Micro-electronic substrate welding auxiliary tool

Abstract

The invention relates to the technical field of welding auxiliary tools, and provides a microelectronic substrate welding auxiliary tool which comprises a tool rack, a clamping frame arranged on the tool rack in a sliding mode, a substrate containing plate and a bent sliding rail, a plurality of installation openings are formed in the substrate containing plate, substrate clamping assemblies are arranged among the installation openings, and the bent sliding rail is arranged on the clamping frame. The substrate clamping assembly is used for clamping microelectronic substrates of different shapes, bent sliding rails are fixedly connected to the two sides of the interior of the clamping frame, a plate clamping mechanism is arranged between the two bent sliding rails, and the plate clamping mechanism is used for clamping a substrate containing plate. According to the technical scheme, the problems that in the prior art, in the process of welding the electronic chip pins on the microelectronic substrate, multiple microelectronic substrates are difficult to clamp in a unified mode, and time is wasted when solder paste or scaling powder is smeared on the multiple jacks in the microelectronic substrate are solved.

Description

Technical Field

[0001] The present invention relates to the technical field of welding auxiliary tooling, and in particular to a microelectronic substrate welding auxiliary tooling. Background Art

[0002] Microelectronic substrates are basic components for manufacturing printed circuit boards. Microelectronic substrates usually have the functions of conductivity, insulation and support. A plurality of sockets for installing electronic chip pins are usually provided on the microelectronic substrate. In order to use the electronic chip, the electronic chip needs to be soldered on the microelectronic substrate so that the electronic device can be used normally after the microelectronic substrate is subsequently installed inside the electronic device. When soldering the electronic chip, firstly apply solder paste or flux to the sockets on the microelectronic substrate for installing the electronic chip pins, and then insert the pins of the electronic chip into the sockets. If solder paste is applied, the pins of the electronic chip and the sockets can be directly soldered using a hot welder. If flux is used, a spot welder and a tin bar are required to be used to solder the electronic chip and the sockets.

[0003] However, the microelectronic substrates in the prior art are generally small in size, and the shapes of the microelectronic substrates used in different electronic devices are also quite different. It is difficult to adapt to the shapes of various microelectronic chips using a single welding auxiliary tooling, which increases the difficulty of fixing the microelectronic substrate during welding. In addition, the sockets on the microelectronic substrate are small in size and large in number, and it is also time-consuming to apply solder paste or flux to multiple sockets in sequence. Summary of the invention

[0004] The present invention proposes a microelectronic substrate welding auxiliary tooling, which solves the problems in the prior art that it is difficult to uniformly clamp multiple microelectronic substrates during the process of welding electronic chip pins, and it is time-consuming to apply solder paste or flux to multiple sockets on the microelectronic substrate.

[0005] The technical solution of the present invention is as follows: A microelectronic substrate welding auxiliary tool, comprising a tool frame, a clamping frame is slidably arranged on the tool frame, and further comprising:

[0006] A substrate placement plate, wherein a plurality of mounting openings are provided on the substrate placement plate, and a substrate clamping assembly is provided between the plurality of mounting openings, and the substrate clamping assembly is used to clamp microelectronic substrates of different shapes;

[0007] Curved slide rails, both sides of the clamping frame are fixedly connected with curved slide rails, a plate clamping mechanism is provided between the two curved slide rails, and the plate clamping mechanism is used to clamp the plate placed on the substrate;

[0008] A lifting trough frame, the lifting trough frame is arranged on one side of the tooling frame, the bottom of the lifting trough frame is fixedly connected with a lower mounting plate, the lifting trough frame is longitudinally slidably connected with an upper mounting plate, a plurality of fixing openings are symmetrically opened between the lower mounting plate and the upper mounting plate, a plurality of injection assemblies are arranged on the lower mounting plate, and a push injection assembly is arranged on the upper mounting plate corresponding to the injection assembly.

