An HDI circuit board edge milling processing device

Abstract

The present application discloses an edge milling processing device for an HDI circuit board, which relates to the technical field of circuit board processing, and includes a workbench, an edge milling assembly and a positioning assembly; the edge milling assembly includes a milling cutter and a driving component; the positioning assembly includes a bottom plate, a plurality of positioning members and a plurality of pressing members; the pressing members are detachably connected to the positioning members; the top of the positioning member has a positioning portion, one side of the pressing member is provided with a mating sleeve, and the inside of the mating sleeve has a socket slot; after the positioning portion passes through the mounting hole and the positioning portion is inserted into and cooperates with the mating sleeve, the pressing member contacts and abuts against the HDI circuit board and presses it downward, and the maximum radial dimension of the mating sleeve increases as the positioning portion is inserted until the mating sleeve abuts against the hole wall of the mounting hole. The present application can effectively improve the position stability of the HDI circuit board during the edge milling process, thereby effectively improving the edge milling effect of the HDI circuit board.

Description

Technical Field

[0001] The present application relates to the technical field of circuit board processing, and in particular to a device for milling the edges of an HDI circuit board. Background Art

[0002] An HDI (High-Density Interconnect) circuit board is an advanced printed circuit board (PCB) that uses fine wires, small apertures, and high-density wiring technology. Its core features are line width / spacing ≤ 100 μm, aperture ≤ 150 μm, and multi-layer high-density interconnect is achieved through processes such as blind vias and buried vias to meet the requirements of miniaturization and high performance of modern electronic devices.

[0003] Currently, HDI circuit boards are usually used in high-integration devices (such as smartphones and wearable devices), so strict requirements are imposed on their external dimensions. Therefore, the edges of HDI circuit boards are usually finely milled to remove burrs and unevenness on the edges of the HDI circuit boards, ensuring perfect matching with the housing or other components and avoiding assembly interference.

[0004] However, currently, after an HDI circuit board is positioned and clamped on a milling machine, it usually has insufficient position stability on the milling machine, resulting in jitter after contacting the high-speed rotating milling cutter, which easily affects the final dimensional accuracy of the HDI circuit board and even causes the HDI circuit board to be scrapped. Summary of the Invention

[0005] The present application provides a device for milling the edges of an HDI circuit board, which can effectively improve the position stability of the HDI circuit board during the edge milling process, thereby effectively improving the edge milling effect of the HDI circuit board.

[0006] The present application provides a device for milling the edges of an HDI circuit board, adopting the following technical solution:

[0007] A device for milling the edges of an HDI circuit board includes a workbench, an edge milling assembly, and a positioning assembly;

[0008] The edge milling assembly is arranged above the workbench and includes a milling cutter and a driving component for controlling the rotation and movement of the milling cutter;

[0009] The positioning assembly includes a bottom plate, a plurality of positioning members, and a plurality of pressing members, and the plurality of positioning members correspond to the plurality of pressing members one by one; the bottom plate is fixedly arranged on the top of the workbench, the plurality of positioning members are all arranged on the top of the bottom plate, and the pressing member is detachably connected to the corresponding positioning member;

[0010] The top of the positioning member has a positioning portion for passing through the mounting holes on the HDI circuit board. One side of the pressing member is provided with an elastic fitting sleeve. The inside of the fitting sleeve has a plugging slot for inserting the positioning portion, and the plugging slot is constricted at one end close to the pressing member.

[0011] After the positioning portion passes through the mounting hole and is in plugging fit with the fitting sleeve, the pressing member contacts and abuts against the HDI circuit board and presses it downward. The maximum radial dimension of the fitting sleeve increases with the insertion of the positioning portion until the fitting sleeve abuts tightly against the hole wall of the mounting hole.

[0012] By adopting the above technical solution, during the milling edge processing of the HDI circuit board, the positioning member can play a preliminary positioning effect on the position of the HDI circuit board on the bottom plate. The fitting sleeve deformed after being in plugging fit with the positioning portion can play a further positioning effect on the position of the HDI circuit board on the bottom plate, so as to effectively ensure the position stability of the HDI circuit board in the horizontal direction during the milling edge processing. At the same time, the pressing member presses the HDI circuit board downward, which can effectively ensure the position stability of the HDI circuit board in the vertical direction during the milling edge processing, effectively reducing the probability of the HDI circuit board shaking and jumping, and thus can effectively improve the milling edge effect of the HDI circuit board.

