Electronic device

Abstract

The invention provides an electronic device. The electronic device comprises a panel; the light guide plate is arranged on the panel, the light guide plate is provided with a first surface, and the first surface is provided with a plurality of optical units; and the attachment part is in contact with a part of the first surface of the light guide plate, and the loss tangent (tan delta) of the attachment part at the temperature of 30 DEG C is larger than 0 and smaller than or equal to 1.

Description

Technical Field

[0001] The present disclosure relates to an electronic device, and more particularly to an electronic device having an attachment member in contact with a light guide plate. Background Art

[0002] Nowadays, many electronic devices include displays, and the electronic devices are moving towards energy saving or low power consumption requirements, such as reflective displays or semi-transmissive displays. When a light guide plate (LGP) is provided on a liquid crystal display (such as a reflective liquid crystal display (RLCD), glare will be generated if there is no adhesive (such as optical adhesive) between the light guide plate and the adjacent components. Considering anti-glare, the light guide plate and the adjacent components are fixed by adhesives that are attached to the entire surface. However, if a general adhesive is used, it is easy to fill the mesh of the light guide plate, thereby affecting the light guiding effect and darkening the picture. Summary of the invention

[0003] According to one embodiment of the present disclosure, an electronic device is provided, characterized in that it includes: a panel; a light guide plate, which is arranged on the panel, wherein the light guide plate has a first surface, and the first surface has a plurality of optical units; and an attachment, which contacts the first surface of the light guide plate, wherein the loss tangent (tanδ) of the attachment at 30°C is greater than 0 and less than or equal to 1.

[0004] According to one embodiment of the present disclosure, an electronic device is provided, characterized in that it includes: a panel; a light guide plate, which is arranged on the panel, wherein the light guide plate has a first surface, and the first surface has a plurality of optical units; and an attachment, which contacts the first surface of the light guide plate, wherein the attachment is spaced apart from at least one of the optical units by a distance.

[0005] According to one embodiment of the present disclosure, an electronic device is provided, characterized in that it includes: a panel; a light guide plate, which is arranged on the panel and has a first surface and a second surface opposite to each other, wherein the first surface is far away from the panel, and the first surface has a plurality of recessed structures and a plurality of protrusion structures, and the plurality of protrusion structures are respectively adjacent to the plurality of recessed structures; a protective substrate, which is arranged on the light guide plate; a first attachment, which is arranged between the light guide plate and the protective substrate and contacts the first surface; and a second attachment, which is arranged between the first attachment and the protective substrate, wherein along the normal direction of the panel, the thickness of the second attachment is greater than the thickness of one of the plurality of protrusion structures. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] The following will be described in detail with reference to the accompanying drawings. It should be noted that the various characteristic components are not drawn to scale and are only used for illustration. In fact, the size of the components may be enlarged or reduced to clearly show the technical features of the embodiments of the present disclosure.

[0007] Figure 1 is a cross-sectional schematic diagram of an electronic device according to an embodiment of the present disclosure;

[0008] Figure 2 is a cross-sectional schematic diagram of an electronic device according to an embodiment of the present disclosure;

[0009] Figure 3 is a top view of some components in an electronic device according to an embodiment of the present disclosure;

[0010] Figure 4 is a cross-sectional schematic diagram of an electronic device according to an embodiment of the present disclosure;

[0011] Figure 5 is a cross-sectional schematic diagram of an electronic device according to an embodiment of the present disclosure;

[0012] Figure 6 is a cross-sectional schematic diagram of an electronic device according to an embodiment of the present disclosure;

[0013] Figure 7 is a cross-sectional schematic diagram of an electronic device according to an embodiment of the present disclosure;

[0014] Fig. 8A According to an embodiment of the present disclosure, the transmittance variation of an attachment in an electronic device for different wavelengths is displayed;

[0015] Figure 8B for Fig. 8A A partial enlarged view of

[0016] Fig. 9 is a cross-sectional schematic diagram of an electronic device according to an embodiment of the present disclosure;

[0017] Fig.10 is a cross-sectional schematic diagram of an electronic device according to an embodiment of the present disclosure;

[0018] Fig.11 is a cross-sectional schematic diagram of a protrusion structure in an electronic device according to an embodiment of the present disclosure;

[0019] Fig.12 is a cross-sectional schematic diagram of a method for manufacturing an electronic device according to an embodiment of the present disclosure; and

[0020] Fig.13 is a cross-sectional schematic diagram of an electronic device according to an embodiment of the present disclosure.

[0021]

Explanation of symbols

[0022] 10,50,100,200,500,1000,5000:Electronic devices

[0023] 12,52,102,202,502,1002,5200: Panel

[0024] 14,56,106,206,506,5600:Light guide plate

[0025] 14a,5600a: First side

[0026] 14b,5600b: Side 2

[0027] 16,20,54,58,60,64,68,104,108,112,116,204,208,212,216,504,508,512,516,1004,1008,1012,5400,5800,6000,6400,6800: Attachments

[0028] 18,57,107,207,507,5700:Optical unit

[0029] 22,70,118,218,518,1014,7000: Protective substrate

[0030] 62,66,110,114,210,214,510,514,1006,1010,6200,6600: Touch layer

[0031] 5750: Protrusion structure

[0032] 5750a: first protrusion structure

[0033] 5750b: Second protrusion structure

[0034] 5900:Substrate

[0035] B: Baseline

[0036] D: Depth

[0037] G: Spacing

[0038] H1:Thickness

[0039] H2: Thickness

[0040] L: Light source

[0041] N: normal direction of the panel

[0042] P1: Handwriting tablet

[0043] S: Spacing

[0044] SA: Light incident side

[0045] SB: Opposite side

[0046] T1, T2: thickness

[0047] Ta1, Ta2: thickness

[0048] Ta3:Thickness

[0049] Ta4:Thickness

[0050] W: Width

[0051] W1: Width

[0052] W2: Width DETAILED DESCRIPTION

[0053] The following description lists various embodiments of the present invention to introduce the basic concepts of the present invention, and is not intended to limit the content of the present invention. The actual scope of the invention should be defined in accordance with the scope of the patent application. The following will refer to the exemplary embodiments of the present disclosure in detail, and examples of the exemplary embodiments are illustrated in the accompanying drawings. Whenever possible, the same component symbols are used in the drawings and descriptions to represent the same or similar parts.

[0054] Certain words are used throughout the specification and claims of this disclosure to refer to specific components. It should be understood by those skilled in the art that manufacturers of sensing devices may refer to the same components by different names. This document does not intend to distinguish between components that have the same function but different names. In the following specification and claims, the words "including", "comprising" and "comprising" are open-ended words and should therefore be interpreted as "including but not limited to..."

[0055] The directional terms mentioned herein, such as "up", "down", "front", "back", "left", "right", etc., are only with reference to the directions of the drawings. Therefore, the directional terms used are for illustration and not for limiting the present disclosure. In the drawings, each figure shows the general characteristics of the methods, structures and / or materials used in a particular embodiment. However, these drawings should not be interpreted as defining or limiting the scope or nature covered by these embodiments. For example, for clarity, the relative size, thickness and position of each film layer, region and / or structure may be reduced or enlarged.

[0056] A structure (or layer, component, substrate) described in the present disclosure is located on / above another structure (or layer, component, substrate), which may refer to the two structures being adjacent and directly connected, or it may refer to the two structures being adjacent but not directly connected. Indirect connection means that there is at least one intermediate structure (or intermediate layer, intermediate component, intermediate substrate, intermediate gap) between the two structures, the lower surface of one structure is adjacent to or directly connected to the upper surface of the intermediate structure, and the upper surface of the other structure is adjacent to or directly connected to the lower surface of the intermediate structure. The intermediate structure can be composed of a single-layer or multi-layer physical structure or a non-physical structure, without limitation. In the present disclosure, when a certain structure is disposed "on" another structure, it may refer to that the certain structure is "directly" on the other structure, or that the certain structure is "indirectly" on the other structure, that is, at least one structure is sandwiched between the certain structure and the other structure.

[0057] The terms "approximately," "equal," "equal" or "same," "substantially" or "approximately" are generally interpreted as within 20% of a given value or range, or within 10%, 5%, 3%, 2%, 1% or 0.5% of a given value or range.

[0058] Furthermore, any two values ​​or directions used for comparison may have a certain error. If the first value is equal to the second value, it implies that there may be an error of about 10% between the first value and the second value; if the first direction is perpendicular or "approximately" perpendicular to the second direction, the angle between the first direction and the second direction may be between 80 degrees and 100 degrees; if the first direction is parallel or "approximately" parallel to the second direction, the angle between the first direction and the second direction may be between 0 degrees and 10 degrees.

[0059] The ordinal numbers used in the specification and claims, such as "first", "second", etc., are used to modify components. They do not imply or represent any previous ordinal numbers of the component (or components), nor do they represent the order of one component and another component, or the order of the manufacturing method. The use of these ordinal numbers is only used to make a component with a certain name clearly distinguishable from another component with the same name. The same words may not be used in the claims and the specification. Accordingly, the first component in the specification may be the second component in the claims.

[0060] In the present disclosure, the phrases “a given range is from a first value to a second value”, “a given range falls within the range from a first value to a second value” mean that the given range includes the first value, the second value and other values ​​therebetween.

[0061] It should be understood that according to the embodiments of the present disclosure, an optical microscope (OM), a scanning electron microscope (SEM), an α-step, an ellipsometer, or other suitable methods may be used to measure the depth, thickness, width, or height of each component, or the spacing or distance between components. According to some embodiments, a scanning electron microscope may be used to obtain a cross-sectional structural image including the components to be measured, and measure the depth, thickness, width, or height of each component, or the spacing or distance between components.