[0009] In order to fix the microelectronic substrate, further, the substrate clamping assembly includes a clamping seat and a padding rod, the bottom of the clamping seat is set as an insertion section, the insertion section extends into the installation port, the upper side of the clamping seat is set as a clamping section, the clamping section is provided with a placement groove, and a plurality of insertion holes are provided on the inner bottom wall of the placement groove, and the padding rod is placed on the insertion hole.

[0010] In order to clamp the plate placed on the substrate, further, the plate clamping mechanism includes a sliding member, a sliding groove frame, a placement seat and a fastening seat, the sliding members are slidably arranged on both sides of the curved slide rail, the sliding groove frame is slidably connected between the two sliding members located on the same side, a spacing adjustment component is arranged between the clamping frame and the two sliding groove frames, the placement seat is fixedly connected to the middle part of the clamping frame, the top of each of the sliding members is fixedly connected to the fastening seat, and the substrate placement plate is clamped between the four fastening seats.

[0011] In order to adjust the positions of the four fastening seats, further, the spacing adjustment assembly includes a rotating seat, a bidirectional screw and a transmission worm gear. The middle parts of both sides of the clamping frame are fixedly connected with the rotating seat, the bidirectional screw is rotatably connected between the two rotating seats, the middle part of the sliding groove frame is threadedly connected to one side of the bidirectional screw, and the transmission worm gear is fixedly sleeved on one side of the bidirectional screw, a transmission worm is meshed with the transmission worm, and the transmission worm is rotatably connected to the rotating seat.

[0012] In order to adjust the position of the clamping frame, it further includes a transmission screw, which is rotatably connected in the tooling frame, a first drive motor is arranged on the tooling frame, an output end of the first drive motor is fixedly connected to the transmission screw, a sliding seat is slidably connected to the tooling frame, the sliding seat is threadedly connected to the transmission screw, and the clamping frame is fixedly connected to the sliding seat.

[0013] In order to adjust the height of the lifting trough frame, it further includes a lifting bracket and a lifting screw. The lifting brackets are fixedly connected on both sides of the tooling frame. The lifting trough frame is slidably connected between the two lifting brackets through a sliding plate. The lifting screw is rotatably connected in one of the lifting brackets, and the lifting screw is threadedly connected to the sliding plate. A second drive motor is arranged on the top of one of the lifting brackets, and the output end of the second drive motor is fixedly connected to the lifting screw.

[0014] In order to add solder paste or flux to the socket of the microelectronic substrate, further, the injection assembly includes a placement slot and an injection tube, the placement slot is placed in the fixing port of the lower mounting plate, a bucket-shaped through groove is opened in the placement slot, and the bottom of the bucket-shaped through groove is connected to multiple injection tubes, and the bottom of the injection tube is set to be conical.

[0015] In order to push the solder paste or flux out of the injection tube, the pushing assembly further includes a mounting seat and a pushing rod, the mounting seat is placed in the fixed port of the upper mounting plate, and a plurality of pushing rods are fixedly connected to the bottom of the mounting seat, the pushing rods correspond one-to-one to the injection tubes, and the bottom of the pushing rods is also set to be conical.

[0016] In order to drive the upper mounting plate to move longitudinally, it further includes a driving electric cylinder, which is arranged on the lifting slot frame, and a connecting plate is fixedly connected to the top of the upper mounting plate, and the output end of the driving electric cylinder is fixedly connected to the connecting plate.