[0013] Optionally, it further includes a blower, and the blower is arranged on the bottom plate.

[0014] The inside of the bottom plate has a cavity. The positioning member is provided with an air hole. One end of the air hole communicates with the cavity, and the other end of the air hole forms an opening on the positioning portion. When the positioning portion is in plugging fit with the fitting sleeve, the air hole communicates with the plugging slot, and the plugging slot, the air hole and the cavity jointly form a sealed space.

[0015] The blower communicates with the cavity and is used to drive gas to enter and exit the cavity.

[0016] By adopting the above technical solution, when milling the edge of the HDI circuit board, the blower driving the gas in the cavity to leave can effectively improve the stability of the plugging fit between the positioning portion and the fitting sleeve, so as to effectively ensure the positioning effect of the positioning component on the HDI circuit board. After the milling edge processing of the HDI circuit board is completed, the blower driving the gas into the cavity can facilitate the disengagement of the plugging fit between the positioning portion and the fitting sleeve, thus facilitating the staff to remove the HDI circuit board.

[0017] Optionally, a plurality of purging holes are formed on the positioning portion, and the plurality of purging holes are evenly distributed on the periphery of the positioning portion.

[0018] The purging holes communicate with the air holes, and the purging holes incline downward away from the air holes.

[0019] By adopting the above technical solution, after the edge milling of the HDI circuit board is completed, the blower can drive the gas into the cavity and blow it out through a plurality of purging holes, purging the milling chips formed during the edge milling process and remaining on the surface of the bottom plate, reducing the probability of the milling chips adhering to the next HDI circuit board to be edge milled.

[0020] Optionally, the top of the edge of the bottom plate has a guiding surface for guiding the milling chips to leave, and the position of the guiding surface close to the edge of the bottom plate is lower than the position of the guiding surface away from the edge of the bottom plate.

[0021] By adopting the above technical solution, it is convenient for the milling chips to leave the bottom plate after being purged, thereby effectively improving the cleanliness of the bottom plate, and further effectively ensuring the product quality after the edge milling of the HDI circuit board.

[0022] Optionally, the top of the workbench has a chip collecting groove for collecting the milling chips, and the bottom plate is located in the chip collecting groove.

[0023] By adopting the above technical solution, the milling chips will be collected in the chip collecting groove after leaving the bottom plate, which is convenient for the staff to uniformly process the milling chips subsequently.

[0024] Optionally, the positioning assembly further includes a plurality of moving parts corresponding to the plurality of positioning parts one by one. The moving parts are movably connected to the corresponding positioning parts and are located in the corresponding air holes.

[0025] When the moving part moves downward to the limit position, the cavity communicates with the corresponding air hole; when the moving part moves upward to the limit position, the moving part blocks the opening at one end of the air hole away from the cavity.

[0026] By adopting the above technical solution, after the edge milling of the HDI circuit board is completed and the blower drives the gas into the cavity, the moving part will move upward to the limit position and remain under the action of the gas, so that the gas can only be blown out through the purging holes, thereby effectively improving the purging effect on the milling chips.

[0027] Optionally, the bottom of the positioning part has a connecting part for connecting with the bottom plate, and the positioning part is rotatably connected to the connecting part; the peripheral side of the moving part has an impeller structure. When the moving part moves upward to the limit position, the gas entering the air hole from the cavity is used to drive the moving part to rotate, and the rotation of the moving part drives the positioning part to rotate relative to the connecting part.

[0028] By adopting the above technical solution, after the edge milling of the HDI circuit board is completed and the fan drives the gas into the cavity, the movable part can not only move upward to the limit position under the action of the gas and stay there, but also be driven by the force of the gas to drive the positioning part to rotate, so that the blowing range of the milling chips is more comprehensive, thereby further effectively improving the blowing effect on the milling chips.

