Display panel and display device

Abstract

The invention relates to a display panel and a display device, the display panel comprises a substrate, the substrate comprises a first substrate and a plurality of first connecting terminals, the first substrate comprises a first surface and a second surface which are oppositely arranged and a plurality of open holes penetrating through the first substrate, and the first connecting terminals are located on the side, away from the second surface, of the first surface; the opening exposes the first connecting terminal on the second surface; the circuit board is located on the side, away from the first surface, of the second surface, the circuit board comprises a plurality of second connecting terminals, and the second connecting terminals are electrically connected with the first connecting terminals. According to the invention, the extremely narrow frame or frameless design of the display panel can be realized.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] With the continuous development of display technology, organic light-emitting diode (OLED) display devices have been widely used in many fields such as flat panel displays, flexible displays, automotive displays and solid-state lighting due to their advantages such as wide color gamut, high contrast, energy saving and foldability.

[0003] With the development of display technology, how to achieve an extremely narrow bezel or bezel-free design of a display panel is an urgent problem to be solved. Summary of the invention

[0004] Based on this, it is necessary to provide a display panel and a display device, aiming to solve the problem of how to achieve an extremely narrow frame or a frameless design of a display panel.

[0005] In a first aspect, an embodiment of the present application provides a display panel, including:

[0006] A substrate, comprising a first base and a plurality of first connection terminals, wherein the first base comprises a first surface and a second surface disposed opposite to each other, and a plurality of openings penetrating the first base, wherein the first connection terminals are located on a side of the first surface away from the second surface, and the openings expose the first connection terminals on the second surface;

[0007] The circuit board is located on a side of the second surface away from the first surface, and the circuit board includes a plurality of second connection terminals, and the second connection terminals are electrically connected to the first connection terminals.

[0008] In some embodiments, it further comprises:

[0009] A protection component, disposed on a side of the circuit board away from the first surface;

[0010] The heat dissipation structure layer is located on a side of the first substrate close to the circuit board, the protection component is fixedly connected to a side surface of the circuit board away from the first surface, and a side surface of the heat dissipation structure layer away from the first surface; and / or,

[0011] The protection component is fixedly connected to a side surface of the circuit board away from the first surface and the second surface of the first substrate.

[0012] In some embodiments, an orthographic projection of the protection component on the first substrate covers the opening.

[0013] In some embodiments, the material of the protection component includes a glue layer.

[0014] In some embodiments, in a direction perpendicular to the plane where the first substrate is located, the depth of the opening is less than the height of the second connecting terminal on the surface of the circuit board; and / or,

[0015] In a direction parallel to the plane where the first substrate is located, a size of the opening is greater than or equal to a size of the second connecting terminal.

[0016] In some embodiments, the second connection terminal is in contact with the first connection terminal.

[0017] In some embodiments, it further comprises:

[0018] The conductive fixing layer is connected between the first connecting terminal and the second connecting terminal.

[0019] In some embodiments, the material of the conductive fixing layer includes at least one of conductive hydrogel and silver colloid.

[0020] In some embodiments, the first connection terminal has a protrusion on a surface close to the second connection terminal, and the second connection terminal has a recess on a surface close to the first connection terminal, and the protrusion matches the recess; and / or,

[0021] The first connection terminal has a recess on its surface close to the second connection terminal, and the second connection terminal has a protrusion on its surface close to the first connection terminal, and the protrusion matches the recess.

[0022] In a second aspect, based on the same inventive concept, an embodiment of the present application further provides a display device, which includes the display panel provided in the first aspect.

[0023] In an embodiment of the present application, the first substrate includes a plurality of openings penetrating the first substrate, the first connection terminal is located on a side of the first surface away from the second surface, the opening exposes the first connection terminal on the second surface, the circuit board includes a plurality of second connection terminals, and the second connection terminals are electrically connected to the first connection terminals. In this way, one or more of the above problems can be improved. In an embodiment of the present application, different first connection terminals are exposed through different openings, and the second connection terminals are electrically connected to different first connection terminals through different openings, so that short circuits between different connection terminals can be avoided. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0025] Figure 1 A first schematic top view of the back side of a display panel provided in an embodiment of the present application.

