Battery management system, battery and automobile

Abstract

The invention relates to the technical field of heat dissipation of battery management systems, in particular to a battery management system, a battery and an automobile, the battery management system comprises a circuit board, a heat dissipation assembly and a shell, and the shell is provided with a containing cavity; the circuit board is positioned in the accommodating cavity; the heat dissipation assembly is attached to the inner wall face of the containing cavity, and the heat dissipation assembly surrounds from one face of the circuit board to the opposite face of one face of the circuit board. The heat dissipation efficiency can be improved.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation of battery management systems, and in particular to a battery management system, a battery and a car. Background Art

[0002] A battery is an energy component that supplies power to a car's motor and other electrical components. It can provide power to these electrical components through multiple battery cells.

[0003] A battery generally includes a battery management system and battery cells. Each battery cell stores a certain amount of electricity in the form of chemical energy. The battery management system is used to adjust the voltage of each battery cell so that the voltage difference between each battery cell remains within a stable range.

[0004] In the related art, the equalizing resistor of the battery management system is prone to overheating because it generally discharges the battery cells to reduce the voltage difference. Summary of the invention

[0005] In view of this, the present application provides a battery management system, a battery and a car to improve the efficiency of heat dissipation.

[0006] Specifically, the following technical solutions are included:

[0007] A first aspect of the present application provides a battery management system, the battery management system comprising a circuit board, a heat dissipation component and a housing, wherein:

[0008] The housing has a receiving cavity;

[0009] The circuit board is located in the accommodating cavity;

[0010] The heat dissipation component is attached to the inner wall surface of the accommodating cavity, and the heat dissipation component surrounds from one side of the circuit board to the opposite side of the one side of the circuit board.

[0011] Optionally, the heat dissipation assembly includes a first heat dissipation portion and a second heat dissipation portion, the first heat dissipation portion has a first cooling channel, the second heat dissipation portion has a second cooling channel, and two ends of the first cooling channel are connected to two ends of the second cooling channel in a one-to-one correspondence.

[0012] Optionally, the circuit board has a balancing resistor, which is arranged on both sides of the circuit board, wherein the first cooling channel has a first expansion section, and the balancing resistor is located within the orthographic projection of the first expansion section on the circuit board, and / or the second cooling channel has a second expansion section, and the balancing resistor is located within the orthographic projection of the second expansion section on the circuit board.

[0013] Optionally, the battery management system further includes a first heat-conducting portion, which is located between the circuit board and the first expansion section, and / or the battery management system further includes a second heat-conducting portion, which is located between the circuit board and the second expansion section.

[0014] Optionally, the heat dissipation assembly includes a conducting portion, and an end of the first cooling channel is connected to an end of the second cooling channel through the conducting portion.

[0015] Optionally, the circuit board has a positioning hole, the positioning hole passes through from one side of the circuit board to the opposite side, and the conductive portion is inserted into the positioning hole.

[0016] Optionally, the housing comprises an upper shell and a lower shell, and an edge of the upper shell is connected to an edge of the lower shell to form the accommodating cavity.

[0017] Optionally, the upper shell has a first flange, the lower shell has a second flange, and the first flange is in close contact with the second flange.

[0018] A second aspect of the present application provides a battery, which includes a battery management system as described in the above technical solution.

[0019] A third aspect of the present application provides a car, comprising a battery as described in the above technical solution.

[0020] The beneficial effects of the technical solution provided by the embodiment of the present application include at least: a capacitor device can be arranged on one side of the circuit board, which consumes the power of the battery cell and reduces the pressure difference between the battery cells. The heat dissipation component can guide the heat generated by the power consumption on one side of the circuit board to the opposite side, thereby improving the efficiency of heat dissipation. The heat dissipation component is attached to the inner wall surface of the accommodating cavity, and can guide the heat received from the circuit board to the outside through the shell, thereby further improving the efficiency of heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0022] Figure 1 A schematic diagram of the structural decomposition of a battery management system provided in an embodiment of the present application;

[0023] Figure 2 A full cross-sectional schematic diagram of a battery management system provided in an embodiment of the present application.

