A large-area flexible perovskite photoelectric component and a preparation method and a packaging method thereof

Abstract

This invention belongs to the field of photovoltaic technology, and relates to a large-area flexible perovskite photovoltaic module and its preparation and packaging methods. The large-area flexible perovskite photovoltaic module is seamlessly spliced ​​together from several small-area flexible perovskite cell modules in series and / or parallel; wherein, the effective area of ​​the small-area flexible perovskite cell module is ≤50cm². 2 The effective area of ​​the large-area flexible perovskite photovoltaic module can be of any size; the photoelectric conversion efficiency of both the small-area flexible perovskite battery module and the large-area flexible perovskite photovoltaic module is above 20%. This invention successfully overcomes the bottlenecks of low photoelectric conversion efficiency and size limitations in the fabrication of large-area flexible perovskite photovoltaic cells by existing technologies, which is conducive to large-scale promotion and application.

Description

Technical Field

[0001] This invention belongs to the field of photovoltaic technology, and relates to a perovskite optoelectronic module, and more particularly to a large-area flexible perovskite optoelectronic module and its preparation and packaging methods. Background Technology

[0002] Currently, perovskite optoelectronic modules demonstrate enormous commercial potential due to their superior theoretical efficiency, simple fabrication process, and broad application prospects. However, in practical applications, they face challenges such as stability and a decline in photoelectric conversion efficiency after large-scale fabrication, becoming key obstacles hindering their widespread commercialization.

[0003] Generally speaking, the factors affecting the stability of perovskite optoelectronic modules can be categorized into two aspects: internal and external. Internal factors mainly stem from structural instability caused by traditional manufacturing processes, which can usually be addressed through process optimization and improvement. External factors primarily arise from water and oxygen corrosion, and effective encapsulation technology becomes a key means to meet this challenge.

[0004] Furthermore, the core reason for the limited efficiency of large-area flexible perovskite photovoltaic modules lies in the fact that existing processes and equipment cannot guarantee the uniformity of the active layer (including hole transport layer, perovskite layer, electron transport layer, electrode layer and other functional layers) during the fabrication process. This technical bottleneck is unlikely to achieve a breakthrough in the foreseeable short term, which is also the fundamental reason why the efficiency of large-area perovskite photovoltaic cells is generally lower than that of small-area cells.

[0005] Therefore, how to provide a preparation and packaging method suitable for large-area flexible perovskite optoelectronic components, improve the structural stability and photoelectric conversion efficiency of large-area flexible perovskite optoelectronic components, and improve the water and oxygen barrier effect has become an urgent problem to be solved by those skilled in the art. Summary of the Invention

[0006] To address the shortcomings of existing technologies, the present invention aims to provide a large-area flexible perovskite photovoltaic module and its preparation and packaging methods, successfully overcoming the bottlenecks of low photoelectric conversion efficiency and size limitations in the preparation of large-area flexible perovskite photovoltaic cells by existing technologies.

[0007] To achieve this objective, the present invention adopts the following technical solution:

[0008] In a first aspect, the present invention provides a large-area flexible perovskite optoelectronic module, which is formed by seamlessly splicing together several small-area flexible perovskite battery modules in series and / or parallel.

[0009] The effective area of ​​the small-area flexible perovskite battery module is ≤50cm². 2The effective area of ​​the large-area flexible perovskite optoelectronic component can be any size.

[0010] The photoelectric conversion efficiency of both the small-area flexible perovskite battery module and the large-area flexible perovskite optoelectronic module is above 20%.

[0011] To address the issues of low photoelectric conversion efficiency and size limitations in existing technologies for fabricating large-area flexible perovskite photovoltaic cells, this invention employs high-efficiency, small-area flexible perovskite cell modules. These modules are seamlessly spliced ​​together in series and parallel to create an equivalent large-area flexible perovskite photovoltaic module. The seamless splicing process does not damage the internal structure of the original small-area cell module, thus maintaining the cell's high efficiency. The series and parallel splicing meets the requirements of different voltages and currents, enabling the construction of large-area photovoltaic modules of any size. Ultimately, this significantly improves the structural stability and photoelectric conversion efficiency of large-area flexible perovskite photovoltaic modules, facilitating large-scale application.

