Substrate processing apparatus and bubble removal method for filter

Abstract

A substrate processing apparatus (100) includes a substrate processing unit (10), a pipe (32), a filter (141), an upstream-side pipe (151), a downstream-side pipe (161), and a removal liquid supply section (165). The substrate processing unit (10) processes a substrate (W). The pipe (32) supplies a processing liquid to the substrate processing unit (10). The filter (141) is provided to the pipe (32). The upstream-side pipe (151) is connected to the pipe (32) at an upstream side of the filter (141). The downstream-side pipe (161) is connected to the pipe (32) at a downstream side of the filter (141). The removal liquid supply section (165) supplies a bubble removal liquid to one of the upstream-side pipe (151) and the downstream-side pipe (161). The substrate processing apparatus (100) passes the bubble removal liquid from one of the upstream-side pipe (151) and the downstream-side pipe (161) through the other of the upstream-side pipe (151) and the downstream-side pipe (161) via the filter (141).

Description

Technical Field

[0001] This invention relates to a substrate processing apparatus and a method for removing bubbles from a filter. Background Technology

[0002] Conventionally, a substrate processing apparatus for processing substrates is known. This substrate processing apparatus is suitable for manufacturing semiconductor substrates. The substrate processing apparatus uses a processing liquid such as a chemical solution to process the substrate. The processing liquid flows through piping equipped with filters and valves, and processes the substrate. The filter captures particles contained in the processing liquid passing through the piping. As such a substrate processing apparatus, a liquid processing apparatus is known, comprising: a tank for storing the processing liquid; and a circulation line for pulling out from and returning to the tank; and supplying the processing liquid to the liquid processing unit via the circulation line (see, for example, Patent Document 1). The liquid processing apparatus includes: a filter for removing particles contained in the processing liquid. In the liquid processing apparatus of Patent Document 1, filters that have been used for a predetermined time are replaced with new filters.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent document 1: Japanese Patent Application Publication No. 2015-103662. Summary of the Invention

[0006] The problem that the invention aims to solve

[0007] However, in cases where a treatment fluid containing air bubbles flows through the piping, the air bubbles can sometimes become trapped in the filter. In such situations, the portion of the filter in contact with the air bubbles dries out, making it impossible for the treatment fluid to pass through this dry section. Furthermore, when the treatment fluid containing air bubbles continues to flow through the piping, the increased contact area with the air bubbles in the filter makes it impossible to ensure a consistent flow rate of the treatment fluid in the piping. Therefore, it is necessary to replace the filter with a new one.

[0008] However, since replacing filters increases the environmental burden, it is desirable to reduce the frequency of filter replacement from the perspective of reducing the environmental burden.

[0009] The present invention addresses the aforementioned problems and aims to provide a substrate processing apparatus capable of suppressing the frequency of filter replacement and a method for removing air bubbles from the filter.

[0010] means of solving problems

[0011] According to one aspect of the present invention, a substrate processing apparatus includes a substrate processing unit, a processing liquid piping, a filter, an upstream side piping, a downstream side piping, and a degassing liquid supply unit. The substrate processing unit processes a substrate. The processing liquid piping supplies processing liquid to the substrate processing unit. The filter is disposed on the processing liquid piping. The upstream side piping is connected to the processing liquid piping upstream of the filter. The downstream side piping is connected to the processing liquid piping downstream of the filter. The degassing liquid supply unit is connected to one of the upstream side piping and the downstream side piping. The degassing liquid supply unit supplies bubble-removing liquid, used to remove bubbles clogging the filter, to one of the upstream side piping and the downstream side piping. The substrate processing apparatus allows the bubble-removing liquid to pass from one of the upstream side piping and the downstream side piping through the filter and the other of the upstream side piping and the downstream side piping.

[0012] In one embodiment, the substrate processing apparatus further includes a cleaning pipe and a cleaning solution supply unit. The cleaning pipe is connected to the processing solution pipe at an upstream or downstream side of the filter. The cleaning solution supply unit is connected to the cleaning pipe. The cleaning solution supply unit supplies cleaning solution for rinsing the processing solution to the cleaning pipe. The substrate processing apparatus allows the cleaning solution to pass from the cleaning pipe through the filter and through the other of the upstream and downstream pipes.

[0013] In one embodiment, the substrate processing apparatus further includes a first valve, a second valve, a third valve, a fourth valve, and a fifth valve. The first valve is disposed upstream of the filter in the processing liquid piping. The second valve is disposed downstream of the filter in the processing liquid piping. The third valve is disposed in the upstream piping. The fourth valve is disposed in the downstream piping. The fifth valve is disposed in the cleaning piping. The substrate processing apparatus closes the third, fourth, and fifth valves and opens the first and second valves, thereby allowing the processing liquid to flow from the upstream side of the processing liquid piping through the filter to the downstream side of the processing liquid piping. The substrate processing apparatus closes the first, second, and fifth valves and opens the third and fourth valves, thereby allowing the bubble removal liquid to flow from one of the upstream and downstream piping through the filter to the other of the upstream and downstream piping. The substrate processing apparatus closes the first valve and the second valve, and one of the third valve and the fourth valve, and opens the other of the third valve and the fourth valve, as well as the fifth valve, thereby allowing the cleaning solution to flow from the cleaning piping through the filter through the other of the upstream piping and the downstream piping.

[0014] In one embodiment, the substrate processing apparatus further includes a flow meter disposed in the processing liquid piping for measuring the flow rate of the processing liquid passing through the filter. When the flow meter reading is less than a threshold, the substrate processing apparatus allows the bubble removal liquid to pass from one of the upstream piping and the downstream piping through the filter to the other of the upstream piping and the downstream piping.

[0015] In one embodiment, the substrate processing apparatus periodically allows the bubble removal liquid to pass from one of the upstream side piping and the downstream side piping through the filter to the other of the upstream side piping and the downstream side piping.

[0016] In one embodiment, the substrate processing apparatus further includes a flow meter for measuring the flow rate of liquid passing through the filter. After the substrate processing apparatus allows the bubble-removing liquid to pass from one of the upstream and downstream piping through the filter to the other of the upstream and downstream piping, if the flow meter reading is less than a predetermined value, the apparatus again allows the bubble-removing liquid to pass from one of the upstream and downstream piping through the filter to the other of the upstream and downstream piping.

[0017] According to another aspect of the present invention, a bubble removal method for a filter includes: a processing fluid flow step, in which processing fluid for processing a substrate flows through a filter disposed in a processing fluid piping connected to a substrate processing unit; and a degassing fluid flow step, in which bubble degassing fluid for removing bubbles clogging the filter flows from one of an upstream side piping and a downstream side piping through the filter and the other of the upstream side piping and the downstream side piping, the upstream side piping being connected to the processing fluid piping upstream of the filter and the downstream side piping being connected to the processing fluid piping downstream of the filter.

[0018] In one embodiment, the bubble removal method of the filter may further include a cleaning fluid flow step, wherein, prior to the cleaning fluid flow step, a cleaning fluid for rinsing the treatment fluid is used to flow from a cleaning pipe through the filter via the upstream side pipe and the other of the downstream side pipe, the cleaning pipe being connected to the treatment fluid pipe at the upstream or downstream side of the filter.

[0019] In one embodiment, the process may also involve: measuring the flow rate of the treated liquid passing through the filter during the treated liquid flow process; and performing the removal liquid flow process when the flow rate of the treated liquid is less than a threshold.

[0020] In one embodiment, the removal liquid flow process can also be performed periodically.

[0021] In one embodiment, the bubble removal method of the filter may further include: a measurement step, wherein after the removal liquid flow step, a flow meter is used to measure the flow rate of the liquid passing through the filter; and if the measured value of the flow meter is less than a predetermined value, the removal liquid flow step is performed again.

[0022] Invention Effects

[0023] According to the present invention, a substrate processing apparatus capable of suppressing the replacement frequency of filters and a method for removing air bubbles from filters can be provided. Attached Figure Description

[0024] Figure 1 This is a schematic top view of the substrate processing apparatus according to the first embodiment.

[0025] Figure 2 This is a schematic diagram of the substrate processing unit in the substrate processing apparatus of the first embodiment.

[0026] Figure 3 This is a schematic diagram illustrating the piping configuration in the substrate processing apparatus of the first embodiment.

[0027] Figure 4 This is a block diagram of the substrate processing apparatus according to the first embodiment.

[0028] Figure 5 This is a flowchart illustrating the bubble removal method of the filter according to the first embodiment.

[0029] Figure 6A This is a schematic diagram illustrating the bubble removal method of the first embodiment, and a diagram showing the flow of liquid around the filter unit indicated by arrows.

[0030] Figure 6B This is a schematic diagram illustrating the bubble removal method of the first embodiment, and a diagram showing the flow of liquid around the filter unit indicated by arrows.

[0031] Figure 6C This is a schematic diagram illustrating the bubble removal method of the first embodiment, and a diagram showing the flow of liquid around the filter unit indicated by arrows.

[0032] Figure 7 This is a schematic diagram illustrating the piping configuration in the substrate processing apparatus of the second embodiment.

[0033] Figure 8 This is a flowchart illustrating the bubble removal method of the filter according to the second embodiment.

[0034] Figure 9A This is a schematic diagram illustrating the bubble removal method of the second embodiment, and an arrow indicating the flow of liquid around the filter unit.

[0035] Figure 9B This is a schematic diagram illustrating the bubble removal method of the second embodiment, and an arrow indicating the flow of liquid around the filter unit.

[0036] Figure 9C This is a schematic diagram illustrating the bubble removal method of the second embodiment, and an arrow indicating the flow of liquid around the filter unit.

[0037] Figure 10 This is a schematic diagram illustrating the piping configuration in the substrate processing apparatus of the first variation example.

[0038] Figure 11 This is a schematic diagram illustrating the piping configuration in the substrate processing apparatus of the second variation example.

[0039] Figure 12 This is a flowchart illustrating the bubble removal method of the filter according to the third embodiment.

[0040] Figure 13 This is a flowchart illustrating the bubble removal method of the filter according to the fourth embodiment.

[0041] Figure 14 This is a flowchart illustrating the bubble removal method of the filter according to the fifth embodiment.

[0042] Figure 15 This is a schematic diagram showing the piping configuration in the substrate processing apparatus according to the sixth embodiment.

