Laminate, method for producing laminate, and conductive laminate

Abstract

[Solution] A laminate is provided with a first resin layer, a first conductive layer, an insulating layer, a second conductive layer, and a second resin layer in this order, the first resin layer having a housing part, and the first conductive layer being disposed in the housing part of the first resin layer. The conductive laminate is provided with a first conductive layer, an insulating layer, and a second conductive layer in this order. The conductive laminate is provided with adhesive layers between the first conductive layer and the insulating layer and between the insulating layer and the second conductive layer.

Description

Technical Field

[0001] The present invention relates to a laminate, a method for producing a laminate, and a conductive laminate. Background Art

[0002] A power module (PM) mounted in a hybrid vehicle or the like includes a laminate (also referred to as a case) of a resin molded article and a metal.

[0003] Conventionally, the housing is manufactured by placing a conductive layer and an insulating layer in a mold and injecting a resin into the mold to perform molding (hereinafter also referred to as insert molding). Summary of the invention

[0004] Problems to be solved by the invention

[0005] Generally, a heat sink plate to which components and the like are brazed is bonded to a housing for a PM.

[0006] From the viewpoint of improving manufacturing efficiency, it is desirable to bond the heat sink to the housing and the components to the heat sink at the same time. However, soldering the components to the heat sink applies heat to the housing.

[0007] This time, the inventors of the present application discovered that for the shell manufactured by the previous insert molding disclosed in Japanese Patent Gazette No. 2021-122959 (Patent Document 1), since the conductive layer is buried in the resin layer, when the laminate is left still in a high temperature environment or heated, the internal stress generated by the difference in the linear expansion coefficient between the conductive layer and the resin layer cannot be fully alleviated, resulting in cracks, deformation of the conductive layer and the resin layer, etc., and there is still room for improvement in its thermal durability.

[0008] An object of one embodiment of the present invention is to provide a laminate having excellent thermal durability and a method for producing the laminate.

[0009] In addition, SiC-MOSFET used as a power semiconductor element can switch at high speed compared to the conventional Si-IGBT. In order to fully utilize this performance, it is required to reduce the surge voltage that increases in proportion to the switching speed. From this point of view, it is preferred to reduce the inductance of the internal wiring. In order to reduce the inductance, it is effective to parallelize two conductive layers with a narrow pitch to cancel each other's inductance.

[0010] However, it has been found that if two conductive layers are placed in parallel with a narrow interval, partial discharge is likely to occur, and the inductance is not effectively reduced.

[0011] Therefore, an object of one embodiment of the present invention is to provide a conductive laminate in which partial discharge is unlikely to occur even when two conductive layers are arranged in parallel at a narrow pitch.

[0012] Means for solving problems

[0013] <1> A laminated body comprising, in order:

[0014] 1st resin layer;

[0015] A first conductive layer;

[0016] Insulation; and

[0017] The second conductive layer,

[0018] The first resin layer has a receiving portion.

[0019] The first conductive layer is disposed in the housing portion of the first resin layer.

[0020] <2> According to the above <1> The described laminated body, wherein the above-mentioned receiving portion includes a concave portion or a concavo-convex portion.

[0021] <3> According to the above <1> The laminated body described above, wherein the first conductive layer, the insulating layer, and the second conductive layer are arranged in the housing portion of the first resin layer.

[0022] <4> According to the above <1> or <2> The laminated body described above, wherein the area of ​​the housing portion included in the first resin layer is equal to or larger than the area of ​​the first conductive layer.

[0023] <5> According to the above <1> ~ <4> The laminated body described in any one of the above, further comprising a second resin layer on the side of the second conductive layer opposite to the insulating layer.

[0024] <6> According to the above <1> ~ <5> The laminated body described in any one of the above, further comprising an adhesive layer between the first conductive layer and the insulating layer and between the insulating layer and the second conductive layer, wherein the adhesive layer contains a resin that is solid under an environment of 25°C.

[0025] <7> According to the above <1> ~ <6> The laminate according to any one of the above, wherein the first resin layer is a cured product of a resin composition containing a thermosetting resin.

[0026] <8> According to the above <7> The laminated body described above, wherein the thermosetting resin comprises an unsaturated polyester.

[0027] <9> According to the above <1> ~ <8> The laminated body described in any one of the above, wherein the first resin layer has a fixing portion that fixes the first conductive layer, the insulating layer, and the second conductive layer.

[0028] <10> A method for manufacturing a laminate, comprising:

[0029] a preparation step of preparing a first resin layer having a receiving portion on at least one surface thereof; and

[0030] a lamination step of laminating a first conductive layer, an insulating layer, and a second conductive layer on the surface of the first resin layer;

[0031] In the lamination step, at least the first conductive layer is disposed in the housing portion of the first resin layer.

[0032] <11> A conductive laminate comprising a first conductive layer, an insulating layer and a second conductive layer in this order,

[0033] Adhesive layers are provided between the first conductive layer and the insulating layer, and between the insulating layer and the second conductive layer.

[0034] <12> according to <11> The conductive laminate described herein has an area where the peripheral end of the above-mentioned first conductive layer is closer to the inner side than the peripheral end of the above-mentioned second conductive layer, and in the above-mentioned area, the end of the adhesive layer on the side of the above-mentioned first conductive layer is aligned with the end of the above-mentioned first conductive layer or is longer than the end of the above-mentioned first conductive layer by less than 10 mm.

[0035] <13> according to <11> The conductive laminate described above has a region where the peripheral end of the first conductive layer is located inside the peripheral end of the second conductive layer, and in the region, the end of the adhesive layer on the first conductive layer side is aligned with the end of the insulating layer.

[0036] <14> according to <11> The conductive laminate described herein has a region where the peripheral end of the first conductive layer is located inner than the peripheral end of the second conductive layer, and in the region, the end of the adhesive layer on the first conductive layer side is longer than the end of the first conductive layer by more than 20 mm.

[0037] <15> according to <11> ~ <14> The conductive laminate according to any one of the preceding claims, wherein an adhesive layer is provided on at least a portion of an end surface of the insulating layer.

[0038] <16> according to <11> ~ <15> The conductive laminate according to any one of the above, comprising a region where the peripheral end of the first conductive layer is located on the inner side than the peripheral end of the second conductive layer, wherein the adhesive layer is provided on at least a part of the end surface of the first conductive layer in the region.

[0039] <17> according to <11> , <15> or <16> " A conductive laminate described in claim 1 , wherein an insulating layer is provided on the end surface of at least one of the first conductive layer and the second conductive layer.

[0040] <18> according to <17> The conductive laminate described above, wherein the insulating layer provided on an end surface of at least one of the first conductive layer and the second conductive layer further extends to a portion of an outer side surface of the first conductive layer.

[0041] <19> according to <11> The conductive laminate described above, wherein the insulating layer covers the periphery of the first conductive layer or the second conductive layer.

[0042] <20> according to <11> ~ <19> The conductive laminate according to any one of the above, comprising a bent portion bent in the thickness direction, wherein the angle of the bent portion is larger than 90° and smaller than 180°.

