A semiconductor automatic cleaning apparatus

Abstract

The application belongs to the technical field of cleaning equipment, and particularly relates to a kind of semiconductor automatic cleaning equipment, including cleaning box body, the inner wall rotation of cleaning box body left side is installed with circumferential rotation shaft, and circumferential rotation shaft is fixedly installed with driving disc, the surface of driving disc is fixedly installed with five extension frames that are annular array distribution, each semiconductor positioning disc is movably installed on each extension frame, the inner bottom wall rotation of cleaning box body is installed with inner container baffle, in the application, driving motor works, it will drive circumferential rotation shaft rotation, makes each extension frame rotate, in turn each semiconductor positioning disc moves, makes semiconductor that passes through roll soft brush can be cleaned and brushed, and because pin shaft movable gear is engaged transmission with positioning gear ring, when extension frame rotates, movable gear drives pin shaft rotation, in turn each semiconductor positioning disc rotates, so that each semiconductor on it can be cleaned and brushed, guarantee cleaning effect, and the drying effect after cleaning is better.

Description

TECHNICAL FIELD

[0001] The present application relates to an automatic cleaning device, in particular to a semiconductor automatic cleaning device. BACKGROUND

[0002] In the semiconductor industry equipment, the most talked about is the lithography machine, known as the crown of the integrated circuit industry; the semiconductor industry involves a variety of equipment, of which the most frequently used equipment in the early process is undoubtedly the semiconductor cleaning equipment.

[0003] As the announcement number CN212991034U provides a kind of high-speed automatic semiconductor plasma cleaning equipment, including rack and setting on the rack three-axis gantry mechanism, plasma cleaning head, conveying mechanism, automatic feeding mechanism, automatic discharging mechanism, identification mechanism, waste gas treatment system, the conveying mechanism is transversely set on the rack, the three-axis gantry mechanism is across the top of the conveying mechanism, the plasma cleaning head is set on the working end of the three-axis gantry mechanism, the automatic feeding mechanism, automatic discharging mechanism, conveying mechanism are at least two groups, two groups above automatic feeding mechanism, automatic discharging mechanism, conveying mechanism are transversely parallelly arranged on the rack;The utility model completes the automatic feeding and discharging of product, accurately conveys by conveying mechanism, makes plasma cleaning head fast positioning to the product position needing cleaning, improves the cleaning efficiency of equipment, can be compatible with different specifications of product, with good market application value.The prior art in the above has many advantages, but still has the following defects: the semiconductor automatic cleaning equipment is not convenient for fixing semiconductor, and the cleaning effect of semiconductor is poor;When the cleaned semiconductor is dried, batch of semiconductor needs to be transferred, so that use is not flexible.

[0004] Therefore, the present application designs a kind of semiconductor automatic cleaning equipment. SUMMARY

[0005] The main purpose of the present application is to provide a kind of semiconductor automatic cleaning equipment, to effectively solve the problem that the inventor proposes in the above background.

[0006] To achieve the above-mentioned purpose, the technical scheme adopted by the present application is as follows:

[0007] The utility model provides a kind of semiconductor automatic cleaning equipment, including cleaning box, the inner wall rotation of left side of the cleaning box is installed with circumferential rotation shaft, and driving disc is fixedly installed on circumferential rotation shaft, the surface of driving disc is fixedly installed with five annular array distribution extension frame, each the extension frame is movably installed with semiconductor positioning disc, the inner bottom wall rotation of cleaning box is installed with inner container baffle, and inner container baffle separates the cavity of cleaning box into left and right two parts, the top of inner container baffle is fixedly connected with protrusion, and protrusion is fixedly connected with movable box cover, movable box cover is located above the right side cavity part of cleaning box;

[0008] Semiconductor clamping assembly, which is installed on semiconductor positioning disc and used for fixing semiconductor to be cleaned.

[0009] Semiconductor cleaning assembly, which is used for cleaning semiconductor fixed on semiconductor clamping assembly.

[0010] First driving assembly, which is used for driving circumferential rotation shaft to rotate and cooperates with semiconductor cleaning assembly.

[0011] Self-rotation assembly, which is used for driving semiconductor positioning disc to rotate and cooperates with first driving assembly.

[0012] Drying assembly, which is used for drying cleaned semiconductor.