[0043] Figure 16 This is a flowchart illustrating the bubble removal method of the filter according to the seventh embodiment.

[0044] Figure 17 This is a schematic diagram illustrating the bubble removal method of the seventh embodiment, and an arrow indicating the flow of liquid around the filter unit. Detailed Implementation

[0045] Hereinafter, embodiments of the substrate processing apparatus and the bubble removal method of the filter according to the present invention will be described with reference to the accompanying drawings. Furthermore, the same reference numerals are used for the same or equivalent parts in the drawings, and descriptions will not be repeated. In addition, for ease of understanding of the present invention, the X-axis, Y-axis, and Z-axis, which are orthogonal to each other, will be described in the specification. In this embodiment, the X-axis and Y-axis are parallel to the horizontal direction, and the Z-axis is parallel to the vertical direction.

[0046] [First Implementation Method]

[0047] Reference Figures 1 to 5 , Figures 6A to 6C The substrate processing apparatus 100 of the first embodiment of the present invention will be described. Figure 1 This is a schematic top view of the substrate processing apparatus 100 according to the first embodiment.

[0048] The substrate processing apparatus 100 processes the substrate W. The substrate processing apparatus 100 processes the substrate W by means of at least one of etching, surface treatment, property imparting, processing film formation, removal of at least a portion of the film, and cleaning.

[0049] The substrate W is used as a semiconductor substrate. The substrate W contains a semiconductor wafer. For example, the substrate W is generally circular. Here, the substrate processing apparatus 100 processes the substrate W one by one.

[0050] like Figure 1 As shown, the substrate processing apparatus 100 includes a plurality of substrate processing units 10, a processing liquid tank 110, a processing liquid reservoir 120, a plurality of load ports LP, an indexer robot IR, a center robot CR, and a control device 101. The control device 101 controls the load ports LP, the indexer robot IR, and the center robot CR. The control device 101 includes a control unit 102 and a storage unit 104.

[0051] Loading ports LP stack and accommodate multiple substrates W. A sorting robot IR moves substrates W between loading ports LP and a central robot CR. The central robot CR moves substrates W between the sorting robot IR and the substrate processing unit 10. The substrate processing unit 10 sprays processing liquid onto each substrate W to process it. The processing liquid includes, for example, chemicals, cleaning solutions, removal solutions, and / or water-repellent agents. A processing liquid tank 110 contains the processing liquid. Additionally, the processing liquid tank 110 may also contain gas.

[0052] Specifically, a plurality of substrate processing units 10 form a plurality of towers TW (in Figure 1 There are four tower TWs in the center, and multiple tower TWs are arranged around the central robotic arm CR when viewed from above. Each tower TW contains multiple substrate processing units 10 stacked vertically. Figure 1 There are three substrate processing units 10 in the middle. Processing liquid tanks 120 correspond to a plurality of towers TW. Liquid in the processing liquid tank 110 is supplied via a certain processing liquid tank 120 to all the substrate processing units 10 contained in the tower TW corresponding to that processing liquid tank 120. Furthermore, gas in the processing liquid tank 110 is supplied via any one of the processing liquid tanks 120 to all the substrate processing units 10 contained in the tower TW corresponding to that processing liquid tank 120.

[0053] In the substrate processing apparatus 100, an interface wall BW is disposed between the area where the central robot arm CR and the substrate processing unit 10 are provided and the area where the processing liquid tank 110 is provided. The processing liquid tank 110 divides a portion of the space of the outer part of the interface wall BW in the substrate processing apparatus 100.

[0054] Typically, the processing fluid tank 110 has a conditioning tank (cylindrical tank) for conditioning the processing fluid. The processing fluid tank 110 may have a conditioning tank for one type of processing fluid or a plurality of conditioning tanks for processing fluids. In addition, the processing fluid tank 110 may also have a pump, nozzle and / or filter for circulating the processing fluid.

[0055] Here, the processing liquid tank 110 has a first processing liquid tank 110A and a second processing liquid tank 110B. The first processing liquid tank 110A and the second processing liquid tank 110B are arranged facing each other.

[0056] The control device 101 controls various operations of the substrate processing device 100.

[0057] The control device 101 includes a control unit 102 and a storage unit 104. The control unit 102 has a processor. The control unit 102 has, for example, a central processing unit (i.e., a CPU). Alternatively, the control unit 102 may also have a general-purpose arithmetic unit.

[0058] Storage unit 104 stores data and computer programs. The data includes recipe data. The recipe data contains information representing a plurality of recipes. The plurality of recipes respectively specify the processing content and processing order of the substrate W.

[0059] Storage unit 104 includes a main storage device and an auxiliary storage device. The main storage device is, for example, a semiconductor memory. The auxiliary storage device is, for example, a semiconductor memory and / or a hard disk drive. Storage unit 104 may also include removable media. Control unit 102 executes the computer program stored in storage unit 104 and performs board processing operations.

[0060] Next, refer to Figure 2 The substrate processing unit 10 in the substrate processing apparatus 100 of the first embodiment will be described. Figure 2 This is a schematic diagram of the substrate processing unit 10 in the substrate processing apparatus 100 of the first embodiment.

[0061] The substrate processing unit 10 includes a chamber 11, a substrate holding section 20, and a processing liquid supply section 30.

[0062] The chamber 11 is generally box-shaped with an internal space. The chamber 11 houses the substrate W. Here, the substrate processing apparatus 100 is a monolithic type for processing substrates W one by one, and the substrates W are housed one by one in the chamber 11. The substrate W is housed in the chamber 11 and processed in the chamber 11. At least a portion of the substrate holding part 20 and the processing liquid supply part 30 are housed in the chamber 11.

[0063] The substrate holding portion 20 holds the substrate W. The substrate holding portion 20 holds the substrate W horizontally with its upper surface (surface) Wa facing upwards and its back surface (lower surface) Wb facing vertically downwards. Furthermore, the substrate holding portion 20 rotates the substrate W while holding it. For example, a laminated structure with recesses is provided on the upper surface Wa of the substrate W. The substrate holding portion 20 directly rotates the substrate W while holding it.

[0064] For example, the substrate holding portion 20 can also be a clamping type for holding the end of the substrate W. Alternatively, the substrate holding portion 20 can also have any mechanism for holding the substrate W from the back surface Wb. For example, the substrate holding portion 20 can also be a vacuum type. In this case, the substrate holding portion 20 adsorbs the central portion of the back surface Wb of the substrate W, which belongs to the non-device forming surface, onto the upper surface, thereby holding the substrate W horizontally. Alternatively, the substrate holding portion 20 can also combine a clamping type and a vacuum type for contacting a plurality of chuck pins with the peripheral end face of the substrate W.

[0065] For example, the substrate holding portion 20 includes a spin base 21, a chuck member 22, a shaft 23, an electric motor 24, and a housing 25. The chuck member 22 is disposed on the spin base 21. The chuck member 22 clamps the substrate W. Typically, a plurality of chuck members 22 are disposed on the spin base 21.

[0066] Shaft 23 is a hollow shaft. Shaft 23 extends vertically along the axis of rotation Ax. A rotating base 21 is attached to the upper end of shaft 23. The substrate W is placed above the rotating base 21.

[0067] The rotating base 21 is a circular plate used to horizontally support the substrate W. A shaft 23 extends downward from the center of the rotating base 21. An electric motor 24 applies rotational force to the shaft 23. The electric motor 24 causes the shaft 23 to rotate in the rotational direction, thereby rotating the substrate W and the rotating base 21 around the rotation axis Ax. A housing 25 surrounds the shaft 23 and the electric motor 24.

[0068] The processing liquid supply unit 30 supplies processing liquid to the substrate W. Typically, the processing liquid supply unit 30 supplies processing liquid to the upper surface Wa of the substrate W. At least a portion of the processing liquid supply unit 30 is housed within the chamber 11.

[0069] The processing solution supply section 30 supplies processing solution to the upper surface Wa of the substrate W. The processing solution may also contain a chemical solution. The chemical solution may contain, for example, hydrofluoric acid (HF). For example, hydrofluoric acid may be heated to above 40°C and below 70°C, or to above 50°C and below 60°C. However, hydrofluoric acid may also be left unheated. Furthermore, the chemical solution may also contain water or phosphoric acid.

[0070] Furthermore, the solution may also contain hydrogen peroxide. In addition, the solution may also contain SC1 (standard clean-1; first standard cleaning solution) (ammonia-hydrogen peroxide mixture), SC2 (standard clean-2; second standard cleaning solution) (hydrochloric acid-hydrogen peroxide mixture), or aqua regia (a mixture of concentrated hydrochloric acid and concentrated nitric acid).

[0071] Alternatively, the treatment solution may also include a so-called rinse solution. The rinse solution may also include any of the following: deionized water (DIW), carbonated water, electrolyzed water, ozone water, ammonia water, hydrochloric acid diluted to a concentration of approximately 10 ppm to 100 ppm, or reduced water (hydrogen water).

[0072] The processing fluid supply unit 30 includes a piping 32, a nozzle 34, and a valve 36. Furthermore, the piping 32 is an example of the "processing fluid piping" of the present invention. The nozzle 34 sprays processing fluid onto the upper surface Wa of the substrate W. The nozzle 34 is connected to the piping 32. Processing fluid is supplied to the piping 32 from a supply source. The valve 36 opens and closes the flow path within the piping 32. The nozzle 34 is preferably configured to be movable relative to the substrate W.

[0073] Valve 36 opens and closes the flow path within piping 32. Valve 36 regulates the opening degree of piping 32, thereby adjusting the flow rate of the treatment fluid supplied to piping 32. Specifically, valve 36 includes: a valve body (not shown) with a valve seat disposed internally; a valve core for opening and closing the valve seat; and an actuator (not shown) for moving the valve core between the open and closed positions.

[0074] Nozzle 34 is also movable. Nozzle 34 can move in the horizontal and / or vertical directions via a moving mechanism controlled by control unit 102. Furthermore, it should be noted that the moving mechanism has been omitted in this specification to avoid making the drawings overly complex.

[0075] The substrate processing unit 10 also includes a cup 80. The cup 80 collects the processing liquid that spills from the substrate W. The cup 80 moves up and down. For example, the cup 80 rises vertically to the side of the substrate W during the entire period when the processing liquid supply unit 30 supplies processing liquid to the substrate W. In this case, the cup 80 collects the processing liquid that spills from the substrate W due to the rotation of the substrate W. Furthermore, when the period when the processing liquid supply unit 30 supplies processing liquid to the substrate W ends, the cup 80 descends vertically from the side of the substrate W.

