Silicon carbide wafer grinding equipment

Abstract

The invention relates to the technical field of silicon wafer processing, in particular to silicon carbide wafer grinding equipment which comprises an operation table, a placement groove is formed in the upper surface of the operation table, a positioning mechanism is mounted in the placement groove, a mounting frame is fixed to the rear end of the operation table, and a grinding machine is slidably connected to the front end of the mounting frame. A lifting assembly is mounted between the mounting frame and the grinding machine; the silicon carbide wafer is positioned through the positioning mechanism, the silicon carbide wafer is prevented from being located in the containing groove, the situation that dust is scattered all around is avoided, the silicon wafer is clamped in cooperation with the clamping assembly, the height of the clamping block is controlled according to the thickness of the silicon wafer in the clamping process, and therefore the situation that the height of the clamping block exceeds the thickness of the silicon wafer is avoided; and finally, the lifting assembly is used for controlling the height of the grinding machine, motor control or manual control is selected according to conditions, the control effect is more accurate, and damage to the silicon wafer is avoided.

Description

Technical Field

[0001] The invention relates to the technical field of silicon wafer processing, and in particular to a silicon carbide wafer grinding device. Background Art

[0002] Silicon carbide (SiC), as a wide bandgap semiconductor material, is widely used in power electronics, communications, automobiles, aerospace and other fields due to its excellent high temperature, high power, high frequency performance and corrosion resistance. However, the hardness of silicon carbide material is relatively high, reaching Mohs hardness 9, which makes it face great challenges in the manufacturing process, especially in the grinding and polishing of wafers. Traditional silicon wafer processing methods are not suitable for silicon carbide, so special equipment is required for grinding, cutting and polishing to ensure the flatness, surface quality and subsequent device performance of the wafer; For example, in the prior art, there is a grinding device for silicon wafer production and processing with publication number CN217371658U. This device adjusts the relative position of the brush head relative to the turntable by adjusting the bolt, so as to facilitate the adjustment of the position of the brush head relative to the silicon wafer. In addition, it is convenient to guide the adjustment direction of the support plate through the complementary action between the slider and the slide groove, so as to facilitate the support of the support plate to the connecting column, thereby effectively ensuring that the brush head grinds the silicon wafer on the turntable. However, this device cannot accurately position the silicon wafer. Since the silicon wafer is brittle, it is easy to be damaged by shaking. At the same time, when grinding the silicon wafer, due to the different thickness of the silicon wafer, the grinding head may interfere with the height of the clamping device. And during grinding, due to the differences between individual silicon wafers, it is difficult to adjust the height of the grinder according to the individual differences, which leads to damage to the silicon wafer during grinding. In view of the above technical defects, a solution is now proposed. Summary of the invention

[0003] In order to overcome the above-mentioned defects of the prior art, the present invention provides a silicon carbide wafer grinding equipment, which accurately positions the silicon wafer through a positioning mechanism, and cooperates with a clamping assembly to ensure that the clamping block is lower than the thickness of the silicon wafer, and cooperates with a lifting assembly to accurately control the height of the grinder to ensure that the silicon wafer will not be damaged, so as to solve the problems raised in the above-mentioned background technology.

[0004] In order to achieve the above-mentioned purpose, the present invention adopts the following technical scheme: a silicon carbide wafer grinding equipment, including an operating table, a placement groove is opened on the upper surface of the operating table, a positioning mechanism is installed inside the placement groove, a mounting frame is fixed to the rear end of the operating table, a grinder is slidably connected to the front end of the mounting frame, and a lifting assembly is installed between the mounting frame and the grinder.

[0005] Furthermore, the positioning mechanism includes two guide rods symmetrically fixed inside the two sides of the placement groove, the guide rods are rotatably connected to the inside with a first screw rod, the top end of the first screw rod passes through and extends to the outside of the guide rod where a first knob is fixed, and the outer layer of the first screw rod is sleeved with a limit plate slidably connected to the outside of the guide rod, and the outer layer of the guide rod is provided with a first through groove at the connection between the limit plate and the first screw rod.

