Heat dissipation core body and heat exchange device

Abstract

The embodiment of the invention provides a heat dissipation core and a heat exchange device, and relates to the field of heat dissipation and cooling equipment. The heat dissipation core body comprises a first module unit and a second module unit, the second module unit and the first module unit are arranged at an interval, and a liquid inlet channel is formed by the second module unit and the first module unit; the end, away from the liquid inlet channel, of the first module unit is provided with a first liquid outlet channel. The end, away from the liquid inlet channel, of the second module unit is provided with a second liquid outlet channel. Each of the first module unit and the second module unit comprises a plurality of fins, the plurality of fins are parallel and spaced, a transverse communicating channel is formed between every two adjacent fins, and the transverse communicating channels are communicated with the liquid inlet channel and the first liquid outlet channel or the second liquid outlet channel. According to the heat dissipation core body, the problem that the heat dissipation efficiency of different parts is inconsistent is solved, the temperature difference of all the parts is reduced, and the temperature uniformity of heat dissipation is improved. The embodiment of the invention further provides a heat exchange device. The heat exchange device comprises the heat dissipation core body.

Description

Technical Field

[0001] The present invention relates to the field of heat dissipation and cooling equipment, and in particular to a heat dissipation core and a heat exchange device. Background Art

[0002] When the chip works under high heat flux density, it is easy to cause poor heat dissipation, which will increase the temperature of the chip. When the temperature of the chip exceeds a certain level, the performance and service life of the power chip will be reduced.

[0003] At present, the cooling medium is mostly used to cool the chip. Specifically, the chip is connected to the liquid cooling plate, and the cooling medium flows in the liquid cooling plate to remove the heat generated by the chip. However, conventional liquid cooling plates cannot evenly dissipate heat to chips in various parts. Usually, the heat dissipation efficiency of chips close to the cooling medium inlet is high, and the heat dissipation efficiency of chips close to the cooling medium outlet is low, resulting in a large temperature difference between the cooling medium outlet and the cooling medium inlet, and poor heat dissipation uniformity. Summary of the invention

[0004] The present invention provides a heat dissipation core and a heat exchange device, which can improve the problem of poor heat dissipation uniformity of chips at different positions on the existing liquid cooling plate.

[0005] The embodiments of the present invention can be implemented as follows:

[0006] An embodiment of the present invention provides a heat dissipation core, which includes:

[0007] The first module unit;

[0008] The second module unit is arranged at an interval with the first module unit, and a liquid inlet channel is formed between the second module unit and the first module unit; the first module unit is provided with a first liquid outlet channel at one end away from the liquid inlet channel, and the second module unit is provided with a second liquid outlet channel at one end away from the liquid inlet channel; the first module unit and the second module unit both include a plurality of fins, the plurality of fins are arranged in parallel and at intervals, the plurality of fins have an angle with the liquid inlet channel, a transverse connecting channel is formed between two adjacent fins, the transverse connecting channel connects the liquid inlet channel and the first liquid outlet channel, or the transverse connecting channel connects the liquid inlet channel and the second liquid outlet channel, or the liquid inlet channel is connected with the first liquid outlet channel and the second liquid outlet channel at the same time through the transverse connecting channel.

[0009] Optionally, the width of the liquid inlet channel gradually decreases along the advancing direction of the cooling medium.

[0010] Optionally, the liquid inlet channel is stepped along its length direction, and the width of the liquid inlet channel gradually decreases along the advancing direction of the cooling medium.

[0011] Optionally, the liquid inlet channel is wedge-shaped along its length direction, and the width of the liquid inlet channel gradually decreases along the advancing direction of the cooling medium.

[0012] Optionally, the heat dissipation core further includes a front side plate and a rear side plate, and the front side plate and the rear side plate are respectively arranged at two ends of the liquid inlet channel.

[0013] Optionally, the transverse connecting channel is perpendicular to the liquid inlet channel, the first liquid outlet channel and the second liquid outlet channel.