[0076] As described above, the control device 101 includes a control unit 102 and a storage unit 104. The control unit 102 controls the substrate holding unit 20, the processing liquid supply unit 30, and / or the cup 80. In one example, the control unit 102 controls the electric motor 24, the valve 36, and / or the cup 80.

[0077] The substrate processing apparatus 100 of this embodiment is suitable for manufacturing semiconductor components in which semiconductors are disposed. Typically, a conductive layer and an insulating layer are stacked on a substrate in the semiconductor component. The substrate processing apparatus 100 is suitable for cleaning and / or processing (e.g., etching, property modification, etc.) of the conductive layer and / or the insulating layer during the manufacture of the semiconductor component.

[0078] In addition, Figure 2 In the substrate processing unit 10 shown, the processing liquid supply unit 30 can supply one type of processing liquid. However, this embodiment is not limited to this. The processing liquid supply unit 30 can also supply multiple types of processing liquids. For example, the processing liquid supply unit 30 can sequentially supply multiple types of processing liquids with different uses to the substrate W. Alternatively, the processing liquid supply unit 30 can simultaneously supply multiple types of processing liquids with different uses to the substrate W.

[0079] Next, refer to Figures 1 to 3 The piping configuration of the substrate processing apparatus 100 according to the first embodiment will be explained. Figure 3This is a schematic diagram illustrating the piping configuration in the substrate processing apparatus 100 according to the first embodiment. Furthermore, as shown in... Figure 1 as well as Figure 2 As understood, it is preferable that the substrate processing apparatus 100 has a plurality of substrate processing units 10, and the substrate W can be processed by a plurality of processing liquids. However, to avoid excessive complexity, this description will focus on supplying one type of processing liquid to one substrate processing unit 10.

[0080] like Figure 3 As shown, the substrate processing apparatus 100 includes a modulation tank 112, a heater 113, a pump 114, a valve 115, a filter unit 140, a flow meter 116, and a valve 117. Furthermore, valve 115 is an example of the "first valve" of the present invention. Valve 117 is an example of the "second valve" of the present invention.

[0081] The preparation tank 112 stores the processing solution. The processing solution is supplied to the substrate processing unit 10 to process the substrate W. Typically, the processing solution is a chemical solution. The processing solution is not particularly limited, for example, it is an alkaline chemical solution. In the first embodiment, the processing solution is a foaming chemical solution containing a surfactant. In addition, in the first embodiment, the processing solution is, for example, TMAH (tetramethylammonium hydroxide). In addition, the processing solution may also contain, for example, TEAOH (tetraethylammonium hydroxide) or citric acid. In addition, the processing solution may also be a washing solution. The processing solution is prepared in the preparation tank 112. Typically, the preparation tank 112 is disposed in the processing solution tank 110.

[0082] Piping 32 connects to the modulation tank 112 and the substrate processing unit 10. A heater 113, pump 114, valve 115, filter unit 140, flow meter 116, valve 117, and valve 36 are installed on piping 32. The heater 113, pump 114, valve 115, filter unit 140, flow meter 116, valve 117, and valve 36 constitute the processing fluid supply unit 30. Furthermore, in... Figure 3 Although only one valve 36 is depicted, valve 36 is provided in each nozzle 34. Therefore, a plurality of valves 36 are configured for one filter unit 140.

[0083] The processing liquid tank 110 has a frame 111. Typically, the frame 111 houses a modulation tank 112, a heater 113, a pump 114, a valve 115, a filter unit 140, a flow meter 116, and a valve 117.

[0084] The processing fluid tank 120 has a housing 121. Typically, the valve 36 is housed in the housing 121.

[0085] Piping 32 extends from the processing liquid tank 110 through the processing liquid reservoir 120 to the substrate processing unit 10. The processing liquid is prepared in the preparation tank 112 and then flows from the preparation tank 112 to the substrate processing unit 10 through piping 32. Piping 32 is formed of resin, for example.

[0086] Heater 113 heats the liquid passing through piping 32. In the first embodiment, heater 113 heats the processing liquid passing through piping 32 to a predetermined temperature.

[0087] Pump 114 delivers the treatment liquid from the modulation tank 112 toward nozzle 34.

[0088] Valve 115 is connected to piping 32 upstream of filter 141 (described later). Valve 115 opens and closes the flow path within piping 32. Specifically, valve 115 opens and closes the flow path of the upstream portion 32a of piping 32, which is upstream of filter unit 140. Valve 115 adjusts the opening degree of piping 32, thereby adjusting the flow rate of the processed liquid supplied to piping 32. Specifically, valve 115 includes: a valve body (not shown) with a valve seat disposed internally; a valve core for opening and closing the valve seat; and an actuator (not shown) for moving the valve core between an open position and a closed position.

[0089] Filter unit 140 is installed on piping 32. Filter unit 140 can be installed and removed relative to piping 32. When filter unit 140 is installed on piping 32, the treatment fluid flows through filter unit 140. On the other hand, filter unit 140 can be removed from piping 32. Therefore, filter unit 140 is replaced when it deteriorates.

[0090] The filter unit 140 is formed of resin, for example. Typically, the filter unit 140 is formed by resin molding. In one example, the filter unit 140 is manufactured by cutting a resin formation with a metal processing tool. Alternatively, the filter unit 140 may also be formed of metal.

[0091] Filter unit 140 filters the processing liquid flowing within piping 32. Filter unit 140 includes a filter 141 and a filter housing 142. Filter 141 is disposed within piping 32. Filter 141 has, for example, a porous shape. Filter 141 allows the liquid components of the processing liquid to pass through. On the other hand, filter 141 captures particles contained in the processing liquid. Furthermore, filter 141 captures a portion of the air bubbles contained in the processing liquid. In other words, a portion of the air bubbles contained in the processing liquid does not pass through filter 141.

[0092] The filter housing 142 houses the filter 141. The filter housing 142 has an upstream chamber 142a disposed upstream of the filter 141, and a downstream chamber 142b disposed downstream of the filter 141. Furthermore, an vent pipe for discharging gas to the outside and a drain pipe for discharging liquid to the outside can be connected to the upstream chamber 142a and the downstream chamber 142b. However, even when the upstream chamber 142a is connected to an vent pipe, for example, in the case where the processing liquid in the conditioning tank 112 contains numerous air bubbles, as described later, the gas cannot be sufficiently discharged through the vent pipe. Therefore, as described later, air bubbles remain in the filter 141.

[0093] Flow meter 116 measures the flow rate of liquid passing through pipe 32.

[0094] Valve 117 is disposed on piping 32 downstream of filter 141. Valve 117 opens and closes the flow path within piping 32. Specifically, valve 117 opens and closes the flow path of the downstream portion 32b of piping 32, which is further downstream of filter unit 140. Valve 117 adjusts the opening degree of piping 32, thereby adjusting the flow rate of the processed liquid through piping 32. Specifically, valve 117 includes: a valve body (not shown) with a valve seat disposed internally; a valve core for opening and closing the valve seat; and an actuator (not shown) for moving the valve core between an open position and a closed position.

[0095] The substrate processing apparatus 100 includes a processing liquid supply unit 210 that supplies processing liquid to the preparation tank 112. The processing liquid supply unit 210 includes a pipe 211 and a valve 212. Processing liquid is supplied to the pipe 211 from a supply source. The valve 212 adjusts the opening degree of the flow path within the pipe 211, thereby adjusting the flow rate of the processing liquid supplied to the pipe 211. Specifically, the valve 212 includes: a valve body (not shown) with a valve seat disposed internally; a valve core for opening and closing the valve seat; and an actuator (not shown) for moving the valve core between an open position and a closed position.

[0096] In the first embodiment, the substrate processing apparatus 100 includes a cleaning solution supply unit 220 for supplying cleaning solution to the mixing tank 112. The cleaning solution supply unit 220 includes a pipe 221 and a valve 222. Cleaning solution is supplied to the pipe 221 from a supply source. The cleaning solution supplied by the cleaning solution supply unit 220 is, for example, deionized water (DIW). The valve 222 adjusts the opening degree of the flow path in the pipe 211, thereby adjusting the flow rate of the cleaning solution supplied to the pipe 221. Specifically, the valve 222 includes: a valve body (not shown) with a valve seat disposed therein; a valve core for opening and closing the valve seat; and an actuator (not shown) for moving the valve core between an open position and a closed position.

[0097] In a first embodiment, the substrate processing apparatus 100 includes a gas supply unit 230 for supplying gas to a modulation tank 112. The gas supply unit 230 includes a pipe 231 and a valve 232. The pipe 231 is connected to the lower surface of the modulation tank 112, for example. Gas is supplied to the pipe 231 from a supply source. In the first embodiment, the gas supplied by the gas supply unit 230 is, for example, N2 gas. Alternatively, the gas supplied by the gas supply unit 230 may also be, for example, air. The valve 232 adjusts the opening degree of the flow path within the pipe 231, thereby adjusting the flow rate of the gas supplied to the pipe 231. Specifically, the valve 232 includes: a valve body (not shown) with a valve seat disposed therein; a valve core for opening and closing the valve seat; and an actuator (not shown) for moving the valve core between an open position and a closed position.

[0098] Gas is supplied to the conditioning tank 112 from the gas supply unit 230, thereby reducing the dissolved oxygen in the treatment liquid. In addition, when gas is supplied to the conditioning tank 112 from the gas supply unit 230, bubbles are generated in the treatment liquid.

[0099] Furthermore, in the first embodiment, the substrate processing apparatus 100 includes a liquid discharge section 240 for discharging liquid from the modulation tank 112. The liquid discharge section 240 includes a pipe 241 and a valve 242. The pipe 241 is connected, for example, to the lower surface of the modulation tank 112. The valve 242 adjusts the opening degree of the flow path within the pipe 241, thereby adjusting the flow rate of the liquid discharged from the pipe 241. Specifically, the valve 242 includes: a valve body (not shown) with a valve seat disposed therein; a valve core for opening and closing the valve seat; and an actuator (not shown) for moving the valve core between an open position and a closed position.

[0100] Next, refer to Figure 3 The substrate processing apparatus 100 is described. The substrate processing apparatus 100 includes an upstream side pipe 151 and a downstream side pipe 161.