[0026] Figure 2 A second schematic top view of the back side of a display panel provided in an embodiment of the present application.

[0027] Figure 3 A third schematic top view of the back side of a display panel provided in an embodiment of the present application.

[0028] Figure 4 A schematic cross-sectional view of a display panel body of a display panel provided in an embodiment of the present application.

[0029] Figure 5 A schematic cross-sectional view of a circuit board of a display panel provided in an embodiment of the present application.

[0030] Figure 6 A first cross-sectional schematic diagram of a display panel provided in an embodiment of the present application.

[0031] Figure 7 A second cross-sectional schematic diagram of a display panel provided in an embodiment of the present application.

[0032] Figure 8 A third cross-sectional schematic diagram of a display panel provided in an embodiment of the present application.

[0033] Fig. 9 A fourth cross-sectional schematic diagram of a display panel provided in an embodiment of the present application.

[0034] Fig.10 A fifth cross-sectional schematic diagram of a display panel provided in an embodiment of the present application.

[0035] Fig.11 A schematic diagram of a display device provided in an embodiment of the present application.

[0036] Reference numerals:

[0037] Display device 200; display panel 100; substrate 10; circuit board 20; first substrate 11; first connection terminal 10d; first surface 111; second surface 112; opening 11k; second connection terminal 20d; array composite layer 12; light emitting layer 13; packaging layer 14; touch layer 15; protection component 30; heat dissipation structure layer 50; circuit board body 21;

[0038] first height h1; second height h2; first length d1; second length d2; conductive fixed layer 40; first protrusion 10d1; first recess 20d2; second recess 10d2; second protrusion 20d1. DETAILED DESCRIPTION

[0039] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are provided in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive.

[0040] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0041] When describing positional relationships, unless otherwise specified, when an element such as a layer, film, or substrate is referred to as being "on" another element, it can be directly on the other element or there may be intervening elements. Further, when a layer is referred to as being "under" another layer, it can be directly under or there may be one or more intervening elements. It is also understood that when a layer is referred to as being "between" two layers, it can be the only layer between the two layers or there may be one or more intervening elements.

[0042] In the case of using “including”, “having”, and “comprising” described herein, another component may be added unless a clear limiting term such as “only”, “consisting of”, etc. is used. Unless mentioned otherwise, a term in the singular form may include a plural form and should not be understood as being one in number.

[0043] It should be understood that although the terms "first", "second", etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. For example, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element without departing from the scope of the present application.

[0044] It should also be understood that when interpreting an element, even if not explicitly described, the element is interpreted as including a range of error, which should be within the acceptable deviation range of the specific value determined by those skilled in the art. For example, "approximately", "approximately" or "substantially" can mean within one or more standard deviations, which are not limited here.

[0045] Furthermore, in the specification, the phrase “planar distribution schematic diagram” refers to a drawing when a target portion is viewed from above, and the phrase “cross-sectional schematic diagram” refers to a drawing when a section taken by vertically cutting the target portion is viewed from the side.

[0046] In addition, the drawings are not drawn to a 1:1 scale, and the relative sizes of the elements in the drawings are drawn only as examples and not necessarily according to the true scale.

[0047] It is obvious to those skilled in the art that various modifications and changes can be made in this application without departing from the spirit or scope of this application. Therefore, this application is intended to cover modifications and changes of this application that fall within the scope of the corresponding claims (technical solutions claimed for protection) and their equivalents. It should be noted that the implementation methods provided in the embodiments of this application can be combined with each other without contradiction.

[0048] As described in the background technology section, with the development of display technology, how to achieve an extremely narrow bezel or a bezel-less design for a display panel is an urgent problem to be solved. For example, an OLED display panel can reduce the width of the bottom bezel of the display by means of pad bending, but it is impossible to further significantly reduce the bezel or achieve a bezel-less design.