[0014] Optionally, the transverse connecting channel is a zigzag channel.

[0015] An embodiment of the present invention further provides a heat exchange device, comprising an upper substrate, a lower substrate and the heat dissipation core;

[0016] The upper substrate includes a cooling medium inlet and a cooling medium outlet, the cooling medium inlet is connected to the liquid inlet channel of the heat dissipation core, and the cooling medium outlet is connected to the first liquid outlet channel and the second liquid outlet channel;

[0017] The lower base plate is sealed and connected to the upper base plate, the upper base plate and the lower base plate form a heat exchange chamber, and the heat dissipation core is located in the heat exchange chamber.

[0018] Optionally, the upper substrate is provided with a tapered protrusion, the heat dissipation core is located between the tapered protrusion and the lower substrate, the tapered protrusion is connected to the heat dissipation core, the tapered protrusion divides the heat exchange chamber into a first space and a second space, the first space is connected to the cooling medium inlet, the second space is connected to the cooling medium outlet, and the liquid inlet channel is located in the first space, and the first liquid outlet channel and the second liquid outlet channel are located in the second space.

[0019] Optionally, there are multiple heat dissipation cores, and the multiple heat dissipation cores are arranged at intervals;

[0020] The number of the tapered protrusions is also multiple, and the positions of the multiple tapered protrusions correspond to the multiple heat dissipation cores.

[0021] Beneficial effects of the embodiments of the present invention:

[0022] The heat dissipation core comprises a first module unit and a second module unit, the second module unit is arranged at an interval from the first module unit, and a liquid inlet channel is formed between the second module unit and the first module unit; a first liquid outlet channel is arranged at one end of the first module unit away from the liquid inlet channel, and a second liquid outlet channel is arranged at one end of the second module unit away from the liquid inlet channel; the first module unit and the second module unit both comprise a plurality of fins, the plurality of fins are arranged in parallel and at intervals, the plurality of fins and the liquid inlet channel have an angle, a transverse connecting channel is formed between two adjacent fins, the transverse connecting channel connects the liquid inlet channel and the first liquid outlet channel, or the transverse connecting channel connects the liquid inlet channel and the second liquid outlet channel, or the liquid inlet channel is connected to the first liquid outlet channel and the second liquid outlet channel at the same time through the transverse connecting channel.

[0023] When the liquid inlet channel is connected to the cooling medium, the cooling medium flows from the transverse connecting channel to the first liquid outlet channel or the second liquid outlet channel respectively. The cooling medium flows into and flows out of the transverse connecting channel at any position, and the length of the distance flowed is the same. At the same time, since the liquid inlet channel is located between the first liquid outlet channel and the second liquid outlet channel, the temperature difference of the cooling medium flowing from the liquid inlet channel into any transverse channel is relatively low. Therefore, the heat dissipation core improves the problem of inconsistent heat dissipation efficiency in different parts, reduces the temperature difference between each part, and greatly improves the uniformity of heat dissipation.

[0024] The heat exchange device comprises an upper base plate, a lower base plate and a heat dissipation core. The upper base plate comprises a cooling medium inlet and a cooling medium outlet. The cooling medium inlet is connected to a liquid inlet channel of the heat dissipation core. The cooling medium outlet is connected to a first liquid outlet channel and a second liquid outlet channel. The lower base plate is sealed and connected to the upper base plate. The upper base plate and the lower base plate form a heat exchange chamber, and the heat dissipation core is located in the heat exchange chamber. The heat exchange device has all the functions of a heat dissipation core. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0026] Figure 1 It is a schematic structural diagram of a heat dissipation core provided in an embodiment of the present invention;

[0027] Figure 2 A schematic diagram of the positional relationship between the liquid inlet channel, the first liquid outlet channel and the second liquid outlet channel provided in an embodiment of the present invention;

[0028] Figure 3 It is a partial enlarged view of the transverse connecting channel in an embodiment of the present invention;

[0029] Figure 4 It is a schematic structural diagram of a heat exchange device provided in an embodiment of the present invention;

[0030] Figure 5 It is a schematic structural diagram of a heat dissipation core and a lower substrate provided in an embodiment of the present invention;

[0031] Figure 6 A schematic structural diagram of an upper substrate provided in an embodiment of the present invention;

[0032] Figure 7 A schematic diagram of the structure of a lower substrate provided in an embodiment of the present invention;

[0033] Figure 8 It is a schematic diagram of the structure in which the chip provided in the embodiment of the present invention is arranged on the lower substrate.