[0013] Second driving assembly, which is used for driving inner container baffle to rotate and cooperates with drying assembly.

[0014] Preferably, the semiconductor clamping assembly comprises U-shaped mounting seat, clamping shaft, crank, clamping head, steering gear, rack slide rod, the outer side of semiconductor positioning disc is fixedly installed with a plurality of groups of annular array distribution U-shaped mounting seat, each group of U-shaped mounting seat is two symmetrically arranged U-shaped mounting seats, clamping shaft is rotatably installed on each U-shaped mounting seat, crank is fixedly installed on clamping shaft, and the other end of crank is fixedly connected with clamping head, steering gear is fixedly installed on clamping shaft, rack slide rod is slidably installed on semiconductor positioning disc, and rack slide rod is in meshing transmission with steering gear.

[0015] Preferably, a plurality of annular array distribution grooves are formed on semiconductor positioning disc, rack slide rod is movably penetrated in groove, and external force sliding block is slidably connected in groove, rack slide rod is fixedly connected with external force sliding block, one-way screw rod is rotatably installed in groove, and external force sliding block is threadedly installed on one-way screw rod, the same number of operation grooves as grooves are formed on semiconductor positioning disc, one end of one-way screw rod extends into operation groove and is fixedly connected with hand wheel.

[0016] Preferably, the left side of the inner wall, the inner bottom wall and the left side of the inner tank baffle of the cleaning box body are provided with semiconductor cleaning assemblies, the semiconductor cleaning assembly comprises a cleaning mounting frame, a follow-up rotating shaft and a roller soft brush, the left side of the inner wall, the inner bottom wall and the left side of the inner tank baffle of the cleaning box body are fixedly provided with the cleaning mounting frame, the follow-up rotating shaft is rotatably arranged on the cleaning mounting frame, and the roller soft brush is fixedly arranged on the follow-up rotating shaft, and the distances from the three roller soft brushes to the circumferential rotating shaft are the same.

[0017] Preferably, the first driving assembly comprises a driving motor, a transmission sprocket and a transmission chain, the driving motor is fixedly arranged on the back of the cleaning box body, the output end of the driving motor is fixedly connected with the circumferential rotating shaft, the two follow-up rotating shafts on the cleaning box body extend out of the cleaning box body and are fixedly connected with the transmission sprockets, the end of the circumferential rotating shaft away from the driving motor extends out of the cleaning box body and is fixedly connected with another transmission sprocket, and the three transmission sprockets are connected through the transmission chain.

[0018] Preferably, the self-rotation assembly comprises a pin shaft, a movable gear and a positioning gear ring, the pin shaft is rotatably arranged on the extension frame, and the semiconductor positioning disc is fixedly arranged on the rear end of the pin shaft, the front end portion of the pin shaft is fixedly arranged with the movable gear, the positioning gear ring is fixedly arranged on the front side of the inner wall of the cleaning box body, the extension frame is located in the positioning gear ring, the movable gear is in meshing transmission with the positioning gear ring, the semiconductor positioning disc is located outside the positioning gear ring, and the roller soft brushes on the cleaning box body are towards the semiconductor positioning disc.

[0019] Preferably, the drying assembly comprises a joint fixing plate and a serpentine heating pipe, two upper and lower joint fixing plates are fixedly connected to the right side of the inner tank baffle, the serpentine heating pipe is arranged between the two joint fixing plates, and a sealing gasket is arranged at the connection between the bottom of the inner tank baffle and the cleaning box body.

[0020] Preferably, the second driving assembly comprises a driven switching shaft, a driven gear, a servo motor and a driving gear, the driven switching shaft is rotatably arranged on the bottom of the cleaning box body and is fixedly connected with the bottom of the inner tank baffle, the bottom end of the driven switching shaft is fixedly connected with the driven gear, the servo motor is fixedly arranged on the bottom of the cleaning box body, the output end of the servo motor is fixedly connected with the driving gear, and the driving gear is in meshing transmission with the driven gear.

[0021] Preferably, a plurality of supporting legs are fixedly connected to the bottom of the cleaning box body, and a plurality of anti-overflow holes are arranged at the lower end of the right side of the cleaning box body.

[0022] Preferably, a drainage pipe is fixedly connected to the bottom of the cleaning box body, a manual valve is arranged on the drainage pipe, and the drainage pipe is located on the left side of the inner tank baffle.