[0049] Based on the above technical problems, the inventors have found that a large opening (a whole row of slots) can be opened on the substrate, and the large opening exposes multiple first connection terminals on one side of the substrate, and then the circuit board is bound to the multiple first connection terminals through the reverse binding technology. At this time, NCF glue (non-conductive film) is used to press the circuit board to the other side of the substrate, and then the multiple first connection terminals are connected to the multiple second connection terminals on the circuit board through silver glue. In this way, the frame can be further reduced or a frameless design can be achieved. However, the inventors found that the activation temperature of NCF glue is too high and the activation pressure is too high, which will cause the display panel to fail. The panel has a whole row of slots (large openings expose multiple first connection terminals) and silver glue is applied. There is a high risk of silver glue overflow, and short circuits are prone to occur between different connection terminals. Therefore, the inventors further found that the first substrate includes multiple openings that penetrate the first substrate, the first connection terminal is located on the side of the first surface away from the second surface, the opening exposes the first connection terminal on the second surface, the circuit board includes multiple second connection terminals, and the second connection terminals are electrically connected to the first connection terminals. In this way, one or more of the above problems can be improved. On the one hand, different first connection terminals are exposed through different openings, and the second connection terminals are electrically connected to different first connection terminals through different openings, so that short circuits between different connection terminals can be avoided. On the other hand, the second connection terminals are physically aligned with the first connection terminals, and when different first connection terminals are electrically connected to corresponding second connection terminals, the positions are limited by multiple openings, and it is not easy to be misaligned to cause short circuits, thereby improving the accuracy and precision of the electrical connection between the first connection terminals and the corresponding second connection terminals.

[0050] See also Figures 1 to 10 . Figure 1 A first schematic top view of the back side of a display panel provided in an embodiment of the present application. Figure 2 A second schematic top view of the back side of a display panel provided in an embodiment of the present application. Figure 3 A third schematic top view of the back side of a display panel provided in an embodiment of the present application.

[0051] Figure 4 A schematic cross-sectional view of a display panel body of a display panel provided in an embodiment of the present application. Figure 5 A schematic cross-sectional view of a circuit board of a display panel provided in an embodiment of the present application.

[0052] Figure 6 A first cross-sectional schematic diagram of a display panel provided in an embodiment of the present application. Figure 7 A second cross-sectional schematic diagram of a display panel provided in an embodiment of the present application. Figure 8 A third cross-sectional schematic diagram of a display panel provided in an embodiment of the present application. Fig. 9A fourth cross-sectional schematic diagram of a display panel provided in an embodiment of the present application. Fig.10 A fifth cross-sectional schematic diagram of a display panel provided in an embodiment of the present application.

[0053] Figure 1 It shows the top view before the back side is bound to the circuit board. Figure 2 and Figure 3 The schematic diagram shows the back side after binding the circuit board.

[0054] Figure 4 for Figure 1 Schematic diagram of the cross section along the dashed line C1-C1. Figure 6 for Figure 2 Schematic diagram of the cross section along the dashed line C1-C1. Figure 7 , Figure 8 , Fig. 9 and Fig.10 for Figure 3 Schematic diagram of the cross section along the dashed line C1-C1.

[0055] The present application provides a display panel 100, which includes a substrate 10 and a circuit board 20. The substrate 10 includes a first substrate 11 and a plurality of first connection terminals 10d, the first substrate 11 includes a first surface 111 and a second surface 112 disposed opposite to each other, and a plurality of openings 11k penetrating the first substrate 11, the first connection terminals 10d are located on a side of the first surface 111 away from the second surface 112, and the openings 11k expose the first connection terminals 10d on the second surface 112. The circuit board 20 is located on a side of the second surface 112 away from the first surface 111, and the circuit board 20 includes a plurality of second connection terminals 20d, and the second connection terminals 20d are electrically connected to the first connection terminals 10d.