[0029] Optionally, the bottom of the movable part has a locking part, and the connecting part is provided with a locking groove adapted to the locking part on the bottom hole wall of the air hole; when the movable part moves downward to the limit position, the locking part is inserted and matched with the locking groove to limit the rotation of the positioning part relative to the connecting part.

[0030] By adopting the above technical solution, during the edge milling process of the HDI circuit board, the relative position stability between the positioning part and the connecting part can be effectively improved, and the probability of the positioning part rotating during this process can be reduced, thereby further ensuring the positioning effect of the positioning component on the HDI circuit board during this process.

[0031] Optionally, a plurality of connecting grooves adapted to the connecting part are opened on the bottom plate for adapting to HDI circuit boards of different sizes. The connecting part is detachably connected to the bottom plate, and the connecting groove communicates with the cavity.

[0032] By adopting the above technical solution, it is convenient for the staff to change the position of the positioning part on the bottom plate according to the sizes of different HDI circuit boards, thereby effectively improving the universality of the edge milling device for different HDI circuit boards.

[0033] Optionally, it further includes a plurality of plugging blocks; the plugging blocks are adapted to the connecting grooves and are detachably connected to the bottom plate.

[0034] By adopting the above technical solution, the probability of the milling chips entering the interior of the bottom plate can be effectively reduced, and at the same time, the driving effect of the fan on the gas in the air holes can be effectively improved.

[0035] In summary, the present application includes at least one of the following beneficial effects:

[0036] 1. It can effectively improve the position stability of the HDI circuit board during edge milling, thereby effectively improving the edge milling effect of the HDI circuit board;

[0037] 2. It is convenient to clean and collect the milling chips generated during the edge milling process of the HDI circuit board, and reduce the influence of the milling chips on the subsequent edge milling process of the HDI circuit board;

[0038] 3. It can meet the edge milling processing requirements of HDI circuit boards of different sizes. Description of the Drawings

[0039] Figure 1 It is a schematic structural diagram of a device for milling the edges of an HDI circuit board according to an embodiment of the present application;

[0040] Figure 2 It is a cross-sectional view of a device for milling the edges of an HDI circuit board according to an embodiment of the present application;

[0041] Figure 3 It is a schematic structural diagram when no HDI circuit board is placed on the top of the workbench according to an embodiment of the present application;

[0042] Figure 4 It is a partial cross-sectional view when the positioning component positions the HDI circuit board according to an embodiment of the present application;

[0043] Figure 5 It is Figure 4 a partial enlarged view in;

[0044] Figure 6 It is a partial cross-sectional view when the positioning component blows the milling chips according to an embodiment of the present application;

[0045] Figure 7 It is Figure 6 a partial enlarged view in.

[0046] Explanation of reference numerals: 1. Workbench; 11. Chip collection groove; 2. Edge milling component; 21. Milling cutter; 22. Driving component; 3. Positioning component; 31. Base plate; 311. Connection groove; 312. Cavity; 313. Guiding surface; 32. Positioning member; 321. Positioning portion; 322. Connection portion; 323. Air hole; 324. Blowing hole; 325. Locking groove; 33. Pressing member; 34. Fitting sleeve; 341. Insertion slot; 35. Movable member; 351. Impeller structure; 352. Locking portion; 36. Fan; 4. HDI circuit board; 41. Mounting hole; 5. Plugging block. Detailed implementation manners

[0047] The following will further elaborate on the present application in conjunction with the attached Figures 1-7 drawings.

[0048] Referring to Figure 1 and Figure 2 , an embodiment of the present application discloses a device for milling the edges of an HDI circuit board, which is used for milling the edges of the HDI circuit board 4. It includes a workbench 1, an edge milling component 2, and a positioning component 3. Among them, the workbench 1 is used to receive the HDI circuit board 4 and provide a place for milling the edges of the HDI circuit board 4; the edge milling component 2 is used to mill the edges of the HDI circuit board 4; the positioning component 3 is used to fix the position of the HDI circuit board 4 above the workbench 1 to ensure the position stability of the HDI circuit board 4 during the edge milling process.

[0049] In this embodiment, preferably, the HDI circuit board 4 is integrally in a rectangular plate-like structure, and mounting holes 41 facilitating subsequent installation are provided at positions near the four corners of the HDI circuit board 4 itself; and preferably, the mounting holes 41 are round holes; since the above-mentioned HDI circuit board 4 is a prior art in the art, it will not be elaborated herein, and it is only briefly shown in the drawings.

