Low-temperature thermocuring etchable adhesive composition as well as preparation method and application thereof

Abstract

The invention provides a low-temperature thermocuring etchable adhesive composition as well as a preparation method and application thereof.The composition comprises polyimide (A) and epoxy resin (B), the polyimide containing an aliphatic structure and an F element is introduced into the composition by optimizing the proportion, the solubility and transparency after film forming are improved, and the low-temperature thermocuring etchable adhesive composition can be applied to the field of film forming. And the composition is endowed with etching capability. Meanwhile, a medium-low temperature curing system is adopted, so that the curing temperature is reduced, the damage of high temperature to electronic devices is avoided, and the service life of the electronic devices is effectively prolonged. Besides, the composition has greater advantages when being applied as a single component, the prepared composition has higher cohesiveness, the Baikal ASTM grade is up to 5B, the mechanical strength is not lower than 200 MPa, the solvent resistance is excellent, the composition is particularly suitable for being applied to the field of semiconductors such as dielectric patterns and electronic packaging materials, the application effect is improved, and meanwhile the application cost is reduced. The production cost is reduced; and the production line efficiency is improved.

Description

Technical Field

[0001] The invention relates to the field of semiconductor materials, and in particular to a low-temperature heat-curable etchable adhesive composition, a preparation method and application thereof. Background Art

[0002] In specific application scenarios, in order to meet the needs of dielectric pattern formation, the graphic etching process becomes an indispensable part. However, due to its inherent chemical properties, traditional epoxy adhesive materials do not have the conditions to be etched, which greatly limits its use in related applications. In order to solve this problem, the industry introduced polyimide materials. Polyimide not only has good physical and chemical stability, but more importantly, it has the property of being etched. Therefore, the combined application of epoxy adhesive and polyimide has become an innovative solution. This combination not only significantly improves the adhesion to the material surface, but also gives the composition etching ability, thereby meeting the graphic etching requirements in specific application scenarios.

[0003] However, the existing combination application of epoxy adhesives and polyimides mostly exists in the form of covering films, pressed films, etc., all of which are multi-component systems. In this system, the separation performance between layers and films becomes a key factor affecting the application effect. Since the separation performance is difficult to be well improved and controlled, this limits the application scope of the epoxy adhesive and polyimide composition to a certain extent. In contrast, the single-component system has greater advantages in application because it can avoid the separation problems that may occur in the multi-component system, thereby improving the stability and reliability of the application.

[0004] In addition, in the field of semiconductor technology, the curing process of traditional epoxy adhesives and polyimides usually requires high temperature conditions. High temperature curing will not only increase the thermal stress of electronic components and shorten their service life, but also increase equipment costs and reduce production line efficiency. Therefore, the development of an epoxy adhesive and polyimide composition that can be cured under medium and low temperature conditions is of great significance for improving the performance of electronic components, reducing costs and improving production efficiency. Summary of the invention

[0005] The object of the present invention is to provide a composition of a heat-curing epoxy adhesive and polyimide and a preparation method thereof, so as to solve the problems of difficult to control separation performance and high curing temperature in the existing combined application of epoxy adhesive and polyimide proposed in the above technical background.

[0006] The first aspect of the present application is to provide a polyimide (A), wherein the structure of the polyimide (A) is as shown in Formula I,

[0007]

[0008] Wherein, R1 is a C4-C40 tetravalent organic group, preferably, it can be an organic group containing a benzene ring, and can be a monocyclic or condensed aliphatic ring or aromatic ring structure.

[0009] More preferably, R1 is a tetravalent organic group having 6 to 30 carbon atoms, more preferably a tetravalent organic group having 10 to 28 carbon atoms, and more preferably a tetravalent organic group having 12 to 26 carbon atoms.

[0010] More preferably, the benzene ring connected to R1 may have an aliphatic hydrocarbon side chain or group, and preferably, the number of C atoms in the aliphatic hydrocarbon side chain or group is ≤6, more preferably ≤5; for example, the benzene ring may have the following side chains or groups: one or a combination of methyl, ethyl, n-propyl, isopropyl, n-butyl, pentyl, cyclopentyl, hexyl, and cyclohexyl.