[0023] In view of this, compared with the prior art, the beneficial effects of the present application are:

[0024] (I) In the present application, the semiconductor is placed between the two clamping heads, the hand wheel is turned to rotate the one-way screw rod, the external force sliding block moves in the groove towards the center of the semiconductor positioning disc, that is, the external force sliding block pulls the rack slide rod, the rack slide rod drives the steering gear to rotate, and then the clamping shaft drives the crank to rotate by a certain angle, so that the two clamping heads are close to each other and the semiconductor is fixed. At least ten semiconductors to be cleaned can be fixed on a single semiconductor positioning disc to meet the batch cleaning requirement, and the semiconductor positioning discs are evenly distributed to further improve the cleaning efficiency.

[0025] (II) In the present application, when cleaning, clean water is injected into the cleaning tank, and the driving motor is driven to work, which drives the circumferential rotating shaft to rotate, so that each extension frame rotates, and then each semiconductor positioning disc moves, so that the semiconductor passing through the roller soft brush can be cleaned. Because the movable gear on the pin shaft is in meshing transmission with the positioning gear ring, when the extension frame rotates, the movable gear drives the pin shaft to rotate, and then each semiconductor positioning disc rotates, so that each semiconductor on it can be cleaned, ensuring the cleaning effect.

[0026] (III) In the present application, when the driving motor works, under the transmission action of the transmission sprocket and the transmission chain, the driven rotating shaft on the two cleaning mounting frames on the cleaning tank rotates to make the roller soft brush rotate for cleaning, avoiding the use of one side of the roller soft brush to cause large wear difference, and then affecting the cleaning effect.

[0027] (IV) In the present application, after cleaning is completed, the manual valve is opened, the clean water in the left chamber of the cleaning tank is discharged through the drain pipe, and after the drain is completed, the servo motor is started, the driving gear drives the driven gear to rotate, and then the driven switching shaft drives the inner container partition plate to rotate by one hundred and eighty degrees, so that the drying assembly moves into the left chamber of the cleaning tank. At this time, the movable tank cover is rotated to the upper side of the left chamber and covers it to reduce heat loss, which provides guarantee for the drying efficiency of the subsequent semiconductor, and the serpentine heating pipe works to dry the semiconductor, which has better use effect. BRIEF DESCRIPTION OF DRAWINGS

[0028] Figure 1 Fig. 1 is a schematic diagram of the internal structure of the semiconductor automatic cleaning equipment provided by the present application;

[0029] Figure 2 Fig. 2 is a schematic diagram of the internal structure of the semiconductor automatic cleaning equipment provided by the present application; Figure 1 Fig. 3 is a schematic diagram of the internal structure of the semiconductor automatic cleaning equipment provided by the present application after the inner container partition plate rotates by one hundred and eighty degrees;

[0030] Figure 3 Fig. 4 is a schematic diagram of the internal structure of the semiconductor automatic cleaning equipment provided by the present application; Figure 1 Fig. 5 is a schematic diagram of the internal structure of the semiconductor automatic cleaning equipment provided by the present application;

[0031] Figure 4 Fig. 1 is a schematic view of a single semiconductor positioning disc;

[0032] Figure 5 Fig. 2 is a schematic view of a partial structure in Fig. 1; Figure 4

[0033] Figure 6 Fig. 3 is a schematic view of the connection of each movable gear and a positioning gear ring;

[0034] Figure 7 Fig. 4 is a side view of an inner container partition plate;

[0035] Figure 8 Fig. 5 is a front view of a semiconductor automatic cleaning equipment provided by the present application;

[0036] Figure 9 Fig. 6 is a rear view of a semiconductor automatic cleaning equipment provided by the present application.