[0043] <21> according to <11> ~ <20> The conductive laminate according to any one of the above items, wherein at least one of the first conductive layer side and the second conductive layer side has a protrusion protruding in the thickness direction, and the angle of the rising portion of the protrusion is larger than 90° and smaller than 180°.

[0044] Effects of the Invention

[0045] According to one embodiment of the present invention, a laminated body having excellent thermal durability and a method for producing the laminated body can be provided.

[0046] According to one embodiment of the present invention, it is possible to provide a conductive laminate in which partial discharge is unlikely to occur even when two conductive layers are arranged in parallel at a narrow pitch. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] [ Figure 1 ] Figure 1 This is a perspective view showing one embodiment of the laminated body of the present invention.

[0048] [ Figure 2 ] Figure 2 This is a perspective view showing another embodiment of the laminated body of the present invention.

[0049] [ Figure 3 ] Figure 3 yes Figure 1 A-A' cross-sectional view.

[0050] [ Figure 4 ] Figure 4 yes Figure 2 A-A' cross-sectional view.

[0051] [ Figure 5 ] Figure 5 This is a cross-sectional view showing another embodiment of the laminated body of the present invention.

[0052] [ Figure 6 ] Figure 6This is a perspective view showing one embodiment of the first resin layer included in the laminated body of the present invention.

[0053] [ Figure 7 ] Figure 7 This is a perspective view showing one embodiment of the first resin layer included in the laminated body of the present invention.

[0054] [ Figure 8 ] Figure 8 It is a perspective view showing another embodiment of the laminated body of the present invention.

[0055] [ Fig. 9 ] Fig. 9 This is a schematic cross-sectional view of one embodiment of the first conductive laminate.

[0056] [ Fig.10 ] Fig.10 This is a schematic cross-sectional view of one embodiment of the second conductive laminate.

[0057] [ Fig.11 ] Fig.11 This is a schematic cross-sectional view of one embodiment of a laminate using the second conductive laminate.

[0058] [ Fig.12 ] Fig.12 This is a schematic cross-sectional view of one embodiment of the third conductive laminate.

[0059] [ Fig.13 ] Fig.13 This is a schematic cross-sectional view of one embodiment of the fourth conductive laminate.

[0060] [ Fig.14 ] Fig.14 It is a schematic cross-sectional view of another embodiment of the fourth conductive laminate.

[0061] [ Fig.15 ] Fig.14 It is a schematic cross-sectional view of another embodiment of the fourth conductive laminate.

[0062] [ Fig.16 ] Fig.16 This is a schematic cross-sectional view of one embodiment of the fifth conductive laminate.

[0063] [ Fig.17 ] Fig.17 This is a schematic cross-sectional view of one embodiment of the sixth conductive laminate.

[0064] [ Fig.18 ] Fig.18 This is a schematic cross-sectional view of one embodiment of the seventh conductive laminate. DETAILED DESCRIPTION

[0065] Hereinafter, the mode for implementing the present invention is described in detail. However, the present invention is not limited to the following embodiments. In the following embodiments, its constituent elements (including element steps, etc.) are not necessary except for the cases clearly indicated. Numerical values ​​and their ranges are also the same and do not limit the present invention.

[0066] In the present invention, the term "process" includes not only processes that are independent of other processes, but also processes that cannot be clearly distinguished from other processes as long as the purpose of the process can be achieved. In the numerical range expressed by "to" in the present invention, the numerical values ​​recorded before and after "to" are included as the minimum value and the maximum value, respectively.

[0067] In the numerical ranges described in stages in the present invention, the upper limit value or the lower limit value described in one numerical range can be replaced by the upper limit value or the lower limit value of the numerical range described in another stage.

[0068] In addition, in the numerical range described in the present invention, the upper limit value or the lower limit value of the numerical range may be replaced with the value shown in the Examples.

[0069] In the present invention, each component may include a plurality of corresponding substances. When there are a plurality of substances corresponding to each component in the composition, unless otherwise specified, the content or content of each component refers to the total content or content of the plurality of substances present in the composition.

[0070] In the present invention, the term "layer" includes a case where the layer is formed in the entire region and a case where the layer is formed in only a part of the region when the region where the layer exists is observed.

[0071] In the present invention, when the embodiment is described with reference to the drawings, the configuration of the embodiment is not limited to the configuration shown in the drawings. In addition, the sizes of the components in each figure are conceptual, and the relative relationship between the sizes of the components is not limited to this.

[0072] [Laminated body]

[0073] The laminated body of the present invention comprises a first resin layer, a first conductive layer, an insulating layer, and a second conductive layer in this order, wherein the first resin layer has a housing portion, and the first conductive layer is disposed in the housing portion of the first resin layer.

[0074] The laminate of the present invention is excellent in thermal durability. The reason for achieving the above effect is not clear, but is presumed as follows.

[0075] The laminate of the present invention can be manufactured by separately making each layer and laminating them, rather than by insert molding. Therefore, in the laminate manufactured by insert molding, the first conductive layer is buried in the first resin layer and is completely in close contact with it. In contrast, in the laminate of the present invention, since the first resin layer has a receiving portion, it is not completely in close contact with the first conductive layer, and the internal stress generated during heating can be alleviated. As a result, it is presumed that the generation of cracks and the deformation of the conductive layer and the resin layer can be suppressed, and the thermal durability is improved.

[0076] In addition, it is presumed that the first resin layer has a housing portion, but this is difficult to form by insert molding, and thus the thermal durability is improved.

[0077] The laminated body of the present invention may further include a second resin layer on the side of the second conductive layer opposite to the insulating layer.

[0078] The laminated body of the present invention may include an adhesive layer between the first conductive layer and the insulating layer, and between the insulating layer and the second conductive layer.

[0079] The laminated body of the present invention may include an adhesive layer between the first resin layer and the first conductive layer, and between the second conductive layer and the second resin layer.

[0080] From the viewpoint of thermal durability, the adhesive layer provided between the first resin layer and the first conductive layer is preferably arranged in the housing portion of the first resin layer.

[0081] The laminated body of the present invention may include a heat sink on the first resin layer side surface of the first conductive layer or the second resin layer side surface of the second conductive layer.

[0082] From the viewpoint of thermal durability, the heat dissipation plate is preferably disposed in the housing portion of the first resin layer.

[0083] (1st resin layer)

[0084] The first resin layer has a housing portion, and the first conductive layer is disposed in the housing portion.

[0085] From the viewpoint of thermal durability, it is preferred that the housing portion include a concave portion or a concavo-convex portion.

[0086] The receiving portion including the concavo-convex portion means that the receiving portion includes a concave portion and a convex portion. The concave portion may also be a step-shaped portion with a deeper concave portion provided inside.

[0087] From the viewpoint of thermal durability, it is preferred that the first conductive layer, the insulating layer, and the second conductive layer be disposed within the housing portion of the first resin layer.