[0011] More preferably, the main chain structure of R2 is a C3-C10 aliphatic hydrocarbon group, preferably a C3-C8 aliphatic hydrocarbon group, and more preferably a C4-C8 aliphatic hydrocarbon group.

[0012] More preferably, the main chain of the aliphatic hydrocarbon group of R2 carries a side group, the side group contains a halogen F, and the side group can be a C5-C10 aromatic group or a C1-C6 aliphatic hydrocarbon group, such as phenyl, methyl, ethyl, cyclopropyl, n-propyl, isopropyl, n-butyl, pentyl, cyclopentyl, hexyl, cyclohexyl or a combination of several thereof.

[0013] Preferably, the mass proportion of the F element in the R2 is 10wt%-45wt%, preferably ≥20wt%, and more preferably ≥25wt%.

[0014] More preferably, in R2, the ratio of the number of C atoms to that of F atoms is ≥1:1, preferably ≥2:1, preferably ≥5:1.

[0015] More preferably, x is an integer greater than 1, preferably 3-18, more preferably 3-10.

[0016] More preferably, R1 and R2 may independently contain one or more of the following side groups: -OH, -NO2, -SH, -Cl, -Br, -COOH, -NH2, -CHO, -F, -SO2.

[0017] In a preferred embodiment, the structure of R1 is selected from:

[0018]

[0019] One or a combination of .

[0020] In a preferred embodiment, the structure of R2 is selected from:

[0021] One or a combination of .

[0022] The second aspect of the present application is to provide a composition, which contains A) polyimide and B) epoxy resin, and the mass ratio of the polyimide to the epoxy resin is (1-15): (0.5-12), preferably (1-12): (0.5-10), and more preferably (1-10): (0.5-8).

[0023] In a preferred embodiment, the mass ratio of the polyimide to the epoxy resin is (1-8):(0.5-6), preferably (1-6):(0.5-5), and more preferably (1-5):(0.5-4).

[0024] In a preferred embodiment, the epoxy resin includes one or a combination of bisphenol A epoxy resin, low viscosity resin, and modified resin.

[0025] Preferably, the modified resin is selected from one or more combinations of silicone resin modified epoxy resin, liquid nitrile rubber modified epoxy resin, polyester modified epoxy resin, and acrylate modified epoxy resin.

[0026] Preferably, the modification may be physical modification or chemical modification.

[0027] Preferably, the low-viscosity resin refers to an epoxy functional group-containing resin with a viscosity of ≤150 cp, preferably ≤120 cp, and more preferably ≤100 cp.

[0028] Preferably, the low-viscosity resin may be a glycidyl ether epoxy resin.

[0029] More preferably, in the low-viscosity resin, the number of epoxy functional groups contained in each polymer chain is ≤4, preferably ≤3.

[0030] More preferably, in the low-viscosity resin, the number of epoxy functional groups on each polymer chain is selected from 1, 2, 3, and 4.

[0031] Preferably, the epoxy resin comprises a combination of bisphenol A epoxy resin, low viscosity resin and modified resin.

[0032] Preferably, the mass ratio of the bisphenol A epoxy resin, the low viscosity resin and the modified resin is (10-60):(2-30):(2-30), preferably (12-55):(3-28):(3-28), and more preferably (15-50):(5-25):(5-25).

[0033] In a preferred embodiment, the composition further comprises one or a combination of a curing agent, an accelerator, an auxiliary agent, and a filler.

[0034] Preferably, the curing agent is used for curing epoxy resin.

[0035] More preferably, an accelerator is used to accelerate the curing of the epoxy resin.

[0036] Preferably, the curing agent is selected from aliphatic polyamine curing agents and aromatic polyamine curing agents, and may be one or a combination of polyetheramine and thiol.

[0037] Preferably, the mass ratio of the curing agent to the epoxy resin is (10-60):(6-120), preferably (12-55):(8-110), and more preferably (15-50):(10-100).

[0038] Preferably, the promoter is selected from at least one of Ajinomoto PN-23, PN-23J, PN-40, PN-40J, Asahi Kasei EH-3293 and HX3741.

[0039] Preferably, the mass ratio of the accelerator to the epoxy resin is (0.2-15):(10-100), preferably (0.3-12):(10-100), and more preferably (0.5-10):(10-100).