[0024] The reference numerals in the figures represent respectively:

[0025] 1. Circuit board; 11. Equalizing resistor; 100. Positioning hole;

[0026] 2. heat dissipation component; 21. first heat dissipation part; 210. first cooling channel; 2101. first expansion section; 2102. first connecting section; 22. second heat dissipation part; 220. second cooling channel; 2201. second expansion section; 2202. second connecting section;

[0027] 3. Shell; 300. Accommodating chamber; 31. Upper shell; 311. First flange; 312. First clamping portion; 32. Lower shell; 321. Second flange; 322. Second clamping portion;

[0028] 4. The first heat conducting part;

[0029] 5. The second heat transfer part;

[0030] 61. first cylinder; 62. second cylinder;

[0031] 7. Sealing plug.

[0032] The above drawings have shown clear embodiments of the present application, which will be described in more detail later. These drawings and text descriptions are not intended to limit the scope of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0034] The directional nouns involved in the embodiments of the present application, such as "upper", "lower", "side", etc., are generally represented by Figure 1 The relative relationship of the orientation shown in the figure is used as the basis, and these orientation terms are used only to more clearly describe the relationship between structures, not to describe absolute orientation. When the product is placed in different postures, the orientation may change, for example, "up" and "down" may be interchangeable.

[0035] Unless otherwise defined, all technical terms used in the embodiments of the present application have the same meanings as commonly understood by those of ordinary skill in the art.

[0036] In order to make the technical solutions and advantages of the present application more clear, the implementation methods of the present application will be further described in detail below with reference to the accompanying drawings.

[0037] At present, the BMS (Battery Manager System) balancing methods on new energy vehicles are mainly divided into active balancing and passive balancing. Taking into account the cost disadvantage, most OEMs do not adopt active balancing. Now new energy vehicle BMS balancing methods mostly use passive balancing. Passive balancing mainly discharges the battery cells by controlling the balancing resistors on the BMS circuit board to reduce the voltage difference between the battery cells and maintain the safety and stability of the battery pack.

[0038] Due to the poor consistency of voltage between cells in the battery pack, the BMS can discharge the voltage difference through the balancing resistor on the balancing circuit as a load while collecting the single cell voltage, so that the voltage difference is reduced. The balancing is affected by the heating of the balancing resistor, which makes the balancing current small and the balancing efficiency low. The passive balancing method is relatively simple for hardware circuit design. It mainly connects a balancing resistor in series in each single cell voltage collection circuit. However, there are many resistors. Considering the small size of the BMS hardware circuit board design, it is difficult to use a large package power resistor, resulting in limited balancing current. In order to achieve a good balancing effect, the energy transferred to the resistor needs to be released in time to avoid energy accumulation and burning of the resistor or even the entire circuit.

[0039] A first aspect of the present application provides a battery management system, such as Figure 1 and Figure 2 As shown, the battery management system includes a circuit board 1, a heat dissipation component 2 and a housing 3, wherein:

[0040] The housing 3 has a receiving cavity 300;

[0041] The circuit board 1 is located in the accommodating cavity 300;

[0042] The heat dissipation component 2 is attached to the inner wall surface of the accommodating cavity 300 , and the heat dissipation component 2 surrounds from one side of the circuit board 1 to the opposite side of the one side of the circuit board 1 .

[0043] It is understandable that a capacitor device can be arranged on one side of the circuit board 1, and the power of the battery cells is consumed to reduce the pressure difference between the battery cells. The heat dissipation component 2 can guide the heat generated by the power consumption on one side of the circuit board 1 to the opposite side, so as to improve the efficiency of heat dissipation. The heat dissipation component 2 is attached to the inner wall surface of the accommodating cavity 300, and the heat received from the circuit board 1 can be guided to the outside through the shell 3, so as to further improve the efficiency of heat dissipation.

[0044] In the embodiment of the present application, the circuit board 1 is located in the accommodating cavity 300 and can be directly connected to the inner wall surface of the accommodating cavity 300 to fix its position, or it can be supported by the heat dissipation component 2 to fix its position.

[0045] In the embodiment of the present application, the heat dissipation component 2 can receive heat from the circuit board 1 through liquid cooling or air cooling, and transfer it to the other side of the circuit board 1 and the side wall of the accommodating cavity 300 for external dissipation, thereby achieving cooling of the circuit board 1.

