Substrate processing equipment for semiconductor chilling plate production

Abstract

The invention discloses substrate processing equipment for semiconductor chilling plate production, and relates to the technical field of polishing equipment. Comprising a substrate polishing mechanism, the substrate polishing mechanism comprises a polishing motor, a fixed plate, a movable plate and a supporting plate, the top of the fixed plate is fixedly arranged at the bottom of the polishing motor through a support, and the movable plate is movably arranged at the bottom of the fixed plate through a plurality of elastic pressing devices. The to-be-polished substrate is preheated, the brittleness of the substrate is greatly reduced, the substrate is not prone to being broken during polishing, the polishing efficiency is improved, a low-temperature area is formed around the polishing wheel through the refrigeration piece, the cold guide frame and air and used for reducing the temperature of the contact area of the polishing wheel and the substrate, and the polishing effect is improved. The situation that the base plate is deformed due to local high temperature is avoided, the movable plate and the fixed plate are kept parallel through the multiple elastic pressing devices, the base plate can be stably pressed by the balls, warping of the base plate is avoided, and the polishing yield and polishing efficiency of the base plate are greatly improved.

Description

Technical Field

[0001] The invention relates to the technical field of polishing equipment, in particular to a substrate processing equipment for producing semiconductor refrigeration sheets. Background Art

[0002] A semiconductor refrigerator is a thermoelectric cooling device based on the Peltier effect. It consists of a thermocouple pair made of P-type and N-type semiconductor materials, and achieves heat transfer through direct current drive. The semiconductor refrigerator is supported by two ceramic substrates as the outer layer, and a metal layer (such as copper) is plated on the surface to form a conductive connection layer. The P-type and N-type semiconductor thermoelectric arms are welded or sintered through the conductive layer and arranged alternately into an "electrical series, thermal parallel" structure. The current circulates from the positive electrode to the conductive layer of the ceramic substrate to the P-type arm to the conductive layer to the N-type arm to the negative electrode, forming a closed loop. The surface flatness of the ceramic substrate is required to be high, and polishing is required during processing.

[0003] Existing refrigeration plate substrates are often susceptible to high temperature during polishing, causing deformation and warping of the substrates, with a high defect rate. In addition, the substrates are highly brittle and easily broken by direct grinding, which further increases the difficulty of substrate polishing, reduces the substrate polishing yield and processing efficiency, and brings serious troubles to the refrigeration plate manufacturing industry. Summary of the invention

[0004] To achieve the above-mentioned object, the present invention provides the following technical solutions: a substrate processing device for producing semiconductor refrigeration sheets, comprising a substrate polishing mechanism, the substrate polishing mechanism comprising a polishing motor, a fixed plate, a movable plate and a supporting plate, the top of the fixed plate is fixedly arranged on the bottom of the polishing motor through a bracket, and the movable plate is movably arranged on the bottom of the fixed plate through a plurality of spring-pressing devices;

[0005] A plurality of balls and dust suction holes are arranged inside the movable plate, a heat sink is fixedly arranged in the middle of the movable plate, a cooling plate is arranged at the bottom of the heat sink, a cooling guide frame is arranged at the bottom of the cooling plate, and the output end of the polishing motor extends to the inside of the heat sink and is provided with a polishing wheel;

[0006] The supporting plate is located directly below the movable plate, and a plurality of suction cup main bodies 1 are arranged inside the supporting plate. A valve seat for ventilation and chip removal is arranged at the bottom of the suction cup main body 1.

[0007] As a preferred technical solution of the present invention, a plurality of annular heat dissipation fins are arranged on the top of the heat dissipation rack, a plurality of heat dissipation cavities are formed between the plurality of annular heat dissipation fins, the depths of the plurality of heat dissipation cavities increase successively from the inside to the outside, a plurality of ventilation holes are arranged at the bottom of the heat dissipation fins, the plurality of heat dissipation cavities are interconnected through the ventilation holes, and an air inlet ring groove is arranged at the bottom of the movable plate in a circle at the bottom of the heat dissipation rack, and the air inlet ring groove is connected with the heat dissipation cavity through the ventilation hole.

[0008] As a preferred technical solution of the present invention, the cooling rack includes a plurality of annular cooling fins, and the plurality of annular cooling fins are all conical, and the bottom levels of the plurality of annular cooling fins decrease successively from the outside to the inside, and a plurality of ventilation holes 2 are arranged on a circle of the cooling fins, and the spaces between the plurality of annular cooling fins are interconnected through the ventilation holes 2, and the interior of the heat dissipation rack is conical with a large top opening and a small bottom opening.

[0009] As a preferred technical solution of the present invention, the spring-pressing device includes a stabilizing rod, a sealing sleeve 1 and a sealing sleeve 2. The stabilizing rod is fixedly arranged on the top of the movable plate and the top end of the stabilizing rod passes through the top of the fixed plate. The stabilizing rod is located between the movable plate and the movable plate, and a movable sleeve is provided with a spring. The sealing sleeve is arranged on the outside of the spring and the two ends of the sealing sleeve 1 are respectively fixedly connected to the bottom of the fixed plate and the top of the movable plate, the top end of the sealing sleeve 2 is connected to the top of the stabilizing rod, and the bottom end of the sealing sleeve 2 is connected to the top of the fixed plate.