[0040] Preferably, the auxiliary agent may be one or a combination of coupling agent, defoaming agent, antioxidant, lubricant, release agent, stabilizer and toughening agent.

[0041] Preferably, the auxiliary agent is selected from at least two combinations of p-hydroxyanisole, hydroquinone, 2,6-di-tert-butyl-p-cresol, and a silane coupling agent.

[0042] Preferably, the mass ratio of the auxiliary agent to the epoxy resin is (0.1-12):(10-100), preferably (0.1-9):(10-100), and more preferably (0.1-7):(10-100).

[0043] Preferably, the filler may be an inorganic filler or an organic filler, for example, may be one or a combination of calcium carbonate, talc, silica powder, titanium dioxide, fumed silica, and aramid pulp.

[0044] Preferably, the mass ratio of the filler to the epoxy resin is (2-30):(10-100), preferably (3-25):(10-100), and more preferably (4-20):(10-100).

[0045] The third aspect of the present invention is to provide a method for preparing the above-mentioned composition, comprising the steps of:

[0046] Mixing the polyimide (A) with a low-viscosity resin at a first preset temperature and a preset vacuum degree to obtain a first mixture;

[0047] At a second preset temperature, adding bisphenol A epoxy resin, modified resin, curing agent, accelerator, and auxiliary agent to the first mixture, and mixing to obtain a second mixture;

[0048] The filler is added to the second mixture, and the mixture is stirred and mixed to obtain the composition.

[0049] Preferably, the first preset temperature is 30-60°C, preferably 35-55°C, more preferably 40-50°C.

[0050] Preferably, the preset vacuum degree is (-0.01)-(-0.08) MPa, preferably (-0.01)-(-0.07) MPa, and more preferably (-0.01)-(-0.05) MPa.

[0051] Preferably, the second preset temperature is 5-40°C, more preferably 15-35°C, more preferably 20-30°C.

[0052] Preferably, the stirring is carried out using a gravity planetary mixer.

[0053] A fourth aspect of the present invention is to provide application of the aforementioned composition, wherein the composition is applied in the semiconductor field.

[0054] Preferably, the composition can also be applied to dielectric materials, dielectric patterns, electronic packaging materials, and display materials.

[0055] Preferably, in the application, after the composition is coated, it is cured at 50-120°C, preferably at 55-110°C, more preferably at 60-100°C.

[0056] Preferably, the curing time is 30-150 min, preferably 35-120 min, more preferably 40-100 min.

[0057] More preferably, in the application, after coating, the composition is cured in two stages, the first stage being cured at 50-120°C, preferably at 55-110°C, more preferably at 60-100°C.

[0058] Preferably, the second stage curing is performed at 50-120°C, preferably 55-110°C, and more preferably 60-100°C.

[0059] More preferably, the first stage curing temperature and the second stage curing temperature may be the same or different.

[0060] Preferably, the first curing period is 30-150 min, preferably 35-120 min, more preferably 40-100 min.

[0061] More preferably, the second curing period is 30-150 min, preferably 35-120 min, and more preferably 40-100 min.

[0062] More preferably, the first curing time and the second curing time may be the same or different.

[0063] In this application specification, low-viscosity resin plays a diluting role. Compared with other types, glycidyl ethers are active epoxy diluents with epoxy groups in their structures, which can participate in the reaction and reduce the viscosity of the system. The term "low-viscosity resin" used in this application mainly refers to active epoxy diluents, more specifically glycidyl ethers, including glycidyl ether epoxy resins with a molecular weight of <350.

[0064] Compared with the prior art, the beneficial technical effects of the present invention include:

[0065] The present invention provides an etchable adhesive composition, a preparation method and its application of low temperature heat curing, wherein the composition includes polyimide (A) and epoxy resin (B), and the composition introduces a polyimide containing a long-chain aliphatic structure and F elements by optimizing the ratio, which not only improves the solubility and transparency after film formation, but also gives the composition etching ability. At the same time, a medium and low temperature curing system is adopted, the curing temperature is reduced, the damage of high temperature to electronic devices is avoided, and the service life of electronic components is effectively extended. In addition, the composition has greater advantages when used as a single component, and the prepared composition has higher adhesion, ASTM grade up to 5B, mechanical strength not less than 200MPa, excellent solvent resistance, and is particularly suitable for applications in the semiconductor field, such as dielectric patterns, electronic packaging materials, etc., while improving the application effect, reducing production costs and improving production line efficiency. DETAILED DESCRIPTION

