Anti-fracture 5G high-precision integrated circuit board

Abstract

The invention relates to the technical field of integrated circuit boards, in particular to an anti-fracture 5G high-precision integrated circuit board, which comprises a reinforcing frame, a closing plate, a plurality of first reinforcing ribs, a plurality of second reinforcing ribs, a plurality of screws, a board body part, a conductive seat and a chip, and adopts an external protection structure combining the reinforcing frame and the closing plate, in addition, reinforcing is carried out through the first reinforcing ribs and the second reinforcing ribs, external force impact is effectively dispersed, the anti-fracture capacity of the circuit is improved, in the aspect of material selection, the insulating layer is made of high-performance polymer materials, the substrate layer is an aluminum substrate, and the materials not only have enough toughness, but also can effectively dissipate heat, so that the service life of the circuit is prolonged, and the service life of the circuit is prolonged. Meanwhile, the inner top and the inner side of the reinforcing frame are respectively provided with a first buffer pad and a second buffer pad, the buffer pads can absorb external impact force, and the circuit board is further protected from being damaged.

Description

Technical Field

[0001] The present invention relates to the technical field of integrated circuit boards, and in particular to a fracture-resistant 5G high-precision integrated circuit board. Background Art

[0002] Integrated circuit board is a technology that integrates multiple electronic components and their connections on a miniaturized, packaged circuit board through a specific process. As a core component of electronic equipment, it is widely used in computers, communication equipment, consumer electronics, industrial control, automotive electronics and other fields.

[0003] The prior art patent CN217445569U discloses a 5G high-precision integrated circuit board that is easy to dissipate heat, including a circuit board body, to which a plurality of transistors are electrically connected, an aluminum alloy carrier plate adapted to the transistors is also provided on the upper side of the circuit board body, a detachable heat insulation plate is also installed between the transistors and the aluminum alloy carrier plate, an aluminum alloy partition plate is fixedly connected to the front side of the aluminum alloy carrier plate and between two adjacent transistors and on both sides of the plurality of transistors, the aluminum alloy carrier plate and the aluminum alloy partition plates on both sides of the transistor form a heat dissipation cavity, the transistors and the heat insulation plate are both located inside the heat dissipation cavity, which can isolate the transistors and the aluminum alloy carrier plate that do not require auxiliary heat dissipation, reduce the heat dissipation load of the aluminum alloy carrier plate, and improve the heat dissipation effect of the device.

[0004] However, the 5G integrated circuit boards currently on the market generally face the problem of easy breakage due to insufficient material toughness, unreasonable structural design and manufacturing process defects, which seriously affects the reliability and service life of the product. Therefore, it is particularly important to develop a 5G high-precision integrated circuit board that can effectively prevent breakage. Summary of the invention

[0005] The purpose of the present invention is to provide a 5G high-precision integrated circuit board that is anti-fracture, so as to solve the problem of easy fracture faced by 5G integrated circuit boards currently on the market in the prior art due to insufficient material toughness, unreasonable structural design and manufacturing process defects, which seriously affects the reliability and service life of the product. Therefore, it is particularly important to develop a 5G high-precision integrated circuit board that can effectively prevent fracture.

[0006] To achieve the above-mentioned objectives, the present invention provides a fracture-resistant 5G high-precision integrated circuit board, comprising a reinforcement frame, a closing plate, a plurality of first reinforcing ribs, a plurality of second reinforcing ribs, a plurality of screws and a plate body member, a conductive seat and a chip are arranged above the plate body member, and a fixing seat is arranged at the four bottom corners of the plate body member, the reinforcement frame is slidably connected to the plate body member and is sleeved on the outside of the plate body member, the closing plate is fixedly connected to the plate body member by screws and is located below the plate body member, and the screw thread is arranged in the fixing seat, the closing plate is held against the bottom of the reinforcement frame, a plurality of the first reinforcing ribs are respectively bonded to the plate body member and are located on the lower end surface of the plate body member, and a plurality of the second reinforcing ribs are respectively bonded to the plate body member and are located on the lower end surface of the plate body member.

[0007] Among them, the board body includes a circuit board layer, an insulating layer and a substrate layer, the circuit board layer is arranged on the upper end surface of the insulating layer, the insulating layer is arranged on the upper end surface of the substrate layer, and the reinforcement frame is sleeved on the outside of the circuit board layer, the insulating layer and the substrate layer.

[0008] Among them, multiple first reinforcing ribs are longitudinally arranged on the lower end surface of the substrate layer, multiple second reinforcing ribs are transversely arranged on the lower end surface of the substrate layer, and multiple first reinforcing ribs and multiple second reinforcing ribs are respectively supported on the upper end surface of the closing plate.

