Liquid cooling flow determination method and device, electronic equipment and storage medium

By obtaining the thermal design power consumption and maximum frequency in the liquid-cooled server and adjusting the current and liquid-cooled flow, the problem of not being able to determine the maximum liquid-cooled flow in the prior art is solved, and efficient heat dissipation is achieved under the full load state of all cores of the processor.

CN119960577AActive Publication Date: 2025-05-09INSPUR SUZHOU INTELLIGENT TECH CO LTD
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Patent Information

Application Number
CN202510121507.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-01-24
Publication Date
2025-05-09
Estimated Expiration
2045-01-24

AI Technical Summary

Technical Problem

The prior art is difficult to meet the cooling requirements of the liquid-cooled server when all processing cores of the processor are simultaneously running at full load, resulting in the inability to determine the maximum liquid-cooled flow required by the liquid-cooled server.

Method used

By obtaining the thermal design power consumption and maximum frequency of the liquid-cooled server, the initial liquid-cooled flow rate is determined, and when the processor load is adjusted to the maximum load, the relationship between the first frequency and the maximum frequency is determined, and the current and liquid-cooled flow rate are adjusted until the frequency is equal to the maximum frequency, thereby determining the maximum liquid-cooled flow rate.

Benefits of technology

It realizes the maximum liquid cooling flow required for the liquid cooling server under the full load state of all processing cores of the processor, ensuring that the liquid cooling system can meet the processor's heat dissipation needs and improving the efficiency and stability of the system.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses a liquid cooling flow determination method, electronic equipment and a storage medium, and relates to the technical field of servers, and the method comprises the steps: adjusting the processor load of a liquid cooling server to the maximum load under the condition that the liquid cooling server is subjected to liquid cooling according to the initial liquid cooling flow, and then the size between the first frequency and the maximum frequency of the liquid cooling server under the maximum load is judged. When the first frequency is greater than or equal to the maximum frequency, determining the initial liquid cooling flow as the maximum liquid cooling flow; under the condition that the first frequency is smaller than the maximum frequency, current adjustment processing and liquid cooling flow adjustment processing are carried out on the liquid cooling server at least once, so that the frequency of the liquid cooling server under the adjustment current is gradually increased until the frequency of the liquid cooling server is equal to the maximum frequency; and determining the liquid cooling flow of the liquid cooling server at the moment as the maximum liquid cooling flow. According to the scheme provided by the invention, the maximum liquid cooling flow required by the liquid cooling server can be determined.
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Description

Technical Field

[0001] The present application relates to the field of server technology, and in particular to a method, device, electronic device and storage medium for determining a liquid cooling flow rate. Background Art

[0002] The liquid-cooled server dissipates heat from the processor of the liquid-cooled server through circulating coolant. In some scenarios, all processing cores of the processor in the liquid-cooled server are required to run at full load at the same time.

[0003] In the related art, multiple temperature intervals are determined at the liquid cooling control end, each temperature interval corresponds to a preset liquid cooling flow rate, and when the temperature of the processor reaches a certain temperature interval, the liquid cooling flow rate of the liquid cooling server is set according to the preset liquid cooling flow rate corresponding to the temperature interval. However, when all the processing cores of the processor are running at full load at the same time, the power consumption of the processor will reach the maximum value, resulting in the liquid cooling flow rate determined by the above method being unable to meet the heat dissipation requirements of the liquid cooling server. Therefore, a method for determining the maximum liquid cooling flow rate required by the liquid cooling server is urgently needed. Summary of the invention

[0004] The present application provides a method, device, equipment and storage medium for determining a liquid cooling flow rate, which are used to determine a maximum liquid cooling flow rate required by a liquid cooling server.

[0005] The present application provides a method for determining a liquid cooling flow rate, comprising:

[0006] Get the thermal design power consumption and maximum frequency of the liquid-cooled server;

[0007] According to the thermal design power consumption, an initial liquid cooling flow corresponding to the liquid cooling server is determined, and according to the initial liquid cooling flow, a liquid cooling system is controlled to perform liquid cooling on the liquid cooling server;

[0008] adjusting a processor load of the liquid cooling server to a maximum load, and obtaining a first frequency of the liquid cooling server under the maximum load;

[0009] If the first frequency is greater than or equal to the maximum frequency, the initial liquid cooling flow rate is determined as the maximum liquid cooling flow rate;

[0010] If the first frequency is less than the maximum frequency, the liquid cooling server is subjected to at least one current adjustment process and a liquid cooling flow adjustment process until the frequency of the liquid cooling server is equal to the maximum frequency, and the maximum liquid cooling flow is determined.

[0011] The present application provides a device for determining a liquid cooling flow rate, comprising:

[0012] An acquisition module, used for acquiring thermal design power consumption and maximum frequency of a liquid cooling server;

[0013] A processing module, used to determine an initial liquid cooling flow rate corresponding to the liquid cooling server according to the thermal design power consumption, and control the liquid cooling system to liquid cool the liquid cooling server according to the initial liquid cooling flow rate;

[0014] An adjustment module, used to adjust the processor load of the liquid cooling server to a maximum load, and obtain a first frequency of the liquid cooling server under the maximum load;

[0015] a first determining module, configured to determine the initial liquid cooling flow rate as the maximum liquid cooling flow rate if the first frequency is greater than or equal to the maximum frequency;

[0016] The second determination module is used to perform at least one current adjustment process and a liquid cooling flow adjustment process on the liquid cooling server if the first frequency is less than the maximum frequency, until the frequency of the liquid cooling server is equal to the maximum frequency, and then determine the maximum liquid cooling flow.

[0017] The present application also provides an electronic device, comprising: a memory for storing a computer program; and a processor for implementing the steps of any of the above-mentioned methods for determining a liquid cooling flow rate when executing the computer program.

[0018] The present application also provides a computer-readable storage medium, in which a computer program is stored, wherein when the computer program is executed by a processor, the steps of any of the above-mentioned methods for determining the liquid cooling flow rate are implemented.