[0010] As a preferred technical solution of the present invention, a plurality of ball holes are arranged inside the movable plate, the ball bearing is movably sleeved inside the ball hole, a plurality of exhaust holes are evenly spaced on the inner wall of the ball hole, a circle of sealing gasket 1 is jointly sleeved on the outside of the fixed plate and the movable plate, a circle of sealing gasket 2 is arranged in the middle position of the top of the fixed plate, the sealing gasket 2 is conical, and the top of the sealing gasket 2 is movably sleeved with the output end of the polishing motor through a bearing.

[0011] As a preferred technical solution of the present invention, a fixing tube is fixedly arranged at the bottom of the suction cup body, a connecting plate is arranged on one side of the fixing tube, the valve seat is rotatably arranged on the connecting plate through a damping shaft, the valve seat includes a vent joint and a chip removal joint, the vent joint is movably sleeved with the inside of the fixing tube, rubber columns are arranged inside the vent joint and the inside of the chip removal joint, a straight through hole is arranged inside the rubber column inside the vent joint, an inclined hole is arranged inside the rubber column inside the chip removal joint, and several of the fixed tubes are connected through an exhaust pipe.

[0012] As a preferred technical solution of the present invention, the substrate polishing mechanism also includes a workbench, the top of the workbench is provided with a gantry for driving the polishing motor and a dust suction enclosure, the top of the inner wall of the dust suction enclosure is provided with a circle of dust suction strip holes, the top of the fixed plate is provided with no less than one negative pressure pipe 1, and one side of the dust suction enclosure is provided with a negative pressure pipe 2.

[0013] As a preferred technical solution of the present invention, a driving groove and docking grooves on both sides of the driving groove are provided at the bottom of the workbench, the driving groove corresponds to the position of the dust collection enclosure, two baffles are symmetrically arranged inside the driving groove, the opposite ends of the two baffles are provided with avoidance openings and the inside of the avoidance openings are provided with sealing plates, dust collection openings are provided at the tops of the opposite ends of the two baffles, negative pressure pipes three are provided at the opposite ends of the two baffles, one end of the negative pressure pipe three away from the baffle passes through one side of the workbench, and heating plates are embedded in the bottoms of the opposite ends of the two baffles.

[0014] As a preferred technical solution of the present invention, a screw assembly for driving the two baffles to move away from each other or relative to each other is also provided inside the driving groove, a suction cup assembly for transferring the substrate is provided inside the docking groove, and an electric push rod 1 is fixedly provided at the bottom of the workbench and is located directly below the driving groove, the output end of the electric push rod 1 is connected to the bottom of the support plate, and the output end of the electric push rod 1 is also provided with an exhaust seat connected to the exhaust pipe.

[0015] As a preferred technical solution of the present invention, it also includes a conveyor line, wherein the number of the conveyor lines is two, and one end of the two conveyor lines extends from both sides of the workbench to the inside of the two docking grooves, respectively, for conveying the substrate to be polished and the polished substrate.

[0016] Compared with the prior art, the present invention provides a substrate processing device for producing semiconductor refrigeration chips, which has the following beneficial effects:

[0017] The substrate processing equipment for producing semiconductor refrigeration plates greatly reduces the brittleness of the substrate by preheating the substrate to be polished, making it less likely to break during polishing and improving the polishing efficiency. The refrigeration plate, the cooling frame and the air form a low-temperature area around the polishing wheel to reduce the temperature of the contact area between the polishing wheel and the substrate, avoiding deformation of the substrate due to local high temperature. Multiple spring-pressing devices keep the movable plate and the fixed plate parallel, and the ball bearings can steadily press the substrate to avoid warping of the substrate, greatly improving the polishing yield and polishing efficiency of the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the structure of a substrate processing device for producing semiconductor refrigeration chips proposed by the present invention;

[0019] Figure 2 A schematic diagram of the structure of a substrate polishing mechanism of a substrate processing device for producing semiconductor refrigeration sheets proposed by the present invention;

[0020] Figure 3 A schematic diagram of a support plate structure of a substrate processing device for producing semiconductor refrigeration chips proposed by the present invention;

[0021] Figure 4 A schematic diagram of a baffle structure of a substrate processing device for producing semiconductor refrigeration chips proposed by the present invention;

[0022] Figure 5 This is a schematic diagram of the structure of a fixed plate and a movable plate of a substrate processing device for producing semiconductor refrigeration chips proposed by the present invention;

[0023] Figure 6 This is a cross-sectional view of the structure of the fixed plate and the movable plate of a substrate processing device for producing semiconductor refrigeration chips proposed by the present invention;

[0024] Figure 7 A top view of a movable plate structure of a substrate processing device for producing semiconductor refrigeration chips proposed by the present invention;

[0025] Figure 8 A cross-sectional view of the heat dissipation frame structure of a substrate processing device for producing semiconductor refrigeration sheets proposed by the present invention;

[0026] Fig. 9 This is a cross-sectional view of the structure of a spring pressing device of a substrate processing equipment for producing semiconductor refrigeration sheets proposed by the present invention;

[0027] Fig.10 A structural cross-sectional view of a suction cup main body of a substrate processing device for producing semiconductor refrigeration sheets proposed by the present invention;

[0028] Fig.11 A cross-sectional view of the working table structure of a substrate processing device for producing semiconductor refrigeration chips proposed by the present invention;

[0029] Fig.12 A bottom view of a baffle structure of a substrate processing device for producing semiconductor refrigeration chips proposed by the present invention;

[0030] Fig.13 This is a schematic diagram of the conveyor line structure of a substrate processing equipment for producing semiconductor refrigeration sheets proposed by the present invention.