[0101] Upstream piping 151 is connected to piping 32 upstream of filter 141. Upstream piping 151 is connected to the upstream portion 32a of piping 32 upstream of filter 141. In the first embodiment, upstream piping 151 is directly connected to piping 32. In other words, upstream piping 151 is connected to piping 32 without passing through filter unit 140.

[0102] Downstream piping 161 is connected to piping 32 downstream of filter 141. Downstream piping 161 is connected to the downstream portion 32b of piping 32 downstream of filter 141. In the first embodiment, downstream piping 161 is directly connected to piping 32. In other words, downstream piping 161 is connected to piping 32 without passing through filter unit 140.

[0103] The substrate processing apparatus 100 includes valves 152 and 162. Valve 152 is disposed on an upstream pipe 151. Valve 152 regulates the opening degree of the flow path within the upstream pipe 151, thereby regulating the flow rate of liquid through the upstream pipe 151. Valve 162 is disposed on a downstream pipe 161. Valve 162 regulates the opening degree of the flow path within the downstream pipe 161, thereby regulating the flow rate of liquid through the downstream pipe 161. Specifically, valves 152 and 162 each include: a valve body (not shown) with a valve seat disposed internally; a valve core for opening and closing the valve seat; and an actuator (not shown) for moving the valve core between an open position and a closed position. Furthermore, valve 152 is an example of a "third valve" of the present invention. Furthermore, valve 162 is an example of a "fourth valve" of the present invention.

[0104] The substrate processing apparatus 100 includes a degassing liquid supply unit 165. The degassing liquid supply unit 165 is connected to one of an upstream pipe 151 and a downstream pipe 161. The degassing liquid supply unit 165 supplies a bubble removal liquid, used to remove bubbles clogging the filter 141, to one of the upstream pipe 151 and the downstream pipe 161. The degassing liquid supply unit 165 includes, for example, a tank for storing the bubble removal liquid and / or a pump for discharging the bubble removal liquid. In a first embodiment, the degassing liquid supply unit 165 is connected to the upstream pipe 151 to supply the bubble removal liquid to the upstream pipe 151. The bubble removal liquid is not particularly limited as long as it is a liquid used to remove bubbles, and may include, for example, IPA (isopropyl alcohol) or PGMEA (propylene glycol monomethyl ether acetate). In the first embodiment, the bubble removal liquid contains IPA. In the first embodiment, the bubble removal liquid is, for example, diluted IPA.

[0105] Next, refer to Figures 1 to 4 The substrate processing apparatus 100 of the first embodiment will be described. Figure 4 This is a block diagram of the substrate processing apparatus 100 according to the first embodiment.

[0106] like Figure 4As shown, the control device 101 controls various operations of the substrate processing apparatus 100. The control device 101 controls the indexing robot IR, the central robot CR, the substrate holding section 20, the processing liquid supply section 30, valves 152 and 162, the processing liquid replenishment section 210, the cleaning liquid supply section 220, the gas supply section 230, and the liquid discharge section 240. Specifically, the control device 101 sends control signals to the indexing robot IR, the central robot CR, the substrate holding section 20, the processing liquid supply section 30, valves 152 and 162, the processing liquid replenishment section 210, the cleaning liquid supply section 220, the gas supply section 230, and the liquid discharge section 240, thereby controlling these components.

[0107] More specifically, the control unit 102 controls the indexing robot IR to pick up and transfer the substrate W.

[0108] The control unit 102 controls the central robot CR, which picks up and transfers the substrate W. For example, the central robot CR picks up the unprocessed substrate W and moves it into any one of the plurality of substrate processing units 10. In addition, the central robot CR picks up the processed substrate W from the substrate processing unit 10 and moves it out.

[0109] The control unit 102 controls the substrate holding unit 20, thereby controlling the substrate W to start rotating, change its rotation speed, and stop rotating. For example, the control unit 102 controls the substrate holding unit 20, thereby changing its rotational speed. Specifically, the control unit 102 changes the rotational speed of the electric motor 24 of the substrate holding unit 20, thereby changing the rotational speed of the substrate W.

[0110] The control unit 102 controls valves 115, 117, and 36, thereby switching their states to open and closed states. Specifically, the control unit 102 sets valve 115 to an open or closed state, thereby allowing or preventing liquid from passing through the upstream portion 32a of the piping 32. Similarly, the control unit 102 sets valve 117 to an open or closed state, thereby allowing or preventing liquid from passing through the downstream portion 32b of the piping 32. Furthermore, the control unit 102 sets valve 36 to an open or closed state, thereby allowing or preventing liquid that has passed through valve 117 from being supplied to nozzle 34.

[0111] The control unit 102 controls the heater 113, thereby heating the liquid passing through the piping 32. The control unit 102 controls the heater 113, thereby heating the liquid passing through the piping 32 to a predetermined temperature. The control unit 102 controls the pump 114, thereby conveying the liquid in the modulation tank 112 to the downstream side. Specifically, the control unit 102 drives the pump 114, thereby sending the liquid in the modulation tank 112 toward the nozzle 34. The measurement results from the flow meter 116 are transmitted to the control unit 102.

[0112] Control unit 102 controls valve 152, thereby switching the state of valve 152 between an open state and a closed state. Specifically, control unit 102 sets valve 152 to an open state or a closed state, thereby allowing or preventing liquid in upstream piping 151 from flowing through. Furthermore, control unit 102 controls valve 162, thereby switching the state of valve 162 between an open state and a closed state. Specifically, control unit 102 sets valve 162 to an open state or a closed state, thereby allowing or preventing liquid in downstream piping 161 from flowing through.

[0113] The control unit 102 controls the processing fluid supply unit 210, thereby controlling the supply of processing fluid to the conditioning tank 112. Specifically, the control unit 102 sets the valve 212 to an open or closed state, thereby enabling the supply of processing fluid to or stopping the supply of processing fluid to the conditioning tank 112.

[0114] The control unit 102 controls the cleaning solution supply unit 220, thereby controlling the supply of cleaning solution to the preparation tank 112. Specifically, the control unit 102 sets the valve 222 to an open or closed state, thereby supplying or stopping the supply of cleaning solution to the preparation tank 112.

[0115] The control unit 102 controls the gas supply unit 230, thereby controlling the gas supply to the modulation tank 112. Specifically, the control unit 102 sets the valve 232 to an open or closed state, thereby supplying gas to or stopping the gas supply to the modulation tank 112.

[0116] The control unit 102 controls the liquid discharge unit 240, thereby controlling the discharge of liquid from the conditioning tank 112. Specifically, the control unit 102 sets the valve 242 to an open or closed state, thereby discharging liquid from the conditioning tank 112 or stopping the discharge of liquid from the conditioning tank 112.

[0117] As described above, the storage unit 104 can also store a plurality of procedure data. The plurality of procedures can also specify the processing content and processing sequence for removing bubbles clogging the filter unit 140.

[0118] The substrate processing apparatus 100 of the first embodiment is suitable for use in forming semiconductor components. For example, the substrate processing apparatus 100 is suitable for use with a substrate W for processing a semiconductor component as a stacked structure. The semiconductor component is a so-called 3D (three-dimensional) memory (storage device). As an example, the substrate W is suitable for use as a NAND (NOT-AND) type flash memory.

[0119] Next, refer to Figure 5 , Figure 6A , Figure 6B as well as Figure 6C The bubble removal method of the filter 141 of the substrate processing apparatus 100 of the first embodiment is described. Figure 5 This is a flowchart illustrating the bubble removal method of the filter 141 according to the first embodiment. Figures 6A to 6C This is a schematic diagram illustrating the bubble removal method of the first embodiment, and an arrow indicating the flow of liquid around the filter unit 140. The bubble removal method of the filter 141 of the first embodiment includes steps S101 to S108. Steps S101 to S108 are executed by the control unit 102. Furthermore, step S101 is an example of the "processing liquid flow process" of the present invention. Furthermore, step S105 is an example of the "removal liquid flow process" of the present invention. Furthermore, step S106 is an example of the "washing liquid flow process" of the present invention.

[0120] like Figure 5 As shown, in step S101, the control unit 102 determines whether the flow rate of the processing liquid through the piping 32 is less than a threshold. The threshold is a predetermined value. Specifically, in step S101, valves 115 and 117 are turned on, and valves 152 and 162 are turned off. Valve 36 is switched between on and off depending on the timing of spraying the processing liquid onto the substrate W. That is, in step S101, the processing liquid is allowed to flow through the filter 141 disposed on the piping 32. Furthermore, in step S101, the processing liquid is allowed to flow through the piping 32 and supplied to the substrate processing unit 10. The control unit 102 determines whether the measured value of the flow meter 116 is less than the threshold when the processing liquid can pass through the piping 32 (e.g., valve 36 is in the open state). Furthermore, for example, when the filter 141 is new, the measured value of the flow meter 116 is above the threshold. On the other hand, when bubbles clog the filter 141, the flow rate of the processed liquid passing through the filter 141 decreases, thus reducing the measured value of the flow meter 116. Moreover, when the amount of bubbles clogging the filter 141 becomes more than a predetermined amount, the measured value of the flow meter 116 becomes less than the threshold.

[0121] In step S101, if the control unit 102 determines that the flow rate of the treatment liquid through the piping 32 is above a threshold, step S101 is repeated. In other words, if the measured value of the flow meter 116 is above the threshold, step S101 is repeated.

[0122] On the other hand, in step S101, if the control unit 102 determines that the flow rate of the treatment liquid through the piping 32 is less than a threshold, the process proceeds to step S102. In other words, if the measured value of the flow meter 116 is less than the threshold, the process proceeds to step S102.

[0123] Next, in step S102, the control unit 102 stops supplying the processing fluid. Specifically, the control unit 102 switches valves 115 and 117 from the open state to the closed state.

[0124] Next, in step S103, the control unit 102 replaces the processing liquid inside the preparation tank 112 with cleaning liquid. Specifically, the control unit 102 switches valve 242 from the closed state to the open state. As a result, the processing liquid inside the preparation tank 112 is discharged via pipe 241. Then, the control unit 102 returns valve 242 from the open state to the closed state. Furthermore, the control unit 102 switches valve 222 from the closed state to the open state. As a result, cleaning liquid is introduced into the preparation tank 112, thereby replacing the interior of the preparation tank 112 with cleaning liquid. Then, the control unit 102 returns valve 222 from the open state to the closed state.