[0012] Preferably, the interior of the small-area flexible perovskite battery module includes parallel etching lines P1, P2 and P3, and the etching lines P1, P2 and P3 form a series-connected sub-cell combination inside the battery module.

[0013] In a second aspect, the present invention provides a method for fabricating a large-area flexible perovskite optoelectronic component as described in the first aspect, the method comprising the following steps:

[0014] (1) Prepare several small-area flexible perovskite battery modules;

[0015] (2) The small-area flexible perovskite battery modules obtained in step (1) are seamlessly spliced ​​together in series and / or parallel to obtain a large-area flexible perovskite optoelectronic component.

[0016] Preferably, the fabrication process of the small-area flexible perovskite battery module in step (1) is accompanied by sequential P1 etching, P2 etching and P3 etching to form parallel P1 etching lines, P2 etching lines and P3 etching lines.

[0017] Preferably, the P1 etching, P2 etching, and P3 etching each include laser etching.

[0018] Preferably, the small-area flexible perovskite battery module described in step (2) is cut before seamless splicing.

[0019] Preferably, the cutting process is performed in a direction parallel to the etching lines.

[0020] Optionally, the cutting path coincides with the P1 etching line.

[0021] Optionally, the cutting path is located between the P1 etching line and the P2 etching line.

[0022] Preferably, the seamless splicing in step (2) includes: using highly conductive tape to connect the back electrodes of the battery module with P1 etching lines to the battery module with P2 and P3 etching lines to form a series and / or parallel structure to achieve seamless splicing.

[0023] Preferably, the highly conductive tape includes bidirectional conductive copper foil tape or aluminum foil tape.

[0024] Thirdly, the present invention provides a method for packaging a large-area flexible perovskite optoelectronic component as described in the first aspect, the packaging method comprising the following steps:

[0025] (a) A continuous lamination encapsulation method is used to sequentially deposit an adhesive film and a water-oxygen barrier film on both sides of a large-area flexible perovskite optoelectronic component, with the adhesive film located between the optoelectronic component and the water-oxygen barrier film.

[0026] (b) The edges of the optoelectronic component are sealed with edge sealant between the water and oxygen barrier films on both sides of the optoelectronic component to obtain a large-area flexible perovskite optoelectronic component with an encapsulation structure.

[0027] This invention employs continuous lamination encapsulation technology to encapsulate large-area flexible perovskite optoelectronic components, effectively solving the problem of the size of encapsulated components being limited by lamination equipment, and ensuring the water and oxygen barrier properties and structural stability of large-area optoelectronic components in practical applications.

[0028] Preferably, the continuous lamination encapsulation method in step (a) is performed in a vacuum lamination apparatus, and the effective lamination area width of the vacuum lamination apparatus is greater than or equal to the effective power generation area width of the large-area flexible perovskite optoelectronic module.

[0029] Preferably, an inorganic barrier layer is further provided on the surface of the water-oxygen barrier membrane described in step (a).

[0030] Compared with the prior art, the present invention has the following beneficial effects:

[0031] (1) This invention uses a high-efficiency small-area flexible perovskite battery module, which is seamlessly spliced ​​in series and parallel to form an equivalent large-area flexible perovskite optoelectronic component. The seamless splicing process does not damage the internal structure of the original small-area battery module, so the high efficiency of the battery can be maintained. The series and parallel splicing meets the requirements of different voltages and currents, and can construct large-area optoelectronic components of any size. In the end, it significantly improves the structural stability and photoelectric conversion efficiency of the large-area flexible perovskite optoelectronic component, which is conducive to large-scale promotion and application.

[0032] (2) The present invention uses continuous lamination encapsulation technology to encapsulate large-area flexible perovskite optoelectronic components, which effectively solves the problem that the size of the encapsulated components is limited by the lamination equipment, and ensures the water and oxygen barrier properties and structural stability of large-area optoelectronic components in practical applications. Attached Figure Description

[0033] Figure 1 This is a schematic diagram of the series splicing and parallel splicing structure of the large-area flexible perovskite optoelectronic component provided by the present invention.