[0031] In the figure: 1, substrate polishing mechanism; 11, polishing motor; 111, polishing wheel; 12, fixed plate; 121, bracket; 122, sealing gasket 1; 123, sealing gasket 2; 124, negative pressure pipe 1; 13, movable plate; 131, ball bearing; 132, dust suction hole; 133, heat sink; 1331, heat sink fin; 1332, heat sink cavity; 1333, ventilation hole 1; 134, cooling plate; 135, cooling frame; 1351, cooling fin; 13 52, ventilation hole 2; 136, air inlet ring groove; 137, ball hole; 1371, exhaust hole; 14, support plate; 141, suction cup body 1; 142, fixing pipe; 143, valve seat; 144, connecting plate; 145, ventilation joint; 146, chip removal joint; 147, rubber column; 148, exhaust pipe; 149, electric push rod 1; 1491, exhaust seat; 15, spring pressure device; 151, stabilizing rod; 152, sealing sleeve 1; 153, sealing sleeve 2; 154, spring; 16, workbench; 161, dust collection enclosure; 162, dust collection strip hole; 163, negative pressure pipe 2; 164, gantry; 1641, linear module 1; 1642, linear module 2; 1643, column; 1644, drive plate; 1645, electric push rod 2; 17, drive slot; 171, baffle; 1711, sealing plate; 1712, dust collection port; 1713, negative pressure pipe 3; 1714, heating plate; 175, Screw assembly; 1751, screw body; 1752, nut seat; 1753, screw motor; 18, docking groove; 181, suction cup assembly; 182, linear module three; 183, sliding rod; 184, mounting plate; 185, cylinder; 186, suction cup frame; 187, suction cup body two; 188, negative pressure tube four; 189, through-beam sensor; 2, conveyor line; 21, main conveyor belt; 22, auxiliary conveyor belt; 23, adjustment seat; 24, adjustment rod. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] See also Figure 1-13 A substrate processing device for producing semiconductor refrigeration sheets includes a substrate polishing mechanism 1, which includes a polishing motor 11, a fixed plate 12, a movable plate 13 and a support plate 14. The top of the fixed plate 12 is fixed to the bottom of the polishing motor 11 through a bracket 121, and the movable plate 13 is movably arranged at the bottom of the fixed plate 12 through a plurality of spring-pressing devices 15.

[0034] A plurality of ball bearings 131 and dust suction holes 132 are arranged inside the movable plate 13, a heat sink 133 is fixedly arranged in the middle position of the movable plate 13, a cooling plate 134 is arranged at the bottom of the heat sink 133, a cooling guide frame 135 is arranged at the bottom of the cooling plate 134, and the output end of the polishing motor 11 extends to the inside of the heat sink 133 and is provided with a polishing wheel 111.

[0035] The supporting plate 14 is located directly below the movable plate 13 , and a plurality of suction cup bodies 141 are arranged inside the supporting plate 14 . A valve seat 143 for ventilation and chip removal is arranged at the bottom of the suction cup body 141 .

[0036] As a specific technical solution of this embodiment, a plurality of annular heat dissipation fins 1331 are arranged on the top of the heat dissipation frame 133, and a plurality of heat dissipation cavities 1332 are formed between the plurality of annular heat dissipation fins 1331. The depths of the plurality of heat dissipation cavities 1332 increase successively from the inside to the outside. A plurality of ventilation holes 1333 are arranged on the bottom of the heat dissipation fins 1331, and the plurality of heat dissipation cavities 1332 are interconnected through the ventilation holes 1333. The bottom of the movable plate 13 is provided with an air inlet ring groove 136 located in a circle at the bottom of the heat dissipation frame 133, and the air inlet ring groove 136 is connected to the heat dissipation cavity 1332 through the ventilation holes 1333.

[0037] In this implementation plan, refer to Figure 6 and Figure 8 The bottom of the inner wall of the heat dissipation cavity 1332 is made into an arc-shaped transition near the ventilation hole 1333. This design prevents the interior of the heat dissipation cavity 1332 from contacting impurities and waste chips. When air enters the outermost heat dissipation cavity 1332 through the air inlet ring groove 136, the impurities and waste chips pass through the ventilation hole 1333 from the outermost heat dissipation cavity 1332 to the innermost heat dissipation cavity 1332 step by step. The arc can prevent impurities and waste chips from accumulating in dead corners, thereby improving the cleaning efficiency. In addition, the air flows between several heat dissipation cavities 1332 and fully contacts several thermal conductive fins, thereby ensuring the heat dissipation efficiency of the heat sink 133.