[0125] Next, in step S104, the control unit 102 causes the cleaning solution to flow through the filter 141. Specifically, the control unit 102 switches valves 115 and 162 from the closed state to the open state. Thus, as... Figure 6A As shown, the cleaning solution in the conditioning tank 112 is discharged via the downstream pipe 161 after passing through the piping 32 and the filter unit 140. Next, the control unit 102 returns the valve 115 from the open state to the closed state. Thus, the interior of the filter unit 140 is replaced with cleaning solution from the processing solution. Furthermore, although in this embodiment the valve 117 is switched from the open state to the closed state in step S102, the timing of switching the valve 117 from the open state to the closed state could also be, for example, step S104 or step S103.

[0126] Next, in step S105, the control unit 102 causes the bubble removal liquid to flow through the filter 141. Specifically, the control unit 102 switches the valve 152 from a closed state to an open state. Thus, as... Figure 6BAs shown, the bubble removal liquid from the degassing liquid supply unit 165 is discharged via the downstream pipe 161 after passing through the upstream pipe 151 and the filter unit 140. At this time, the bubble removal liquid passes through the filter 141, thereby removing the bubbles clogging the filter 141. That is, the function of the filter 141 to allow liquid to flow through is restored. Then, the control unit 102 returns the valve 152 from the open state to the closed state.

[0127] Next, in step S106, the control unit 102 causes the cleaning solution to flow through the filter 141. Specifically, the control unit 102 switches the valve 115 from a closed state to an open state. Thus, as... Figure 6A As shown, the cleaning solution in the conditioning tank 112 is discharged via the downstream pipe 161 after passing through the piping 32 and the filter unit 140. Then, the control unit 102 returns the valve 115 from the open state to the closed state. Thus, the interior of the filter unit 140 is replaced with cleaning solution from the bubble removal liquid.

[0128] Next, in step S107, the control unit 102 replaces the cleaning liquid inside the preparation tank 112 with the treatment liquid. Specifically, the control unit 102 switches valve 242 from the closed state to the open state. As a result, the cleaning liquid in the preparation tank 112 is discharged via pipe 241. Then, the control unit 102 returns valve 242 from the open state to the closed state. Furthermore, the control unit 102 switches valve 212 from the closed state to the open state. As a result, the treatment liquid is introduced into the preparation tank 112, thereby replacing the interior of the preparation tank 112 with the treatment liquid. Then, the control unit 102 returns valve 212 from the open state to the closed state.

[0129] Next, in step S108, the control unit 102 resumes supplying the processing fluid. Specifically, the control unit 102 switches valves 115 and 117 from the closed state to the open state, and switches valve 162 from the open state to the closed state. Thus, as... Figure 6C As shown, the treatment liquid in the modulation tank 112 passes through the filter unit 140 and the valve 117.

[0130] Specifically, control unit 102 switches valve 115 from the closed state to the open state. As a result, the cleaning fluid in piping 32 and filter unit 140 is discharged via downstream piping 161. After a predetermined time elapsed since switching valve 115 from the closed to the open state, control unit 102 switches valve 162 from the open state to the closed state and valve 117 from the closed state to the open state. Therefore, the passage of cleaning fluid from piping 32 and filter unit 140 through valve 117 can be suppressed. Furthermore, valve 117 can be switched from the closed state to the open state and valve 162 can be switched from the open state to the closed state simultaneously with switching valve 115 from the closed to the open state.

[0131] As described above, the bubble removal of the filter 141 in the first embodiment is completed.

[0132] Above, refer to Figures 1 to 5 , Figures 6A to 6C The first embodiment of the present invention will be described. As described above, in the first embodiment, the bubble removal liquid is passed from the upstream piping 151 through the filter 141 to the downstream piping 161. Therefore, bubbles clogging the filter 141 can be removed. That is, the performance of the filter 141 in allowing liquid to flow through can be restored. Therefore, the frequency of filter 141 replacement can be reduced. As a result, the environmental burden can be reduced.

[0133] Furthermore, by suppressing the replacement frequency of filter 141, the replacement and recovery time of filter 141 (also known as downtime) can be reduced.

[0134] Furthermore, as described above, the cleaning solution is passed from pipe 32 through filter 141 to downstream pipe 161. Therefore, mixing or contact between the treatment solution and the bubble removal solution can be prevented. In the event that the treatment solution and the bubble removal solution react with each other, for example, high temperature and high pressure may occur, adversely affecting pipe 32, pump 114, valve 115, filter unit 140, flow meter 116, or valve 117. Therefore, in the first embodiment, the cleaning solution is passed through, thereby preventing mixing or contact between the treatment solution and the bubble removal solution, and thus preventing the treatment solution and the bubble removal solution from becoming high temperature and high pressure. As a result, adverse effects on pipe 32, pump 114, valve 115, filter unit 140, flow meter 116, or valve 117 can be prevented.

[0135] Furthermore, as described above, the flow rate of the treatment liquid passing through filter 141 is measured. When the flow rate of the treatment liquid is less than a threshold, the bubble removal liquid is passed from the upstream piping 151 through filter 141 to the downstream piping 161. Therefore, the blockage of bubbles that are difficult to observe directly can be easily confirmed using flow meter 116. In addition, since bubbles are removed when the flow rate of the treatment liquid becomes less than a certain threshold, bubble removal can be performed before a large number of bubbles become blocked. Therefore, the time for suppressing the flow of treatment liquid and washing liquid through filter 141 is extended.

[0136] [Second Implementation]

[0137] Next, refer to Figure 7 as well as Figure 8 The substrate processing apparatus 100 of the second embodiment of the present invention will be described. Figure 7This is a schematic diagram illustrating the piping configuration in the substrate processing apparatus 100 according to the second embodiment. In the second embodiment, the following example is described: a cleaning pipe 171 and a cleaning solution supply unit 175 are provided. The cleaning pipe 171 is connected to the pipe 32, and the cleaning solution supply unit 175 is connected to the cleaning pipe 171.

[0138] like Figure 7 As shown, the substrate processing apparatus 100 includes a cleaning pipe 171, a valve 172, and a cleaning solution supply unit 175. Furthermore, the valve 172 is an example of the "fifth valve" of the present invention.

[0139] The cleaning pipe 171 is connected to the pipe 32 upstream or downstream of the filter 141. In the second embodiment, the cleaning pipe 171 is connected to the pipe 32 upstream of the filter 141. Furthermore, in the second embodiment, the cleaning pipe 171 is directly connected to the pipe 32. In other words, the cleaning pipe 171 is connected to the pipe 32 without passing through the filter unit 140. Additionally, as... Figure 7 As shown, the cleaning piping 171 can also be connected to piping 32 after converging to the upstream piping 151. In other words, a portion of the cleaning piping 171 and a portion of the upstream piping 151 can also be a common piping and connected to piping 32. Furthermore, although not shown, the cleaning piping 171 can also be connected to piping 32 without converging to the upstream piping 151.

[0140] Valve 172 is disposed on cleaning pipe 171. Valve 172 regulates the opening degree of the flow path within cleaning pipe 171, thereby regulating the flow rate of liquid through cleaning pipe 171. Specifically, valve 172 includes: a valve body (not shown) with a valve seat disposed therein; a valve core for opening and closing the valve seat; and an actuator (not shown) for moving the valve core between the open and closed positions.

[0141] A cleaning solution supply unit 175 is connected to a cleaning pipe 171. The cleaning solution supply unit 175 supplies cleaning solution to the cleaning pipe 171. The cleaning solution supply unit 175 may include, for example, a tank for storing the cleaning solution and / or a pump for dispensing the cleaning solution. The cleaning solution may also include, for example, any of the following: deionized water (DIW), carbonated water, electrolyzed water, ozone water, ammonia water, hydrochloric acid water with a dilution concentration (e.g., approximately 10 ppm to 100 ppm), or reduced water (hydrogen water). In the second embodiment, the cleaning solution supplied by the cleaning solution supply unit 175 is deionized water (DIW).

[0142] The control unit 102 can control the valve 172, thereby switching the state of the valve 172 to an open state and a closed state. Specifically, the control unit 102 sets the valve 172 to an open state or a closed state, thereby allowing or preventing the liquid in the cleaning pipe 171 from passing through. Furthermore, in the second embodiment, the cleaning liquid supply unit 220 may not be provided.

[0143] The other components of the second embodiment are the same as those of the first embodiment.

[0144] Next, refer to Figure 8 , Figure 9A , Figure 9B as well as Figure 9C The bubble removal method of the filter 141 of the substrate processing apparatus 100 of the second embodiment is described. Figure 8 This is a flowchart illustrating the bubble removal method of the filter 141 according to the second embodiment. Figures 9A to 9C This is a schematic diagram illustrating the bubble removal method of the second embodiment, and an arrow indicating the flow of liquid around the filter unit 140. The bubble removal method of the filter 141 in the second embodiment includes steps S101, S102, S204, S105, S206, and S108. Furthermore, unlike the first embodiment, the second embodiment does not include a step for replacing the liquid in the conditioning tank 112. Steps S204 and S206 of the second embodiment correspond to steps S104 and S106 of the first embodiment. Furthermore, step S206 is an example of the "washing liquid flow process" of the present invention.

[0145] like Figure 8 As shown, in step S101, the control unit 102 determines whether the flow rate of the treatment fluid through the piping 32 is less than a threshold. Furthermore, in step S101, valve 172 is closed.

[0146] In step S101, if the control unit 102 determines that the flow rate of the treatment liquid through the piping 32 is above a threshold, step S101 is repeated.

[0147] On the other hand, in step S101, if the control unit 102 determines that the flow rate of the processing liquid through the piping 32 is less than the threshold, the process is transferred to step S102.

[0148] Next, in step S102, the control unit 102 stops supplying the processing fluid. Specifically, the control unit 102 switches valves 115 and 117 from the open state to the closed state.

[0149] Next, in step S204, the control unit 102 causes the cleaning solution to flow through the filter 141. Specifically, the control unit 102 switches valves 172 and 162 from the closed state to the open state. Thus, as... Figure 9A As shown, the cleaning fluid from the cleaning fluid supply unit 175 is discharged via the downstream piping 161 after passing through the cleaning pipe 171 and the filter unit 140. Next, the control unit 102 returns the valve 172 from the open state to the closed state. Thus, the interior of the filter unit 140 is replaced with cleaning fluid from the processing fluid.