[0034] Figure 2 This is a schematic diagram of the small-area flexible perovskite battery module structure provided by the present invention;

[0035] Figure 3 This is a schematic diagram of a traditional small battery cell structure;

[0036] Figure 4 This is a flowchart of the fabrication process of the small-area flexible perovskite battery module provided by the present invention;

[0037] Figure 5 This is a schematic diagram of the dead zone and cut-off area in the small-area flexible perovskite battery module provided by the present invention;

[0038] Figure 6 This is a schematic diagram of seamless splicing of two adjacent small-area flexible perovskite battery modules;

[0039] Figure 7 This is a schematic diagram of the structure of the large-area flexible perovskite optoelectronic component provided in Example 1.

[0040] Wherein: 1-transparent substrate; 2-conductive layer; 3-hole transport layer; 4-perovskite layer; 5-electron transport layer; 6-metal electrode; 7-electrode line; 8-highly conductive tape; 10-P1 etching line; 20-P2 etching line; 30-P3 etching line. Detailed Implementation

[0041] The technical solution of the present invention will be further illustrated below through specific embodiments. Those skilled in the art should understand that the embodiments described are merely illustrative of the present invention and should not be construed as limiting the invention in any way.

[0042] One embodiment of this invention provides a large-area flexible perovskite optoelectronic component, such as... Figure 1 As shown, the large-area flexible perovskite optoelectronic module is seamlessly spliced ​​together from several small-area flexible perovskite cell modules in series and / or parallel.

[0043] The effective area of ​​the small-area flexible perovskite battery module is ≤50cm². 2 For example, it could be 5cm 2 10cm2 15cm 2 20cm 2 25cm 2 30cm 2 35cm 2 40cm 2 45cm 2 Or 50cm 2 The effective area of ​​the large-area flexible perovskite optoelectronic component can be of any size.

[0044] The photoelectric conversion efficiency of the small-area flexible perovskite battery module and the large-area flexible perovskite optoelectronic component is above 20%, for example, it can be 20%, 21%, 22%, 23%, 24% or 25%, but it is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0045] To address the issues of low photoelectric conversion efficiency and size limitations in existing technologies for fabricating large-area flexible perovskite photovoltaic cells, this invention employs high-efficiency, small-area flexible perovskite cell modules. These modules are seamlessly spliced ​​together in series and parallel to create an equivalent large-area flexible perovskite photovoltaic module. The seamless splicing process does not damage the internal structure of the original small-area cell module, thus maintaining the cell's high efficiency. The series and parallel splicing meets the requirements of different voltages and currents, enabling the construction of large-area photovoltaic modules of any size. Ultimately, this significantly improves the structural stability and photoelectric conversion efficiency of large-area flexible perovskite photovoltaic modules, facilitating large-scale application.

[0046] like Figure 2 As shown, the small-area flexible perovskite battery module contains parallel P1 etching lines 10, P2 etching lines 20 and P3 etching lines 30, and the P1 etching lines 10, P2 etching lines 20 and P3 etching lines 30 form a series-connected sub-cell combination inside the battery module.

[0047] In this invention, the small-area flexible perovskite solar cell module includes a transparent substrate 1, a conductive layer 2, a hole transport layer 3, a perovskite layer 4, an electron transport layer 5, and a metal electrode 6, all stacked together. The materials of each layer can be adjusted according to actual conditions. For example, the material of the conductive layer 2 can be ITO or FTO, as long as the function of each layer can be achieved, so no special limitation is made here.

[0048] The small-area flexible perovskite battery module used in this invention is structurally significantly different from traditional small battery cells. For example... Figure 3 As shown, the small battery cell does not contain the P1-P3 etched lines. The electrode lines 7 are connected to the conductive layer 2 and the metal electrode 6, respectively, and the effective area is usually less than 1 cm². 2If the aforementioned small battery cells are used to splice together large-area optoelectronic modules, problems such as long-distance carrier transmission efficiency loss, battery short-circuit failure caused by defects, and sharp decline in efficiency due to uneven coating are often encountered. Therefore, traditional small battery cells are not suitable for splicing together large-area optoelectronic modules.

[0049] Furthermore, mainstream large-area flexible perovskite solar cell modules typically use P1-P3 etching lines on the surface of the large-area module to divide it into several smaller sub-cells, which are then connected in series and parallel to form an integrated large-area series-parallel module. However, this technology cannot avoid the problem that the efficiency of the large-area module is much lower than that of the small-area module prepared using the same method, which is fundamentally different from the technical solution of this invention.

