Circuit board assembly insulation epoxy powder automatic coating device

Abstract

The invention relates to the technical field of circuit board surface powder coating equipment, in particular to a circuit board assembly insulation epoxy powder automatic coating device which comprises a feeding box and further comprises a bubbling powder spraying assembly, a powder spraying assembly, a powder spraying assembly, a powder spraying assembly and a powder spraying assembly, and the bubbling powder spraying assembly comprises a powder spraying bin and a bubbling air pipe installed in the powder spraying bin; the vibration assembly comprises a shaft rod rotationally mounted on the vibration assembly and a cam mounted on the shaft rod; the overturning and drying assembly comprises a heating bin which is provided with a heating resistance wire and is used for installing a clamp tool of a circuit board assembly to be preheated and dried; uniform powder can be sprayed to the surface of the circuit board assembly through the bubbling powder spraying assembly and the vibration assembly, preheating and drying operation after coating of the circuit board can be achieved through the overturning drying assembly, position movement of the circuit board assembly is achieved through the translation assembly on the whole, and operation continuity is achieved; the production efficiency of powder coating of the circuit board assembly and the consistency of the surface coating quality are effectively improved, and large-scale production is facilitated.

Description

Technical Field

[0001] The invention relates to the technical field of circuit board surface powder coating equipment, and in particular to an automatic insulating epoxy powder coating device for a circuit board component. Background Art

[0002] The insulating epoxy powder coating process on the surface of circuit board components is an important processing technology in the SMT production process. At present, the automation efficiency of insulating epoxy powder coating on the surface of circuit board components is low. The continuous integration of process steps such as preheating, spraying, and drying is poor, resulting in low production efficiency and is not conducive to controlling the coating quality.

[0003] Therefore, we consider designing an automatic coating device for insulating epoxy powder of circuit board components suitable for the surface of circuit board body, so that it can provide stable and reliable preheating, spraying, drying and other process steps to ensure the coating quality and production efficiency of the product; in view of this, we propose an automatic coating device for insulating epoxy powder of circuit board components. Summary of the invention

[0004] The purpose of the present invention is to solve the deficiencies mentioned in the above background technology and provide an automatic insulating epoxy powder coating device for circuit board components.

[0005] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0006] An automatic insulating epoxy powder coating device for a circuit board assembly comprises a feeding box for containing insulating epoxy powder to be coated, and also comprises:

[0007] The bottom frame is provided with a vibration inner cavity, a drying cavity and an embedding cavity for inserting the feeding box;

[0008] A bubbling powder spraying assembly is used for blowing and spraying insulating epoxy powder onto the surface of the circuit board assembly, comprising a powder spraying bin detachably mounted on the base frame and located above the vibration inner cavity, and a bubbling air pipe mounted in the powder spraying bin, wherein the bubbling air pipe is provided with a through hole;

[0009] A vibration assembly, comprising a shaft rotatably mounted inside the vibration inner cavity, and a cam mounted on the shaft, wherein the cam is used for vibrating and dispersing the insulating epoxy powder in the powder spraying bin;

[0010] A flip drying assembly comprises a heat chamber installed in the drying chamber, wherein a heating resistor wire and a fixture for installing circuit board assemblies to be preheated and dried are installed in the heat chamber;

[0011] The translation assembly is movably mounted on the base frame and is used to drive the circuit board assembly to reciprocate along the direction of the bubbling powder spraying assembly and the flip drying assembly.

[0012] Preferably, a stop plate corresponding to the cam is connected below the powder spray bin via a spring rod.

[0013] Preferably, the cam adopts a fan-shaped structure with a smooth surface, and the cam is used to cyclically move the abutment plate when rotating.

[0014] Preferably, a rotating shaft is rotatably mounted on the heat storage bin, and the fixture is fixedly mounted on the rotating shaft.

[0015] Preferably, the translation assembly includes a moving frame in an inverted C-shaped structure, and a micro electric hoist and a clamping rod installed on the moving frame for fixing the circuit board assembly.

[0016] Preferably, a second slide rail is installed at the edge of the heat chamber, and a first slide rail aligned with the second slide rail is provided at the position of the vibration inner cavity of the base frame;

[0017] The movable frame is provided with a slide groove inserted into the first slide rail and the second slide rail.

[0018] Preferably, a first transmission belt drivingly connected to the rotating shaft is installed on the base frame, and a first motor is installed on the first transmission belt as a power source.