[0017] The working principle and beneficial effects of the present invention are:

[0018] In the present invention, when welding operations are required on multiple microelectronic substrates, first, according to the combined volume of the multiple microelectronic substrates, a substrate placement plate of corresponding volume is selected, the substrate clamping assembly is placed in the corresponding mounting opening of the substrate placement plate, and then the microelectronic substrate is placed between the multiple substrate clamping assemblies, the microelectronic substrate is clamped by the multiple substrate clamping assemblies, and then the substrate placement plate is clamped by the plate clamping mechanism, and then the position of the clamping frame is adjusted by the transmission screw, and then the clamping frame is moved to the lower side of the lifting slot frame, and then according to the opening position of the socket on the microelectronic substrate, the corresponding injection assembly and the push injection assembly are respectively installed in the corresponding fixing openings opened on the lower mounting plate and the upper mounting plate, and first, the microelectronic substrate is clamped by the multiple substrate clamping assemblies. The injection assembly is brought close to the position of the microelectronic substrate socket, and then the driving electric cylinder is used to drive the upper mounting plate to move longitudinally, so that the solder paste or flux in the injection assembly is squeezed into the socket position of the microelectronic substrate, and then the clamping frame is moved out from the bottom of the lifting slot frame, and the operator extends the pins of the electronic chip into the socket. The operator can use welding equipment to perform welding operations on the clamped microelectronic substrate. During use of the present invention, firstly, multiple microelectronic substrates can be centrally fixed and clamped together, which is convenient for subsequent welding operations on multiple microelectronic substrates in sequence, and after clamping the microelectronic substrate, solder paste or flux can be easily injected into the socket on the microelectronic substrate, thereby improving the injection time of welding auxiliary materials. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0020] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0021] Figure 2 It is a schematic diagram of the structure of a partial cross-section of the present invention;

[0022] Figure 3 It is a partial cross-sectional structural schematic diagram of the cooperation of the clamping frame, the substrate placement plate, the substrate clamping assembly and the plate clamping mechanism in the present invention;

[0023] Figure 4 It is a structural schematic diagram of the substrate clamping assembly in the present invention;

[0024] Figure 5 For the present invention Figure 3 A schematic diagram of the local enlarged structure at point A in the middle;

[0025] Figure 6 It is a schematic diagram of the structure of the coordination of the curved slide rail, the sliding member, the sliding slot frame and the fastening seat in the present invention;

[0026] Figure 7It is a schematic diagram of the structure of the lifting bracket, the lifting slot frame, the lower mounting plate and the upper mounting plate in the present invention;

[0027] Figure 8 It is a partial cross-sectional structural diagram of the cooperation of the lower mounting plate, the upper mounting plate, the injection assembly and the push injection assembly in the present invention;

[0028] Fig. 9 For the present invention Figure 8 A schematic diagram of the local enlarged structure at B in the middle;

[0029] Fig.10 It is a schematic structural diagram of a partial cross-section of the cooperation between the injection assembly and the injection rod in the present invention.

[0030] In the figure: 100, substrate clamping assembly; 200, plate clamping mechanism; 300, injection assembly; 400, push injection assembly;

[0031] 1. Tooling frame; 2. Clamping frame; 3. Base plate for placing plate; 4. Bending slide rail; 5. Lifting slot frame; 6. Lower mounting plate; 7. Upper mounting plate; 8. Clamping seat; 9. Clamping section; 10. Placement slot; 11. Pad rod; 12. Sliding member; 13. Sliding slot frame; 14. Placement seat; 15. Fastening seat; 16. Rotating seat; 17. Bidirectional screw; 18. Drive worm gear; 19. Drive worm; 20. Drive screw; 21. First drive motor; 22. Sliding seat; 23. Lifting bracket; 24. Lifting screw; 25. Second drive motor; 26. Placement slot; 27. Bucket-shaped through slot; 28. Injection pipe; 29. ​​Mounting seat; 30. Push rod; 31. Drive electric cylinder; 32. Connecting plate. DETAILED DESCRIPTION

