embodiment is completed.

[0154] As described above, in the second embodiment, a cleaning pipe 171 connected to the pipe 32 is provided, and the cleaning solution is passed from the cleaning pipe 171 through the filter 141 through the downstream pipe 161. Therefore, it is not necessary to provide a process (step S103) for replacing the inside of the modulation tank 112 with the cleaning solution and a process (step S107) for replacing the inside of the modulation tank 112 with the treatment solution. Therefore, the process for restoring the filter 141 can be simplified. In addition, since it is not necessary to replace the inside of the modulation tank 112 with the cleaning solution and it is not necessary to replace the inside of the modulation tank 112 with the treatment solution, the consumption of the treatment solution and the cleaning solution can be reduced. Therefore, the environmental burden can be further reduced.

[0155] The other bubble removal methods and other effects of the second embodiment are the same as those of the first embodiment.

[0156] [First Modification Example]

[0157] Next, refer to Fig.10 A substrate processing apparatus 100 according to a first modified example of the present invention will be described. Fig.10 1 is a schematic diagram for explaining the piping structure of the substrate processing apparatus 100 according to the first variation. The first variation describes an example different from the first embodiment and the second embodiment, that is, an example in which the downstream piping 161 is connected to the filter unit 140. Figure 7 The piping structure of the second embodiment shown in the figure is partially described, but it can also be changed. Figure 3 A part of the piping structure of the first embodiment is shown.

[0158] like Fig.10 As shown, in the substrate processing apparatus 100 of the first variation, the downstream side pipe 161 is connected to the downstream portion 32b of the pipe 32 at the downstream side of the filter 141. Specifically, the downstream side pipe 161 is connected to the pipe 32 via the filter unit 140. The downstream side pipe 161 is connected to the pipe 32 via the downstream chamber 142b of the filter unit 140.

[0159] In the first modification, similarly to the first and second embodiments, the liquid that has passed through the filter 141 can be discharged through the downstream pipe 161 .

[0160] The downstream side piping 161 is connected to the lower part of the downstream chamber 142b, for example. For example, in a configuration where a drain pipe for discharging the liquid passing through the filter 141 to the outside is connected to the downstream chamber 142b of the filter unit 140, the drain pipe can also be used as the downstream side piping 161. In other words, the previously provided drain pipe can also serve as the downstream side piping 161. According to this configuration, since there is no need to separately provide the downstream side piping 161, the increase in the number of components of the substrate processing apparatus 100 can be suppressed.

[0161] The other structures, bubble removal methods, and other effects of the first variation are the same as those of the first embodiment and the second embodiment.

[0162] [Second variation]

[0163] Next, refer to Fig.11 A substrate processing apparatus 100 according to a second modified example of the present invention will be described. Fig.11 1 is a schematic diagram for explaining the piping structure of the substrate processing apparatus 100 according to the second variation. The second variation describes an example different from the first variation, that is, an example in which the downstream side piping 161 is connected to the upper part of the downstream chamber 142b of the filter unit 140. Figure 7 The piping structure of the second embodiment shown in the figure is partially described, but it can also be changed. Figure 3 A part of the piping structure of the first embodiment is shown.

[0164] like Fig.11 As shown, in the substrate processing apparatus 100 of the second modification, similarly to the first modification, the downstream pipe 161 is connected to the pipe 32 via the downstream chamber 142b of the filter unit 140. In the second modification, similarly to the first modification, the liquid passing through the filter 141 can be discharged via the downstream pipe 161.

[0165] In the second variation, the downstream side piping 161 is connected to the upper part of the downstream chamber 142b, for example. For example, in a configuration in which an exhaust pipe for discharging the gas passing through the filter 141 to the outside is connected to the downstream chamber 142b of the filter unit 140, the exhaust pipe can also be used as the downstream side piping 161. In other words, the exhaust pipe provided in advance can also serve as the downstream side piping 161. According to this configuration, since there is no need to provide the downstream side piping 161 separately, the number of components of the substrate processing apparatus 100 can be suppressed from increasing.

[0166] The other structures, bubble removal methods, and other effects of the second variation are the same as those of the first variation.

[0167] [Third Embodiment]

[0168] Next, refer to Fig.12 A substrate processing apparatus 100 according to a third embodiment of the present invention will be described. In the third embodiment, an example different from the first and second embodiments is described, that is, an example in which bubble removal is performed periodically. Figure 5 The bubble removal method of the first embodiment shown in the figure is partially described, but it can also be changed Figure 8 A part of the bubble removal method according to the second embodiment is shown.