[0006] Furthermore, a guide block is slidably connected to the outer layer of the guide rod at a position above the limit plate, a lifting plate is fixed between the two guide blocks, the bottom of the lifting plate is rotatably connected to a rotating plate, a fixing rod is fixed to the bottom of the rotating plate, a spiral blade is fixed to the bottom of the fixing rod, a fixing cylinder is fixed to the position of the spiral blade inside the placement groove, and a spiral hole is opened inside the fixing cylinder corresponding to the inside of the spiral blade.

[0007] Furthermore, a placement cavity is provided inside the lifting plate, a plurality of electric suction cups are fixed at equal intervals inside the placement cavity, three guide grooves are provided at equal intervals inside the outer layer of the lifting plate at positions corresponding to the placement cavity, a movable block is slidably connected inside the guide groove, a clamping assembly is installed inside the movable block, a spiral groove is provided on the upper surface of the rotating plate, and the movable block is slidably connected to the spiral groove.

[0008] Furthermore, the clamping assembly includes a clamping block slidably connected to the inside of the movable block, a guide column rotatably connected to the inside of the movable block passes through the inside of the clamping block, a second screw rod is rotatably connected to the inside of the guide column, the second screw rod is rotatably connected to the clamping block, and the top end of the second screw rod passes through and extends to the outside of the guide column where a second knob is fixed, and a second through groove is provided on the outer layer of the guide column corresponding to the connection between the second screw rod and the clamping block.

[0009] Furthermore, the lifting assembly includes a gear rotatably connected to the inside of the grinder, a tooth plate is fixed at the front end of the mounting frame at the position corresponding to the gear, a second rotating shaft is connected through the inside of the gear, one side of the second rotating shaft passes through and extends to the outside of the grinder where a rotating handle is fixed, and a connecting rod is slidably connected to the inside of the second rotating shaft, and the connecting rod has an elliptical structure.

[0010] Furthermore, the outer layer of the connecting rod is sleeved with a first rotating shaft, and two first protrusions are symmetrically fixed to the outer layer of the connecting rod, two second protrusions are symmetrically fixed to one side of the inner side of the first rotating shaft, and a stepping motor is fixed to one side of the first rotating shaft.

[0011] Furthermore, a third screw rod is rotatably connected inside the connecting rod, and one side of the third screw rod passes through the connecting rod and extends to the outside of the handle where a third knob is fixed.

[0012] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are: 1. The present invention is provided with a positioning assembly. When performing the grinding operation, the silicon carbide wafer is placed on the upper surface of the electric suction cup. The first knob is rotated to control the lifting and lowering of the limit plate, thereby controlling the lowering of the lifting plate, and the lowering of the lifting plate drives the spiral blade to insert into the spiral hole. The spiral blade continues to drive the rotating plate to rotate through the spiral hole, and then cooperates with the spiral groove to drive the movable block to move, thereby positioning the silicon carbide wafer and keeping the silicon carbide wafer in the center position. At the same time, the overall operating environment is inside the placement groove, so that dust will not be scattered during grinding; 2. The present invention is provided with a clamping assembly. After the silicon carbide wafer is positioned by using the positioning mechanism, the second screw rod is driven to rotate by rotating the second knob, thereby driving the clamping block to rise and fall inside the movable block, thereby controlling the height of the clamping block to ensure that the height of the clamping block is not higher than the silicon carbide wafer, thereby avoiding the inability to fully grind the silicon wafer due to the height of the clamping block during the subsequent grinding process.

[0013] 3. The present invention is provided with a lifting component. When controlling the lifting of the grinder, the motor can be used to drive the grinder to lift or directly control it manually according to the situation. At the same time, after the lifting is completed, the stepper motor is used to form a self-locking effect to maintain the overall height and temperature of the grinder, so as to accurately grind the silicon wafer and avoid damage to the silicon wafer due to height changes.