[0088] When the housing portion includes a stepped recessed portion, the first conductive layer, the insulating layer, and the second conductive layer may be housed in the same layer or in different layers.

[0089] exist Figure 3 to Figure 5 , a mode in which the first conductive layer, the insulating layer, and the second conductive layer are accommodated in different levels of a stepped recessed portion is shown.

[0090] In addition, the first resin layer may have one housing portion, or may have two or more housing portions.

[0091] Figure 6 The first resin layer 100 shown has a plurality of housing portions 101 .

[0092] Figure 6 Each housing portion 101 included in the illustrated first resin layer 100 includes a concave portion 102A and a convex portion 102B that is higher than the concave portion 102A.

[0093] When the first resin layer has a plurality of receiving portions, Figure 7 Although the first conductive layer 105 is arranged in a part of the receiving portions in the illustrated embodiment, the first conductive layer 105 may be arranged in all the receiving portions.

[0094] In addition, the insulating layer and the second conductive layer do not need to be stacked on all the first conductive layers arranged in the receiving portion, but Figure 8 As shown, it can also be stacked on all the first conductive layers arranged in the receiving portion. Figure 8 In the figure, the insulating layer is not shown, and the second conductive layer is represented by reference numeral 106.

[0095] The area of ​​the receiving portion of the first resin layer is preferably greater than the area of ​​the first conductive layer. The ratio of the area of ​​the first conductive layer to the area of ​​the receiving portion of the first resin layer (the area of ​​the first conductive layer / the receiving portion of the first resin layer) is preferably greater than 1.01. Thus, the first conductive layer can be easily arranged on the receiving portion of the first resin layer. In addition, the area ratio is preferably less than 2.00. Thus, there is a tendency that the first conductive layer can be suppressed from being displaced on the first resin layer.

[0096] When the first resin layer has a receiving portion, its size is preferably appropriately changed according to the size of the first conductive layer, the purpose of the laminate, etc. The area of ​​the receiving portion may be, for example, 1 cm 2 ~1000cm 2 .

[0097] The depth of the housing portion is preferably at least equal to or greater than the thickness of the first conductive layer, more preferably equal to or greater than the total thickness of the first conductive layer, the insulating layer, and the second conductive layer, further preferably equal to or greater than the total thickness of the first conductive layer, the insulating layer, the second conductive layer, and the adhesive layer, and particularly preferably equal to or greater than the total thickness of the first conductive layer, the insulating layer, the second conductive layer, the adhesive layer, and the heat sink. The thickness of the housing portion may be, for example, 0.1 mm to 100 mm.

[0098] It should be noted that the depth of the housing portion may be smaller than the total thickness of the first conductive layer, the insulating layer, the second conductive layer, the adhesive layer, and the heat dissipation plate.

[0099] From the viewpoint of thermal durability, the first resin layer is preferably a cured product of a resin composition containing a thermosetting resin.

[0100] The type of thermosetting resin is not particularly limited, as long as it has one or more functional groups that can be used for a crosslinking reaction by heating in one molecule. Examples of the functional group include epoxy, acryloyl, methacryloyl, hydroxyl, vinyl, carboxyl, amino, maleimide, anhydride, thiol, sulfinyl, amide, and imide groups.

[0101] Examples of the thermosetting resin include phenolic resins, unsaturated imide resins, cyanate resins, isocyanate resins, benzoxazine resins, oxetane resins, amino resins, unsaturated polyester resins, acrylic resins, dicyclopentadiene resins, silicone resins, triazine resins, melamine resins, resorcinol resins, epoxy resins, etc. Among the above, from the viewpoint of heat durability, it is preferred to contain at least one selected from unsaturated polyesters and phenolic resins, and it is more preferred to contain unsaturated polyesters.

[0102] The resin composition may contain one type of thermosetting resin alone, or may contain two or more types of thermosetting resins.

[0103] Unsaturated polyesters can be obtained by polycondensing (esterifying) polyols with unsaturated polybasic acids, saturated polybasic acids, and the like.

[0104] The polyol is not particularly limited, and conventionally known polyols can be used. Examples of the polyol include ethylene glycol, propylene glycol, butylene glycol, diethylene glycol, dipropylene glycol, triethylene glycol, pentanediol, hexylene glycol, neopentyl glycol, hydrogenated bisphenol A, bisphenol A, glycerol, etc. These can be used alone or in combination of two or more.

[0105] The unsaturated polyacid is not particularly limited, and conventionally known substances can be used. Examples of the unsaturated polyacid include maleic anhydride, fumaric acid, citraconic acid, itaconic acid, etc. These can be used alone or in combination of multiple types.

[0106] As saturated polyacid, there is no particular limitation, and known saturated polyacids can be used. As saturated polyacid, phthalic anhydride, isophthalic acid, terephthalic acid, chlorendic acid, succinic acid, adipic acid, sebacic acid, tetrachlorophthalic anhydride, tetrabromophthalic anhydride, endomethylenetetrahydrophthalic anhydride etc. can be mentioned. They can be used alone or in combination of two or more.

[0107] As the unsaturated polyester, those synthesized by a known method using the above-mentioned raw materials may be used, or commercially available ones may be used.

[0108] Unsaturated polyester can be obtained by polycondensing a polyol with an unsaturated polybasic acid, a saturated polybasic acid, or the like in an inert gas atmosphere such as nitrogen at a temperature of 140° C. to 230° C. The polycondensation reaction can be carried out under pressure or under reduced pressure.

[0109] In the polycondensation reaction, a crosslinking agent or a catalyst may be used as necessary.

[0110] Examples of the crosslinking agent include styrene monomers, diallyl phthalate monomers, diallyl phthalate prepolymers, methyl methacrylate, triallyl isocyanurate, etc. These can be used alone or in combination of two or more.

[0111] Examples of the catalyst include manganese acetate, dibutyltin oxide, stannous oxalate, zinc acetate, cobalt acetate, etc. These may be used alone or in combination of two or more.

[0112] From the viewpoint of thermal durability, the number average molecular weight of the thermosetting resin is preferably 1,000 to 10,000, more preferably 1,500 to 5,000.

[0113] In the present invention, the number average molecular weight is a weight average molecular weight in terms of polystyrene measured by gel permeation chromatography (GPC).

[0114] From the viewpoint of thermal durability, the content of the thermosetting resin is preferably 10 to 60% by mass, more preferably 20 to 50% by mass, and even more preferably 20 to 40% by mass, based on the total mass of the resin composition.

[0115] The resin composition may contain a thermoplastic resin, an elastomer, and the like.

[0116] Specific examples of thermoplastic resins include polyimide resins, polyamideimide resins, polyamide resins, polyetherimide resins, polybenzoxazole resins, polybenzimidazole resins, polystyrene resins, acrylonitrile-butadiene-styrene copolymer resins, acrylonitrile-styrene copolymer resins, polyethylene resins, polypropylene resins, polyvinyl chloride resins, polyvinylidene chloride resins, polycarbonate resins, (meth)acrylic resins, polyester resins, polyacetal resins, and polyphenylene sulfide resins (PPS).