[0150] Next, in step S105, the control unit 102 causes the bubble removal liquid to flow through the filter 141. Specifically, the control unit 102 switches the valve 152 from a closed state to an open state. Thus, as... Figure 9B As shown, the removal fluid from the removal fluid supply unit 165 is discharged via the downstream pipe 161 after passing through the upstream side pipe 151 and the filter unit 140. At this time, the removal fluid passes through the filter 141, thereby removing the air bubbles clogging the filter 141. That is, the filter 141 is restored to its function of allowing liquid to flow through. Then, the control unit 102 returns the valve 152 from the open state to the closed state.

[0151] Next, in step S206, the control unit 102 causes the cleaning solution to flow through the filter 141. Specifically, the control unit 102 switches the valve 172 from a closed state to an open state. Thus, as... Figure 9A As shown, the cleaning fluid from the cleaning fluid supply unit 175 is discharged via the downstream pipe 161 after passing through the cleaning pipe 171 and the filter unit 140. Next, the control unit 102 returns the valve 172 from the open state to the closed state. Thus, the interior of the filter unit 140 is replaced with cleaning fluid from the bubble removal liquid.

[0152] Next, in step S108, the control unit 102 resumes supplying the processing fluid. Thus, as... Figure 9C As shown, the treatment liquid in the modulation tank 112 passes through the filter unit 140 and the valve 117.

[0153] As described above, the bubble removal of filter 141 in the second embodiment is completed.

[0154] As described above, in the second embodiment, a cleaning pipe 171 connected to the piping 32 is provided, and the cleaning solution flows from the cleaning pipe 171 through the filter 141 and then through the downstream piping 161. Therefore, the steps for replacing the interior of the mixing tank 112 with the cleaning solution (step S103) and for replacing the interior of the mixing tank 112 with the treatment solution (step S107) are eliminated. This simplifies the process for restoring the filter 141. Furthermore, since it is unnecessary to replace the interior of the mixing tank 112 with the cleaning solution and the treatment solution, the consumption of both the cleaning solution and the treatment solution can be reduced. Therefore, the environmental burden can be further reduced.

[0155] The other bubble removal methods and other effects of the second embodiment are the same as those of the first embodiment.

[0156] [First Variation Example]

[0157] Next, refer to Figure 10 The substrate processing apparatus 100 of the first variation of the present invention will be described. Figure 10 This is a schematic diagram illustrating the piping configuration in the substrate processing apparatus 100 of the first variation example. The first variation example describes an example different from the first and second embodiments, specifically an example in which a downstream piping 161 is connected to the filter unit 140. Furthermore, although changes are made here... Figure 7 The piping configuration shown in the second embodiment will be described as a part, but modifications are also possible. Figure 3 This is part of the piping configuration of the first embodiment shown.

[0158] like Figure 10 As shown, in the substrate processing apparatus 100 of the first variation, the downstream piping 161 is connected to the downstream portion 32b of the piping 32 at the downstream side of the filter 141. Specifically, the downstream piping 161 is connected to the piping 32 via the filter unit 140. The downstream piping 161 is connected to the piping 32 via the downstream chamber 142b of the filter unit 140.

[0159] In the first variation, similar to the first and second embodiments, the liquid passing through the filter 141 can be discharged via the downstream piping 161.

[0160] The downstream piping 161 is connected, for example, to the lower part of the downstream chamber 142b. For example, in a configuration where the downstream chamber 142b of the filter unit 140 is connected to a discharge pipe for discharging liquid passing through the filter 141 to the outside, the discharge pipe can also be used as the downstream piping 161. In other words, a pre-installed discharge pipe can also serve as the downstream piping 161. With this configuration, since there is no need to separately install the downstream piping 161, the increase in the number of components in the substrate processing apparatus 100 can be suppressed.

[0161] The other components, bubble removal methods, and other effects of the first variation are the same as those of the first and second embodiments.

[0162] [Second Variation Example]

[0163] Next, refer to Figure 11 The substrate processing apparatus 100 of the second variation of the present invention will be described. Figure 11 This is a schematic diagram illustrating the piping configuration in the substrate processing apparatus 100 of the second variation. The second variation differs from the first variation in that a downstream side piping 161 is connected to the upper part of the downstream chamber 142b of the filter unit 140. Furthermore, although this variation... Figure 7 The piping configuration shown in the second embodiment will be described as a part, but modifications are also possible. Figure 3 This is part of the piping configuration of the first embodiment shown.

[0164] like Figure 11 As shown, in the second variation of the substrate processing apparatus 100, similarly to the first variation, the downstream piping 161 is connected to the piping 32 via the downstream chamber 142b of the filter unit 140. In the second variation, similarly to the first variation, liquid passing through the filter 141 can be discharged via the downstream piping 161.

[0165] In a second variation, the downstream piping 161 is connected, for example, to the upper part of the downstream chamber 142b. For instance, in a configuration where the downstream chamber 142b of the filter unit 140 is connected to an exhaust pipe for discharging gas passing through the filter 141 to the outside, the exhaust pipe can also be used as the downstream piping 161. In other words, a pre-installed exhaust pipe can also serve as the downstream piping 161. With this configuration, since there is no need to separately install the downstream piping 161, the increase in the number of components in the substrate processing apparatus 100 can be suppressed.

[0166] The other components, bubble removal method, and other effects of the second variation are the same as those of the first variation.

[0167] [Third Implementation Method]

[0168] Next, refer to Figure 12 This paper describes a substrate processing apparatus 100 according to a third embodiment of the present invention. In this third embodiment, an example different from the first and second embodiments is described, specifically an example of periodically removing air bubbles. Furthermore, although changes are made here... Figure 5 The bubble removal method of the first embodiment shown will be described in part, but modifications are also possible. Figure 8 This is part of the bubble removal method of the second embodiment shown.

[0169] The substrate processing apparatus 100 of the third embodiment is configured the same as that of the first or second embodiment. However, in the third embodiment, the substrate processing apparatus 100 may not include the flow meter 116.

[0170] Figure 12 This is a flowchart illustrating the bubble removal method of the filter 141 according to the third embodiment. The bubble removal method of the filter 141 according to the third embodiment includes steps S301 and S102 to S108. Furthermore, step S301 is an example of the "processing liquid flow process" of the present invention. In step S301, similar to step S101 described above, the processing liquid is allowed to flow through the filter 141. In addition, in step S301, the processing liquid is allowed to flow to the piping 32 and supplied to the substrate processing unit 10.

[0171] like Figure 12 As shown, in step S301, the control unit 102 determines whether a predetermined period has elapsed. The predetermined period is a pre-determined period. The predetermined period can be, for example, the elapsed time since the previous replacement or bubble removal of the filter 141, or the cumulative driving time of the substrate processing apparatus 100. Alternatively, the predetermined period can also be, for example, the cumulative time during which the processing liquid flows through since the previous replacement or bubble removal of the filter 141. The cumulative time during which the processing liquid flows through corresponds to the flow rate of the processing liquid. To measure the aforementioned predetermined period, the substrate processing apparatus 100 preferably includes a timer or a flow meter.

[0172] Furthermore, the predetermined period for the previous replacement of filter 141 may differ from the predetermined period for the previous removal of air bubbles from filter 141. In such cases, the predetermined period for the replacement of filter 141 may be set to be longer than the predetermined period for the removal of air bubbles from filter 141.

[0173] In step S301, if the control unit 102 determines that the predetermined period has not elapsed, step S301 is repeated.

[0174] On the other hand, in step S301, if the control unit 102 determines that a predetermined period has elapsed, the process is transferred to step S102.

[0175] Next, proceed with steps S102 to S108.

[0176] The other bubble removal methods in the third embodiment are the same as those in the first or second embodiment.

[0177] As described above, in the third embodiment, the bubble removal liquid is periodically supplied from the upstream piping 151 through the filter 141 and then through the downstream piping 161. Therefore, bubble removal can be performed before a large amount of bubbles become clogged. Consequently, the time required for the processing liquid and washing liquid to flow through the filter 141 is prevented from becoming excessive.

[0178] The other effects of the third embodiment are the same as those of the first or second embodiment.

[0179] [Fourth Implementation Method]

[0180] Next, refer to Figure 13 This paper describes a substrate processing apparatus 100 according to a fourth embodiment of the present invention. In this fourth embodiment, an example different from the first to third embodiments will be described, specifically an example where the processing liquid supply is resumed after confirming that the filter 141 has been restored. Furthermore, although changes have been made here... Figure 5 The bubble removal method of the first embodiment shown will be described in part, but modifications are also possible. Figure 12 This is part of the bubble removal method of the third embodiment shown.

[0181] The substrate processing apparatus 100 of the fourth embodiment has the same configuration as that of the first embodiment and the third embodiment.

[0182] Figure 13 This is a flowchart illustrating the bubble removal method of the filter 141 according to the fourth embodiment. The bubble removal method of the filter 141 according to the fourth embodiment includes steps S101 to S107, S401, S402, and S108. Furthermore, step S402 is an example of the "measurement process" of the present invention.

[0183] like Figure 13 As shown, steps S101 to S107 are the same as in the first embodiment. After step S107, the process proceeds to step S401. Step S401 is executed before step S108.

[0184] In step S401, the control unit 102 causes the treatment fluid to flow through the filter 141. Specifically, the control unit 102 switches valves 115 and 117 from the closed state to the open state. As a result, the treatment fluid in the conditioning tank 112 passes through the piping 32 and the filter unit 140 before passing through the flow meter 116.

[0185] Next, in step S402, the control unit 102 determines whether the flow rate of the processed liquid passing through the flow meter 116 is above a predetermined value. That is, the control unit 102 determines whether the flow rate of the processed liquid passing through the filter 141 is above a predetermined value. In other words, the control unit 102 determines whether the filter 141 has been restored. Furthermore, the "predetermined value" in step S402 is larger than the "threshold" in step S101. However, the "predetermined value" in step S402 may also be the same as the "threshold" in step S101.

[0186] If, in step S402, the control unit 102 determines that the flow rate of the treatment liquid through the flow meter 116 is less than a predetermined value, the process returns to step S102. Thereafter, the treatment liquid flows through the filter 141 again.