[0038] As a specific technical solution of this embodiment, the cooling rack 135 includes a plurality of annular cooling fins 1351, each of which is conical, and the bottom levels of the plurality of annular cooling fins 1351 decrease successively from the outside to the inside, and a plurality of ventilation holes 1352 are arranged on a circle of the cooling fins 1351. The spaces between the plurality of annular cooling fins 1351 are interconnected through the ventilation holes 1352, and the interior of the heat dissipation rack 133 is conical with a large top opening and a small bottom opening.

[0039] In this implementation plan, refer to Figure 8When the polishing wheel 111 rotates at a high speed, a cyclone is generated, which disturbs the surrounding air and starts the cooling plate 134. The cooling surface of the cooling plate 134 is opposite to the cooling fin 1351, and the heating surface is opposite to the heat sink 133. When the air passes through the cooling fin 1351, the air temperature is reduced, so that the cooling plate 134, the cooling frame 135 and the air form a low-temperature area around the polishing wheel 111. The setting of the low-temperature area is used to reduce the temperature of the contact area between the polishing wheel 111 and the substrate, avoiding the deformation of the substrate due to local high temperature, and ensuring the polishing yield of the substrate. Although the cooling frame 135 is not in direct contact with the substrate, the cooling frame 135 is very close to the substrate, and with the specially designed cooling fin 1351, the air is fully cooled and then impacts the substrate, thereby cooling the polishing area. The heat sink 133 with an internal conical design, together with the cyclone generated when the polishing wheel 111 rotates at a high speed, is guided by the heat sink 133, so that the cyclone rises in a spiral shape, which can accelerate the cleaning of impurities and waste generated during polishing and avoid accumulation.

[0040] As a specific technical solution of this embodiment, the spring-pressing device 15 includes a stabilizing rod 151, a sealing sleeve 152 and a sealing sleeve 2 153. The stabilizing rod 151 is fixedly arranged on the top of the movable plate 13 and the top of the stabilizing rod 151 passes through the top of the fixed plate 12. The stabilizing rod 151 is located between the movable plates 13 and 13, and a spring 154 is provided on the movable sleeve. The sealing sleeve 152 is sleeved on the outside of the spring 154 and the two ends of the sealing sleeve 152 are respectively fixedly connected to the bottom of the fixed plate 12 and the top of the movable plate 13. The top of the sealing sleeve 2 153 is connected to the top of the stabilizing rod 151, and the bottom end of the sealing sleeve 2 153 is connected to the top of the fixed plate 12.

[0041] In this embodiment, the design of the spring pressing device 15 is shown in FIG. Figure 6-9 The bottom level of the ball 131 is lower than the polishing wheel 111. When the ball 131 contacts the substrate, the fixed plate 12 presses down the movable plate 13 through the spring pressure device 15. The movable plate 13 cooperates with the fixed plate 12 to compress the spring 154, so that the polishing wheel 111 contacts the substrate for polishing. The movable plate 13 continuously presses the substrate through the elastic force of the spring 154. At the same time, as the polishing wheel 111 moves back and forth and left and right, the movable plate 13 and the fixed plate 12 will also move, so that the ball 131 rolls on the top of the substrate. The ball 131 is made of silicon nitride ceramic material and a DLC coating is sprayed on its outside, so that the ball 131 rotates more smoothly and is not prone to static electricity. The setting of multiple spring pressure devices 15 ensures that the movable plate 13 drives the ball 131 to be stably pressed on the top of the substrate and will not rise due to negative pressure.

[0042] As a specific technical solution of this embodiment, a plurality of ball holes 137 are provided inside the movable plate 13, and the ball 131 is movably sleeved inside the ball hole 137. A plurality of exhaust holes 1371 are evenly spaced on the inner wall of the ball hole 137. A circle of sealing gasket 122 is jointly sleeved on the outside of the fixed plate 12 and the movable plate 13. A circle of sealing gasket 2 123 is provided in the middle position of the top of the fixed plate 12. The sealing gasket 2 123 is conical, and the top of the sealing gasket 2 123 is movably sleeved on the output end of the polishing motor 11 through a bearing.

[0043] In this embodiment, the dust suction hole 132 is arranged at intervals from the ball 131, and the exhaust holes 1371 on the inner wall of the ball hole 137 allow dust to pass through the holes. When used in conjunction with the dust suction hole 132, the dust suction efficiency is greatly guaranteed, and the dust and waste generated during the polishing process will not be scattered around and affect the working environment. The setting of the sealing gasket 122 seals the space between the movable plate 13 and the fixed plate 12, thereby ensuring the exhaust efficiency of the negative pressure tube 124. The sealing gasket 2 123 cooperates with the bearing to ensure the sealing between the fixed plate 12 and the output end of the polishing motor 11, thereby ensuring the exhaust efficiency of the negative pressure tube 124.

[0044] As a specific technical solution of this embodiment, a fixed tube 142 is fixedly provided at the bottom of the suction cup body 141, a connecting plate 144 is provided on one side of the fixed tube 142, a valve seat 143 is rotatably provided on the connecting plate 144 through a damping shaft, the valve seat 143 includes a vent joint 145 and a chip removal joint 146, the vent joint 145 is movably sleeved with the inside of the fixed tube 142, rubber columns 147 are provided inside the vent joint 145 and the inside of the chip removal joint 146, a straight through hole is provided inside the rubber column 147 inside the vent joint 145, an inclined hole is provided inside the rubber column 147 inside the chip removal joint 146, and several fixed tubes 142 are connected through an exhaust pipe 148.