[0056] For example, the substrate 10 may be an array substrate, or the substrate 10 may be a display panel body. The structure of the substrate 10 may include a first substrate 11, an array composite layer 12 disposed on one side of the first substrate 11, a light emitting layer 13 disposed on a side of the array composite layer 12 away from the first substrate 11, and an encapsulation layer 14 disposed on a side of the light emitting layer 13 away from the first substrate 11. The substrate 10 may also include a touch layer 15 disposed on a side of the encapsulation layer 14 away from the first substrate 11, but the structure of the substrate 10 is not limited thereto. For example, the substrate 10 may not include the touch layer 15, and for example, the array composite layer 12 and the light emitting layer 13 in the substrate 10 may have other relative positional relationships.

[0057] For example, the array composite layer 12 may include a plurality of thin film transistors and a plurality of signal lines, and the plurality of thin film transistors and the plurality of signal lines and other structures constitute a plurality of driving circuits. The light emitting layer 13 may include a plurality of light emitting elements arranged in an array, and the light emitting elements may be light emitting devices of OLED, but are not limited thereto, for example, the light emitting elements may be micro light emitting diodes (Mirco LED), for example, the light emitting elements may be mini light emitting diodes (Min LED).

[0058] For example, the first connection terminal 10d may be electrically connected to a signal line. For example, the first connection terminal 10d may be a part of the signal line. For example, the first connection terminal 10d is electrically connected to the signal line and the width of the first connection terminal 10d is greater than the width of the signal line.

[0059] For example, the first substrate 11 may be a glass substrate or a flexible substrate, but is not limited thereto. When the first substrate 11 is a flexible substrate, it is easier to form a plurality of openings 11 k by a laser grooving process.

[0060] For example, a plurality of openings 11k penetrate the first substrate 11, the first connection terminal 10d is located on a side of the first surface 111 away from the second surface 112, and the openings 11k expose the first connection terminal 10d on the second surface 112. When there are other film layers between the first connection terminal 10d and the first substrate 11, for example, there is an insulating layer between the first connection terminal 10d and the first substrate 11, the openings 11k also penetrate the other film layers between the first connection terminal 10d and the first substrate 11, so that the openings 11k expose the first connection terminal 10d on the second surface 112.

[0061] For example, the circuit board 20 may be a flexible printed circuit (FPC), or a chip on film (COF), but is not limited thereto.

[0062] For example, the circuit board 20 may include a circuit board body 21 and a plurality of second connection terminals 20d. The circuit board body 21 may be a body of a highly reliable and excellently flexible printed circuit board made of polyimide or polyester film as a substrate, but is not limited thereto.

[0063] For example, the plurality of second connection terminals 20 d may be binding terminals or pins on the circuit board 20 .

[0064] For example, the second connection terminal 20d is electrically connected to the first connection terminal 10d. In some embodiments, the second connection terminal 20d is disposed opposite to the first connection terminal 10d, but is not limited thereto.

[0065] In the embodiment of the present application, the first substrate 11 includes a plurality of openings 11k that penetrate the first substrate 11, the first connection terminal 10d is located on the side of the first surface 111 away from the second surface 112, the opening 11k exposes the first connection terminal 10d on the second surface 112, and the circuit board 20 includes a plurality of second connection terminals 20d, and the second connection terminals 20d are electrically connected to the first connection terminals 10d. In this way, one or more of the above problems can be improved. On the one hand, different first connection terminals 10d are exposed through different openings 11k, and the second connection terminals 20d are electrically connected to different first connection terminals 10d through different openings 11k, which can avoid short circuits between different connection terminals. On the other hand, the physical alignment of the second connection terminals 20d and the first connection terminals 10d is achieved, and when different first connection terminals 10d are electrically connected to the corresponding second connection terminals 20d, the positions are limited by the plurality of openings 11k, which improves the accuracy and precision of the electrical connection between the first connection terminals 10d and the corresponding second connection terminals 20d. Thirdly, the conductive adhesive material that may be disposed between the first connection terminal 10d and the second connection terminal 20d is limited by the plurality of openings 11k, and the risk of adhesive overflowing to adjacent openings 11k is less likely to occur, thereby improving or avoiding the adhesive overflow problem.