[0019] The method, device, electronic device and storage medium for determining the liquid cooling flow provided in the embodiments of the present application control the liquid cooling system to liquid cool the liquid cooling server according to the initial liquid cooling flow, and when the liquid cooling server is liquid cooled according to the initial liquid cooling flow, the processor load of the liquid cooling server is adjusted to the maximum load, and then the size between the first frequency and the maximum frequency of the liquid cooling server under the maximum load is determined. When the first frequency is greater than or equal to the maximum frequency, the initial liquid cooling flow is determined as the maximum liquid cooling flow; when the first frequency is less than the maximum frequency, the liquid cooling server is subjected to at least one current adjustment process and liquid cooling flow adjustment process, so that the frequency of the liquid cooling server under the adjusted current gradually increases until the frequency of the liquid cooling server is equal to the maximum frequency, and then the liquid cooling flow of the liquid cooling server at this time is determined as the maximum liquid cooling flow. Through the above method, the maximum liquid cooling flow required by the liquid cooling server can be determined. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0021] Figure 1 A schematic diagram of an application scenario provided for an embodiment of the present application;

[0022] Figure 2 A flow chart of a method for determining a liquid cooling flow rate provided in an embodiment of the present application Figure 1 ;

[0023] Figure 3 A schematic diagram of a process for determining a maximum liquid cooling flow rate provided in an embodiment of the present application;

[0024] Figure 4 A schematic diagram of the structure of a remote control terminal provided in an embodiment of the present application;

[0025] Figure 5 A flow chart of a method for determining a liquid cooling flow rate provided in an embodiment of the present application Figure 2 ;

[0026] Figure 6 A schematic diagram of the structure of a device for determining a liquid cooling flow rate provided in an embodiment of the present application;

[0027] Figure 7 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0029] It should be noted that, in the description of this application, the terms "include", "comprise" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. The terms "first", "second", etc. in this application are used to distinguish similar objects, and are not used to describe a specific order or sequence.

[0030] First, the terms involved in this application are explained:

[0031] A liquid-cooled server refers to a server that uses liquid cooling to dissipate heat from heat-generating components such as the processor of the server. Common liquid-cooled servers may be cold plate liquid-cooled servers, for example. For example, a cold plate liquid-cooled server includes a cold plate, and a fluid channel is designed inside the cold plate, and the coolant can circulate in the fluid channel. A cold plate liquid-cooled server can transfer the heat generated by heat-generating components such as the processor to the circulating coolant through the cold plate, thereby achieving heat dissipation of the liquid-cooled server.

[0032] In the related art, at least one temperature interval is determined at the liquid cooling control end, and each temperature interval corresponds to a preset liquid cooling flow rate. For any temperature interval in the at least one temperature interval, when the temperature of the processor is in the temperature interval, the cold liquid control end determines the liquid cooling flow rate of the liquid cooling server according to the preset liquid cooling flow rate corresponding to the temperature interval. However, when the processor is at maximum load, the power consumption of the processor will reach a maximum value. In order for the liquid cooling flow rate to meet the heat dissipation requirements of the processor, it is necessary to determine the maximum liquid cooling flow rate required by the processor. Furthermore, when the processor is at maximum load, the processing core of the processor usually cannot reach the maximum frequency, and it is necessary to perform current adjustment processing on the liquid cooling server so that all processing cores of the processor reach the maximum frequency. In the process of current adjustment processing on the liquid cooling server, the power consumption of the liquid cooling server increases. In order for the liquid cooling system to be able to meet the heat dissipation requirements of the liquid cooling server in a timely manner, it is necessary to determine the maximum liquid cooling flow rate required by the liquid cooling server after each current adjustment processing on the liquid cooling server.

[0033] An embodiment of the present application provides a method for determining a liquid cooling flow rate, by judging the size between a first frequency and a maximum frequency of a liquid cooling server under a maximum load, and when the first frequency is greater than or equal to the maximum frequency, determining the initial liquid cooling flow rate of the liquid cooling server at the first frequency as the maximum liquid cooling flow rate; and when the first frequency is less than the maximum frequency, performing at least one current adjustment process and a liquid cooling flow adjustment process on the liquid cooling server, so that the frequency of the liquid cooling server gradually increases after the current adjustment until the frequency of the liquid cooling server is equal to the maximum frequency, and then determining the liquid cooling flow rate of the liquid cooling server at this time as the maximum liquid cooling flow rate, thereby achieving the determination of the maximum liquid cooling flow rate required for the liquid cooling server.

[0034] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0035] Combined with the specific application scenarios on which the method for determining the liquid cooling flow rate depends, the specific application scenarios are described here. Figure 1 , Figure 1 This is a schematic diagram of an application scenario provided by an embodiment of the present application. Figure 1As shown, it includes a liquid cooling server 11, a remote control terminal 12 and a liquid cooling control terminal 13. The liquid cooling server 11 refers to a server that dissipates heat from heat-generating components such as a processor of the server through liquid cooling. The liquid cooling server 11 can be, for example, a cold plate liquid cooling server.

[0036] During actual application, the liquid cooling server 11 can communicate with the remote control terminal 12 through the internal network or management system of the liquid cooling server. For example, the remote control terminal 12 can send an information acquisition request to the liquid cooling server 11, and the liquid cooling server 11 can send status information to the remote control terminal 12; the remote control terminal 12 can communicate with the liquid cooling control terminal 13, for example, the remote control terminal 12 sends the liquid cooling flow to the liquid cooling control terminal 13; the liquid cooling system can be set through the liquid cooling control terminal 13 to control the liquid cooling flow when the liquid cooling server 11 is liquid cooled.

[0037] It should be noted that Figure 1 This is just an example to illustrate an application scenario, and is not intended to limit the application scenario.

[0038] The technical solution of the present application and how the technical solution of the present application solves the above-mentioned technical problems are described in detail below with specific embodiments. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. The embodiments of the present application will be described below in conjunction with the accompanying drawings.

[0039] Figure 2 A flow chart of a method for determining a liquid cooling flow rate provided in an embodiment of the present application Figure 1 .like Figure 2 As shown, the method includes:

[0040] S201, obtaining a thermal design power consumption and a maximum frequency of a liquid cooling server.

[0041] The execution subject of the present application may be a remote control terminal, or a device for determining a liquid cooling flow rate disposed in the remote control terminal. The device for determining a liquid cooling flow rate may be implemented through software, or through a combination of software and hardware.

[0042] The thermal design power consumption of a liquid-cooled server refers to the thermal design power consumption of the processor in the liquid-cooled server. The thermal design power consumption is an indicator of the amount of heat generated by the processor. It is used to indicate the amount of heat generated by the processor when the processor load is at the maximum load. The unit of thermal design power consumption is watt (W). Normally, the thermal design power consumption of the processor is a fixed value, which is determined and marked by the processor manufacturer at the factory. Through the thermal design power consumption, the maximum heat dissipation that needs to be achieved when the liquid cooling system of the liquid-cooled server dissipates heat for the processor can be determined to ensure that the processor can operate normally under full load without overheating.

