Scribing knife and processing and manufacturing method

Abstract

The dicing blade comprises a dicing blade body, a plurality of alternately arranged chip removal areas and cutting areas are arranged on the surface of a cutting edge of the dicing blade body in the reversing direction, and a plurality of protruding units arranged in a honeycomb shape are arranged on the surfaces of the cutting areas to form micro-texture structures located on the surfaces of the cutting areas. Each protruding unit comprises a closed annular protrusion, a plurality of linear strip-shaped protrusions are arranged in each closed annular protrusion, a pit is formed between every two adjacent linear strip-shaped protrusions, and the linear strip-shaped protrusions are distributed in an outward diverging mode in the radial direction of the dicing blade body from inside to outside. Friction force is small, and service life is long.

Description

Technical Field

[0001] The present invention relates to the technical field of dicing knives, and in particular to a dicing knife and a processing and manufacturing method thereof. Background Art

[0002] The statements herein merely provide background information related to the present invention and do not necessarily constitute prior art.

[0003] Most optoelectronic chip integrated circuits and device products need to be cut with a dicing knife during packaging. The dicing knife is made of diamond. Traditional diamond dicing knives face severe challenges: on the one hand, the hardness of sapphire, silicon carbide and other chip hard and brittle materials is very high; on the other hand, the thickness of the dicing knife is getting thinner and thinner, and the surface of the dicing knife edge is flat, with a large contact area with the workpiece, high friction, poor chip tolerance, and poor chip removal. These problems will lead to defects such as microcracks, interface peeling, burrs on the edges, back boundary cracks, and corner shedding in the diced chips, which cannot meet the requirements of industrialization.

[0004] Currently, the friction between the tool and the workpiece can be reduced by using a micro-texture structure. For example, patent CN105922377B discloses a woodworking tool and a manufacturing method thereof for reducing the friction coefficient of the woodworking tool during cutting. By setting a micro-structure texture at the cutting edge position, chipping of the cutting edge is avoided and the service life of the tool is extended. However, it also has the problem of poor chip removal. The surface micro-texture adopts circular pits (convex bodies) or parallel grooves or cross-net grooves, but the use of the above-mentioned micro-texture structure is not conducive to the storage of lubricants, and the lubricant is easily lost, thereby affecting the lubrication effect. Summary of the invention

[0005] In view of the deficiencies in the prior art, the purpose of the present invention is to provide a dicing knife and a manufacturing method, which overcome the defects of the current dicing knife, reduce the friction between the dicing knife and the workpiece, and prevent the lubricating oil from being lost easily, thereby extending the service life of the dicing knife.

[0006] In order to achieve the above object, the present invention is implemented through the following technical solutions:

[0007] In the first aspect, an embodiment of the present invention provides a dicing knife, including a dicing knife body, the cutting edge surface of the dicing knife body is provided with a plurality of chip removal areas and cutting areas arranged alternately along the reversing direction, the cutting area surface is provided with a plurality of protrusion units arranged in a honeycomb shape to form a micro-texture structure located on the cutting area surface, the protrusion unit includes a closed annular protrusion, a plurality of straight bar protrusions are provided inside the closed annular protrusion, pits are formed between adjacent straight bar protrusions, and along the radial direction of the dicing knife body from the inside to the outside, the plurality of straight bar protrusions are distributed in an outward divergent form.

[0008] Optionally, the height of the closed annular protrusion and the straight strip protrusion is 10-30 um.

[0009] Optionally, the closed annular protrusion is a regular polygonal annular protrusion or a circular annular protrusion.

[0010] Optionally, the chip removal areas are evenly spaced along the circumferential direction of the dicing knife body, and the area between adjacent chip removal areas is the cutting area.

[0011] Optionally, the width of the chip removal area gradually decreases along the radial direction from the inside to the outside of the dicing knife body.

[0012] Optionally, the dicing knife body is made of diamond material.

[0013] In the second aspect, an embodiment of the present invention provides a method for processing and manufacturing the slicing knife described in the first aspect: the slicing blade body rotates around its own axis, a pulsed laser beam is vertically irradiated to the cutting edge surface of the slicing blade body, and the pulsed laser beam is used to remove the cutting edge surface material to form a micro-texture structure of the chip removal area and the processing area located between the chip removal areas.