[0037] Fig. 1 is a schematic view of a single semiconductor positioning disc;

[0038] 1 - cleaning box; 100 - anti-overflow hole; 101 - movable box cover; 102 - support leg; 103 - liquid discharge pipe; 104 - manual valve;

[0039] 2 - circumferential rotating shaft; 201 - transmission sprocket; 202 - transmission chain; 203 - driving motor;

[0040] 3 - driving disc; 301 - extension frame; 302 - pin shaft; 303 - movable gear;

[0041] 4 - semiconductor positioning disc; 401 - clamping shaft; 402 - crank; 403 - clamping head; 404 - steering gear; 405 - rack slide rod; 406 - groove; 407 - external force sliding block; 408 - one-way screw; 409 - hand wheel;

[0042] 5 - inner container partition plate; 501 - joint fixing plate; 502 - serpentine heating pipe; 503 - sealing gasket; 504 - driven switching shaft; 505 - driven gear; 506 - servo motor; 507 - driving gear;

[0043] 6 - cleaning mounting frame; 601 - follow-up rotating shaft; 602 - roller soft brush;

[0044] 7 - positioning gear ring. DETAILED DESCRIPTION

[0045] ​With reference to the drawings of the embodiments of the present application, the technical solutions in the embodiments of the present application will be described clearly and completely. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present application.

[0046] Please refer to Figures 1-9 The present application provides the following embodiments:

[0047] A semiconductor automatic cleaning device, comprising a cleaning box body 1, a circumferential rotating shaft 2 is rotatably installed on the inner wall of the left side of the cleaning box body 1, and a driving disc 3 is fixedly installed on the circumferential rotating shaft 2, five extension frames 301 arranged in a ring array are fixedly installed on the surface of the driving disc 3, a semiconductor positioning disc 4 is movably installed on each extension frame 301, an inner container partition plate 5 is rotatably installed on the inner bottom wall of the cleaning box body 1, and the inner container partition plate 5 divides the cavity of the cleaning box body 1 into left and right two parts, a protrusion is fixedly connected to the top of the inner container partition plate 5, and a movable box cover 101 is fixedly connected to the protrusion, and the movable box cover 101 is located above the right side cavity part of the cleaning box body 1;

[0048] A semiconductor clamping assembly is installed on the semiconductor positioning disc 4, and the semiconductor clamping assembly is used for fixing the semiconductor to be cleaned;

[0049] A semiconductor cleaning assembly is used for cleaning the semiconductor fixed on the semiconductor clamping assembly;

[0050] A first driving assembly is used for driving the circumferential rotating shaft 2 to rotate, and the first driving assembly is used in cooperation with the semiconductor cleaning assembly;

[0051] A self-rotating assembly is used for driving the semiconductor positioning disc 4 to rotate, and the self-rotating assembly is used in cooperation with the first driving assembly;

[0052] A drying assembly is used for drying the cleaned semiconductor;

[0053] A second driving assembly is used for driving the inner container partition plate 5 to rotate, and the second driving assembly is used in cooperation with the drying assembly.

[0054] Specifically, the semiconductor clamping assembly comprises a U-shaped mounting seat, a clamping shaft 401, a crank 402, a clamping head 403, a steering gear 404, and a rack slide rod 405. A plurality of groups of U-shaped mounting seats are arranged in a ring array on the outer side of the semiconductor positioning disc 4. Each group of U-shaped mounting seats comprises two symmetrically arranged U-shaped mounting seats. The clamping shaft 401 is rotatably installed on each U-shaped mounting seat. The crank 402 is fixedly installed on the clamping shaft 401. The other end of the crank 402 is fixedly connected with the clamping head. The steering gear 404 is fixedly installed on the clamping shaft 401. The rack slide rod 405 is slidably installed on the semiconductor positioning disc 4 and is in meshing transmission with the steering gear 404. A plurality of grooves 406 are arranged in a ring array on the semiconductor positioning disc 4. The rack slide rod 405 movably penetrates the grooves 406. The external force sliding block 407 is slidably connected in the grooves 406. The rack slide rod 405 is fixedly connected with the external force sliding block 407. The one-way screw rod 408 is rotatably installed in the groove 406. The external force sliding block 407 is threadedly installed on the one-way screw rod 408. The same number of operation grooves as the grooves 406 are formed in the semiconductor positioning disc 4. One end of the one-way screw rod 408 extends into the operation groove and is fixedly connected with the hand wheel 409.