[0043] The maximum frequency of a liquid-cooled server refers to the maximum frequency of a processor in the liquid-cooled server. The maximum frequency is the maximum frequency that a processor can reach in a working state, and is used to indicate the maximum performance of the processor. Generally, the maximum performance of a processor is a fixed value, which is determined and marked by the manufacturer of the processor before leaving the factory. For example, the maximum frequency of a processor may be, for example, the nominal maximum frequency of the processor.

[0044] S202, determining an initial liquid cooling flow rate corresponding to the liquid cooling server according to the thermal design power consumption, and controlling the liquid cooling system to liquid cool the liquid cooling server according to the initial liquid cooling flow rate.

[0045] The liquid cooling system refers to the system that cools the processor in the liquid cooling server. The liquid cooling flow rate refers to the volume of liquid cooling that flows per unit time. The unit of the liquid cooling flow rate can be, for example, liters per minute (L / min), which is used to indicate the volume of liquid cooling that flows per minute. Therefore, when the liquid cooling system cools the liquid cooling server, the greater the liquid cooling flow rate, the greater the degree of heat dissipation for the processor; the smaller the liquid cooling flow rate, the smaller the degree of heat dissipation for the processor. Therefore, when the liquid cooling system cools the liquid cooling server, in order to keep the temperature of the processor within an appropriate range, the liquid cooling flow rate needs to be controlled.

[0046] The initial liquid cooling flow rate refers to the liquid cooling flow rate determined according to the thermal design power consumption. When the liquid cooling system performs liquid cooling on the liquid cooling server according to the initial liquid cooling flow rate, the heat dissipation requirement of the liquid cooling server under the thermal design power consumption can be met. In some embodiments, the method of controlling the liquid cooling system to perform liquid cooling on the liquid cooling server according to the initial liquid cooling flow rate can be as follows: the initial liquid cooling flow rate is sent to the liquid cooling control end, and after receiving the initial liquid cooling flow rate, the liquid cooling control end sets the liquid cooling flow rate in the liquid cooling system to the initial liquid cooling flow rate, and then performs liquid cooling on the liquid cooling server through the initial liquid cooling flow rate.

[0047] For example, assuming that the initial liquid cooling flow rate is 10L / min, the remote control end sends the initial liquid cooling flow rate to the liquid cooling control end. After receiving the initial liquid cooling flow rate, the liquid cooling control end sets the liquid cooling flow rate in the liquid cooling system to 10L / min. Then, the liquid cooling system cools the liquid-cooled server according to the liquid cooling flow rate of 10L / min.

[0048] S203: Adjust the processor load of the liquid cooling server to a maximum load, and obtain a first frequency of the liquid cooling server under the maximum load.

[0049] Adjusting the processor load of the liquid-cooled server to the maximum load means that all processing cores of the processor in the liquid-cooled server are in a fully loaded working state. The first frequency of the liquid-cooled server under the maximum load refers to the frequency at which the processor of the liquid-cooled server runs stably under the maximum load. The first frequency is used to indicate the performance upper limit of the processor of the liquid-cooled server under the current liquid cooling condition.

[0050] S204: If the first frequency is greater than or equal to the maximum frequency, the initial liquid cooling flow rate is determined as the maximum liquid cooling flow rate.

[0051] When the first frequency is greater than or equal to the maximum frequency, it means that the liquid cooling system can meet the liquid cooling demand of the processor at the maximum frequency when performing liquid cooling according to the initial liquid cooling flow rate. Therefore, the initial liquid cooling flow rate can be determined as the maximum liquid cooling flow rate.

[0052] For example, if the first frequency is 30 Hz, the maximum frequency is 30 Hz, and the initial liquid cooling flow rate is 10 L / min, since the first frequency is equal to the maximum frequency, the initial liquid cooling flow rate of 10 L / min is determined as the maximum liquid cooling flow rate, that is, the maximum liquid cooling flow rate is determined to be 10 L / min.

[0053] S205: If the first frequency is less than the maximum frequency, perform at least one current adjustment process and a liquid cooling flow adjustment process on the liquid cooling server until the frequency of the liquid cooling server is equal to the maximum frequency, and then determine the maximum liquid cooling flow.

[0054] When the first frequency is less than the maximum frequency, it means that the liquid cooling system cannot meet the liquid cooling demand of the processor at the maximum frequency when dissipating heat with the initial liquid cooling flow rate. Therefore, it is necessary to perform at least one current adjustment process and liquid cooling flow adjustment process on the liquid cooling server. Performing at least one current adjustment on the liquid cooling server refers to adjusting the load current of the processor in the liquid cooling server at least once. Since the load current and frequency of the processor are positively correlated, specifically, the larger the load current of the processor, the larger the frequency; the smaller the load current of the processor, the smaller the frequency. Therefore, by adjusting the load current of the processor in the liquid cooling server at least once, the frequency of the liquid cooling server can be adjusted until the frequency of the liquid cooling server is equal to the maximum frequency, and the liquid cooling flow rate at this time is the maximum liquid cooling flow rate.

[0055] When the liquid cooling server is subjected to at least one current adjustment process, the load current of the processor in the liquid cooling server will increase, and accordingly, the processor will generate more heat. Therefore, in order to keep the temperature of the processor within a suitable range, it is necessary to adjust the liquid cooling flow rate accordingly after the current adjustment so that the liquid cooling flow rate can meet the liquid cooling demand of the processor.

[0056] exist Figure 2In the embodiment shown, the liquid cooling system is controlled according to the initial liquid cooling flow rate to perform liquid cooling on the liquid cooling server. When the liquid cooling server is liquid cooled according to the initial liquid cooling flow rate, the processor load of the liquid cooling server is adjusted to the maximum load, and then the size between the first frequency and the maximum frequency of the liquid cooling server under the maximum load is determined. When the first frequency is greater than or equal to the maximum frequency, the initial liquid cooling flow rate is determined as the maximum liquid cooling flow rate; when the first frequency is less than the maximum frequency, the liquid cooling server is subjected to at least one current adjustment process and liquid cooling flow rate adjustment process, so that the frequency of the liquid cooling server under the adjusted current gradually increases until the frequency of the liquid cooling server is equal to the maximum frequency, and then the liquid cooling flow rate of the liquid cooling server at this time is determined as the maximum liquid cooling flow rate. Through the above method, the maximum liquid cooling flow rate required by the liquid cooling server can be determined.

[0057] exist Figure 2 Based on the embodiment shown below, combined with Figure 3 The process of determining the maximum liquid cooling flow rate when the first frequency is less than the maximum frequency is further described.

[0058] Figure 3 A schematic diagram of a process for determining a maximum liquid cooling flow rate provided in an embodiment of the present application is shown in FIG. Figure 3 As shown, the process may include the following steps:

[0059] S301, i is initialized to 1.