[0014] Optionally, the wavelength of the pulsed laser beam is 1060-1068 nm, preferably 1064 nm, and the pulse width is 0.8-1.2 us, preferably 1 us.

[0015] Optionally, before the dicing blade body is processed by a pulsed laser beam, it is ultrasonically cleaned using acetone, anhydrous ethanol and deionized water in sequence. After cleaning, the dicing blade body is blown dry using nitrogen.

[0016] Optionally, the center position of the dicing knife body is fixedly connected to the power spindle, and the power spindle drives it to rotate around its own axis. A pulse laser is set on one side of the dicing knife body, and the pulse laser is used to irradiate the edge surface of the dicing knife body with pulse laser.

[0017] The beneficial effects of the present invention are as follows:

[0018] 1. The blade surface of the dicing knife of the present invention includes a chip removal area and a processing area which are alternately arranged. The processing area is provided with a texture structure. The texture structure includes a plurality of protrusion units. The protrusion unit includes a closed annular ring protrusion. A plurality of straight strip protrusions are arranged inside the closed annular ring protrusion. When the dicing knife is processed, a chip removal area is provided to facilitate the discharge of processed chips and make chip removal smoother. During the processing, only the top surface of the protrusion contacts the workpiece, reducing the friction area and thereby reducing the friction force. A plurality of closed lubricant storage chambers can be formed by the closed annular protrusion and the plurality of straight strip protrusions. The lubricant can be stored in the lubricant storage chambers. The lubricant in the lubricant storage chamber can be continuously released during the processing, forming a lubricating film between the dicing knife and the workpiece, reducing the direct contact between the two, reducing the friction coefficient, and reducing wear. At the same time, the closed-loop annular protrusion can prevent the loss of lubricant and ensure the lubrication effect. Multiple straight-line bar protrusions are distributed in an outwardly divergent form, so that the straight-line bar protrusions can guide the chip flow, making it easier for the chips to detach from the surface of the dicing knife, guiding the cutting to the outside and then allowing the cutting to enter the chip removal area. A wedge-shaped gap is formed between adjacent straight-line bar protrusions, which can form a fluid dynamic pressure effect, which is beneficial to lubrication.

[0019] 2. For the dicing knife of the present invention, the width of the chip removal zone gradually decreases along the radial direction of the dicing knife body from the inside to the outside, and a pressure difference can be formed between the inner edge and the outer edge of the chip removal zone, which is beneficial for the lubricating oil to carry the chips to flow to the inner edge of the chip removal zone, can reduce the accumulation of chips, is more conducive to chip removal, and makes chip removal smoother. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The accompanying drawings in the specification, which constitute a part of the present invention, are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute improper limitations on the present invention.

[0021] Figure 1 It is a schematic diagram of the overall structure of Embodiment 1 of the present invention;

[0022] Figure 2 is a schematic diagram of a protruding unit in Example 1 of the present invention;

[0023] Figure 3 Schematic diagram of the processing and manufacturing of the dicing knife in Example 1 of the present invention;

[0024] Among them, 1. chip removal area, 2. texture structure, 3. dicing blade body, 4. dicing blade, 5. high-speed spindle, 6. A / D conversion module, 7. data acquisition module, 8. main controller, 9. mobile workbench, 10. displacement sensor, 11. laser workbench, 12. laser;

[0025] 2-1. Closed ring-shaped protrusion, 2-2. Straight line protrusion. DETAILED DESCRIPTION

[0026] Example 1

[0027] This embodiment provides a dicing knife, such as Figure 1 As shown, it includes a dicing blade body 3, which is made of diamond material and is a circular structure. Its outer edge is provided with a cutting edge. The structure of the dicing blade body can adopt the existing technology, and its further technical details are not described in detail here. In traditional dicing blades, the cutting edge surface is flat, and the problems of poor chip tolerance and poor chip removal will lead to defects such as micro cracks, interface peeling, burrs on the edges, back boundary cracking, and corner shedding in the diced chips, which cannot meet the requirements of industrialization. In this embodiment, the existing dicing blade structure is improved, and the cutting edge surface of the dicing blade body is laser processed to form alternating chip removal areas 1 and processing areas, and the surface of the processing area is processed into a texture structure 2 using a pulsed laser beam. The texture structure includes a plurality of raised units arranged in a honeycomb shape, such as Figure 2 As shown, the protrusion unit includes a closed ring-shaped annular protrusion 2-1, a plurality of straight bar-shaped protrusions 2-2 are arranged inside the closed ring-shaped annular protrusion 2-1, and pits are formed between adjacent straight bar-shaped protrusions 2-2.