[0045] In this embodiment, a plurality of through holes are provided inside the support plate 14 for installing the suction cup body 141, and the fixed tube 142 is fixedly provided inside the through hole. The suction cup body 141 is made of rubber. The number of suction cup bodies 141 enabled is adjusted according to the size of the substrate. When the suction cup body 141 is not in use, in order to prevent dust and waste chips from entering and accumulating inside the suction cup body 141, the valve seat 143 is rotated so that the chip removal joint 146 is opposite to the fixed tube 142, and the rubber column 147 inside the chip removal joint 146 blocks the fixed tube 142. At the same time, the inclined hole inside the rubber column 147 guides the dust and waste chips entering from the suction cup body 141, so that the waste chips fall into the top of the baffle 171 through the inclined hole and will not accumulate inside the suction cup body 141. The setting of the damping shaft has the function of arbitrary rotation and positioning, which is convenient for users to switch between the chip removal joint 146 and the ventilation joint 145, making it more convenient to use.

[0046] As a specific technical solution of this embodiment, the substrate polishing mechanism 1 also includes a workbench 16, and a gantry 164 for driving the polishing motor 11 and a dust collection enclosure 161 are arranged on the top of the workbench 16. A circle of dust collection strip holes 162 are arranged on the top of the inner wall of the dust collection enclosure 161, and at least one negative pressure pipe 1 124 is arranged on the top of the fixed plate 12, and a negative pressure pipe 2 163 is arranged on one side of the dust collection enclosure 161.

[0047] In the present embodiment, negative pressure tube 1 124, negative pressure tube 2 163 and negative pressure tube 3 1713 are all connected to the negative pressure gas source through a hose when in use. The setting of the hose will not affect the movement of the fixed plate 12 and the baffle 171. The vacuum seat 1491 is connected to an independent negative pressure gas source when in use, thereby ensuring the stability of the suction cup body 141. The negative pressure tube 2 163 cooperates with the dust collection enclosure 161 to absorb the dust and waste around the fixed plate 12 and the movable plate 13, thereby ensuring the working environment. The negative pressure tube 124 cooperates with the vacuum hole, the dust collection hole 132 and the heat dissipation rack 133 to absorb the impurities and waste generated during the polishing process.

[0048] As a specific technical solution of this embodiment, the gantry 164 includes a linear module 1641 and a linear module 1642. The number of linear modules 1 1641 is two. The two linear modules 1641 are fixedly arranged on the top of the workbench 16 and are respectively located on both sides of the dust collection enclosure 161. Columns 1643 are arranged at the bottom of both ends of the linear module 1642. The bottom ends of the two columns 1643 are respectively connected to the output ends of the two linear modules 1 1641. A driving plate 1644 is arranged at the output end of the linear module 1642. An electric push rod 1645 is arranged on the top of the driving plate 1644. The polishing motor 11 is slidably arranged on one side of the driving plate 1644 through a slide rail. The output end of the electric push rod 1645 is connected to the top of the polishing motor 11. The gantry 164 has the function of driving the polishing motor 11 to move in the three-axis directions of X, Y, and Z, so that the polishing motor 11 can fully polish the substrate.

[0049] As a specific technical solution of this embodiment, a driving groove 17 and docking grooves 18 located on both sides of the driving groove 17 are provided at the bottom of the workbench 16. The driving groove 17 corresponds to the position of the dust collection enclosure 161. Two baffles 171 are symmetrically arranged inside the driving groove 17. The opposite ends of the two baffles 171 are provided with avoidance openings and the inside of the avoidance openings are provided with sealing plates 1711. Dust collection openings 1712 are provided at the tops of the opposite ends of the two baffles 171. Negative pressure pipe three 1713 is provided at the opposite ends of the two baffles 171. One end of the negative pressure pipe three 1713 away from the baffle 171 passes through one side of the workbench 16. A heating plate 1714 is embedded in the bottoms of the opposite ends of the two baffles 171.

[0050] In this embodiment, the avoidance port cooperates with the sealing plate 1711 to clamp the exhaust seat 1491, and the heating plate 1714 is used to preheat the substrate before polishing to reduce the brittleness of the substrate, so that the substrate is not easy to break during polishing and is easier to polish. The dust suction port 1712 on the top of the baffle 171 is used to absorb waste chips and dust that fall on the baffle 171. When the two baffles 171 move away from each other, the waste chips that have not been sucked away on the baffle 171 are gathered to the position of the dust suction port 1712 due to the scratches on the bottom of the inner wall of the dust suction enclosure 161, and fall into the dust suction port 1712, and the top of the baffle 171 is cleaned. Finally, the impurities and waste chips are sucked away through the negative pressure pipe three 1713.

[0051] As a specific technical solution of this embodiment, a screw assembly 175 for driving the two baffles 171 to move away from each other or relative to each other is also provided inside the driving groove 17, a suction cup assembly 181 for transferring the substrate is provided inside the docking groove 18, and an electric push rod 149 is also fixedly provided at the bottom of the workbench 16 and located directly below the driving groove 17. The output end of the electric push rod 149 is connected to the bottom of the support plate 14 and the output end of the electric push rod 149 is also provided with an exhaust seat 1491 connected to the exhaust pipe 148.