[0060] S302, performing an i-th current adjustment process on the liquid cooling server to obtain an i-th current, and obtaining an i-th frequency of the liquid cooling server under the i-th current.

[0061] Among them, the i-th current refers to the current obtained after the i-th current adjustment process is performed on the liquid-cooled server; the i-th frequency refers to the frequency of the liquid-cooled server under the i-th current after the i-th current adjustment process is performed on the liquid-cooled server. Exemplarily, the first current is adjusted for the liquid-cooled server, and the first current is obtained. At this time, the frequency of the liquid-cooled server under the first current is the first frequency; the second current adjustment is performed on the liquid-cooled server, and the second current is obtained. At this time, the frequency of the liquid-cooled server under the second current is the second frequency. i is 1, 2, ... in sequence until the i-th frequency is greater than or equal to the maximum frequency. Exemplarily, if the 5th frequency is equal to the maximum frequency, i is 1, 2, 3, 4, 5 in sequence; if the 7th frequency is equal to the maximum frequency, i is 1, 2, 3, 4, 5, 6, 7 in sequence.

[0062] In some embodiments, the liquid-cooled server is subjected to the i-th current adjustment process, and the i-th current can be obtained as follows: if i is 1, a preset reference current is determined as the i-th current; if i is greater than 1, an adjustment ratio is determined based on i, and the product of the reference current and the adjustment ratio is determined as the i-th current, and the adjustment ratio is a positive number greater than 1.

[0063] The higher the frequency of the liquid-cooled server, the greater the power consumption; the lower the power consumption of the liquid-cooled server, the lower the frequency, and the higher the frequency of the liquid-cooled server, the better, and the lower the power consumption, the better. Therefore, for a liquid-cooled server, the frequency and power consumption of the liquid-cooled server need to be within an appropriate range. The reference current is preset in advance, and under the reference current, the frequency and power consumption of the liquid-cooled server can reach the same balanced state.

[0064] The liquid cooling server can be subjected to the i-th current regulation process by adjusting the ratio to obtain the i-th current. In the process of adjusting the i-th current of the liquid cooling server, i is different and the corresponding regulation ratio is also different. Specifically, the regulation ratio can be determined by calculating i, and the formula for calculating the regulation ratio by i can be shown as formula (1):

[0065] N=100 / (100-n) (1)

[0066] Wherein, N is the adjustment ratio, and n is i-1. For example, when the second current adjustment is performed on the liquid cooling server, the adjustment ratio is When the third current adjustment is made to the liquid-cooled server, the adjustment ratio is

[0067] Exemplarily, if i=1, the reference current is determined to be the first current, that is, the first current is equal to the preset reference current. At this time, the first frequency of the liquid-cooled server is equal to the square of the first current multiplied by the resistance of the liquid-cooled server, that is, the first frequency is equal to the square of the reference current multiplied by the resistance of the liquid-cooled server. Exemplarily, if the first current is I, the resistance of the liquid-cooled server is R, the first frequency of the liquid-cooled server is P1, and the preset reference current is X, then P1=I 2 *R=X 2 *R.

[0068] For example, if i=3, the reference current is X, and the adjustment ratio is determined according to i=3: According to the reference current adjustment ratio, the third current can be determined as: At this time, the third frequency of the liquid cooling server is equal to the square of the third current multiplied by the resistance of the liquid cooling server, that is, the third frequency is equal to Square multiplied by the resistance of the liquid cooling server. For example, if the third current is I, the resistance of the liquid cooling server is R, and the third frequency of the liquid cooling server is P3, then P3 = I2 *R=(100 / 98*X) 2 *R.

[0069] S303: Determine the i-th power of the liquid cooling server according to the i-th current.

[0070] The i-th power is used to represent the power consumption of the liquid-cooled server under the i-th current. The i-th power of the liquid-cooled server is equal to the i-th frequency of the liquid-cooled server. Therefore, according to the i-th current, the i-th power of the liquid-cooled server can be determined by: determining the i-th frequency of the liquid-cooled server under the i-th current, and determining the i-th frequency as the i-th power of the liquid-cooled server.

[0071] Exemplarily, assuming that i=4, the 4th frequency of the liquid-cooled server at the 4th current is P4, then P4 is determined as the 4th power of the liquid-cooled server, that is, the 4th power of the liquid-cooled server is determined to be P4.

[0072] S304: Determine an i-th liquid cooling flow rate of the liquid cooling server according to the i-th power, and control the liquid cooling system to liquid cool the liquid cooling server according to the i-th liquid cooling flow rate.

[0073] After the i-th current adjustment process is performed on the liquid-cooled server, the processor of the liquid-cooled server generates more heat. In order for the liquid cooling system to meet the heat dissipation requirements of the liquid-cooled server, the liquid cooling flow rate needs to be adjusted accordingly.

[0074] The i-th liquid cooling flow rate refers to the liquid cooling flow rate required by the liquid cooling server when the frequency of the liquid cooling server is the i-th frequency. According to the i-th power, the i-th liquid cooling flow rate of the liquid cooling server can be determined as follows: determine the specific heat capacity and density of the coolant of the liquid cooling server; determine the temperature difference corresponding to the liquid cooling server, the temperature difference being the difference between the temperature of the coolant after passing through the liquid cooling server and the temperature of the coolant before passing through the cooling server; determine the i-th liquid cooling flow rate according to the i-th power, specific heat capacity, density and temperature difference.

[0075] The coolant of a liquid-cooled server refers to the liquid used for liquid cooling in a liquid-cooled server. The specific heat capacity of the coolant is used to indicate the energy absorbed by the coolant when the temperature rises by 1 degree, or the extra energy released by the coolant when the temperature drops by 1 degree. The unit of specific heat capacity is joule / kilogram*degree Celsius (J / Kg*C). The unit of the temperature difference corresponding to the liquid-cooled server is degree Celsius (C). Under normal circumstances, in order to ensure the stable operating temperature of the liquid-cooled server, the temperature difference of the liquid-cooled server is a fixed value, which can be set in advance according to needs.

[0076] The liquid cooling power consumption of the liquid cooling system can be calculated by the liquid cooling flow rate, specific heat capacity, density and temperature difference. The calculation formula can be shown as formula (2):

[0077] P Q=Cp*ρ*Q*ΔT (2)

[0078] Where, Q represents the liquid cooling flow rate, P Q It represents the liquid cooling power consumption of the liquid cooling system when the liquid cooling flow rate is Q, Cp is the specific heat capacity of the coolant, ρ is the density of the coolant, and ΔT represents the temperature difference corresponding to the liquid cooling server.