[0046] In the embodiment of the present application, the housing 3 may be made of a metal with strong thermal conductivity, such as copper, aluminum, or an alloy thereof.

[0047] In the embodiment of the present application, the heat dissipation component 2 can be completely located in the accommodating cavity 300 , and the heat of the circuit board 1 can be conducted through the inner wall surface of the accommodating cavity 300 .

[0048] In some of the embodiments of this application, Figure 1 and Figure 2 As shown, the heat dissipation assembly 2 includes a first heat dissipation portion 21 and a second heat dissipation portion 22. The first heat dissipation portion 21 has a first cooling channel 210, and the second heat dissipation portion 22 has a second cooling channel 220. Both ends of the first cooling channel 210 are connected to both ends of the second cooling channel 220 in a one-to-one correspondence.

[0049] It is understandable that the first cooling channel 210 and the second cooling channel 220 can contain a coolant, and the coolant can dissipate the heat of the circuit board 1 to cool it. The first cooling channel 210 can be close to the capacitive resistor of the circuit board 1, so that the heat enters the coolant and enters the second cooling channel 220 and the housing 3 with the coolant. The second cooling channel 220 and the housing 3 receive the heat and dissipate it to the outside, thus achieving a cooling effect.

[0050] In the embodiment of the present application, the outer wall of the first cooling channel 210 can be attached to the inner wall of the accommodating cavity 300, so as to improve the efficiency of heat dissipation.

[0051] In the embodiment of the present application, the outer wall of the second cooling channel 220 can be attached to the inner wall of the accommodating cavity 300, so as to improve the efficiency of heat dissipation.

[0052] In the embodiment of the present application, the two ends of the first cooling channel 210 are connected to the two ends of the second cooling channel 220 in a one-to-one correspondence, which may refer to the two ends of the first cooling channel 210 and the second cooling channel 220 located on the same side of the accommodating cavity 300 being connected, or it may refer to the two ends of the first cooling channel 210 and the second cooling channel 220 located on different sides of the accommodating cavity 300 being connected.

[0053] In some of the embodiments of this application, Figure 1 As shown, the circuit board 1 has a balancing resistor 11, which is arranged on both sides of the circuit board 1, wherein the first cooling channel 210 has a first expansion section 2101, and the balancing resistor 11 is located in the orthographic projection of the first expansion section 2101 on the circuit board 1.

[0054] It is understandable that the balancing resistor 11 can convert the electric energy of the battery cell into heat energy, thereby reducing the pressure difference between the battery cells. The balancing resistor 11 is located in the positive projection of the first expansion section 2101 on the circuit board 1, which is conducive to the first expansion section 2101 receiving the heat from the balancing resistor 11 and dissipating it to the second cooling channel 220 and the inner wall of the accommodating cavity 300 using the coolant, which is conducive to reducing the situation where excessive heat accumulates when the circuit board 1 is working.

[0055] In an embodiment of the present application, the first cooling channel 210 includes a first connecting section 2102, and both ends of the first expansion section 2101 are respectively connected to a first connecting section 2102, and each first connecting section 2102 is connected to the second cooling channel 220, wherein the bottom surface of the first expansion section 2101 is flush with the bottom surface of the first connecting section 2102, or higher than the first connecting section 2102, which is helpful to avoid the coolant staying in the first expansion section 2101 for a long time, resulting in a decrease in heat dissipation efficiency.

[0056] In the embodiment of the present application, the height of the first expansion section 2101 is higher than the height of the first connection section 2102 , which is beneficial to improving the heat dissipation effect of the first expansion section 2101 on the balancing resistor 11 .

[0057] In some of the embodiments of this application, Figure 1 and Figure 2 As shown, the circuit board 1 has a balancing resistor 11, which is arranged on both sides of the circuit board 1, wherein the second cooling channel 220 has a second expansion section 2201, and the balancing resistor 11 is located in the orthographic projection of the second expansion section 2201 on the circuit board 1.