[0032] The following will be combined with the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] like Figures 1 to 10As shown, this embodiment proposes a microelectronic substrate welding auxiliary tooling, including a tooling frame 1, a clamping frame 2 is slidably arranged on the tooling frame 1, and also includes a transmission screw 20, which is rotatably connected in the tooling frame 1, and a first driving motor 21 is arranged on the tooling frame 1, and the output end of the first driving motor 21 is fixedly connected to the transmission screw 20, and a sliding seat 22 is slidably connected to the tooling frame 1, and the sliding seat 22 is threadedly connected to the transmission screw 20, and the clamping frame 2 is fixedly connected to the sliding seat 22. When it is necessary to drive the clamping frame 2 to move laterally on the tooling frame 1 and move the microelectronic substrate to the bottom of the lifting slot frame 5, the first driving motor 21 is started to drive the transmission screw 20 to rotate, so that the sliding seat 22 moves laterally on the tooling frame 1, and the sliding seat 22 drives the clamping frame 2 and the components on the clamping frame 2 to move together.

[0034] The substrate placing plate 3 is also included. A plurality of mounting openings are provided on the substrate placing plate 3. A substrate clamping assembly 100 is provided between the plurality of mounting openings. The substrate clamping assembly 100 is used to clamp microelectronic substrates of different shapes. The substrate clamping assembly 100 includes a clamping seat 8 and a padding rod 11. The bottom of the clamping seat 8 is provided as an insertion section. The insertion section extends into the mounting opening. The upper side of the clamping seat 8 is provided as a clamping section 9. The clamping section 9 is provided with a placing groove 10. A plurality of insertion holes are provided on the inner bottom wall of the placing groove 10. Padding rods 11 are placed on the insertion holes. When the microelectronic substrate needs to be placed, When the plate is clamped, based on the shape of the microelectronic substrate and the placement position of the microelectronic substrate on the substrate placement plate 3 as a reference, the clamping seat 8 is selected to be placed in the corresponding installation port, and the microelectronic substrate is placed between the multiple placement grooves 10, so that the angle of the microelectronic substrate is in contact with the inner wall of the placement groove 10. When the contact between the placement groove 10 and the microelectronic substrate is not tight, the padding rod 11 can be inserted into the corresponding insertion hole to fix the padding rod 11 between the placement groove 10 and the microelectronic substrate, thereby improving the stability of the microelectronic substrate between the multiple placement grooves 10.

[0035] The inner sides of the clamping frame 2 are fixedly connected with curved slide rails 4, and a plate clamping mechanism 200 is arranged between the two curved slide rails 4. The plate clamping mechanism 200 is used to clamp the plate 3 placed on the substrate. The plate clamping mechanism 200 includes a sliding member 12, a sliding slot frame 13, a placement seat 14 and a fastening seat 15. Sliders 12 are slidably arranged on both sides of the curved slide rail 4, and a sliding slot frame 13 is slidably connected between the two slides 12 located on the same side. A spacing adjustment component is arranged between the clamping frame 2 and the two sliding slot frames 13. The spacing adjustment component includes a rotating seat 16, a bidirectional screw 17 and a transmission worm gear 18. The middle parts of both sides of the clamping frame 2 are fixedly connected with the rotating seat 16 The bidirectional screw 17 is rotatably connected between the two rotating seats 16, the middle part of the sliding slot frame 13 is threadedly connected to one side of the bidirectional screw 17, and a fixed sleeve is provided with a transmission worm wheel 18 on one side of the bidirectional screw 17, and a transmission worm 19 is meshedly provided on the transmission worm wheel 18, and the transmission worm 19 is rotatably connected to the rotating seat 16. When the plate 3 is placed on different substrates for fixed clamping, the transmission worm 19 is rotated, and the bidirectional screw 17 is driven to rotate through the meshing relationship between the transmission worm 19 and the transmission worm wheel 18, and the two sliding slot frames 13 are driven to move relative to each other. The sliding slot frame 13 pushes the two sliding members 12 to slide in the curved slide rail 4, so that the moving positions of the four sliding members 12 correspond to each other;

[0036] A placement seat 14 is fixedly connected to the middle of the clamping frame 2, and a fastening seat 15 is fixedly connected to the top of each sliding member 12. The substrate placement plate 3 is clamped between the four fastening seats 15. First, the substrate placement plate 3 is placed on the placement seat 14, and the positions of the four sliding members 12 are adjusted, so that the positions of the fastening seats 15 are also adjusted together. Finally, the four fastening seats 15 clamp the substrate placement plate 3, thereby realizing the fixed clamping operation of different substrate placement plates 3.