[0187] On the other hand, if in step S402 the control unit 102 determines that the flow rate of the treatment fluid through the flow meter 116 is above a predetermined value, the process proceeds to step S108. Then, for example, the supply of treatment fluid to the nozzle 34 is started again.

[0188] As described above, the bubble removal of filter 141 in the fourth embodiment is completed.

[0189] The other bubble removal methods in the fourth embodiment are the same as those in the first and third embodiments.

[0190] As described above, in the fourth embodiment, if the measured value of the flow meter 116 is less than a predetermined value after the removal liquid flow process (step S105), the removal liquid flow process is performed again. Therefore, the processing liquid can be supplied to the substrate processing unit 10 only after the filter 141 has been reliably restored.

[0191] Furthermore, in the fourth embodiment, the liquid flow time in step S104 after step S402 can be set to be shorter than the liquid flow time in step S104 without step S402 (the first step S104). With this configuration, the increase in the amount of bubble removal liquid used can be suppressed.

[0192] Furthermore, in the fourth embodiment, the time for the bubble-removing liquid to flow through the filter 141 in step S105 can also be changed by the control unit 102. Specifically, the control unit 102 can automatically change the liquid flow time in step S104 (the first step S104) before step S402 is performed, based on the cumulative liquid flow time required in step S105 before moving to step S108. Alternatively, the liquid flow time can also be changed manually by the user. Thus, by changing the liquid flow time in step S104 (the first step S104) before step S402 is performed, based on the cumulative liquid flow time required in step S105 before moving to step S108, the liquid flow time in the first step S104 can be optimized. Therefore, performing multiple steps S102 to S107 can be suppressed. Therefore, the increase in the amount of cleaning liquid used can be suppressed, and the time required for bubble removal can be suppressed.

[0193] The other effects of the fourth embodiment are the same as those of the first and third embodiments.

[0194] [Fifth Implementation]

[0195] Next, refer to Figure 14 The substrate processing apparatus 100 according to the fifth embodiment of the present invention will be described. In the fifth embodiment, an example different from the fourth embodiment will be described, that is, an example that does not include the step of replacing the liquid in the modulation tank 112. Furthermore, although changes have been made here... Figure 8 The bubble removal method of the second embodiment shown will be described in part, but modifications are also possible. Figure 12 This is part of the bubble removal method of the third embodiment shown.

[0196] Similar to the second embodiment, in the fifth embodiment, the substrate processing apparatus 100 includes a cleaning pipe 171 connected to the pipe 32 at an upstream or downstream side of the filter 141. The cleaning pipe 171 is connected to the pipe 32 at an upstream side of the filter 141.

[0197] The substrate processing apparatus 100 of the fifth embodiment has the same configuration as that of the second and third embodiments.

[0198] Figure 14 This is a flowchart illustrating the bubble removal method of the filter 141 according to the fifth embodiment. The bubble removal method of the filter 141 according to the fifth embodiment includes steps S101, S102, S204, S105, S206, S401, S402, and S108.

[0199] like Figure 14As shown, steps S101, S102, S204, S105, S206, and S108 are the same as in the second embodiment. After step S206, the process proceeds to step S401. Step S401 is executed before step S108.

[0200] In step S401, the control unit 102 causes the treatment fluid to flow through the filter 141. Specifically, the control unit 102 switches valves 115 and 117 from the closed state to the open state. As a result, the treatment fluid in the conditioning tank 112 passes through the piping 32 and the filter unit 140 before passing through the flow meter 116.

[0201] Next, in step S402, the control unit 102 determines whether the flow rate of the treatment liquid passing through the flow meter 116 is above a predetermined value.

[0202] If, in step S402, the control unit 102 determines that the flow rate of the treatment liquid through the flow meter 116 is less than a predetermined value, the process returns to step S102. Thereafter, the treatment liquid flows through the filter 141 again.

[0203] On the other hand, if in step S402 the control unit 102 determines that the flow rate of the treatment fluid through the flow meter 116 is above a predetermined value, the process proceeds to step S108. Then, for example, the supply of treatment fluid to the nozzle 34 is started again.

[0204] As described above, the bubble removal of filter 141 in the fifth embodiment is completed.

[0205] The other bubble removal methods in the fifth embodiment are the same as those in the second and fourth embodiments.

[0206] As described above, similarly to the fourth embodiment, in the fifth embodiment, if the measured value of the flow meter 116 is less than a predetermined value after the removal liquid flow process (step S105), the removal liquid flow process is performed again. Therefore, the processing liquid can be supplied to the substrate processing unit 10 only after the filter 141 has been reliably restored.

[0207] The other effects of the fifth embodiment are the same as those of the second and fourth embodiments.

[0208] [Sixth Implementation Method]

[0209] Next, refer to Figure 15 The substrate processing apparatus 100 of the sixth embodiment of the present invention will be described. Figure 15This is a schematic diagram showing the piping configuration in the substrate processing apparatus 100 according to the sixth embodiment. In the sixth embodiment, an example is described where a portion of the processing liquid that has passed through valve 117 is returned to the modulation tank 112. That is, an example is described where the piping 32 is configured in a manner that allows for processing liquid circulation in the sixth embodiment. Furthermore, although changes are made here… Figure 3 The piping configuration shown in the first embodiment will be described as a part, but modifications are also possible. Figure 7 This is part of the piping configuration of the second embodiment shown.

[0210] like Figure 15 As shown, in the sixth embodiment, piping 32 includes a common piping 32c, branch piping 32d, return piping 32e, common piping 32f, and branch piping 32g. The common piping 32c is connected to the downstream portion 32b of piping 32. A plurality of (four in this case) branch piping 32ds are connected to the common piping 32c. Branch piping 32ds branch off from the common piping 32c. Branch piping 32ds supply the processed fluid, which has passed through valve 117, to the processed fluid tank 120.

[0211] Return pipe 32e is connected to common pipe 32c. Return pipe 32e extends to conditioning tank 112. Return pipe 32e returns the treated liquid that has passed through common pipe 32c to conditioning tank 112.

[0212] A common piping 32f is disposed, for example, within the treatment fluid tank 120. The common piping 32f is connected to the branch piping 32d. Furthermore, a plurality of branch piping 32g (three in this case) are connected to the common piping 32f. The branch piping 32g branches off from the common piping 32f. The branch piping 32g supplies the treatment fluid that has passed through the common piping 32f to the nozzle 34.

[0213] The other components, bubble removal methods, and effects of the sixth embodiment are the same as those of the first to fifth embodiments.

[0214] [Seventh Implementation Method]

[0215] Next, refer to Figure 6A , Figure 6C , Figure 16 as well as Figure 17 The substrate processing apparatus 100 according to the seventh embodiment of the present invention will be described. In the seventh embodiment, an example different from the first to sixth embodiments will be described, that is, an example in which the bubble removal liquid is allowed to flow through when the processing liquid is started to be supplied.

[0216] Similar to the sixth embodiment, in the seventh embodiment, the piping 32 is configured to circulate the processing liquid. Alternatively, the piping 32 may not be configured to circulate the processing liquid. Furthermore, in the seventh embodiment, the substrate processing apparatus 100 may not include a gas supply unit 230.

[0217] As will be described later, in the seventh embodiment, the treatment liquid and the bubble removal liquid are mixed or in contact. Therefore, the treatment liquid and the bubble removal liquid are liquids that do not react with each other or are difficult to react with each other. At least one of the treatment liquid and the bubble removal liquid in the seventh embodiment is a different liquid from that in the first embodiment.

[0218] The other components of the seventh embodiment are the same as those of the sixth embodiment.

[0219] Figure 16 This is a flowchart illustrating the bubble removal method of the filter 141 according to the seventh embodiment. Figure 17 This is a schematic diagram illustrating the bubble removal method of the seventh embodiment, and an arrow indicating the flow of liquid around the filter unit. The bubble removal method of the filter 141 of the seventh embodiment includes steps S501 to S503. Steps S501 to S503 are executed by the control unit 102. Furthermore, step S501 is an example of the "processing liquid flow process" and "removal liquid flow process" of the present invention.

[0220] like Figure 16 As shown, in step S501, the control unit 102 causes the processing liquid and the air bubble removal liquid to flow through the filter 141. Specifically, step S501 is performed before the supply of processing liquid begins. For example, when the supply of processing liquid begins from a stopped state, air bubbles may mix into the filter unit 140. The gas mixed into the filter unit 140 becomes the cause of filter 141 blockage. Examples of a stopped state for pump 114 include, for example, an idling state where the circulation of processing liquid has stopped, or a state after the processing liquid in the conditioning tank 112 has been replaced. Furthermore, before step S501, valves 115, 117, 152, and 162 are in a closed state.

[0221] In step S501, the control unit 102 switches valves 115, 152, and 162 from the closed state to the open state. Thus, as... Figure 17As shown, the treatment fluid and the bubble removal fluid are discharged via the downstream piping 161 after passing through the filter unit 140. At this time, since the bubble removal fluid passes through the filter 141, even if bubbles are mixed into the filter unit 140, clogging of the filter 141 can be prevented. Furthermore, the timing of switching valve 115 from the closed state to the open state can be the same as the timing of switching valve 152 from the closed state to the open state, or one can be earlier than the other. Moreover, when, for example, several seconds have elapsed since the treatment fluid and the bubble removal fluid began to flow through, the process proceeds to step S502.

[0222] Next, in step S502, the control unit 102 stops the flow of the bubble removal liquid. Specifically, the control unit 102 switches the valve 152 from the open state to the closed state. Thus, as... Figure 6A As shown, the treatment fluid is discharged via downstream piping 161 after passing through filter unit 140.

[0223] Next, in step S503, the control unit 102 begins supplying the processing fluid. Specifically, valve 162 is switched from the open state to the closed state, and valve 117 is switched from the closed state to the open state. Thus, as... Figure 6C As shown, the treatment fluid flows toward valve 117 after passing through filter unit 140.

[0224] As described above, the bubble removal of filter 141 in the seventh embodiment is completed.

[0225] As described above, in the seventh embodiment, when the processing liquid is supplied from the stopped state of pump 114, the processing liquid and the air bubble removal liquid flow through filter 141. Therefore, even if air bubbles are mixed into filter unit 140, it is possible to prevent air bubbles from clogging filter 141.