[0117] Specific examples of the elastomer include silicone rubber, styrene butadiene rubber (SBR), nitrile rubber (NBR), and urethane rubber.

[0118] The resin composition may also contain various additives such as a curing agent, a curing accelerator, a filler, a release agent, a flame retardant, a colorant, a plasticizer, a silane coupling agent, a rust inhibitor, a copper damage inhibitor, a reducing agent, an antioxidant, a tackifying resin, an ultraviolet absorber, a defoaming agent, a leveling agent, and a solvent.

[0119] The first resin layer may have a fixing portion for fixing the first conductive layer, the insulating layer, and the second conductive layer. The first resin layer having the fixing portion can suppress the first conductive layer, the insulating layer, and the second conductive layer from being displaced on the first resin layer.

[0120] The first resin layer and the second resin layer may have either an insertion portion or an opening portion.

[0121] When the first resin layer has either one of the insertion portion and the opening portion, and the second resin layer has at least the other, the first resin layer and the second resin layer can be fitted together by inserting the insertion portion into the opening portion.

[0122] (First conductive layer and second conductive layer)

[0123] The first conductive layer and the second conductive layer may include at least one of a metal and a metal oxide.

[0124] Examples of the metal include silver, gold, copper, palladium, platinum, titanium, chromium, nickel, aluminum, zirconium, tungsten, vanadium, rhodium, iridium, and alloys thereof.

[0125] Examples of the metal oxide include zinc oxide (ZnO), tin oxide (SnO 2 ), indium tin oxide (ITO), aluminum oxide (Al 2 O 3 ), and titanium oxide (TiO 2 ).

[0126] From the viewpoint of conductivity, the average thickness of the first conductive layer and the second conductive layer can be appropriately set according to the application, etc. Considering the ease of arrangement on the concave or concavo-convex portions of the first resin layer, it is preferably 0.1 mm to 10 mm.

[0127] In the present invention, the average thickness is obtained by measuring the thickness at two locations of the layer using a measuring instrument and taking the average value thereof.

[0128] The materials contained in the first conductive layer and the second conductive layer, the average thickness of the layers, etc. may be the same or different.

[0129] (Insulation layer)

[0130] The insulating layer is preferably a cured product of a resin composition containing an insulating resin.

[0131] Examples of the insulating resin include curable resins such as thermoplastic resins, thermosetting resins, and photocurable resins.

[0132] The photocurable resin may be any resin having one or more unsaturated bonds in one molecule that initiate a crosslinking reaction by light. Specific examples of the photocurable resin include acrylic resins, urethane resins, polyester resins, polyether resins, epoxy resins, polybutadiene resins, polyimide resins, polyamide resins, silicone resins, and fluororesins.

[0133] Since the thermoplastic resin and the thermosetting resin have been described above, their description is omitted here.

[0134] The resin composition may also contain various additives such as a curing agent, a curing accelerator, a photopolymerization initiator, a filler, a release agent, a flame retardant, a colorant, a plasticizer, a silane coupling agent, a rust inhibitor, a copper damage inhibitor, a reducing agent, an antioxidant, a tackifying resin, an ultraviolet absorber, a defoaming agent, a leveling agent, a solvent, and the like.

[0135] From the viewpoint of insulation, the average thickness of the insulating layer can be appropriately set according to the application, etc. In consideration of the ease of arrangement on the concave portions or the concavo-convex portions of the first resin layer, the average thickness is preferably 0.01 mm to 10 mm.

[0136] (Second resin layer)

[0137] The laminate of the present invention may further include a second resin layer on the side of the second conductive layer opposite to the insulating layer. By including the second resin layer, positional deviation of the first conductive layer, the insulating layer, and the second conductive layer on the first resin layer can be suppressed.

[0138] The second resin layer may also have a concave portion, a convex portion, or a concavo-convex portion. The concave portion, the convex portion, or the concavo-convex portion provided on the second resin layer may also be provided corresponding to the shape of the second conductive layer. By making the concave portion of the second resin layer correspond to the shape of the second conductive layer, the position of the second conductive layer can be fixed by the second resin layer.

[0139] For example, when the total thickness of the first conductive layer, the insulating layer, and the second conductive layer is greater than the depth of the concave portion of the first resin layer, a concave portion matching the shape of the second conductive layer may be provided in the second resin layer. In this case, the area of ​​the concave portion of the second resin layer is preferably greater than the area of ​​the second conductive layer.

[0140] In addition, when the total thickness of the first conductive layer, the insulating layer, and the second conductive layer is smaller than the depth of the recessed portion of the first resin layer, a convex portion may be provided at a position of the second resin layer corresponding to the second conductive layer. The number of convex portions may be one or more than two.

[0141] The second resin layer is preferably a cured product of a resin composition containing a thermosetting resin. Since the thermosetting resin and the resin composition have been described above, their description is omitted here.

[0142] The second resin layer may have a fixing portion for fixing the first conductive layer, the insulating layer, and the second conductive layer. The second resin layer having the fixing portion tends to suppress positional displacement of the first conductive layer, the insulating layer, and the second conductive layer on the first resin layer.

[0143] (Adhesive layer)

[0144] The laminated body of the present invention may include an adhesive layer between the first conductive layer and the insulating layer, and between the insulating layer and the second conductive layer.

[0145] The laminated body of the present invention may include an adhesive layer between the first resin layer and the first conductive layer, and between the second conductive layer and the second resin layer.

[0146] The first resin layer and the second resin layer may be bonded together by adjusting the size of the adhesive layer provided between any of the layers.

[0147] The adhesive layer preferably contains a resin that is solid at 25° C. Thus, when the first conductive layer, the adhesive layer, the insulating layer, etc. are laminated on the surface of the first resin layer, the thickness of the adhesive layer can be suppressed from changing, and the distance between the first conductive layer and the insulating layer, the distance between the first conductive layer and the second conductive layer, the distance between the second conductive layer and the insulating layer, etc. can be suppressed from changing.

[0148] Examples of the resin that is solid at 25°C include polyimide resins, polyamideimide resins, polyamide resins, polyetherimide resins, polybenzoxazole resins, polybenzimidazole resins, polystyrene resins, acrylonitrile-butadiene-styrene copolymer resins, acrylonitrile-styrene copolymer resins, polyethylene resins, polypropylene resins, polyvinyl chloride resins, polyvinylidene chloride resins, polycarbonate resins, (meth)acrylic resins, polyester resins, polyacetal resins, polyphenylene sulfide resins (PPS) phenolic resins, and the like.

[0149] The resin that is solid at 25°C is preferably a thermoplastic resin. The adhesive layer containing a thermoplastic resin can be bonded by heating. In addition, for example, after the first conductive layer is attached to one side of the adhesive layer containing a thermoplastic resin, if it is cooled, the adhesive layer returns to a solid state, but it is also possible to attach an insulating layer to the other side of the adhesive layer by heating it again, which is excellent in workability.