[0066] In some embodiments, Figure 7 , Figure 8 and Fig.10 As shown, the display panel 100 further includes a protection component 30 , and the protection component 30 is fixedly connected to a side surface of the circuit board 20 away from the first surface 111 and the second surface 112 of the first substrate 11 .

[0067] For example, the protection component 30 can prevent the circuit board 20 from falling off, and can also prevent water vapor and the like from entering the first connection terminal 10d and the second connection terminal 20d.

[0068] For example, the material of the protection component 30 may be an adhesive layer, such as UV adhesive.

[0069] In other embodiments, Fig. 9 As shown, the display panel 100 also includes a protective component 30 and a heat dissipation structure layer 50. The heat dissipation structure layer 50 is located on a side of the first substrate 11 close to the circuit board 20. The protective component 30 is fixedly connected to a side surface of the circuit board 20 away from the first surface 111, and a side surface of the heat dissipation structure layer 50 away from the first surface 111.

[0070] For example, the protection component 30 can prevent the circuit board 20 and / or the heat dissipation structure layer 50 from falling off, and can also prevent water vapor and the like from entering the first connection terminal 10d and the second connection terminal 20d.

[0071] In some other embodiments, for example, a partial area of ​​the second surface 112 of the first substrate 11 is covered by the heat dissipation structure layer 50. In this case, the protective component 30 can be fixedly connected to the side surface of the circuit board 20 away from the first surface 111, and the second surface 112 of the first substrate 11. At the same time, the protective component 30 can also be fixedly connected to the side surface of the heat dissipation structure layer 50 away from the first surface 111.

[0072] For example, the heat dissipation structure layer 50 may be a single-layer or multi-layer structure. For example, the heat dissipation structure layer 50 may include copper foil. The heat dissipation structure layer 50 may include foam and copper foil.

[0073] In some embodiments, the orthographic projection of the protection component 30 on the first substrate 11 covers the opening 11 k .

[0074] For example, the orthographic projection of the protection component 30 on the first substrate 11 covers the opening 11k, which can better prevent the circuit board 20 from falling off, make the electrical connection between the first connection terminal 10d and the second connection terminal 20d more secure, and prevent the first connection terminal 10d and the second connection terminal 20d from loosening or falling off.

[0075] In some embodiments, the material of the protection component 30 includes a glue layer, and the protection component 30 can be formed by a glue dispensing process, which has the effect of simple process.

[0076] In some embodiments, Figure 4 and Figure 5 As shown, in a direction perpendicular to the plane where the first substrate 11 is located, the depth of the opening 11 k is smaller than the height of the second connecting terminal 20 d on the surface of the circuit board 20 .

[0077] For example, Figure 4 and Figure 5 As shown, in a direction perpendicular to the plane where the first substrate 11 is located, the depth of the opening 11k is a first height h1, and the height of the second connecting terminal 20d on the surface of the circuit board 20 is a second height h2, and the first height h1 is smaller than the second height h2.

[0078] For example, in some embodiments, the first height h1 is smaller than the second height h2, so that the first connection terminal 10d and the second connection terminal 20d can be directly contacted and connected, thereby reducing electrical connection impedance.

[0079] For example, in some embodiments, the first height h1 is smaller than the second height h2. The first height h1 is smaller than the second height h2, which can avoid a gap between the first connection terminal 10d and the second connection terminal 20d during the binding process and avoid poor contact.

[0080] In some embodiments, Figure 4 and Figure 5 As shown, in a direction parallel to the plane where the first substrate 11 is located, the size of the opening 11 k is greater than or equal to the size of the second connecting terminal 20 d .