[0034] Icons: 1-heat dissipation core; 10-first module unit; 11-second module unit; 12-fins; 121-lateral connecting channel; 13-liquid inlet channel; 14-first liquid outlet channel; 15-second liquid outlet channel; 16-front side plate; 17-rear side plate; 18-third module unit; 19-fourth module unit; 2-upper substrate; 20-cooling medium inlet; 21-cooling medium outlet; 22-tapered protrusion; 3-lower substrate; 30-settlement area; 4-chip. DETAILED DESCRIPTION

[0035] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0036] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0037] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0038] In the description of the present invention, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. appear to indicate an orientation or position relationship, they are based on the orientation or position relationship shown in the accompanying drawings, or are the orientation or position relationship in which the product of the invention is usually placed when used. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0039] In addition, the terms “first”, “second”, etc., if used, are merely used to distinguish between the descriptions and should not be understood as indicating or implying relative importance.

[0040] The terms "comprises," "comprising," or any other variation thereof are intended to encompass non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes the element.

[0041] Unless otherwise clearly specified and limited, the terms "disposed", "connected" and the like should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0042] It should be noted that, for the aforementioned various method embodiments, for the sake of simplicity of description, they are all expressed as a series of action combinations, but those skilled in the art should be aware that the present application is not limited by the described order of actions, because according to the present application, some steps can be performed in other orders or simultaneously. The steps in the method of the embodiment of the present application can be adjusted in order, combined, and deleted according to actual needs.

[0043] It should be noted that, in the absence of conflict, the features in the embodiments of the present invention may be combined with each other.

[0044] With the development of chip technology, the requirements for chip heat dissipation are getting higher and higher. Poor chip heat dissipation under high heat flux density will cause temperature rise. If the temperature rise exceeds a certain level, the performance and service life of the power chip will be reduced. At the same time, under high heat flux density, the uneven temperature distribution inside the chip will further aggravate the above effect.

[0045] At present, the method of cooling the chip is to pass the cooling medium into the liquid cooling plate to cool it down, and use the cooling medium to force convection in the flow channel of the liquid cooling plate to take away the heat generated by the chip. However, during the use of conventional liquid cooling plates, the heat dissipation efficiency of the chip near the cooling medium inlet is high, while the heat dissipation efficiency of the chip near the cooling medium outlet is low, which leads to a relatively high temperature of the chip near the cooling medium outlet, and the overall temperature uniformity of the liquid cooling plate is poor, which is not conducive to the long-term reliable operation of the chip.

[0046] In this regard, an embodiment of the present invention provides a heat dissipation core and a heat exchange device that can solve the above problems. The heat exchange device includes a heat dissipation core and has the function of a heat dissipation core. Next, the heat dissipation core is described in detail, and then the heat exchange device is described in detail.

[0047] Please refer to Figures 1 to 3 The heat dissipation core comprises a first module unit 10 and a second module unit 11, the second module unit 11 is arranged at an interval with the first module unit 10, and a liquid inlet channel 13 is formed between the second module unit 11 and the first module unit 10; a first liquid outlet channel 14 is arranged at one end of the first module unit 10 away from the liquid inlet channel 13, and a second liquid outlet channel 15 is arranged at one end of the second module unit 11 away from the liquid inlet channel 13; the first module unit 10 and the second module unit 11 both comprise a plurality of fins 12, the plurality of fins 12 are arranged in parallel and at intervals, the plurality of fins 12 and the liquid inlet channel 13 have an angle, a transverse connecting channel 121 is formed between two adjacent fins 12, the transverse connecting channel 121 connects the liquid inlet channel 13 with the first liquid outlet channel 14, or the transverse connecting channel 121 connects the liquid inlet channel 13 with the second liquid outlet channel 15, or the liquid inlet channel 13 is connected to the first liquid outlet channel 14 and the second liquid outlet channel 15 at the same time through the transverse connecting channel 121.