[0150] The content of the resin that is solid under an environment of 25° C. is preferably 10% by mass to 100% by mass, and more preferably 60% by mass to 80% by mass, based on the total mass of the adhesive layer.

[0151] The adhesive layer may contain various additives such as fillers, release agents, flame retardants, colorants, plasticizers, silane coupling agents, rust inhibitors, copper damage inhibitors, reducing agents, antioxidants, tackifying resins, ultraviolet absorbers, defoamers, leveling agents, solvents, and the like.

[0152] From the viewpoint of adhesiveness, the average thickness of the adhesive layer is preferably 1 μm to 5000 μm, more preferably 20 μm to 1000 μm, and further preferably 50 μm to 800 μm.

[0153] (Heat sink)

[0154] The laminated body of the present invention may include a heat sink on the first resin layer side surface of the first conductive layer or the second resin layer side surface of the second conductive layer.

[0155] As the heat sink, a conventionally known heat sink can be used, and components etc. may be bonded.

[0156] (use)

[0157] The laminated body of the present invention can be suitably used for manufacturing a power module (PM).

[0158] The use of the laminate of the present invention is not limited to PM applications, and can also be used for other electrical system components, control system components, drive system components, weak current related components, home appliances, decorative components, etc.

[0159] Below, refer to Figure 1 to Figure 6 , an embodiment of the laminated body of the present invention is described. It should be noted that the disclosed laminated body is not limited to Figure 1 to Figure 6 The method shown.

[0160] Figure 1 is a perspective view showing one embodiment of the laminated body of the present invention, Figure 3 is its cross-sectional view. Figure 2 is a perspective view showing another embodiment of the laminated body of the present invention, Figure 4 is its cross-sectional view. Figure 1 and Figure 2 , the illustration of the adhesive layer between the layers is omitted.

[0161] Figure 1 The laminated body 10 shown includes a first resin layer 11 , a first conductive layer 12 , an insulating layer 13 , a second conductive layer 14 , and a second resin layer 16 in this order.

[0162] Figure 2 The laminated body 20 shown includes a first resin layer 21 , a first conductive layer 22 , an insulating layer 23 , a second conductive layer 24 , and a second resin layer 26 in this order.

[0163] like Figure 1 and Figure 2 As shown, the second resin layer may also have an opening. Thus, a heat sink or the like can be arranged on the surface of the second conductive layer or the like. The shape of the opening is not particularly limited, and is preferably adjusted appropriately according to the application.

[0164] like Figure 1 and Figure 2 As shown in FIG. 1 , the first conductive layer and the second conductive layer may protrude outward from the outer periphery of the first resin layer and the second resin layer, thereby enabling connection with other components such as wiring.

[0165] Figure 3 The laminate 30 shown includes a first resin layer 11, an adhesive layer 15, a first conductive layer 12, an adhesive layer 15, an insulating layer 13, an adhesive layer 15, a second conductive layer 14, an adhesive layer 15, and a second resin layer 16. The materials of the adhesive layer 15 provided between the layers may be the same or different.

[0166] like Figure 3 As shown, the first resin layer 11 has a housing portion including a stepped recessed portion, and the adhesive layer 15, the first conductive layer 12, the adhesive layer 15, the insulating layer 13, the adhesive layer 15, the second conductive layer 14 and the adhesive layer 15 are arranged in the housing portion.

[0167] exist Figure 3 In the embodiment, the first conductive layer 12, the insulating layer 13, and the second conductive layer 14 are accommodated in different levels of the stepped concave portion. Thus, thermal durability can be improved.

[0168] exist Figure 3 In the illustrated laminated body 30 , the first resin layer 11 and the second resin layer 16 are bonded together via an adhesive layer 15 .

[0169] Figure 4 The laminate 20 shown includes a first resin layer 21, an adhesive layer 25, a first conductive layer 22, an adhesive layer 25, an insulating layer 23, an adhesive layer 25, a second conductive layer 24, an adhesive layer 25, and a second resin layer 26. The materials of the adhesive layer 25 provided between the layers may be the same or different.

[0170] like Figure 4 As shown, the first resin layer 21 has a housing portion including a stepped recessed portion, and the adhesive layer 25, the first conductive layer 22, the adhesive layer 25, the insulating layer 23, the adhesive layer 25, the second conductive layer 24 and the adhesive layer 25 are arranged in the housing portion.

[0171] exist Figure 4 In the embodiment, the first conductive layer 22, the insulating layer 23, and the second conductive layer 24 are housed in different levels of the stepped recessed portion. Thus, thermal durability can be improved.

[0172] In addition, if Figure 4 As shown, the first resin layer 21 has an insertion portion 27 which is inserted into an opening (not shown) of the second resin layer 26. The insertion portion 27 may be provided at any position as long as the second resin layer 26 can be inserted.

[0173] In addition, Figure 4 In the illustrated laminated body 20 , the first resin layer 21 and the second resin layer 26 are bonded together via an adhesive layer 25 .

[0174] Figure 5 This is a cross-sectional view showing another embodiment of the laminated body of the present invention.

[0175] Figure 5 The laminated body 30 shown includes a first resin layer 31, a heat sink 37, an adhesive layer 35, a first conductive layer 32, an adhesive layer 35, an insulating layer 33, an adhesive layer 35, a second conductive layer 34, an adhesive layer 35, and a second resin layer 36. The materials of the adhesive layer 35 provided between the layers may be the same or different.

[0176] like Figure 5 As shown, the first resin layer 31 has a receiving portion including a stepped recessed portion, and a heat sink 37, an adhesive layer 35, a first conductive layer 32, an adhesive layer 35, an insulating layer 33, an adhesive layer 35, a second conductive layer 34 and an adhesive layer 35 are arranged in the receiving portion.

[0177] exist Figure 5 In the embodiment, the first conductive layer, the insulating layer, and the second conductive layer are accommodated in different levels of the stepped concave portion. Thus, thermal durability can be improved.

[0178] In addition, Figure 5 In the illustrated laminated body 30 , the first resin layer 31 and the second resin layer 36 are bonded together via an adhesive layer 35 .

[0179] Figure 6 This is a perspective view showing one embodiment of the first resin layer included in the laminated body of the present invention.

[0180] like Figure 6 As shown, the first resin layer 100 has a plurality of receiving portions 101 , and the receiving portions 101 include concave portions 102A and convex portions 102B.

[0181] Furthermore, the first resin layer 100 includes a fixing portion 103 and an opening 104 .

[0182] like Figure 6 As shown, the first resin layer 100 may have openings between the housing portions 101. Thus, other components such as connection wirings, etc., which are arranged on the first resin layer 100, can be connected through the openings.

[0183] like Figure 3 to Figure 6 As shown in the figure, the sizes of the peripheries of the adhesive layer, the first conductive layer, the insulating layer, and the second conductive layer may be different. When the sizes of the peripheries of the adhesive layer, the first conductive layer, the insulating layer, and the second conductive layer are different, the size of the inner periphery of the concave portion of the first resin layer is preferably greater than the size of the periphery of the layer having the largest periphery among the adhesive layer, the first conductive layer, the insulating layer, and the second conductive layer.