[0037] The lifting slot frame 5 is arranged on one side of the tooling frame 1, and a lower mounting plate 6 is fixedly connected to the bottom of the lifting slot frame 5, and an upper mounting plate 7 is longitudinally slidably connected to the lifting slot frame 5. A plurality of fixing ports are symmetrically provided between the lower mounting plate 6 and the upper mounting plate 7, and also include a lifting bracket 23 and a lifting screw 24. The lifting bracket 23 is fixedly connected to both sides of the tooling frame 1, and the lifting slot frame 5 is slidably connected between the two lifting brackets 23 through a sliding plate, and a lifting screw 24 is rotatably connected in one of the lifting brackets 23, and the lifting screw 24 is threadedly connected to the sliding plate, and a second driving motor 25 is arranged on the top of one of the lifting brackets 23, and the output end of the second driving motor 25 is fixedly connected to the lifting screw 24, and when solder paste or flux is subsequently injected into the microelectronic substrate, the second driving motor 25 is started to drive the lifting screw 24 to rotate, and drive the lifting slot frame 5 to move longitudinally between the two lifting brackets 23, so that the bottom of the injection tube 28 is close to the jack of the microelectronic substrate.

[0038] A plurality of injection assemblies 300 are arranged on the lower mounting plate 6, and the injection assemblies 300 include a placement slot 26 and an injection tube 28. The placement slot 26 is placed in the fixed opening of the lower mounting plate 6, and a bucket-shaped through slot 27 is opened in the placement slot 26. The bottom of the bucket-shaped through slot 27 is connected to a plurality of injection tubes 28, and the bottom of the injection tube 28 is set to be conical, and the solder paste or flux used for welding between the microelectronic substrate and the pins of the electronic components is in a fluid state. The solder paste or flux is filled into the injection tube 28 in advance, and when the solder paste or flux overflows into the bucket-shaped through slot 27, the solder paste or flux will flow into the injection tube 28 along the inclined inner wall of the bucket-shaped through slot 27. When it is necessary to add solder paste or flux to the socket of the microelectronic substrate, the bottom of the injection tube 28 is close to the socket of the microelectronic substrate, and then the push injection assembly 400 is used to squeeze out the solder paste and flux in the injection tube 28.

[0039] The upper mounting plate 7 is provided with a push assembly 400 corresponding to the injection assembly 300. The push assembly 400 includes a mounting seat 29 and a push rod 30. The mounting seat 29 is placed in the fixed opening of the upper mounting plate 7. A plurality of push rods 30 are fixedly connected to the bottom of the mounting seat 29. The push rods 30 correspond to the injection tube 28 one by one. The bottom of the push rod 30 is also set to be conical. According to the position of the socket on the microelectronic substrate, the placement position of the placement slot 26 is determined so that the injection tube 28 corresponds to the socket. Then, according to the position of the placement slot 26, the placement position of the mounting seat 29 is determined so that the push rod 30 corresponds to the injection tube 28 one by one. When the upper mounting plate 7 is subsequently driven to move longitudinally, the push rod 30 enters the injection tube 28 to squeeze out the solder paste or flux in the injection tube 28.

[0040] It also includes a driving electric cylinder 31, which is arranged on the lifting slot frame 5. A connecting plate 32 is fixedly connected to the top of the upper mounting plate 7. The output end of the driving electric cylinder 31 is fixedly connected to the connecting plate 32. Starting the driving electric cylinder 31 can push the connecting plate 32 and the upper mounting plate 7 down, so that the push rod 30 enters the injection tube 28, completing the discharge operation of the solder paste and flux.