[0081] For example, Figure 4 and Figure 5 As shown, in a direction parallel to the plane where the first substrate 11 is located, the size of the opening 11k is a first length d1, and the size of the second connecting terminal 20d is a second length d2. The first length d1 is greater than or equal to the second length d2, so that the second connecting terminal 20d can be at least partially accommodated in the opening 11k, reducing the distance between the first connecting terminal 10d and the second connecting terminal 20d (in some embodiments, when the first connecting terminal 10d and the second connecting terminal 20d are directly contacted and connected, the distance is 0), which can improve the yield of the electrical connection between the first connecting terminal 10d and the second connecting terminal 20d, reduce the electrical connection resistance, and at the same time, reduce the thickness of the display panel 100.

[0082] For example, in the display panel 100, in a direction parallel to the plane where the first substrate 11 is located, the first length d1 and the second length d2 are respectively the lengths of the opening 11k and the second connection terminal 20d in the same direction. For example, the first length d1 is the length of the opening 11k in the first direction of the second surface 112, and the second length d2 is the length of an end of the second connection terminal 20d close to the surface of the circuit board body 21 in the first direction. For example, the first direction may be parallel to the desktop or perpendicular to the desktop, but is not limited thereto.

[0083] For example, the first length d1 is greater than or equal to the second length d2, so that the second connection terminal 20d can be at least partially accommodated in the opening 11k, so that the second connection terminal 20d can be buckled and connected to the first connection terminal 10d exposed by the corresponding opening 11k.

[0084] For example, in some embodiments, in a direction parallel to the plane where the first substrate 11 is located, in the same direction, the first length d1 is the maximum length of the opening 11k, and the second length d2 is the maximum length of the corresponding second connecting terminal 20d, but is not limited thereto, as long as the second connecting terminal 20d can be accommodated in the opening 11k.

[0085] In some embodiments, Figure 6 and Figure 7 As shown, the second connection terminal 20d is in contact with the first connection terminal 10d.

[0086] For example, Figure 6 and Figure 7As shown, the second connection terminal 20d is directly contacted and connected with the first connection terminal 10d to realize electrical connection between the second connection terminal 20d and the first connection terminal 10d, which has the effects of small impedance, small thickness of display panel and simple process.

[0087] In some embodiments, Figure 8 As shown, the display panel 100 further includes a conductive fixing layer 40 , and the conductive fixing layer 40 is connected between the first connecting terminal 10 d and the second connecting terminal 20 d .

[0088] In some embodiments, Figure 8 As shown, the material of the conductive fixing layer 40 includes at least one of conductive hydrogel and silver paste.

[0089] For example, the conductive fixing layer 40 is located between the first connecting terminal 10d and the second connecting terminal 20d, which can improve the mechanical strength and stability of the electrical connection between the first connecting terminal 10d and the second connecting terminal 20d. The conductive fixing layer 40 also has the advantage of small thickness, which can reduce the thickness of the display panel 100. At the same time, the conductive fixing layer 40 is limited by a plurality of openings 11k, and the portion of the first substrate 11 between two adjacent openings 11k separates the conductive fixing layers 40 in different openings 11k, so that the conductive fixing layer 40 in one opening 11k is not easy to overflow to the adjacent opening 11k, thereby improving or avoiding the overflow problem.

[0090] In some embodiments, Fig.10 As shown, the first connection terminal 10d has a protrusion on its surface close to the second connection terminal 20d, and the second connection terminal 20d has a recess on its surface close to the first connection terminal 10d, and the protrusion matches the recess.

[0091] For example, Fig.10 As shown, the first connecting terminal 10d has a first protrusion 10d1 on its surface close to the second connecting terminal 20d, and the second connecting terminal 20d has a first recess 20d2 on its surface close to the first connecting terminal 10d. The first protrusion 10d1 cooperates with the first recess 20d2 to improve the mechanical strength and stability of the electrical connection between the first connecting terminal 10d and the second connecting terminal 20d.