[0052] In this embodiment, the vacuum seat 1491 is connected to an independent negative pressure air source, which can be an air compressor, so that the suction cup body 141 can suck the substrate. The screw assembly 175 includes a screw body 1751, a nut seat 1752 and a screw motor 1753. The screw body 1751 has two screw bodies 1751, which are respectively located on both sides of the two baffles 171. The screw body 1751 is provided with two sections of threads in opposite directions and the two sections of threads are both sleeved with nut seats 1752. The two nut seats 1752 are respectively connected to one side of the two baffles 171, and one end of the screw body 1751 is connected to the screw motor 1753. The output end is connected to the output end, the screw motor 1753 is started to drive the screw body 1751 to rotate, and the two nut seats 1752 on the screw body 1751 simultaneously drive the two baffles 171 to move relative to or away from each other according to the rotation direction. After the two baffles 171 move relative to each other, the electric push rod 149 can drive the support plate 14 to rise freely. When the electric push rod 149 drives the support plate 14 to absorb the substrate to be polished and rise, the screw motor 1753 is started to drive the two baffles 171 to move relative to each other and clamp the exhaust seat 1491, thereby preventing the waste chips generated during the grinding process from falling into the bottom of the workbench 16.

[0053] The suction cup assembly 181 includes a linear module 3 182 and a sliding rod 183. The sliding rod 183 is slidably arranged at the bottom of the linear module 3 182 through a slide rail. The output end of the linear module 3 182 is connected to the top of the sliding rod 183. A mounting plate 184 is arranged on one side of the sliding rod 183. A cylinder 185 is arranged on the top of the mounting plate 184. The output end of the cylinder 185 extends to the bottom of the mounting plate 184 and is provided with a suction cup frame 186. A plurality of suction cup bodies 2 187 are arranged at the bottom of the suction cup frame 186. A negative pressure pipe 4 188 connected to the plurality of suction cup bodies 2 187 is arranged at the top of the suction cup frame 186. The negative pressure pipe 4 188 is connected to an independent negative pressure gas source when in use. The suction cup assembly 181 is used to suck and move the substrate on the conveyor line 2 to the pallet 1 4, or the substrate on the support plate 14 is sucked and moved to the conveyor line 2. Both sides of the inner wall of the docking groove 18 are also provided with a beam sensor 189 for detecting the position of the substrate. After detecting that the substrate is in place on the conveyor line 2, the linear module three 182 is started to move the suction cup frame 186 to the top of the substrate, and the cylinder 185 is started to drive the suction cup frame 186 to descend, so that the suction cup body 187 contacts the substrate, and the negative pressure gas source is started to suck the substrate through the negative pressure pipe four 188 and the suction cup body, and the cylinder 185 is started to rise and reset, and then the linear module three 182 is started to drive the suction cup frame 186 to move to the top of the support plate 14, and then the cylinder 185 is started to drive the suction cup frame 186 to descend, and the negative pressure air pipe is closed, so that the substrate falls on the support plate 14, and then the suction cup assembly 181 is reset, and the polishing operation can be carried out.

[0054] As a specific technical solution of this embodiment, it also includes a conveyor line 2, and the number of conveyor lines 2 is two. One end of the two conveyor lines 2 extends from both sides of the workbench 16 to the inside of the two docking grooves 18, respectively, for conveying substrates to be polished and substrates that have been polished.

[0055] As a specific technical solution of this embodiment, the conveyor line 2 includes a main conveyor belt 21 and auxiliary conveyor belts 22 arranged on both sides of the top of the main conveyor belt 21. The auxiliary conveyor belt 22 has the same conveying speed as the main conveyor belt 21. Adjustment seats 23 are arranged on both sides of the main conveyor belt 21. An adjustment rod 24 is movably arranged on the top of the adjustment seat 23. One end of the adjustment rod 24 extends to the top of the main and auxiliary conveyor belts 22 and is connected thereto. The conveyor line 2 is a relatively mature prior art. The conveyor line 2 has been widely used in industrial assembly line production and is responsible for quickly transferring and processing materials, products, parts, etc. between different workstations. The main conveyor belt 21 and the auxiliary conveyor belt 22 are driven by independent motors respectively, and the conveying speeds of the main conveyor belt 21 and the auxiliary conveyor belt 22 are the same. When conveying the substrate, the auxiliary conveyor belt 22 contacts with the substrate and guides it. At the same time, the conveying speed of the auxiliary conveyor belt 22 is the same as that of the main conveyor belt 21, so that the substrate will not stagnate when contacting the auxiliary conveyor belt 22, and the substrate will not be scratched. At the same time, the conveying efficiency of the substrate is guaranteed. There is a waist-shaped hole inside the adjustment seat 23, and the adjustment seat 23 is locked on one side of the main conveyor belt 21 by bolts. The height of the adjustment seat 23 can be adjusted by the bolts. One end of the adjustment rod 24 is inserted into the adjustment seat 23 and locked by bolts, and the other end is fixed to the external fixing frame of the auxiliary conveyor belt 22. The adjustment rod 24 is used to support the auxiliary conveyor belt 22. At the same time, the distance between the two auxiliary conveyor belts 22 can be adjusted. After the adjustment is completed, it can be locked again by bolts. It can adapt to substrates of different widths for transportation.