[0184] [Method for producing laminated body]

[0185] The method for producing a laminate of the present invention comprises:

[0186] a preparation step of preparing a first resin layer having a receiving portion on at least one surface thereof; and

[0187] a lamination step of laminating a first conductive layer, an insulating layer, and a second conductive layer on the surface of the first resin layer;

[0188] In the lamination step, at least the first conductive layer is disposed in the housing portion of the first resin layer.

[0189] According to the method for producing a laminated body of the present invention, a laminated body having excellent thermal durability can be produced. The reason for achieving the above effect is not clear, but it is presumed as follows.

[0190] The manufacturing method of the laminate of the present invention is not insert molding, but is manufactured by separately manufacturing each layer and laminating. Therefore, in the laminate manufactured by insert molding, the first conductive layer is buried in the first resin layer and is completely in close contact, while in the laminate manufactured by the manufacturing method of the present invention, the first resin layer and the first conductive layer are not completely in close contact, and the internal stress generated during heating can be alleviated. As a result, the generation of cracks and the deformation of the conductive layer and the resin layer can be suppressed, and it is estimated that the thermal durability is improved.

[0191] The method for producing a laminate of the present invention may include a second lamination step of further laminating a second resin layer on the side of the second conductive layer opposite to the insulating layer.

[0192] (Preparation process)

[0193] The first resin layer has been described above, and therefore its description is omitted here.

[0194] The method for producing the first resin layer is not particularly limited, and the first resin layer can be produced by injection molding or the like.

[0195] (Lamination process)

[0196] The method for producing a laminate of the present invention includes a lamination step of laminating a first conductive layer, an insulating layer, and a second conductive layer on the surface of a first resin layer.

[0197] In the lamination step, at least the first conductive layer is disposed in the housing portion of the first resin layer. Preferably, the first insulating layer and the second conductive layer are disposed in the housing portion of the resin layer.

[0198] Regarding lamination of the first conductive layer, the insulating layer, and the second conductive layer on the surface of the first resin layer, an adhesive layer may be disposed between the layers. When the adhesive layer contains a thermoplastic or thermosetting resin, the layers can be bonded by heating.

[0199] When an adhesive layer is disposed between the layers, it is preferable that the adhesive layer is disposed in the housing portion of the first resin layer together with the first conductive layer, the insulating layer, and the second conductive layer in the lamination step.

[0200] In the lamination step, a heat sink may be disposed on the side of the first conductive layer opposite to the insulating layer or on the side of the second conductive layer opposite to the insulating layer.

[0201] When a heat sink is disposed, it is preferable that the heat sink is disposed in the housing portion of the first resin layer together with the first conductive layer, the insulating layer, and the second conductive layer in the lamination step.

[0202] The first conductive layer, the second conductive layer, the insulating layer, the adhesive layer, and the heat sink have been described above, and thus their description is omitted here.

[0203] The first conductive layer, the second conductive layer, the insulating layer, the adhesive layer, and the heat sink may be those produced by a conventionally known method, or may be commercially available products.

[0204] (Second Lamination Step)

[0205] The second resin layer has been described above, and therefore its description is omitted here.

[0206] The method for producing the second resin layer is not particularly limited, and the second resin layer can be produced by injection molding or the like.

[0207] Regarding lamination of the second resin layer, an adhesive layer may be disposed between the second resin layer and the second conductive layer. When the adhesive layer contains a thermoplastic or thermosetting resin, the layers may be bonded by heating.

[0208] Alternatively, the first resin layer and the second resin layer may be bonded together using an adhesive layer.

[0209] When the first resin layer has either one of the insertion portion and the opening portion, and the second resin layer has at least the other, the first resin layer and the second resin layer can be fitted together by inserting the insertion portion into the opening portion.

[0210] [Conductive laminate]

[0211] The conductive laminate of the present invention comprises a first conductive layer, an insulating layer, and a second conductive layer in this order, and comprises adhesive layers between the first conductive layer and the insulating layer and between the insulating layer and the second conductive layer.

[0212] Conventionally, the first conductive layer, the insulating layer, and the second conductive layer are stacked in sequence without an adhesive layer. At this time, since air enters between the first conductive layer and the insulating layer, and between the insulating layer and the second conductive layer, and partial discharge occurs, the distance (gap) between them is enlarged to a certain extent to suppress the occurrence of partial discharge. Therefore, the gap between the first conductive layer and the insulating layer, and between the insulating layer and the second conductive layer cannot be narrowed.

[0213] In contrast, the conductive laminate of the above structure has an insulating layer disposed between the first conductive layer and the second conductive layer via an adhesive layer, so that the first conductive layer and the second conductive layer can be arranged in parallel with a narrow gap. In this layer structure, even if the adhesive layer contains pores, the pores can be reduced by applying pressure in the thickness direction, and partial discharge caused by the pores can be suppressed.

[0214] The first conductive layer, the second conductive layer and the insulating layer have the same meaning as the first conductive layer, the second conductive layer and the insulating layer in the above-mentioned laminate. The first conductive layer and the second conductive layer may also be bus bars. The first conductive layer may be a P bus bar or an N bus bar, and the second conductive layer paired with the first conductive layer may be an N bus bar opposite to the first conductive layer or a P bus bar.

[0215] The conductive laminate of the present invention can fully suppress partial discharge, and therefore, as in the above-mentioned laminate, a laminate containing the conductive laminate can be manufactured by separately manufacturing the first resin layer and the second resin layer in advance and stacking them. In addition, the conductive laminate of the present invention can be insert-molded to manufacture a laminate in which the conductive laminate of the present invention is attached to a housing.

[0216] Preferred embodiments of the conductive laminate of the present invention are exemplified below, but the conductive laminate of the present invention is not limited to these embodiments.

[0217] <First Conductive Laminated Body>

[0218] The first conductive laminate has a region where the peripheral end of the first conductive layer is located inwardly relative to the peripheral end of the second conductive layer, and in the region, the end of the adhesive layer on the first conductive layer side is aligned with the end of the first conductive layer or is longer than the end of the first conductive layer by less than 10 mm. A schematic cross-sectional view of one embodiment of the first conductive laminate is shown in Fig. 9 .

[0219] Regarding the adhesive layer 45 in the region where the first conductive layer 42 is disposed, even if voids are included in the adhesive layer 45, they can be reduced by applying pressure in the thickness direction from the outside of the first conductive layer 42. On the other hand, since the adhesive layer 45 extending from the end of the first conductive layer 42 is not pressurized, it is difficult to reduce the voids and this may also cause partial discharge. Therefore, it is preferred that the end of the adhesive layer on the first conductive layer side does not extend from the end of the first conductive layer as much as possible.