[0028] Specifically, the closed-loop annular protrusion 2-1 is in the shape of a rectangle, square, circle or other polygon, and the technicians in this field can choose according to actual needs. Multiple closed-loop annular protrusions are distributed in a honeycomb manner. Preferably, the closed-loop annular protrusion 2-1 is in the shape of a rectangle, square or other regular polygon, so that adjacent closed-loop protrusions have a common edge, so that the entire blade surface can be completely covered by the closed-loop annular protrusion. Through the closed-loop annular protrusion, a larger lubricating oil storage room can be enclosed to facilitate the storage of lubricating oil and prevent the loss of lubricating oil. Multiple straight bar protrusions 2-2 divide the lubricating oil storage room into multiple chambers for storing lubricating oil.

[0029] Preferably, the closed-loop annular protrusion 2-1 adopts a rectangular structure, which facilitates laser processing and reduces processing difficulty.

[0030] In the texture structure composed of multiple circular protrusions or other shaped soil bodies, the space between the multiple protrusions is a non-sealed space, which is used to accommodate lubricating oil. Since the space is a non-sealed space, it cannot restrict the outward flow of the lubricating oil. Therefore, during operation, the lubricating oil can flow out through the space between the protrusions, which leads to the loss of the lubricating oil. The protrusion unit of this embodiment is provided with a closed ring-shaped annular protrusion 2-1, and the closed ring-shaped annular protrusion 2-1 encloses a closed space. The closed ring-shaped annular protrusion 2-1 can store the lubricating oil in the lubricating oil storage chamber formed therein. The lubricating oil is not easy to lose and it is easier to form an oil film between the workpiece and the dicing knife.

[0031] In the micro-texture structure composed of circular or other shaped pits or parallel grooves or cross-net grooves, since the pits and grooves are small in size and the lubricating oil has a certain viscosity, it is not easy for the lubricating oil to enter the pits or grooves for storage and is more likely to be lost. It is not easy to form a lubricating oil film between the cutting edge surface and the workpiece. When the closed-loop annular protrusion 2-1 is used in this embodiment, the storage space for the lubricating oil is larger, and the lubricating oil is more likely to enter the internal space of the closed-loop annular protrusion 2-1 for storage, thereby avoiding the loss of the lubricating oil and ensuring the lubrication effect.

[0032] In addition, during processing, the cutting knife contacts the workpiece through the protrusions. Compared with the traditional grooved texture structure, the cutting edge of the cutting knife only contacts the workpiece through the top surface of the protrusions. The contact area between the cutting knife and the workpiece is smaller, reducing the friction area between the workpiece and the cutting edge of the cutting knife, thereby reducing the friction force and avoiding friction damage to the cutting knife.

[0033] Therefore, through the structural design of the protruding unit of this embodiment, when the dicing knife is processed, it can not only reduce the contact area between the dicing knife and the workpiece and reduce the friction, but also store the lubricating oil to avoid the loss of the lubricating oil. The lubricating oil can further reduce the friction and the temperature of the dicing knife, thereby increasing the service life of the dicing knife.

[0034] Along the radial direction from inside to outside of the dicing knife body, multiple straight bar protrusions 2-2 are distributed in an outward divergent form, that is, along the radial direction from outside to inside of the dicing knife body, multiple straight bar protrusions 2-2 gradually approach each other and converge.

[0035] In this embodiment, the straight-line bar-shaped protrusion 2-2 intersects or does not intersect with the closed-loop annular protrusion 2-1. Preferably, the straight-line bar-shaped protrusion 2-2 intersects with the closed-loop annular protrusion 2-1.