[0056] When in use, the substrate to be processed is transported to the inside of the docking groove 18 through the conveyor line 2 on one side of the workbench 16, the through-beam sensor 189 detects that the substrate is in place, starts the suction cup assembly 181, moves the substrate to be polished on the conveyor line 2 to the support plate 14, starts the heating plate 1714, starts the electric push rod 149 through the support plate 14 to drive the substrate on the top to contact the heating plate 1714 for preheating before polishing, and after the heating is completed, starts the screw rod assembly 175 to drive the two baffles 171 to move in opposite directions, and starts the electric push rod 11 49 drives the support plate 14 and the substrate sucked on the top thereof to rise and enter the interior of the dust collection enclosure 161, then starts the screw assembly 175 to drive the two baffles 171 to move relative to clamp the exhaust seat 1491, starts the gantry 164 to drive the polishing motor 11 to move until the substrate rises, the polishing motor 11 descends to drive the polishing wheel 111 to contact the substrate, starts the polishing motor 11 to drive the polishing wheel 111 to rotate, and cooperates with the gantry 164 to perform mobile polishing, and at the same time starts the negative pressure pipe 1 124, the negative pressure pipe 2 163, and the negative pressure pipe 3 171 3 is connected to the negative pressure air source and the cooling plate 134. When the polishing wheel 111 rotates at a high speed, a cyclone is generated to disturb the surrounding air, and the cooling plate 134 is started. The cooling surface of the cooling plate 134 is opposite to the cooling fin 1351, and the heating surface is opposite to the heat sink 133. When the air passes through the cooling fin 1351, the air temperature is reduced, so that the cooling plate 134, the cooling frame 135 and the air form a low-temperature area around the polishing wheel 111. The setting of the low-temperature area is used to reduce the temperature of the contact area between the polishing wheel 111 and the substrate. To avoid the deformation of the substrate caused by local high temperature, multiple spring-pressing devices 15 keep the movable plate 13 and the fixed plate 12 parallel, and the ball 131 can steadily press the substrate to avoid warping of the substrate. After polishing is completed, start the screw assembly 175 to drive the two baffles 171 to move in opposite directions, and then start the electric push rod 149 to descend into place, close the negative pressure air source connected to the suction cup body 141, and start another set of suction cup assemblies 181 to suck the polished substrate and move it to another conveyor line 2.

[0057] In summary, the substrate processing equipment for producing semiconductor refrigeration plates greatly reduces the brittleness of the substrate by preheating the substrate to be polished, making it less likely to break during polishing and improving the polishing efficiency. The refrigeration plate 134, the cooling frame 135 and the air form a low-temperature area around the polishing wheel 111, which is used to reduce the temperature of the contact area between the polishing wheel 111 and the substrate, avoiding deformation of the substrate due to local high temperature. Multiple spring-pressing devices 15 keep the movable plate 13 and the fixed plate 12 parallel, and the ball 131 can press the substrate steadily to avoid warping of the substrate, greatly improving the polishing yield and polishing efficiency of the substrate.

[0058] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A substrate processing device for producing semiconductor cooling sheets, comprising a substrate polishing mechanism (1), characterized in that: The substrate polishing mechanism (1) comprises a polishing motor (11), a fixed plate (12), a movable plate (13) and a supporting plate (14); the top of the fixed plate (12) is fixedly arranged on the bottom of the polishing motor (11) via a bracket (121); and the movable plate (13) is movably arranged on the bottom of the fixed plate (12) via a plurality of spring-pressing devices (15); A plurality of balls (131) and dust suction holes (132) are arranged inside the movable plate (13); a heat sink (133) is fixedly arranged in the middle of the movable plate (13); a cooling plate (134) is arranged at the bottom of the heat sink (133); a cooling guide frame (135) is arranged at the bottom of the cooling plate (134); and an output end of the polishing motor (11) extends to the inside of the heat sink (133) and is provided with a polishing wheel (111); The support plate (14) is located directly below the movable plate (13), and a plurality of suction cup main bodies (141) are arranged inside the support plate (14), and a valve seat (143) for ventilation and chip removal is arranged at the bottom of each suction cup main body (141).

2. The substrate processing equipment for producing semiconductor refrigeration chips according to claim 1, characterized in that: A plurality of annular heat dissipation fins (1331) are arranged on the top of the heat dissipation frame (133), a plurality of heat dissipation cavities (1332) are formed between the plurality of annular heat dissipation fins (1331), the depths of the plurality of heat dissipation cavities (1332) are increased from the inside to the outside, a plurality of ventilation holes (1333) are arranged on the bottom of the heat dissipation fins (1331), the plurality of heat dissipation cavities (1332) are interconnected through the ventilation holes (1333), and an air inlet ring groove (136) is arranged on the bottom of the movable plate (13) and is located in a circle at the bottom of the heat dissipation frame (133), and the air inlet ring groove (136) is connected to the heat dissipation cavity (1332) through the ventilation holes (1333).