[0014] To sum up, the present invention relies on the positioning mechanism to position the silicon carbide wafer to avoid it being inside the placement groove and to avoid the occurrence of dust scattering, and cooperates with the clamping assembly to clamp the silicon wafer. During the clamping process, the height of the clamping block is controlled according to the thickness of the silicon wafer to avoid the height of the clamping block exceeding the thickness of the silicon wafer. Finally, the lifting assembly is used to control the height of the grinder, and motor control or manual control is selected according to the situation to make the control effect more precise and avoid damage to the silicon wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is a schematic diagram of the structure inside the operating table of the present invention; Figure 3 It is a structural schematic diagram of the fixing tube of the present invention; Figure 4 It is a structural schematic diagram of the positioning mechanism of the present invention; Figure 5 A combined view of the lifting plate and the rotating plate of the present invention; Figure 6 It is a schematic structural diagram of the clamping assembly of the present invention; Figure 7It is a structural schematic diagram of the lifting assembly of the present invention; Figure 8 It is a schematic diagram of the structure inside the second rotating shaft of the present invention.

[0016] Reference numerals: 1, operating table; 2, positioning mechanism; 3, mounting frame; 4, grinding machine; 5, lifting assembly; 6, fixing cylinder; 7, placement groove; 8, guide rod; 9, first knob; 10, limit plate; 11, first screw rod; 12, first through groove; 13, lifting plate; 14, rotating plate; 15, fixing rod; 16, spiral blade; 17, spiral hole; 18, guide block; 19, placement cavity; 20, spiral groove; 21, Electric suction cup; 22, clamping assembly; 23, guide column; 24, second screw rod; 25, clamping block; 26, second through slot; 27, second knob; 28, stepping motor; 29, first rotating shaft; 30, first protrusion; 31, tooth plate; 32, second rotating shaft; 33, third knob; 34, handle; 35, gear; 36, connecting rod; 37, movable block; 38, second protrusion; 39, third screw rod; 40, guide slot. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention. Example

[0018] This embodiment is designed to address the problem in the prior art that it is difficult to accurately position the silicon wafer during silicon wafer grinding. The silicon wafer is brittle and easily damaged by shaking.

[0019] like Figure 1-5 As shown, a silicon carbide wafer grinding device includes an operating table 1, a placement groove 7 is opened on the upper surface of the operating table 1, a positioning mechanism 2 is installed inside the placement groove 7, the positioning mechanism 2 includes two guide rods 8 symmetrically fixed inside the two sides of the placement groove 7, the inside of the guide rod 8 is rotatably connected with a first screw rod 11, the top end of the first screw rod 11 penetrates and extends to the outside of the guide rod 8 to be fixed with a first knob 9, and the outer layer of the first screw rod 11 is sleeved with a limit plate 10 slidably connected to the outside of the guide rod 8, and the limit plate 10 is driven to move along the first through groove 12 by the rotation of the first screw rod 11, and the outer layer of the guide rod 8 is provided with a first through groove 12 corresponding to the connection between the limit plate 10 and the first screw rod 11; The outer layer of the guide rod 8 is slidably connected with a guide block 18 at a position above the limit plate 10, and a lifting plate 13 is fixed between the two guide blocks 18. The lifting plate 13 has a certain counterweight. When the limit plate 10 descends, the lifting plate 13 descends with its own weight. The bottom of the lifting plate 13 is rotatably connected with a rotating plate 14, and a fixing rod 15 is fixed to the bottom of the rotating plate 14. A spiral blade 16 is fixed to the bottom of the fixing rod 15. A fixing cylinder 6 is fixed at a position corresponding to the spiral blade 16 inside the placement groove 7, and a spiral hole 17 is opened inside the fixing cylinder 6 corresponding to the inside of the spiral blade 16; A placement cavity 19 is provided inside the lifting plate 13, and a number of electric suction cups 21 are fixed equidistantly inside the placement cavity 19. Three guide grooves 40 are equidistantly provided inside the outer layer of the lifting plate 13 at positions corresponding to the placement cavity 19. A movable block 37 is slidably connected inside the guide groove 40, and the moving direction of the movable block 37 is limited by the guide groove 40. A clamping assembly 22 is installed inside the movable block 37. A spiral groove 20 is provided on the upper surface of the rotating plate 14, and the movable block 37 is slidably connected to the spiral groove 20. A limit block adapted to the spiral groove 20 is fixed at the bottom of the movable block 37 to control the sliding of the movable block 37.