[0092] In some embodiments, Fig.10 As shown, the first connection terminal 10d has a recess on its surface close to the second connection terminal 20d, and the second connection terminal 20d has a protrusion on its surface close to the first connection terminal 10d, and the protrusion matches the recess.

[0093] For example, Fig.10As shown, the first connecting terminal 10d has a second recess 10d2 on its surface close to the second connecting terminal 20d, and the second connecting terminal 20d has a second protrusion 20d1 on its surface close to the first connecting terminal 10d. The second protrusion 20d1 cooperates with the second recess 10d2 to improve the mechanical strength and stability of the electrical connection between the first connecting terminal 10d and the second connecting terminal 20d.

[0094] See also Fig.11 , Fig.11 A schematic diagram of a display device provided in an embodiment of the present application.

[0095] On the second aspect, based on the same application concept, the present application also provides a display device 200, the display device 200 includes any one of the display panels 100 described above, or the display device 200 includes a display panel 100 that combines any several of the features described above.

[0096] For example, the display device 200 also has the beneficial effects of the display panel 100 in the above embodiment. The similarities can be understood by referring to the above explanation of the display panel 100 and will not be described in detail below.

[0097] For example, the display device 200 provided in the embodiment of the present application can be Fig.11 The mobile phone shown can also be any electronic product with a display function, including but not limited to the following categories: televisions, laptops, desktop displays, tablet computers, digital cameras, smart bracelets, smart glasses, car displays, industrial control equipment, medical display screens, touch interactive terminals, etc. The embodiments of the present application do not specifically limit this.

[0098] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0099] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the attached claims.

Claims

1. A display panel, characterized in that: include: A substrate, comprising a first base and a plurality of first connection terminals, wherein the first base comprises a first surface and a second surface disposed opposite to each other, and a plurality of openings penetrating the first base, wherein the first connection terminals are located on a side of the first surface away from the second surface, and the openings expose the first connection terminals on the second surface; The circuit board is located on a side of the second surface away from the first surface, and the circuit board includes a plurality of second connection terminals, and the second connection terminals are electrically connected to the first connection terminals.

2. The display panel according to claim 1, characterized in that: Also includes: A protection component is arranged on a side of the circuit board away from the first surface; The heat dissipation structure layer is located on a side of the first substrate close to the circuit board, and the protection component is fixedly connected to a side surface of the circuit board away from the first surface and a side surface of the heat dissipation structure layer away from the first surface; and / or, The protection component is fixedly connected to a side surface of the circuit board away from the first surface and the second surface of the first substrate.

3. The display panel according to claim 2, characterized in that: The orthographic projection of the protection component on the first substrate covers the opening.

4. The display panel according to claim 2, characterized in that: The material of the protection component includes a glue layer.

5. The display panel according to claim 1, characterized in that: In a direction perpendicular to the plane where the first substrate is located, the depth of the opening is less than the height of the second connecting terminal on the surface of the circuit board; and / or, In a direction parallel to the plane where the first substrate is located, a size of the opening is greater than or equal to a size of the second connecting terminal.

6. The display panel according to claim 1, characterized in that: The second connection terminal is in contact with and connected to the first connection terminal.

7. The display panel according to claim 1, characterized in that: Also includes: The conductive fixing layer is connected between the first connecting terminal and the second connecting terminal.

8. The display panel according to claim 7, characterized in that: The material of the conductive fixing layer includes at least one of conductive hydrogel and silver paste.

9. The display panel according to claim 1, characterized in that: The first connection terminal has a protrusion on its surface close to the second connection terminal, and the second connection terminal has a recess on its surface close to the first connection terminal, and the protrusion matches the recess; and / or, The first connection terminal has a recess on its surface close to the second connection terminal, and the second connection terminal has a protrusion on its surface close to the first connection terminal, and the protrusion matches the recess.

10. A display device, characterized in that: The invention comprises the display panel as claimed in any one of claims 1 to 9.

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