[0062] The electronic device may include an imaging device, a bonding device, a display device, a backlight device, an antenna device, a splicing device, a touch display, a curved display, or a freeshape display, but is not limited thereto. The electronic device may, for example, include a liquid crystal, a light emitting diode, fluorescence, phosphorescence, other suitable display media, or a combination of the foregoing, but is not limited thereto. The display device may be a non-self-luminous display device or a self-luminous display device. The antenna device may be a liquid crystal antenna device or a non-liquid crystal antenna device, and the sensing device may be a sensing device for sensing capacitance, light, heat, or ultrasound, but is not limited thereto. The splicing device may, for example, be a display splicing device or an antenna splicing device, but is not limited thereto. It should be noted that the electronic device may be any combination of the foregoing, but is not limited thereto. The electronic device may be a bendable or flexible electronic device. It should be noted that the electronic device may be any combination of the foregoing, but is not limited thereto. In addition, the appearance of the electronic device can be rectangular, circular, polygonal, with curved edges or other suitable shapes. The electronic device can have peripheral systems such as a drive system, a control system, a light source system, a shelf system, etc. to support a display device, an antenna device or a splicing device.

[0063] It should be noted that the following embodiments can replace, reorganize, or mix features in several different embodiments to complete other embodiments without departing from the spirit of the present disclosure. Features between embodiments can be mixed and matched as long as they do not violate the spirit of the invention or conflict with each other.

[0064] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meanings as commonly understood by those skilled in the art to which the present disclosure belongs. It is understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the background or context of the relevant technology and the present disclosure, and should not be interpreted in an idealized or overly formal manner unless specifically defined in the embodiments of the present disclosure.

[0065] Furthermore, the term "adjacent" in the specification and claims is used to describe being near each other, but does not necessarily mean being in contact with each other.

[0066] In addition, the descriptions of "when..." or "when..." in this disclosure indicate "at the moment, before or after", etc., and are not limited to situations that occur at the same time, which is hereby stated in advance. The descriptions of "disposed on..." and the like in this disclosure indicate the corresponding positional relationship between two components, and are not limited to whether the two components are in contact with each other, unless otherwise specified, which is hereby stated in advance. Furthermore, when the disclosure records multiple effects, if the word "or" is used between the effects, it means that the effects can exist independently, but does not exclude that multiple effects can exist at the same time.

[0067] In addition, the term "electrically connected" or "coupled" in the specification and claims refers not only to direct electrical connection with another component, but also to indirect electrical connection with another component. Electrical connection includes direct electrical connection, indirect electrical connection or communication between two components using radio signals.

[0068] In the present disclosure, when “or” is used as a conjunction between multiple components, unless otherwise specified, both “and” and “or” are included.

[0069] In the present disclosure, when "a component is disposed on another component", it means that the component may be disposed on a certain side of the other component, such as but not limited to the top, bottom, left side, right side, front side or back side, and the two components do not necessarily need to be in contact. Figure 1 According to an embodiment of the present disclosure, an electronic device 10 is provided. Figure 1 is a schematic cross-sectional view of the electronic device 10 .

[0070] like Figure 1 As shown, the electronic device 10 includes a panel 12, a light guide plate 14, and an attachment 16. The light guide plate 14 is disposed on the panel 12. The light guide plate 14 has a first surface 14a, and the first surface 14a has a plurality of optical units 18. The attachment 16 contacts a portion of the first surface 14a of the light guide plate 14. In some embodiments, the loss tangent (tanδ) of the attachment 16 at 30°C is greater than 0 and less than or equal to 1, but is not limited thereto.

[0071] According to some embodiments, the panel 12 may include a reflective display or a semi-transmissive display, but is not limited thereto. According to some embodiments, the panel 12 may include a cholesteric liquid crystal panel, an electrophoretic panel, or other reflective panels, but is not limited thereto. It should be noted that the panel 12 may selectively include a plurality of sequentially stacked sub-panels (not shown), and the panel 12 may include, for example, a plurality of cholesteric liquid crystal sub-panels that reflect different wavelengths, such as a blue cholesteric liquid crystal sub-panel, a green cholesteric liquid crystal sub-panel, and / or a red cholesteric liquid crystal sub-panel, but is not limited thereto, and these sub-panels may be bonded to each other through other attachments (not shown).

[0072] like Figure 1 As shown, the light guide plate 14 has a second surface 14b opposite to the first surface 14a, the first surface 14a has a plurality of optical units 18, and the second surface 14b is adjacent to the panel 12, but not limited thereto. In other words, the optical unit 18 is located on the first surface 14a of the light guide plate 14 away from the panel 12. According to some embodiments, the first surface 14a of the light guide plate 14, for example, forms a plurality of recessed structures, and these recessed structures can be compared to a plurality of optical units 18, but not limited thereto. According to some embodiments (not shown), the first surface 14a of the light guide plate 14 can be provided with a mesh material (not shown), and these mesh materials (such as ink or other suitable materials) can be compared to a plurality of optical units 18, but not limited thereto. According to some embodiments, the attachment 16 is disposed between the light guide plate 14 and the protective substrate 22, but not limited thereto, and other functional components (such as touch components, optical components) or other attachments can be selectively inserted between the light guide plate 14 and the protective substrate 22. It should be noted that the above-mentioned attachment 16 is defined as an attachment that contacts the first surface 14a of the light guide plate 14 having a plurality of optical units 18. According to some embodiments, the protective substrate 22 may include a hard substrate (such as glass, plastic, ceramic or other suitable materials), but is not limited thereto. According to some embodiments, other optical layers (not shown, such as anti-glare layer, anti-reflection layer, anti-fouling layer) may be selectively provided on the protective substrate 22, but are not limited thereto. According to some embodiments, a light shielding layer (not shown) may be selectively provided on the protective substrate 22, and the light shielding layer (not shown) is, for example, located in the peripheral area of ​​the protective substrate 22. According to some embodiments, the material of the attachment 16 may include a light-transmitting material. According to some embodiments, the material of the attachment 16 may include an acrylic polymer or other suitable materials. According to some embodiments, the attachment 16 may be selected as a non-photocurable adhesive (such as a non-UV curable adhesive). After the attachment 16 is attached to the light guide plate 14, it is not necessary to perform any curing step on the attachment 16, but is not limited thereto.

[0073] According to some embodiments, the storage modulus of the attachment 16 (e.g., hard glue) at 30°C is greater than or equal to 10Kpa and less than or equal to 2,000Kpa, but not limited thereto. According to some embodiments, the storage modulus of the attachment 16 at 30°C is greater than or equal to 50Kpa and less than or equal to 1,000Kpa. According to some embodiments, the storage modulus of the attachment 16 at 30°C is greater than or equal to 60Kpa and less than or equal to 800Kpa, but not limited thereto. According to some embodiments, the storage modulus of the attachment 16 at 30°C is greater than or equal to 70Kpa and less than or equal to 730Kpa.

[0074] According to some embodiments, the loss modulus of the attachment 16 at 30°C is greater than or equal to 5Kpa and less than or equal to 300Kpa, but not limited thereto. According to some embodiments, the loss modulus of the attachment 16 at 30°C is greater than or equal to 10Kpa and less than or equal to 250Kpa, but not limited thereto. According to some embodiments, the loss modulus of the attachment 16 at 30°C is greater than or equal to 15Kpa and less than or equal to 200Kpa, but not limited thereto. According to some embodiments, the loss modulus of the attachment 16 at 30°C is greater than or equal to 20Kpa and less than or equal to 165Kpa, but not limited thereto. When the attachment 16 is a hard glue (i.e., a glue without fluidity), the attachment 16 may not need to be cured, so the measurement of the storage modulus and loss modulus of the attachment 16 is, for example, measured using an uncured attachment.

[0075] According to some embodiments, the loss tangent (tanδ) of the adhesive 16 at 30°C is greater than 0 and less than or equal to 1, but is not limited thereto. According to some embodiments, the loss tangent of the adhesive 16 at 30°C is greater than 0 and less than or equal to 0.6, but is not limited thereto. According to some embodiments, the loss tangent of the adhesive 16 at 30°C is greater than 0 and less than or equal to 0.5, but is not limited thereto. According to some embodiments, the loss tangent of the adhesive 16 at 30°C is greater than 0 and less than or equal to 0.4, but is not limited thereto. According to some embodiments, the loss tangent of the adhesive 16 at 30°C is greater than 0 and less than or equal to 0.3, but is not limited thereto. When the adhesive 16 is a hard glue (i.e., a glue without fluidity), the adhesive 16 may not need to be cured, so the measurement of the loss tangent of the adhesive 16 is, for example, measured using an uncured adhesive. The present disclosure uses a dynamic mechanical analyzer (DMA) to measure the parameters of the attachment material, and can obtain three parameter values, namely, loss tangent (tanδ), loss modulus, and storage modulus. The relationship between the three parameter values ​​of loss tangent, loss modulus, and storage modulus is as follows: Loss tangent (tanδ) = loss modulus / storage modulus.

[0076] By designing the storage modulus, loss modulus and / or loss tangent of the attachment 16, the chance of the attachment filling up the mesh of the light guide plate can be reduced, and the chance of the light guide effect of the light guide plate being affected by the attachment and darkening the image can be reduced.