[0169] The configuration of the substrate processing apparatus 100 of the third embodiment is the same as that of the first embodiment or the second embodiment. However, in the third embodiment, the substrate processing apparatus 100 may not include the flow meter 116 .

[0170] Fig.12 1 is a flowchart showing a method for removing bubbles from the filter 141 according to the third embodiment. The method for removing bubbles from the filter 141 according to the third embodiment includes step S301 and steps S102 to S108. In addition, step S301 is an example of the "processing liquid circulation process" of the present invention. In step S301, the processing liquid is made to flow and pass through the filter 141 in the same manner as in the above-mentioned step S101. In addition, in step S301, the processing liquid is made to flow to the pipe 32 and supplied to the substrate processing unit 10.

[0171] like Fig.12 As shown, in step S301, the control unit 102 determines whether a predetermined period has passed. The predetermined period is a predetermined period. The predetermined period is, for example, the time elapsed since the last time the filter 141 was replaced or the bubbles were removed, or the accumulated driving time of the substrate processing apparatus 100. In addition, the predetermined period may also be, for example, the accumulated time for the processing liquid to flow and pass since the last time the filter 141 was replaced or the bubbles were removed. The accumulated time for the processing liquid to flow and pass corresponds to the flow rate of the processing liquid. In order to measure the above-mentioned predetermined period, the substrate processing apparatus 100 is preferably equipped with a timer or a flow meter.

[0172] In addition, the predetermined period of the situation that the filter 141 was replaced last time may be different from the predetermined period of the situation that the filter 141 was removed from the air bubbles last time. In this case, the predetermined period of the situation that the filter 141 was replaced may also be set to be longer than the predetermined period of the situation that the filter 141 was removed from the air bubbles.

[0173] In step S301 , when the control unit 102 determines that the predetermined period has not elapsed, the process repeats step S301 .

[0174] On the other hand, in step S301 , when the control unit 102 determines that the predetermined period has elapsed, the process proceeds to step S102 .

[0175] Next, step S102 to step S108 are executed.

[0176] The other bubble removal methods of the third embodiment are the same as those of the first embodiment or the second embodiment.

[0177] As described above, in the third embodiment, the bubble removal liquid is periodically passed from the upstream pipe 151 through the filter 141 through the downstream pipe 161. Therefore, the bubble removal can be performed before a large number of bubbles are blocked. Therefore, the time taken to make the treatment liquid and the cleaning liquid flow and pass through the filter 141 can be suppressed from being prolonged.

[0178] The other effects of the third embodiment are the same as those of the first embodiment or the second embodiment.

[0179] [Fourth Embodiment]

[0180] Next, refer to Fig.13 The substrate processing apparatus 100 according to the fourth embodiment of the present invention is described. In the fourth embodiment, an example different from the first to third embodiments is described, that is, an example in which the supply of the processing liquid is restarted after confirming that the filter 141 has recovered. Figure 5 The bubble removal method of the first embodiment shown in the figure is partially described, but it can also be changed Fig.12 A part of the bubble removal method according to the third embodiment is shown.

[0181] The configuration of the substrate processing apparatus 100 according to the fourth embodiment is the same as that of the first embodiment and the third embodiment.

[0182] Fig.13 1 is a flowchart showing a method for removing air bubbles from the filter 141 according to the fourth embodiment. The method for removing air bubbles from the filter 141 according to the fourth embodiment includes steps S101 to S107, S401, S402, and S108. Step S402 is an example of the "measurement process" of the present invention.

[0183] like Fig.13 As shown, steps S101 to S107 are the same as those in the first embodiment. After step S107, the process moves to step S401. Step S401 is executed before step S108.

[0184] In step S401, the control unit 102 allows the treatment liquid to flow through the filter 141. Specifically, the control unit 102 switches the valve 115 and the valve 117 from the closed state to the open state. Thus, the treatment liquid in the preparation tank 112 passes through the pipe 32 and the filter unit 140 and then passes through the flow meter 116.

[0185] Next, in step S402, the control unit 102 determines whether the flow rate of the treatment liquid passing through the flow meter 116 is greater than a predetermined value. That is, the control unit 102 determines whether the flow rate of the treatment liquid passing through the filter 141 is greater than a predetermined value. In other words, the control unit 102 determines whether the filter 141 has been restored. In addition, the "predetermined value" of step S402 is greater than the "threshold value" of step S101. However, the "predetermined value" of step S402 may also be the same size as the "threshold value" of step S101.