[0220] exist Fig. 9 In the embodiment, the end of the adhesive layer 45 on the first conductive layer 42 side extends out from the end of the first conductive layer 42, but the extending length is preferably set within 10 mm, more preferably within 3 mm, further preferably within 1 mm, and particularly preferably within 0.5 mm. The end of the adhesive layer 45 on the first conductive layer 42 side is extremely preferably aligned with the end of the first conductive layer 42.

[0221] exist Fig. 9 In the embodiment, the length of the second conductive layer 44 is longer than the insulating layer 43, but may be aligned with the length of the insulating layer 43. In the first conductive laminate, the length of the adhesive layer 45 on the second conductive layer 44 side is not particularly limited, and may be aligned with the end of the insulating layer 43, may be aligned with the end of the second conductive layer 44, or may be longer than the insulating layer 43 and shorter than the second conductive layer 44.

[0222] In the case of the first conductive stack, from the viewpoint of preventing discharge from the end of the first conductive layer 42 around the end of the insulating layer 43 to the second conductive layer 44, the length from the end of the first conductive layer 42 to the end of the insulating layer 43 is preferably sufficiently long, for example, more preferably greater than 20 mm.

[0223] exist Fig. 9 In the embodiment, the first conductive layer 42 is shorter than the second conductive layer 44, but the first conductive layer 42 and the second conductive layer 44 may be swapped. In this case, it is preferred that the end of the adhesive layer 45 on the second conductive layer 44 side is aligned with the end of the second conductive layer 44 or is longer than the end of the second conductive layer 44 by less than 10 mm.

[0224] In the first conductive laminate, an adhesive layer 45 may be provided on at least a portion of the end surface of the insulating layer 43 .

[0225] <Second Conductive Laminated Body>

[0226] The second conductive laminate has a region where the peripheral end of the first conductive layer is located inwardly of the peripheral end of the second conductive layer, and in the region, the end of the adhesive layer on the first conductive layer side is aligned with the end of the insulating layer. Fig.10 .

[0227] exist Fig.10 In the embodiment, the length of the second conductive layer 44 is aligned with the length of the insulating layer 43, but may be longer than the insulating layer 43. In the second conductive laminate, the length of the adhesive layer 45 on the second conductive layer 44 side is not particularly limited, and may be aligned with the end of the insulating layer 43, may be aligned with the end of the second conductive layer 44, or may be longer than the insulating layer 43 and shorter than the second conductive layer 44.

[0228] exist Fig.10 In the embodiment, the first conductive layer 42 is shorter than the second conductive layer 44 . However, the first conductive layer 42 and the second conductive layer 44 may be switched so that the second conductive layer 44 is shorter than the first conductive layer 42 .

[0229] In the second conductive laminate, an adhesive layer 45 may be provided on at least a portion of the end surface of the insulating layer 43 .

[0230] Compared with the second conductive laminate, the adhesive layer 45 on the first conductive layer 42 side in the first conductive laminate has a shorter extension length, so it is easy to play the function of preventing partial discharge. Conventionally, the conductive layer and the insulating layer are provided without an adhesive layer, so even if the distance between the conductive layer and the insulating layer is narrowed, partial discharge is suppressed compared with the past.

[0231] From the viewpoint of suppressing partial discharge at the extended portion of the adhesive layer 45 on the first conductive layer 42 side, it is preferred to cover the end of the first conductive layer 42 with a resin layer. For example, the end of the first conductive layer 42 may be covered by the first resin layer or the second resin layer in the laminate.

[0232] As a laminate having a second conductive laminate, such as Fig.11 As shown in FIG. 1 , the second resin layer 46 disposed on the outside of the second conductive layer 44 may be extended to the end of the second conductive layer 44. The first resin layer 41 disposed on the outside of the first conductive layer 42 may be arranged with a slack from the end of the first conductive layer 42 as in the above-mentioned laminated body so as to relieve the internal stress generated by heating, or may be arranged as in FIG. Fig.11 As shown, it is provided so as to cover the end portion of the first conductive layer 42 .

[0233] Fig.11 The laminated body can be manufactured by separately manufacturing the first resin layer 41 and the second resin layer 46 in advance, and then laminating the first resin layer 41, two conductive laminated bodies, and the second resin layer 46, or can be manufactured by insert molding using the second conductive laminated body.

[0234] <Third Conductive Laminated Body>

[0235] The third conductive laminate has a region where the peripheral end of the first conductive layer is located inwardly of the peripheral end of the second conductive layer, and in the region, an adhesive layer is provided on at least a portion of the end surface of the first conductive layer. Fig.12 .

[0236] In the third conductive laminate, since the adhesive layer 45 is provided on at least a portion of the end surface of the first conductive layer 42, partial discharge from the end surface of the first conductive layer 42 toward the second conductive layer 44 or partial discharge from the end surface of the second conductive layer 44 toward the first conductive layer 42 is suppressed.

[0237] The adhesive layer 45 provided on at least a portion of the end surface of the first conductive layer 42 may be made of the same material as or different from the adhesive layer 45 provided between the first conductive layer 42 and the insulating layer 43 or between the insulating layer 43 and the second conductive layer 44 .

[0238] It should be noted that Fig.12 Shown in Fig.10 Although the embodiment shown above further provides an adhesive layer on the end surface of the first conductive layer in the second conductive laminate, an embodiment may further provide an adhesive layer on the end surface of the first conductive layer in the first conductive laminate.

[0239] <Fourth Conductive Laminated Body>

[0240] In the fourth conductive laminate, an insulating layer is provided on an end surface of at least one of the first conductive layer and the second conductive layer.

[0241] In the fourth conductive laminate, the insulating layer 43 may be Fig.13 As shown, the end surface of the first conductive layer 42 or the second conductive layer 44 may also be provided as Fig.14 As shown, it is provided on the end surfaces of both the first conductive layer 42 and the second conductive layer 44 .

[0242] By providing the insulating layer 43 on at least one end surface of the first conductive layer 42 and the second conductive layer 44, partial discharge from the end surface of the first conductive layer 42 toward the second conductive layer 44 or partial discharge from the end surface of the second conductive layer 44 toward the first conductive layer 42 is suppressed.

[0243] The insulating layer 43 disposed on the end surface of at least one of the first conductive layer 42 and the second conductive layer 44 may be provided as a separate component from the insulating layer 43 disposed between the first conductive layer 42 and the second conductive layer 44 or may be provided as an integral component.

[0244] like Fig.15 As shown, the insulating layer provided on at least one end surface of the end portions of the first conductive layer 42 and the second conductive layer 44 may further extend to a portion of the outer side surface of the first conductive layer.

[0245] <Fifth Conductive Laminated Body>

[0246] In the fifth conductive laminate, the first conductive layer or the second conductive layer is covered. Fig.16 By adopting the fifth conductive laminate, partial discharge from the end of the first conductive layer 42 to the second conductive layer 44 or partial discharge from the end of the second conductive layer 44 to the first conductive layer 42 is suppressed.