[0055] Specifically, the semiconductor cleaning assembly is installed on the left inner wall, the inner bottom wall of the cleaning box body 1 and the left side of the inner container partition plate 5. The semiconductor cleaning assembly comprises a cleaning mounting frame 6, a follow-up rotating shaft 601 and a roller soft brush 602. The cleaning mounting frame 6 is fixedly installed on the left inner wall, the inner bottom wall of the cleaning box body 1 and the left side of the inner container partition plate 5. The follow-up rotating shaft 601 is rotatably installed on the cleaning mounting frame 6. The roller soft brush 602 is fixedly installed on the follow-up rotating shaft 601. The distances from the three roller soft brushes 602 to the circumferential rotating shaft 2 are the same.

[0056] Specifically, the first driving assembly comprises a driving motor 203, a transmission sprocket 201 and a transmission chain 202. The driving motor 203 is fixedly installed on the back of the cleaning box body 1. The output end of the driving motor 203 is fixedly connected with the circumferential rotating shaft 2. The two follow-up rotating shafts 601 on the cleaning box body 1 extend out of the cleaning box body 1 and are fixedly connected with the transmission sprockets 201. The other end of the circumferential rotating shaft 2 away from the driving motor 203 extends out of the cleaning box body 1 and is fixedly connected with another transmission sprocket 201. The three transmission sprockets 201 are connected through the transmission chain 202.

[0057] Specifically, the rotation assembly includes a pin shaft 302, a movable gear 303 and a positioning gear ring 7, the pin shaft 302 is rotatably installed on the extension frame 301, and the semiconductor positioning disc 4 is fixedly installed on the rear end of the pin shaft 302, the front end of the pin shaft 302 is fixedly installed with the movable gear 303, the positioning gear ring 7 is fixedly installed on the inner wall of the front side of the cleaning box body 1, the extension frame 301 is located in the positioning gear ring 7, the movable gear 303 is in meshing transmission with the positioning gear ring 7, the semiconductor positioning disc 4 is located outside the positioning gear ring 7, and the roller soft brush 602 on the cleaning box body 1 faces the semiconductor positioning disc 4.

[0058] Specifically, the drying assembly includes a joint fixing plate 501 and a serpentine heating pipe 502, two up-and-down distributed joint fixing plates 501 are fixedly connected to the right side of the inner container partition plate 5, the serpentine heating pipe 502 is installed between the two joint fixing plates 501, a sealing gasket 503 is installed at the connection between the bottom of the inner container partition plate 5 and the cleaning box body 1, a drainage pipe 103 is fixedly connected to the bottom of the cleaning box body 1, a manual valve 104 is installed on the drainage pipe 103, and the drainage pipe 103 is located on the left side of the inner container partition plate 5.

[0059] The second driving assembly includes a driven switching shaft 504, a driven gear 505, a servo motor 506 and a driving gear 507, the driven switching shaft 504 is rotatably installed on the bottom of the cleaning box body 1 and is fixedly connected with the bottom of the inner container partition plate 5, the bottom end of the driven switching shaft 504 is fixedly connected with the driven gear 505, the servo motor 506 is fixedly installed on the bottom of the cleaning box body 1, the output end of the servo motor 506 is fixedly connected with the driving gear 507, the driving gear 507 is in meshing transmission with the driven gear 505, a plurality of supporting legs 102 are fixedly connected to the bottom of the cleaning box body 1, and a plurality of anti-overflow holes 100 are formed in the lower end of the right side of the cleaning box body 1.

[0060] The specific implementation of the embodiment is that initially, the movable box cover 101 is located on the right side above the cleaning box body 1, the left side chamber of the cleaning box body 1 is a cleaning chamber, and the upper side of the cleaning chamber is in an open state, so as to facilitate the fixing operation of the semiconductor and the injection of the cleaning water;

[0061] The semiconductor is placed between the two clamping heads 403, the hand wheel 409 is rotated to rotate the one-way screw rod 408, the external force sliding block 407 moves in the groove 406 towards the center of the semiconductor positioning disc 4, that is, the external force sliding block 407 pulls the rack sliding rod 405 to drive the steering gear 404 to rotate, and then the clamping shaft 401 drives the crank 402 to rotate by a certain angle, so that the two clamping heads 403 are close to each other and fix the semiconductor, at least ten semiconductors to be cleaned can be fixed on a single semiconductor positioning disc 4, so as to achieve batch cleaning, and the semiconductor positioning discs 4 are evenly distributed, which further improves the cleaning efficiency;

[0062] When cleaning, the cleaning water is injected into the cleaning box body 1, the driving motor 203 is driven to rotate the circumferential rotating shaft 2, the extension frame 301 is rotated, the semiconductor positioning disc 4 is moved, the semiconductor passing through the roller soft brush 602 can be cleaned, and the movable gear 303 on the pin shaft 302 is driven to rotate by the driving of the extension frame 301, the semiconductor positioning disc 4 is rotated, and each semiconductor on the semiconductor positioning disc 4 can be cleaned, so that the cleaning effect is guaranteed.