[0009] Wherein, the reinforcement frame is made of metal material, the insulating layer is made of high-performance polymer material, and the substrate layer is an aluminum substrate.

[0010] Among them, a first buffer pad is arranged on the inner top of the reinforcement frame, a second buffer pad is arranged on the inner side of the reinforcement frame, and the first buffer pad is abutted against the outer edge of the circuit board layer, and the second buffer pad is abutted against the outer sides of the circuit board layer, the insulating layer and the substrate layer.

[0011] Wherein, a plurality of mounting seats are arranged on the outer side of the reinforcement frame, and mounting holes are arranged inside the mounting seats.

[0012] The insulating layer and the substrate layer each have a plurality of first heat dissipation holes inside, the closed plate has a plurality of second heat dissipation holes, and the plurality of first heat dissipation holes are connected to the plurality of second heat dissipation holes.

[0013] The present invention provides a fracture-resistant 5G high-precision integrated circuit board, comprising a reinforcement frame, a closed plate, a plurality of first reinforcement ribs, a plurality of second reinforcement ribs, a plurality of screws and a plate body, wherein a conductive seat and a chip are arranged above the plate body, and a fixing seat is arranged at each of the four bottom corners of the plate body, and an external protection structure combining the reinforcement frame with the closed plate is adopted, wherein the reinforcement frame is made of metal and is tightly combined with the plate body through a sliding connection, thereby providing strong external support. In addition, the first reinforcement rib and the second reinforcement rib are used for reinforcement, thereby effectively dispersing external force impact and improving the fracture resistance of the circuit. In terms of material selection, the insulating layer adopts high-performance The polymer material is used, and the substrate layer is an aluminum substrate. These materials not only have sufficient toughness, but also can effectively dissipate heat, thereby improving the overall performance of the circuit board. At the same time, the inner top and inner side of the reinforcement frame are respectively provided with the first buffer pad and the second buffer pad. These buffer pads can absorb external impact force and further protect the circuit board from damage. In this way, the problem of easy breakage caused by insufficient material toughness, unreasonable structural design and manufacturing process defects that 5G integrated circuit boards on the market are effectively solved, which seriously affects the reliability and service life of the product. Therefore, it is a particularly important technical issue to develop a 5G high-precision integrated circuit board that can effectively prevent breakage. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art are briefly introduced below.

[0015] Figure 1 It is a three-dimensional stereogram of a fracture-proof 5G high-precision integrated circuit board of the present invention.

[0016] Figure 2 This is a front view of a fracture-resistant 5G high-precision integrated circuit board of the present invention.

[0017] Figure 3 The present invention Figure 2 Section view along line AA.

[0018] Figure 4 The present invention Figure 3 A partial enlarged view of point B in the middle.

[0019] Figure 5 It is an overhead view of a middle reinforcement frame and a board body of a fracture-resistant 5G high-precision integrated circuit board of the present invention.

[0020] 101-reinforcement frame, 102-closing plate, 103-first reinforcing rib, 104-second reinforcing rib, 105-screw, 106-conductive seat, 107-chip, 108-fixing seat, 109-circuit board layer, 110-insulating layer, 111-substrate layer, 112-first buffer pad, 113-second buffer pad, 114-mounting seat, 115-mounting hole, 116-first heat dissipation hole, 117-second heat dissipation hole. DETAILED DESCRIPTION

[0021] Embodiments of the present invention are described in detail below. Examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, but should not be construed as limiting the present invention.

[0022] See also Figure 1 to Figure 5 The present invention provides a fracture-proof 5G high-precision integrated circuit board, comprising a reinforcement frame 101, a closing plate 102, a plurality of first reinforcing ribs 103, a plurality of second reinforcing ribs 104, a plurality of screws 105 and a plate body, wherein a conductive seat 106 and a chip 107 are arranged above the plate body, and a fixing seat 108 is arranged at each of the four bottom corners of the plate body, the reinforcement frame 101 is slidably connected to the plate body and sleeved on the outer side of the plate body, the closing plate 102 is fixedly connected to the plate body by screws 105 and is located below the plate body, and the screws 105 are threadedly arranged in the fixing seat 108, and the closing plate 102 is held against the bottom of the reinforcement frame 101, Multiple first reinforcing ribs 103 are respectively bonded to the plate body and are located on the lower end surface of the plate body. Multiple second reinforcing ribs 104 are respectively bonded to the plate body and are located on the lower end surface of the plate body. Through the sliding connection design between the reinforcement frame 101 and the plate body, and the fixed connection between the closing plate 102 and the plate body through screws 105, a stable external protection structure is formed. This design not only enhances the overall strength of the circuit board, but also effectively prevents the breakage problem caused by external impact or vibration. At the same time, the setting of the first reinforcing ribs 103 and the second reinforcing ribs 104 further enhances the structural support of the lower end of the plate body and improves the anti-fracture ability.