[0058] It is understandable that the balancing resistor 11 can convert the electric energy of the battery cell into heat energy, thereby reducing the pressure difference between the battery cells. The balancing resistor 11 is located in the positive projection of the second expansion section 2201 on the circuit board 1, which is conducive to the second expansion section 2201 receiving the heat from the balancing resistor 11 and dissipating it to the second cooling channel 220 and the inner wall of the accommodating cavity 300 using the coolant, which is conducive to reducing the situation where excessive heat accumulates when the circuit board 1 is working.

[0059] In an embodiment of the present application, the second cooling channel 220 includes a second connecting section 2202, and both ends of the second expansion section 2201 are respectively connected to a second connecting section 2202, and each second connecting section 2202 is connected to the first cooling channel 210, wherein the bottom surface of the second expansion section 2201 is flush with the bottom surface of the second connecting section 2202, or is higher than the second connecting section 2202, which helps to prevent the coolant from staying in the second expansion section 2201 for a long time, resulting in a decrease in heat dissipation efficiency.

[0060] In some of the embodiments of this application, Figure 1 and Figure 2 As shown, the circuit board 1 has a balancing resistor 11, and the balancing resistors 11 are arranged on two opposite sides of the circuit board 1, wherein the first cooling channel 210 has a first expansion section 2101, and the balancing resistor 11 is located in the orthographic projection of the first expansion section 2101 on the circuit board 1, the second cooling channel 220 has a second expansion section 2201, and the balancing resistor 11 is located in the orthographic projection of the second expansion section 2201 on the circuit board 1, the first expansion section 2101 is in contact with a surface of the circuit board 1 where the balancing resistor 11 is located, and the second expansion section 2201 is in contact with another surface of the circuit board 1 where the balancing resistor 11 is located.

[0061] In the embodiment of the present application, since the number of balancing resistors 11 generally corresponds to the number of battery cells, and all balancing resistors 11 do not work at the same time, the first expansion section 2101 is in contact with the surface of the circuit board 1 where one balancing resistor 11 is located, and the second expansion section 2201 is in contact with the surface of the circuit board 1 where another balancing resistor 11 is located, which can fully utilize all the coolant in the heat dissipation component 2 to dissipate heat for a single or several working balancing resistors 11 and improve the heat dissipation efficiency.

[0062] In the embodiment of the present application, the first expansion section 2101 may be in contact with the balancing resistor 11 through an intermediate medium to reduce the possibility that the circuit board 1 may be short-circuited due to coolant leakage in the first expansion section 2101 .

[0063] In some of the embodiments of this application, Figure 1 As shown, the battery management system further includes a first heat conducting portion 4 , and the first heat conducting portion 4 is located between the circuit board 1 and the first expansion section 2101 .

[0064] It can be understood that the first heat conducting portion 4 is helpful to increase the speed of heat conduction from the balancing resistor 11 to the first expansion section 2101 , which is helpful to improve the conduction efficiency of the coolant in the first cooling channel 210 .

[0065] In the embodiment of the present application, the first heat conducting portion 4 can be a silicone pad to improve the efficiency of heat conduction from the balancing resistor 11 to the first expansion section 2101. In addition, if the balancing resistor 11 is accompanied by voltage during operation, it can be insulated by the silicone pad to reduce the possibility of the heat dissipation component 2 and the housing 3 being charged.

[0066] In the embodiment of the present application, the first heat conducting part 4 can be a thermally conductive silicone pad, which can insulate the electrical components on the one hand, conduct heat on the other hand, and fill the gap between the insulating resistor surface and the heat sink surface to enhance buffering and play a role in heat transfer.

[0067] In the embodiment of the present application, there is a gap of 2 mm between the first expansion section 2101 and the surface of the circuit board 1 where the balancing resistor 11 is located, and the gap is filled by the first heat conducting part 4 to achieve the function of heat conduction.

[0068] In the embodiment of the present application, the orthographic projection of the first expansion section 2101 on the circuit board 1 is located within the orthographic projection of the first heat conducting portion 4 on the circuit board 1 , which is beneficial to improving the efficiency of the first heat conducting portion 4 in completely conducting heat to the first expansion section 2101 .

[0069] In some of the embodiments of this application, Figure 1 As shown, the battery management system further includes a second heat conducting portion 5 , and the second heat conducting portion 5 is located between the circuit board 1 and the second expansion section 2201 .