[0041] The working principle of the microelectronic substrate welding auxiliary tooling:

[0042] First, determine the size of the substrate placement plate 3 to be used, rotate the transmission worm 19, and through the meshing relationship between the transmission worm 19 and the transmission worm wheel 18, drive the bidirectional screw 17 to rotate, drive the two sliding slot frames 13 to move relative to each other, and the sliding slot frames 13 push the two sliding members 12 to slide in the curved slide rail 4, so that the moving positions of the four sliding members 12 correspond to each other, and the substrate placement plate 3 is clamped between the four fastening seats 15, and then place the clamping seat 8 in the corresponding installation port, and place the microelectronic substrate into the multiple placement slots 10. The microelectronic substrate is placed in the groove 10 so that the angle of the microelectronic substrate is in contact with the inner wall of the placement groove 10. When the placement groove 10 and the microelectronic substrate are not in close contact, the padding rod 11 can be inserted into the corresponding insertion hole to fix the padding rod 11 between the placement groove 10 and the microelectronic substrate. Then, the first driving motor 21 is started to drive the transmission screw 20 to rotate, so that the sliding seat 22 moves horizontally on the tooling frame 1. The sliding seat 22 drives the clamping frame 2 and the components on the clamping frame 2 to move together, and multiple microelectronic substrates are moved to the lower side of the lifting groove frame 5.

[0043] According to the position of the socket on the microelectronic substrate, the placement position of the placement slot 26 is determined so that the injection tube 28 corresponds to the socket. Then, according to the position of the placement slot 26, the placement position of the mounting seat 29 is determined so that the push rod 30 corresponds to the injection tube 28 one by one. Solder paste or flux is added to the injection tube 28. Then, the second drive motor 25 is started to drive the lifting screw 24 to rotate, and the lifting slot frame 5 is driven to move longitudinally between the two lifting brackets 23, so that the bottom of the injection tube 28 is close to the socket of the microelectronic substrate. Then, the driving electric cylinder 31 is started to push the connecting plate 32 and the upper mounting plate 7 down, so that the push rod 30 enters the injection tube 28, and the solder paste and flux are injected near the socket of the microelectronic substrate. Then, multiple microelectronic substrates are moved out from the bottom of the lifting slot frame 5, and the operator extends the pins of the electronic chip into the socket. The operator can use welding equipment to perform welding operations on the clamped microelectronic substrates.

[0044] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A microelectronic substrate welding auxiliary tool, comprising a tool frame (1), a clamping frame (2) being slidably arranged on the tool frame (1), characterized in that: Also includes: A substrate placement plate (3), wherein a plurality of mounting openings are formed on the substrate placement plate (3), and a substrate clamping assembly (100) is arranged between the plurality of mounting openings, wherein the substrate clamping assembly (100) is used to clamp microelectronic substrates of different shapes; A curved slide rail (4), wherein both sides of the interior of the clamping frame (2) are fixedly connected with the curved slide rails (4), and a plate clamping mechanism (200) is provided between the two curved slide rails (4), and the plate clamping mechanism (200) is used to clamp the plate (3) placed on the substrate; A lifting trough frame (5), wherein the lifting trough frame (5) is arranged on one side of the tooling frame (1), the bottom of the lifting trough frame (5) is fixedly connected to a lower mounting plate (6), the lifting trough frame (5) is longitudinally slidably connected to an upper mounting plate (7), a plurality of fixing openings are symmetrically provided between the lower mounting plate (6) and the upper mounting plate (7), a plurality of injection assemblies (300) are provided on the lower mounting plate (6), and a push injection assembly (400) is provided on the upper mounting plate (7) corresponding to the injection assembly (300).

2. The microelectronic substrate welding auxiliary tooling according to claim 1 is characterized in that: The substrate clamping assembly (100) comprises: A clamping seat (8), wherein the bottom of the clamping seat (8) is configured as an insertion section, the insertion section extends into the installation opening, the upper side of the clamping seat (8) is configured as a clamping section (9), and the clamping section (9) is provided with a placement groove (10); A padding rod (11) is provided on the inner bottom wall of the placement groove (10), and the padding rod (11) is placed on the insertion hole.