[0050] Referring to Figure 2 and Figure 3 , the workbench 1 is integrally in a cuboid structure and is fixedly installed in a vertical position state in its own height direction; the edge milling assembly 2 is installed above the workbench 1 and includes a milling cutter 21 for milling the edges of the HDI circuit board 4 and a driving component 22 for driving the rotation of the milling cutter 21 and controlling the movement of the milling cutter 21. The driving component 22 can drive the milling cutter 21 to rotate about its own vertical center line, and at the same time can drive the milling cutter 21 to move along the length direction, width direction and height direction of the workbench 1. In this embodiment, since the workbench 1 and the edge milling assembly 2 with the above functions are both prior arts in the art, they will not be elaborated herein, and they are only briefly shown in the drawings.

[0051] Referring to Figure 4 and Figure 5 , the positioning assembly 3 is installed on the top of the workbench 1 and includes a bottom plate 31, four positioning members 32 and four pressing members 33. Among them, the bottom plate 31 is used to directly receive the HDI circuit board 4; the positioning members 32 are used to limit the horizontal displacement of the HDI circuit board 4 during the edge milling process; and the pressing members 33 are used to limit the vertical displacement of the HDI circuit board 4 during the edge milling process.

[0052] Referring to Figure 2 and Figure 4 , a large amount of milling chips will be generated during the edge milling process of the HDI circuit board 4. A chip collection groove 11 for collecting milling chips is provided on the top of the workbench 1, and the opening of the chip collection groove 11 is vertically upward; the bottom plate 31 is integrally in a rectangular plate-like structure, and the bottom plate 31 is fixedly installed on the bottom wall of the chip collection groove 11, and it is entirely located in the chip collection groove 11 and is centered horizontally in the chip collection groove 11. In this embodiment, preferably, the length direction of the bottom plate 31 is parallel to the length direction of the workbench 1, and the width direction of the bottom plate 31 is parallel to the width direction of the workbench 1.

[0053] Referring to Figure 4 and Figure 5, the four positioning members 32 correspond to the four mounting holes 41 on the HDI circuit board 4 one by one, and are used to pass through the corresponding mounting holes 41 on the HDI circuit board 4 to achieve positioning; when the HDI circuit board 4 is placed and positioned on the bottom plate 31, at this time, the four positioning members 32 on the bottom plate 31 will respectively pass through the four mounting holes 41 on the HDI circuit board 4. In this embodiment, preferably, the positioning member 32 is integrally in a cylindrical structure, and preferably, the radial dimension of the positioning member 32 is smaller than the radial dimension of the mounting hole 41.

[0054] Refer to Figure 3 and Figure 5 , the positioning member 32 includes a connecting portion 322 for detachably connecting it to the bottom plate 31 and a positioning portion 321 for positioning the HDI circuit board 4. A plurality of connecting grooves 311 adapted to the connecting portion 322 are formed on the top of the bottom plate 31, and the plurality of connecting grooves 311 are arranged in a rectangular array on the bottom plate 31. In this embodiment, preferably, the connecting portion 322 and the bottom plate 31 are detachably connected in a threaded engagement manner, and after the positioning member 32 is installed on the bottom plate 31, its connecting portion 322 will be completely located inside the bottom plate 31, and the positioning portion 321 will be completely located above the bottom plate 31.

[0055] Refer to Figure 2 and Figure 3 , further, preferably, a plurality of plugging blocks 5 for plugging the connecting grooves 311 are also detachably connected to the bottom plate 31, and the plugging blocks 5 are integrally in a cylindrical structure. In this embodiment, preferably, the plugging blocks 5 and the bottom plate 31 are also detachably connected in a threaded engagement manner, and after the plugging blocks 5 are installed on the bottom plate 31, the plugging blocks 5 will be completely located inside the bottom plate 31, and the top of the plugging blocks 5 is flush with the top end face of the bottom plate 31.