[0077] like Figure 1As shown, one of the optical units 18 has a depth D (e.g., the depth of the recessed structure), and the attachment 16 has a thickness T1. According to some embodiments, the depth D is, for example, greater than or equal to 0.1 μm and less than or equal to 30 μm, but is not limited thereto. According to some embodiments, the depth D is, for example, greater than or equal to 0.1 μm and less than or equal to 25 μm, but is not limited thereto. According to some embodiments, the depth D is, for example, greater than or equal to 0.1 μm and less than or equal to 20 μm, but is not limited thereto. According to some embodiments, the depth D is, for example, greater than or equal to 0.1 μm and less than or equal to 15 μm, but is not limited thereto. According to some embodiments, the thickness T1 of the attachment 16 is greater than or equal to 25 μm and less than or equal to 300 μm, but is not limited thereto. According to some embodiments, the thickness T1 of the attachment 16 is greater than or equal to 25 μm and less than or equal to 250 μm, but is not limited thereto. According to some embodiments, the thickness T1 of the attachment 16 is greater than or equal to 25 μm and less than or equal to 200 μm, but is not limited thereto. According to some embodiments, the ratio of the depth D to the thickness T1 of the attachment 16 is greater than or equal to 0.0001 and less than or equal to 30000, but is not limited thereto. According to some embodiments, the ratio of the depth D to the thickness T1 of the attachment 16 is greater than or equal to 0.001 and less than or equal to 8000 (or 3000). According to some embodiments, the ratio of the depth D to the thickness T1 of the attachment 16 is greater than or equal to 0.01 and less than or equal to 300 (or 200). According to some embodiments, the ratio of the depth D to the thickness T1 of the attachment 16 is greater than or equal to 0.1 and less than or equal to 30 (or 20). According to some embodiments, the ratio of the depth D to the thickness T1 of the attachment 16 is greater than or equal to 0.1 and less than or equal to 1. According to some embodiments, the ratio of the depth D to the thickness T1 of the attachment 16 is greater than or equal to 0.01 and less than or equal to 0.33. The depth D can be defined as the maximum depth of an optical unit 18 (e.g., a recessed structure) in the direction of looking down at the electronic device (Z direction). The thickness T1 of the attachment 16 can be defined as the average value of the thickness of the attachment 16 at any three locations in the direction of looking down at the electronic device (Z direction). Through the design of the above-mentioned range of the ratio of the depth D to the thickness T1 of the attachment 16, both optics and attachment yield can be taken into account.

[0078] According to some embodiments (such as Figure 2), a spacing S is spaced between the attachment 16 and at least one of the optical units 18. The spacing S can be defined as the maximum distance between the attachment 16 and the optical unit 18 (e.g., a recessed structure) in the direction of looking down at the electronic device (Z direction). According to some embodiments, the spacing S is, for example, greater than 0 and less than or equal to the depth D, but is not limited thereto. According to some embodiments, the ratio of the spacing S to the depth D of one of the multiple optical units 18 is, for example, greater than or equal to 0.2 and less than or equal to 1 (i.e., 0.3≦S / D≦1), but is not limited thereto. According to some embodiments, the ratio of the spacing S to the depth D of one of the multiple optical units 18 is, for example, greater than or equal to 0.3 and less than or equal to 1 (i.e., 0.3≦S / D≦1), but is not limited thereto. According to some embodiments, the ratio of the spacing S to the depth D is, for example, greater than or equal to 0.5 and less than or equal to 1 (i.e., 0.5≦S / D≦1), but is not limited thereto. The above-mentioned design of the ratio range of the spacing S and the depth D helps to guide the light source to the panel through the light guide plate, and can take both optics and adhesion yield into consideration.

[0079] According to some embodiments, the transmittance of the attachment 16 to light with a wavelength in the range of 380nm to 430nm (380nm≤wavelength≤430nm) is less than or equal to 20% (or 15%), but not limited thereto. According to some embodiments, the transmittance of the attachment 16 to light with a wavelength in the range of ultraviolet wavelength (for example, 20nm≤wavelength<380nm, but not limited thereto) is less than or equal to 20% (or 15%), but not limited thereto. According to some embodiments, the transmittance of the attachment 16 to light with a wavelength less than or equal to 430nm (wavelength≤430nm) is less than or equal to 20% (or 15%), but not limited thereto. For example, the transmittance of the attachment 16 to light with a wavelength less than or equal to 420nm (wavelength≤420nm) is less than or equal to 20% (or 15%), but not limited thereto. For example, the transmittance of the attachment 16 to light with a wavelength less than or equal to 400nm (wavelength≤400nm) is less than or equal to 20% (or 15%). For example, the transmittance of the attachment 16 to wavelengths less than or equal to 380 nm (wavelength ≤ 380 nm) is less than or equal to 20% (or 15%). The transmittance design of the attachment 16 in different wavelength ranges can reduce the possibility of the panel being affected by short-wavelength light (such as ultraviolet light or other light) and deteriorating the material in the panel.

[0080] According to some embodiments, the loss tangent of the adhesive 16 at 95°C is greater than or equal to 0.1 and less than or equal to 1, and the loss tangent of the adhesive 16 at 95°C is greater than the loss tangent of the adhesive 16 at 30°C, but is not limited thereto. According to some embodiments, the loss tangent of the adhesive 16 at 95°C is greater than or equal to 0.15 and less than or equal to 0.9. According to some embodiments, the loss tangent of the adhesive 16 at 95°C is greater than or equal to 0.15 and less than or equal to 0.7. According to some embodiments, the loss tangent of the adhesive 16 at 95°C is greater than or equal to 0.15 and less than or equal to 0.6. When the adhesive 16 is a hard glue (i.e., a glue without fluidity), the adhesive 16 may not need to be cured, so the measurement of the loss tangent of the adhesive 16 is, for example, measured using an uncured adhesive.

[0081] like Figure 1 As shown, the electronic device 10 further includes an attachment 20, which is disposed between the panel 12 and the light guide plate 14. According to some embodiments, the material of the attachment 20 may include an acrylic polymer. According to some embodiments, the thickness T2 of the attachment 20 is greater than or equal to 100μm and less than or equal to 300μm, but is not limited thereto. According to some embodiments, the thickness T2 of the attachment 20 is greater than or equal to 100μm and less than or equal to 250μm, but is not limited thereto. According to some embodiments, the attachment 20 may selectively have a transmittance of less than or equal to 20% for light with a wavelength in the range of 380nm to 430nm (380nm≤wavelength≤430nm), but is not limited thereto. According to some embodiments, the transmittance of the attachment 20 for light with a wavelength in the range of ultraviolet wavelength (20nm≤wavelength<380nm) is less than or equal to 20% (or 15%), but is not limited thereto. According to some embodiments, the transmittance of the attachment 20 to light in the range of wavelength less than or equal to 430nm (wavelength ≤ 430nm) is less than or equal to 20% (or 15%), but not limited thereto. For example, the transmittance of the attachment 20 to light in the range of wavelength less than or equal to 420nm (wavelength ≤ 420nm) is less than or equal to 20% (or 15%), but not limited thereto. For example, the transmittance of the attachment 20 to light in the range of wavelength less than or equal to 400nm (wavelength ≤ 400nm) is less than or equal to 20% (or 15%). For example, the transmittance of the attachment 20 to light in the range of wavelength less than or equal to 380nm (wavelength ≤ 380nm) is less than or equal to 20% (or 15%). The transmittance design of the above-mentioned attachment 20 in different wavelength ranges can reduce the possibility of degradation of the panel due to the influence of short-wavelength light (such as ultraviolet light or other light).

[0082] According to some embodiments, the transmittance of at least one of the attachments 16 and 20 to light with a wavelength less than or equal to 430nm (wavelength ≤ 430nm) is less than or equal to 20% (or 15%). According to some embodiments, the transmittance of at least one of the attachments 16 and 20 to light with a wavelength less than or equal to 420nm (or 400nm, or 390nm, or 380nm) is less than or equal to 20% (or 15%). When short-wavelength light (such as ultraviolet light or other light) is irradiated, the panel 12 (for example, the liquid crystal or other material layer contained therein) will be at risk of degradation. Therefore, the present disclosure is provided with an attachment (for example, at least one of the attachments 16 and 20) that reduces short wavelengths (such as ultraviolet light) disposed on the panel 12 to increase the anti-ultraviolet light function of the electronic device, thereby increasing the performance of the panel. According to some embodiments, the above-mentioned attachment may also selectively have the effect of reducing IR light.

[0083] See also Figure 2 According to an embodiment of the present disclosure, an electronic device 10 is provided. Figure 2 is a schematic cross-sectional view of the electronic device 10 .

[0084] Figure 2 The embodiment shown is Figure 1 The difference between the embodiments shown mainly lies in the different ways and positions of the light guide plate 14, the attachment member 16, and the attachment member 20, which will be further described below. Figure 2 The rest are similar to Figure 1 The disclosed parts will not be repeated here.

[0085] like Figure 2 As shown, the electronic device 10 includes a panel 12, a light guide plate 14, and an attachment 16, but is not limited thereto. The light guide plate 14 (front light guide plate) is, for example, disposed on the panel 12. The light guide plate 14 has a first surface 14a, and the first surface 14a has a plurality of optical units 18. The attachment 16, for example, contacts the first surface 14a of the light guide plate 14, and the loss tangent (tanδ) of the attachment 16 at 30°C is greater than 0 and less than or equal to 1, but is not limited thereto. Figure 2 As shown, the light guide plate 14 has a second surface 14b opposite to the first surface 14a, the first surface 14a has a plurality of optical units 18, and the first surface 14a is adjacent to the panel 12. The attachment 20 is disposed between the second surface 14b of the light guide plate 14 and the protective substrate 22, but is not limited thereto. In other words, the attachment 16 is disposed between the light guide plate 14 and the panel 12. Other functional components (such as touch components, optical components) or other attachments may be selectively inserted between the light guide plate 14 and the protective substrate 22. It should be noted that the attachment 16 is defined as, for example, an attachment that contacts the first surface 14a of the light guide plate 14 having a plurality of optical units 18. Figure 2Examples of materials, properties, dimensions, etc. of the components (attachment 16, attachment 20, light guide plate 14, but not limited thereto) in FIG. Figure 1 In the description.