[0020] During grinding, first place the silicon carbide wafer on the upper surface of the electric suction cup 21, and then rotate the first knob 9 to control the rotation of the first screw rod 11. The rotation of the first screw rod 11 drives the limit plate 10 to descend along the first through groove 12, and the guide block 18 descends synchronously with the descent of the limit plate 10. During the descent of the guide block 18, the fixed rod 15 is driven to descend. The descent of the fixed rod 15 drives the spiral blade 16 to insert into the spiral hole 17. The spiral blade 16 is continuously inserted into the spiral hole 17 and rotates, thereby driving the rotating disk 14 to rotate. During the rotation of the rotating disk 14, the spiral groove 20 is driven to rotate. The rotation of the spiral groove 20 drives the movable block 37 to move inside the guide groove 40 to the center position of the placement cavity 19, thereby forming a centering and positioning effect for the silicon carbide wafer. At this time, the silicon carbide wafer is inside the placement groove 7 to prepare for subsequent grinding. Example

[0021] This embodiment is designed to address the problem in the prior art that when grinding silicon wafers, due to the different thicknesses of silicon wafers, the grinding head may interfere with each other due to the height of the clamping device.

[0022] like Figure 6As shown, the embodiment is a silicon carbide wafer grinding device, and there is a clamping assembly 22 including a clamping block 25 slidably connected to the inside of a movable block 37, the inside of the clamping block 25 is penetrated by a guide column 23 rotatably connected to the inside of the movable block 37, the inside of the guide column 23 is rotatably connected to a second screw rod 24, the second screw rod 24 and the clamping block 25 are rotatably connected, and the top end of the second screw rod 24 penetrates and extends to the outside of the guide column 23 where a second knob 27 is fixed, and the outer layer of the guide column 23 is provided with a second through groove 26 corresponding to the connection between the second screw rod 24 and the clamping block 25.

[0023] After positioning is completed, the height of the clamping block 25 is controlled according to the thickness of the silicon wafer. The second screw rod 24 is controlled to rotate by turning the second knob 27, so as to control the lifting and lowering of the clamping block 25 along the guide column 23. The height of the clamping block 25 is controlled to be always lower than the thickness of the silicon wafer, so as to avoid the situation where the grinding cannot be completely covered when the clamping block 25 is higher than the surface of the silicon wafer. Example

[0024] This embodiment aims to address the problem in the prior art that when grinding silicon wafers, it is difficult to adjust the height of the grinder according to individual differences, which may cause damage to the silicon wafers during grinding.

[0025] like Figure 7-8 As shown, the embodiment is a silicon carbide wafer grinding device, and there is a lifting assembly 5 including a gear 35 rotatably connected to the inside of the grinder 4, a toothed plate 31 is fixed at the front end of the mounting frame 3 at the position corresponding to the gear 35, a second rotating shaft 32 is connected through the inside of the gear 35, one side of the second rotating shaft 32 passes through and extends to the outside of the grinder 4 and a rotating handle 34 is fixed, and a connecting rod 36 is slidably connected to the inside of the second rotating shaft 32, and the connecting rod 36 is an elliptical structure. The elliptical structure design of the connecting rod 36 controls the rotation of the connecting rod 36 to drive the second rotating shaft 32 to rotate; The outer layer of the connecting rod 36 is sleeved with the first rotating shaft 29, and the outer layer of the connecting rod 36 is sleeved with a circular piece, which is rotatably connected to the third screw rod 39, and the outer layer of the connecting rod 36 is symmetrically fixed with two first protrusions 30, and the inner side of the first rotating shaft 29 is symmetrically fixed with two second protrusions 38, and a stepping motor 28 is fixed to one side of the first rotating shaft 29, and the inner part of the connecting rod 36 is rotatably connected to the third screw rod 39, and one side of the third screw rod 39 passes through the connecting rod 36 and extends to the outside of the handle 34 where a third knob 33 is fixed.