[0050] One embodiment of the present invention also provides a method for fabricating the large-area flexible perovskite optoelectronic component described in any of the above embodiments, the fabrication method comprising the following steps:

[0051] (1) Prepare several small-area flexible perovskite battery modules;

[0052] (2) The small-area flexible perovskite battery modules obtained in step (1) are seamlessly spliced ​​together in series and / or parallel to obtain a large-area flexible perovskite optoelectronic component.

[0053] In some embodiments, the fabrication process of the small-area flexible perovskite battery module in step (1) is accompanied by sequential P1 etching, P2 etching, and P3 etching, forming parallel P1 etching line 10, P2 etching line 20, and P3 etching line 30 (see Figure 4 ).

[0054] In some embodiments, the P1 etching, P2 etching, and P3 etching each comprise laser etching.

[0055] In some embodiments, the small-area flexible perovskite battery module described in step (2) is cut before seamless splicing.

[0056] In some embodiments, the cutting process is parallel to the etching lines, that is, parallel to the P1 etching line 10, the P2 etching line 20 and the P3 etching line 30, respectively.

[0057] In some embodiments, the cutting path coincides with the P1 etching line 10.

[0058] In some embodiments, the cutting process path is located between the P1 etching line 10 and the P2 etching line 20.

[0059] The seamless splicing defined in this invention is a significant improvement over the conventional P1-P3 etching process. In the conventional process, the dead zone (the region that cannot generate electricity but is crucial for constructing the series-parallel structure of sub-cells) is typically located between the P1 etching line 10 and the P3 etching line 30 (see...). Figure 5 ).

[0060] To achieve a seamless splicing effect, this invention utilizes the cutability of the flexible battery module, performing a cutting process along a direction parallel to the etching lines (see cutting area). Figure 5 (The dotted line portion in the diagram) This trimming process actually creates a new P1 etching line 10, and a new dead zone would originally form between the two P1 etching lines 10. To minimize the dead zone area, this invention trims along the P1 etching line 10 (i.e., the trimming path coincides with the P1 etching line 10), so that the two P1 etching lines 10 overlap, or trims between the P1 etching line 10 and the P2 etching line 20 (i.e., the trimming path is located between the P1 etching line 10 and the P2 etching line 20), thereby effectively avoiding the introduction of a new dead zone and minimizing the dead zone area.

[0061] In some embodiments, the seamless splicing in step (2) includes: using highly conductive adhesive tape 8 to connect the back electrodes of the battery module retaining the P1 etching line 10 to the battery module retaining the P2 etching line 20 and the P3 etching line 30, thereby constructing a series and / or parallel structure to achieve seamless splicing (see...). Figure 6 ).

[0062] In some embodiments, the highly conductive tape 8 includes a bidirectional conductive copper foil tape or aluminum foil tape.

[0063] To address the issues of increased resistance, difficulty in controlling contact resistance, and increased dead zone area after series-parallel splicing, this invention uses highly conductive adhesive tape 8 to connect the back electrodes of the battery module. Its resistivity is far lower than that of ITO and FTO, almost negligible, thus effectively reducing the adverse effects of resistance. Simultaneously, in conjunction with laser etching technology, by precisely controlling the etching process (such as reducing the laser etching width), the dead zone area is significantly reduced, further improving battery performance.

[0064] One embodiment of the present invention also provides a packaging method for the large-area flexible perovskite optoelectronic component described in any of the above embodiments, the packaging method comprising the following steps:

[0065] (a) A continuous lamination encapsulation method is used to sequentially deposit an adhesive film and a water-oxygen barrier film on both sides of a large-area flexible perovskite optoelectronic component, with the adhesive film located between the optoelectronic component and the water-oxygen barrier film.

[0066] (b) The edges of the optoelectronic component are sealed with edge sealant between the water and oxygen barrier films on both sides of the optoelectronic component to obtain a large-area flexible perovskite optoelectronic component with an encapsulation structure.

[0067] Given the high sensitivity of perovskite optoelectronic modules to water and oxygen, effective encapsulation is crucial to realizing their application value. This invention uses a series-parallel connection method to create large-area flexible perovskite optoelectronic modules with arbitrary effective areas. However, for modules several meters or even hundreds of meters in length, this size far exceeds the processing capacity of existing lamination equipment. Therefore, this invention employs a continuous lamination encapsulation method, successfully achieving the encapsulation of ultra-long flexible optoelectronic modules.