[0070] It can be understood that the second heat conducting portion 5 is helpful to increase the speed of heat conduction from the balancing resistor 11 to the second expansion section 2201 , which is helpful to improve the conduction efficiency of the coolant in the second cooling channel 220 .

[0071] In the embodiment of the present application, the second heat conducting portion 5 can be a silicone pad to improve the efficiency of heat conduction from the balancing resistor 11 to the second expansion section 2201. In addition, if the balancing resistor 11 is accompanied by voltage during operation, it can be insulated by the silicone pad to reduce the possibility of the heat dissipation component 2 and the housing 3 being charged.

[0072] In the embodiment of the present application, the first heat conducting part 4 can be a thermally conductive silicone pad, which can insulate the electrical components on the one hand, conduct heat on the other hand, and fill the gap between the insulating resistor surface and the heat sink surface to enhance buffering and play a role in heat transfer.

[0073] In the embodiment of the present application, the orthographic projection of the first expansion section 2101 on the circuit board 1 is located within the orthographic projection of the first heat conducting portion 4 on the circuit board 1 , which is beneficial to improving the efficiency of the first heat conducting portion 4 in completely conducting heat to the first expansion section 2101 .

[0074] In the embodiment of the present application, there is a gap of 2 mm between the second expansion section 2201 and the surface of the circuit board 1 where the balancing resistor 11 is located, and the gap is filled by the second heat conducting part 5 to achieve the function of heat conduction.

[0075] In some embodiments of the present application, the battery management system also includes a first heat conducting part 4, which is located between the circuit board 1 and the first expansion section 2101, and the battery management system also includes a second heat conducting part 5, which is located between the circuit board 1 and the second expansion section 2201.

[0076] It can be understood that such a configuration is helpful to improve the heat dissipation efficiency of the heat dissipation component 2.

[0077] In some of the embodiments of this application, Figure 1 and Figure 2 As shown, the heat dissipation assembly 2 includes a conducting portion, and an end of the first cooling channel 210 is connected to an end of the second cooling channel 220 through the conducting portion.

[0078] It can be understood that the conducting portion can provide conditions for the coolant to flow between the first cooling channel 210 and the second cooling channel 220. The coolant in the first cooling channel 210 can transfer heat to the coolant in the second cooling channel 220 when heated, which is beneficial to the dissipation of heat. The coolant in the second cooling channel 220 can also transfer heat to the first cooling channel 210 when heated, which is beneficial to the heat dissipation efficiency of the heat dissipation component 2.

[0079] In the embodiment of the present application, the number of the conducting portion may be one, and one conducting portion connects the first cooling channel 210 and the second cooling channel 220 at one end on the same side, or connects the first cooling channel 210 and the second cooling channel 220 at one end on the opposite side.

[0080] In the embodiment of the present application, the number of the conducting parts can be two, wherein one conducting part connects the first cooling channel 210 and the second cooling channel 220 at one end on the same side, and the other conducting part connects the first cooling channel 210 and the second cooling channel 220 at the other end on the same side.

[0081] In the embodiment of the present application, the conducting portion can be integrally formed with the first heat dissipation portion 21 , and communicated with the second cooling channel 220 of the second heat dissipation portion 22 by plugging.

[0082] In the embodiment of the present application, the conducting portion can be integrally formed with the second heat dissipation portion 22 , and communicated with the first cooling channel 210 of the first heat dissipation portion 21 by plugging.

[0083] In the embodiment of the present application, the housing 3 may be provided with a liquid injection hole, which is connected to the first cooling channel 210 , so that after assembly is completed, the coolant can be replenished in time when the coolant is lost.

[0084] In the embodiment of the present application, the conducting part may include a first cylinder 61 and a second cylinder 62, the first cylinder 61 vertically penetrates the first cooling channel 210, the second cylinder 62 vertically extends from one end of the second cooling channel 220, the first cylinder 61 is sleeved on the outside of the second cylinder 62, the second cylinder 62 extends into the injection hole of the shell through the first heat dissipation part 21, a sealing ring is arranged between the first cylinder 61 and the second cylinder 62, and is used to seal the gap between the first cylinder 61 and the second cylinder 62, and openings may be arranged on the first cylinder 61 and the second cylinder 62, so that the coolant can flow between the first cooling channel 210 and the second cooling channel 220. A liquid injection port may be arranged at the end of the first cylinder 61, and the liquid injection port may be sealed by a sealing plug 7.