[0079] When the liquid cooling system performs liquid cooling on the liquid cooling server, the liquid cooling power consumption of the liquid cooling system is consistent with the power of the liquid cooling server. At this time, when the liquid cooling system performs liquid cooling on the liquid cooling server, the heat dissipation demand of the liquid cooling server can be met. Based on this, when the power of the liquid cooling server is the i-th power, the i-th liquid cooling flow rate can be calculated according to the i-th power of the liquid cooling server, the specific heat capacity, density and temperature difference of the coolant, and the calculation formula can be shown as formula (3):

[0080] Q i =P i / (Cp*ρ*ΔT) (3)

[0081] Among them, Q i is the i-th liquid cooling flow rate, P i is the i-th power of the liquid-cooled server.

[0082] After calculating the i-th liquid cooling flow rate, the liquid cooling system can be controlled according to the i-th liquid cooling flow rate to perform liquid cooling on the liquid-cooled server. The method of controlling the liquid cooling system to perform liquid cooling on the liquid-cooled server according to the i-th liquid cooling flow rate is the same as the method of controlling the liquid cooling system to perform liquid cooling on the liquid-cooled server according to the processing liquid cooling flow rate, and will not be repeated here.

[0083] S305, determining whether the i-th frequency is greater than or equal to the maximum frequency.

[0084] If yes, execute S307;

[0085] If not, execute S306.

[0086] S306, update i to i+1.

[0087] When the i-th frequency is less than the maximum frequency, it means that the processing core in the liquid-cooled server has not yet reached the maximum frequency. At this time, the power consumption of the liquid-cooled server has not reached the maximum. When the liquid-cooled server is cooled according to the i-th liquid-cooling flow rate, the liquid-cooled system cannot meet the maximum heat dissipation demand of the liquid-cooled server. Therefore, it is necessary to continue to perform the i+1th current adjustment process on the liquid-cooled server.

[0088] S307, determining the i-th liquid cooling flow rate as the maximum liquid cooling flow rate.

[0089] When the i-th frequency is greater than or equal to the maximum frequency, it means that the processing core in the liquid cooling server has reached the maximum frequency. At this time, the power consumption of the liquid cooling server reaches the maximum. When the liquid cooling system cools the liquid cooling server according to the i-th liquid cooling flow rate, it can meet the maximum heat dissipation demand of the liquid cooling server. Therefore, the i-th liquid cooling flow rate is determined as the maximum liquid cooling flow rate.

[0090] exist Figure 3 In the embodiment shown, the liquid-cooled server is subjected to i-time current adjustment processing. During the i-time current adjustment processing, the adjustment ratio is determined according to i, and then the i-th current is determined according to the adjustment ratio and the preset reference current. After determining the i-th current, the i-th frequency of the liquid-cooled server under the i-th current is determined, and then the i-th liquid cooling flow of the liquid-cooled server is determined, and the liquid cooling system is controlled according to the i-th liquid cooling flow to liquid-cool the server until the i-th frequency is equal to the maximum frequency, and the i-th liquid cooling flow of the liquid-cooled server under the i-th frequency is determined as the maximum liquid cooling flow. In the above method, the liquid-cooled server is subjected to multiple current adjustment processings, so that the frequency of the liquid-cooled server is equal to the maximum frequency, and the liquid cooling flow of the liquid-cooled server at this time is determined as the maximum liquid cooling flow, thereby realizing the determination of the maximum liquid cooling flow required for the liquid-cooled server. In addition, during the process of performing multiple current adjustment processing on the liquid-cooled server, the liquid cooling flow of the liquid-cooled server is adjusted accordingly, so that when the frequency of the liquid-cooled server increases, the liquid cooling flow of the liquid cooling system when liquid cooling the liquid-cooled server increases accordingly, thereby meeting the heat dissipation requirements of the liquid-cooled server during the current adjustment processing and improving the efficiency and stability of the liquid cooling system.

[0091] In some embodiments, the remote control terminal may include multiple modules. Figure 4 To understand, Figure 4 A schematic diagram of the structure of a remote control terminal provided in an embodiment of the present application is shown in FIG. Figure 4 As shown, the remote control terminal 40 includes an information collection module 41, a pressurization execution module 42, a voltage regulator (VR) optimization module 43, a data processing module 44 and a task delivery module 45, wherein the information collection module 41, the pressurization execution module 42, the VR optimization module 43, the data processing module 44 and the task delivery module 45 can communicate with each other, and in addition, the information collection module 41 can communicate with the liquid cooling server to obtain the information of the liquid cooling server in the liquid cooling server. The pressurization execution module 42 can communicate with the liquid cooling server to send a program startup instruction to the liquid cooling server.

[0092] The VR optimization module 43 can adjust the load current of the processor in the liquid-cooled server, and then adjust the frequency of the liquid-cooled server. For example, a reference current is preset in the VR optimization module, and the frequency and power consumption of the liquid-cooled server under the reference current are relatively balanced. The load current of the processor in the liquid-cooled server can be obtained, and the load current is compared with the preset reference current. If the load current of the liquid-cooled server is less than the preset reference current, it means that the frequency of the liquid-cooled server is relatively small at this time. The load current of the liquid-cooled server is adjusted so that the load current is equal to the reference current, thereby increasing the frequency of the liquid-cooled server; if the load current of the liquid-cooled server is greater than the preset reference current, it means that the power consumption of the liquid-cooled server is relatively large at this time. The load current of the liquid-cooled server is adjusted so that the load current is equal to the reference current, thereby reducing the power consumption of the liquid-cooled server.

[0093] In some embodiments, the liquid-cooled server includes a current register, and the power control unit of the liquid-cooled server stores the load current value of the liquid-cooled server in the current register through the bus of the liquid-cooled server. The VR optimization module can read the current load current of the liquid-cooled server from the current register.

[0094] The task issuing module 45 can communicate with the liquid cooling control end to send the liquid cooling flow value to the liquid cooling control end.

[0095] Based on the above embodiments, Figure 5 The method for determining the liquid cooling flow rate in this application is further introduced.

[0096] Figure 5 A flow chart of a method for determining a liquid cooling flow rate provided in an embodiment of the present application Figure 2 , see Figure 5 , the method may include the following steps:

[0097] S501, obtain the thermal design power consumption and maximum frequency of the liquid cooling server.

[0098] The thermal design power consumption and maximum frequency of the liquid-cooled server can be obtained through the information collection module. The information collection module can obtain the thermal design power consumption and maximum frequency of the liquid-cooled server in the following way: sending an information acquisition request to the liquid-cooled server, the information acquisition request is used to request to obtain the status information of the processor of the liquid-cooled server; receiving the status information sent by the liquid-cooled server, the status information includes the thermal design power consumption and maximum frequency.