[0019] Preferably, a second transmission belt drivingly connected to the shaft is installed on the base frame, and a second motor is installed on the second transmission belt as a power source.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] The automatic insulating epoxy powder coating device for circuit board assemblies can spray powder evenly onto the surface of the circuit board assemblies through a bubbling powder spraying assembly and a vibration assembly, and can realize preheating of the circuit board and drying operations after coating through a turning and drying assembly. The position of the circuit board assembly is moved by a translation assembly as a whole, thereby realizing continuous operations; the production efficiency of the powder coating of the circuit board assemblies and the consistency of the surface coating quality are effectively improved, and large-scale production is facilitated. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The drawings constituting a part of the present application are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0023] Figure 1 This is one of the overall structural schematic diagrams of the present invention;

[0024] Figure 2 This is the second schematic diagram of the overall structure of the present invention;

[0025] Figure 3 It is an exploded view of the overall structure of the present invention;

[0026] Figure 4 This is a diagram showing the installation relationship between the chassis and the vibration assembly of the present invention;

[0027] Figure 5 It is a cross-sectional view of the installation relationship of the overall structure of the present invention;

[0028] Figure 6 This is one of the schematic diagrams of the bubbling powder spraying assembly of the present invention;

[0029] Figure 7 This is the second schematic diagram of the bubbling powder spraying assembly of the present invention;

[0030] Figure 8 This is a schematic diagram of the tumble drying assembly of the present invention;

[0031] Fig. 9 It is a schematic diagram of the translation assembly of the present invention.

[0032] The meaning of each number in the figure is:

[0033] 1. Loading box; 2. Bottom frame; 201. First slide rail; 21. Embedding cavity; 22. Vibration cavity; 23. Drying cavity;

[0034] 3. Bubble powder spraying assembly; 31. Powder spraying chamber; 32. Bubble air pipe; 321. Through hole; 33. Abutment plate; 34. Spring rod;

[0035] 4. Turning and drying assembly; 41. Hot chamber; 411. Second slide rail; 42. Rotating shaft; 43. Fixture tooling; 44. Heating resistance wire; 45. First motor; 46. First transmission belt;

[0036] 5. Translation assembly; 51. Moving frame; 511. Slideway; 52. Micro electric hoist; 53. Clamping rod;

[0037] 6. Shaft; 7. Cam; 8. Second transmission belt; 9. Second motor. DETAILED DESCRIPTION

[0038] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments. In the absence of conflict, the embodiments in this application and the features in the embodiments can be combined with each other. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work belong to the scope of protection of the present invention.

[0039] See also Figure 1-9 The present invention describes the above technical solution in detail through the following embodiments:

[0040] An automatic insulating epoxy powder coating device for a circuit board assembly comprises a feeding box 1 for containing insulating epoxy powder to be coated, and further comprises:

[0041] Base frame 2, such as Figure 4 The structure shown is provided with a vibration inner cavity 22, a drying cavity 23 and an embedding cavity 21 for inserting the loading box 1.

[0042] The bubbling powder spraying assembly 3 is used to blow and spray the insulating epoxy powder onto the surface of the circuit board assembly, and includes a powder spraying bin 31 detachably mounted on the base frame 2 and located above the vibration inner cavity 22, and a bubbling air pipe 32 mounted in the powder spraying bin 31. The bubbling air pipe 32 is provided with a through hole 321. In this embodiment, the bubbling air pipe 32 is externally connected to an air pump to blow the insulating epoxy powder in the powder spraying bin 31, so that the surface of the circuit board assembly after preheating is sprayed with the insulating epoxy powder. It should be noted that if Figure 6 , Figure 7 In the structure shown, a stop plate 33 is connected to the bottom of the powder spraying bin 31 via a spring rod 34 .

[0043] Vibration components, see Figure 4 The structure shown in the figure comprises a shaft 6 rotatably mounted inside the vibration inner cavity 22, and a cam 7 mounted on the shaft 6, the cam 7 is used to vibrate and disperse the insulating epoxy powder in the powder spraying bin 31; a second transmission belt 8 connected to the shaft 6 is mounted on the base frame 2, and a second motor 9 is mounted on the second transmission belt 8 as a power source, and the cam 7 can be driven to rotate by the rotation of the shaft 6; specifically, the cam 7 adopts the following method: Figure 5 As shown in the fan-shaped structure with a smooth surface, the rotation of the cam 7 will continuously and cyclically push the plate 33 upward, causing the powder spraying bin 31 to vibrate, thereby causing the insulating epoxy powder in the powder spraying bin 31 to be vibrated and dispersed, so that it can be sprayed more evenly during the blowing and spraying process, avoiding the problem of uneven powder accumulation and affecting the quality of blowing and spraying.

[0044] Turn over and dry the component 4, such as Figure 8 The structure shown includes a heat chamber 41 installed in the drying chamber 23, wherein a heating resistor 44 and a fixture 43 for installing circuit board assemblies to be preheated and dried are installed in the heat chamber 41.

[0045] The translation assembly 5 is used to drive the circuit board assembly to move horizontally, and includes a mobile frame 51 with an inverted C-shaped structure, and a micro electric hoist 52 and a clamping rod 53 installed on the mobile frame 51 for fixing the circuit board assembly; Figure 1-Figure 4As shown in the structure, in order to provide a moving path for the translation component 5, a second slide rail 411 is installed at the edge of the hot bin 41 in this embodiment, a first slide rail 201 aligned with the second slide rail 411 is provided at the position of the vibration inner cavity 22 of the base frame 2, and a slide groove 511 inserted into the first slide rail 201 and the second slide rail 411 is provided on the movable frame 51; the translation component 5 can be reciprocated along the direction of the bubbling powder spraying component 3 and the flip drying component 4, which is conducive to realizing the continuous operation steps of spraying after preheating and drying after spraying.