[0086] In addition, if Figure 2 As shown, there is a spacing S between the attachment 16 and at least one of the optical units 18. According to some embodiments, the spacing S is, for example, greater than 0 and less than or equal to the depth D, but is not limited thereto. According to some embodiments, the ratio of the spacing S to the depth D is, for example, greater than or equal to 0.2 and less than or equal to 1 (i.e., 0.3≦S / D≦1), but is not limited thereto. According to some embodiments, the ratio of the spacing S to the depth D is, for example, greater than or equal to 0.2 and less than or equal to 1 (i.e., 0.3≦S / D≦1), but is not limited thereto. According to some embodiments, the ratio of the spacing S to the depth D is, for example, greater than or equal to 0.5 and less than or equal to 1 (i.e., 0.5≦S / D≦1), but is not limited thereto. The design of the above-mentioned range of the ratio of the spacing S to the depth D helps to guide the light source to the panel through the light guide plate, and can take into account both the optical and adhesion yields.

[0087] See also Figure 3 , further illustrating the structure of the light guide plate 14. Figure 3 It is a top view of some components (eg, the light guide plate 14 ) in the electronic device 10 .

[0088] like Figure 3 As shown, the light guide plate 14 has a plurality of optical units 18. According to some embodiments, the shape of the optical unit 18 may include an ellipse, a circle, or an irregular shape, but is not limited thereto. According to some embodiments, the (maximum) width W of the optical unit 18 may be greater than or equal to 0.1 μm and less than or equal to 300 μm, but is not limited thereto. Figure 3 The (maximum) width W of the optical unit 18 is taken as an example along the X direction, but is not limited thereto. In other embodiments (not shown), the (maximum) width W of the optical unit 18 may also be along other directions (any direction perpendicular to the Z direction). According to some embodiments, the (maximum) width W of the optical unit 18 may be greater than or equal to 0.1 μm and less than or equal to 250 μm (or 200 μm). According to some embodiments, the depth D may be greater than or equal to 0.1 μm and less than or equal to 30 μm, but is not limited thereto. According to some embodiments, the depth D is greater than or equal to 0.1 μm and less than or equal to 25 μm (or 20 μm), but is not limited thereto. According to some embodiments, the ratio of the depth to the width of the optical unit 18 is greater than or equal to 0.1 and less than or equal to 30, but is not limited thereto. According to some embodiments, the ratio of the depth to the width of the optical unit 18 is greater than or equal to 0.1 and less than or equal to 25 (or 20). The above-mentioned depth to width ratio design of the optical unit 18 can achieve a better light guiding effect.

[0089] According to some embodiments, in the light guide plate 14, two adjacent optical units 18 are spaced apart by a minimum spacing G. According to some embodiments, the minimum spacing G is greater than or equal to 0.1 μm and less than or equal to 10,000 μm, but not limited thereto. According to some embodiments, the minimum spacing G is greater than or equal to 0.1 μm and less than or equal to 8000 μm (or 6000 μm, or 5000 μm), but not limited thereto. According to some embodiments, the minimum spacing G is greater than or equal to 1 μm and less than or equal to 800 μm (or 600 μm, or 500 μm), but not limited thereto. According to some embodiments, the minimum spacing G is greater than or equal to 10 μm and less than or equal to 100 μm, but not limited thereto. According to some embodiments, the minimum spacing G is greater than or equal to 15 μm (or 30 μm) and less than or equal to 80 μm (or 60 μm, or 50 μm), but not limited thereto. According to some embodiments, the ratio of the minimum spacing G to the thickness T1 of the attachment 16 is greater than or equal to 0.0001 and less than or equal to 50,000, but not limited thereto. According to some embodiments, the ratio of the minimum spacing G to the thickness T1 of the attachment 16 is greater than or equal to 0.001 (or 0.01) and less than or equal to 10,000 (or 8000, or 6000, or 5000, or 3000, or 500, or 100, or 50), but not limited thereto. According to some embodiments, the ratio of the minimum spacing G to the thickness T1 of the attachment 16 is greater than or equal to 0.1 and less than or equal to 5. According to some embodiments, the ratio of the minimum spacing G to the thickness T1 of the attachment 16 is greater than or equal to 1 and less than or equal to 3. The light guide plate 14 has a light incident side SA and an opposite side SB relative to the light incident side SA, and the light source L is adjacent to the light incident side SA. According to some embodiments, the light guide plate 14 is divided into 5 parts with equal proportions (e.g., equal width) along the X direction, and is divided into the first part to the fifth part in sequence from the light incident side SA to the opposite side SB. From the third part, we can select the minimum spacings measured by two adjacent optical units 18 of three groups and take the average to obtain the minimum spacing G.

[0090] By designing the ratio range of the above-mentioned minimum spacing G to the thickness T1 of the attachment 16, both optics and attachment yield can be taken into account. According to some embodiments, the size (width, depth or shape) of the optical unit 18 adjacent to the light source L (i.e., adjacent to the light incident side SA) and the optical unit 18 away from the light source L (i.e., adjacent to the opposite side SB) in the light guide plate 14 may be substantially the same, but is not limited thereto. According to some embodiments, the size (width, depth or shape) of the optical unit 18 adjacent to the light source L (i.e., adjacent to the light incident side SA) and the optical unit 18 away from the light source L (i.e., adjacent to the opposite side SB) in the light guide plate 14 may be different, but is not limited thereto. According to some embodiments, the minimum spacing G between two adjacent optical units 18 adjacent to the light source L (i.e., adjacent to the light incident side SA) in the light guide plate 14 and the minimum spacing G between two adjacent optical units 18 away from the light source L (i.e., adjacent to the opposite side SB) may be different, but is not limited thereto. As described above, the light-incident side SA to the opposite side SB are divided into the first to fifth parts in equal proportion, and the minimum spacing G between two adjacent optical units 18 in the first part and the minimum spacing G between two adjacent optical units 18 in the fifth part may be different. For example, the minimum spacing G between two adjacent optical units 18 in the first part may be greater than the minimum spacing G between two adjacent optical units 18 in the fifth part, so that light can be guided to the panel more evenly, but the present invention is not limited thereto. According to some embodiments, the density of the optical units 18 in the light guide plate 14 adjacent to the light source L (i.e., adjacent to the light-incident side SA) and the density away from the light source L (i.e., adjacent to the opposite side SB) may be different, but the present invention is not limited thereto. As described above, the light-incident side SA to the opposite side SB are divided into the first to fifth parts in equal proportion, and the density of the optical unit 18 located in the first part may be different from the density of the optical unit 18 located in the fifth part. For example, the density of the optical unit 18 located in the first part may be less than the density of the optical unit 18 located in the fifth part, so that the light can be guided to the panel more evenly, but it is not limited thereto. According to some embodiments (not shown), the thickness of the light guide plate 14 adjacent to the light source L (i.e., adjacent to the light-incident side SA) and the thickness away from the light source L (i.e., adjacent to the opposite side SB) may be the same or different.

[0091] See also Figure 4 According to an embodiment of the present disclosure, an electronic device 50 is provided. Figure 4 is a schematic cross-sectional view of an electronic device 50 . Figure 4 For example, the material examples, characteristics, dimensions, etc. of similar components (such as light guide plate, panel, protective substrate, attachment) in Figure 1 In the description.

[0092] like Figure 4As shown, the electronic device 50 is provided with a panel 52, an attachment 54, a light guide plate 56, an attachment 58, an attachment 60, a touch layer 62 (for example, an ITO film, but not limited thereto), an attachment 64, a touch layer 66 (for example, an ITO film, but not limited thereto), an attachment 68, and a protective substrate 70 from bottom to top. A capacitive touch component may be formed between the touch layer 62 and the touch layer 66, for example. According to some embodiments, one of the touch layer 62 and the touch layer 66, for example, transmits a sensing signal, and the other, for example, receives a sensing signal. According to some embodiments, the touch layer 62 and the touch layer 66 may selectively include a conductive layer (not shown) on the entire surface or a patterned touch conductive layer (not shown). According to some embodiments (not shown), a transparent substrate (glass or other transparent substrate) may be provided between the touch layer 62 (for example, an ITO film, but not limited thereto) and the touch layer 66 (for example, an ITO film, but not limited thereto), for example, but not limited thereto. It should be noted that any of the above-mentioned components may be selectively removed, or other components may be inserted between these components. The side of the light guide plate 56 away from the panel 52 has a plurality of optical units 57. The attachment 58 contacts the surface of the light guide plate 56 having the plurality of optical units 57. The loss tangent (tanδ) of the attachment 58 at 30°C is greater than 0 and less than or equal to 1. The detailed description of the attachment 58 can be referred to the above attachment 16, and the description will not be repeated. When the attachment 58 is a hard glue (i.e., a glue without fluidity), the attachment 58 does not need to be cured, so the measurement of the loss tangent of the attachment 58 is, for example, measured using an uncured attachment.