[0085] In the embodiment of the present application, the end of the first cylinder 61 abuts against the surface of the second heat dissipation portion 22, so that the first heat dissipation portion 21 and the second heat dissipation portion 22 can maintain a relatively fixed distance through the interference effect of the second heat dissipation portion 22 to accommodate the circuit board 1.

[0086] In an embodiment of the present application, the sum of the volume of the coolant in the first cooling channel 210 and the volume of the coolant in the second cooling channel 220 accounts for 90% of the volume of the first cooling channel 210 and the volume of the second cooling channel 220. A first temperature sensor is arranged in the first cooling channel 210, and a second temperature sensor is arranged in the second cooling channel 220. A water pump is arranged in the first cooling channel 210. When there is a large temperature difference between the temperatures sensed by the first temperature sensor and the second temperature sensor, the water pump drives the coolant in the first cooling channel 210 to operate, so that the coolant in the first cooling channel 210 and the coolant in the second cooling channel 220 can circulate, thereby improving the cooling efficiency.

[0087] In the embodiment of the present application, the temperature difference may be 5°C, 6°C or 7°C.

[0088] In some of the embodiments of this application, Figure 1 and Figure 2 As shown, the circuit board 1 has a positioning hole 100 , and the positioning hole 100 penetrates from one side of the circuit board 1 to the opposite side, and the conductive portion is penetrated in the positioning hole 100 .

[0089] It is understandable that the positioning hole 100 can limit the conductive part. The conductive part located in the positioning hole 100 is interfered by the positioning hole 100, and the radial movement space along the positioning hole 100 is small enough, which is conducive to the normal operation of the heat dissipation component 2.

[0090] In the embodiment of the present application, the number of the positioning holes 100 and the number of the conducting portions can both be 1, 2, 3 or 4. When the number of both is 2 or more, they can be arranged on opposite sides of the circuit board 1 and close to the same side or opposite sides of the circuit board 1.

[0091] In some of the embodiments of this application, Figure 1 and Figure 2 As shown, the housing 3 includes an upper shell 31 and a lower shell 32 , and the edge of the upper shell 31 is connected to the edge of the lower shell 32 to form a receiving chamber 300 .

[0092] It is understandable that the upper shell 31 and the lower shell 32 are conducive to the molding of the accommodating cavity 300. At the same time, during assembly, the heat dissipation component 2 and the circuit board 1 can be arranged by connecting the edges of the two, which is conducive to the protection of the shell 3 for both.

[0093] In the embodiment of the present application, the upper shell 31 and the lower shell 32 can be formed into a accommodating cavity 300 by forming a concave cavity, and the concave cavities of the two are opposite and connected.

[0094] In the embodiment of the present application, the upper shell 31 and the lower shell 32 can be connected by bolts.

[0095] In some of the embodiments of this application, Figure 1 and Figure 2 As shown, the upper shell 31 has a first flange 311 , and the lower shell 32 has a second flange 321 , and the first flange 311 and the second flange 321 are closely connected.

[0096] It is understandable that the first flange 311 and the second flange 321 are conducive to increasing the contact area between the upper shell 31 and the lower shell 32, so that the upper shell 31 and the lower shell 32 can be connected and the sealing of the accommodating cavity 300 can be improved.

[0097] In the embodiment of the present application, first flanges 311 are arranged on opposite sides of the upper shell 31, and second flanges 321 are arranged on opposite sides of the upper shell 31. The upper shell 31 and the lower shell 32 can be connected by connecting the first flange 311 and the second flange 321. The first flange 311 and the second flange 321 can be connected by bolts.