[0046] In order to better improve the drying effect and preheating efficiency of the circuit board assembly after the spraying operation, in this embodiment, a rotating shaft 42 is rotatably installed on the heat chamber 41, and a fixture 43 is fixedly installed on the rotating shaft 42; a first transmission belt 46 connected to the rotating shaft 42 is installed on the base frame 2, and a first motor 45 is installed on the first transmission belt 46 as a power source; the fixture 43 installed with the circuit board assembly can be driven to rotate by driving the rotating shaft 42, so as to better receive the heat source.

[0047] The working principle of the automatic insulating epoxy powder coating device for circuit board components of this embodiment is as follows: the circuit board components to be coated need to be preheated, and the circuit board components are rotated inside the hot chamber 41 for preheating by means of the fixture 43. This embodiment adopts a fixture 43 detachably mounted on the rotating shaft 42. After the preheating is completed, the fixture is directly installed through the micro electric hoist 52 and the clamping rod 53, so that the fixture 43 with the circuit board component installed is inverted to facilitate subsequent spraying. The moving frame 51 moves to the top of the bubbling powder spraying component 3 for blowing and spraying. The vibrating component is operated during the spraying process to obtain a uniform spraying effect. After the spraying is completed, the moving frame 51 is reset, and the fixture 43 is installed on the rotating shaft 42 again for rotation and drying. The overall movement of the device is consistent, and uniform spraying conditions can be obtained, which is conducive to controlling and obtaining stable coating quality.

[0048] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0049] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features.

[0050] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be considered exemplary and non-restrictive in all respects, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention.

Claims

1. An automatic insulating epoxy powder coating device for a circuit board assembly, comprising a feeding box (1) for containing insulating epoxy powder to be coated, characterized in that: Also includes: The bottom frame (2) is provided with a vibration inner cavity (22), a drying cavity (23) and an embedding cavity (21) for inserting the loading box (1); A bubbling powder spraying assembly (3) is used for blowing and spraying insulating epoxy powder onto the surface of the circuit board assembly, comprising a powder spraying bin (31) detachably mounted on the base frame (2) and located above the vibration inner cavity (22), and a bubbling air pipe (32) mounted in the powder spraying bin (31), wherein the bubbling air pipe (32) is provided with a through hole (321); A vibration assembly, comprising a shaft (6) rotatably mounted inside the vibration inner cavity (22), and a cam (7) mounted on the shaft (6), wherein the cam (7) is used to vibrate and disperse the insulating epoxy powder in the powder spraying bin (31); A turning and drying assembly (4) comprises a heat chamber (41) installed in the drying chamber (23), wherein a heating resistor (44) and a fixture (43) for installing circuit board assemblies to be preheated and dried are installed in the heat chamber (41); The translation assembly (5) is movably mounted on the base frame (2) and is used to drive the circuit board assembly to reciprocate along the direction of the bubbling powder spraying assembly (3) and the tumbling drying assembly (4).

2. The circuit board assembly insulating epoxy powder automatic coating device according to claim 1, characterized in that: A stop plate (33) corresponding to the cam (7) is connected below the powder spraying bin (31) via a spring rod (34).

3. The circuit board assembly insulating epoxy powder automatic coating device as claimed in claim 2, characterized in that: The cam (7) adopts a fan-shaped structure with a smooth surface, and the cam (7) is used to cyclically move the abutment plate (33) when rotating.

4. The circuit board assembly insulating epoxy powder automatic coating device according to claim 1, characterized in that: A rotating shaft (42) is rotatably mounted on the heat chamber (41), and the fixture (43) is fixedly mounted on the rotating shaft (42).

5. The circuit board assembly insulating epoxy powder automatic coating device according to claim 1, characterized in that: The translation assembly (5) comprises a moving frame (51) in an inverted C-shaped structure, and a micro electric hoist (52) and a clamping rod (53) mounted on the moving frame (51) for fixing the circuit board assembly.

6. The circuit board assembly insulating epoxy powder automatic coating device as claimed in claim 5, characterized in that: A second slide rail (411) is installed at the edge of the heat chamber (41), and a first slide rail (201) aligned with the second slide rail (411) is provided on the bottom frame (2) at the position of the vibration inner cavity (22); The movable frame (51) is provided with a slide groove (511) inserted into the first slide rail (201) and the second slide rail (411).

7. The circuit board assembly insulating epoxy powder automatic coating device as claimed in claim 4, characterized in that: The base frame (2) is provided with a first transmission belt (46) which is transmission-connected to the rotating shaft (42), and the first transmission belt (46) is provided with a first motor (45) as a power source.

8. The circuit board assembly insulating epoxy powder automatic coating device as claimed in claim 1, characterized in that: A second transmission belt (8) which is transmission-connected to the shaft rod (6) is installed on the base frame (2), and a second motor (9) is installed on the second transmission belt (8) as a power source.

Images