3. A microelectronic substrate welding auxiliary tooling according to claim 2, characterized in that: The plate clamping mechanism (200) comprises: Sliding members (12), the sliding members (12) being slidably arranged on both sides of the curved slide rail (4); A sliding slot frame (13), wherein the sliding slot frame (13) is slidably connected between the two sliding members (12) located on the same side, and a spacing adjustment component is provided between the clamping frame (2) and the two sliding slot frames (13); A placement seat (14), the middle portion of the clamping frame (2) being fixedly connected to the placement seat (14); A fastening seat (15), the top of each sliding member (12) is fixedly connected to the fastening seat (15), and the substrate placement plate (3) is clamped between four of the fastening seats (15).

4. The microelectronic substrate welding auxiliary tooling according to claim 3 is characterized in that: The spacing adjustment component comprises: A rotating seat (16), the rotating seat (16) being fixedly connected to the middle parts of both sides of the clamping frame (2); A bidirectional screw (17), wherein the bidirectional screw (17) is rotatably connected between the two rotating seats (16), and the middle portion of the sliding slot frame (13) is threadedly connected to one side of the bidirectional screw (17); A transmission worm wheel (18) is provided on a fixed sleeve on one side of the bidirectional screw (17), a transmission worm wheel (18) is meshed with a transmission worm (19), and the transmission worm (19) is rotatably connected to the rotating seat (16).

5. The microelectronic substrate welding auxiliary tooling according to claim 4 is characterized in that: Also includes: A transmission screw (20), the transmission screw (20) is rotatably connected in the tooling frame (1), a first drive motor (21) is arranged on the tooling frame (1), an output end of the first drive motor (21) is fixedly connected to the transmission screw (20), a sliding seat (22) is slidably connected to the tooling frame (1), the sliding seat (22) is threadedly connected to the transmission screw (20), and the clamping frame (2) is fixedly connected to the sliding seat (22).

6. The microelectronic substrate welding auxiliary tooling according to claim 5, characterized in that: Also includes: Lifting brackets (23), both sides of the tooling frame (1) are fixedly connected with the lifting brackets (23), and the lifting slot frame (5) is slidably connected between the two lifting brackets (23) via a sliding plate; A lifting screw (24), wherein the lifting screw (24) is rotatably connected inside one of the lifting brackets (23), the lifting screw (24) is threadedly connected to the sliding plate, a second drive motor (25) is arranged at the top of one of the lifting brackets (23), and the output end of the second drive motor (25) is fixedly connected to the lifting screw (24).

7. The microelectronic substrate welding auxiliary tooling according to claim 6, characterized in that: The injection assembly (300) comprises: A placement trough (26), wherein the placement trough (26) is placed in a fixing opening of the lower mounting plate (6), and a bucket-shaped through groove (27) is provided in the placement trough (26); Injection pipes (28), a plurality of injection pipes (28) are connected to the bottom of the bucket-shaped through groove (27), and the bottom of the injection pipes (28) is set to be conical.

8. The microelectronic substrate welding auxiliary tooling according to claim 7, characterized in that: The push injection assembly (400) comprises: A mounting seat (29), the mounting seat (29) being placed in the fixing opening of the upper mounting plate (7); A push rod (30), a plurality of push rods (30) are fixedly connected to the bottom of the mounting seat (29), the push rods (30) correspond one to one with the injection tubes (28), and the bottom of the push rods (30) is also set to be conical.

9. The microelectronic substrate welding auxiliary tooling according to claim 8, characterized in that: Also includes: A driving electric cylinder (31) is arranged on the lifting slot frame (5); a connecting plate (32) is fixedly connected to the top of the upper mounting plate (7); and an output end of the driving electric cylinder (31) is fixedly connected to the connecting plate (32).

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