[0056] After the four positioning members 32 are installed on the bottom plate 31, the remaining connecting grooves 311 on the bottom plate 31 are plugged by installing a plurality of plugging blocks 5 on the bottom plate 31; when the size of the HDI circuit board 4 changes, the staff can make the distribution positions of the four positioning members 32 on the bottom plate 31 adapt to the distribution positions of the four mounting holes 41 on the HDI circuit board 4 by changing the installation positions of the positioning members 32 on the bottom plate 31, which is convenient for the positioning assembly 3 to adapt to HDI circuit boards 4 of different sizes.

[0057] Refer to Figure 5 and Figure 6, the four pressing members 33 correspond to the four positioning members 32 one by one. The pressing member 33 is integrally in a cylindrical structure and has a certain weight. At one end in the axial direction of the pressing member 33, an elastic fitting sleeve 34 is fixedly installed. The fitting sleeve 34 is integrally in a cylindrical structure. The radial dimension of the pressing member 33 is larger than the radial dimension of the mounting hole 41, and the radial dimension of the fitting sleeve 34 is smaller than the radial dimension of the pressing member 33. An insertion slot 341 for inserting the positioning portion 321 is formed inside the fitting sleeve 34, and the insertion slot 341 is flared in a direction away from the pressing member 33. In this embodiment, it is preferably that the fitting sleeve 34 is made of rubber material; preferably, the maximum radial dimension of the fitting sleeve 34 when not inserted and engaged with the positioning portion 321 is smaller than the radial dimension of the mounting hole 41. After the fitting sleeve 34 is inserted and engaged with the positioning portion 321, its maximum radial dimension becomes larger and is larger than the radial dimension of the mounting hole 41.

[0058] Referring to Figure 5 and Figure 7 , for facilitating the insertion and engagement between the positioning portion 321 and the fitting sleeve 34, and at the same time improving the relative position stability after the insertion and engagement between the positioning portion 321 and the fitting sleeve 34, it is preferably that the positioning portion 321 is integrally in a spherical structure.

[0059] Referring to Figure 5 and Figure 6 , when the HDI circuit board 4 is placed above the bottom plate 31 and all four positioning portions 321 pass through the corresponding mounting holes 41, the corresponding pressing members 33 are respectively installed above the four positioning members 32. After the positioning portion 321 and the corresponding fitting sleeve 34 are initially inserted and engaged, the reliability of the subsequent insertion and engagement between the positioning portion 321 and the corresponding fitting sleeve 34 can be ensured under the gravity of the pressing member 33. Then, the fitting sleeve 34 will wrap the spherical structure of the corresponding positioning portion 321, and the maximum radial dimension of the fitting sleeve 34 will increase until the fitting sleeve 34 abuts against the hole wall of the mounting hole 41. At the same time, the pressing member 33 will be located above the HDI circuit board 4 and be in contact with the top of the HDI circuit board 4. At this time, the fitting sleeve 34 elastically deformed by the insertion of the positioning portion 321 can effectively limit the displacement of the HDI circuit board 4 in the horizontal direction, and at the same time can reduce the probability that the hole wall of the mounting hole 41 of the HDI circuit board 4 is damaged due to the direct positioning effect of the positioning portion 321. Moreover, the gravity of the pressing member 33 can effectively limit the displacement of the HDI circuit board 4 in the vertical direction, so that the HDI circuit board 4 is clamped and positioned between the pressing member 33 and the bottom plate 31.

[0060] Referring to Figure 1 and Figure 2 , further, for facilitating the insertion and engagement and the disengagement of the insertion and engagement between the positioning portion 321 and the fitting sleeve 34, it is preferably that the positioning assembly 3 further includes a blower 36.

[0061] A cavity 312 is formed inside the bottom plate 31, and the cavity 312 communicates with a plurality of connecting grooves 311 at the same time; the fan 36 is fixedly installed on the bottom plate 31, and the fan 36 communicates with the cavity 312. In this embodiment, preferably, the fan 36 is embedded at the top of the bottom plate 31, and preferably, the fan 36 can be controlled by the staff to drive the gas in and out of the cavity 312; since the fan 36 with the above functions is a common prior art, it will not be elaborated here, and it is only briefly shown in the drawings.