[0098] In the embodiment of the present application, the first shell can be arranged with two first clamping portions 312, and the two first clamping portions 312 are adjacent to the two first flanges 311; the second shell can be arranged with two second clamping portions 322, and the two second clamping portions 322 are adjacent to the two second flanges 321. The two first clamping portions 312 and the two second clamping portions 322 are clamped one by one, so that the connection performance between the upper shell 31 and the lower shell 32 can be improved.

[0099] A second aspect of the present application provides a battery, the battery comprising a battery management system as described in the above embodiment.

[0100] It can be understood that, due to the adoption of the battery management system of the above embodiment, the battery of the present application has the same technical effects as the above embodiment, which will not be repeated here.

[0101] In the embodiment of the present application, the balancing resistor of the battery management system can be connected one by one to multiple cells of the battery, and can consume the power of the cells to reduce the voltage difference between different cells.

[0102] A third aspect of the present application provides a car, which includes a battery according to the above technical solution.

[0103] It can be understood that, due to the use of the battery of the above embodiment, the automobile of the present application has the same technical effects as the above embodiment, which will not be described in detail here.

[0104] In the embodiment of the present application, the automobile may be an automobile using an engine as a power source, or an automobile using an electric motor as a power source.

[0105] In the present application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. The term "plurality" refers to two or more than two, unless otherwise clearly defined.

[0106] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the present application disclosed herein. The present application is intended to cover any variations, uses or adaptations of the present application, which follow the general principles of the present application and include common knowledge or customary techniques in the art that are not disclosed in the present application. The specification and examples are intended to be exemplary only.

[0107] It should be understood that the present application is not limited to the precise structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.

Claims

1. A battery management system, characterized in that: The battery management system comprises a circuit board (1), a heat dissipation component (2) and a housing (3), wherein: The housing (3) has a receiving cavity (300); The circuit board (1) is located in the accommodating cavity (300); The heat dissipation component (2) is attached to the inner wall surface of the accommodating cavity (300), and the heat dissipation component (2) surrounds from one side of the circuit board (1) to the opposite side of the one side of the circuit board (1).

2. The battery management system according to claim 1, characterized in that: The heat dissipation component (2) comprises a first heat dissipation portion (21) and a second heat dissipation portion (22); the first heat dissipation portion (21) has a first cooling channel (210); the second heat dissipation portion (22) has a second cooling channel (220); two ends of the first cooling channel (210) are connected to two ends of the second cooling channel (220) in a one-to-one correspondence.

3. The battery management system according to claim 2, characterized in that: The circuit board (1) has a balancing resistor (11), and the balancing resistor (11) is arranged on two sides of the circuit board (1), wherein: The first cooling channel (210) has a first expansion section (2101), and the balancing resistor (11) is located within the orthographic projection of the first expansion section (2101) on the circuit board (1). and / or, The second cooling channel (220) has a second expansion section (2201), and the equalizing resistor (11) is located within the orthographic projection of the second expansion section (2201) on the circuit board (1).

4. The battery management system according to claim 3, characterized in that: The battery management system further comprises a first heat conducting portion (4), wherein the first heat conducting portion (4) is located between the circuit board (1) and the first expansion section (2101). and / or, The battery management system further comprises a second heat conducting portion (5), wherein the second heat conducting portion (5) is located between the circuit board (1) and the second expansion section (2201).

5. The battery management system according to claim 2, characterized in that: The heat dissipation component (2) comprises a conducting portion, and an end of the first cooling channel (210) and an end of the second cooling channel (220) are connected through the conducting portion.

6. The battery management system according to claim 5, characterized in that: The circuit board (1) has a positioning hole (100), the positioning hole (100) penetrates from one side of the circuit board (1) to the opposite side, and the conducting portion is arranged in the positioning hole (100).

7. The battery management system according to claim 1, characterized in that: The housing (3) comprises an upper shell (31) and a lower shell (32), and the edge of the upper shell (31) is connected to the edge of the lower shell (32) to form the accommodating cavity (300).

8. The battery management system according to claim 7, characterized in that: The upper shell (31) has a first flange (311), and the lower shell (32) has a second flange (321), and the first flange (311) and the second flange (321) are closely connected.

9. A battery, characterized in that: The battery comprises a battery management system as claimed in any one of claims 1 to 8.

10. An automobile, characterized in that: The vehicle comprises the battery of claim 9.

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