[0186] If the control unit 102 determines in step S402 that the flow rate of the treatment liquid passing through the flow meter 116 is less than the predetermined value, the process returns to step S102. Thus, the treatment liquid flows toward and passes through the filter 141 again.

[0187] On the other hand, when the control unit 102 determines in step S402 that the flow rate of the processing liquid passing through the flow meter 116 is equal to or higher than the predetermined value, the process proceeds to step S108. Next, for example, the supply of the processing liquid to the nozzle 34 is restarted.

[0188] As described above, the removal of air bubbles from the filter 141 according to the fourth embodiment is completed.

[0189] The rest of the air bubble removal method of the fourth embodiment is the same as that of the first and third embodiments.

[0190] As described above, in the fourth embodiment, when the measured value of the flow meter 116 is less than the predetermined value after the removal liquid circulation step (step S105), the removal liquid circulation step is performed again. Therefore, the supply of the processing liquid to the substrate processing unit 10 can be restarted after the filter 141 is surely restored.

[0191] In the fourth embodiment, the time during which the liquid flows and passes through step S104 performed after step S402 may be set shorter than the time during which the liquid flows and passes through step S104 (the first step S104) performed without step S402. With this configuration, it is possible to suppress an increase in the amount of the bubble removing liquid used.

[0192] In addition, in the fourth embodiment, the time for making the bubble removal liquid flow and pass through the filter 141 in step S105 can also be changed by the control unit 102. Specifically, the control unit 102 can also automatically change the time for the liquid to flow and pass through in step S104 (the first step S104) that is not performed by step S402 based on the cumulative time for the liquid to flow and pass through required in step S105 before moving to step S108. In addition, the change of the time for the liquid to flow and pass through can also be performed manually by the user. In this way, the time for the liquid to flow and pass through in step S104 (the first step S104) that is not performed by step S402 is changed based on the cumulative time for the liquid to flow and pass through required in step S105 before moving to step S108, thereby optimizing the time for the liquid to flow and pass through in the first step S104. Therefore, it is possible to suppress the execution of steps S102 to S107 multiple times. Therefore, it is possible to suppress the increase in the amount of cleaning liquid used and the increase in the time required for bubble removal.

[0193] The other effects of the fourth embodiment are the same as those of the first and third embodiments.

[0194] [Fifth Embodiment]

[0195] Next, refer to Fig.14 The substrate processing apparatus 100 according to the fifth embodiment of the present invention is described. In the fifth embodiment, an example different from the fourth embodiment is described, that is, an example in which a step for replacing the liquid in the modulation tank 112 is not included. Figure 8 The bubble removal method of the second embodiment shown in FIG. Fig.12 A part of the bubble removal method according to the third embodiment is shown.

[0196] Similar to the second embodiment, in the fifth embodiment, the substrate processing apparatus 100 includes a cleaning pipe 171 connected to the pipe 32 on the upstream side or downstream side of the filter 141. The cleaning pipe 171 is connected to the pipe 32 on the upstream side of the filter 141.

[0197] The configuration of the substrate processing apparatus 100 according to the fifth embodiment is the same as that of the second embodiment and the third embodiment.

[0198] Fig.14 1 is a flowchart showing a method for removing air bubbles from the filter 141 according to the fifth embodiment. The method for removing air bubbles from the filter 141 according to the fifth embodiment includes steps S101, S102, S204, S105, S206, S401, S402, and S108.

[0199] like Fig.14As shown, steps S101, S102, S204, S105, S206, and S108 are the same as those of the second embodiment. After step S206, the process moves to step S401. Step S401 is executed before step S108.

[0200] In step S401, the control unit 102 allows the treatment liquid to flow through the filter 141. Specifically, the control unit 102 switches the valve 115 and the valve 117 from the closed state to the open state. Thus, the treatment liquid in the preparation tank 112 passes through the pipe 32 and the filter unit 140 and then passes through the flow meter 116.

[0201] Next, in step S402 , the control unit 102 determines whether the flow rate of the processing liquid passing through the flow meter 116 is equal to or greater than a predetermined value.