3. The substrate processing equipment for producing semiconductor refrigeration chips according to claim 1, characterized in that: The cooling rack (135) includes a plurality of annular cooling fins (1351), each of which is conical, and the bottom levels of the plurality of annular cooling fins (1351) decrease from the outside to the inside. A plurality of ventilation holes (1352) are arranged on a circle of the cooling fins (1351), and the spaces between the plurality of annular cooling fins (1351) are interconnected through the ventilation holes (1352). The interior of the heat dissipation rack (133) is conical with a large top opening and a small bottom opening.

4. The substrate processing equipment for producing semiconductor refrigeration chips according to claim 1, characterized in that: The spring-pressing device (15) comprises a stabilizing rod (151), a sealing sleeve 1 (152) and a sealing sleeve 2 (153); the stabilizing rod (151) is fixedly arranged on the top of the movable plate (13) and the top end of the stabilizing rod (151) passes through the top of the fixed plate (12); a section of the stabilizing rod (151) between the movable plates (13) and the movable sleeve (13) is provided with a spring (154); the sealing sleeve 1 (152) is sleeved on the outside of the spring (154) and the two ends of the sealing sleeve 1 (152) are respectively fixedly connected to the bottom of the fixed plate (12) and the top of the movable plate (13); the top end of the sealing sleeve 2 (153) is connected to the top of the stabilizing rod (151) and the bottom end of the sealing sleeve 2 (153) is connected to the top of the fixed plate (12).

5. The substrate processing equipment for producing semiconductor refrigeration chips according to claim 1, characterized in that: The movable plate (13) is provided with a plurality of ball holes (137) inside, the ball (131) is movably sleeved inside the ball hole (137), a plurality of exhaust holes (1371) are opened at equal intervals on the inner wall of the ball hole (137), the fixed plate (12) and the movable plate (13) are sleeved with a circle of sealing gasket 1 (122) outside, a circle of sealing gasket 2 (123) is provided at the middle position of the top of the fixed plate (12), the sealing gasket 2 (123) is conical, and the top of the sealing gasket 2 (123) is movably sleeved with the output end of the polishing motor (11) through a bearing.

6. The substrate processing equipment for producing semiconductor cooling sheets according to claim 1, characterized in that: A fixed tube (142) is fixedly provided at the bottom of the suction cup body (141), a connecting plate (144) is provided on one side of the fixed tube (142), the valve seat (143) is rotatably provided on the connecting plate (144) via a damping shaft, the valve seat (143) comprises a vent joint (145) and a chip removal joint (146), the vent joint (145) is movably sleeved with the inside of the fixed tube (142), the inside of the vent joint (145) and the inside of the chip removal joint (146) are both provided with rubber columns (147), the rubber columns (147) inside the vent joint (145) are provided with straight through holes, the rubber columns (147) inside the chip removal joint (146) are provided with inclined holes, and a plurality of the fixed tubes (142) are connected via an exhaust pipe (148).

7. The substrate processing equipment for producing semiconductor cooling sheets according to claim 1, characterized in that: The substrate polishing mechanism (1) also includes a workbench (16), the top of the workbench (16) is provided with a gantry (164) for driving a polishing motor (11) and a dust collection enclosure (161), the top of the inner wall of the dust collection enclosure (161) is provided with a circle of dust collection strip holes (162), the top of the fixed plate (12) is provided with not less than one negative pressure pipe 1 (124), and one side of the dust collection enclosure (161) is provided with a negative pressure pipe 2 (163).

8. The substrate processing equipment for producing semiconductor cooling sheets according to claim 7, characterized in that: The bottom of the workbench (16) is provided with a driving groove (17) and docking grooves (18) located on both sides of the driving groove (17); the driving groove (17) corresponds to the position of the dust collection enclosure (161); two baffles (171) are symmetrically arranged inside the driving groove (17); avoidance openings are arranged at the opposite ends of the two baffles (171) and sealing plates (1711) are arranged inside the avoidance openings; dust collection openings (1712) are arranged at the tops of the opposite ends of the two baffles (171); negative pressure pipes (1713) are arranged at the opposite ends of the two baffles (171); one end of the negative pressure pipe (1713) away from the baffle (171) passes through one side of the workbench (16); and heating plates (1714) are embedded at the bottoms of the opposite ends of the two baffles (171).

9. The substrate processing equipment for producing semiconductor cooling sheets according to claim 8, characterized in that: The driving groove (17) is also provided with a screw assembly (175) for driving the two baffles (171) to move in opposite directions or relative to each other. The docking groove (18) is provided with a suction cup assembly (181) for transferring the substrate. The bottom of the workbench (16) is also fixedly provided with an electric push rod (149) located directly below the driving groove (17). The output end of the electric push rod (149) is connected to the bottom of the support plate (14) and the output end of the electric push rod (149) is also provided with an exhaust seat (1491) connected to the exhaust pipe (148).

10. The substrate processing equipment for producing semiconductor cooling sheets according to claim 1, characterized in that: It also includes a conveyor line (2), wherein the number of the conveyor lines (2) is two, and one end of the two conveyor lines (2) respectively extends from both sides of the workbench (16) to the inside of two docking grooves (18), and is used to convey substrates to be polished and substrates that have been polished, respectively.

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