[0099] Exemplarily, the information collection module sends an information acquisition request to the liquid cooling server, requesting to acquire the status information of the processor of the liquid cooling server. After receiving the information acquisition request, the liquid cooling server sends the status information to the information collection module.

[0100] S502: Determine an initial liquid cooling flow rate corresponding to the liquid cooling server according to the thermal design power consumption, and control the liquid cooling system to liquid cool the liquid cooling server according to the initial liquid cooling flow rate.

[0101] According to the thermal design power consumption, the formula for determining the initial liquid cooling flow corresponding to the liquid cooling server can be shown as formula (4):

[0102] Q f =TDP / (Cp*ρ*ΔT) (4)

[0103] Among them, TDP is thermal design power consumption, Q f The initial liquid cooling flow rate refers to the liquid cooling flow rate that the liquid cooling system needs to provide when cooling the liquid-cooled server under the thermal design power consumption.

[0104] The task delivery module can be used to control the liquid cooling system to perform liquid cooling on the liquid cooling server according to the initial liquid cooling flow rate. Exemplarily, the task delivery module sends the initial liquid cooling flow rate to the liquid cooling control end, and after receiving the initial liquid cooling flow rate, the liquid cooling control end determines the liquid cooling flow rate in the liquid cooling system according to the initial liquid cooling flow rate.

[0105] S503: Adjust the processor load of the liquid cooling server to a maximum load, and obtain a first frequency of the liquid cooling server under the maximum load.

[0106] The processor load of the liquid-cooled server can be adjusted to the maximum load through the pressure execution module. The specific implementation method can be as follows: a program start instruction is sent to the liquid-cooled server, and the program start instruction is used to start the processor stress testing program in the liquid-cooled server. The processor stress testing program is used to adjust the processor load of the liquid-cooled server to the maximum load.

[0107] Exemplary: the pressure execution module sends a program start instruction to the liquid cooling server. After receiving the program start instruction, the liquid cooling server starts the processor stress testing program in the liquid cooling server according to the program start instruction, and adjusts the processor load of the liquid cooling server to the maximum load.

[0108] When the liquid cooling server is under the maximum load, the first frequency of the liquid cooling server under the maximum load is calculated according to the load current of the liquid cooling server at this time. The calculation formula can be shown as formula (5):

[0109] P = I 2 * R (5)

[0110] Wherein, P is the first frequency, I is the load current of the liquid cooling server at this time, and R is the resistance of the liquid cooling server.

[0111] S504, determining whether the first frequency is greater than or equal to the maximum frequency;

[0112] If yes, execute S505;

[0113] If not, execute S505.

[0114] S505: Determine the initial liquid cooling flow rate as the maximum liquid cooling flow rate.

[0115] S506, i is updated to i+1.

[0116] S507, performing an i-th current adjustment process on the liquid cooling server to obtain an i-th current, and obtaining an i-th frequency of the liquid cooling server under the i-th current.

[0117] The VR optimization module may be used to perform an i-th current adjustment process on the liquid-cooled server to obtain an i-th current, and obtain an i-th frequency of the liquid-cooled server under the i-th current.

[0118] The specific implementation method of performing the i-th current adjustment process on the liquid cooling server to obtain the i-th current and obtaining the i-th frequency of the liquid cooling server under the i-th current can be found in Figure 3 Step S302 in the illustrated embodiment will not be described in detail here.

[0119] After obtaining the i-th frequency of the liquid-cooled server at the i-th current, the VR optimization module sends the i-th current and the i-th frequency to the data processing module.

[0120] S508: Determine the i-th power of the liquid cooling server according to the i-th current.

[0121] The i-th power of the liquid cooling server can be determined by the data processing module. After receiving the i-th current and the i-th frequency, the data processing module determines the i-th frequency of the liquid cooling server under the i-th current as the i-th power of the liquid cooling server.

[0122] S509: Determine an i-th liquid cooling flow rate of the liquid cooling server according to the i-th power.

[0123] The i-th liquid cooling flow rate of the liquid cooling server can be determined according to the i-th power by the data processing module. For a specific embodiment of determining the i-th liquid cooling flow rate of the liquid cooling server, see Figure 3 S304 in the illustrated embodiment will not be described in detail here.

[0124] S510: Control the liquid cooling system to perform liquid cooling on the liquid-cooled server according to the i-th liquid cooling flow rate.

[0125] The manner in which the liquid cooling system is controlled to cool the liquid-cooled server according to the i-th liquid cooling flow rate is the same as the manner in which the liquid cooling system is controlled to cool the liquid-cooled server according to the initial liquid cooling flow rate, and will not be described in detail here.

[0126] S511, determining whether the i-th frequency is greater than or equal to the maximum frequency;

[0127] If yes, execute S513;

[0128] If not, execute S512.

[0129] S512, update i to 1.

[0130] When the i-th frequency is less than the maximum frequency, the current adjustment process is continued for the liquid-cooled server. It should be noted that the i+1-th current adjustment process is performed on the liquid-cooled server at this time.

[0131] S513, determining the i-th liquid cooling flow rate as the maximum liquid cooling flow rate.

[0132] In some embodiments, the method for determining the liquid cooling flow provided in the embodiments of the present application also includes: determining the working state of the liquid cooling server; when the working state is a pressurized state, controlling the liquid cooling system to perform liquid cooling on the liquid cooling server according to the maximum liquid cooling flow, and the pressurized state is used to indicate that the liquid cooling server is working under maximum load.

[0133] Exemplarily, after obtaining the maximum liquid cooling flow required by the liquid cooling server through the method for determining the liquid cooling flow provided in the embodiment of the present application, when the liquid cooling server is working normally, it is determined whether the working state of the liquid cooling server is a pressurized state, that is, whether the liquid cooling server is working under the maximum load. If the liquid cooling server is working under the maximum load, the liquid cooling system is controlled according to the maximum liquid cooling flow to perform liquid cooling on the liquid cooling server. At this time, when the liquid cooling system uses the maximum liquid cooling flow to perform liquid cooling on the liquid cooling system, the heat dissipation requirements of the liquid cooling server under the maximum load working state can be met.