[0066] The present invention provides a low-temperature heat-curable etchable adhesive composition, a preparation method and an application thereof. To make the purpose, technical scheme and effect of the present invention clearer and more specific, the present invention is further described in detail with examples below. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0067] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0068] In the following examples, the reaction raw materials used are exemplified as follows:

[0069] The structures of the polyimides in Examples 1-5 and Comparative Examples 1, 2 and 3 are shown in Formula A:

[0070]

[0071] Synthesis method: Under the protection of inert gas, an acid anhydride compound containing an R1 group (CAS No. 89-32-7, pyromellitic dianhydride) is added to a mixed solution of a diamine compound containing an R2 group (3-trifluoromethylpentane-1,5-diamine, CAS No. 1779129-42-8, Chemical Book) and a polar aprotic solvent (γ-butyrolactone) to carry out a condensation reaction (temperature 60°C, rotation speed 500rpm, time 2.5h) to obtain polyimide (A).

[0072] Embodiment 1:

[0073] This embodiment 1 provides a low-temperature heat-curable etchable adhesive composition and a preparation method thereof, the steps comprising:

[0074] First, 20 parts of low-viscosity resin (1,4-butanediol diglycidyl ether, CAS No. 2425-79-8) and 120 parts of polyimide (structure as shown in formula A) are stirred evenly at a temperature of 40°C and a vacuum degree of -0.02 MPa; then 35 parts of bisphenol A epoxy resin (E51, Phoenix brand), 8.9 parts of modified resin (liquid nitrile rubber modified epoxy resin, brand Struktol Polydis3604), 25 parts of curing agent (trimethylolpropane tris (3-thioglycolate), CAS No. 33007-83-9), 3 parts of accelerator (PN-40), 0.1 parts of hydroquinone, and 2 parts of KH560 are stirred evenly at room temperature; finally, 2 parts of talc and 4 parts of fumed silica are added, and stirred evenly with a gravity planetary stirrer to obtain a composition.

[0075] Embodiment 2:

[0076] This embodiment 2 provides a low-temperature heat-curable etchable adhesive composition and a preparation method thereof, the steps comprising:

[0077] First, 20 parts of glycidyl ether epoxy (1,4-butanediol diglycidyl ether, CAS No. 2425-79-8) and 120 parts of polyimide (structure as shown in formula A) are stirred evenly at a temperature of 40°C and a vacuum degree of -0.02MPa; then 37 parts of bisphenol A epoxy resin (E44, Phoenix brand), 8.9 parts of modified resin (liquid nitrile rubber modified epoxy resin, brand StruktolPolydis 3604), 24 parts of curing agent (trimethylolpropane tris (3-thioglycolate), CAS No. 33007-83-9), 3 parts of accelerator (PN-40), 0.1 parts of hydroquinone, and 2 parts of KH560 are stirred evenly at room temperature; finally, 1 part of Kevlar pulp 8F1857 and 4 parts of fumed silica are added, and stirred evenly with a gravity planetary stirrer to obtain a composite.

[0078] Embodiment 3:

[0079] This embodiment 3 provides a low-temperature heat-curable etchable adhesive composition and a preparation method thereof, the steps comprising: first, 25 parts of glycidyl ether epoxy (1,4-butanediol diglycidyl ether, CAS No. 2425-79-8) and 80 parts of polyimide (structure as shown in formula A) are stirred uniformly at a temperature of 40°C and a vacuum degree of -0.02MPa; then, 35 parts of bisphenol A epoxy resin (E44, Phoenix brand), 5.9 parts of modified resin (liquid nitrile rubber modified epoxy resin, brand StruktolPolydis 3604), 25 parts of curing agent (trimethylolpropane tris (3-thioglycolate), CAS No. 33007-83-9), 3 parts of accelerator (PN-40J), and 0.1 parts of hydroquinone and 2 parts of KH560 are stirred uniformly at room temperature; finally, 2 parts of talc and 4 parts of fumed silica are added, and stirred uniformly with a gravity planetary stirrer to obtain a composition.