[0068] In short, this invention uses continuous lamination encapsulation technology to encapsulate large-area flexible perovskite optoelectronic components, effectively solving the problem of the size of the encapsulated components being limited by the lamination equipment, and ensuring the water and oxygen barrier properties and structural stability of large-area optoelectronic components in practical applications.

[0069] In some embodiments, the continuous lamination encapsulation method in step (a) is performed in a vacuum lamination apparatus, and the effective lamination area width of the vacuum lamination apparatus is greater than or equal to the effective power generation area width of the large-area flexible perovskite optoelectronic module.

[0070] In some embodiments, the surface of the water-oxygen barrier membrane in step (a) is further provided with an inorganic barrier layer, and the inorganic barrier layer is provided by physical deposition and / or chemical deposition.

[0071] The inorganic barrier layer can be made of aluminum oxide, silicon oxide, aluminum nitride, or silicon nitride, as long as it can achieve the effect of water and oxygen barrier. No specific material is specified here.

[0072] In this invention, the physical deposition and chemical deposition are conventional film deposition methods used in the field. As long as the inorganic barrier layer can be successfully deposited, no specific limitations are made on the deposition conditions and process parameters.

[0073] Example 1

[0074] This embodiment provides a large-area flexible perovskite optoelectronic component and its fabrication method, the fabrication method comprising the following steps:

[0075] (1) Prepare 20 small-area flexible perovskite battery modules. The effective power generation area of ​​each small-area battery module is 7cm×7cm, that is, the effective area is 49cm². 2The internal structure contains parallel P1-P3 etching lines, which form interconnected sub-cell combinations within the battery module, creating a pin-structured battery with a photoelectric conversion efficiency of nearly 20%. The specific fabrication method is as follows: First, laser etching P1 is performed on the surface of a flexible conductive substrate. Then, hole transport layer Meo-4PACZ, perovskite layer, passivation layer F-PEAI, and electron transport layer C60 and BCP are deposited sequentially. After that, laser etching P2 is performed. Finally, copper electrodes are deposited and laser etching P3 is performed to obtain a small-area battery module.

[0076] (2) Under the premise of ensuring that the P1-P3 splicing order of all battery modules is consistent, cut along the P1 etching line of the edge sub-battery, and connect the backlight electrode of the battery containing only the P1 edge and the battery containing the P2 and P3 edges in series with each other using copper foil tape, and form a group of two batteries in series. Then connect the positive and negative terminals of the series battery group in parallel to form a splicing module with an effective power generation area of ​​14cm×70cm (see Figure 7 ).

[0077] This embodiment also performs encapsulation processing on the splicing module obtained above, specifically including the following steps:

[0078] (a) A vacuum lamination device with an effective lamination area of ​​40cm×40cm is used to continuously laminate and encapsulate the splicing module. The encapsulation structure from the light-facing side to the back-facing side consists of a high-transmittance water and oxygen barrier film, an adhesive film, the splicing module, another layer of adhesive film, and a water and oxygen barrier film.

[0079] (b) Between the water and oxygen barrier films on both sides of the splicing module, the edges of the splicing module are sealed with edge sealant to ensure the water and oxygen barrier effect, thus obtaining a large-area flexible perovskite optoelectronic component with an encapsulation structure.

[0080] In this embodiment, the water and oxygen barrier film, the adhesive film, and the edge sealant have no significant impact on the photoelectric conversion efficiency of the optoelectronic module. Therefore, the specific materials and models of each film layer are not described in detail here.

[0081] Performance testing:

[0082] Reference standards: IEC 61215 and IEC 60904

[0083] Test method: Using an IV tester and an electrical test system, the current density and voltage value are recorded by scanning voltage (forward and reverse), the IV curve is plotted, and the open circuit voltage (Voc), short circuit current density (Jsc), fill factor (FF), and photoelectric conversion efficiency (PCE) are calculated.

[0084] Test conditions: Light intensity 1000W / m 2(AM1.5G spectrum), temperature 25±5℃, humidity 20±10%.

[0085] Equipment calibration: The solar simulator is calibrated using a standard light source and photodetector to ensure spectral matching and illumination uniformity.