[0063] When the driving motor 203 is driven, the transmission chain wheel 201 and the transmission chain 202 are driven to rotate the two cleaning installation frames 6 on the cleaning box body 1, so that the roller soft brush 602 is rotated to clean, the wear difference of the roller soft brush 602 is avoided, and the cleaning effect is affected.

[0064] After cleaning, the manual valve 104 is opened, the cleaning water in the left chamber of the cleaning box body 1 is discharged through the drain pipe 103, the servo motor 506 is started after the cleaning water is discharged, the driving gear 507 drives the driven gear 505 to rotate, the driven switching shaft 504 drives the inner container partition plate 5 to rotate by 180 degrees, the drying assembly is moved into the left chamber of the cleaning box body 1, the movable box cover 101 is rotated to the left chamber and covers the left chamber, the heat loss is reduced, the subsequent semiconductor drying efficiency is guaranteed, the serpentine heating pipe 502 is used to dry the semiconductor, and the use effect is better.

[0065] In the description of the present specification, the description of the terms "one embodiment", "example", "specific example" and the like means that the specific features, structures, materials or characteristics described in combination with the embodiment or example are contained in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0066] The preferred embodiments of the application disclosed above are only used to help explain the application. The preferred embodiments do not describe all the details, and the application is not limited to the specific embodiments described. Obviously, many modifications and changes can be made according to the content of the present specification. The embodiments are selected and described in the present specification in order to better explain the principles and practical applications of the application, so that those skilled in the art can well understand and use the application. The application is limited by the claims and the entire scope and equivalents thereof.

Claims

1. An automatic semiconductor cleaning device, characterized in that: The utility model provides a semiconductor cleaning device, including the cleaning box (1), the inner wall rotation of left side of cleaning box (1) is installed with the circumference rotation axis (2), and the circumference rotation axis (2) is fixedly installed with drive disc (3), the surface of drive disc (3) is fixedly installed with five and is annular array distribution's extension frame (301), each extension frame (301) is movably installed with semiconductor positioning disc (4), the inner bottom wall rotation of cleaning box (1) is installed with inner container baffle (5), and inner container baffle (5) divides the cavity of cleaning box (1) into two parts, the top of inner container baffle (5) is fixedly connected protruding, and protruding is fixedly connected with movable box cover (101), movable box cover (101) is located the top of cleaning box (1) right side chamber portion; Semiconductor clamping assembly, the semiconductor clamping assembly is installed on semiconductor positioning disc (4), and semiconductor clamping assembly is used for fixing the semiconductor to be cleaned, the semiconductor clamping assembly includes U-shaped mounting seat, clamping shaft (401), crank (402), clamping head (403), steering gear (404), rack slide bar (405), the outer side of semiconductor positioning disc (4) is fixedly installed with several groups and is annular array distribution's U-shaped mounting seat, and each group of U-shaped mounting seat is two symmetrical U-shaped mounting seats, each U-shaped mounting seat is rotatably installed with clamping shaft (401), the clamping shaft (401) is fixedly installed with crank (402), and the other end of crank (402) is fixedly connected with clamping head, the clamping shaft (401) is fixedly installed with steering gear (404), and rack slide bar (405) is slidably installed on semiconductor positioning disc (4), and rack slide bar (405) is engaged with steering gear (404) and is driven, a plurality of recesses (406) are arranged in annular array on semiconductor positioning disc (4), the rack slide bar (405) is movably arranged in the recess (406), and the recess (406) is slidably connected with an external force sliding block (407), the rack slide bar (405) is fixedly connected with the external force sliding block (407), the recess (406) is rotatably installed with one-way screw rod (408), and the external force sliding block (407) is threadedly installed on the one-way screw rod (408), the recess (406) is provided with the same number of operation grooves as the recess (406), one end of the one-way screw rod (408) extends into the operation groove and is fixedly connected with a hand wheel (409); Semiconductor cleaning assembly, the semiconductor cleaning assembly is used for cleaning the semiconductor fixed on semiconductor clamping assembly; The first driving assembly is used for driving the circumferential rotating shaft (2) to rotate, and is used in cooperation with the semiconductor cleaning assembly, and comprises a driving motor (203), a transmission sprocket (201) and a transmission chain (202). The driving motor (203) is fixedly installed on the back of the cleaning box body (1), and the output end of the driving motor (203) is fixedly connected with the circumferential rotating shaft (2). Two follow-up rotating shafts (601) on the cleaning box body (1) are all extended to the outside of the cleaning box body (1) and are fixedly connected with the transmission sprockets (201). The end of the circumferential rotating shaft (2) away from the driving motor (203) is extended to the outside of the cleaning box body (1) and is fixedly connected with another transmission sprocket (201). The three transmission sprockets (201) are connected through the transmission chain (202). The self-rotation assembly is used for driving the semiconductor positioning disc (4) to rotate, and is used in cooperation with the first driving assembly, and comprises a pin shaft (302), a movable gear (303) and a positioning gear ring (7). The pin shaft (302) is rotatably installed on the extension frame (301), and the semiconductor positioning disc (4) is fixedly installed on the rear end of the pin shaft (302). The front end part of the pin shaft (302) is fixedly installed with the movable gear (303). The front side inner wall of the cleaning box body (1) is fixedly installed with the positioning gear ring (7). The extension frame (301) is located in the positioning gear ring (7), and the movable gear (303) is in meshing transmission with the positioning gear ring (7). The semiconductor positioning disc (4) is located outside the positioning gear ring (7). The roller soft brushes (602) on the cleaning box body (1) are towards the semiconductor positioning disc (4). The drying assembly is used for drying the semiconductor after cleaning. The second driving assembly is used for driving the inner container baffle (5) to rotate, and is used in cooperation with the drying assembly.