[0134] exist Figure 5In the embodiment shown, by judging the size between the first frequency and the maximum frequency of the liquid-cooled server under the maximum load, when the first frequency is greater than or equal to the maximum frequency, the initial liquid-cooled flow rate of the liquid-cooled server under the first frequency is determined as the maximum liquid-cooled flow rate; when the first frequency is less than the maximum frequency, the liquid-cooled server is subjected to at least one current adjustment process and a liquid-cooled flow adjustment process, so that the frequency of the liquid-cooled server gradually increases after the current adjustment, until the frequency of the liquid-cooled server is equal to the maximum frequency, and then the liquid-cooled flow rate of the liquid-cooled server at this time is determined as the maximum liquid-cooled flow rate, thereby achieving the determination of the maximum liquid-cooled flow rate required for the liquid-cooled server. Secondly, in the process of current adjustment of the liquid-cooled server, the power consumption of the liquid-cooled server is constantly increasing. In order to ensure the normal heat dissipation of the liquid-cooled server, after each current adjustment of the liquid-cooled server, the liquid-cooled flow rate of the liquid-cooled server is adjusted accordingly, so that the liquid-cooled system can timely meet the heat dissipation requirements of the liquid-cooled server during the current adjustment process, thereby improving the efficiency and stability of the liquid-cooled system.

[0135] Through the description of the above implementation methods, those skilled in the art can clearly understand that the method according to the above embodiment can be implemented by means of software plus a necessary general hardware platform, and of course by hardware, but in many cases the former is a better implementation method.

[0136] Figure 6 A schematic diagram of a liquid cooling flow determination device provided in an embodiment of the present application is shown in FIG. Figure 6 As shown, the liquid cooling flow determination device 60 provided in the embodiment of the present application includes:

[0137] An acquisition module 61 is used to acquire a thermal design power consumption and a maximum frequency of a liquid cooling server;

[0138] The processing module 62 is used to determine the initial liquid cooling flow rate corresponding to the liquid cooling server according to the thermal design power consumption, and control the liquid cooling system to liquid cool the liquid cooling server according to the initial liquid cooling flow rate;

[0139] An adjustment module 63, configured to adjust the processor load of the liquid cooling server to a maximum load, and obtain a first frequency of the liquid cooling server under the maximum load;

[0140] A first determination module 64, configured to determine the initial liquid cooling flow rate as the maximum liquid cooling flow rate if the first frequency is greater than or equal to the maximum frequency;

[0141] The second determination module 65 is used to perform at least one current adjustment process and liquid cooling flow adjustment process on the liquid cooling server if the first frequency is less than the maximum frequency, until the frequency of the liquid cooling server is equal to the maximum frequency, and then determine the maximum liquid cooling flow.

[0142] In a possible implementation manner, the second determining module 65 is specifically configured to:

[0143] Performing an i-th current adjustment process on the liquid-cooled server to obtain an i-th current, and obtaining an i-th frequency of the liquid-cooled server under the i-th current;

[0144] Determine the i-th power of the liquid cooling server according to the i-th current;

[0145] Determine an i-th liquid cooling flow rate of the liquid cooling server according to the i-th power, and control the liquid cooling system to liquid cool the liquid cooling server according to the i-th liquid cooling flow rate;

[0146] Among them, i is 1, 2, ... in sequence, until the i-th frequency is greater than or equal to the maximum frequency, the i-th liquid cooling flow rate is determined as the maximum liquid cooling flow rate.

[0147] In a possible implementation manner, the second determining module 65 is specifically configured to:

[0148] If i is 1, the preset reference current is determined as the i-th current;

[0149] If i is greater than 1, the adjustment ratio is determined according to i, and the product of the reference current and the adjustment ratio is determined as the i-th current, and the adjustment ratio is a positive number greater than 1.

[0150] In a possible implementation manner, the second determining module 65 is specifically configured to:

[0151] Determine the specific heat capacity and density of the coolant for liquid-cooled servers;

[0152] Determine a temperature difference corresponding to the liquid-cooled server, where the temperature difference is the difference between the temperature of the coolant after passing through the liquid-cooled server and the temperature of the coolant before passing through the cooling server;

[0153] The i-th liquid cooling flow rate is determined according to the i-th power, specific heat capacity, density and temperature difference.

[0154] In a possible implementation, the acquisition module 61 is specifically used to:

[0155] Sending an information acquisition request to the liquid cooling server, where the information acquisition request is used to request to acquire status information of a processor of the liquid cooling server;

[0156] Receive status information sent by the liquid cooling server, where the status information includes thermal design power consumption and maximum frequency.

[0157] In a possible implementation manner, the adjustment module 63 is specifically configured to:

[0158] A program start instruction is sent to the liquid cooling server, where the program start instruction is used to start a processor stress test program in the liquid cooling server, where the processor stress test program is used to adjust the processor load of the liquid cooling server to a maximum load.

[0159] In a possible implementation manner, the device for determining the liquid cooling flow rate further includes:

[0160] Determine the working status of the liquid-cooled server;

[0161] When the working state is the pressurized state, the liquid cooling system is controlled according to the maximum liquid cooling flow rate to perform liquid cooling on the liquid-cooled server. The pressurized state is used to indicate that the liquid-cooled server is working under the maximum load.

[0162] The device for determining the liquid cooling flow rate provided in the embodiment of the present application and the description of the features in the corresponding embodiment can refer to the relevant description of the embodiment corresponding to the method for determining the liquid cooling flow rate, which will not be repeated here.

[0163] Figure 7 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application is shown in FIG. Figure 7 As shown, the electronic device 70 provided in this embodiment includes: at least one processor 71 and a memory 72. Optionally, the device 70 also includes a communication component 73. The processor 71, the memory 72 and the communication component 73 are connected via a bus 74.

[0164] In the specific implementation process, at least one processor 71 executes the computer execution instructions stored in the memory 72, so that at least one processor 71 executes the above-mentioned liquid cooling flow determination method embodiment.

[0165] The specific implementation process of the processor 71 can be found in the above-mentioned method embodiment. Its implementation principle and technical effects are similar, and will not be repeated here in this embodiment.

[0166] In the above embodiments, it should be understood that the processor may be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), etc. The general-purpose processor may be a microprocessor or any conventional processor. The steps of the method disclosed in the application may be directly implemented as being executed by a hardware processor, or may be executed by a combination of hardware and software modules in the processor.

[0167] The memory may include a high-speed memory (Random Access Memory, RAM), and may also include a non-volatile memory (Non-volatile Memory, NVM), such as at least one disk memory.

[0168] The bus may be an Industry Standard Architecture (ISA) bus, a Peripheral Component Interconnect (PCI) bus, or an Extended Industry Standard Architecture (EISA) bus, etc. The bus may be divided into an address bus, a data bus, a control bus, etc. For ease of representation, the bus in the drawings of the present application is not limited to only one bus or one type of bus.