[0093] Similarly, panel 52 may include a reflective display or a transflective display.

[0094] According to some embodiments, the materials of the attachments 54 , 60 , 64 , and 68 may include light-transmitting materials, and the materials of these attachments may be the same as or different from those of the attachment 20 .

[0095] According to some embodiments, the attachment 58 is disposed between the attachment 60 and the light guide plate 56, and the attachment 60 is disposed between the touch layer 62 and the attachment 58. According to some embodiments, when the transmittance of the attachment 60 to light with a wavelength in the range of 380nm to 430nm (380nm≤wavelength≤430nm) is less than or equal to 20% (or 15%). At this time, the attachment 58 may selectively not need to have a design with a transmittance less than or equal to 20% (or 15%) for light with a wavelength in the range of 380nm to 430nm (380nm≤wavelength≤430nm). According to some embodiments, when the transmittance of the attachment 60 to light with a wavelength in the range of ultraviolet wavelength (for example, 20nm≤wavelength<380nm) is less than or equal to 20% (or 15%). At this time, the attachment 58 may selectively not need to have a design with a transmittance less than or equal to 20% (or 15%) for light with a wavelength in the range of ultraviolet wavelength (20nm≤wavelength<380nm).

[0096] According to some embodiments, different materials are selected for the attachment 60 and the attachment 58, and the loss tangent (tanδ) of the attachment 58 at 30°C may be less than the loss tangent (tanδ) of the attachment 60 at 30°C, but is not limited thereto. When the attachment 58 is a hard glue (i.e., a glue without fluidity), the attachment 58 may not need to be cured, so the loss tangent of the attachment 58 is measured, for example, using an uncured attachment. When the attachment 60 is a soft glue (i.e., a flowing glue with fluidity), the attachment 60 may need to be cured, so the loss tangent of the attachment 60 is measured, for example, using a cured attachment. According to some embodiments, the thickness of the attachment 60 is, for example, greater than or equal to the thickness of the attachment 58, but is not limited thereto. According to some embodiments, other base materials (not shown) may be selectively included between the attachment 60 and the attachment 58.

[0097] According to some embodiments, the attachment 54, the attachment 64, and / or the attachment 68 may be made of a different material than the attachment 58 or the attachment 60, but not limited thereto. According to some embodiments, the loss tangent (tanδ) of the attachment 58 at 30°C may be less than or equal to that of the attachment 54, the attachment 64, and / or the attachment 68, but not limited thereto. It should be noted that when the above-mentioned attachments (attachments 54, attachments 64, and / or attachments 68) are hard glue (i.e., glue without fluidity), the above-mentioned attachments may not need to be cured, so the loss tangent of the above-mentioned attachments is measured, for example, using an uncured attachment. When the above-mentioned attachments (attachments 54, attachments 64, and / or attachments 68) are soft glue (i.e., flowing glue with fluidity), the above-mentioned attachments may need to be cured, so the loss tangent of the above-mentioned attachments is measured, for example, using a cured attachment.

[0098] According to some embodiments, other optical layers (not shown, such as an anti-glare layer, an anti-reflection layer, and an anti-fouling layer, but not limited thereto) are further disposed on the protective substrate 70 .

[0099] According to some embodiments, an electronic device (not shown) is provided, the structure of which is similar to Figure 4 The difference between the electronic device 50 shown in FIG. 5 is that the electronic device does not have a touch component, for example, the touch component is omitted. Figure 4 The touch layer 62 (eg, ITO film), the attachment 64, the touch layer 66 (eg, ITO film), and the attachment 68. The rest is similar to Figure 4 The disclosed parts will not be repeated here.

[0100] See also Figure 5 According to an embodiment of the present disclosure, an electronic device 100 is provided. Figure 5 is a schematic cross-sectional view of the electronic device 100 . Figure 5 For example, the material examples, characteristics, dimensions, etc. of similar components (such as light guide plate, panel, protective substrate, attachment) in Figure 1 In the description.

[0101] like Figure 5 As shown, the electronic device 100 is provided with a panel 102, an attachment 104, a light guide plate 106, an attachment 108, a touch layer 110 (e.g., an ITO film), an attachment 112, a touch layer 114 (e.g., an ITO film), an attachment 116, and a protective substrate 118 from bottom to top. The description of the touch layer 110 (e.g., an ITO film) and the touch layer 114 (e.g., an ITO film) can refer to the description of the touch layer 62 and the touch layer 66 mentioned above. The light guide plate 106 has a plurality of optical units 107 on a side away from the panel 102. The attachment 108 contacts the surface of the light guide plate 106 having the plurality of optical units 107, and the loss tangent (tanδ) of the attachment 108 at 30°C is greater than 0 and less than or equal to 1. The details of the attachment 108 and the description of the measurement method of the loss tangent (tanδ) can refer to the above attachment 16, and the description will not be repeated.

[0102] According to some embodiments, the panel 102 may include a reflective display or a transflective display.

[0103] According to some embodiments, the materials of the attachments 104 , 108 , 112 , and 116 may include acrylic polymers or other suitable materials.

[0104] According to some embodiments, the attachment 104 is disposed between the panel 102 and the light guide plate 106. When the transmittance of the attachment 104 to light with a wavelength in the range of 380nm to 430nm (380nm≤wavelength≤430nm) is less than or equal to 20% (or 15%). At this time, the attachment 108 may selectively be designed not to have a transmittance less than or equal to 20% (or 15%) for light with a wavelength in the range of 380nm to 430nm (380nm≤wavelength≤430nm), but is not limited thereto. According to some embodiments, when the transmittance of the attachment 104 to light with a wavelength in the range of ultraviolet wavelength (for example, 20nm≤wavelength<380nm) is less than or equal to 20% (or 15%). At this time, the attachment 108 may selectively be designed not to have a transmittance less than or equal to 20% (or 15%) for light with a wavelength in the range of ultraviolet wavelength (for example, 20nm≤wavelength<380nm), but is not limited thereto.

[0105] According to some embodiments, the attachment 104 and the attachment 108 are made of different materials, and the loss tangent (tan δ) of the attachment 108 at 30° C. may be smaller than that of the attachment 104 , but the present invention is not limited thereto.

[0106] According to some embodiments, the materials of the attachments 112 and 116 may be different from those of the attachments 108 and 104, but are not limited thereto. According to some embodiments, the loss tangent (tanδ) of the attachment 108 at 30°C may be smaller than those of the attachments 112, 116 and / or 104, but are not limited thereto. According to some embodiments, the materials of the attachments 112 and 116 may be the same as those of the attachments 108 and 104, for example. It should be noted that when the above-mentioned attachments (attachments 112, 116, 108 or 104) are hard glue (i.e., glue without fluidity), the above-mentioned attachments may not need to be cured, so the loss tangent of the above-mentioned attachments is measured, for example, using uncured attachments. When the attachment is a soft glue (ie, a flowing glue with fluidity), the attachment may, for example, need to be cured. Therefore, the loss tangent of the attachment is measured, for example, using the cured attachment.

[0107] According to some embodiments, other optical layers (not shown, such as an anti-glare layer, an anti-reflection layer, and an anti-fouling layer) are further disposed on the protective substrate 118 , but the present invention is not limited thereto.

[0108] See also Figure 6 According to an embodiment of the present disclosure, an electronic device 200 is provided. Figure 6 is a schematic cross-sectional view of the electronic device 200 . Figure 6 For example, the material examples, characteristics, dimensions, etc. of similar components (such as light guide plate, panel, protective substrate, attachment) in Figure 1In the description.

[0109] like Figure 6 As shown, the electronic device 200 is provided with a panel 202, an attachment 204, a light guide plate 206, an attachment 208, a touch layer 210 (e.g., an ITO film), an attachment 212, a touch layer 214 (e.g., an ITO film), an attachment 216, and a protective substrate 218 from bottom to top. The description of the touch layer 210 (e.g., an ITO film) and the touch layer 214 (e.g., an ITO film) can refer to the description of the touch layer 62 and the touch layer 66 mentioned above. The light guide plate 206 has a plurality of optical units 207 on a side away from the panel 202. The attachment 208 contacts the surface of the light guide plate 206 having the plurality of optical units 207, and the loss tangent (tanδ) of the attachment 208 at 30°C is greater than 0 and less than or equal to 1. The material examples, characteristics, or loss tangent measurement method of the attachment 208 can refer to the aforementioned attachment 16.

[0110] According to some embodiments, panel 202 may include a reflective display or a transflective display.

[0111] According to some embodiments, the material of the attachment 204 , the attachments 208 , 212 , and the attachment 216 may include acrylic polymer or other suitable materials.

[0112] According to some embodiments, the attachment 216 is disposed between the touch layer 214 (e.g., an ITO film) and the protective substrate 218. According to some embodiments, the transmittance of the attachment 216 to light with a wavelength in the range of 380nm to 430nm (380nm≤wavelength≤430nm) is less than or equal to 20% (or 15%), but not limited thereto. According to some embodiments, the transmittance of the attachment 216 to light with a wavelength in the range of ultraviolet wavelength (20nm≤wavelength<380nm) is less than or equal to 20% (or 15%), but not limited thereto. In other embodiments, the attachment 212 disposed between the touch layer 214 (e.g., an ITO film) and the touch layer 210 (e.g., an ITO film) may selectively have a transmittance of less than or equal to 20% (or 15%) to light with a wavelength in the range of 380nm to 430nm (380nm≤wavelength≤430nm), but not limited thereto.