[0080] Embodiment 4:

[0081] This embodiment 4 provides a low-temperature heat-curable etchable adhesive composition and a preparation method thereof, the steps comprising:

[0082] First, 20 parts of epoxy glycidyl ether (1,4-butanediol diglycidyl ether, CAS No. 2425-79-8) and 80 parts of polyimide (structure as shown in formula A) are stirred evenly at a temperature of 40°C and a vacuum degree of -0.02MPa; then 35 parts of bisphenol A epoxy resin (E51, Phoenix brand), 6 parts of modified resin (silicone resin modified epoxy resin, brand ES1002T), 24 parts of curing agent (trimethylolpropane tris (3-thioglycolate), CAS No. 33007-83-9), 5 parts of accelerator (PN-40J), 0.1 parts of hydroquinone, and 2 parts of KH560 are stirred evenly at room temperature; finally, 1 part of Kevlar pulp 8F1857 and 5 parts of fumed silica are added, and stirred evenly with a gravity planetary stirrer to obtain a composite.

[0083] Embodiment 5:

[0084] This embodiment 5 provides a low-temperature heat-curable etchable adhesive composition and a preparation method thereof, the steps comprising:

[0085] First, 30 parts of glycidyl ether epoxy (1,4-butanediol diglycidyl ether, CAS No. 2425-79-8) and 150 parts of polyimide (structure as shown in formula A) are stirred evenly at a temperature of 40°C and a vacuum degree of -0.02 MPa; then 30 parts of bisphenol A epoxy resin (Epikote1004F), 8.9 parts of modified resin (liquid nitrile rubber modified epoxy resin, brand StruktolPolydis 3604), 24 parts of curing agent (trimethylolpropane tris (3-thioglycolate), CAS No. 33007-83-9), 2 parts of accelerator (PN-23), 0.1 parts of hydroquinone, and 2 parts of KH560 are stirred evenly at room temperature; finally, 2 parts of talc and 3 parts of fumed silica are added, and stirred evenly with a gravity planetary stirrer to obtain a composite.

[0086] Comparative Example 1:

[0087] 20 parts of low-viscosity resin (1,4-butanediol diglycidyl ether), 35 parts of bisphenol A epoxy resin (E51), 8.9 parts of modified resin (liquid nitrile rubber modified epoxy resin), 30 parts of dicyandiamide curing agent (TaiLuck-D95), and 2 parts of KH560 were stirred evenly at room temperature; finally, 2 parts of talcum powder and 4 parts of fumed silica were added, and stirred evenly with a gravity planetary stirrer to obtain a product.

[0088] Comparative Example 2:

[0089] First, 20 parts of an inactive epoxy diluent (acetone) and 120 parts of a polyimide (structure as shown in formula A) are stirred uniformly at a temperature of 40° C. and a vacuum degree of -0.02 MPa; then, 37 parts of a bisphenol A epoxy resin (E44), 24 parts of a curing agent (trimethylolpropane tris(3-thioglycolate)), and 3 parts of an accelerator (PN-40) are stirred uniformly at room temperature; finally, 1 part of Kevlar pulp 8F1857 and 4 parts of fumed silica are added, and the mixture is stirred uniformly with a gravity planetary stirrer to obtain a composite.

[0090] Comparative Example 3:

[0091] First, 20 parts of non-active epoxy diluent (acetone), 37 parts of bisphenol A epoxy resin (ARALDITE CY179-1), and 16 parts of curing agent (aliphatic polyamine) were stirred uniformly at room temperature; finally, 1 part of Kevlar pulp 8F1857 and 4 parts of fumed silica were added and stirred uniformly with a gravity planetary stirrer, and the obtained product was then mixed with 80 parts of polyimide (the structure is shown in Formula A).

[0092] Comparative Example 4:

[0093] Only polyimide (structure as shown in formula A) is used without epoxy part.

[0094] Membrane preparation method:

[0095] 1. Film preparation method for etching and solvent resistance: first, apply the target composition product to the target substrate (amorphous silicon substrate, glass plate, copper carrier substrate, etc.) by spin coating, and then use a hot plate (model: HPD-3000BZN) of Japan Azowan Company to dry the coated film, and the drying condition is 50℃*10s; then use a vacuum oven (model: Binder VD23) to heat and cure, and then start to cool to room temperature and take it out to obtain a substrate with a polyimide film (amorphous silicon substrate, glass plate, copper carrier substrate, etc.). During the spin coating process, controlling the spin coating speed can obtain substrates with different polyimide film thicknesses.