[0036] Among the multiple straight-line strip protrusions 2-2 inside a closed-loop annular protrusion 2-1, one straight-line strip protrusion 2-2 located in the middle is arranged along the radial direction of the slicing knife body, and the straight-line strip protrusions on both sides of the straight-line strip protrusion 2-2 are symmetrically arranged relative to the straight-line strip protrusion.

[0037] Compared with the parallel distribution of the straight-line bar protrusions 2-2, this setting method enables the straight-line bar protrusions to guide the flow of chips, making it easier for the chips to detach from the surface of the dicing knife, discharging the chips from the inside to the outside, and then guiding the chips into the chip removal area 1. At the same time, a wedge-shaped gap can be formed between adjacent straight-line bar protrusions 2-2, which is conducive to the generation of fluid dynamic pressure effect and lubrication.

[0038] In this embodiment, the thickness of the closed-loop annular protrusion 2-1 and the straight bar protrusion 2-2 are both 10um-30um. This thickness size can not only satisfy the good storage function of lubricating oil, but also ensure the strength of the protrusion to achieve smooth cutting of the workpiece.

[0039] The cutting edge surface is provided with a plurality of chip removal areas 1 along the circumferential direction, the outer end of the chip removal area 1 extends to the outer edge of the cutting edge, and the inner end extends to the inner edge of the cutting edge. Preferably, the plurality of chip removal areas 1 are evenly spaced along the circumferential direction of the dicing knife body, so that chip removal can be more uniform. A processing area is provided between adjacent chip removal areas 1, and a texture structure 2 is provided on the surface of the processing area.

[0040] Since the texture structure 2 is a convex structure, the chip removal area 1 is recessed relative to the processing area. During processing, the chip removal area 1 does not contact the workpiece, thereby forming a space for accommodating chips, which greatly improves the chip holding capacity of the dicing knife. At the same time, lubricating oil can be introduced into the chip removal area, and the chips are flushed out using the lubricating oil, thereby improving the chip removal capacity of the dicing knife.

[0041] The chip removal area 1 can form a space for storing chips, and the chips in the chip removal area are flushed out by lubricating oil, so that the chips leave the cutting edge of the dicing knife. By setting the chip removal area, the chip holding and chip removal capabilities of the dicing knife are improved, avoiding defects such as microcracks, interface peeling, edge burrs, back boundary cracking, and corner shedding.

[0042] The chip removal area can adopt a strip structure, and the strip structure is set at an angle that deviates from the radial setting of the dicing knife. The chip removal area can also be set in other shapes as long as it can meet the chip removal requirements. In this embodiment, the chip removal area adopts a trapezoidal shape, and the width of the chip removal area 1 gradually decreases from the inside to the outside of the radial direction of the dicing knife body. This setting method can reduce the accumulation of chips, which is more conducive to chip removal and makes chip removal smoother.

[0043] Specifically, the inner edge width of the chip removal area 1 of the dicing knife body is large, and the fluid dynamic pressure of the lubricating oil is small. The outer edge width of the chip removal area 1 is small, and the fluid dynamic pressure of the lubricating oil is large. A fluid pressure difference is formed between the inner edge and the outer edge of the chip removal area 1, driving the lubricating oil to carry the chips from the outer edge of the chip removal area 1 to the inner edge of the chip removal area 1, which is beneficial to chip removal and reduces chip aggregation.

[0044] A fixing hole is provided at the center of the dicing knife for fixing the dicing knife to the rotating shaft. In this embodiment, only the surface structure of the cutting edge of the dicing knife is improved, and the remaining structures of the dicing knife can adopt the existing technology, which will not be described in detail here.

[0045] The dicing knife of this embodiment has a stronger chip holding and chip removal capacity and smoother chip removal through the setting of the chip removal area 1. The friction between the dicing knife and the workpiece is smaller through the setting of the raised units distributed in a honeycomb shape, the storage capacity of the lubricating oil is stronger, and the lubricating effect of the lubricating oil is better. Under the premise of reducing the thickness of the dicing blade, the cutting and processing requirements of hard and brittle materials such as sapphire and silicon carbide are met.