[0113] According to some embodiments, the attachment 208 and the attachment 216, the attachment 212 and / or the attachment 204 may be made of different materials, and the loss tangent (tanδ) of the attachment 208 at 30°C may be smaller than that of the attachment 216, the attachment 212 and / or the attachment 204, but it is not limited thereto. According to some embodiments, the attachment 208 and the attachment 216, the attachment 212 and / or the attachment 204 may be made of the same material. It should be noted that when the above-mentioned attachments (attachments 208, attachments 216, attachments 212 or attachments 204) are hard glue (i.e., glue without fluidity), the above-mentioned attachments do not need to be cured, so the measurement of the loss tangent of the above-mentioned attachments is, for example, measured using uncured attachments. When the above-mentioned attachment (attachment 208, attachment 216, attachment 212 or attachment 204) is soft glue (i.e., flowing glue with fluidity), the above-mentioned attachment may, for example, need to be cured, so the measurement of the loss tangent of the above-mentioned attachment is measured, for example, using the cured attachment.

[0114] According to some embodiments, other optical layers (not shown, such as an anti-glare layer, an anti-reflection layer, and an anti-fouling layer) are further disposed on the protective substrate 218 , but the present invention is not limited thereto.

[0115] See also Figure 7 According to an embodiment of the present disclosure, an electronic device 500 is provided. Figure 7 is a schematic cross-sectional view of the electronic device 500 . Figure 7 For example, the material examples, characteristics, dimensions, etc. of similar components (such as light guide plate, panel, protective substrate, attachment) in Figure 1 In the description.

[0116] like Figure 7 As shown, the electronic device 500 is provided with a panel 502, an attachment 504, a light guide plate 506, an attachment 508, a touch layer 510 (e.g., an ITO film), an attachment 512, a touch layer 514 (e.g., an ITO film), an attachment 516, and a protective substrate 518 from bottom to top, but is not limited thereto. The description of the touch layer 510 (e.g., an ITO film) and the touch layer 514 (e.g., an ITO film) can refer to the description of the above-mentioned touch layer 62 and the touch layer 66. The light guide plate 506 has a plurality of optical units 507 on a side away from the panel 502. The attachment 508 contacts the surface of the light guide plate 506 having the plurality of optical units 507, and the loss tangent (tanδ) of the attachment 508 at 30°C is greater than 0 and less than or equal to 1. According to some embodiments, the loss tangent of the adhesive 508 at 30° C. is greater than 0 and less than or equal to 0.5 or the loss tangent at 30° C. is greater than 0 and less than or equal to 0.3, but is not limited thereto.

[0117] The material examples, characteristics or loss tangent measurement method of the attachment 508 may refer to the aforementioned attachment 16 .

[0118] According to some embodiments, panel 502 may include a reflective display or a transflective display.

[0119] According to some embodiments, the materials of the attachments 504 , 508 , 512 , and 516 may include acrylic polymers or other suitable materials.

[0120] According to some embodiments, the loss angle of the attachment 508 is cut off outside the above range, and its transmittance to light with a wavelength in the range of 380nm to 430nm (380nm≤wavelength≤430nm) is less than or equal to 20% (or less than 15%). According to some embodiments, the loss angle of the attachment 508 is cut off outside the above range, and its transmittance to light with a wavelength in the range of ultraviolet wavelength (20nm≤wavelength<380nm) is less than or equal to 20% (or less than 15%).

[0121] According to some embodiments, the transmittance of the attachment 504, attachment 512, and / or 516 to light with a wavelength between 380nm and 430nm (380nm≤wavelength≤430nm) may be less than or equal to 20% (15%), but is not limited thereto.

[0122] According to some embodiments, other optical layers (not shown, such as an anti-glare layer, an anti-reflection layer, and an anti-fouling layer) are further disposed on the protective substrate 518 , but the present invention is not limited thereto.

[0123] According to some embodiments, an electronic device (not shown) is provided, the structure of which is similar to Figure 7 The difference between the electronic device 500 shown in FIG. 5 is that the electronic device does not have a touch component. Figure 7 The touch layer 510 (eg, an ITO film), the attachment 512, the touch layer 514 (eg, an ITO film), and the attachment 516 are similar to the Figure 7 The disclosed parts will not be repeated here.

[0124] This embodiment conducts transmittance tests at different wavelengths for the wavelength-reducing light attachments (eg, samples 1 and 2) used in the present disclosure. The results are shown in FIGS. 8A and 8B . Figure 8B for Fig. 8A A partial enlarged view of .

[0125] From the results of Figures 8A and 8B, it can be seen that the transmittance of sample 1 is less than or equal to 20% at least in the range of wavelengths between 300nm and 370nm (300nm≤wavelength≤370nm). Similarly, the transmittance of sample 2 is also less than or equal to 20% at least in the range of wavelengths between 300nm and 385nm (300nm≤wavelength≤385nm). This result verifies that the attachment for reducing wavelength light (e.g., reducing ultraviolet light) used on the panel in combination with the present disclosure can reduce the light transmittance of low wavelength light, such as reducing the transmittance of at least part of the ultraviolet wavelength light, thereby reducing the risk of degradation of the liquid crystal of the panel due to ultraviolet light irradiation.

[0126] See also Fig. 9 According to an embodiment of the present disclosure, an electronic device 1000 is provided. Fig. 9 is a schematic cross-sectional view of the electronic device 1000 . Fig. 9 For example, the material examples, characteristics, dimensions, etc. of similar components (such as panels, protective substrates, and attachments) in Figure 1 In the description.

[0127] like Fig. 9 As shown, the electronic device 1000 is provided with a handwriting tablet P1, a panel 1002, an attachment 1004, a touch layer 1006 (e.g., an ITO film), an attachment 1008, a touch layer 1010 (e.g., an ITO film), an attachment 1012, and a protective substrate 1014 from bottom to top. The description of the touch layer 1006 (e.g., an ITO film) and the touch layer 1010 (e.g., an ITO film) can refer to the description of the touch layer 62 and the touch layer 66 described above. Fig. 9 In the embodiment, the electronic device 1000 is not provided with a light guide plate and a light source. The panel 1002 and the handwriting board P1 can be bonded together through other attachments (not shown).

[0128] According to some embodiments, panel 1002 may include a reflective display or a transflective display.

[0129] According to some embodiments, the materials of the attachments 1004 , 1008 , and 1012 may include acrylic polymers or other suitable materials.

[0130] According to some embodiments, the transmittance of the attachment 1004 , the attachment 1008 and / or the attachment 1012 to light with a wavelength ranging from 380 nm to 430 nm (380 nm ≤ wavelength ≤ 430 nm) is less than or equal to 20% (or 15%).

[0131] According to some embodiments, other optical layers (not shown, such as an anti-glare layer, an anti-reflection layer, and an anti-fouling layer) are further disposed on the protective substrate 1014 , but the present invention is not limited thereto.

[0132] According to some embodiments, an electronic device (not shown) is provided, the structure of which is similar to Fig. 9 The difference between the electronic device 1000 shown in FIG. 1 and the electronic device 1000 is that the electronic device does not have a touch component. Fig. 9 The attachment 1004, the touch layer 1006 (eg, an ITO film), the attachment 1008, and the touch layer 1010 (eg, an ITO film) in FIG. Fig. 9 The disclosed parts will not be repeated here.

[0133] According to some embodiments, an electronic device (not shown) is provided, the structure of which is similar to Fig. 9 The difference between the electronic device 1000 shown in FIG. 1 and the electronic device 1000 is that the electronic device is provided with a single touch layer (eg, an ITO film), for example, omitting the touch layer. Fig. 9 The attachment 1008 and the touch layer 1010 (such as an ITO film) are shown in FIG. Fig. 9 The disclosed parts will not be repeated here.

[0134] See also Fig.10 According to one embodiment of the present disclosure, an electronic device 5000 is provided. Fig.10 is a schematic cross-sectional view of the electronic device 5000 . Fig.10 For example, the material examples, characteristics, dimensions, etc. of similar components (e.g., light guide plate, panel, protective substrate, attachment) in Figure 1 In the description.

[0135] like Fig.10 As shown, the electronic device 5000 is provided with a panel 5200, an attachment 5400, a light guide plate 5600, an attachment 5800, an attachment 6000, a touch layer 6200 (for example, an ITO film, but not limited to this), an attachment 6400, a touch layer 6600 (for example, an ITO film, but not limited to this), an attachment 6800 and a protective substrate 7000 from bottom to top, but not limited to this.

[0136] like Fig.10 As shown, the light guide plate 5600 is disposed on the panel 5200 and has a first surface 5600a and a second surface 5600b opposite to each other. The first surface 5600a is away from the panel 5200, and the first surface 5600a has a plurality of optical units 5700 (recessed structures) and a plurality of protrusion structures 5750. The plurality of protrusion structures 5750 (recessed structures) are respectively adjacent to the plurality of optical units 5700. The protrusion structures 5750 are, for example, surrounding the periphery of the optical units 5700 (see Fig.10The top view outline of the optical unit 5700 and the protrusion structure 5750 is enlarged by the arrow). The protective substrate 7000 is disposed on the light guide plate 5600. The attachment 5800 is disposed between the light guide plate 5600 and the protective substrate 7000, and contacts the first surface 5600a of the light guide plate 5600. The attachment 6000 is disposed between the attachment 5800 and the protective substrate 7000. According to some embodiments, the thickness Ta3 of the protrusion structure 5750 is greater than 0 and less than or equal to 8μm, or greater than 0 and less than or equal to 7μm, or greater than 0 and less than or equal to 6μm, or greater than 0 and less than or equal to 5μm, but is not limited thereto.