[0048] When the liquid inlet channel 13 is connected to the cooling medium, the cooling medium flows from the transverse connecting channel 121 to the first liquid outlet channel 14 or the second liquid outlet channel 15 or flows to the first liquid outlet channel 14 and the second liquid outlet channel 15 at the same time. The cooling medium flows into and flows out of the transverse connecting channel 121 at any position, and the length of the distance it flows through is the same. At the same time, since the liquid inlet channel 13 is located between the first liquid outlet channel 14 and the second liquid outlet channel 15, the temperature difference of the cooling medium flowing from the liquid inlet channel 13 into any transverse channel is relatively low. Therefore, the heat dissipation core 1 improves the problem of inconsistent heat dissipation efficiency in different parts, reduces the temperature difference between each part, and greatly improves the uniformity of heat dissipation.

[0049] The heat dissipation core 1 of the embodiment of the present invention is provided with a first module unit 10 and a second module unit 11 to form a liquid inlet channel 13, and at the same time, a plurality of fins 12 are arranged in parallel and at intervals to form a transverse connecting channel 121, so that the cooling medium changes from a straight flow to an impact flow in a vertical direction, and the convection heat transfer coefficient is increased without increasing the complexity of the structure, and the heat dissipation efficiency and the uniformity of the flow field temperature are improved. Of course, the plurality of fins 12 and the liquid inlet channel 13 have a certain angle, and the angle range is greater than 0° and less than or equal to 90°.

[0050] A front side plate 16 and a rear side plate 17 are also provided at both ends of the liquid inlet channel 13. The front side plate 16 and the rear side plate 17 are respectively connected to the first module unit 10 and the second module unit 11, and both ends of the front side plate 16 and the rear side plate 17 extend to the first liquid outlet channel 14 and the second liquid outlet channel 15.

[0051] In this embodiment, there are multiple transverse connecting channels 121, and the multiple transverse connecting channels 121 connect the liquid inlet channel 13 and the first liquid outlet channel 14 at different positions, or connect the liquid inlet channel 13 and the second liquid outlet channel 15. The cooling medium flows along the liquid inlet channel 13, and the transverse connecting channels 121 at various positions guide the cooling medium with low temperature in the liquid inlet channel 13 to the first liquid outlet channel 14 or the second liquid outlet channel 15. Since the cooling medium guided by each transverse connecting channel 121 comes from the liquid inlet channel 13, the temperature difference of the cooling medium is not large, thus ensuring that the temperature difference of each part of the heat dissipation core 1 is not large, and improving the uniformity of heat dissipation and cooling.

[0052] In this embodiment, each independent transverse connecting channel 121 is perpendicular to the liquid inlet channel 13 , and the liquid inlet channel 13 is parallel to the first liquid outlet channel 14 and the second liquid outlet channel 15 .

[0053] In the present embodiment, the fin 12 is plate-shaped. When the fin 12 is a flat plate, the transverse connecting channel 121 is a straight channel; when the fin 12 is a curved plate or a zigzag plate, the transverse connecting channel 121 is a zigzag channel. The zigzag channel has a better heat exchange effect than the straight channel. This is because the cooling medium flowing through the zigzag channel will hit the side wall of the fin 12 while moving, thereby causing the cooling medium to flow in turbulent flow.

[0054] In order to make the cooling medium flow rate and the cooling medium flow rate at different positions more uniform, the width of the liquid inlet channel 13 is gradually reduced along the advancing direction of the cooling medium.