[0247] like Figure 12 to Figure 16 As shown, in cases where the end of the first conductive layer 42 is aligned with the end of the second conductive layer 44, and the length from the end of the first conductive layer 42 around the insulating layer 43 to the second conductive layer 44 cannot be sufficiently extended, from the viewpoint of further preventing local discharge, it is preferred to use a fourth conductive stack or a fifth conductive stack.

[0248] <Sixth and Seventh Conductive Laminates>

[0249] like Figures 9 to 16 As shown in FIG. 1 , the conductive laminate may be planar or may have a bent portion bent in the thickness direction as in the sixth conductive laminate. Fig.17 In the conductive laminate, the number of bent portions may be one or more.

[0250] In addition, as in the seventh conductive laminate, at least one of the first conductive layer side and the second conductive layer side may have a protrusion protruding in the thickness direction. Fig.18 .exist Fig.18 In the embodiment, the thickness of a part of the insulating layer 43 becomes thicker to form a protruding portion.

[0251] Preferably, the angle θ1 of the bent portion and the angle θ2 of the rising portion of the protrusion are independently greater than 90°. If the angle θ1 and the angle θ2 are greater than 90°, even if the adhesive layer contains pores, the pores can be effectively reduced by pressurization from the thickness direction. In addition, if the angle θ1 and the angle θ2 are greater than 90°, each layer is fully pressurized, so the adhesion between the layers is improved and the peeling between the layers is suppressed. It should be noted that when the conductive laminate is planar, the angle θ1 is 180°. In the case of a bent portion or a protrusion, the angle θ1 or the angle θ2 is less than 180°.

[0252] It should be noted that the bent portion and the raised portion of the protrusion may be bent with or without curvature. In addition, the same is true for the corners other than the raised portion of the protrusion, which may be bent with or without curvature.

[0253] [Method for producing conductive laminate]

[0254] The conductive laminate of the present invention may be produced by any method as long as the above-mentioned structure can be achieved.

[0255] For example, an intermediate 1 having an adhesive layer on a first conductive layer and an intermediate 2 having an adhesive layer on a second conductive layer may be prepared separately, and intermediates 1 and 2 may be overlapped on the insulating layer in such a manner that the adhesive layer of intermediate 1 and the adhesive layer of intermediate 2 are in contact with the insulating layer, thereby producing a conductive laminate.

[0256] Description of Reference Numerals

[0257] 10, 20, 30: Laminated

[0258] 11, 21, 31, 41: 1st resin layer

[0259] 12, 22, 32, 42: 1st conductive layer

[0260] 13, 23, 33, 43: Insulation layer

[0261] 14, 24, 34, 44: Second conductive layer

[0262] 15, 25, 35, 45: Adhesive layer

[0263] 16, 26, 36, 46: Second resin layer

[0264] 47: Insertion

[0265] 37: Heat sink

[0266] 100: 1st resin layer

[0267] 101: Containment

[0268] 102A: Concave portion

[0269] 102B: convex part

[0270] 103: Fixed part

[0271] 104: Opening

[0272] 105: 1st conductive layer

[0273] 106: Second conductive layer

Claims

1. A laminate comprising: 1st resin layer; A first conductive layer; Insulation; and The second conductive layer, The first resin layer has a receiving portion, The first conductive layer is disposed in the housing portion of the first resin layer.

2. The laminate according to claim 1, wherein The receiving portion includes a concave portion or a concave-convex portion.

3. The laminate according to claim 1, wherein The first conductive layer, the insulating layer, and the second conductive layer are arranged in the housing portion of the first resin layer.

4. The laminate according to claim 1 or 2, wherein: The area of ​​the housing portion of the first resin layer is equal to or larger than the area of ​​the first conductive layer.

5. The laminate according to any one of claims 1 to 4, wherein A second resin layer is further provided on the side of the second conductive layer opposite to the insulating layer.

6. The laminate according to any one of claims 1 to 5, wherein An adhesive layer is provided between the first conductive layer and the insulating layer and between the insulating layer and the second conductive layer, and the adhesive layer contains a resin that is solid under an environment of 25° C.

7. The laminate according to any one of claims 1 to 6, wherein The first resin layer is a cured product of a resin composition containing a thermosetting resin.

8. The laminate according to claim 7, wherein: The thermosetting resin comprises an unsaturated polyester.

9. The laminate according to any one of claims 1 to 8, wherein The first resin layer has a fixing portion that fixes the first conductive layer, the insulating layer, and the second conductive layer.

10. A method for producing a laminate, comprising: A preparation step of preparing a first resin layer having a receiving portion on at least one surface thereof; and a lamination step of laminating a first conductive layer, an insulating layer, and a second conductive layer on a surface of the first resin layer; In the lamination step, at least the first conductive layer is disposed in the housing portion of the first resin layer.

11. A conductive laminate comprising, in order, a first conductive layer, an insulating layer and a second conductive layer, Adhesive layers are provided between the first conductive layer and the insulating layer, and between the insulating layer and the second conductive layer.

12. The conductive laminate according to claim 11 has a region where the peripheral end of the first conductive layer is closer to the inner side than the peripheral end of the second conductive layer, and in the region, the end of the adhesive layer on the first conductive layer side is aligned with the end of the first conductive layer or is longer than the end of the first conductive layer by less than 10 mm. 13 . The conductive laminate according to claim 11 , comprising a region where the peripheral end of the first conductive layer is located inside the peripheral end of the second conductive layer, and in which the end of the adhesive layer on the first conductive layer side is aligned with the end of the insulating layer.

14. The conductive laminate according to claim 11, comprising a region where the peripheral end of the first conductive layer is located inner than the peripheral end of the second conductive layer, and in the region, the end of the adhesive layer on the first conductive layer side is longer than the end of the first conductive layer by more than 20 mm.

15. The conductive laminate according to any one of claims 11 to 14, wherein An adhesive layer is provided on at least a portion of an end surface of the insulating layer. 16 . The conductive laminate according to claim 11 , comprising a region where the peripheral end of the first conductive layer is located inside the peripheral end of the second conductive layer, wherein the adhesive layer is provided on at least a portion of an end surface of the first conductive layer in the region.

17. The conductive laminate according to claim 11, 15 or 16, wherein: An insulating layer is provided on an end surface of at least one of the first conductive layer and the second conductive layer.

18. The conductive laminate according to claim 17, wherein The insulating layer provided on an end surface of at least one of the first conductive layer and the second conductive layer further extends to a portion of an outer side surface of the first conductive layer.

19. The conductive laminate according to claim 11, wherein The insulating layer covers the periphery of the first conductive layer or the second conductive layer. 20 . The conductive laminate according to claim 11 , comprising a bent portion bent in a thickness direction, wherein an angle of the bent portion is larger than 90° and smaller than 180°.

21. The conductive laminate according to any one of claims 11 to 20, wherein At least one of the first conductive layer side and the second conductive layer side has a protrusion protruding in the thickness direction, and the angle of the rising portion of the protrusion is larger than 90° and smaller than 180°.

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