[0202] If the control unit 102 determines in step S402 that the flow rate of the treatment liquid passing through the flow meter 116 is less than the predetermined value, the process returns to step S102. Thus, the treatment liquid flows toward and passes through the filter 141 again.

[0203] On the other hand, when the control unit 102 determines in step S402 that the flow rate of the processing liquid passing through the flow meter 116 is equal to or higher than the predetermined value, the process proceeds to step S108. Next, for example, the supply of the processing liquid to the nozzle 34 is restarted.

[0204] As described above, the removal of air bubbles from the filter 141 according to the fifth embodiment is completed.

[0205] The rest of the air bubble removal method of the fifth embodiment is the same as that of the second embodiment and the fourth embodiment.

[0206] As described above, similarly to the fourth embodiment, in the fifth embodiment, when the measured value of the flow meter 116 is less than the predetermined value after the removal liquid circulation process (step S105), the removal liquid circulation process is performed again. Therefore, the supply of the processing liquid to the substrate processing unit 10 can be started again after the filter 141 is surely restored.

[0207] The other effects of the fifth embodiment are the same as those of the second and fourth embodiments.

[0208] [Sixth Embodiment]

[0209] Next, refer to Fig.15 A substrate processing apparatus 100 according to a sixth embodiment of the present invention will be described. Fig.151 is a schematic diagram showing the piping structure in the substrate processing apparatus 100 according to the sixth embodiment. In the sixth embodiment, an example is described in which a portion of the processing liquid that has passed through the valve 117 is returned to the modulation tank 112. That is, an example is described in which the piping 32 is configured in a manner for circulating the processing liquid in the sixth embodiment. Figure 3 The piping structure of the first embodiment shown in the figure is partially described, but it can also be changed. Figure 7 A part of the piping structure of the second embodiment shown.

[0210] like Fig.15 As shown, in the sixth embodiment, the pipe 32 includes a common pipe 32c, a branch pipe 32d, a return pipe 32e, a common pipe 32f, and a branch pipe 32g. The common pipe 32c is connected to the downstream portion 32b of the pipe 32. A plurality of (four in this case) branch pipes 32d are connected to the common pipe 32c. The branch pipe 32d branches from the common pipe 32c. The branch pipe 32d supplies the treatment liquid that has passed through the valve 117 to the treatment liquid tank 120.

[0211] The return pipe 32e is connected to the common pipe 32c. The return pipe 32e extends to the preparation tank 112. The return pipe 32e returns the processing liquid having passed through the common pipe 32c to the preparation tank 112.

[0212] The common pipe 32f is, for example, disposed in the treatment liquid tank 120. The common pipe 32f is connected to the branch pipe 32d. In addition, a plurality of (three in this case) branch pipes 32g are connected to the common pipe 32f. The branch pipe 32g branches from the common pipe 32f. The branch pipe 32g supplies the treatment liquid that has passed through the common pipe 32f to the nozzle 34.

[0213] The other structures, bubble removal methods, and functions of the sixth embodiment are the same as those of the first to fifth embodiments.

[0214] [Seventh Embodiment]

[0215] Next, refer to Fig. 6A , Figure 6C , Fig.16 as well as Fig.17 A substrate processing apparatus 100 according to a seventh embodiment of the present invention will be described. In the seventh embodiment, an example different from the first to sixth embodiments is described in which a bubble removing liquid is caused to flow and pass when supply of a processing liquid is started.

[0216] In the seventh embodiment, similarly to the sixth embodiment, the pipe 32 is configured to circulate the processing liquid. In addition, the pipe 32 may not be configured to circulate the processing liquid. In addition, in the seventh embodiment, the substrate processing apparatus 100 may not include the gas supply unit 230.

[0217] As described later, in the seventh embodiment, the processing liquid is mixed or in contact with the bubble removal liquid. Therefore, the processing liquid and the bubble removal liquid are liquids that do not react or are difficult to react with each other. At least one of the processing liquid and the bubble removal liquid in the seventh embodiment is a different liquid from that in the first embodiment.

[0218] The rest of the configuration of the seventh embodiment is the same as that of the sixth embodiment.

[0219] Fig.16 It is a flowchart showing the method of removing bubbles from the filter 141 according to the seventh embodiment. Fig.17 1 is a schematic diagram for explaining the bubble removal method of the seventh embodiment, and is a diagram showing the flow of liquid in the vicinity of the filter unit by arrows. The bubble removal method of the filter 141 of the seventh embodiment includes steps S501 to S503. Steps S501 to S503 are executed by the control unit 102. In addition, step S501 is an example of the "processing liquid circulation process" and the "removal liquid circulation process" of the present invention.