[0055] For example, the liquid inlet channel 13 is stepped along its length direction. The liquid inlet channel 13 is divided into four steps along its length direction. The widths of the four steps decrease successively, and the steps are connected in sequence. The step with the largest width is close to the liquid inlet end of the liquid inlet channel 13.

[0056] For another example, the liquid inlet channel 13 is wedge-shaped along its length direction, and the large end of the wedge is close to the liquid inlet end of the liquid inlet channel 13, so that the width of the liquid inlet channel 13 gradually decreases along the forward direction of the cooling medium.

[0057] In other embodiments, the width of the liquid inlet channel 13 along its length direction may also be in other forms such as arc shape, semi-arc shape, etc.

[0058] The width of the liquid inlet channel 13 is 1 to 5 mm. For example, the liquid inlet channel 13 is stepped along its length, and the liquid inlet channel 13 is divided into multiple steps, for example, four steps, the width of the first step can be 4.5 mm, the width of the second step can be 3.5 mm, the width of the third step can be 2.5 mm, and the width of the fourth step can be 1.5 mm. The number of steps in the multiple steps here refers to two or more.

[0059] Optionally, the heat dissipation core 1 is further provided with a third module unit 18 and a fourth module unit 19, and the third module unit 18 and the fourth module unit 19 are both arranged in parallel and spaced apart by a plurality of fins 12. The third module unit 18 is located outside the first module unit 10, and the third module unit 18 and the first module unit 10 form a first liquid outlet channel 14; the fourth module unit 19 is located outside the second module unit 11, and the fourth module unit 19 and the second module unit 11 form a second liquid outlet channel 15.

[0060] The heat exchange device is described in detail below.

[0061] At present, although fins are arranged in the flow channel of the liquid cooling plate to enhance the convective heat transfer coefficient in the flow channel to improve the heat exchange effect, the pressure drop of the cooling medium is large when it flows through the fin area. The equipment will be under great pressure during the heat dissipation process, which will cause problems such as material deformation.

[0062] refer to Figures 4 to 8 An embodiment of the present invention further provides a heat exchange device, comprising an upper substrate 2, a lower substrate 3 and the above-mentioned heat dissipation core 1, the upper substrate 2 comprising a cooling medium inlet 20 and a cooling medium outlet 21, the cooling medium inlet 20 is connected to the liquid inlet channel 13 of the heat dissipation core 1, and the cooling medium outlet 21 is connected to the first liquid outlet channel 14 and the second liquid outlet channel 15; the lower substrate 3 is sealed and connected to the upper substrate 2, the upper substrate 2 and the lower substrate 3 form a heat exchange chamber, the heat dissipation core 1 is located in the heat exchange chamber and the heat dissipation core 1 is arranged on the lower substrate 3.

[0063] Specifically, the lower substrate 3 is a flat plate, and a placement area 30 is provided on one side of the lower substrate 3, the heat dissipation core 1 is fixed in the placement area 30, and the chip 4 is attached to the other side of the lower substrate 3. When the chip 4 generates heat, the heat is transferred to the heat dissipation core 1 through the lower substrate 3. It should be known that the lower substrate 3 should have good thermal conductivity so as to quickly transfer the heat generated by the chip 4 to the heat dissipation core 1, thereby efficiently dissipating heat and cooling the chip 4.

[0064] The upper substrate 2 is formed into a cover shape by stamping a flat plate, and the concave side of the upper substrate 2 is connected to the lower substrate 3, thereby forming a heat exchange chamber, and the heat dissipation core 1 is located in the heat exchange chamber. A cooling medium inlet 20 and a cooling medium outlet 21 are opened at both ends of the upper substrate 2, and the cooling medium inlet 20 and the cooling medium outlet 21 both penetrate the upper substrate 2, and the openings of the cooling medium inlet 20 and the cooling medium outlet 21 are both facing the lower substrate 3.