[0137] like Fig.10 As shown, a capacitive touch component may be formed between the touch layer 6200 and the touch layer 6600, for example. According to some embodiments, one of the touch layer 6200 and the touch layer 6600, for example, transmits a sensing signal, and the other, for example, receives a sensing signal, but is not limited thereto. According to some embodiments, the touch layer 6200 and the touch layer 6600 may selectively include a conductive layer (not shown) on the entire surface or a patterned touch conductive layer (not shown). According to some embodiments (not shown), a transparent substrate (glass or other transparent substrate) may be provided between the touch layer 6200 (for example, an ITO film, but not limited thereto), but is not limited thereto.

[0138] According to some embodiments, any one of the above components may be selectively removed, or other components may be inserted between these components.

[0139] According to some embodiments, panel 5200 may include a reflective display or a transflective display.

[0140] According to some embodiments, along the normal direction N of the panel 5200, the thickness Ta2 of the attachment 6000 is greater than the thickness Ta3 of one of the plurality of protrusion structures 5750. According to some embodiments, along the normal direction N of the panel 5200, the thickness Ta2 of the attachment 6000 is greater than the thickness Ta1 of the attachment 5800. According to some embodiments, the ratio of the thickness Ta2 of the attachment 6000 to the thickness Ta1 of the attachment 5800 is greater than or equal to 2 and less than or equal to 20, but is not limited thereto. According to some embodiments, the ratio of the thickness Ta2 of the attachment 6000 to the thickness Ta1 of the attachment 5800 is greater than or equal to 4 and less than or equal to 16. According to some embodiments, the ratio of the thickness Ta2 of the attachment 6000 to the thickness Ta1 of the attachment 5800 is greater than or equal to 6 and less than or equal to 14. According to some embodiments, the ratio of the thickness Ta2 of the attachment 6000 to the thickness Ta1 of the attachment 5800 is greater than or equal to 8 and less than or equal to 12. If the attachment 6000 is too thin, the filling effect is not good, and if the attachment 6000 is too thick, the cost and stacking thickness are increased. According to some embodiments, the thickness Ta2 of the attachment 6000 is greater than the thickness Ta1 of the attachment 5800, and the thickness Ta1 of the attachment 5800 is greater than the thickness Ta3 of one of the plurality of protruding structures 5750. When the thickness Ta2 of the attachment 6000 is greater than the thickness Ta1 of the attachment 5800 and the thickness Ta3 of one of the plurality of protruding structures 5750, the filling effect is good. The thickness Ta1 is measured, for example, by selecting any three areas under the area of ​​the attachment 5800 that does not overlap the protruding structure 5750 on a cross section and taking the average to obtain the thickness. The thickness Ta2 is measured, for example, by selecting any three areas under the area of ​​the attachment 6000 that does not overlap the protruding structure 5750 on a cross section and taking the average to obtain the thickness.

[0141] According to some embodiments, at 30° C., the loss tangent (tan δ) of the adhesive 5800 is greater than 0 and less than or equal to 0.4, or greater than 0 and less than or equal to 0.35, or greater than 0 and less than or equal to 0.3, but not limited thereto. It should be noted that when the adhesive 5800 is a hard glue (i.e., a glue without fluidity), the adhesive 5800 does not need to be cured, so the loss tangent of the adhesive 5800 is measured, for example, using an uncured adhesive.

[0142] According to some embodiments, at 30° C., the loss tangent of the attachment 6000 is greater than or equal to 0.4 and less than 1, or greater than or equal to 0.5 and less than 0.9, or greater than or equal to 0.6 and less than 0.8, but not limited thereto. When the attachment 6000 is a soft glue (i.e., a fluid glue with fluidity), the attachment 6000 may, for example, need to be cured, so the loss tangent of the attachment 6000 is measured, for example, using the cured attachment.

[0143] According to some embodiments, at 30° C., the loss tangent of the attachment 5800 is less than the loss tangent of the attachment 6000. According to some embodiments, at 30° C., the ratio of the loss tangent of the attachment 5800 to the loss tangent of the attachment 6000 is greater than or equal to 0.01 and less than 1, or greater than or equal to 0.05 and less than 0.8, or greater than or equal to 0.05 and less than 0.6, but is not limited thereto.

[0144] According to some embodiments, the loss modulus of the attachment 5800 is greater than or equal to 10Kpa and less than or equal to 70Kpa, or greater than or equal to 20Kpa and less than or equal to 60Kpa, or greater than or equal to 30Kpa and less than or equal to 50Kpa, but not limited thereto. According to some embodiments, the loss modulus of the attachment 6000 is greater than or equal to 10Kpa and less than or equal to 70Kpa, or greater than or equal to 20Kpa and less than or equal to 60Kpa, or greater than or equal to 30Kpa and less than or equal to 50Kpa, but not limited thereto. According to some embodiments, the storage modulus of the attachment 5800 is greater than or equal to 200Kpa and less than or equal to 400Kpa, or greater than or equal to 220Kpa and less than or equal to 380Kpa, or greater than or equal to 250Kpa and less than or equal to 350Kpa, or greater than or equal to 280Kpa and less than or equal to 320Kpa, but not limited thereto. According to some embodiments, the storage modulus of the attachment 6000 is greater than or equal to 20Kpa and less than or equal to 100Kpa, or greater than or equal to 25Kpa and less than or equal to 95Kpa, or greater than or equal to 30Kpa and less than or equal to 90Kpa, or greater than or equal to 35Kpa and less than or equal to 85Kpa, but not limited thereto. It should be noted that when the attachment 5800 is a hard glue (i.e., a glue without fluidity), the attachment 5800 may not need to be cured, so the loss modulus or storage modulus of the attachment 5800 is measured, for example, using an uncured attachment. When the attachment 6000 is a soft glue (i.e., a flowing glue with fluidity), the attachment 6000 may need to be cured, so the loss modulus or storage modulus of the attachment 6000 is measured, for example, using a cured attachment.

[0145] According to some embodiments, at least one of the attachments 5800 and 6000 has a transmittance of less than or equal to 20% for light with a wavelength in the range of 380nm to 430nm (380nm≤wavelength≤430nm), but is not limited thereto. According to some embodiments, at least one of the attachments 5800 and 6000 has a transmittance of less than or equal to 20% (or 15%) for light with a wavelength in the range of ultraviolet wavelength (20nm≤wavelength<380nm), but is not limited thereto. According to some embodiments, at least one of the attachments 5800 and 6000 has a transmittance of less than or equal to 20% (or 15%) for light with a wavelength less than or equal to 430nm (wavelength≤430nm), but is not limited thereto. For example, at least one of the attachments 5800 and 6000 has a transmittance of less than or equal to 420nm (wavelength≤420nm), but is not limited thereto. For example, the transmittance of at least one of the attachments 5800 and 6000 to wavelengths less than or equal to 400nm (wavelength ≤ 400nm) is less than or equal to 20% (or 15%). For example, the transmittance of at least one of the attachments 5800 and 6000 to wavelengths less than or equal to 380nm (wavelength ≤ 380nm) is less than or equal to 20% (or 15%). The transmittance design of the above-mentioned attachments in different wavelength ranges can reduce the possibility of degradation of the panel due to the influence of short-wavelength light (such as ultraviolet light or other light).

[0146] See also Fig.11 According to one embodiment of the present disclosure, the appearance of the protrusion structure 5750 in the electronic device 5000 is described. Fig.11 It is a cross-sectional schematic diagram of the protrusion structure 5750 in the electronic device 5000 .

[0147] like Fig.11 As shown, the relatively flat parts of the first surface 5600a of the light guide plate 5600 are connected to form a baseline B. The part protruding above the baseline B is called a protrusion structure, and the thickness Ta3 of the protrusion structure 5750 can be calculated, for example, from the baseline B to the highest point of the protrusion structure 5750. Fig.11In a cross section, the protrusion structure 5750 includes a first protrusion structure 5750a and a second protrusion structure 5750b, which are respectively located on both sides of the optical unit 5700. According to some embodiments, the thickness H1 of the first protrusion structure 5750a may be different from or the same as the thickness H2 of the second protrusion structure 5750b. The thickness H1 may be calculated, for example, from the baseline B to the highest point of the first protrusion structure 5750a. The thickness H2 may be calculated, for example, from the baseline B to the highest point of the second protrusion structure 5750b. According to some embodiments, the width W1 of the first protrusion structure 5750a may be different from the width W2 of the second protrusion structure 5750b. According to some embodiments, the first protrusion structure 5750a and the second protrusion structure 5750b are asymmetric protrusion structures. According to some embodiments (not shown), the first protrusion structure 5750a and the second protrusion structure 5750b are symmetric protrusion structures.

[0148] According to some embodiments, other optical layers (not shown, such as, but not limited to, an anti-glare layer, an anti-reflection layer, and an anti-fouling layer) are selectively disposed on the protective substrate 7000 .

[0149] According to some embodiments, an electronic device (not shown) is provided, the structure of which is similar to Fig.10 The difference between the electronic device 5000 shown in FIG. 5 is that the electronic device does not have a touch component. Fig.10 The touch layer 6200 (eg, an ITO film), the attachment 6400, the touch layer 6600 (eg, an ITO film), and the attachment 6800 are similar to the above. Fig.10 The disclosed parts will not be repeated here.

[0150] See also Fig.12 According to an embodiment of the present disclosure, a method for manufacturing an electronic device 5000 is provided. Fig.12 It is a cross-sectional schematic diagram of a method for manufacturing the electronic device 5000.