[0220] like Fig.16 As shown, in step S501, the control unit 102 causes the treatment liquid and the bubble removal liquid to flow and pass through the filter 141. Specifically, step S501 is performed before the supply of the treatment liquid is started. For example, there may be the following situation: when the treatment liquid is supplied from the state where the pump 114 is stopped, bubbles will be mixed into the filter unit 140. The gas mixed into the filter unit 140 becomes the cause of the clogging of the filter 141. The so-called state where the pump 114 is stopped can be exemplified by an idling state in which the circulation of the treatment liquid has been stopped or a state in which the treatment liquid in the modulation tank 112 has been replaced. In addition, before step S501, valves 115, 117, 152, and 162 are closed.

[0221] In step S501, the control unit 102 switches the valves 115, 152, and 162 from the closed state to the open state. Fig.17As shown, the treatment liquid and the bubble removal liquid are discharged through the downstream pipe 161 after passing through the filter unit 140. At this time, since the bubble removal liquid passes through the filter 141, even if bubbles are mixed into the filter unit 140, it is possible to prevent the bubbles from clogging the filter 141. In addition, the timing of switching the valve 115 from the closed state to the open state and the timing of switching the valve 152 from the closed state to the open state may be the same, or one may be earlier than the other. And, when, for example, several seconds have passed since the treatment liquid and the bubble removal liquid began to flow and pass through, the process moves to step S502.

[0222] Next, in step S502, the control unit 102 stops the bubble removal liquid from flowing and passing through. Specifically, the control unit 102 switches the valve 152 from an open state to a closed state. Fig. 6A As shown, the treated liquid passes through the filter unit 140 and is discharged through the downstream pipe 161 .

[0223] Next, in step S503, the control unit 102 starts supplying the treatment liquid. Specifically, the valve 162 is switched from the open state to the closed state, and the valve 117 is switched from the closed state to the open state. Figure 6C As shown, the process liquid flows toward the valve 117 after passing through the filter unit 140 .

[0224] As described above, the removal of air bubbles from the filter 141 according to the seventh embodiment is completed.

[0225] As described above, in the seventh embodiment, when the processing liquid is supplied from the stopped state of the pump 114, the processing liquid and the bubble removing liquid are caused to flow and pass through the filter 141. Therefore, even if bubbles are mixed into the filter unit 140, clogging of the filter 141 by the bubbles can be suppressed.

[0226] The other effects of the seventh embodiment are the same as those of the first to sixth embodiments.

[0227] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, the present invention is not limited to the above-mentioned embodiments, and can be implemented in various ways without departing from the spirit of the present invention. In addition, various inventions can be formed by appropriately combining the plurality of constituent elements disclosed in the above-mentioned embodiments. For example, some of the constituent elements of all the constituent elements shown in the embodiments can be deleted. Furthermore, the constituent elements in different embodiments can also be appropriately combined. In order to easily understand the present invention, the accompanying drawings show each constituent element principally and schematically, and the thickness, length, number, interval, etc. of each constituent element shown in the drawings will also be different from the actual situation due to the relationship of drawing the accompanying drawings. In addition, the material, shape, size, etc. of each constituent element shown in the above-mentioned embodiments are examples, and are not particularly limited. Various changes can be made within the scope of not substantially departing from the effect of the present invention.

[0228] For example, in the first to sixth embodiments, although an example is described in which the cleaning liquid is made to flow and pass before the bubble removal liquid is made to flow and pass, and the cleaning liquid is made to flow and pass after the bubble removal liquid is made to flow and pass, the present invention is not limited to this. For example, after the supply of the treatment liquid is stopped, the cleaning liquid may not be made to flow and pass, but the bubble removal liquid may be made to flow and pass. In addition, after the bubble removal liquid is made to flow and pass, the cleaning liquid may not be made to flow and pass, but the treatment liquid may be made to flow and pass. However, in a case where there is a concern that the treatment liquid and the bubble removal liquid may react with each other and thus have an adverse effect on components such as piping, valves, or filter units, it is preferable to make the cleaning liquid flow and pass as described in the first to sixth embodiments.