[0065] The concave side wall of the upper substrate 2 has a tapered protrusion 22, the heat dissipation core 1 is located between the tapered protrusion 22 and the lower substrate 3, the two ends of the tapered protrusion 22 are respectively connected to the two side walls of the concave side of the upper substrate 2, and the tapered protrusion 22 is a continuous and complete protrusion, and its shape is conical. The tapered protrusion 22 is connected to the upper surface of the heat dissipation core 1, so that the tapered protrusion 22 divides the heat exchange chamber into a first space and a second space, the entirety of the liquid inlet channel 13 is located in the first space, the first liquid outlet channel 14 and the second liquid outlet channel 15 are both located in the second space, the first space is connected to the cooling medium inlet 20, the second space is connected to the cooling medium outlet 21, and the first space and the second space are connected through the liquid inlet channel 13 and the transverse connecting channel 121.

[0066] When the cooling medium is injected from the cooling medium inlet 20, the cooling medium first impacts the surface of the lower substrate 3, and then accumulates in front of the front side plate 16 of the heat dissipation core 1. After the liquid level of the cooling medium gradually rises until it overflows the upper end of the front side plate 16, the cooling medium impacts downward from the top of the heat dissipation core 1 to the liquid inlet channel 13, and the cooling medium impacting the bottom wall of the liquid inlet channel 13 flows toward the horizontal connecting channel 121.

[0067] It is worth mentioning that the cooling medium can only flow from the first space to the second space through the liquid inlet channel 13 of the heat dissipation core 1 into the transverse connecting channel 121 .

[0068] Since the heat dissipation core 1 is provided with the rear side plate 17, the cooling medium in the first liquid outlet channel 14 and the second liquid outlet channel 15 cannot be discharged directly, but needs to overflow from the top of the first liquid outlet channel 14 and the second liquid outlet channel 15 to the second space, and then the cooling medium passes over the upper end of the rear side plate 17, and finally gathers behind the rear side plate 17 and is discharged from the cooling medium outlet 21; the process of the cooling medium flowing out of the first liquid outlet channel 14 and the second liquid outlet channel 15 is a process in which the liquid level gradually increases.

[0069] The heat exchange device of the embodiment of the present invention provides a tapered protrusion 22 on the upper substrate 2 and provides a liquid inlet channel 13 and a transverse connecting channel 121 that are perpendicular to each other on the heat dissipation core 1, thereby changing the flow field flow pattern of the cooling medium without adding additional components and reducing the heat exchange thermal resistance.

[0070] Optionally, there are multiple heat dissipation cores 1, which are arranged at intervals, and the liquid inlet channels 13 of each heat dissipation core 1 are in the same direction. There are also multiple tapered protrusions 22, and the positions of the multiple tapered protrusions 22 correspond to the multiple heat dissipation cores 1, so that the cooling medium can be reused.

[0071] In this embodiment, the heat dissipation core 1 and the lower substrate 3, and the upper substrate 2 and the lower substrate 3 are connected by brazing. The third module unit 18 and the fourth module unit 19 of the heat dissipation core 1 are respectively connected to the side wall surface of the concave side of the upper substrate 2.

[0072] In the heat dissipation core 1 of the embodiment of the present invention, the distance from the liquid inlet channel 13 to the first liquid outlet channel 14 of the heat dissipation core 1 is L, and the distance from the liquid inlet channel 13 to the second liquid outlet channel 15 is l, and L is equal to l, which reduces the flow distance of the cooling medium and thereby achieves the effect of reducing the pressure drop.

[0073] In this embodiment, the impact heat exchange of the cooling medium can reduce the boundary layer thickness of the impacted wall surface, reduce the thermal resistance of forced convection heat exchange, and thus enhance the heat dissipation capacity.

[0074] The embodiment of the present invention not only adopts impingement heat exchange, but also combines impingement heat exchange with heat exchange of fins 12, thereby improving the heat exchange effect and improving the problems of large heat exchange pressure drop of the existing liquid cooling plate, large temperature difference of the cooling medium and low heat exchange efficiency.