[0046] Example 2

[0047] This embodiment provides a method for processing and manufacturing the dicing knife described in Embodiment 1, wherein the current dicing knife is irradiated with laser to process a chip removal area 1 and a plurality of protrusion units on the cutting edge surface, such as Figure 3 As shown, the following steps are included:

[0048] First, the dicing blade 4 is ultrasonically cleaned with acetone, anhydrous ethanol and deionized water in turn to clean the dust and impurities on the surface of the dicing blade 4 to avoid affecting the subsequent laser processing. Each cleaning is set for a time, preferably, the setting time is 20 minutes, and then the dicing blade is blown dry with nitrogen, and the center position of the dicing blade 4 after drying is fixedly connected to the high-speed spindle 5, and the high-speed spindle 5 is connected to the rotating power system, and the high-speed spindle 5 can drive the dicing blade 4 to rotate around its own axis. The rotating power system can adopt the existing technology, for example, the rotating power system adopts a motor or a hydraulic motor, etc., which will not be described in detail here. The high-speed spindle 5 is equipped with a speed sensor, which is connected to the main controller 8 through the A / D conversion module 6 and the data acquisition module 7 in turn, and can collect the speed of the high-speed spindle 5 and transmit it to the main controller 8. The speed sensor and its connection method with the high-speed spindle 5 can adopt the existing technology, which will not be described in detail here. The speed of the high-speed spindle 5 in this embodiment is 10000r / min-50000r / min.

[0049] The A / D conversion module 6 and the data acquisition module 7 can adopt the existing technology, which will not be described in detail here.

[0050] A movable workbench 9 is provided below the high-speed spindle 5. The movable workbench 9 is connected to a three-axis linkage mechanism. The three-axis linkage mechanism can adopt existing equipment and can drive the movable workbench 9 to move. The three-axis linkage mechanism includes a first horizontal moving mechanism and a second horizontal moving mechanism. The distribution directions of the first horizontal moving mechanism and the second horizontal moving mechanism are perpendicular to each other. The moving part of the first horizontal moving mechanism is connected to the second horizontal moving mechanism and can drive the second horizontal moving mechanism to move. The first horizontal moving mechanism and the second horizontal moving mechanism can respectively output a first direction movement and a second direction movement on the horizontal plane. The first direction and the second direction are perpendicular to each other. The second horizontal moving mechanism is connected to the vertical moving mechanism. , can drive the vertical moving mechanism to move along the second direction, the vertical moving mechanism can output vertical movement, the mobile workbench 9 is connected to the moving part of the vertical moving mechanism, the vertical moving mechanism can drive the mobile workbench 9 to do vertical movement, the mobile workbench 9 can move under the drive of the first horizontal moving mechanism, the second horizontal moving mechanism and the vertical moving mechanism, so as to adjust the position of the laser 12, so that the position between the laser 12 and the slicing blade edge meets the processing needs, preferably, the first horizontal moving mechanism, the second horizontal moving mechanism and the vertical moving mechanism all adopt a screw transmission mechanism, which meets the control requirements of the movement accuracy, and thus meets the molding quality requirements of the micro-texture structure.

[0051] The mobile workbench 9 is also provided with a displacement sensor 10 for detecting the displacement of its moving part. The displacement sensor 10 is connected to the main controller 8 through the A / D conversion module and the data acquisition module 7 in sequence. The moving part of the mobile workbench 9 is connected to the laser workbench 11 and can drive the laser workbench 11 to move. The travel range of the mobile workbench 9 in the first direction is 0-250mm, the travel range in the second direction is 0-220mm, and the vertical travel range is 0-250mm.

[0052] The displacement sensor 10 and its installation and connection method can adopt the existing technology, which will not be described in detail here.

[0053] A laser 12 is fixed on the laser workbench 11. In this embodiment, the laser 12 is a semiconductor microsecond pulse laser. Preferably, a semiconductor end-pumped microsecond pulse laser is used. The pulse laser beam emitted by the semiconductor microsecond pulse laser can produce surface microstructures at the micrometer level.

[0054] When the semiconductor microsecond pulse laser is used, the output laser wavelength is 1060-1068nm, preferably 1064nm, and the pulse width is 0.8-1.2us, preferably 1us.