[0023] Furthermore, the board body includes a circuit board layer 109, an insulating layer 110 and a substrate layer 111. The circuit board layer 109 is arranged on the upper end surface of the insulating layer 110, the insulating layer 110 is arranged on the upper end surface of the substrate layer 111, and the reinforcement frame 101 is sleeved on the outside of the circuit board layer 109, the insulating layer 110 and the substrate layer 111. Through the layered design, the structure of the circuit board is clearer and the function is clearer. The setting of the insulating layer 110 effectively isolates the electrical interference between the circuit board layer 109 and the substrate layer 111, thereby improving the stability and reliability of the circuit. At the same time, the reinforcement frame 101 is sleeved on the outside of the three-layer structure, further enhancing the stability of the overall structure and providing comprehensive protection for the circuit board.

[0024] Furthermore, multiple first reinforcing ribs 103 are longitudinally arranged on the lower end surface of the substrate layer 111, and multiple second reinforcing ribs 104 are transversely arranged on the lower end surface of the substrate layer 111, and multiple first reinforcing ribs 103 and multiple second reinforcing ribs 104 are respectively abutted against the upper end surface of the closing plate 102. Through this cross-layout, not only the structural support of the lower end of the plate body is enhanced, but also the anti-twisting ability of the circuit board is improved. At the same time, the first reinforcing ribs 103 and the enemy reinforcing ribs are abutted against the upper end surface of the closing plate 102, so that the connection between the closing plate 102 and the plate body is tighter, further enhancing the stability of the overall structure.

[0025] Furthermore, the reinforcement frame 101 is made of metal, the insulating layer 110 is made of high-performance polymer material, and the substrate layer 111 is an aluminum substrate. The reinforcement frame 101 is made of metal material, which has high strength and good conductivity, and can effectively resist external impact and electromagnetic interference; the insulating layer 110 is made of high-performance polymer material, which has excellent insulation performance and heat resistance, ensuring the safe operation of the circuit board; the substrate layer 111 is made of aluminum substrate, which has good heat dissipation performance and mechanical strength, providing a stable operating environment for the circuit board. The selection of these high-quality materials has significantly improved the overall performance of the circuit board.

[0026] Furthermore, a first buffer pad 112 is provided at the inner top of the reinforcement frame 101, and a second buffer pad 113 is provided on the inner side of the reinforcement frame 101, and the first buffer pad 112 is abutted against the outer edge of the circuit board layer 109, and the second buffer pad 113 is abutted against the outer sides of the circuit board layer 109, the insulating layer 110 and the substrate layer 111. The first buffer pad 112 and the second buffer pad 113 can absorb external impact force, thereby reducing damage to the circuit board when it is impacted by external force. At the same time, the setting of the first buffer pad 112 and the second buffer also improves the stability of the circuit board in a vibration environment and extends the service life of the circuit board.

[0027] Furthermore, a plurality of mounting seats 114 are provided on the outer side of the reinforcement frame 101, and mounting holes 115 are provided inside the mounting seats 114. The plurality of mounting seats 114 and the mounting holes 115 facilitate the installation and fixation of the circuit board. This design enables the circuit board to be conveniently installed in various devices, thereby improving the flexibility and scalability of the circuit.

[0028] Furthermore, the insulating layer 110 and the substrate layer 111 each have a plurality of first heat dissipation holes 116 therein, the closed plate 102 has a plurality of second heat dissipation holes 117, and the plurality of first heat dissipation holes 116 and the plurality of second heat dissipation holes 117 are connected. These heat dissipation holes not only improve the heat dissipation performance of the circuit board, but also enable the circuit board to maintain a stable temperature environment during long-term operation. This design effectively reduces the failure rate of the circuit board and improves the reliability and service life of the product.