[0229] In addition, for example, although the first to sixth embodiments describe an example in which the removal liquid supply unit 165 is connected to the upstream pipe 151 and the bubble removal liquid is passed from the upstream pipe 151 to the downstream pipe 161 via the filter 141, the present invention is not limited thereto. For example, the removal liquid supply unit 165 may be connected to the downstream pipe 161 and the bubble removal liquid may be passed from the downstream pipe 161 to the upstream pipe 151 via the filter 141.

[0230] In addition, for example, although the second embodiment and the fifth embodiment describe an example in which the cleaning pipe 171 is connected to the pipe 32 at the upstream side of the filter 141 and the cleaning liquid passes from the cleaning pipe 171 through the filter 141 through the downstream side pipe 161, the present invention is not limited thereto. For example, the cleaning pipe 171 may be connected to the pipe 32 at the downstream side of the filter 141 and the cleaning liquid passes from the cleaning pipe 171 through the filter 141 through the upstream side pipe 151.

[0231] In addition, for example, although the fourth embodiment and the fifth embodiment describe an example of using the flow rate of the treatment liquid in the measuring process (step S402) in order to confirm that the filter 141 has been restored, the present invention is not limited to this. For example, the flow rate of the cleaning liquid may be used to confirm that the filter 141 has been restored. In this case, a flow meter for measuring the flow rate of the cleaning liquid passing through the filter 141 may be arranged in, for example, the downstream piping 161, the piping 32, or the cleaning piping 171. In addition, for example, the flow rate of the bubble removal liquid may be used to confirm that the filter 141 has been restored. In this case, a flow meter for measuring the flow rate of the bubble removal liquid passing through the filter 141 may be arranged in, for example, the downstream piping 161, the piping 32, or the upstream piping 151.

[0232] In addition, in the above embodiment, although an example is shown in which the substrate processing apparatus 100 is provided with the gas supply unit 230, the present invention is not limited thereto, and gas may not be supplied to the modulation tank 112. For example, bubbles may be mixed into the filter unit 140 when the filter 141 is replaced. Although the mixed gas may cause the filter 141 to be clogged, the filter 141 can be restored according to the present invention.

[0233] In addition, in the above-mentioned embodiment, although the valve 36, 115, 117, 152, 162, 172, 212, 222, 232, 242 is described as an example of a valve capable of adjusting the flow rate of the liquid, the present invention is not limited thereto. For example, the valve 36, 115, 117, 152, 162, 172, 212, 222, 232, 242 may also be a valve that cannot adjust the flow rate of the liquid. That is, the valve 36, 115, 117, 152, 162, 172, 212, 222, 232, 242 may also switch the flow path only to an open state or a closed state.

[0234] Industrial Applicability

[0235] The present invention is suitable for use in a substrate processing apparatus and a method for removing bubbles from a filter.

[0236] [Description of Reference Numerals]

[0237] 10: Substrate processing unit

[0238] 32: Piping (processing liquid piping)

[0239] 100: Substrate processing device

[0240] 115: Valve (first valve)

[0241] 116: Flow meter

[0242] 117: Valve (second valve)

[0243] 141: Filter

[0244] 151: Upstream piping

[0245] 152: Valve (third valve)

[0246] 161: Downstream piping

[0247] 162: Valve (fourth valve)

[0248] 165: Removal liquid supply unit

[0249] 171: Clean the pipes

[0250] 172: Valve (fifth valve)

[0251] 175: Cleaning liquid supply unit

[0252] 220: Cleaning liquid supply unit

[0253] S101, S301: Step (Processing Liquid Flowing Process)

[0254] S105: Step (removal liquid flow process)

[0255] S106, S206: Step (cleaning liquid circulation process)

[0256] S402: Step (measurement process)

[0257] S501: Step (processing liquid circulation step, removal liquid circulation step)

[0258] W: substrate

Claims

1. A substrate processing device, wherein: have: A substrate processing unit, used for processing a substrate; A processing liquid pipe for supplying the processing liquid to flow to the substrate processing unit; A filter, arranged on the treatment liquid piping; an upstream pipe connected to the treatment liquid pipe at the upstream side of the filter; A downstream pipe connected to the treatment liquid pipe at the downstream side of the filter; as well as a removal liquid supply unit connected to one of the upstream pipe and the downstream pipe, and supplying the bubble removal liquid for removing bubbles clogged in the filter to one of the upstream pipe and the downstream pipe; The substrate processing apparatus allows the bubble removing liquid to pass from one of the upstream pipe and the downstream pipe through the filter to the other of the upstream pipe and the downstream pipe.