[0096] 2. Film-making method for basic performance: first degas the target composition product, then use a film applicator to scrape the film on a polytetrafluoroethylene release pad, then use a vacuum oven (model: Binder VD 23) to heat and cure, then start to cool to room temperature and take it out to obtain a flat composition film with polyimide.

[0097] In the present application, the test is generally performed based on a film thickness of 1um±0.5um, and the film forming method is performed by drying the film under heating conditions.

[0098] Performance Test:

[0099] 1) Tensile strength: Coat the release sheet with a film thickness of 1±0.5 μm. Cut the film into 5 cm × 1 cm strips and perform a tensile test using an RTI-1225 tensile machine.

[0100] 2) 100-grid test method: Spin-coat and cure film samples on silicon wafers; use a cutter and a 100-grid plate to scribble.

[0101] (Grid size: 1mm×1mm); Use special test tape to adhere, peel off, and observe the test results. (Tape model: 3M Transparent tape); if the edge of the cut is completely smooth and there is no peeling on the edge of the grid, the adhesion is considered to be qualified and is indicated by 5B. If there is small peeling at the intersection of the cut and the actual damage in the grid area is ≤5%, it is indicated by 4B. If there is peeling at the edge and / or intersection of the cut, and the area is greater than 5%-15%, it is indicated by 3B. There is partial peeling or large peeling along the edge of the cut, or some grids are peeled off in whole pieces. If the area of ​​peeling exceeds 15%-35%, it is indicated by 2B. If there is large peeling on the edge of the cut / or some squares are partially or completely peeled off, and the area is greater than 35%-65% of the grid area, it is indicated by 1B. If there are pieces of paint falling off at the edges and intersections of the lines, and the total area of ​​the peeling is greater than 65%, it is indicated by 0B. 3) Solvent resistance test: The film is completely immersed in the specified solvent (2.38% tetramethylammonium hydroxide (TMAH)), and then the film state after immersion is observed. The film is considered qualified if it is still smooth and unchanged and there is no falling off or edge at the bonding point with the substrate, and is indicated by ○; the film surface has no wrinkles, and there is no falling off but edge at the bonding point with the substrate, which is considered fair, and is indicated by △; the film is considered unqualified if it falls off from the substrate, and is indicated by ×

[0102] express.

[0103] 4) Etching performance: After spin coating, the film is exposed (365nm) and developed to reveal the mask pattern. If it can be revealed, it is considered to be present, represented by √; if it cannot be revealed, it is considered to be absent, represented by ×.

[0104] Table 1-1, properties of films prepared from the compositions of the examples and comparative examples

[0105]

[0106] Table 1-2, properties of films prepared from the compositions of the examples and comparative examples

[0107]

[0108] The specific embodiments of the present invention are described in detail above, but they are only examples, and the present invention is not limited to the specific embodiments described above. For those skilled in the art, any equivalent modifications and substitutions made to the present invention are also within the scope of the present invention. Therefore, the equalization changes and modifications made without departing from the spirit and scope of the present invention should be included in the scope of the present invention.

Claims

1. A polyimide (A), characterized in that: The structure of the polyimide (A) is shown in Formula I, Wherein, R1 is a tetravalent organic group of C4-C40, preferably, it can be an organic group containing a benzene ring, and can be a monocyclic or condensed aromatic ring structure, and R1 is a tetravalent organic group with 6-30 carbon atoms; The benzene ring connected to R1 has an aliphatic hydrocarbon side chain or group, and the number of C atoms in the aliphatic hydrocarbon side chain or group is ≤6; the benzene ring has the following side chains or groups: methyl, ethyl, n-propyl, isopropyl, n-butyl, pentyl, cyclopentyl, hexyl, cyclohexyl; The main chain structure of R2 is a C3-C10 aliphatic hydrocarbon group; the main chain of the aliphatic hydrocarbon group of R2 carries a side group, and the side group contains a halogen F, which can be a C1-C6 aromatic group or a C1-C6 aliphatic hydrocarbon group; the mass proportion of the F element in R2 is 10-45wt%; in R2, the number ratio of the C atoms to the F atoms is ≥2:1, preferably ≥2:1; Said x is an integer greater than 1, preferably x is 3-18, more preferably x is 3-10.