2. The apparatus according to claim 1, wherein: The left side inner wall, the inner bottom wall of the cleaning box body (1) and the left side of the inner container baffle (5) are all installed with the semiconductor cleaning assembly. The semiconductor cleaning assembly comprises a cleaning mounting frame (6), a follow-up rotating shaft (601) and a roller soft brush (602). The left side inner wall, the inner bottom wall of the cleaning box body (1) and the left side of the inner container baffle (5) are all fixedly installed with the cleaning mounting frame (6). The follow-up rotating shaft (601) is rotatably installed on the cleaning mounting frame (6), and the roller soft brush (602) is fixedly installed on the follow-up rotating shaft (601). The distances from the three roller soft brushes (602) to the circumferential rotating shaft (2) are the same.

3. The apparatus according to claim 2, wherein: The drying assembly comprises a joint fixing plate (501) and a serpentine heating pipe (502). The right side of the inner container baffle (5) is fixedly connected with two joint fixing plates (501) which are distributed in upper and lower positions. The serpentine heating pipe (502) is installed between the two joint fixing plates (501). The bottom of the inner container baffle (5) is installed with a sealing gasket (503) at the connection with the cleaning box body (1).

4. The apparatus according to claim 3, wherein: The second driving assembly comprises a driven switching shaft (504), a driven gear (505), a servo motor (506) and a driving gear (507), the bottom of the cleaning box body (1) is rotatably provided with the driven switching shaft (504), and the bottom of the driven switching shaft (504) is fixedly connected with the inner container partition plate (5); the bottom end of the driven switching shaft (504) is fixedly connected with the driven gear (505); the servo motor (506) is fixedly installed at the bottom of the cleaning box body (1), and the output end of the servo motor (506) is fixedly connected with the driving gear (507); and the driving gear (507) is in meshing transmission with the driven gear (505).

5. The apparatus according to claim 4, wherein: The bottom of the cleaning box body (1) is fixedly connected with a plurality of supporting legs (102), and the lower end of the right side of the cleaning box body (1) is provided with a plurality of anti-overflow holes (100).

6. The apparatus of claim 4 wherein: The bottom of the cleaning box body (1) is fixedly connected with a drainage pipe (103), a manual valve (104) is installed on the drainage pipe (103), and the drainage pipe (103) is located at the left side of the inner container partition plate (5).

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