[0151] For the convenience of description, the manufacturing method of the electronic device 5000 is described here with components such as the light guide plate 5600, the attachment 5800, the attachment 6000, and the protective substrate 7000. Here, the manufacturing method of the electronic device 5000 includes at least three methods, such as Fig.12 For example, the first method is to first attach the attachment 6000 to the protective substrate 7000 and attach the attachment 5800 to the light guide plate 5600, and then align the protective substrate 7000 including the attachment 6000 and the light guide plate 5600 including the attachment 5800 to manufacture the electronic device 5000.

[0152] For example, the second method is to first attach the attachment 5800 and the attachment 6000 to the light guide plate 5600 , and then attach the light guide plate 5600 including the attachment 5800 and the attachment 6000 to the protection substrate 7000 to manufacture the electronic device 5000 .

[0153] For example, the first method is to first attach the attachment 6000 and the attachment 5800 to the protective substrate 7000 , and then attach the protective substrate 7000 including the attachment 6000 and the attachment 5800 to the light guide plate 5600 to manufacture the electronic device 5000 .

[0154] See also Fig.13 According to an embodiment of the present disclosure, an electronic device 5000' is provided. Fig.13 It is a cross-sectional schematic diagram of an electronic device 5000 ′.

[0155] like Fig.13 As shown, the structure of the electronic device 5000' is similar to Fig.10 The difference between the electronic device 5000 shown in the figure mainly lies in that the electronic device may be additionally provided with a substrate 5900 between the attachment 5800 and the attachment 6000. According to some embodiments, the substrate 5900 may be a thin transparent substrate. According to some embodiments, the thickness Ta4 of the substrate 5900 is less than the thickness of the upper and lower substrates (not shown) in the panel 5200. According to some embodiments, the thickness Ta4 of the substrate 5900 is less than the thickness Ta2 of the attachment 6000. According to some embodiments (not shown), the thickness Ta4 of the substrate 5900 is greater than the thickness Ta2 of the attachment 6000 and the thickness Ta1 of the attachment 5800. The rest is similar to Fig.10 The disclosed part will not be described here. Fig.10 The disclosed part will not be described again here. The thickness Ta4 is measured by, for example, selecting any three regions in a cross section of the substrate 5900 that are not overlapped with the protrusion structure 5750 and taking the average value.

[0156] It should be noted that in other embodiments, a handwriting board may also be disposed below the panel.

[0157] It should be noted that the touch layer of the above different embodiments may include touch glass, touch layer or other components with touch function, but is not limited thereto. According to some embodiments, the touch layer may include touch electrodes and wires electrically connected thereto. According to some embodiments, the materials of the touch electrodes and wires may include metal materials or transparent conductive materials.

[0158] The present disclosure designs an attachment with a loss tangent less than or equal to 1 at 30°C, and adheres the attachment to a side of a light guide plate having multiple optical units. Since such attachments have greater rigidity, such attachments are not easy to fill into the mesh of the light guide plate after being adhered to the light guide plate, which can reduce the glare effect and maintain the light guiding efficiency. Furthermore, the present disclosure, in addition to the attachment (hard glue) provided between the protective substrate and the light guide plate, further adds an attachment (soft glue) with a high loss tangent (tanδ). The attachment (soft glue) can be used to fill the concave and convex structure formed on the attachment (hard glue). When the light guide plate and the protective substrate are adhered to each other through the above-mentioned composite glue, the mura phenomenon caused by bubbles generated at the protrusions can be reduced.

[0159] It should be noted that when the attachment mentioned in this case is a hard glue (i.e., a glue without fluidity), the attachment may not need to be cured, so the loss tangent, loss modulus, or storage modulus of the attachment is measured, for example, using the attachment that does not need to be cured. It should be noted that when the attachment mentioned in this case is a soft glue (i.e., a flowing glue with fluidity), the attachment may need to be cured, so the loss tangent, loss modulus, or storage modulus of the attachment is measured, for example, using the cured attachment.

[0160] The components of some of the above-mentioned embodiments are provided so that those skilled in the art can better understand the viewpoints of the embodiments of the present disclosure. Those skilled in the art should understand that they can design or modify other processes and structures based on the embodiments of the present disclosure to achieve the same purposes and / or advantages as the embodiments introduced herein. Those skilled in the art should also understand that such equivalent structures do not deviate from the spirit and scope of the present disclosure, and they can make various changes, substitutions and replacements without violating the spirit and scope of the present disclosure. Therefore, the scope of protection of the present disclosure shall be determined by the appended claims. In addition, although the present disclosure has been disclosed as above with several preferred embodiments, it is not intended to limit the present disclosure.

[0161] References throughout this specification to features, advantages, or similar language do not imply that all features and advantages that may be realized using the present disclosure should or may be realized in any single embodiment of the present disclosure. Conversely, language referring to features and advantages is understood to mean that a particular feature, advantage, or characteristic described in conjunction with an embodiment is included in at least one embodiment of the present disclosure. Thus, discussions of features and advantages and similar language throughout this specification may, but do not necessarily, represent the same embodiment.

[0162] Furthermore, in one or more embodiments, the described features, advantages, and characteristics of the present disclosure may be combined in any suitable manner. Based on the description herein, those skilled in the relevant art will appreciate that the present disclosure may be implemented without one or more specific features or advantages of a particular embodiment. In other cases, additional features and advantages may be identified in certain embodiments, which may not be present in all embodiments of the present disclosure.

Claims

1. An electronic device, characterized in that: include: One panel; A light guide plate is disposed on the panel, wherein the light guide plate has a first surface, and the first surface has a plurality of optical units; as well as An adhesive member contacts a portion of the first surface of the light guide plate, wherein a loss tangent (tanδ) of the adhesive member at 30° C. is greater than 0 and less than or equal to 1.

2. The electronic device according to claim 1, wherein: The light guide plate has a second surface opposite to the first surface, and the second surface is adjacent to the panel.

3. The electronic device according to claim 1, wherein: The attachment has a loss tangent at 30° C. greater than 0 and less than or equal to 0.

3.

4. The electronic device according to claim 1, wherein: The storage modulus of the attachment at 30° C. is greater than or equal to 10 KPa and less than or equal to 2,000 KPa.

5. The electronic device according to claim 1, wherein: The loss modulus of the attachment at 30° C. is greater than or equal to 5 KPa and less than or equal to 300 KPa.

6. The electronic device as claimed in claim 1, wherein: One of the plurality of optical units has a depth, the attachment has a thickness, and a ratio of the depth to the thickness is greater than or equal to 0.01 and less than or equal to 0.

33.

7. The electronic device as claimed in claim 1, characterized in that: Two adjacent optical units are spaced apart by a minimum distance. The attachment has a thickness, and a ratio of the minimum distance to the thickness is greater than or equal to 1 and less than or equal to 3.

8. The electronic device as claimed in claim 1, wherein: The transmittance of the attachment to light with a wavelength ranging from 380nm to 430nm is less than or equal to 20%.

9. The electronic device as claimed in claim 1, wherein: The loss tangent of the attachment at 95° C. is greater than 0.1 and less than or equal to 1, and the loss tangent of the attachment at 95° C. is greater than the loss tangent of the attachment at 30° C.

10. The electronic device as claimed in claim 1, further comprising another attachment disposed on the attachment, wherein a loss tangent of the attachment at 30°C is smaller than a loss tangent of the other attachment at 30°C.

11. An electronic device, characterized in that: include: One panel; A light guide plate is disposed on the panel, wherein the light guide plate has a first surface, and the first surface has a plurality of optical units; as well as An attachment member contacts a portion of the first surface of the light guide plate, wherein a distance is spaced between the attachment member and at least one of the plurality of optical units.

12. The electronic device according to claim 11, wherein: A ratio of the pitch to a depth of one of the plurality of optical units is greater than or equal to 0.3 and less than or equal to 1.

13. The electronic device according to claim 11, wherein: The light guide plate has a second surface opposite to the first surface, and the second surface is adjacent to the panel.

14. An electronic device, characterized in that: include: One panel; A light guide plate is disposed on the panel and has a first surface and a second surface opposite to each other, wherein the first surface is away from the panel and has a plurality of recessed structures and a plurality of protruding structures, and the plurality of protruding structures are respectively adjacent to the plurality of recessed structures; A protective substrate, disposed on the light guide plate; a first attachment member disposed between the light guide plate and the protective substrate and contacting the first surface; as well as A second adhesive member is disposed between the first adhesive member and the protective substrate, wherein along the normal direction of the panel, the thickness of the second adhesive member is greater than the thickness of one of the plurality of protrusion structures.

15. The electronic device as claimed in claim 14, characterized in that: At 30° C., the loss tangent of the first attachment is smaller than the loss tangent of the second attachment.

16. The electronic device as claimed in claim 15, characterized in that: At 30° C., a loss tangent of the first adhesive member is greater than 0 and less than or equal to 0.

4.

17. The electronic device according to claim 15, wherein: At 30° C., a loss tangent of the second adhesive is greater than or equal to 0.4 and less than 1.

18. The electronic device according to claim 15, wherein: At 30° C., a ratio of a loss tangent of the first attachment to a loss tangent of the second attachment is greater than or equal to 0.01 and less than 1.

19. The electronic device as claimed in claim 14, wherein: Along the normal direction of the panel, the thickness of the second attachment member is greater than the thickness of the first attachment member.

20. The electronic device as claimed in claim 19, wherein: A ratio of the thickness of the second attachment member to the thickness of the first attachment member is greater than or equal to 2 and less than or equal to 20.

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