2. A composition, characterized in that The composition contains A) polyimide and / or B) epoxy resin, and the mass ratio of the polyimide to the epoxy resin is (1-10):(0.5-8).

3. The composition according to claim 2, characterized in that The composition according to claim 2, characterized in that the epoxy resin comprises bisphenol A type epoxy resin, low viscosity resin, and modified resin.

4. The composition according to claim 3, characterized in that The modified resin is selected from one or more combinations of silicone modified epoxy resin, liquid nitrile rubber modified epoxy resin, polyester modified epoxy resin, and acrylate modified epoxy resin; and / or The low-viscosity resin includes a glycidyl ether epoxy resin; and / or The low-viscosity resin is an epoxy functional group-containing resin with a viscosity of ≤150 cp, and preferably the number of epoxy functional groups contained in each polymer chain is ≤4, preferably ≤3.

5. The composition according to claim 3, characterized in that The mass ratio of the bisphenol A epoxy resin, the low-viscosity resin and the modified resin is (10-60):(2-30):(2-30), preferably (12-55):(3-28):(3-28), and more preferably (15-50):(5-25):(5-25).

6. The composition according to claim 2, characterized in that The composition further comprises one or a combination of a curing agent, an accelerator, an auxiliary agent, and a filler; and / or The curing agent is selected from one or a combination of polyetheramine and thiol; and / or The mass ratio of the curing agent to the epoxy resin is (10-60): (6-120), preferably (12-55): (8-110), more preferably (15-50): (10-100); and / or The promoter is selected from at least one of Ajinomoto PN-23, PN-23J, PN-40, PN-40J, Asahi Kasei EH-3293, HX3741; and / or The mass ratio of the accelerator to the epoxy resin is (0.2-15):(10-100), preferably (0.3-12):(10-100), and more preferably (0.5-10):(10-100). The auxiliary agent is selected from at least two combinations of p-hydroxyanisole, hydroquinone, 2,6-di-tert-butyl-p-cresol, and a silane coupling agent; and / or The mass ratio of the auxiliary agent to the epoxy resin is (0.1-12):(10-100), preferably (0.1-9):(10-100), and more preferably (0.1-7):(10-100).

7. The composition according to claim 2, characterized in that The filler is selected from one or a combination of calcium carbonate, talc, silica powder, titanium dioxide, fumed silica, and aramid pulp; and / or The mass ratio of the filler to the epoxy resin is (2-30):(10-100), preferably (3-25):(10-100), and more preferably (4-20):(10-100).

8. A method for preparing the composition according to any one of claims 2 to 7, characterized in that the steps include: Mixing the polyimide (A) with a low-viscosity resin at a first preset temperature and a preset vacuum degree to obtain a first mixture; At a second preset temperature, adding bisphenol A epoxy resin, modified resin, curing agent, accelerator, and auxiliary agent to the first mixture, and mixing to obtain a second mixture; The filler is added to the second mixture, and the mixture is stirred and mixed to obtain the composition.

9. The method according to claim 8, characterized in that The first preset temperature is 30-60°C, preferably 35-55°C, more preferably 40-50°C; and / or The preset vacuum degree is (-0.01)-(-0.08) MPa, preferably (-0.01)-(-0.07) MPa, and more preferably (-0.01)-(-0.05) MPa.

10. Use of the composition according to any one of claims 2 to 7, characterized in that: The composition is applied in the semiconductor field; and / or After coating, the composition is cured at 50-120°C, preferably at 55-110°C, more preferably at 60-100°C; and / or The curing time is 30-150 min, preferably 35-120 min, more preferably 40-100 min; and / or More preferably, in the application, after the composition is coated, it is cured in two stages, the first stage is cured at 50-120°C, preferably at 55-110°C, more preferably at 60-100°C; and / or Preferably, the second stage curing is performed at 50-120°C, preferably 55-110°C, more preferably 60-100°C; and / or The first curing period is 30-150 min, preferably 35-120 min, more preferably 40-100 min; and / or The second curing period is 30-150 min, preferably 35-120 min, and more preferably 40-100 min.

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