[0062] Referring to Figure 2 and Figure 5 , an air hole 323 for gas flow is formed inside the positioning member 32. The air hole 323 penetrates through both ends of the positioning portion 321 along the axial direction of the positioning portion 321 in the positioning portion 321 to form openings. The air hole 323 penetrates through the end of the connecting portion 322 close to the positioning portion 321 in the connecting portion 322 to communicate with the internal space of the positioning portion 321, and at the same time, penetrates through the periphery of the end of the connecting portion 322 away from the positioning portion 321 to form a plurality of openings, and at least one opening makes the internal space of the connecting portion 322 communicate with the cavity 312.

[0063] Referring to Figure 4 and Figure 5 , when the HDI circuit board 4 is positioned by the positioning assembly 3, at this time, the four mating sleeves 34 will cooperate with the corresponding pressing members 33 to form seals at the openings of the four air holes 323 respectively, so that the four air holes 323 and the cavity 312 together form a sealed space; at this time, if the fan 36 drives the gas in the cavity 312 to leave the cavity 312 through the fan 36, the positioning portion 321 can be driven to be further inserted and mated with the mating sleeve 34 to effectively improve the positioning effect of the positioning assembly 3 on the HDI circuit board 4; if the fan 36 drives the external gas to enter the cavity 312 through the fan 36, the positioning portion 321 can be driven to be disengaged from the mating sleeve 34 to facilitate the staff to remove the pressing member 33.

[0064] Referring to Figure 6 and Figure 7 , further, since the milling chips generated after the edge milling of the HDI circuit board 4 mainly fall on the edge position of the top of the bottom plate 31, in order to facilitate the staff to clean the milling chips after the edge milling of the HDI circuit board 4 is completed, preferably, a plurality of blowing holes 324 are formed on the periphery of the positioning portion 321 of the positioning member 32, and preferably, the edge position of the top of the bottom plate 31 has a guiding surface 313 that facilitates the milling chips to leave.

[0065] A plurality of purging holes 324 are arranged in a circumferential array on the positioning portion 321 with the axis of the positioning portion 321 as the axis. One end of the purging hole 324 communicates with the air hole 323 and the other end communicates with the circumferential space of the positioning portion 321, and the purging hole 324 is inclined downward in a direction away from the air hole 323. In this embodiment, preferably, the guiding surface 313 is an arc surface; and preferably, a total of four purging holes 324 are formed on the positioning portion 321, and the gas blown out through the purging holes 324 can effectively drive the milling chips located at the top edge position of the bottom plate 31 to move towards the direction close to the guiding surface 313.

[0066] Refer to Figure 5 and Figure 7 , and, preferably, after the positioning portion 321 is inserted and fitted with the mating sleeve 34, the mating sleeve 34 can simultaneously seal the openings of the plurality of purging holes 324 on the positioning portion 321. When the fan 36 drives the gas in the cavity 312 to leave, the insertion and fitting between the positioning portion 321 and the mating sleeve 34 will be more stable at this time.

[0067] Furthermore, to improve the flexibility of the positioning portion 321 during the process of purging the milling chips and at the same time ensure the position stability of the positioning portion 321 during the milling edge processing of the HDI circuit board 4, preferably, the positioning portion 321 is rotatably connected to the connecting portion 322, and a movable member 35 is installed in the air hole 323.

[0068] Refer to Figure 6 and Figure 7 , the rotation axis of the positioning portion 321 coincides with its own axis, the movable member 35 is movably installed inside the positioning member 32 and can move along the axis direction of the positioning portion 321; a peripheral side of the top of the movable member 35 has an impeller structure 351, and a locking portion 352 extends downward from the bottom of the movable member 35; correspondingly, the connecting portion 322 is provided with a locking groove 325 adapted to the locking portion 352 on the hole wall at the bottom of the air hole 323. In this embodiment, preferably, the movable member 35 and the air hole 323 are movably matched along the axis direction of the positioning portion 321.