[0169] An embodiment of the present application further provides a computer-readable storage medium, in which a computer program is stored, wherein the computer program is configured to execute the steps of any of the above-mentioned liquid cooling flow determination method embodiments when running.

[0170] In an exemplary embodiment, the computer-readable storage medium may include, but is not limited to, various media that can store computer programs, such as a USB flash drive, a read-only memory (ROM), a random access memory (RAM), a mobile hard disk, a magnetic disk or an optical disk.

[0171] An embodiment of the present application further provides a computer program product, which includes a computer program. When the computer program is executed by a processor, the steps in any of the above-mentioned liquid cooling flow determination method embodiments are implemented.

[0172] An embodiment of the present application also provides another computer program product, including a non-volatile computer-readable storage medium, the non-volatile computer-readable storage medium storing a computer program, and when the computer program is executed by a processor, the steps in any of the above-mentioned liquid cooling flow determination method embodiments are implemented.

[0173] Professionals may further appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the composition and steps of each example have been generally described in the above description according to function. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professionals and technicians may use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.

[0174] The above is a detailed introduction to a method for determining a liquid cooling flow rate, an electronic device, and a storage medium provided by the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the claims of the present application.

Claims

1. A method for determining liquid cooling flow rate, characterized in that: include: Get the thermal design power consumption and maximum frequency of the liquid-cooled server; Determining an initial liquid cooling flow rate corresponding to the liquid cooling server according to the thermal design power consumption, and controlling a liquid cooling system to liquid cool the liquid cooling server according to the initial liquid cooling flow rate; adjusting a processor load of the liquid cooling server to a maximum load, and obtaining a first frequency of the liquid cooling server under the maximum load; If the first frequency is greater than or equal to the maximum frequency, determining the initial liquid cooling flow rate as the maximum liquid cooling flow rate; If the first frequency is less than the maximum frequency, the liquid cooling server is subjected to at least one current adjustment process and a liquid cooling flow adjustment process until the frequency of the liquid cooling server is equal to the maximum frequency, and the maximum liquid cooling flow is determined.

2. The method according to claim 1, characterized in that Performing at least one current adjustment process and a liquid cooling flow adjustment process on the liquid cooling server until the frequency of the liquid cooling server is equal to the maximum frequency, and determining the maximum liquid cooling flow, including: Performing an i-th current adjustment process on the liquid-cooled server to obtain an i-th current, and acquiring an i-th frequency of the liquid-cooled server under the i-th current; Determining an i-th power of the liquid cooling server according to the i-th current; Determining an i-th liquid cooling flow rate of the liquid cooling server according to the i-th power, and controlling the liquid cooling system to liquid-cool the liquid cooling server according to the i-th liquid cooling flow rate; Among them, the i is sequentially 1, 2, ..., until the i-th frequency is greater than or equal to the maximum frequency, and the i-th liquid cooling flow rate is determined as the maximum liquid cooling flow rate.

3. The method according to claim 2, characterized in that Performing an i-th current adjustment process on the liquid cooling server to obtain an i-th current includes: If the i is 1, the preset reference current is determined as the i-th current; If the i is greater than 1, the adjustment ratio is determined according to the i, and the product of the reference current and the adjustment ratio is determined as the i-th current, and the adjustment ratio is a positive number greater than 1.

4. The method according to claim 2 or 3, characterized in that: Determining an i-th liquid cooling flow rate of the liquid cooling server according to the i-th power includes: Determining the specific heat capacity and density of the cooling liquid of the liquid-cooled server; Determine a temperature difference corresponding to the liquid cooling server, where the temperature difference is a difference between a temperature of the cooling liquid after passing through the liquid cooling server and a temperature of the cooling liquid before passing through the cooling server; The i-th liquid cooling flow rate is determined according to the i-th power, the specific heat capacity, the density and the temperature difference.

5. The method according to any one of claims 1 to 4, characterized in that: Get the thermal design power and maximum frequency of a liquid-cooled server, including: Sending an information acquisition request to the liquid cooling server, wherein the information acquisition request is used to request to acquire status information of a processor of the liquid cooling server; The status information sent by the liquid cooling server is received, where the status information includes the thermal design power consumption and the maximum frequency.

6. The method according to any one of claims 1 to 5, characterized in that: Adjusting the processor load of the liquid-cooled server to a maximum load includes: A program start instruction is sent to the liquid cooling server, wherein the program start instruction is used to start a processor stress testing program in the liquid cooling server, and the processor stress testing program is used to adjust the processor load of the liquid cooling server to the maximum load.

7. The method according to any one of claims 1 to 6, characterized in that: The method further comprises: Determining the working status of the liquid cooling server; When the working state is a pressurized state, the liquid cooling system is controlled according to the maximum liquid cooling flow rate to perform liquid cooling on the liquid cooling server, and the pressurized state is used to indicate that the liquid cooling server is working under maximum load.

8. A device for determining liquid cooling flow, characterized in that: include: An acquisition module, used for acquiring thermal design power consumption and maximum frequency of a liquid cooling server; A processing module, configured to determine an initial liquid cooling flow rate corresponding to the liquid cooling server according to the thermal design power consumption, and control a liquid cooling system to liquid cool the liquid cooling server according to the initial liquid cooling flow rate; an adjusting module, configured to adjust a processor load of the liquid cooling server to a maximum load, and obtain a first frequency of the liquid cooling server under the maximum load; a first determining module, configured to determine the initial liquid cooling flow rate as the maximum liquid cooling flow rate if the first frequency is greater than or equal to the maximum frequency; The second determination module is used to perform at least one current adjustment process and liquid cooling flow adjustment process on the liquid cooling server if the first frequency is less than the maximum frequency, until the frequency of the liquid cooling server is equal to the maximum frequency, and then determine the maximum liquid cooling flow.

9. An electronic device, characterized in that: include: Memory and processor; The memory stores computer-executable instructions; The processor executes the computer-executable instructions stored in the memory to implement the method for determining the liquid cooling flow rate according to any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer-executable instructions, and when the computer-executable instructions are executed by a processor, they are used to implement the method for determining the liquid cooling flow rate according to any one of claims 1 to 7.

Citation Information

Patent Citations

  • Method and device for determining liquid cooling energy efficiency ratio of liquid cooling system

    CN111103943A

  • Server liquid cooling system regulation and control device and method, terminal and storage medium

    CN115129133A

  • Flow regulation method and system and related equipment

    CN118119148A

  • Configuration management based on thermal state

    US11442513B1

  • Method for improving peak computing power of processor, and system for improving peak computing power of processor

    WO2023143333A1