[0086] Tests showed that the photoelectric conversion efficiency of the large-area flexible perovskite optoelectronic module obtained in this embodiment remained stable at around 20%, which is similar to the photoelectric conversion efficiency of the original small-area battery module.

[0087] Therefore, this invention uses high-efficiency, small-area flexible perovskite battery modules and seamlessly splices them together in series and parallel to form an equivalent large-area flexible perovskite optoelectronic module. The seamless splicing process does not damage the internal structure of the original small-area battery module, thus maintaining the high efficiency of the battery. The series and parallel splicing meets the requirements of different voltages and currents, and can construct large-area optoelectronic modules of any size. Ultimately, it significantly improves the structural stability and photoelectric conversion efficiency of the large-area flexible perovskite optoelectronic module, which is conducive to large-scale promotion and application.

[0088] Furthermore, this invention employs continuous lamination encapsulation technology to encapsulate large-area flexible perovskite optoelectronic components, effectively solving the problem of the size of the encapsulated components being limited by the lamination equipment, and ensuring the water and oxygen barrier properties and structural stability of large-area optoelectronic components in practical applications.

[0089] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Those skilled in the art should understand that any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention fall within the scope of protection and disclosure of the present invention.

Claims

1. A large-area flexible perovskite optoelectronic module, characterized in that, The large-area flexible perovskite optoelectronic module is formed by seamlessly splicing together several small-area flexible perovskite cell modules in series and / or parallel. The effective area of ​​the small-area flexible perovskite battery module is ≤50cm². 2 The effective area of ​​the large-area flexible perovskite optoelectronic component can be of any size. The photoelectric conversion efficiency of both the small-area flexible perovskite battery module and the large-area flexible perovskite optoelectronic module is above 20%. The small-area flexible perovskite battery module contains parallel P1 etching lines, P2 etching lines, and P3 etching lines, which together form a series of sub-cell combinations within the battery module.

2. A method for fabricating a large-area flexible perovskite optoelectronic component as described in claim 1, characterized in that, The preparation method includes the following steps: (1) Prepare several small-area flexible perovskite battery modules; (2) The small-area flexible perovskite battery modules obtained in step (1) are seamlessly spliced ​​together in series and / or parallel to obtain a large-area flexible perovskite optoelectronic component.

3. The preparation method according to claim 2, characterized in that, In step (1), the fabrication process of the small-area flexible perovskite battery module is accompanied by sequential P1 etching, P2 etching and P3 etching, forming parallel P1 etching lines, P2 etching lines and P3 etching lines. The P1 etching, P2 etching, and P3 etching respectively include laser etching.

4. The preparation method according to claim 3, characterized in that, The small-area flexible perovskite battery module described in step (2) is cut before seamless splicing; The cutting process is performed in a direction parallel to the etching lines.

5. The preparation method according to claim 4, characterized in that, The cutting path coincides with the P1 etching line; Alternatively, the cutting path may be located between the P1 etching line and the P2 etching line.

6. The preparation method according to claim 5, characterized in that, The seamless splicing in step (2) includes: using highly conductive tape to connect the back electrodes of the battery module with P1 etching lines to the battery module with P2 and P3 etching lines to form a series and / or parallel structure to achieve seamless splicing; The highly conductive tape includes bidirectional conductive copper foil tape or aluminum foil tape.

7. A packaging method for a large-area flexible perovskite optoelectronic component as described in claim 1, characterized in that, The packaging method includes the following steps: (a) A continuous lamination encapsulation method is used to sequentially deposit an adhesive film and a water-oxygen barrier film on both sides of a large-area flexible perovskite optoelectronic component, wherein the adhesive film is located between the optoelectronic component and the water-oxygen barrier film. (b) The edges of the optoelectronic component are sealed with edge sealant between the water and oxygen barrier films on both sides of the optoelectronic component to obtain a large-area flexible perovskite optoelectronic component with encapsulation structure.

8. The packaging method according to claim 7, characterized in that, The continuous lamination encapsulation method in step (a) is performed in a vacuum lamination apparatus, and the effective lamination area width of the vacuum lamination apparatus is greater than or equal to the effective power generation area width of the large-area flexible perovskite optoelectronic module.

9. The packaging method according to claim 7 or 8, characterized in that, An inorganic barrier layer is also provided on the surface of the water-oxygen barrier membrane described in step (a).

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