[0069] When the fan 36 drives the external gas into the cavity 312, during the process of the gas entering the air hole 323 from the cavity 312, the gas can drive the movable member 35 to move upward along the air hole 323 to the limit position and stay; at this time, the movable member 35 can block the opening of the air hole 323 at the top of the positioning portion 321. At the same time, the acting force exerted by the gas on the impeller structure 351 can make the movable member 35 have a tendency to rotate around its own vertical center line, and the rotation of the movable member 35 can drive the positioning portion 321 to rotate relative to the connecting portion 322, thereby changing the direction of the gas blown out through the purging hole 324, effectively expanding the purging range and making the effect of purging the milling chips more comprehensive. In this embodiment, preferably, the top of the movable member 35 has a structure with an inwardly convex shape, and preferably, the shape of the position of the air hole 323 near the top of the positioning portion 321 is adapted to the top of the movable member 35.

[0070] Referring to Figure 4 and Figure 5 , when the fan 36 drives the gas in the cavity 312 to leave, during the process of the gas entering the air hole 323 from the outside and then entering the cavity 312, the gas can drive the movable member 35 to move downward along the air hole 323 to the limit position and stay; at this time, the locking portion 352 is inserted and matched with the locking groove 325, and the movable member 35 will limit the rotation of the positioning portion 321 relative to the connecting portion 322. At the same time, the gas in the air hole 323 can pass through the gap between the movable member 35 and the hole wall of the air hole 323, without affecting the gas flow between the air hole 323 and the cavity 312. In this embodiment, preferably, the shape of the locking portion 352 is a prism, and its bottom has a guiding structure to facilitate its insertion into the locking groove 325.

[0071] The implementation principle of an HDI circuit board edge milling processing device according to an embodiment of the present application is as follows:

[0072] Before milling the edge of the HDI circuit board 4, first place the HDI circuit board 4 on the bottom plate 31, so that the four positioning portions 321 respectively pass through the four mounting holes 41 on the HDI circuit board 4, and then install the four pressing members 33 on the four positioning members 32 respectively, so that the positioning portion 321 is inserted and matched with the fitting sleeve 34 and the fitting sleeve 34 abuts against the hole wall of the mounting hole 41, and at the same time, the pressing member 33 abuts against the top of the HDI circuit board 4; after that, the edge milling assembly 2 can be started to mill the edge of the HDI circuit board 4, and at the same time, the fan 36 is started to keep driving the gas in the cavity 312 to leave during this process, so that the positioning portion 321 and the fitting sleeve 34 remain inserted and matched;

[0073] After the edge milling of the HDI circuit board 4 is completed, first control the edge milling assembly 2 to stop, and then control the fan 36 to drive the external gas into the cavity 312 to reduce the insertion and matching strength between the positioning portion 321 and the fitting sleeve 34, so as to facilitate the staff to remove the four pressing members 33;

[0074] After the staff removes the HDI circuit board 4 that has been processed by edge milling, control the blower 36 to drive the outside air into the cavity 312 for a period of time. The air will drive the movable part 35 to move upward to the limit position to block the opening of the air hole 323, so that the air is blown out through a plurality of purging holes 324. At the same time, the positioning part 321 can rotate relative to the connecting part 322 under the action of the rotation trend of the movable part 35, so as to purge the milling chips in the area around the positioning part 32 at the bottom and top. After being purged, the milling chips will fall into the chip collecting groove 11 along the guiding surface 313 for collection, which is convenient for the subsequent staff to uniformly process the milling chips and also convenient for the next HDI circuit board 4 to be processed by edge milling.

[0075] The above are all the preferred embodiments of the present application, and the protection scope of the present application is not limited accordingly. Therefore, all equivalent changes made according to the structure, shape, and principle of the present application shall be covered within the protection scope of the present application.