[0026] When grinding, manual control or electric control is used to lift the grinder 4 according to the needs. When manual control is needed, the handle 34 is directly rotated to drive the second shaft 32 to rotate, and the gear 35 is controlled to rotate by the second shaft 32. The gear 35 rotates and rises and falls along the toothed plate 31, thereby driving the grinder 4 to rise and fall. When electric control is required, the third knob 33 is rotated to control the rotation of the third screw rod 39. The rotation of the third screw rod 39 drives the connecting rod 36 to move. The connecting rod 36 continues to move until the positions of the first protrusion 30 and the second protrusion 38 are matched. At this time, the stepper motor 28 is started to drive the first rotating shaft 29 to rotate. The first rotating shaft 29 rotates to cooperate with the second protrusion 38 and the first protrusion 30 to drive the connecting rod 36 to rotate. The rotation of the connecting rod 36 drives the second rotating shaft 32 to rotate, and then drives the gear 35 to rotate, thereby forming an electric control effect. At the same time, the characteristics of the stepper motor 28 itself are used to form a self-locking effect.

[0027] Working process and principle of the present invention: Step 1: During grinding, first place the silicon carbide wafer on the upper surface of the electric suction cup 21, then rotate the first knob 9 to control the rotation of the first screw rod 11, the rotation of the first screw rod 11 drives the limit plate 10 to descend along the first through groove 12, and the guide block 18 synchronously descends with the descent of the limit plate 10, and the guide block 18 drives the fixed rod 15 to descend during the descent, and the fixed rod 15 drives the spiral blade 16 to be inserted into the spiral hole 17 when it descends, and the spiral blade 16 is continuously inserted into the spiral hole 17 and rotates, thereby driving the rotating disk 14 to rotate, and the rotating disk 14 drives the spiral groove 20 to rotate during the rotation, and the rotation of the spiral groove 20 drives the movable block 37 to move inside the guide groove 40 to the center position of the placement cavity 19, thereby forming a centering and positioning effect for the silicon carbide wafer, and at this time the silicon carbide wafer is inside the placement groove 7, preparing for subsequent grinding; Step 2: After positioning is completed, the height of the clamping block 25 is controlled according to the thickness of the silicon wafer. The second screw rod 24 is rotated by rotating the second knob 27 to control the lifting and lowering of the clamping block 25 along the guide column 23. The height of the clamping block 25 is always controlled to be lower than the thickness of the silicon wafer, so as to avoid the situation that the grinding cannot be completely covered when the clamping block 25 is higher than the surface of the silicon wafer; Step 3: When grinding, the grinding machine 4 is raised and lowered by manual control or electric control according to the needs. When manual control is required, the handle 34 is directly rotated to drive the second rotating shaft 32 to rotate, and the gear 35 is controlled to rotate by the second rotating shaft 32. The gear 35 rotates and rises and falls along the toothed plate 31, thereby driving the grinding machine 4 to rise and fall; When electric control is required, the third knob 33 is rotated to control the rotation of the third screw rod 39. The rotation of the third screw rod 39 drives the connecting rod 36 to move. The connecting rod 36 continues to move until the position of the first protrusion 30 and the second protrusion 38 are matched. At this time, the stepper motor 28 is started to drive the first shaft 29 to rotate. The first shaft 29 rotates to cooperate with the second protrusion 38 and the first protrusion 30 to drive the connecting rod 36 to rotate. The rotation of the connecting rod 36 drives the second shaft 32 to rotate, and then drives the gear 35 to rotate, thereby forming an electric control effect. At the same time, the characteristics of the stepper motor 28 itself are used to form a self-locking effect. In summary, the positioning mechanism 2 is used to position the silicon wafer, and the silicon wafer is kept inside the placement groove 7 to prepare for subsequent grinding and avoid dust scattering. At the same time, the silicon wafer is clamped by the clamping assembly 22, and the thickness of the silicon wafer is kept higher than the clamping block 25 to avoid interference in grinding. Finally, the lifting assembly 5 is used to control the lifting of the grinder 4 according to needs to ensure the grinding accuracy of the silicon wafer and will not cause damage to the silicon wafer.