[0055] The average power of the semiconductor microsecond pulse laser is about 100mW, the repetition frequency is 7.5kHz, the scanning speed is 10mm / s, and the scanning spacing is 0.01mm.

[0056] After fixing the dicing knife 4 on the high-speed spindle 5, adjust the position of the laser 12 so that the laser emission port of the laser 12 is aligned with the cutting edge position of the dicing knife, and the distance between the laser emission port of the laser 12 and the cutting edge meets the set requirements, then start the laser 12 and the high-speed spindle 5, the high-speed spindle 5 drives the dicing knife 4 to rotate at a speed of 10000-25000r / min, the pulsed laser beam emitted by the laser 12 is irradiated on the cutting edge surface of the dicing knife 4, when the laser irradiates the cutting edge material matrix, the particles absorb the laser energy, the material temperature rises rapidly and vaporizes, the cutting edge material is removed, and the processing of the chip removal area and the texture structure is completed.

[0057] The laser 12 moves along a set trajectory driven by the moving workbench, and cooperates with the rotation of the dicing knife to process a chip removal area and a micro-texture structure that meet the requirements on the edge surface.

[0058] By adjusting the laser scanning speed, scanning times, pulse width and other parameters, the laser flux irradiated on the cutting edge surface and the number of pulses received per unit area of ​​the sample surface can be adjusted, thereby controlling the aspect ratio and other structural characteristics of the surface microstructure. Technical personnel in this field can adjust according to actual needs, which will not be described in detail here.

[0059] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A dicing knife, comprising a dicing knife body, characterized in that: The cutting edge surface of the dicing blade body is provided with a plurality of chip removal areas and cutting areas arranged alternately along the reversing direction, and the surface of the cutting area is provided with a plurality of protrusion units arranged in a honeycomb shape to form a micro-texture structure located on the surface of the cutting area, and the protrusion unit includes a closed annular protrusion, and a plurality of straight-line protrusions are provided inside the closed annular protrusion, and pits are formed between adjacent straight-line protrusions. Along the radial direction from the inside to the outside of the dicing blade body, the plurality of straight-line protrusions are distributed in an outward divergent form.

2. A dicing knife as claimed in claim 1, characterized in that: The height of the closed annular protrusion and the straight strip protrusion is 10-30um.

3. A dicing knife as claimed in claim 1, characterized in that: The closed annular protrusion is a regular polygonal annular protrusion or a circular annular protrusion.

4. A dicing knife as claimed in claim 1, characterized in that: The chip removal areas are evenly spaced along the circumferential direction of the dicing knife body, and the area between adjacent chip removal areas is the cutting area.

5. A dicing knife as claimed in claim 1, characterized in that: Along the radial direction of the dicing blade body from inside to outside, the width of the chip removal area gradually decreases.

6. A dicing knife as claimed in claim 1, characterized in that: The dicing knife body is made of diamond material.

7. A method for processing and manufacturing a slicing knife as described in any one of claims 1-6: the slicing blade body rotates around its own axis, a pulsed laser beam is vertically irradiated to the cutting edge surface of the slicing blade body, and the pulsed laser beam is used to remove the cutting edge surface material to form a micro-texture structure of a chip removal area and a processing area located between the chip removal areas.

8. The method for manufacturing a dicing knife according to claim 7, characterized in that: The wavelength of the pulsed laser beam is 1060-1068 nm, preferably 1064 nm, and the pulse width is 0.8-1.2 us, preferably 1 us.

9. The method for manufacturing a dicing knife according to claim 7, characterized in that: Before the dicing blade body is processed by a pulsed laser beam, it is ultrasonically cleaned with acetone, anhydrous ethanol and deionized water in sequence. After cleaning, the dicing blade body is blown dry with nitrogen.

10. The method for manufacturing a dicing knife according to claim 7, wherein: The center position of the dicing knife body is fixedly connected to the power spindle, and the power spindle drives it to rotate around its own axis. A pulse laser is set on one side of the dicing knife body, and the pulse laser is used to irradiate the edge surface of the dicing knife body with pulse laser.

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