[0226] The other effects of the seventh embodiment are the same as those of the first to sixth embodiments.

[0227] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments, and can be implemented in various ways without departing from the spirit of the present invention. Furthermore, various inventions can be formed by appropriately combining the plurality of constituent elements disclosed in the above embodiments. For example, some of the constituent elements shown in all embodiments may be deleted. Moreover, constituent elements in different embodiments may be appropriately combined. For ease of understanding of the present invention, the accompanying drawings represent the constituent elements principally and schematically, and the thickness, length, number, spacing, etc. of the constituent elements shown may differ from the actual figures due to the nature of the drawings. In addition, the material, shape, size, etc. of the constituent elements shown in the above embodiments are examples and are not particularly limited; various modifications can be made without substantially departing from the effectiveness of the present invention.

[0228] For example, in the first to sixth embodiments, examples were described where the cleaning liquid was flowed through before the bubble-removing liquid flowed through and after the bubble-removing liquid flowed through; however, the present invention is not limited to this. For example, the cleaning liquid may not flow through after the supply of the treatment liquid is stopped, but the bubble-removing liquid may flow through instead. Furthermore, the cleaning liquid may not flow through after the bubble-removing liquid has flowed through, but the treatment liquid may flow through instead. However, in cases where there are concerns that the treatment liquid and the bubble-removing liquid may react with each other, adversely affecting components such as piping, valves, or filter units, it is preferable to allow the cleaning liquid to flow through as described in the first to sixth embodiments.

[0229] Furthermore, although examples have been described in the first to sixth embodiments where the degassing liquid supply unit 165 is connected to the upstream piping 151 and the degassing liquid flows from the upstream piping 151 through the filter 141 to the downstream piping 161, the present invention is not limited thereto. For example, the degassing liquid supply unit 165 may also be connected to the downstream piping 161 and the degassing liquid flows from the downstream piping 161 through the filter 141 to the upstream piping 151.

[0230] Furthermore, although examples are described in the second and fifth embodiments where the cleaning pipe 171 is connected to the pipe 32 upstream of the filter 141 and the cleaning solution flows from the cleaning pipe 171 through the filter 141 to the downstream pipe 161, the present invention is not limited thereto. For example, the cleaning pipe 171 may also be connected to the pipe 32 downstream of the filter 141 and the cleaning solution flows from the cleaning pipe 171 through the filter 141 to the upstream pipe 151.

[0231] Furthermore, although examples of using the flow rate of the treatment fluid in the measurement step (step S402) to confirm that the filter 141 has been restored are described in the fourth and fifth embodiments, the present invention is not limited thereto. For example, the flow rate of the cleaning fluid may also be used to confirm that the filter 141 has been restored. In this case, a flow meter for measuring the flow rate of the cleaning fluid passing through the filter 141 may be configured, for example, in downstream piping 161, piping 32, or cleaning piping 171. Furthermore, the flow rate of the bubble removal fluid may also be used to confirm that the filter 141 has been restored. In this case, a flow meter for measuring the flow rate of the bubble removal fluid passing through the filter 141 may also be configured, for example, in downstream piping 161, piping 32, or upstream piping 151.

[0232] Furthermore, while the above embodiment exemplifies an example where the substrate processing apparatus 100 includes a gas supply unit 230, the present invention is not limited to this, and gas may not be supplied to the modulation tank 112. For example, there may be instances where air bubbles are mixed into the filter unit 140 when the filter 141 is replaced. Although the mixed-in gas can cause the filter 141 to become clogged, the present invention allows the filter 141 to be restored.

[0233] Furthermore, while the above embodiments have described valves 36, 115, 117, 152, 162, 172, 212, 222, 232, and 242 as examples of valves capable of adjusting the flow rate of liquids, the present invention is not limited thereto. For example, valves 36, 115, 117, 152, 162, 172, 212, 222, 232, and 242 may also be valves that cannot adjust the flow rate of liquids. That is, valves 36, 115, 117, 152, 162, 172, 212, 222, 232, and 242 may simply switch the flow path to an open or closed state.

[0234] Industrial availability

[0235] This invention is suitable for use in substrate processing apparatus and bubble removal methods for filters.

[0236] [Explanation of the labeling in the attached diagram]

[0237] 10: Substrate Processing Unit

[0238] 32: Piping (treatment fluid piping)

[0239] 100: Substrate processing apparatus

[0240] 115: Valve (First Valve)

[0241] 116: Flow meter

[0242] 117: Valve (Second Valve)

[0243] 141: Filter

[0244] 151: Upstream side piping

[0245] 152: Valve (Third Valve)

[0246] 161: Downstream piping

[0247] 162: Valve (Fourth Valve)

[0248] 165: Desalination fluid supply unit

[0249] 171: Clean the piping

[0250] 172: Valve (Fifth Valve)

[0251] 175: Cleaning Solution Supply Department

[0252] 220: Cleaning Solution Supply Department

[0253] S101, S301: Steps (Processing Liquid Flow Process)

[0254] S105: Step (Removal of Liquid Flow Process)

[0255] S106, S206: Steps (Washing Solution Circulation Process)

[0256] S402: Procedure (Measurement Process)

[0257] S501: Steps (processing liquid flow process, removal liquid flow process)

[0258] W: substrate

Claims

1. A substrate processing apparatus, wherein, have: Substrate processing unit, used to process substrates; Processing fluid piping is provided to allow the processing fluid to flow to the substrate processing unit; A filter is configured in the treatment fluid piping; Upstream piping is connected to the treatment fluid piping upstream of the filter; Downstream piping is connected to the treatment fluid piping downstream of the filter; as well as A degassing fluid supply unit, connected to one of the upstream side piping and the downstream side piping, supplies degassing fluid, used to remove bubbles clogging the filter, to one of the upstream side piping and the downstream side piping. A flow meter is used to measure the flow rate of the treated liquid passing through the filter. as well as The processing fluid supply unit is connected to the processing fluid piping and supplies processing fluid to the processing fluid piping. When the flow meter reading is less than a threshold while the processing liquid is flowing through the processing liquid piping, the substrate processing apparatus stops supplying processing liquid from the processing liquid supply unit to the processing liquid piping, and supplies the bubble removal liquid from the bubble removal liquid supply unit via one of the upstream side piping and the downstream side piping, and passes the bubble removal liquid through the filter via the other of the upstream side piping and the downstream side piping.

2. The substrate processing apparatus as claimed in claim 1, wherein, It also has: Clean the piping and connect it to the treatment fluid piping upstream or downstream of the filter; and A cleaning solution supply unit is connected to the cleaning piping and supplies cleaning solution for rinsing the treatment solution to the cleaning piping. When the flow meter reading is less than a threshold, the substrate processing device begins supplying cleaning fluid from the cleaning fluid supply unit to the cleaning piping, causing the cleaning fluid to flow from the cleaning piping through the filter and through one of the upstream piping and the downstream piping. After the substrate processing apparatus allows the cleaning solution to flow to one of the upstream side pipe and the downstream side pipe, it stops supplying the cleaning solution from the cleaning solution supply unit to the cleaning pipe, and supplies the bubble removal solution from the bubble removal solution supply unit via one of the upstream side pipe and the downstream side pipe.

3. The substrate processing apparatus as claimed in claim 2, wherein, It also has: A first valve is disposed on the upstream side of the filter in the treatment fluid piping; A second valve is disposed on the downstream side of the filter in the treatment fluid piping; The third valve is configured in the upstream piping; The fourth valve is configured on the downstream piping; as well as The fifth valve is located on the cleaning piping; The substrate processing apparatus closes the third valve, the fourth valve, and the fifth valve and opens the first valve and the second valve, thereby allowing the processing liquid to pass from the upstream side of the processing liquid piping through the filter to the downstream side of the processing liquid piping; The substrate processing apparatus closes the first valve, the second valve, and the fifth valve and opens the third valve and the fourth valve, thereby allowing the bubble removal liquid to pass from one of the upstream side piping and the downstream side piping through the filter to the other of the upstream side piping and the downstream side piping; The substrate processing apparatus closes one of the third and fourth valves, the first valve and the second valve, and opens the other of the third and fourth valves and the fifth valve, thereby allowing the cleaning solution to flow from the cleaning piping through the filter through the other of the upstream piping and the downstream piping.

4. The substrate processing apparatus according to any one of claims 1 to 3, wherein, The bubble removal fluid is periodically passed from one of the upstream and downstream piping lines through the filter to the other of the upstream and downstream piping lines.

5. The substrate processing apparatus according to any one of claims 1 to 3, wherein, After the substrate processing apparatus allows the bubble removal liquid to pass from one of the upstream side piping and the downstream side piping through the filter through the other of the upstream side piping and the downstream side piping, if the measured value of the flow meter is less than a predetermined value, the apparatus again allows the bubble removal liquid to pass from one of the upstream side piping and the downstream side piping through the filter through the other of the upstream side piping and the downstream side piping.

6. A method for removing air bubbles from a filter, wherein, Include: In the processing fluid flow process, the processing fluid used to process the substrate flows through a filter disposed in the processing fluid piping, and the flow rate of the processing fluid passing through the filter is measured by a flow meter. The processing fluid piping is connected to the substrate processing unit. as well as In the process of removing the flow liquid, if the measured value of the flow meter is less than a threshold, the supply of processing liquid to the processing liquid piping is stopped. A bubble-removing liquid, used to remove bubbles clogging the filter, is supplied from one of the upstream and downstream piping via the filter and the other of the upstream and downstream piping. The upstream piping is connected to the processing liquid piping upstream of the filter, and the downstream piping is connected to the processing liquid piping downstream of the filter.

7. The bubble removal method for a filter as described in claim 6, wherein, It also includes: a cleaning fluid flow process, prior to the removal fluid flow process, using a cleaning fluid for rinsing the treatment fluid from a cleaning pipe via the filter through the upstream side pipe and the other of the downstream side pipe, the cleaning pipe being connected to the treatment fluid pipe at the upstream or downstream side of the filter.

8. The bubble removal method for a filter as described in claim 6 or 7, wherein, The removal liquid flow process is performed periodically.

9. The bubble removal method for a filter as described in claim 6 or 7, wherein, It also includes: a measurement step, after the removal liquid flow step, using the flow meter to measure the flow rate of the liquid passing through the filter; If the measured value of the flow meter is less than the predetermined value, the removal liquid flow process is repeated.

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