Claims

1. An HDI circuit board edge milling processing device, characterized in that, It includes a workbench (1), a milling edge assembly (2) and a positioning assembly (3); The milling edge assembly (2) is arranged above the workbench (1), and it includes a milling cutter (21) and a driving component (22) for controlling the rotation and movement of the milling cutter (21); The positioning assembly (3) includes a bottom plate (31), a plurality of positioning members (32) and a plurality of pressing members (33), and the plurality of positioning members (32) correspond to the plurality of pressing members (33) one by one; the bottom plate (31) is fixedly arranged on the top of the workbench (1), the plurality of positioning members (32) are all arranged on the top of the bottom plate (31), and the pressing member (33) is detachably connected to the corresponding positioning member (32); The top of the positioning member (32) has a positioning portion (321) for passing through the mounting hole (41) on the HDI circuit board (4), and one side of the pressing member (33) is provided with an elastic fitting sleeve (34), and the inside of the fitting sleeve (34) has a plugging slot (341) for inserting the positioning portion (321), and the plugging slot (341) is in a necked shape towards one end close to the pressing member (33); After the positioning portion (321) passes through the mounting hole (41) and the positioning portion (321) is in plugging fit with the fitting sleeve (34), the pressing member (33) contacts and abuts against the HDI circuit board (4) and presses it downward, and the maximum radial dimension of the fitting sleeve (34) increases with the insertion of the positioning portion (321) until the fitting sleeve (34) abuts tightly against the hole wall of the mounting hole (41); It further includes a blower (36), and the blower (36) is arranged on the bottom plate (31); The inside of the bottom plate (31) has a cavity (312), the positioning member (32) is provided with an air hole (323), one end of the air hole (323) communicates with the cavity (312), and the other end of the air hole (323) forms an opening on the positioning portion (321); when the positioning portion (321) is in plugging fit with the fitting sleeve (34), the air hole (323) communicates with the plugging slot (341), and the plugging slot (341), the air hole (323) and the cavity (312) jointly form a sealed space; The blower (36) communicates with the cavity (312), and it is used to drive gas to enter and exit the cavity (312); A plurality of purging holes (324) are formed on the positioning portion (321), and the plurality of purging holes (324) are evenly distributed on the periphery of the positioning portion (321); The purging holes (324) communicate with the air holes (323), and the purging holes (324) are inclined downward in a direction away from the air holes (323); The positioning assembly (3) further includes a plurality of movable members (35) corresponding to the plurality of positioning members (32) one by one, and the movable members (35) are movably connected to the corresponding positioning members (32) and are located in the corresponding air holes (323); When the movable member (35) moves downward to the extreme position, the cavity (312) communicates with the corresponding air hole (323); when the movable member (35) moves upward to the extreme position, the movable member (35) blocks the opening at one end of the air hole (323) away from the cavity (312).

2. The HDI circuit board edge milling processing device according to claim 1, wherein, The top of the edge of the bottom plate (31) has a guiding surface (313) for guiding the milling chips away, and the position of the guiding surface (313) close to the edge of the bottom plate (31) is lower than the position of the guiding surface (313) away from the edge of the bottom plate (31).

3. The edge milling processing device for an HDI circuit board according to claim 2, characterized in that, The top of the workbench (1) has a chip collecting groove (11) for collecting milling chips, and the bottom plate (31) is located in the chip collecting groove (11).

4. An HDI circuit board edge milling processing device according to claim 1, characterized in that, The bottom of the positioning member (32) has a connecting portion (322) for connecting with the bottom plate (31), and the positioning portion (321) is rotatably connected to the connecting portion (322); the peripheral side of the movable member (35) has an impeller structure (351). When the movable member (35) moves upward to the extreme position, the gas entering the air hole (323) from the cavity (312) is used to drive the movable member (35) to rotate, and the rotation of the movable member (35) drives the positioning portion (321) to rotate relative to the connecting portion (322).

5. An edge milling processing device for an HDI circuit board according to claim 4, characterized in that, The bottom of the movable member (35) has a locking portion (352), and the connecting portion (322) is provided with a locking groove (325) adapted to the locking portion (352) on the bottom hole wall of the air hole (323); when the movable member (35) moves downward to the extreme position, the locking portion (352) is inserted and matched with the locking groove (325) to limit the rotation of the positioning portion (321) relative to the connecting portion (322).

6. The HDI circuit board edge milling processing device according to claim 4, characterized in that A plurality of connecting grooves (311) adapted to the connecting portion (322) are formed on the bottom plate (31) for adapting to different sizes of the HDI circuit board (4). The connecting portion (322) is detachably connected to the bottom plate (31), and the connecting groove (311) communicates with the cavity (312).

7. An edge milling processing device for an HDI circuit board according to claim 6, characterized in that, It further includes a plurality of plugging blocks (5); the plugging blocks (5) are adapted to the connecting grooves (311) and are detachably connected to the bottom plate (31).

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