2. The substrate processing apparatus according to claim 1, wherein: Also available: a cleaning pipe connected to the treatment liquid pipe at the upstream side or the downstream side of the filter; as well as a cleaning liquid supply unit connected to the cleaning pipe and supplying the cleaning liquid for flushing the processing liquid to the cleaning pipe; The substrate processing apparatus allows the cleaning liquid to pass from the cleaning pipe through the filter through the other of the upstream pipe and the downstream pipe.

3. The substrate processing apparatus according to claim 2, wherein: Also available: a first valve disposed on the treatment liquid pipe at an upstream side of the filter; a second valve disposed in the treatment liquid pipe at a downstream side of the filter; A third valve is disposed on the upstream pipe; a fourth valve, disposed on the downstream pipe; as well as a fifth valve, disposed on the cleaning pipe; The substrate processing apparatus closes the third valve, the fourth valve, and the fifth valve and opens the first valve and the second valve, thereby allowing the processing liquid to pass from the upstream side of the processing liquid piping through the filter to the downstream side of the processing liquid piping; The substrate processing apparatus closes the first valve, the second valve, and the fifth valve and opens the third valve and the fourth valve, thereby allowing the bubble removing liquid to pass from one of the upstream pipe and the downstream pipe through the filter and through the other of the upstream pipe and the downstream pipe; The substrate processing device closes the third valve and one of the fourth valves, the first valve and the second valve, and opens the other of the third valve and the fourth valve, and the fifth valve, thereby allowing the cleaning liquid to flow from the cleaning pipe through the filter through the other of the upstream side pipe and the downstream side pipe.

4. The substrate processing apparatus according to any one of claims 1 to 3, wherein: It also includes: a flow meter, which is arranged on the processing liquid piping and is used to measure the flow rate of the processing liquid passing through the filter; The substrate processing apparatus allows the bubble removing liquid to pass from one of the upstream pipe and the downstream pipe through the filter to the other of the upstream pipe and the downstream pipe when the measured value of the flow meter is less than a threshold value.

5. The substrate processing apparatus according to any one of claims 1 to 4, wherein: The bubble removing liquid is periodically passed from one of the upstream pipe and the downstream pipe through the filter to the other of the upstream pipe and the downstream pipe.

6. The substrate processing apparatus according to any one of claims 1 to 5, wherein: It also includes: a flow meter for measuring the flow rate of the liquid passing through the filter; After the substrate processing device allows the bubble removal liquid to pass from one of the upstream piping and the downstream piping through the filter through the other of the upstream piping and the downstream piping, when the measured value of the flow meter is less than a predetermined value, the bubble removal liquid is again passed from one of the upstream piping and the downstream piping through the filter through the other of the upstream piping and the downstream piping.

7. A method for removing bubbles from a filter, wherein: Include: A process liquid flow step, wherein the process liquid for processing the substrate flows through a filter arranged in a process liquid piping connected to a substrate processing unit; as well as A removal liquid circulation process uses a bubble removal liquid to remove bubbles blocked in the filter from one of the upstream piping and the downstream piping through the filter through the other of the upstream piping and the downstream piping, the upstream piping being connected to the treatment liquid piping at the upstream side of the filter, and the downstream piping being connected to the treatment liquid piping at the downstream side of the filter.

8. The method for removing air bubbles from a filter according to claim 7, wherein: It also includes: a cleaning liquid circulation process, before the removal liquid circulation process, a cleaning liquid used to flush the treatment liquid is passed from the cleaning pipe through the filter through the other of the upstream pipe and the downstream pipe, and the cleaning pipe is connected to the treatment liquid pipe at the upstream side or downstream side of the filter.

9. The method for removing air bubbles from a filter according to claim 7 or 8, wherein: measuring the flow rate of the treatment liquid passing through the filter in the treatment liquid circulation step; When the flow rate of the processing liquid is less than a threshold value, the removal liquid flowing step is performed.

10. The method for removing air bubbles from a filter according to any one of claims 7 to 9, wherein: The removal liquid circulation step is performed periodically.

11. The method for removing air bubbles from a filter according to any one of claims 7 to 10, wherein: The method further comprises: a measuring step of measuring the flow rate of the liquid passing through the filter after the removal liquid circulation step; When the measured value of the flow meter is smaller than the predetermined value, the removal liquid flowing step is performed again.

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