[0028] The above are only preferred specific implementation modes of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical solutions and inventive concepts of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A silicon carbide wafer grinding device, comprising an operating table (1), characterized in that: The upper surface of the operating table (1) is provided with a placement groove (7), a positioning mechanism (2) is installed inside the placement groove (7), a mounting frame (3) is fixed at the rear end of the operating table (1), a grinder (4) is slidably connected to the front end of the mounting frame (3), and a lifting assembly (5) is installed between the mounting frame (3) and the grinder (4).

2. A silicon carbide wafer grinding device according to claim 1, characterized in that: The positioning mechanism (2) comprises two guide rods (8) symmetrically fixed inside the two sides of the placement groove (7); the guide rods (8) are rotatably connected to the inside of a first screw rod (11); the top end of the first screw rod (11) passes through and extends to the outside of the guide rod (8) where a first knob (9) is fixed; the outer layer of the first screw rod (11) is sleeved with a limit plate (10) slidably connected to the outside of the guide rod (8); and the outer layer of the guide rod (8) is provided with a first through groove (12) at the connection between the limit plate (10) and the first screw rod (11).

3. A silicon carbide wafer grinding device according to claim 2, characterized in that: The outer layer of the guide rod (8) is slidably connected to a guide block (18) at a position above the limit plate (10); a lifting plate (13) is fixed between the two guide blocks (18); the bottom of the lifting plate (13) is rotatably connected to a rotating plate (14); a fixing rod (15) is fixed to the bottom of the rotating plate (14); a spiral blade (16) is fixed to the bottom of the fixing rod (15); a fixing cylinder (6) is fixed to the inside of the placement groove (7) at a position corresponding to the spiral blade (16); a spiral hole (17) is provided inside the fixing cylinder (6) corresponding to the inside of the spiral blade (16).

4. A silicon carbide wafer grinding device according to claim 3, characterized in that: A placement cavity (19) is provided inside the lifting plate (13), a plurality of electric suction cups (21) are fixed at equal intervals inside the placement cavity (19), three guide grooves (40) are provided at equal intervals inside the outer layer of the lifting plate (13) at positions corresponding to the placement cavity (19), a movable block (37) is slidably connected inside the guide groove (40), a clamping assembly (22) is installed inside the movable block (37), a spiral groove (20) is provided on the upper surface of the rotating plate (14), and the movable block (37) is slidably connected to the spiral groove (20).

5. A silicon carbide wafer grinding device according to claim 4, characterized in that: The clamping assembly (22) comprises a clamping block (25) slidably connected to the inside of a movable block (37); a guide column (23) rotatably connected to the inside of the movable block (37) is penetrated inside the clamping block (25); a second screw rod (24) is rotatably connected inside the guide column (23); the second screw rod (24) and the clamping block (25) are rotatably connected, and the top end of the second screw rod (24) penetrates and extends to the outside of the guide column (23) where a second knob (27) is fixed; and a second through groove (26) is formed on the outer layer of the guide column (23) corresponding to the connection between the second screw rod (24) and the clamping block (25).

6. The silicon carbide wafer grinding device according to claim 1, characterized in that: The lifting assembly (5) comprises a gear (35) rotatably connected to the inside of the grinder (4); a toothed plate (31) is fixed to the front end of the mounting frame (3) at a position corresponding to the gear (35); a second rotating shaft (32) is connected through the inside of the gear (35); a rotating handle (34) is fixed on one side of the second rotating shaft (32) that passes through and extends to the outside of the grinder (4); a connecting rod (36) is slidably connected to the inside of the second rotating shaft (32); the connecting rod (36) has an elliptical structure.

7. A silicon carbide wafer grinding device according to claim 6, characterized in that: The outer layer of the connecting rod (36) is sleeved with a first rotating shaft (29), and two first protrusions (30) are symmetrically fixed to the outer layer of the connecting rod (36), two second protrusions (38) are symmetrically fixed to one side of the inner part of the first rotating shaft (29), and a stepping motor (28) is fixed to one side of the first rotating shaft (29).

8. The silicon carbide wafer grinding device according to claim 7, characterized in that: The interior of the connecting rod (36) is rotatably connected to a third screw rod (39), and one side of the third screw rod (39) passes through the connecting rod (36) and extends to the outside of the rotary handle (34) where a third knob (33) is fixed.

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