[0075] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed by the present invention should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A heat dissipation core, characterized in that: include: A first module unit (10); A second module unit (11), the second module unit (11) and the first module unit (10) are arranged at a distance from each other, and a liquid inlet channel (13) is formed between the second module unit (11) and the first module unit (10); a first liquid outlet channel (14) is arranged at one end of the first module unit (10) away from the liquid inlet channel (13), and a second liquid outlet channel (15) is arranged at one end of the second module unit (11) away from the liquid inlet channel (13); the first module unit (10) and the second module unit (11) both include a plurality of fins (12), the plurality of fins The fins (12) are arranged in parallel and at intervals, a plurality of the fins (12) and the liquid inlet channel (13) have an included angle, and a transverse connecting channel (121) is formed between two adjacent fins (12); the transverse connecting channel (121) connects the liquid inlet channel (13) with the first liquid outlet channel (14), or the transverse connecting channel (121) connects the liquid inlet channel (13) with the second liquid outlet channel (15), or the liquid inlet channel (13) is simultaneously connected to the first liquid outlet channel (14) and the second liquid outlet channel (15) through the transverse connecting channel (121).

2. The heat dissipation core according to claim 1, characterized in that: The width of the liquid inlet channel (13) gradually decreases along the advancing direction of the cooling medium.

3. The heat dissipation core according to claim 2, characterized in that: The liquid inlet channel (13) is in a stepped shape along its length direction, and the width of the liquid inlet channel (13) gradually decreases along the advancing direction of the cooling medium.

4. The heat dissipation core according to claim 2, characterized in that: The liquid inlet channel (13) is wedge-shaped along its length direction, and the width of the liquid inlet channel (13) gradually decreases along the advancing direction of the cooling medium.

5. The heat dissipation core according to claim 1, characterized in that: The heat dissipation core (1) further comprises a front side plate (16) and a rear side plate (17), wherein the front side plate (16) and the rear side plate (17) are respectively arranged at two ends of the liquid inlet channel (13).

6. The heat dissipation core according to claim 1, characterized in that: The transverse connecting channel (121) is perpendicular to the liquid inlet channel (13), the first liquid outlet channel (14) and the second liquid outlet channel (15).

7. The heat dissipation core according to any one of claims 1 to 6, characterized in that: The transverse connecting channel (121) is a zigzag channel.

8. A heat exchange device, characterized in that: include: An upper substrate (2), a lower substrate (3), and a heat dissipation core (1) according to any one of claims 1 to 7; The upper substrate (2) comprises a cooling medium inlet (20) and a cooling medium outlet (21), the cooling medium inlet (20) is in communication with the liquid inlet channel (13) of the heat dissipation core (1), and the cooling medium outlet (21) is in communication with the first liquid outlet channel (14) and the second liquid outlet channel (15); The lower base plate (3) is sealedly connected to the upper base plate (2); the upper base plate (2) and the lower base plate (3) form a heat exchange chamber, and the heat dissipation core (1) is located in the heat exchange chamber.

9. The heat exchange device according to claim 8, characterized in that: The upper substrate (2) is provided with a tapered protrusion (22), the heat dissipation core (1) is located between the tapered protrusion (22) and the lower substrate (3), the tapered protrusion (22) is connected to the heat dissipation core (1), the tapered protrusion (22) divides the heat exchange chamber into a first space and a second space, the first space is connected to the cooling medium inlet (20), the second space is connected to the cooling medium outlet (21), and the liquid inlet channel (13) is located in the first space, and the first liquid outlet channel (14) and the second liquid outlet channel (15) are located in the second space.

10. The heat exchange device according to claim 9, characterized in that: The number of the heat dissipation cores (1) is multiple, and the multiple heat dissipation cores (1) are arranged at intervals; The number of the tapered protrusions (22) is also multiple, and the positions of the multiple tapered protrusions (22) correspond to the multiple heat dissipation cores (1).

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