[0029] When using a fracture-proof 5G high-precision integrated circuit board of this embodiment, the circuit board is comprehensively strengthened and protected through a series of carefully designed components and layouts. Specifically, the reinforcement frame 101 is slidably connected and tightly sleeved on the outside of the board body, providing a solid external support for the circuit board, effectively resisting external force impact and vibration, and preventing the circuit board from breaking. At the same time, the closing plate 102 is firmly fixed to the bottom of the board body by screws 105 and forms a closed protection space together with the reinforcement frame 101, further enhancing the overall stability and safety of the circuit board. In addition, a plurality of the first reinforcing ribs 103 and the second reinforcing ribs 104 are respectively arranged longitudinally and transversely on the lower end surface of the substrate layer 111, and abut against the upper end surface of the closing plate 102. This cross layout significantly improves the anti-twisting and anti-fracture capabilities of the circuit board. The reinforcement frame 101 is made of metal material, the insulating layer 110 is made of high-performance polymer material, and the substrate layer 111 is made of aluminum substrate. The selection of these high-quality materials not only enhances the overall performance of the circuit board, but also improves its heat dissipation efficiency and Electrical insulation performance, the first buffer pad 112 and the second buffer pad 113 are also arranged on the top and inner side of the reinforcement frame 101, these buffer pads can absorb external impact force and reduce the damage of the circuit board when it is impacted. At the same time, the multiple mounting seats 114 and the mounting holes 115 arranged on the outer side of the reinforcement frame 101 provide convenience for the installation and fixation of the circuit board and enhance its connection strength with other devices. Finally, the multiple first heat dissipation holes 116 inside the insulating layer 110 and the substrate layer 111, and the multiple second heat dissipation holes 117 on the closing plate 102 together constitute an efficient heat dissipation system structure, ensuring that the circuit board can still maintain a stable temperature environment under long-term operation, reducing the failure rate and extending the service life. In this way, it effectively solves the problem of easy breakage caused by insufficient material toughness, unreasonable structural design and manufacturing process defects faced by 5G integrated circuit boards on the current market, which seriously affects the reliability and service life of the product. Therefore, it is a particularly important technical issue to develop a 5G high-precision integrated circuit board that can effectively prevent breakage.

[0030] What is disclosed above is only one or more preferred embodiments of the present application, and cannot be used to limit the scope of rights of the present application. Ordinary technicians in this field can understand that all or part of the processes of implementing the above embodiments and equivalent changes made according to the claims of the present application are still within the scope covered by the present application.

Claims

1. A fracture-resistant 5G high-precision integrated circuit board, characterized in that: It includes a reinforcement frame, a closing plate, a plurality of first reinforcement ribs, a plurality of second reinforcement ribs, a plurality of screws and a plate body, wherein a conductive seat and a chip are arranged above the plate body, and a fixing seat is arranged at the four bottom corners of the plate body, the reinforcement frame is slidably connected to the plate body and sleeved on the outer side of the plate body, the closing plate is fixedly connected to the plate body by screws and is located below the plate body, and the screw thread is arranged in the fixing seat, the closing plate is abutted against the bottom of the reinforcement frame, a plurality of the first reinforcement ribs are respectively bonded to the plate body and are located on the lower end surface of the plate body, and a plurality of the second reinforcement ribs are respectively bonded to the plate body and are located on the lower end surface of the plate body.

2. The anti-fracture 5G high-precision integrated circuit board according to claim 1, characterized in that: The board body comprises a circuit board layer, an insulating layer and a substrate layer, the circuit board layer is arranged on the upper end surface of the insulating layer, the insulating layer is arranged on the upper end surface of the substrate layer, and the reinforcement frame is sleeved on the outer sides of the circuit board layer, the insulating layer and the substrate layer.

3. The anti-fracture 5G high-precision integrated circuit board according to claim 2, characterized in that: The first plurality of reinforcing ribs are longitudinally arranged on the lower end surface of the substrate layer, the second plurality of reinforcing ribs are transversely arranged on the lower end surface of the substrate layer, and the first plurality of reinforcing ribs and the second plurality of reinforcing ribs are respectively abutted against the upper end surface of the closing plate.

4. The anti-fracture 5G high-precision integrated circuit board according to claim 3, characterized in that: The reinforcement frame is made of metal, the insulating layer is made of high-performance polymer material, and the substrate layer is an aluminum substrate.

5. The anti-fracture 5G high-precision integrated circuit board according to claim 4, characterized in that: A first buffer pad is arranged on the inner top of the reinforcement frame, a second buffer pad is arranged on the inner side of the reinforcement frame, and the first buffer pad abuts against the outer edge of the circuit board layer, and the second buffer pad abuts against the outer sides of the circuit board layer, the insulation layer and the substrate layer.

6. The anti-fracture 5G high-precision integrated circuit board according to claim 5, characterized in that: A plurality of mounting seats are arranged on the outer side of the reinforcement frame, and mounting holes are arranged inside the mounting seats.

7. The anti-fracture 5G high-precision integrated circuit board according to claim 6, characterized in that: The insulating layer and the substrate layer are each provided with a plurality of first heat dissipation holes inside, the closed plate is provided with a plurality of second heat dissipation holes, and the plurality of first heat dissipation holes are connected with the plurality of second heat dissipation holes.

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